TWI226680B - Chip scale package of an image sensor - Google Patents

Abstract

A chip scale package of an image sensor comprises an image sensing chip, a substrate, a connecting means and a transplant layer. An imaging surface of the image sensing chip forms a plurality of bonding pads which are electrically connecting to first end of a conductive layer of the substrate. A back surface of the image sensing chip attaches to first surface of the substrate. A second surface of the substrate forms a plurality of connecting pads which are electrically connecting to second end of the conductive layer of the substrate to achieve vertically connecting the image sensing chip with the substrate and chip scale packaging. The transplant layer corresponds to the imaging surface of the image sensing chip.

Description

1226680 V. Description of the invention (1) [Technical field to which the invention belongs] Month: There is a type of image sensor ', in particular, a type of image sensor packaged in a Japanese-Japanese film size. [Prior art] Image Sensor [Image Sensor] is an image sensor, such as complementary metal oxide semiconductor [complementaq Metai

Oxide Seunconductor, CMOS], installed in a ceramic substrate with a groove or a lead frame or a pre-molded printed circuit board with a pre-mold [pre-mold]. The space of the image sensing chip is usually vacuum or filled with an inert gas to prevent water particles from entering. Please refer to the first figure, a conventional image sensing package structure, which includes a substrate 11, a flange layer 1 2, an image sensing chip 丨 3 and a light transmitting layer 1 4 ′ The image sensing chip 1 3 is arranged in the groove formed by the flange layer 丨 2 and the substrate 丨 丨, and is electrically connected to the substrate 11 by using a plurality of bonding wires 15, and the light transmissive 14 is attached to the protrusion The edge layer 12 is sealed to the image sensing wafer 1 3, however, when the image sensing wafer 13 is close to the groove formed by the flange layer i 2 and the substrate 11, the bonding wires 15 It is not possible to directly connect a wire to the substrate 11, and it is impossible to achieve a wafer size seal. A signal input terminal is formed on the surface for a plurality of wires to be electrically connected to another conventional image sensor structure, as disclosed in China Patent Bulletin No. 5 4 2 4 9 3 "Image Sensor Structure" It includes a substrate, a flange layer, an image sensing chip, and a light transmitting layer. The image sensing sheet is disposed in a groove formed by the flange layer and the substrate, and the flange is 1226680. V. Description of the invention (2) The input end of some signal wheels are electrically connected to this layer, and the side is protected by an electrical connection layer. In addition, our type of image sensor has a signal input on the chip of the chip. The printed circuit with the hole electrically connected to the signal output terminal passes through the light-transmitting layer, and the light-transmitting layer and the double-sided layer are formed to form a double-sided electrical device. [Summary of the Invention] The image sensor of the present invention, a sharp piece, and the conductor layer floor And the effectiveness of the plurality of lead-in seals and the image-sensing substrate and the convex light-transmitting layer are connected to the substrate, which is likely to cause the package structure of the reliable national patent announcement to be combined into a light-transmitting and signal output, After the image, the transparent plate is used, so The electrical transmission is performed on a conductive line test chip printed with electrical conduction, and then a portion of the adhesive layer coated on the upper surface of the side edge layer of the flange layer is adhered to the image sensor wafer using the flange layer, but There are no other poor retentions on the sides of the flange layer. The invention patent No. 45 9 3 55 discloses a method and a packaging method thereof. An image sensing layer is formed on different surfaces and the light transmitting layer is connected to a signal input terminal to sense a chip and the light transmitting layer. The signal output end of the signal input light layer is connected to an open transmission path by the image sensor chip circuit board. The light transmission layer must have functions, and it is difficult to make the road system on the glass light transmission layer. And high cost. The main purpose is to provide a wafer-size package for at least one contact element with a support layer and a conductor layer, and a first end extending from the branch of the contact element and an image sensing chip. The solder pad and a substrate are electrically connected to the substrate to achieve electrical connection between the upper and lower sides and the wafer ruler, and the conductor layer is protected by the support layer, which improves the reliability of the image sensing according to the present invention a Ud, a chip size package. Device, which includes

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V. Description of the invention (3) Image sensing crystal I-substrate, at least-conductive element and __ translucent sheet, the image sensing chip has-sensing surface and a back surface, and the periphery of the sensing surface is formed There are a plurality of bonding pads. The substrate has a first surface and a second surface. The first surface of the substrate is bonded to the back surface of the image sensing wafer, and the second surface of the substrate is formed with A plurality of external pads, the external pads are electrically connected to the conductive pads, the conductive π member is a thin film substrate, and the thickness is not more than 0 mm, the conductive element has a support layer and a The conductor layer has a first end and: The first end and the second end of the conductor layer extend out of the connection: a piece, a support layer, and the first end of the conductor layer is connected with The image sensing crystal 2 is electrically connected to the fresh pad, and the second end of the conductor layer is electrically connected to the conductive pad of the substrate, so as to achieve electrical conduction up and down and chip size packaging. The light sheet corresponds to the first end of the C ΐ 1 lead element corresponding to the sensing surface of the image sensing chip, Preferably, 'an additional sealant is provided around the image sensing chip = f measuring surface, α seals the sensing surface from gas or dust particles' and the external pads are implanted with a plurality of solder balls Use = as an image sensor outside the chip size package. [Embodiment] With reference to the drawings, the present invention will be described by the following embodiments. According to a first specific embodiment of the present invention, please refer to FIG. 2, a crystal-size image sensor is mainly composed of an image-sensing chip 110, a substrate 120, and at least-a conductive element 13. And a light-transmitting sheet 14 (), f image sensing chip 110 is-charge coupled couple Charged Devil CCD] or a complementary metal oxide semiconductor

HI 1226680 V. Description of the Invention (4) [Complementary Metal Oxide Semiconductor, CMOS], the image sensing chip 110 has a sensing surface 11 1 and a back surface

11 2. A plurality of pads 1 1 3 are formed around the sensing surface 1 11. A plurality of bumps 1 1 4 are formed on the pads 11 3. The bumps 1 1 4 may be A tin-lead bump or a gold bump, the size of the substrate 120 is the same as the size of the image sensing chip 110, and has a first surface 121 and a second surface 1 22 'The substrate 1 20 is selected from In one of the dummy chip and the ceramic substrate, in order to avoid a large difference in thermal expansion coefficient between the substrate 120 and the image sensing chip, the reliability of the first surface of the substrate 1 2 0 is affected. 1 2 1 is attached with an adhesive layer 1 50 to the back surface 112 of the image sensing chip 11 0, and the second surface 1 22 of the substrate 1 20 is formed with a plurality of lead pads 123 and a plurality of The external pads 124 are electrically connected to the conductive pads 123 by a plurality of lines 125. The conductive pads 23 are formed with a plurality of bumps 126. The conductive elements 130 are The thickness of the thin-film substrate is no more than 0 · 2mm. The conductive element has one floor, 31 and two conductor layers, and the material of the support layer is 131. Polyimide (PI), the material of the conductor layer 132 is copper foil, and has a first end 133 and a second end 134, the first end of the conductor layer 132] [μ and the second The end 134 extends from the support layer 31 of the conductive element 13o, and the first end 133 of the conductive layer 132 is combined with the convexity 114 of the image sensing chip 11 and is combined with the image sensing chip !! The solder pads 113 of 10 are electrically connected, and the second end 134 of the conductor layer 132 is combined with the bumps 126 of the substrate 120, and is electrically connected to the conductive pads 23 of the substrate 120 to To achieve the effect of electrical conduction and chip size packaging, please refer to circle 3 again, when the

Page 1226680 · V. Description of the invention (5) The first end 133 of the conductive layer 132 of the conductive element 130 before the conductive element 1 30 is not combined with the image sensing chip 丨〗 〇 and the substrate 丨 2 〇 It has excellent ductility with the second end 134 and can be easily bent. Therefore, when applied to the image sensor 100, the first end 133 and the second end 134 of the conductive layer 132 can be separately detected from the image. The bumps 丨 4 of the wafer 11 〇 and the bumps 1 2 6 of the substrate 丨 2 are combined, and the light transmitting sheet 4 〇 is a transparent glass and corresponds to the image sensing wafer 11 The sensing surface 111 is fixed on the first end 1 33 of the conductive element 1 30. Preferably, a seal is provided on the periphery of the sensing surface 11 1 of the image sensing chip j 丨 〇 Adhesive 丨 6 〇 to seal the sensing surface 111 ′ to prevent moisture or dust particles from invading, and the external pads 124 of the substrate 丨 are implanted with a plurality of solder balls 17 〇 for the image sensor External electrical contact of the tester 100 ％. The first end 133 and the second end 134 of the conductive layer 132 of the conductive element 130 are used to extend the support layer 131 of the conductive element 130. The first end 133 is connected to the image sensing chip 110. The pads 11 3 are electrically connected, and the second end 134 is electrically connected to the conductive pads 123 of the substrate 120, so that the signal of the image sensing chip 11 〇 passes through the conductor of the conductive element 1 30 The layer 1 3 2 is electrically connected to the conductive pads 123 of the substrate 120 so as to achieve electrical conduction up and down. Because the thickness of the conductive element 130 is not greater than 0.2 mm, and the size of the substrate 1 2 0 The size is the same as that of the image sensing chip 110, so as to achieve the effect of chip size packaging. In addition, the branch floor 131 of the lead element 130 is outside the conductor layer 1 32 to protect the conductor layer. 1 32, improve reliability. The scope of protection of the present invention shall be defined by the scope of the attached patent application

Page 10 1226680 5. Description of the invention (6) shall prevail. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention.

Page 11 1226680 Brief description of the drawings [Simplified description of the drawings] Fig. 1 The cross-sectional schematic diagram of the conventional image sensing package structure Fig. 2 The schematic diagram of the image sensor y and 3 according to the wafer size package created by this Schematic diagram of the image sensor j connector components not combined with the image sensor chip and the base-board based on the wafer size package created by this creation. 0 Simple explanation of component symbols 10 Image sensor package structure 11 Substrate 12 Flange layer 13 Image sensor Measure 14 Light transmission layer 15 Welding wire 100 Image sensor 110 Image sensor wafer 111 Sensing surface 112 Back side 113 Welding pad 114 Bump 120 Substrate 121 First surface 122 Second surface 123 Leading pad 124 External coil 125 Circuit 126 Bump 130 Leading element 131 Support layer 132 Conductor layer 133 First end 134 Second end 140 Light transmitting sheet 150 Adhesive layer 160 sealant 170 solder ball «

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Claims (1)

1226680 6. Scope of Patent Application Scope of Patent Application] A wafer size seals the periphery of the measuring surface of the image sensing wafer to form a surface system and a surface system with at least one conductive element and a substrate, the first watch plate and the first The conductor layer is connected with the shadow, and the second end is connected with the first image. The connecting element is a range of light. The conductor is a light-transmitting sheet fixed on the guide. 2. If you apply for a special tester, the support layer . 3. If you apply for a special detector, the branch floor. 4. If you apply for a special test device, of which 5. If you apply for a special test device, of which 6. If you apply for a patent, the conductor range, the lead range, the lead range, and the image sensor installed in the range, including: 'It is Having a sensing surface and a back surface, the sensing surface having a plurality of bonding pads; a first surface and a second surface, the substrate and the back surface of the image sensing chip are bonded together, and the base is formed with a plurality of conducting pads; 'It has a support layer and a conductor layer, one end and a second end, the pads of the first wafer of the conductor layer are electrically connected, and the pads of the conductor layer substrate are electrically connected; and Corresponds to the first end of the sensing surface of the image sensing chip. The first end of the image-sensing layer of the crystal / size package described in item 1 extends beyond the second end of the shadow layer of the wafer-size package described in item 1 of the guide. The component of the chip-size package described in item 1 of this guide-sensing τ is a thin film substrate. 2mm。 ~ Image feeling The chip size package described in item 1, the thickness of the component is not greater than 0. 2mm. y 晶片 The chip size package described in item 1 ~ like salt 1226680 lill I 丨 I ____ Six, the scope of patent application = device, the size of the substrate and the size of the image sensor chip, 7, such as applying for a patent The chip size package described in the item 丨 of the scope: the device, wherein the substrate is selected from / of the virtual wafer and the ceramic substrate. 8. The shadow measurement of the chip size package described in the patent application scope item 丨Device: wherein the second surface of the substrate is formed with a plurality of external pads, and the conductive pads are electrically connected to the external pads. 9. ^ The chip-size packaged image sensor described in item 8 of the scope of the patent application, which further includes a plurality of solder balls, which are implanted on the external pads of the substrate. 10. The chip-sized packaged image sensor described in item 1 of the patent application scope further includes a sealant provided around the sensing surface of the image-sensing wafer. Page 14 1