1225675 五、發明說明（1) 【技術領域】 B、本發明係提供一種晶粒檢測分類裝置及其方法，特別 疋適用於取出晶圓上之晶粒檢測分類過程，利用本發明技 術之晶粒檢測分類裝置及其方法可快速完成晶粒檢測，減 少晶粒移動次數，更可避免晶粒測試前的重複定位。 【先前技術】1225675 V. Description of the Invention (1) [Technical Field] B. The present invention provides a device and method for detecting and classifying grains, and is particularly suitable for the process of detecting and classifying the grains on a wafer and using the techniques of the present invention The detection and classification device and method can quickly complete the grain inspection, reduce the number of grain movements, and avoid repeated positioning before the grain test. [Prior art]
習知晶粒取放檢測過程，係指將晶粒從晶圓上取出， 放到一承盤，再開始依序將晶粒從承盤取出並放到一測試 平台、，請參考第一圖係為習知技術之晶粒取放檢測流程 圖’首先將晶粒2 0從晶圓1 〇取出，放入一承盤3 〇 ,再利用 二拾取方法將晶粒2 0從該承盤3 〇取出放入測試平台進行測 j，但是該晶粒2 0在測試前，經過多次移動，所以在測試 别，必須先對晶粒2 0進行定位，除了 γ方向定位4丨，還必 須：過X方向疋位4 2 ’而且在定位過程中還必須經過至少 三個引腳（PIN)定位才能開始進行測試。 、、’ 、有鑑於此，本發明係提供一種晶粒檢測分類裝置及其 =法利用一疋位軸直接在晶圓上進行晶粒測試，不需多 :欠移動曰曰“立，也不需多次定位即可完成晶粒測試，該定位The conventional grain pick-up and inspection process refers to removing the die from the wafer, placing it on a tray, and then sequentially removing the die from the tray and placing it on a test platform. Please refer to the first picture for Flowchart of Grain Picking and Detecting in the Conventional Technology 'Firstly, remove the die 20 from the wafer 10, put it into a tray 30, and then use the two picking method to remove the die 20 from the tray 30. Put it on the test platform to measure j, but the grain 20 has been moved several times before the test, so before testing, the grain 20 must be positioned first. In addition to the γ direction positioning 4 丨, it must also be: X The orientation position is 4 2 ′, and during the positioning process, at least three pins (PIN) must be positioned before the test can be started. In view of this, the present invention provides a grain detection and classification device and a method for directly performing a grain test on a wafer by using a positioning axis, without the need for: under-movement, "stand," and The grain test can be completed by multiple positioning.
:,T晶粒在取出同時可以快速定位，進行檢測，藉此避 免夕。人取放造成晶粒重複定位的煩雜過程， 粒取放效率。 疋’代 【内容】 =發明技術之主要目的係提供一種晶粒檢測分類方 法，特別是適用於晶粒取放檢測過程，藉由該晶粒檢測分:, T grains can be quickly located and taken out at the same time when taking out, so as to avoid the evening. The complicated process of repeated positioning of crystal grains caused by human picking and placing results in efficient grain picking and placing.疋 ’代 [Content] = The main purpose of the invention is to provide a method for classification and classification of grains, especially suitable for the process of grain pick-and-place inspection.
1225675 五、發明說明（2) 類方法可在晶粒取放過程中直接檢測晶粒，不需多次移動 晶粒，即可完成晶粒測試，其中，該晶粒檢測分類方法主 要係於該晶圓上直接測試晶粒，特別是藉由一定位軸將晶 粒從晶圓上移開，並進行檢測，不須多次取放及重複定位 的晶粒，進一步提高晶粒取放效率。 本發明技術之主要目的係提供一種晶粒檢測分類裝 置’特別是適用於晶粒取放檢測過程，藉由該晶粒檢測分 類裝置可在晶粒取放過程中直接檢測晶粒，不需多次移動 晶粒’即可完成晶粒測試，其中，該晶粒檢測分類裝置主 要包含兩個取放晶粒平台及一定位軸，藉此該晶粒可直接 在晶圓上測試，不需要先將將晶粒從晶圓上移開再進行檢 測’因此可減少多次取放及重複定位晶粒，進一步提高晶 粒分類檢測之效率。 【實施方法】 本發明技術提供一種晶粒檢測分類裝置及其方法，可 適用於晶粒從晶圓取出之檢測分類過程，藉由該晶粒檢測 分類裝置及其方法可在晶粒取放過程中直接檢測晶粒，不 需多次移動晶粒，即可完成晶粒測試。 請參考第二圖係為本發明技術之晶粒檢分 圓1 0之u又置，其中該晶圓1 〇上具有至少一個晶粒2 1; 一定 位軸61，設於該第一平台6〇下，且具有一可升降之抵端 611; —第一機械手臂7〇,設有一探針71;其中，該抵端 6 11可藉由升降抵起該晶粒2丨後，透過該探針7丨進行電性1225675 V. Description of the invention (2) The method can directly detect the grains during the process of picking and placing the grains, and the grain test can be completed without moving the grains multiple times. Among them, the grain detection classification method is mainly based on the The die is directly tested on the wafer, especially the die is removed from the wafer by a positioning axis and tested. It is not necessary to repeatedly pick and place and reposition the die, which further improves the efficiency of chip picking and placing. The main purpose of the technology of the present invention is to provide a grain detection and classification device 'especially suitable for the process of grain pick-and-place inspection, by which the grain inspection and classification device can directly detect grains during the process of grain pick-and-place, without the need for more The die test can be completed by moving the die twice. The die detection and classification device mainly includes two pick-and-place platforms and a positioning axis, so that the die can be directly tested on the wafer without first The die will be removed from the wafer and then inspected ', so multiple pick-and-places and repeated positioning of the die can be reduced, further improving the efficiency of die classification inspection. [Implementation method] The technology of the present invention provides a grain detection and classification device and a method thereof, which can be applied to the detection and classification process of taking out crystals from a wafer. It can directly detect the grains without moving the grains multiple times to complete the grain test. Please refer to the second figure, which is a chip inspection circle 10 of the technology of the present invention, wherein the wafer 10 has at least one die 2 1; a positioning axis 61 provided on the first platform 6 〇, and has a lifting end 611;-the first robotic arm 70, is provided with a probe 71; wherein the end 6 11 can be lifted up and down against the die 2 through the probe Pin 7 丨 for electrical properties
第7頁 1225675 五、發明說明（3) 測試，測試該 置入一第二平 該晶圓1 〇上具 第一平台6 0前 該晶粒上置之 請再參考 示意圖，該晶 及一第二平台 吸起該晶粒置 複數個特定容 完成的晶粒可 粒2 1置入該第 來分類裝盛不 並依據該探針71之測試，將該晶粒 右1¾彳η預先分類之該特定容器；此外’如果 ，兮:以上晶粒2 0時，該晶圓1 0在設置於該 —=曰曰圓會預先切割以劃分該晶粒2 〇，並對 監膜1 1進行崩裂。 第二圖係為本發明技術之晶粒檢測分類過程 粒檢測分類裝置更包含一第二機械手臂80以 9 〇 ’該第二機械手臂8 〇設有一吸取結構8 1可 入該第二平台上9〇，而該第二平台9〇，具有 器（Β I Ν )，可提供該晶粒之設置；經過檢測 藉由該第一機器手臂之吸取結構8 1吸起該晶 二平台上9 0之特定容器，該特定容器更可用 同類型之晶粒。 又，本發明技術提供之一種晶粒檢測分類方法，請參 考第四圖係為本發明技術之晶粒檢測分類方法流程圖，該 晶粒檢測分類方法，首先設置一晶圓於一第一平台5 1，其 中該晶圓至少具有一晶粒及一藍膜覆蓋，若該晶圓上有兩 個以上的晶粒時，將預先進行晶圓劃分，並進行崩裂藍 膜，使得該晶粒能彼此分離；其次於該第一平台下升起一 定位軸抵起該晶粒5 2 ;之後藉一第一機械手臂設有一探針 測試該晶粒5 3，該測試可包含檢測該晶粒之電性測試；最 後藉一第二機械手臂吸取該晶粒置入一第二平台上54 ;其 中，該第二平台上包含至少一特定容器，且該特定容器已 預先分類。Page 7 1225675 V. Description of the invention (3) Test, test the placement of a second flat wafer 10 with the first platform 60 before the die is placed on the wafer, please refer to the schematic diagram again, the crystal and a first The second platform sucks up the crystal grain and sets a plurality of specific grains. The crystal grains 2 1 are placed in the first to classify and hold, and according to the test of the probe 71, the crystal grains 1¾ 彳 η are pre-classified. A specific container; in addition, 'if, when: when the above die 20, the wafer 10 is set in the — = said circle will be cut in advance to divide the die 20, and the monitor film 1 1 will be cracked. The second figure is the grain detection and classification process of the technology of the present invention. The grain detection and classification device further includes a second robotic arm 80 to 90 °. The second robotic arm 80 is provided with a suction structure 81 and can be inserted into the second platform. 90, and the second platform 90 has a device (B IN), which can provide the setting of the crystal grains; after inspection, the suction structure of the first robot arm 8 1 sucks up 9 0 on the crystal platform 2 For a specific container, the same container can be used with the same type of die. In addition, a grain detection and classification method provided by the technology of the present invention, please refer to the fourth figure for a flowchart of the grain detection and classification method of the present technology. The grain detection and classification method firstly sets a wafer on a first platform. 51, where the wafer has at least one die and a blue film cover, if there are more than two die on the wafer, the wafer is divided in advance, and the blue film is cracked, so that the die can Separated from each other; secondly, a positioning axis is raised under the first platform against the grain 5 2; then a first robotic arm is provided with a probe to test the grain 5 3, and the test may include detecting the grain. Electrical test; finally, the second die is used to suck the die and place it on a second platform 54; wherein the second platform contains at least one specific container, and the specific container has been pre-sorted.
1225675 五、發明說明（4) 綜上所述，充份顯示出本發明技術之晶粒承載檢測方 法在目的及功效上均深富實施之進步性，極具產業之利用 價值，且為目前市面上前所未見之新發明，完全符合發明 專利之系統，爰依法提出申請。 唯以上所述者，僅為本發明之較佳實施例而已，當不 能以之限定本發明所實施之範圍。即大凡依本發明申請專 利範圍所作之均等變化與修飾，皆應仍屬於本發明專利涵 蓋之範圍内，謹請 貴審查委員明鑑，並祈惠准，是所至 禱01225675 V. Description of the invention (4) In summary, it fully shows that the method of grain bearing testing of the technology of the present invention is deeply implemented in terms of purpose and efficacy, has great industrial use value, and is currently on the market New inventions that have not been seen before are completely in line with the system of invention patents, and applications are filed according to law. The above are only the preferred embodiments of the present invention, and it should not be used to limit the scope of the present invention. That is to say, all equal changes and modifications made in accordance with the scope of the patent application for the present invention should still fall within the scope of the patent of the present invention.
1225675 圖式簡單說明 第一圖係為習知技術之晶粒取放檢測流程圖； 第二圖係為本發明技術之晶粒檢測分類裝置示意圖； 第三圖係為本發明技彳^之晶粒檢測分類過程示意圖； 第四圖係為本發明技術之晶粒檢測分類方法流程圖。 【符號說明】 10 晶圓 11 藍膜 20 晶粒 30 承盤 31 晶粒裝盛位置 4 0 測試平台 41 Y方向定位 42 X方向定位 51 設置晶圓於第一平台 5 2 升起定位轴抵起晶圓上之晶粒 5 3 測試晶粒 5 4 將晶粒置入第二平台上 60 第一平台 61 定位軸 6 11抵端 7 0 第一機械手臂 71 探針 80 第二機械手臂 81 吸取結構1225675 The diagram is a simple illustration. The first diagram is a flowchart of the conventional technology for picking, placing, and testing of grains. The second diagram is a schematic diagram of the grain detection and classification device of the present technology. The third diagram is the crystal of the invention Schematic diagram of grain detection and classification process; The fourth diagram is a flowchart of the grain detection and classification method of the technology of the present invention. [Symbol description] 10 Wafer 11 Blue film 20 Die 30 Receiving plate 31 Die holding position 4 0 Test platform 41 Y-direction positioning 42 X-direction positioning 51 Set the wafer on the first platform 5 2 Raise the positioning axis against Die on wafer 5 3 Test die 5 4 Place die on second platform 60 First platform 61 Positioning axis 6 11 Abutment 7 0 First robot arm 71 Probe 80 Second robot arm 81 Suction structure
第10頁 1225675 圖式簡單說明 90 第二平台 II·!Page 10 1225675 Schematic description 90 Second Platform II ·!