TW446829B - Image formation position adjusting device, exposure system, image formation adjusting method and exposure method - Google Patents

Abstract

The purpose of the present invention is to adjust the image formation position of the projection optical system by continuous variation with high accuracy. The first and second optical members 32, 33 consisting of wedge-shaped sheets of glass and having tilted surfaces 32b, 33a are disposed facing each other, wherein a positive pressure groove 33c supplied with a compressed air from a positive pressure source P and a negative pressure groove 33d vacuum-sucked by a negative pressure source V are provided in the tilted surface 32b of the first optical member 32 to form an air bearing with the first and second optical members 32, 33 facing each other in non-contact condition, and a relative clearance (sheet thickness) between a plane 32a of light incidence and a plane 33b of outgoing light can be changed and adjusted by actuating an actuator 35 against an urging force of a coil spring 36 to relatively move the first optical member 32 with respect to the second optical member 33. By installing this image formation position adjusting device 31 on the optical axis of the projection optical system, the image formation position can be arbitrarily adjusted.

Description

· A46 82 9

TECHNICAL FIELD The present invention relates to an imaging position adjustment device, an exposure device, an imaging position adjustment method, and the like for a micro ^ exposure device such as a liquid crystal display device or a plasma display device, and the present invention relates to preparing the imaging position adjustment for use in the manufacture of electronic devices. Device exposure method. The conventional technology is used to manufacture relatively large-scale liquid crystal display panels, etc. for the production of Tongnan. A field-type projection exposure device is used. The scanning projection exposure device is a J light pepper illumination area illumination light sheet, and * and the illumination area = orthogonal. Ϊ ^ 播 播; h + 出 s ΡΠstop the cover first, and for the exposure area I 'shared with the lighting area, scan the photosensitive substrate (glass plate, etc.) coated with the photoresist, and put the mask on the circle equal times. Or reduce the device that is successively exposed on the photosensitive substrate after projection. The shadow optical system is provided corresponding to each of the plurality of illuminated areas. Here, since the surface (pattern surface) of the photomask and the surface (exposed surface) of the photosensitive substrate are preferably set to positions conjugate to the projection optical system during exposure, the light and the photosensitive substrate are controlled by the level adjustment device. posture. The water w adjustment device is structurally provided in a direction along the optical axis of the projection optical system: a plurality of actuators, etc., to move the actuators appropriately and move the photomask or photosensitive substrate along the optical axis. The direction is ㈣, and rotates about two orthogonal axes in a plane orthogonal to the optical axis. Yes, there are irregularities on the surface of the mask and the photosensitive substrate due to its flatness or deflection caused by the state of maintenance. Therefore, in a local view, the mask and the photosensitive substrate are not conjugated to the projection optical system. Situation.

Department of imaging position (imaging surface) and sense

446829 V. Description of the invention (2) The surface of the light substrate is well adjusted. However, it is good. Although the light sensitivity is reduced, the precision and the higher are used to maintain the resulting method. Here, each of the parallel plane plates is provided with an appropriate system. However, the degree of each projection parallel plane plane is changed. Moreover, the outline of the invention is long. Therefore, the method of adjusting the projection light imaging position adjustment method is to improve the accuracy of the south direction and the optical axis of the plane. The distance in the direction (focus error) is used to control the posture of the photosensitive substrate, and it is adjusted to be the most useful on average: Use the attitude control of the level adjustment device to adjust the position on the substrate and each projection first. M = Yes, it remains, there are restrictions. The smallest of manufacturing, the body ... by the mask or the sense = the work of Teramoto "precision, reducing the increase in man-hours and the price rise, etc., I hope other solutions: because the imaging position of the projection optics is In its light can be adjusted according to its thickness.

The parallel plane plate with the plate thickness adjusted, so that each projection optical image is imaged on the surface of the photosensitive substrate. Due to the unevenness of the photosensitive substrate or the photomask, the imaging position of the continuous optical system needs to be adjusted to continuously change. The thickness of the plate to be adjusted and the plate thickness change need to be stable with extremely high precision. The purpose of the present invention is to provide an imaging device capable of continuously changing the imaging position of a faculty with high accuracy and adjusting the position of the imaging device, and an exposure device provided with the present device, the method of "improving the imaging position and increasing the price of the exposure system," etc. High density of electronic devices.

Page 5 446829 V. Description of the invention (3) According to the first aspect of the present invention, an imaging position adjustment device for adjusting an imaging position of an optical system is provided, including: first and second optical elements, Having an opposite inclined surface and transmitting light of a predetermined wavelength; a non-contact device that makes the opposite inclined surface face each other in a non-contact manner; and a moving device that makes the first optical element and the optical axis along a direction crossing the optical axis of the optical system and The second optical element moves relatively. If the imaging position adjusting device of the present invention is used, the first and second optical elements having opposite inclined surfaces · are moved relative to each other using a moving device, so that the overall thickness of the first and second optical elements can be adjusted. Therefore, by setting the imaging position adjustment device on the optical axis of the projection optical system, the imaging position of the projection optical system can be arbitrarily changed and adjusted. Here, 'not specifically defined, a non-contact bearing can be used for this non-contact device', for example, including a gas bearing. By adopting such a non-contact device such as a gas bearing, the first and second optical elements can be fine-tuned to a relative position without contact with each other. 'Deterioration over time with adjustment and adjustment of the relative position 3, can be adjusted with high accuracy and stability. Imaging position. According to a second aspect of the present invention, there is provided an exposure device that uses a projection optical system to expose a pattern on a substrate. The exposure device includes: and a second optical element, which is arranged in the projection optical system and has opposite inclined surfaces. And transmitting light of a predetermined wavelength; and a moving device that relatively moves the first optical element and the second optical element in a direction crossing the optical axis of the projection optical system. If the exposure device ’is equipped with the imaging position adjustment device, the imaging position of the projection optical system can be arbitrarily changed and adjusted, and the exposure stomach K &

Page 6 446829 V. Description of the invention (4) The surface of the board and the like has unevenness, and the surface can be manufactured with high precision and high density. The surface of the substrate can be reliably imaged. . The method is to adjust the imaging position of the optical system. The adjustment of the imaging position includes: the step of arranging an optical element with an inclined surface facing each other and transmitting light of a predetermined wavelength to the optical system; and non-contact A step of moving the i-th optical element and the second optical element along the inclined surface. According to a fourth aspect of the present invention, an exposure method is provided, which is an exposure method for exposing a pattern on a substrate by using a projection optical system, including: first and second optical elements having opposite inclined surfaces and transmitting light of a predetermined wavelength; A step of disposing in the projection optical system; and a step of moving the first optical element and the second optical element in a direction crossing the optical axis of the projection optical system. Brief Description of the Drawings Fig. 1 is a structural diagram showing a main part of a scanning type projection exposure apparatus according to an embodiment of the present invention. Fig. 2 is a diagram showing a relationship between a photosensitive substrate and a field of view in an embodiment of the present invention. Fig. 3 is a structural diagram showing a projection optical system according to an embodiment of the present invention. Fig. 4 is a side view showing the construction of an imaging position adjusting device according to an embodiment of the present invention. FIG. 5 is a bottom view of the first optical member of the imaging position adjusting device according to the embodiment of the present invention. Fig. 6 is a schematic diagram showing processing of an embodiment of the present invention.

446 82 9 V. Description of the invention (5) Fig. 7b: η: ί n Figures and diagrams of the status of the horizontal control in the embodiment. The best embodiment of the invention of the situation of the image position adjustment control in the detailed example of the month and month The detailed description of the present invention is based on the attached drawings. The main embodiment of the invention is a scanning projection exposure apparatus A plate of the embodiment of the invention of Qiu Ba, and FIG. 2 is a diagram showing the relationship between the photosensitive exposure and the field of view of the embodiment of the present invention. In circles 1,11, a photomask to be transferred is formed;} 2 is a photosensitive substrate such as a glass plate coated with a photosensitive material (photoresist). These reticle U and Weiguang substrate 12 are arranged to interpose a plurality of sets of projection optical systems. 3 ('ε sets of U are oriented here, will be along the projection of approximately H and π and photosensitive substrate 12, the optical axis of Department 13 The direction is set to the ζ direction (Z axis), and the plane parallel to the ζ direction is shown in the figure} The direction parallel to the paper surface is set to the X direction α axis) 'in the plane orthogonal to the ζ direction and the X direction The direction perpendicular to the paper surface in FIG. 1 is set to the Υ direction (γ axis). An illumination optical system 1 $ is disposed on the opposite side of the projection optical system 13 of the mask 11. In the illumination optics system 14, although the illustration is omitted, the illumination light emitted by a plurality of light sources composed of a free ultra-high-light silver lamp is once concentrated and emitted by a light guide or the like. The emitted light from this light guide is converted into a light beam having a uniform illuminance distribution by a compound eye integrator 'and formed into a slit shape by a curtain having a slit shape (rectangular) opening. The light beam that has passed through the curtain enters the condenser lens. The condenser lens forms an image on the light grass 1 i through the beam, and illuminates the photomask 1 in a plurality of slit-shaped illumination areas.] ≪: 1 5 is on the photomask Light of 11 and illumination optics 14

Page 8

A46 82 9 Description of the invention (6) Alignment marks (i.e., alignment marks i2a ~ l2 I formed on the photomicrograph to detect the position of the photomask U) are arranged between the ejection sections so that they can move forward and backward freely. The pair of photomasks Π on the substrate 12 is sucked and held in the position shown in the figure. The substrate 12 is sucked and held on a mask table of the substrate worker 2, and the photosensitive plate table 16 is installed and formed into a cross section: 1 ″. These reticle worktables and the base scanning worktables (not shown in the figure) are moved in the shape of [letter ... direction m in base two: Zhatai; = three linear actuators displaced in 2 directions 1 7 (in Fig. 1 Only 2 are shown) are installed in the 槁 >, by these linear actuators i 涯 择 ^. The surface of the photosensitive substrate 12 is shifted and the axis is in the middle: the rotary motion of the body is rotated in the Z direction (the state adjusts the horizontal axis (Sichuan and the scan centered on the γ axis as a D (substrate table)) It can be moved in the X direction of the scanning direction in accordance with the control drive of the upper (exposure control device). The position of the photosensitive substrate 12 is measured by a plurality of position sensors 19 such as a laser interferometer provided on the substrate table 16. The position of the photomask is also measured using a plurality of position sensors (not shown) such as a laser interferometer provided on the photomask table. When the scanning table is stationary, it is projected on the photosensitive substrate 丨 2 The slit-like pattern image above is a part of the mask pattern formed on the mask 丨 (imaged, but by the mask table that will hold the mask i and the substrate that holds the photosensitive substrate 12 The worktable 丨 6 is kept in one scanning table relative to the illumination area on the reticle 11 and the projection optical system 丨 3 moves and scans, so that all the reticle patterns formed on the reticle 11 are transferred to the photosensitive substrate ι2 446 82 9 Five 'invention description (7) In this embodiment, the optical system of the equal magnification erect image t · 7 system is made on the projection optical system 13. The illumination light is shaped using the openings of the blinds arranged on the illumination optical system 1 4 t on each of the light-sensitive substrates 12. The trapezoidal field-of-view area I 8a to Ue (see FIG. 2), a plurality of rectangular (slit-shaped) illumination areas (not shown) illuminate the photomask 11. FIG. 3 shows the structure of the projection optical system 13 and the projection optical system. 1 3 has all the structures of Fig. 3. The projection optical system 13 has a structure composed of two sets of Dyson type optical systems, a part i optical system 13a (21 ~ 24) and a part optical system 13b. (26 ~ 29), etc. The first part of the optical system 13a includes a right angle 稜鏡 2 that faces the mask 11 and has a reflecting surface arranged at an inclination angle of 45 °. 1. It has light in a direction along the plane of the mask π. A plano-convex lens component 22 having an axis and a convex surface facing the right side of the right angle 稜鏡 21, a lens component 23 having a meniscus shape as a whole and a reflective surface having a concave surface facing the plano-convex lens component 22 side, and a reflection surface orthogonal to the right-angle prism 21 and It has a reflection arranged at an oblique angle of 45 ° with respect to the 11 face of the mask The right-angle clock mirror 2 4. The illumination light from the illumination optical system 14 through the mask 11 is used to deflection the optical path to 90 using the right angle 稜鏡 21. Then, it enters the plano-convex lens component 22 joined to the right angle 稜鏡 21. This plano-convex lens component 22 is a lens component 23 composed of different glass materials for the plano-convex lens and the plano-convex lens. The light from the right-angle prism 2i is refracted on the joint surface 22a of the lens components 22 and 23 and reaches the reflection of the vapor-deposited reflective film. Surface 23a. The light reflected by the reflective surface 23a is folded at the joint surface 22 & the beam reaches the right angle 稜鏡 24 which is joined to the lens component 22. The light from the lens component I 22 is deflected by 90 ° by the right angle 稜鏡 24, The right-angle prism |

Page 丨 0 446 82 9 V. Description of the invention (8) One image is formed on the exit side of 24. # a _The light of human imaging is formed by the second part of the optical system i3b (26 ~ 29) to form a photomask 11 on the surface of the sensor i «. Because the second part of the light: Λ is the same as the optical system i3a of the first part, and the detailed description is omitted. The two sides of the faculty of Psychology 13 (the first and second optical systems i3a, i3b) are two two two two two. A field of view diaphragm (not shown) is arranged at the position of the first imaging formed by the optical system 13a in the first part. C 1 The field of view has a trapezoidal opening. The field of view diaphragm is used to expose two I i it exposures. The area is defined as a trapezoid. That is, 'as shown in FIG. 2,' the imaging of these field of view areas 18 a to 18 e having the field of view defined by the field of view stop in the projection optical system is an orthophoto of the light area on the photosensitive substrate 12 at equal magnification ( The horizontal magnification in the up, down, left, and right directions is a positive image). Here, a part of the projection optical system 3 is arranged as a field region 18a to 18 (; arranged along the γ direction in the figure. Another part of the projection optical system 13 is arranged as In the figure, the visual field regions 1 and 18e at different positions in the X direction and the visual field regions 18a to i8c are arranged along the Y direction. Each visual field region 18a to 18e is arranged as the short side of the parallel sides above the visual field regions 18a to 18c.) It faces the field of view 18d and the upper side. At this time, the trapezoidal field of view areas 18a to 18e are arranged so that the sum of the widths of the field of view areas i 8a to 8e along the X direction, that is, the moving direction of the scanning table, becomes a constant value at any position in the Y direction. This is because when the scanning table is moved in the χ direction while exposing the large exposure area of the photosensitive substrate 12, a uniform exposure distribution can be obtained in the entire exposed area of the photosensitive substrate 12 due to the exposed area 18a on the photosensitive substrate 12. ~ 18c and exposed area I8d,

IH • A46 82 9 V. Description of the invention (9) 18e is set to be separated in the X direction, and the pattern elongated in the γ direction becomes the first to use the spatially separated and scattered exposure area to extinguish 18a ~ 18c after exposure with a period of 0τΓ. Fill in the middle exposure areas 18d, 18e, and expose them after dividing them in time and space. An imaging position adjustment device 31 for adjusting the imaging position of the projection optical system 13 is arranged on the optical path (optical axis) between the first and second part optical systems 1 3a, 1 3b of the projection optical system 13 and Each optical system of each projection optical system 1 3 corresponds. The detailed structure of the imaging position adjusting device 31 is shown in FIGS. 4 and 5. The imaging position adjusting device 31 includes a first optical element 32, a second optical element 33, and a moving device that slides the first optical element 32. The moving device is guided by the first optical element 32 into a plurality of freely sliding guide rollers 34, a linear actuator 35 for slidingly displacing the first optical element 32, and a linear actuator 35 for biasing the first optical element 32 toward the linear actuator 35 side. The coil spring 36 and a position detection sensor 37 for detecting the position of the first optical element 32 are configured. In this embodiment ', the first optical element 32 is guided by a plurality of guide rollers 34 so as to be movable in the X direction (or Y direction), and the second optical element 33 is fixed to a frame or the like not shown in the figure. However, the first optical element 32 is fixed in structure and the second optical element 33 is moved or both the first and second optical elements 32 and 33 can be moved. The first optical element 32 and the second optical element 33 are each formed to transmit light of a predetermined wavelength (including light of a predetermined frequency band including the wavelength of the illumination light). = Glass plate. That is, the first optical element 32 has a j-th incident surface 32a as a light incident surface and a j-th emission surface 32b as a light exit surface which is oblique to the first incident surface 32a. In addition, the second optical element 33 has a first working element along the first optical element 32.

V. Description of the Invention (ί) The second incident surface 33a as the light incident surface facing the exit surface 32b and the second exit surface 33b as the light exit surface which is substantially parallel to the first incident surface 3 2a of the first optical element 32. A plurality of positive pressure grooves 32c and a plurality of negative pressure grooves 3 2 d are formed in the first emission surface 32 b of the first optical element 32. In this embodiment, two negative pressure grooves 32d are arranged on two sides of the positive pressure groove 32c at two positions near both ends. These positive pressure grooves 32c and negative pressure grooves 32d are configured to keep the first exit surface 32b of the first optical element 32 and the second incident surface 33a of the second optical element 33 at a fixed interval from each other so as to face each other in a non-contact manner. The grooves of the air bearing serving as the non-contact device, that is, the positive pressure grooves 3 2c communicate with the positive pressure supply source (compressed air supply device) P (not shown) through the through holes, and supply the positive pressure groove through the positive pressure supply source p. The compressed air 32c biases the first optical element 32 in a direction to make it separate (float) from the second optical element 33. Each of the negative pressure grooves 32d communicates with a negative pressure supply source (vacuum pumping device) v through a through hole, and the air in the negative pressure groove 3 2d is evacuated by the negative pressure supply source V to move the first optical element 32. The bias is applied in a direction to approach (contact) the second optical element 33. The positive pressure supply source p and the negative pressure supply source V are controlled by appropriate adjustments to maintain the repulsive force using the positive pressure groove 32c and the suction force using the negative pressure groove 32d at a predetermined value. The first exit surface 32b of the first optical element 32 The second incident surface 3 3 a of the second optical element 33 faces the second incident surface 3 3 a while maintaining a fixed gap g. In this embodiment, the gap G is set to about 10 m. In addition, when the gap g is too large, since optical aberration occurs, as shown in this embodiment, 10 # m to several 0 # m is better. In any case, it is only necessary to set the gap G within the optical aberration allowable by the use device (for example, a projection exposure device).

Page 13 446829 V. Description of the invention αι) '' One -----: The front end of the motion axis of the two-actuator linear actuator 35 touches the light beam path, and one side 'expands and contracts by this motion axis, so that First optical element 32. The guide light 34 moves. Coil spring_: Tilt the i-th optical element to the other :: f so that one side of the first optical element 32 touches the front end of the linear actuator 35. The position (movement amount) of the i-th optical element 32 is detected by a position detection sensor 37 such as ί or a linear encoder, and the feedback control of the linear actuator 35 is performed according to the detected value. 2 is accurately positioned at an arbitrary position relative to the second optical element 3 3. With this, the relative size (thickness) of the i-th emission surface m of the i-th optical element 32 and the second-person emission surface 33a of the second optical π member 33 can be arbitrarily fine-tuned, for example, 4; The optical element 32 is moved from the position indicated by the two-dot chain line to a position not indicated by the solid line, and the imaging position of the projectable optical system 13 is only changed. As shown above * The optical axis direction (z direction) of each projection optical system 13 can be adjusted with high accuracy using the imaging position adjustment device 31. / A rectangular chrome-shaped anti-contact film 38 is formed on the second incident surface 33a of the second optical element 33 to prevent the j-th emission surface of the first optical element 32 in a non-operating state, that is, when the air bearing is not activated. 32b is in direct contact with the second incident surface 33a of the second optical element 33. 2 and 3 again. The portion between the reticle U and the photosensitive substrate 12 and between the projection optical system 13 corresponding to the field of view areas 18a to 18c and the projection optical system corresponding to the field of view areas 18d and 18e are crossed in FIG. 2 The position indicated by the line is set to a plurality (3 in this embodiment) of the focus sensing Is 2 0 arranged in the γ direction. These focus sensors 2 0 emit detection beams to the surface (pattern surface) of the mask 丨 丨 and the surface (exposure surface) of the photosensitive substrate 12 respectively.

Page} _4 446 82 9 5 'Explanation of the invention (12) A device for detecting the reflected light and detecting the position of the surface of the photomask 1 1 and the surface of the photosensitive substrate 12 in the Z direction. By moving the scanning table in the X direction in accordance with the focus signals of each of the focus sensors 20, the data is extracted at an appropriate sampling interval in the X direction, and the X specified by and according to the feed rate of the scanning table can be obtained. Surface data consisting of the coordinates and the respective positions in the Z direction of the photomask 11 and the photosensitive substrate 12 at positions corresponding to the γ coordinates specified by the position of the focus sensor 20 in the Y direction. These surface data represent the flatness of the photomask i 1 and the photosensitive substrate 丨 2 | the surface, the respective i associated with the holding of the photomask table and the substrate table 丨 6, and the subsequent bending of the scanning table Information on the unevenness of the mask and the surface of the photosensitive substrate 12 caused by unevenness is given. However, in this embodiment, the photomask π and the photosensitive substrate 12 are obtained based on the positions in the Z direction of each of the mask 11 and the photosensitive substrate. The relative distance in the Z direction is set as the surface data. Furthermore, it is assumed that the photomask Π is an ideal plane, and all the projections and depressions including the surface of the photomask 丨 are treated as being located on the photosensitive substrate 12. The surface data is stored in a memory device (not shown). Next, the operation of the scanning exposure apparatus will be described with reference to the figure showing the outline of the processing shown in FIG. First, after the scanning table is moved to the predetermined substrate transfer position at the end of the + χ direction, the photosensitive substrate 12 is moved to the substrate table 16 of the scanning table (ST1) = the photomask π has been moved in and held at Photomask workbench for scanning workbench. Then, the scanning table starts to move in the χ direction in which the preliminary scanning should be performed. The photomask 1 1 and the photosensitive substrate 12 are moved synchronously with respect to the projection optical system 1 3

Page 15

446829 V. Description of the invention (13) At this time, 3 uses a masker not shown in the figure to block the illumination light of the illumination optical system 14. ... ', in this preliminary scan,' the relative attitude (X, Y position) in the \ _ γ plane of the mask 1 丨 and the photosensitive substrate 丨 2 is detected (ST2). Specifically, the alignment microscope 15 is moved to a predetermined detection position. When the alignment marks 12a and 12b of the photosensitive substrate i 2 are located at the positions of the field of view 18a and 18c, the photosensitive substrate 15 is used to detect the photosensitive substrate. The relative positions of the alignment marks i 2 a, 1 2 b of 1 2 and the corresponding alignment marks formed on the photomask 11 corresponding to them ^ 'Poor' and then 'When the alignment marks i2c, 12d of the photosensitive substrate 12 When located in the field of view 18a, 18c, use the alignment microscope 丨 5 to detect the alignment mark of the photosensitive substrate 12 丨 2C '12d and the relative position deviation of the corresponding alignment mark formed on the photomask n . In the preliminary scan, the relative distance (Z position) in the Z direction of the photomask 11 and the photosensitive substrate 12 is detected simultaneously with the process (S T 2) (ST3). Specifically, by extracting the positions of the photomask 11 and the photosensitive substrate 2 in the z direction according to the predetermined distance between the focus signals of the focus sensor 20 and the photomask 11 and the photosensitive substrate 12 according to the predetermined distance, the checkerboard shape The relative distances in the Z direction between the photomask 11 and the photosensitive substrate 12 corresponding to the predetermined coordinates X and γ are stored in the memory device as surface data. The sampling position of the surface data in the X direction is shown in FIG. 2 by a cross line and a dotted cross line. In addition, the more the number of samples in the X direction on the photosensitive substrate 12, the higher the accuracy, but it is appropriately determined in consideration of the relationship between the time required for signal processing or calculation processing. If the scanning table is moved to a predetermined end folding position in the X direction, it is | only ′ Use the position not shown in the figure equipped with the photosensitive substrate 12 and the photomask table!

Page 16 446329 V. Description of the invention (14) The correction mechanism is moved in the XY plane, and one or both of the photomask η and the photosensitive substrate 12 are rotated, so that the positions of the photomask Η and the photosensitive substrate 12 are aligned with each other into light. The relative positional deviations of the alignment marks of the cover 11 and the photosensitive substrates 2 and the alignment marks corresponding to the alignment marks 12a to 12d are minimized (ST4). According to the surface data stored in the memory device as a set of relative distances in the Z direction in discrete positions in the χ-γ plane, an approximate surface (ST 5) is calculated using an approximation method such as a least square method. Then, the horizontal control amount is calculated (ST6). That is, based on the data of the focal distance of each projection optical system 13 (preliminarily obtained), after calculating the theoretical imaging position of the first optical element 32 of the imaging position adjustment device 31 in a state of a predetermined starting position, The theoretical imaging position and the approximate surface calculated in ST5 are used to calculate the focus error in the γ direction (the distance between the imaging position of the projection optical system i 3 and the approximate surface in the Z direction) which becomes the smallest. The amount of rotation (Θχ) around the X-axis and the amount of movement in the z-direction after 16 is set to the horizontal control amount of the linear actuator 17 for adjusting the posture of the substrate table i 6. In addition, in the case where the rotation of the substrate table 16 about the γ axis is also corrected, the rotation amount (0y) is calculated in the same way, and it is also included as the horizontal control amount for the linear actuator 17 . The horizontal control amount is calculated according to the feed amount (movement amount) of the scanning table in the x direction every predetermined feed amount. Following & the 'calculation uses the horizontal control amount calculated in ST6 to correct the new approximate surface of the approximate surface calculated in ST5, and then calculates the residual based on the new approximate surface and the theoretical imaging position. Focus error

446329 V. Description of the invention as) * ----- (ΙτΙΓ. The difference is that after calculating these control amounts for the imaging position control amounts of the imaging position adjustment device 31, the light of the illumination optical system 14 is lifted to the photo-: And start scanning formally by moving the scanning platform. By moving along with the scanning task a > teaching | moving, the linear control actuates according to the horizontal control amount corresponding to the position of the scanning platform at X square °. The actuator 17 adjusts the level appropriately, and the linear actuator 35 of the imaging position adjustment device is actuated according to the imaging position control amount. The first optical element 32 is moved relative to the second optical element 33, and the overall plate is adjusted. It is so thick that the imaging position of each projection optical system and the surface of the photosensitive substrate 12 are approximately equal to each other so that the photosensitive substrate 12 is exposed (ST8). Therefore, the photosensitive material of the photosensitive substrate 12 is selectively photosensitive, and the transfer mask is sequentially projected. Imaging of the pattern of U. If the transfer of the pattern of the photosensitive substrate 12 is completed, repeat the same operation by replacing another photosensitive substrate. If the scanning projection exposure device of this embodiment is used, FIG. 7A adjusts the level by controlling the linear actuator 17 for the substrate table 16 in accordance with the level control amount in the formal scanning, so that the focus error at each position on the surface of the photosensitive substrate 12 becomes smaller on average. As shown in FIG. 7B, by controlling the imaging position adjustment device 3 provided for each projection optical system i 3 according to the imaging position control amount, the imaging position of the projection projection optical system itself is changed, so that the horizontal adjustment is still used. The remaining focus error becomes smaller individually. In addition, the imaging surface of each of the projection optical systems 1 3 before the adjustment of the imaging position shown in the two-point chain line in FIG. 7A; the two-point chain line in FIG. 7B The illustrated systems are each of the projection optical systems 13 after adjusting the imaging position.

Page 18 446 R2 9 V. Description of the invention (16) Other imaging surface. This eliminates the misunderstanding of the focus caused by the unevenness of the surface of the photomask 11 and the photosensitive substrate 12, and it becomes possible to perform exposure processing in the entire region of the photosensitive substrate 12 in a state close to the best focus, which can produce high precision and high reliability. Microelectronic devices such as liquid crystal display devices. In addition, in this embodiment, the level adjustment and the imaging position adjustment are performed according to the surface data on the relative distance between the photomask n and the photosensitive substrate 12 in the Z direction, but the surface data or Adjust only according to the surface data of the photosensitive substrate i 2. & The level adjustment of the #focus error is performed with the linear actuator i 7 of the photosensitive substrate 12 in combination, but it can be adjusted with the action on the light; also may. '一 又' In the imaging position adjustment of this embodiment, the home position 31 is adjusted, so that the second door 2L is the first? The imaging element 33 can fine-tune the imaging of each projection optical system 13 in a non-contact state with an air bearing in a non-contact state. It can be adjusted in a long-term and stable manner because it is non-contact and has less aging. The non-contact impact of the element 33 is described in the above example. The combination of 70 and 32 and the first and the repulsive force of the positive μ is used in the above example f, which uses a combination of negative f dust attraction and magnetic repulsion.罔 negative a.. ,, m ^ ^ j In addition, the combination of positive and negative pressure, magnetic force, and gravity is described by the combination of magnetic attraction and repulsive force of magnetic force. Bias

Page 19 446829 V. Description of the invention () 7)---- When the M is acceptable. In addition, if a driving mechanism is provided for tilting the imaging position adjustment dress 31 as a whole, the projection position of each projection optical system 13 can be shifted. For example, when the projection magnification of each projection optical system 13 is adjusted by using the expansion and contraction of the photosensitive substrate 12, the overlap amount of the trapezoidal field-of-view areas 18 ^ and} 8 (1 will change =. The imaging position adjustment device 31 is tilted as a whole, and can adjust the overlapping amount of the trapezoidal field-of-view areas 18a and 8 (1. Therefore, in this embodiment, due to the two imaging position adjustment devices 31, each projection can be adjusted = optical ^ The imaging position of the optical axis direction and the γ direction orthogonal to the optical axis direction can simplify the structure of the projection optical system 13. In addition, the above-mentioned embodiments are for the purpose of not limiting the present invention, and each element disclosed also includes It is a change or equivalent of the present invention, and it is easy to understand the present invention. Therefore, all the designs in the technical scope described in the above-mentioned embodiment, such as 'in the above-mentioned embodiment', describe the use of scanning technology in the structure. Ϊ Moving the photomask 11 and the photosensitive substrate 12 and applying the present invention to the case of a scanning type projection exposure device that uses equal-magnification projection exposure, but it can also be applied to the photomask and the photosensitive substrate. The scanning projection exposure device that exposes the plates in the same direction or in the opposite direction and moves synchronously. The projection method is not limited to equal magnification projection. It is also possible to reduce or enlarge the projection & and also to adjust the imaging position of the present invention. The device is not only a scanning type exposure device but also a stationary type exposure device (such as a stepper). In addition, the exposure device in this embodiment can use g-rays (wavelength 436 nm) generated from a mercury lamp on the exposure illumination light or i-ray (wavelength 446 82 9 V. Description of the invention (18) 365nm), KrF excimer laser (wavelength 248nm), ArF excimer laser (wavelength 193nm), F2 laser (wavelength I57nm), Ar2 Lasers (wavelength 12 6 nm) and high-harmonics such as metal vapor lasers or γ a G lasers. Amplified by j) FB semiconductor lasers using fiber amplifiers doped with europium (or both bait and yttrium) After a single-wavelength laser in the infrared or visible light region excited by a laser or fiber laser, and using a non-linear optical crystal to convert the wavelength into high harmonics of ultraviolet light, it is also possible.

The semiconductor device manufactured by using the exposure device of this embodiment includes, for example, a liquid crystal display device such as a liquid crystal display element or a plasma display, a semiconductor such as an element, a thin film magnetic head, and a photographing element (CCD). This type of semiconductor device passes the function and performance design steps of the device, a step of making a photomask according to the design step, a step of making a substrate such as a glass plate or a transistor, a step of transferring a pattern of a photomask to a substrate using the exposure device, The device assembly step, u (including cutting process, bonding process, packaging process) and inspection steps and other manufacturing. In addition, the exposure device of this embodiment is configured by a plurality of lenses. The illumination optical system 1 4 and a plurality of sets of projection optical systems 13 with imaging position adjustment devices 3 丨 are incorporated into the exposure device body for optical adjustment. The scanning table composed of parts is installed on the main body of the exposure device and quickly connected to the wiring or piping, and then the overall adjustment (electric adjustment, action ball recognition, etc.) can be manufactured. In addition, it is best to manufacture the exposure device in a clean room under temperature and cleanliness management. 2 Intact citations include instructions, patent application scope, drawings, and abstracts. Japanese franchise made on September 25, 1998 First

Page 21 446829 V. Description of the invention (19) 1 0-27 1 270 The full disclosure content is recorded in this manual 18d 1 2 ~ photosensitive substrate 12 2d ~ alignment mark 1 3a, 1 3b ~ part of optical 16 ~ substrate X, Y position ST4 of substrate table substrate, alignment mask. X, γ position ST5 of substrate, approximate approximate surface ST6, calculated horizontal control amount ST7, calculated imaging position control amount ST 8, exposure symbol description : 11 ~ masks 12a, 12b, 12c, 1 3 ~ projection optics 1 4 ~ illumination optics 1 7 ~ linear actuators 18a, 18b, 18c, 19, 2 0 ~ sensor 22, 23 ~ lens Component 2 3a ~ Reflecting surface 31 ~ Adjustment devices 32a, 33a ~ Incident surfaces 32c, 33c ~ Positive pressure measure 34 ~ Multiple guide roller 36 ~ Coil spring P ~ Positive pressure supply source ST, Load substrate ST2, ST3 ~ Detection Mask 18e ~ Viewing area 2 Right angle 稜鏡 22a ~ Joint surface 24 ~ Right angle 稜鏡 32,33 ~ Optical element 32b, 33b ~ Ejection surface 32d, 33d ~ Negative pressure groove 3 5 ~ Linear actuator 37 ~ Detection Sensor V ~ negative pressure supply source

Page 22

Claims (1)

4 4 6 8 2 9 VI. Patent Application Range | 1. An imaging position adjustment device that adjusts the imaging position of the optical system, | The imaging position adjustment device includes: first and second optical elements, which have opposite inclined surfaces and transmit Light of a predetermined wavelength; a non-contact device that makes the opposite inclined surface face to each other with a non-contact, and a moving device that relatively moves the first optical element and the second optical element in a direction crossing the optical axis of the optical system . I 2. The imaging position adjusting device according to item i of the patent application range, wherein i each of the first and second optical elements is a wedge-shaped glass plate. 3. If the imaging position adjustment device of item 1 or item 2 of the patent application scope, wherein the non-contact device includes a non-contact bearing. | 4. The imaging position adjustment device according to item 3 of the patent application, wherein the non-contact bearing is a gas bearing. 5. The imaging position adjustment device according to item 1 of the patent application scope, which includes a driving mechanism for integrally driving the first optical element and the second optical element with respect to the optical axis of the optical system. 6. The imaging position adjustment device according to item 1 of the scope of patent application, wherein the moving device drives the first optical j element and the second optical element in a direction substantially orthogonal to the optical axis. I 7. —An exposure device that exposes a pattern to a substrate: a projection optical system. The exposure device includes: first and second optical elements, which are arranged in the projection optical system and have opposite inclined surfaces and transmit a predetermined light. Wavelength of light; and 丨 mobile device, along the direction that intersects the optical axis of the projection optics order! \ Page 23 446829 6. Scope of patent application The first optical element and the second optical element move relatively. 8. If the exposure device in the scope of patent application No. 7 = there is a non-contact device which makes the facing inclined surface face to face with non-contact. 9. The exposure device according to item 7 of the patent application > wherein each of the i-th and second optical elements is a wedge-shaped glass plate. 10. The exposure device according to item 8 of the patent application, wherein the non-contact device comprises a non-contact bearing. Π. The exposure device according to item 10 of the patent application scope, wherein the non-contact bearing is a gas bearing. 1 2. The exposure device according to item 7 of the scope of patent application * which includes a driving mechanism that drives the first optical element and the second optical element integrally with respect to the optical axis of the optical system. 13. The exposure device according to item 7 of the patent application, wherein the moving device drives the first optical element and the second optical element in a direction substantially orthogonal to the optical axis. 1 4. The exposure apparatus according to item 7 of the scope of patent application, which includes a mask table for holding a mask having the pattern. 1 5. The exposure device according to item 14 of the scope of patent application, which includes a detection device that detects information about the relative distance between the substrate and the photomask in the direction of the optical axis. 1 6. The exposure device according to item 15 of the patent application scope, wherein the moving | device moves the first optical element and the second optical element relative to each other according to the detection result of the detecting device. 1 7. The exposure device according to item 7 of the scope of patent application, wherein the exposure device Page 24 446 82 9 6. Scope of patent application The scanner is a scanning exposure device that exposes the pattern between moving the substrate. 18. The exposure device according to item 7 of the patent application scope, wherein the exposure device is provided with a plurality of sets of the projection optical system. 19. The exposure device according to item 18 of the scope of patent application, wherein the first projection optical system and the second projection optical system are configured as a part of the projection area of the first projection optical system among the plurality of sets of projection optical systems. It partially overlaps with one of the projection areas of the second projection optical system. 2 0. — An imaging position adjustment method, adjusting the imaging position of the optical system 'The imaging position adjustment method includes: arranging the first and second | optical elements having opposite inclined surfaces and transmitting light of a predetermined wavelength; And a step of moving the first optical element and the second optical element along the inclined surface in a non-contact manner. i 2 1. The imaging position adjustment method according to item 20 of the patent application scope, which includes the step of driving the first optical element and the second optical element integrally with respect to the optical axis of the optical system. 2 2. The imaging position adjustment method according to item 20 of the scope of patent application, wherein the incident surface of the first optical element where the light of a predetermined wavelength enters and the exit surface of the second optical element where the light of the predetermined wavelength exits are Roughly parallel. : 2 3. An exposure method that uses a projection optical system to expose a pattern to a substrate. The exposure method includes: arranging the first and second optical elements having opposite inclined surfaces and transmitting light of a predetermined wavelength. The steps in the projection optics; and Page 25 4 46 82 9 VI. Scope of patent application The step of moving the first optical element and the second optical element in a direction crossing the optical axis of the projection optical system. 2 4. The exposure method according to item 23 of the scope of patent application, wherein the first optical element and the second optical element perform the relative movement in a non-contact manner. 2 5. The exposure method according to item 23 of the scope of patent application, wherein the incident surface of the first optical element where the exposed light enters and the exit surface of the second optical element where the exposed light exits are substantially parallel. 2 6. The exposure method according to item 23 of the scope of patent application, including the step of driving the first optical element and the second optical element integrally with respect to the optical axis of the optical system. 2 7. The exposure method according to item 23 of the patent application scope, including the step of exposing the pattern between moving the substrate. 2 8. The exposure method according to item 23 of the scope of patent application, which includes the step of exposing a part of the pattern to the substrate and exposing it on the substrate. 2 9. A substrate, the pattern is exposed using the exposure method as described in item 23 of the patent application. Page 26