經濟部智慧財產局員工消費合作社印製 411296 A7 B7 五、發明說明（I ) 技術锸域 本發明係有關於晶圓硏磨裝置，尤有關於利用化工硏 磨法（CMP:Chemical Mechanical Polishing )之半導體晶圓 ’硏磨裝置。 背景技術 曾有人提議以一種於托架（corrier)與晶圓之間形成 壓力空氣層之硏磨裝置作爲此種半導體晶圓硏磨裝置，根 據此硏磨裝置；經由前述壓力空氣層，將按壓片夾之按壓 裝置所施加之按壓力量傳元晶圓，壓緊晶圓於硏磨固定盤 ，予以硏磨。 又，於前述晶圓硏磨裝置設有包圍晶圓周緣之挾持環 ，藉由晶圓周緣抵接此挾持環，防止晶圓自托架飛出。自 防止晶圓飛出觀點看來，前述挾持環剛性高，並安裝於其 他剛性高之構件來使用。 惟，前述晶圓硏磨裝置因挾持環之剛性高，故晶圓成 點接觸狀態壓緊挾持環。由於壓力藉此集中於前述點接觸 部份，故有晶圓於此接觸部份發生裂縫等瑕疵情形的缺點 0 本發明係鑑於此種情形而作成者，其目的在於提供一 種具備不會於晶圓造成瑕疵之挾持環之晶圓硏磨裝置。 發明槪要 爲達成前述目的，本發明特徵在於，在壓緊晶圓於保 本紙張尺度適用中國國家標準（CNS)A4規格（210 * 297公釐〉 .4. !1裝 iill·!訂.！ I _線 (靖先閲讀背面之注意事項ί寫本頁) 經濟部智慧財產局負工湞費合作社印製 411S9C a7 __B7__ 五、發明說明位） 持，旋轉於保持頭之硏磨固定盤而硏磨晶圓之硏磨裝置中 ，前述保持頭由以下元件構成：頭本體，旋轉同時對向配 置於前述硏磨固定盤；托架，上下方向移動自如支持於前 •述頭本體：空氣吹出構件，設於前述托架下面，同時朝前 述晶圓裏面吹出空氣，藉此於托架與晶圓間形成壓力流體 層：按壓裝置，經由前述壓力流體層，將前述晶圓壓緊於 前述硏磨固定盤；以及環，可上下移動嵌入前述托架之下 部外周部，防止晶圓自該托架飛出，同時藉由自晶圓橫向 抵接之晶圓之按壓力量，在形狀上，沿晶圓之周緣形狀彈 性變形。 根據本發明，於硏磨中，一旦晶圓周緣與挾持環抵接 ，挾持環即在形狀上藉由自晶圓橫向抵接之晶圓所產生之 按壓力量，沿晶圓周緣之形狀彈性變形》由於晶圓藉此成 而接觸狀態壓緊挾持環，故挾持環作用於晶圓之壓力分散 ，不會於晶圓產生裂縫等瑕疵。 圖式之簡單說明 第1圖係本發明實施形態之晶圓硏磨裝置之全體構造 1〇,| · 圖， 第2圖係適用於第1圖之晶圓硏磨裝置之保持頭之平 面圖； 第3圖係沿第2圖上3 - 3線之保持頭之縱剖面圖； 第4圖係顯示挾持環因抵接晶圓而彈性變形之狀態之 說明圖。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）_ 5 - — — — — — — — — — — — — — I — I —--—訂--- <請先閲讀背面之注意事項再填寫本頁)Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives 411296 A7 B7 V. Description of the Invention (I) Technical Field The present invention relates to wafer honing equipment, especially to the use of chemical honing (CMP: Chemical Mechanical Polishing). Semiconductor wafer 'honing device. 2. Description of the Related Art It has been proposed to use a honing device that forms a pressure air layer between a carrier and a wafer as such a semiconductor wafer honing device. According to this honing device, the pressure The wafer is pressed by the pressing device of the wafer clamping device, and the wafer is pressed against the honing fixed disk for honing. In addition, the wafer honing device is provided with a holding ring surrounding the periphery of the wafer, and the wafer ring abuts the holding ring to prevent the wafer from flying out of the bracket. From the viewpoint of preventing wafers from flying out, the aforementioned holding ring is highly rigid and is used by being mounted on other rigid members. However, because the aforementioned wafer honing device has high rigidity of the holding ring, the wafer is pressed into the point holding state by the holding ring. Because the pressure is concentrated on the aforementioned point contact portion, there are disadvantages such as cracks in the contact portion of the wafer. The present invention is made in view of this situation, and its purpose is to provide a device Wafer honing device for round holding rings that cause defects. In order to achieve the foregoing object, the present invention is characterized in that the Chinese National Standard (CNS) A4 specification (210 * 297 mm>) is applied to the compacted wafer and the guaranteed paper size (210 * 297 mm). I _line (Jing Xian first read the note on the back to write this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and the Co-operative Co-operative Society 411S9C a7 __B7__ V. Description of the invention), rotating on the honing fixed disk of the holding head and 硏In the honing device for wafer polishing, the holding head is composed of the following components: a head body, which is arranged opposite to the honing fixed disk while rotating, and a bracket, which can move freely in the vertical direction and is supported by the front body. It is located under the bracket and blows air into the wafer at the same time, thereby forming a pressure fluid layer between the bracket and the wafer: a pressing device presses the wafer against the honing through the pressure fluid layer. A fixed disk; and a ring that can be moved up and down and embedded in the outer periphery of the lower part of the bracket to prevent the wafer from flying out of the bracket. circle The shape of the periphery is elastically deformed. According to the present invention, in honing, once the wafer peripheral edge abuts the holding ring, the holding ring is elastically deformed in shape along the shape of the wafer peripheral edge by the pressing force generated by the wafer abutting laterally from the wafer. 》 Since the wafer is in contact with the holding ring, the pressure of the holding ring on the wafer is dispersed, and no defects such as cracks will be generated on the wafer. Brief Description of the Drawings Fig. 1 is the overall structure of the wafer honing apparatus of the embodiment of the present invention. Fig. 2 is a plan view of the holding head of the wafer honing apparatus suitable for Fig. 1; Fig. 3 is a longitudinal sectional view of the holding head taken along line 3-3 in Fig. 2; Fig. 4 is an explanatory diagram showing a state in which the holding ring is elastically deformed by abutting against the wafer. This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) _ 5-— — — — — — — — — — — I — I —--— Order --- < Please first (Read the notes on the back and fill out this page)
41129C A7 經濟部智慧財產局員工消費合作社印製 五、 發明說明G ) 主要元件對照 10 晶圓硏磨裝置 '12 硏磨固定盤 14 保持頭 16 硏磨布 18 心軸 20 馬達 22 頭本體 24 托架 25 凹部 26 導環 28 硏磨面調整環 28A 環狀上面 28B 環狀下面 28C 貫通孔 29 開口部 30 挾持環 32 橡膠片 32A 中央部 32B 中間部 32C 外周部 34 差動變壓器 36 壓緊構件 --- ---裝 i---I ^---訂---------線 (請先H讀背面之注意事項再4寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） .Q.41129C A7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Invention Description G) Main component comparison 10 Wafer honing device '12 Honing fixing plate 14 Holding head 16 Honing cloth 18 Mandrel 20 Motor 22 Head body 24 bracket Frame 25 Concave part 26 Guide ring 28 Honed surface adjustment ring 28A Ring-shaped upper surface 28B Ring-shaped lower surface 28C Through-hole 29 Opening 30 Holding ring 32 Rubber piece 32A Central portion 32B Middle portion 32C Outer peripheral portion 34 Differential transformer 36 Clamping member- ---- install i --- I ^ --- order --------- line (please read the precautions on the back first and then write this page) This paper size applies to Chinese national standards (CNS ) A4 size (210 x 297 mm) .Q.
41129C A7 五、發明說明θ ) 經濟部智慧財產局員工消費合作社印製 36A 本體 36B 頭部 36C 支持臂 36D 腳部 37 下面 38 旋轉軸 40 空氣供給路 42 空氣供給路 44 空氣供給路 46A 調整器 46B 調整器 46C 調整器 46D 調整器 48 空氣泵 50 多孔質板 52 空氣路 54 晶圓 54A 周緣 56 空氣室 58 扣接件 60 扣接件 62 空氣背部 64 空氣背部 66 空氣背部 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -----— I!--11 1111 ^--—訂---I 111--^ (請先M讀背面之注意事項i寫本頁) A741129C A7 V. Description of the invention θ) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs of the Consumer Cooperative Cooperative 36A body 36B head 36C support arm 36D foot 37 lower 38 rotating shaft 40 air supply path 42 air supply path 44 air supply path 46A regulator 46B Adjuster 46C Adjuster 46D Adjuster 48 Air pump 50 Porous plate 52 Air path 54 Wafer 54A perimeter 56 Air chamber 58 Fastener 60 Fastener 62 Air back 64 Air back 66 Air back This paper size applies to Chinese national standards (CNS) A4 specification (210 X 297 mm) -----— I!-11 1111 ^ --- Order --- I 111-^ (Please read the precautions on the back first i write this page ) A7
41129C ________B7 五、發明說明$ ) 70 -鐵 芯 72 繞 線 管 74 觸 頭 76 吸 入 泵 78 空 氣 供給路 用以實施發明之最佳形態 茲依以下附圖就本發明晶圓硏磨裝置之較佳實施形態 詳加說明。第1圖係有關本發明實施形態之晶圓硏磨裝置 之構造圖。同圖所示晶圓硏磨裝置1 〇主要由硏磨固定盤 1 2及保持頭1 4構成。硏磨固定盤1 2形成圓盤狀，於 其上面設有硏磨布1 6。又’於硏磨固定盤1 2下部連結 心軸1 8，此心軸1 8與馬達2 0之未圖示輸出軸連結。 前述硏磨固定盤12藉由驅動馬達20朝箭頭A方向旋轉 ，漿液自未圖示之噴嘴供至旋轉之硏磨固定盤12之硏磨 布1 6上。前述保持頭1 4藉未圖示之昇降裝置上下移動 ，在定位硏磨對泵的晶圓於保持頭14之際上昇移動。又 ，保持頭1 4在硏磨晶圓之際下降移動，將晶圓壓緊於前 述硏磨布1 6上。 第2圖係前述保持頭1 4之平面圖，第3圖係沿第2 圖之3 — 3線之縱剖視圖。第3圖所示保持頭1 4由頭本 體22、托架24、導環26、硏磨面調整環28，挾持 環30、橡膠片32、差動變壓器34及壓緊構件36等 構成。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） _g. — — — — — — — — — — — — · I- I I I Γ I I ^ in (請先閱讀背面之沒意事項#4寫本頁) 經濟部智慧財產局員工消費合作社印製 經濟部智慧財產局員工消费合作社印製 411^96 A7 ___B7 五、發明說明❺) 前述頭本體2 2形成圓盤狀，同時於其上面連結旋轉 軸3 8，藉由與此旋轉軸3 8連結之未圖示馬達朝箭頭B 方向旋轉。又，於頭本體2 2上形成空氣供給路4 0、 •42、44。前述空氣供給路40如第3圖上二點鏈線所 示伸延設於保持頭1 4外部，經由調整器（R:regulator ) 4 6 A連接於空氣泵（AP:airpump) 4 8。又，空氣供給 路42、 44亦同樣伸延設於保持頭14外部，分別地， 空氣供給路4 2經由調整器4 6 B連接於泵4 8，空氣供 給路4 4經由調整器4 6 C連接於泵4 8。 前托架2 4形成大致圓柱狀，於頭本體2 2下部，與 頭本體2 2配置在同軸上。又，於托架2 4下面形成凹部 2 5，具有通氣性的多孔質板5 0收納於此凹部2 5。形 成於托架24之空氣路52、 52連通多孔質板50,此 等空氣路52、 52如圖中二點鏈線所示伸延設於保持頭 1 4外部，與吸入泵（SP:suction pump)76連接。因此，一 旦驅動前述吸入泵7 6，晶圓5 4即爲多孔質板5 0吸引 而吸附保持於多孔質板5 0。且，前述多孔質板5 0內部 具有多數通氣路，其例如使用陶瓷材料之燒結體所構成者 〇 於前述托架2 4形成多數個於托架2 4下面外周部形 成噴出口之空氣供給路7 8、7 8 .........(第3圖僅顯示 2個）。如圖中二點鏈線所示，此空氣供給路78、 78 伸延設於保持頭1 4外部，經由調整器4 6 D空氣泵4 8 連接。因此，來自空氣泵4 8之壓縮空氣經由空氣供給路 本紙張尺度適用中固S家標準（CNS)A4規格（210 X 297公釐） -9 - — III—— — — •Lull· — — ^»— — — — — 1 — (請先Μ讀背面之注意事項#'4寫本頁) 經濟部智慧財產局員工消費合作社印製 411S9G ^ __B7 _ 五、發明說明f ) 7 8. 7-8 .........噴至多孔質板5 0與晶圓5 4間之空氣 室56。藉此，壓力空氣層形成於空氣室56，托架24 之按壓力量經由此壓力空氣層傳至晶圓5 4。晶圓5 4藉 •由經前述壓力空氣層傳送之前述按壓力量壓緊於硏磨布 16。且，噴自空氣供給路78、 78空氣自形成於硏磨 面調整環28之未圖示排氣孔排出外部。 另一方面，於頭本體2 2與托架2 4之間配置一橡膠 片3 2。此橡膠片3 2形成的一厚度圓盤狀。又，橡膠片 32藉大小二環狀扣接件58、 60固定於頭本體22下 面。藉此，以扣接件6 0爲界，二分爲中央部3 2A與中 間部3 2 B，復以扣接件5 8爲界，二分爲中間部3 2 B 與外周部3 2 C。亦即，橡膠片3 2以扣接件5 8、6 0 分成三部份，其具有作爲空氣背部（air back )，俾此中央 部32A按壓托架24，中間部32B按壓壓緊構件36 ，外周部3 2 C按壓硏磨面調整環2 8的功能。 前述空氣供給路4 0與前述空氣後座中橡膠片3 2之 中央部3 2A所區劃之空氣背部6 2.連接。因此，一旦壓 縮空氣自空氣供給路4 0供至空氣背部6 2，橡膠片3 2 之中央部3 2 A即因空氣壓力彈性變形而按壓托架2 4上 面。藉此，可獲得晶圓54對硏磨布16之壓緊力量。又 ，若以調整器4 6 A調整空氣壓力，即可控制晶圓2 4之 壓緊力量（硏磨壓力）。 前述導環2 6形成圓筒狀，於頭本體2 2下部，與頭 本體2 2配置在同軸上。又，導環2 6經由橡膠片3 2固 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） _ 1 〇 Ι1ΙΓΙ — — — — — — i I H Γ I I ^ « — — III—! ^ ί請先閲讀背面之注意事項#4寫本頁) 41129€ 經濟部智慧財產局員工消費合作社印裳 A7 B7 五、發明說明$ ) 定於頭本體2 2。於導環2 6與托架2 4之間配置硏磨面 調整環2 8。 於前述硏磨面調整環2 8上方形成橡膠片3 2之外周 •部3 2 C與扣接件5 8所區劃的環狀空氣背部6 4。前述 空氣供給路4 4與此空氣背部6 4連通。因此，一旦壓縮 空氣自空氣供給路4 4供至空氣背部6 4，橡膠片3 2之 外周部3 2 C即因空氣壓力彈性變形而按壓硏磨面調整環 28之環狀上面2 8A，硏磨面調整環2 8之環狀下面2 8 B壓緊硏磨布1 6。且，硏磨面調整環2 8之壓緊力量 可藉由以調整器4 6 C之調整空氣壓力予以控制。 於前述托架2 4與硏磨面調整環2 8之間配置壓緊構 件36。此壓緊構件36由本體36A、頭部36B、支 持臂36C、 36C及腳部36D、 36D構成。且，如 第2圖上虛線所示，壓緊構件3 6之頭部3 6 B、支持臂 3 6 C及腳部3 6 D分別等間隔形成3個。 第3圖所示前述壓緊構件3 6之本體3 6 A配置在形 成於硏磨面調整環2 8之開口部2 9內。又，壓緊構件3 6之前述頭部3 6 B與本體3 6 A—體形成，同時，隔有 間隙配置於托架2 4與硏磨面調整環2 8之間。 於前述頭部3 6 B之上方形成以橡膠片3 2之中間部 3 2 B及扣接件5 8、6 0區劃之環狀空氣背部6 6。前 述空氣供給路4 2連通此空氣背部6 6。因此，一旦壓縮 空氣自空氣供給路4 2供至空氣背部6 6，橡膠片3 2之 中間部3 2 B即因空氣壓力彈性變形而按壓壓緊構件3 6 ---- ----裝 - ---ri — 訂 —--I-線 <讀先閲讀背面之注意事項再4寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐) 77l _ 經濟部智慧財產局員工消費合作社印製 ^11S9C a? ___I_B7__；____ 五、發明說明自） 之頭部3 6B。藉此，壓緊構件3 6之腳部3 6D之下面 3 7壓緊硏磨布1 6。且，壓緊構件3 6之壓緊力量可藉 由以調整器4 6 B調整空氣壓力予以控制。又，前述腳部 ‘3 6 D配置在形成於硏磨面調整環2 8之貫通孔2 8 C ° 更且，爲了防止硏磨加工熱造成熱膨脹*壓緊構件3 8以 熱膨脹率極小之琥珀爲母材來形成，並且，按壓硏磨布 1 6之前述下面3 7塗佈金剛石，俾不致於爲硏磨布1 6 所硏磨。 另一方面；於前述按壓構件3 6之支持臂3 6 C前端 部設有檢測晶圓5 4硏磨量之差動變壓器3 4。此差動變 壓器34由鐵芯70、繞線管72及觸頭74構成，同時 ，前述繞線管7 2固定於壓緊構件3 6之支持臂3 6前端 部，前述鐵芯7 0上下移動自如配置於此繞線管7 2內。 又，前述觸頭7 4設在前述鐵芯7 0下部，此觸頭7 4接 觸托架2 4。又，未圖示之演算裝置連接於前述繞線管 7 2，此演算裝置根據鐵芯7 0相對於繞線管7 2之上下 移動量演算晶圓5 4之硏磨量。 而且，挾持環3 0可上下移動嵌入托架2 4之下部外 周部。前述挾持環3 0於晶圓5 4硏磨中接觸硏磨布1 6 。又，前述晶圓5 4藉硏磨布1 6之旋轉力量橫向移動’ 抵接挾持環3 0之內周面，藉此，以挾持環3 0阻止晶圓 54自托架24飛出。 又，由於前述挾持環3 0係樹脂製，故藉由如第4圖 所示，自晶圓5 4之周緣5 4A之橫向抵接之晶圓5 4所 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公釐） _ 12 -41129C ________B7 V. Description of invention $) 70-iron core 72 bobbin 74 contact 76 suction pump 78 the best form of the air supply path for implementing the invention The implementation form will be described in detail. FIG. 1 is a structural diagram of a wafer honing apparatus according to an embodiment of the present invention. The wafer honing apparatus 10 shown in the figure is mainly composed of a honing fixed disk 12 and a holding head 14. The honing fixing plate 12 is formed in a disc shape, and a honing cloth 16 is provided on the honing cloth. Furthermore, a mandrel 18 is connected to the lower part of the honing fixing plate 12 and this mandrel 18 is connected to an output shaft (not shown) of the motor 20. The aforementioned honing fixed plate 12 is rotated in the direction of arrow A by the drive motor 20, and the slurry is supplied from a nozzle (not shown) to the honing cloth 16 of the rotating honing fixed plate 12. The holding head 14 is moved up and down by a lifting device (not shown), and the wafer of the honing pump is positioned to move up and down while holding the head 14. In addition, the holding head 14 moves downward while honing the wafer, and presses the wafer against the honing cloth 16 described above. Fig. 2 is a plan view of the aforementioned holding head 14, and Fig. 3 is a longitudinal sectional view taken along line 3-3 of Fig. 2. The holding head 14 shown in Fig. 3 is composed of a head body 22, a bracket 24, a guide ring 26, a honing surface adjusting ring 28, a holding ring 30, a rubber sheet 32, a differential transformer 34, and a pressing member 36. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) _g. — — — — — — — — — — — I- III Γ II ^ in (Please read the unintentional matter on the back first # 4 写 页) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Employee Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 411 ^ 96 A7 ___B7 V. Description of the invention ❺) The aforementioned head body 2 2 is formed into a disc shape, and at the same time The rotary shaft 38 is connected to the upper surface, and is rotated in the direction of arrow B by a motor (not shown) connected to the rotary shaft 38. In addition, air supply paths 40, 42 and 44 are formed in the head body 22. The air supply path 40 is extended outside the holding head 14 as shown by a two-point chain line in FIG. 3, and is connected to an air pump (AP: airpump) 4 8 through a regulator (R: regulator) 4 6 A. The air supply paths 42 and 44 are also extended to the outside of the holding head 14. Similarly, the air supply path 42 is connected to the pump 4 8 via the regulator 4 6 B, and the air supply path 44 is connected to the pump 4 8 via the regulator 4 6 C.于 泵 4 8。 At the pump 4 8. The front bracket 24 is formed in a substantially cylindrical shape, and is disposed coaxially with the head body 22 under the head body 22. A recessed portion 25 is formed on the lower surface of the bracket 24, and a porous plate 50 having air permeability is accommodated in the recessed portion 25. The air passages 52 and 52 formed in the bracket 24 communicate with the porous plate 50. These air passages 52 and 52 are extended outside the holding head 14 as shown by a two-point chain line in the figure, and are connected to a suction pump (SP: suction pump). ) 76 connection. Therefore, once the aforementioned suction pump 76 is driven, the wafer 54 is attracted by the porous plate 50 and adsorbed and held on the porous plate 50. In addition, the porous plate 50 has a large number of air passages inside. For example, the porous plate 50 is made of a sintered body made of a ceramic material. A plurality of air supply passages are formed in the bracket 24 to form a spray outlet on the outer peripheral portion of the lower surface of the bracket 24. 7 8, 7 8 ......... (Figure 3 shows only 2). As shown by the two-dot chain line in the figure, the air supply paths 78 and 78 are extended to the outside of the holding head 1 4 and are connected via an adjuster 4 6 D air pump 4 8. Therefore, the compressed air from the air pump 48 is supplied to the paper through the air supply. The paper size applies the CNS A4 specification (210 X 297 mm) -9-— III—— — — • Lull · — — ^ »— — — — — 1 — (Please read the notes on the back # '4 to write this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 411S9G ^ __B7 _ V. Description of the invention f) 7 8. 7-8 ... sprayed to the air chamber 56 between the porous plate 50 and the wafer 54. As a result, a pressurized air layer is formed in the air chamber 56, and the pressing force of the bracket 24 is transmitted to the wafer 54 through the pressurized air layer. The wafer 54 is pressed against the honing cloth 16 by the aforementioned pressing force transmitted through the aforementioned pressure air layer. In addition, the air sprayed from the air supply paths 78 and 78 is discharged to the outside from a vent hole (not shown) formed in the honing surface adjusting ring 28. On the other hand, a rubber sheet 32 is arranged between the head body 22 and the bracket 24. The rubber sheet 32 is formed in a disc shape with a thickness. In addition, the rubber sheet 32 is fixed to the lower surface of the head body 22 by two ring-shaped fasteners 58, 60. With this, the fastener 60 is used as a boundary, and is divided into a central portion 3 2A and the intermediate portion 3 2 B, and the fastener 5 8 is used as a boundary, which is divided into a middle portion 3 2 B and an outer peripheral portion 3 2 C. That is, the rubber sheet 32 is divided into three parts by the fasteners 5 8 and 60, which has an air back. The central part 32A presses the bracket 24, and the middle part 32B presses the pressing member 36. The outer peripheral portion 3 2 C functions to press the honing surface adjustment ring 28. The aforementioned air supply path 40 is connected to the air back 6 2. defined by the central portion 3 2A of the rubber sheet 32 in the aforementioned air rear seat. Therefore, once the compressed air is supplied from the air supply path 40 to the air back 6 2, the central portion 3 2 A of the rubber sheet 3 2 is elastically deformed by the air pressure and presses the upper surface of the bracket 2 4. Thereby, the pressing force of the wafer 54 on the honing cloth 16 can be obtained. In addition, if the air pressure is adjusted by the regulator 4 6 A, the pressing force (honing pressure) of the wafer 2 4 can be controlled. The guide ring 26 is formed in a cylindrical shape, and is arranged coaxially with the head body 22 under the head body 22. In addition, the guide ring 2 6 is fixed via a rubber sheet 3 2 and the paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) _ 1 〇Ι1ΙΓΙ — — — — — — i IH Γ II ^ «— — III —! ^ Please read the note on the back # 4 to write this page) 41129 € Yin Sang A7 B7, Consumer Cooperative of Employees and Intellectual Property Bureau of the Ministry of Economic Affairs. A honing surface adjustment ring 2 8 is arranged between the guide ring 26 and the bracket 2 4. The outer periphery of the rubber sheet 3 2 is formed above the honing surface adjustment ring 2 8. The annular air back 64 divided by the portion 3 2 C and the fastener 5 8. The aforementioned air supply path 4 4 communicates with this air back 64. Therefore, once the compressed air is supplied from the air supply path 4 4 to the air back 6 4, the outer peripheral portion 3 2 C of the rubber sheet 3 2 is elastically deformed by the air pressure and presses the annular upper surface 28A of the honing surface adjustment ring 28. The ring-shaped lower surface 2 8 B of the surface adjustment ring 2 8 is pressed against the honing cloth 16. Moreover, the pressing force of the honing surface adjusting ring 28 can be controlled by adjusting the air pressure of the adjuster 4 6 C. A pressing member 36 is arranged between the bracket 24 and the honing surface adjusting ring 28. This pressing member 36 is composed of a main body 36A, a head portion 36B, support arms 36C and 36C, and leg portions 36D and 36D. In addition, as shown by a dotted line in FIG. 2, three heads 3 6 B, support arms 3 6 C, and leg portions 3 6 D of the pressing member 36 are formed at equal intervals. The main body 3 6 A of the pressing member 36 shown in Fig. 3 is disposed in the opening portion 29 formed in the honing surface adjusting ring 28. In addition, the aforementioned head 3 6 B of the pressing member 36 and the main body 3 6 A are integrally formed, and are disposed between the bracket 24 and the honing surface adjusting ring 28 with a gap therebetween. A ring-shaped air back 6 6 divided by a rubber sheet 3 2 and a middle part 3 2 B and fasteners 5 8 and 60 is formed above the head 3 6 B. The aforementioned air supply path 4 2 communicates with this air back 6 6. Therefore, once compressed air is supplied from the air supply path 4 2 to the air back 6 6, the middle portion 3 2 B of the rubber sheet 3 2 is elastically deformed by the air pressure and presses the pressing member 3 6 ---- ---- ---- ri — Order —-I-line < Read the precautions on the reverse side and then write this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 77l _ Economy Printed by the Consumer Cooperatives of the Ministry of Intellectual Property Bureau ^ 11S9C a? ___I_B7__; ____ V. Description of the invention from) Head 3 6B. With this, the lower surface 3 7 of the leg portion 36 of the pressing member 36 is pressed against the honing cloth 16. In addition, the pressing force of the pressing member 36 can be controlled by adjusting the air pressure with the adjuster 4 6 B. In addition, the aforementioned leg portion '3 6 D is disposed in the through hole 2 8 C formed in the honing surface adjusting ring 2 8. Furthermore, in order to prevent thermal expansion due to the heat of the honing process, the pressing member 3 8 has amber with extremely small thermal expansion rate. It is formed for the base material, and the diamond is coated on the lower surface 37 of the honing cloth 16 so that the honing cloth 16 is not honed. On the other hand, a differential transformer 34 is provided at the front end of the support arm 3 6 C of the pressing member 36 to detect the honing amount of the wafer 5 4. This differential transformer 34 is composed of an iron core 70, a bobbin 72, and a contact 74. At the same time, the aforementioned bobbin 72 is fixed to the front end of the support arm 36 of the pressing member 36, and the aforementioned iron core 70 is moved up and down. Freely arranged in the bobbin 72. The contact 74 is provided below the iron core 70, and the contact 74 contacts the bracket 24. A calculation device (not shown) is connected to the bobbin 72, and the calculation device calculates the honing amount of the wafer 54 based on the amount of movement of the iron core 70 relative to the bobbin 72. Further, the holding ring 30 can be moved up and down to engage the outer peripheral portion of the lower portion of the bracket 24. The aforementioned holding ring 30 contacts the honing cloth 16 in the wafer 5 4 honing. In addition, the wafer 54 is moved laterally by the rotational force of the honing cloth 16 to abut the inner peripheral surface of the holding ring 30, thereby preventing the wafer 54 from flying out of the bracket 24 by the holding ring 30. In addition, since the holding ring 30 is made of resin, as shown in FIG. 4, the wafer 5 4 which is laterally abutted from the periphery 5 4A of the wafer 5 4 is in accordance with the Chinese national standard (CNS). ) A4 size (210x297 mm) _ 12-
In — — — — — — — — — — ·1111„--I — — — — — — — (請先《讀背面之注意事項务总寫本頁) 經濟部智慧財產局員工消費合作社印製 a7 ____B7___ 五、發明說明6〇 ) 產生之按壓力量P，自圖中二點鏈線所示原來形狀變形， 其沿晶圓5 4之周緣5 4A之形狀彈性變形。因此，前述 晶圓5 4在與挾持環3 0成角度0之範圍內成面接觸狀態 下壓緊挾持環3 0。且，若係藉前述按壓力量P彈性變形 者，即不限於樹脂製，亦可適用金屬製挾持環。 其次，.就如前述構成之晶圓硏磨裝置1 0之作用加以 說明。首先，在使保持頭14上昇後，驅動吸入泵76， 吸附保持硏磨對象之晶圓5 4於多孔質板5 0。 其次，使保持頭1 4下降，於保持頭1 4之硏磨面調 整環2 8之接觸面抵接硏磨布1 6之位置停止下降移動= 並且，停止吸入泵7 6，解除前述晶圓5 4之吸附，將晶 圓5 4載置於硏磨布1 6上。 其次，驅動空氣泵48，經由空氣路78將壓縮空氣 供至空間56|於空氣室56形成壓力空氣層。此時，藉 由控制調整器4 6 D調整壓縮空氣的供給量，設定壓力空 氣層的壓力爲預定壓力。 其次•經由由空氣供給路4 0，將來自泵4 8之壓縮 空氣供至空氣背部6 2，藉由內部空氣壓力使橡膠片3 2 之中央部3 2 A彈性變形而按壓托架2 4 _經由前述壓力 層將晶圓5 4壓緊於硏磨布1 6。而且，以調整器4 6A 調整空氣壓力，將內部壓力控制成所需壓力，保持晶圓 5 4對硏磨布1 6之壓緊力量一定。 而且，於此同時，經由空氣供給路4 4將來自泵4 0 之壓縮空氣供至空氣背部6 4，藉由內部空氣壓力使橡膠 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -13- I ------- .!1'1 — 1 訂 (請先閱讀背面之注意事項？寫本頁) 經濟部智慧財產局員工消費合作社印製 41129c A7 ____B7__ 五、發明說明（M ) 片3 2之外周部3 2 C彈性變形而按壓硏磨面調整環2 8 ’將硏磨面調整環2 8與挾持環3 0之下面壓緊於硏磨布 1 6。而且，經由空氣供給路42將來自泵40之壓縮空 _氣供至空氣背部6 6，藉由內部空氣壓力使橡膠片3 2之 中間部3 2 B彈性變形而按壓壓緊構件3 6，將壓緊構件 3 6之下面3 7壓緊於硏磨布1 6。此後，旋轉硏磨固定 盤1 2及保持頭14，開始晶圓54之硏磨。 於晶圓5 4硏磨中，固然晶圓5 4藉由硏磨布1 6之 旋轉橫向移動，於其周緣壓緊於挾持環3 0狀態下硏磨， 惟，如第4圖所示，此時，挾持環3 0藉來自晶圓5 4的 按壓力量P，在形狀上，沿晶圓5 4之周緣5 4A之形狀 彈性變形。藉此，晶圓5 4在與挾持環3 0面接觸狀態下 ，壓緊挾持環3 0，由於挾持環3 0作用在晶圓上的壓力 分散，故不會於晶圓產生裂縫等瑕疵。 另一方面，硏磨中晶圓5 4之硏磨量藉由差動變壓器 3 4之觸頭7 4接觸托架2 4 ’根據觸頭7 4之下降量’ 亦即鐵芯7 0之下降量，以演算裝置算出。 而且，一旦前述演算裝置所算出之硏磨量達到預先設 定之硏磨加工終點，即停止晶圓硏磨裝置1 〇 ’結束晶圓 5 4之硏磨。藉此，一片晶圓5 4之硏磨結束，在硏磨第 2片以後之晶圓情形下’可反覆進行前述步驟。 產業上可利用性 如以上說明，根據本發明晶圓硏磨裝置’由於藉由自 本紙張尺度適用中國國家標準（CNS>A4規格（210x297公爱）-14- — — I!!! — — · ·-! 1 Γ I I 訂 (請先閱讀背面之注意事項—总寫本頁》 A7 411290 ____B7____ 五、發明說明) 晶圓橫向抵接之晶圓按壓力量，在形狀上1挾持環沿晶圓 周緣之形狀彈性變彤，故挾持環作用在晶圓上之壓力分散 疵 瑕 等 縫 裂 生 產 圓 晶 於 會 不 ---.---Γ I------裝.1 — (請先閱讀背面之注意事項再4寫本頁) 線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格<210^297公爱） .15 -In — — — — — — — — — — — · 1111 „-I — — — — — — — (Please read“ Precautions on the back ”and write this page first) The Intellectual Property Bureau, Ministry of Economic Affairs, Consumer Consumption Cooperative, printed a7 ____B7___ V. Description of the invention 60) The pressing force P generated from the original shape shown by the two-point chain line in the figure is deformed, and it deforms elastically along the shape of the periphery 5 4A of the wafer 54. Therefore, the aforementioned wafer 54 is The holding ring 30 is pressed in a state of being in surface contact with the holding ring 30 at an angle of 0. Moreover, if it is elastically deformed by the aforementioned pressing force P, it is not limited to resin, and a metal holding ring may also be applied. Next, the function of the wafer honing apparatus 10 configured as described above will be described. First, after the holding head 14 is raised, the suction pump 76 is driven to adsorb and hold the wafer 5 4 to be polished to the porous plate 5 0. Next, the holding head 14 is lowered, and the lowering movement is stopped at the position where the contact surface of the honing surface adjusting ring 2 8 of the holding head 14 abuts the honing cloth 16 = and the suction pump 76 is stopped to release the foregoing. For the adsorption of the wafer 54, the wafer 54 is placed on the honing cloth 16. Next, the air pump 48 is driven, and compressed air is supplied to the space 56 through the air path 78. A compressed air layer is formed in the air chamber 56. At this time, the supply of compressed air is adjusted by the control regulator 4 6 D to set the compressed air layer. The pressure is a predetermined pressure. Secondly, the compressed air from the pump 48 is supplied to the air back 6 2 through the air supply path 40, and the central portion 3 2 A of the rubber sheet 3 2 is elastically deformed by the internal air pressure. Press the bracket 2 4 _ Press the wafer 5 4 against the honing cloth 16 through the aforementioned pressure layer. Also, adjust the air pressure with the adjuster 4 6A, control the internal pressure to the required pressure, and keep the wafer 5 4 pairs The pressing force of the honing cloth 16 is constant. At the same time, the compressed air from the pump 40 is supplied to the air back 6 4 through the air supply path 4 4. The rubber paper size is adapted to China by the internal air pressure. National Standard (CNS) A4 Specification (210 X 297 mm) -13- I -------.! 1'1 — 1 Order (Please read the notes on the back first? Write this page) Intellectual Property of the Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperatives 41129c A7 ____B7__ V. Description of Invention M) The outer peripheral portion 3 2 of the sheet 3 2 is elastically deformed and presses the honing surface adjusting ring 2 8 ′ and presses the lower surface of the honing surface adjusting ring 28 and the holding ring 3 0 against the honing cloth 16. The air supply path 42 supplies the compressed air_air from the pump 40 to the air back 6 6, and the middle portion 3 2 B of the rubber sheet 3 2 is elastically deformed by the internal air pressure to press the pressing member 36 to press the pressing member The lower part of 3 6 is pressed against the honing cloth 1 6. Thereafter, the honing fixed plate 12 and the holding head 14 are rotated to start honing of the wafer 54. During the honing of the wafer 54, although the wafer 54 is laterally moved by the rotation of the honing cloth 16, the honing is carried out under the state that the periphery of the wafer 54 is pressed against the holding ring 30, but as shown in FIG. 4, At this time, the holding ring 30 is elastically deformed in shape along the shape of the periphery 54 of the wafer 54 by the pressing force P from the wafer 54. As a result, the wafer 54 is pressed against the holding ring 30 in a state of being in contact with the holding ring 30. Since the pressure on the wafer by the holding ring 30 is dispersed, defects such as cracks will not be generated on the wafer. On the other hand, the honing amount of the wafer 5 4 in the honing is contacted by the contact 7 4 of the differential transformer 3 4 and the bracket 2 4 'according to the drop amount of the contact 7 4', that is, the drop of the iron core 70. The amount is calculated by a calculation device. Furthermore, once the honing amount calculated by the aforementioned calculation device reaches a preset honing process end point, the wafer honing device 10 'is stopped and the honing of the wafer 54 is finished. With this, the honing of one wafer 54 is finished, and in the case of honing the wafer after the second wafer ', the foregoing steps can be repeatedly performed. Industrial Applicability As explained above, according to the present invention, the wafer honing device 'applies to the Chinese national standard (CNS > A4 specification (210x297 public love) -14- — — I !!! — — · ·-! Order of 1 Γ II (Please read the precautions on the back-write this page first "A7 411290 ____B7____ 5. Description of the invention The wafer pressing force of the wafer lateral contact, 1 shape holding ring along the wafer circumference The shape of the edge becomes elastic, so the pressure produced by the holding ring on the wafer disperses flaws and other cracks to produce round crystals. ---.--- Γ I ------ pack. 1 — (Please (Please read the notes on the back before writing this page) (4) This paper is printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Online Economics. The paper size is applicable to the Chinese National Standard (CNS) A4 specification < 210 ^ 297 public love). 15-