TW367551B - Polishing pad and a process for polishing - Google Patents
Polishing pad and a process for polishingInfo
- Publication number
- TW367551B TW367551B TW083103794A TW83103794A TW367551B TW 367551 B TW367551 B TW 367551B TW 083103794 A TW083103794 A TW 083103794A TW 83103794 A TW83103794 A TW 83103794A TW 367551 B TW367551 B TW 367551B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing pad
- polishing
- pad
- modified
- modifying
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 10
- 238000000034 method Methods 0.000 title abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000003989 dielectric material Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7726593A | 1993-06-17 | 1993-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW367551B true TW367551B (en) | 1999-08-21 |
Family
ID=22137062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW083103794A TW367551B (en) | 1993-06-17 | 1994-04-27 | Polishing pad and a process for polishing |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5674352A (zh) |
| EP (1) | EP0638391A1 (zh) |
| JP (1) | JP3616407B2 (zh) |
| KR (1) | KR100307276B1 (zh) |
| TW (1) | TW367551B (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2914166B2 (ja) * | 1994-03-16 | 1999-06-28 | 日本電気株式会社 | 研磨布の表面処理方法および研磨装置 |
| TW334379B (en) * | 1995-08-24 | 1998-06-21 | Matsushita Electric Ind Co Ltd | Compression mechanism for grinding machine of semiconductor substrate |
| US6051495A (en) * | 1997-10-31 | 2000-04-18 | Advanced Micro Devices, Inc. | Seasoning of a semiconductor wafer polishing pad to polish tungsten |
| US6135863A (en) * | 1999-04-20 | 2000-10-24 | Memc Electronic Materials, Inc. | Method of conditioning wafer polishing pads |
| DE10162597C1 (de) * | 2001-12-19 | 2003-03-20 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung beidseitig polierter Halbleiterscheiben |
| JP4356601B2 (ja) | 2004-12-14 | 2009-11-04 | トヨタ自動車株式会社 | ウエビングガイド機構 |
| JP2009194134A (ja) * | 2008-02-14 | 2009-08-27 | Ebara Corp | 研磨方法及び研磨装置 |
| US9925637B2 (en) * | 2016-08-04 | 2018-03-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tapered poromeric polishing pad |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63283857A (ja) * | 1987-05-15 | 1988-11-21 | Asahi Chem Ind Co Ltd | 研磨布 |
| JP2707264B2 (ja) * | 1987-12-28 | 1998-01-28 | ハイ・コントロール・リミテッド | 研磨シートおよびその製造方法 |
| JPH01193166A (ja) * | 1988-01-28 | 1989-08-03 | Showa Denko Kk | 半導体ウェハ鏡面研磨用パッド |
| CA1298980C (en) * | 1988-02-26 | 1992-04-21 | Clyde D. Calhoun | Abrasive sheeting having individually positioned abrasive granules |
| EP0348757B1 (en) * | 1988-06-28 | 1995-01-04 | Mitsubishi Materials Silicon Corporation | Method for polishing a silicon wafer |
| US4962562A (en) * | 1989-01-18 | 1990-10-16 | Minnesota Mining And Manufacturing Company | Compounding, glazing or polishing pad |
| JP2994404B2 (ja) * | 1989-07-06 | 1999-12-27 | ハイ・コントロール・リミテッド | バインダーをフォーム状にして塗布する研磨シートの製造方法 |
| US5219462A (en) * | 1992-01-13 | 1993-06-15 | Minnesota Mining And Manufacturing Company | Abrasive article having abrasive composite members positioned in recesses |
| US5534106A (en) * | 1994-07-26 | 1996-07-09 | Kabushiki Kaisha Toshiba | Apparatus for processing semiconductor wafers |
| US5611943A (en) * | 1995-09-29 | 1997-03-18 | Intel Corporation | Method and apparatus for conditioning of chemical-mechanical polishing pads |
-
1994
- 1994-04-27 TW TW083103794A patent/TW367551B/zh not_active IP Right Cessation
- 1994-06-08 JP JP14875794A patent/JP3616407B2/ja not_active Expired - Fee Related
- 1994-06-13 EP EP94109011A patent/EP0638391A1/en not_active Withdrawn
- 1994-06-16 KR KR1019940013584A patent/KR100307276B1/ko not_active Expired - Fee Related
-
1995
- 1995-05-15 US US08/456,278 patent/US5674352A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR950001933A (ko) | 1995-01-04 |
| KR100307276B1 (ko) | 2001-11-30 |
| EP0638391A1 (en) | 1995-02-15 |
| JPH0722362A (ja) | 1995-01-24 |
| US5674352A (en) | 1997-10-07 |
| JP3616407B2 (ja) | 2005-02-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |