TW364143B - Conductive composite articles based on expandable and contractible particulate matrices - Google Patents

Conductive composite articles based on expandable and contractible particulate matrices

Info

Publication number: TW364143B
Authority: TW; Taiwan
Prior art keywords: polymeric particles; solvent; particles; conductive; polymeric
Prior art date: 1995-10-27

Application number

TW086103007A

Other languages

English (en)

Inventor

Zoya Martynenko Soane

Original Assignee

Zms Llc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1995-10-27

Filing date

1997-03-11

Publication date

1999-07-11

1997-03-11 Application filed by Zms Llc filed Critical Zms Llc

1999-07-11 Application granted granted Critical

1999-07-11 Publication of TW364143B publication Critical patent/TW364143B/zh

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material

Landscapes

Physics & Mathematics (AREA)
Chemical & Material Sciences (AREA)
Dispersion Chemistry (AREA)
Spectroscopy & Molecular Physics (AREA)
Compositions Of Macromolecular Compounds (AREA)
Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)

TW086103007A 1995-10-27 1997-03-11 Conductive composite articles based on expandable and contractible particulate matrices TW364143B (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US08/549,539 US5672297A (en)	1995-10-27	1995-10-27	Conductive composite articles based on expandable and contractible particulate matrices
PCT/US1996/017112 WO1997015932A1 (en)	1995-10-27	1996-10-24	Conductive composite articles based on expandable and contractible particulate matrices

Publications (1)

Publication Number	Publication Date
TW364143B true TW364143B (en)	1999-07-11

Family

ID=24193415

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW086103007A TW364143B (en)	1995-10-27	1997-03-11	Conductive composite articles based on expandable and contractible particulate matrices

Country Status (6)

Country	Link
US (1)	US5672297A (zh)
EP (1)	EP0914661A1 (zh)
AU (1)	AU713855B2 (zh)
CA (1)	CA2228941A1 (zh)
TW (1)	TW364143B (zh)
WO (1)	WO1997015932A1 (zh)

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US5756007A (en) *	1995-11-16	1998-05-26	Lucent Technologies Inc.	Composition for protection of devices
US5968606A (en) *	1997-06-30	1999-10-19	Ferro Corporation	Screen printable UV curable conductive material composition
US6121358A (en) *	1997-09-22	2000-09-19	The Dexter Corporation	Hydrophobic vinyl monomers, formulations containing same, and uses therefor
US8105690B2 (en)	1998-03-03	2012-01-31	Ppg Industries Ohio, Inc	Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
US6593255B1 (en)	1998-03-03	2003-07-15	Ppg Industries Ohio, Inc.	Impregnated glass fiber strands and products including the same
US6949289B1 (en)	1998-03-03	2005-09-27	Ppg Industries Ohio, Inc.	Impregnated glass fiber strands and products including the same
US6419981B1 (en)	1998-03-03	2002-07-16	Ppg Industries Ohio, Inc.	Impregnated glass fiber strands and products including the same
TW524820B (en) *	1998-03-17	2003-03-21	Ind Tech Res Inst	PTC conductive polymer composition
AU2514900A (en)	1999-01-27	2000-08-18	United States Of America As Represented By The Secretary Of The Navy, The	Fabrication of conductive/non-conductive nanocomposites by laser evaporation
EP1157270A1 (en) *	1999-02-03	2001-11-28	Aclara BioSciences, Inc.	Multichannel control in microfluidics
US6533963B1 (en)	1999-02-12	2003-03-18	Robert A. Schleifstein	Electrically conductive flexible compositions, and materials and methods for making same
US6315956B1 (en)	1999-03-16	2001-11-13	Pirelli Cables And Systems Llc	Electrochemical sensors made from conductive polymer composite materials and methods of making same
JP3346376B2 (ja) *	1999-11-05	2002-11-18	ソニーケミカル株式会社	異方性導電接続用導電性粒子及び異方性導電接続材料
US6343647B2 (en) *	2000-01-11	2002-02-05	Thermax International, Ll.C.	Thermal joint and method of use
US6317540B1 (en) *	2000-02-02	2001-11-13	Pirelli Cables & Systems, Llc	Energy cable with electrochemical chemical analyte sensor
US8062746B2 (en)	2003-03-10	2011-11-22	Ppg Industries, Inc.	Resin compatible yarn binder and uses thereof
DE102006004010A1 (de) *	2006-01-27	2007-08-09	CCS Technology, Inc., Wilmington	Optisches Kabel und Verfahren zur Herstellung eines optischen Kabels
ES2621210T3 (es) *	2006-02-14	2017-07-03	The Procter & Gamble Company	Partículas recubiertas sensibles
CA2635843C (en) *	2006-02-14	2012-12-04	The Procter & Gamble Company	Responsive coated substrates
WO2007127722A2 (en) *	2006-04-24	2007-11-08	Rensselaer Polytechnic Institute	Surface-modified substrate and method of its preparation
US7683102B2 (en) *	2006-04-28	2010-03-23	Xerox Corporation	Vehicles for ink compositions
CN101511981A (zh) *	2006-09-05	2009-08-19	3M创新有限公司	导热油脂
JP5166714B2 (ja) *	2006-09-15	2013-03-21	東海ゴム工業株式会社	センサー用架橋エラストマー体およびその製法
US20080083450A1 (en) *	2006-10-04	2008-04-10	United Technologies Corporation	Thermal management of concentrator photovoltaic cells
US7722786B2 (en) *	2007-02-23	2010-05-25	Henkel Ag & Co. Kgaa	Conductive materials
WO2008130958A1 (en) *	2007-04-17	2008-10-30	Henkel Ag & Co. Kgaa	Thermally-conductive compositions
JP4998732B2 (ja)	2007-10-22	2012-08-15	ソニーケミカル＆インフォメーションデバイス株式会社	異方性導電接着剤
US20090195512A1 (en) *	2008-02-05	2009-08-06	Sony Ericsson Mobile Communications Ab	Touch sensitive display with tactile feedback
EP2336765A1 (en)	2009-12-08	2011-06-22	Nanocyl S.A.	Fibre-based electrochemical sensor
KR101156266B1 (ko) *	2010-09-01	2012-06-13	삼성에스디아이 주식회사	배터리 팩
CA2756621C (en) *	2011-10-26	2020-07-14	Michael Serpe	Gel assembly
US10373891B2 (en) *	2013-06-14	2019-08-06	Laird Technologies, Inc.	Methods for establishing thermal joints between heat spreaders or lids and heat sources
US9759648B2 (en)	2014-07-03	2017-09-12	The Governors Of The University Of Alberta	Stimulus responsive polymeric system
WO2016024842A1 (ko) *	2014-08-14	2016-02-18	주식회사 한국알테코	전도성 복합체 및 이의 제조 방법
TWI535784B (zh)	2014-08-26	2016-06-01	財團法人工業技術研究院	剪切增稠配方、及包含其之複合材料
EP3059739A1 (de) *	2015-02-20	2016-08-24	Wicor Holding AG	Isolationselement mit geringer elektrischer Leitfähigkeit zur elektrischen Isolation im Hochspannungsbereich
GB201813857D0 (en) *	2018-08-24	2018-10-10	Lussey David	Composite Materials
CN113203774A (zh) *	2021-04-28	2021-08-03	北京梦之墨科技有限公司	一种液体传感器及其制作方法、液体传感系统
WO2023209612A1 (en) *	2022-04-27	2023-11-02	3M Innovative Properties Company	Conductive film for attachment to electrical systems

Family Cites Families (8)

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US4098945A (en) *	1973-07-30	1978-07-04	Minnesota Mining And Manufacturing Company	Soft conductive materials
US4367745A (en) *	1980-05-27	1983-01-11	Minnesota Mining And Manufacturing Company	Conformable electrically conductive compositions
US5094769A (en) *	1988-05-13	1992-03-10	International Business Machines Corporation	Compliant thermally conductive compound
US4952293A (en) *	1989-12-29	1990-08-28	Xerox Corporation	Polymer electrodeposition process
US5328756A (en) *	1992-01-31	1994-07-12	Minnesota Mining And Manufacturing Company	Temperature sensitive circuit breaking element
US5330874A (en) *	1992-09-30	1994-07-19	Xerox Corporation	Dry carrier coating and processes
US5378405A (en) *	1993-07-28	1995-01-03	Minnesota Mining And Manufacturing Company	Conductive microparticles and pressure-sensitive adhesive tapes made therefrom
US5484681A (en) *	1994-10-31	1996-01-16	Xerox Corporation	Conductive composite particles and processes for the preparation thereof

1995
- 1995-10-27 US US08/549,539 patent/US5672297A/en not_active Expired - Fee Related
1996
- 1996-10-24 EP EP96936958A patent/EP0914661A1/en not_active Withdrawn
- 1996-10-24 AU AU74743/96A patent/AU713855B2/en not_active Ceased
- 1996-10-24 CA CA002228941A patent/CA2228941A1/en not_active Abandoned
- 1996-10-24 WO PCT/US1996/017112 patent/WO1997015932A1/en not_active Application Discontinuation
1997
- 1997-03-11 TW TW086103007A patent/TW364143B/zh active

Also Published As

Publication number	Publication date
WO1997015932A1 (en)	1997-05-01
AU713855B2 (en)	1999-12-09
CA2228941A1 (en)	1997-05-01
AU7474396A (en)	1997-05-15
EP0914661A4 (zh)	1999-05-12
EP0914661A1 (en)	1999-05-12
US5672297A (en)	1997-09-30

Publication	Publication Date	Title
TW364143B (en)	1999-07-11	Conductive composite articles based on expandable and contractible particulate matrices
DE3477083D1 (en)	1989-04-13	Electrically conductive microballoons and compositions incorporating same
MY111334A (en)	1999-11-30	Process for particle adsorption
CA2183345A1 (en)	1995-10-12	Fabric laminates
EP1792938A3 (en)	2010-09-29	Thermally conductive polyterafluorethylene article
ES8607376A1 (es)	1986-05-16	Un procedimiento para fabricar una composicion detergente organica sintetica, no ionica, con sal mejoradora de la de- tergencia, y en particulas
KR970700202A (ko)	1997-01-08	다공성 입자 응집체 및 이의 제조방법(porous particle aggregate and method therefor)
CA2059398A1 (en)	1992-08-08	Solid phase extraction medium
KR890005188A (ko)	1989-05-13	플라스틱의 정전 코팅용 전도제와 정전 코팅된 플라스틱 성형품
MY106996A (en)	1995-08-30	Semi-conducting static-dissipative polymeric composites
DE69124983D1 (de)	1997-04-10	Formteile aus einer thermoplastischen stärkeschmelze
CA2413146A1 (en)	2002-01-03	Conductive composition for solid polymer type fuel cell separator, solid polymer type fuel cell separator, solid polymer type fuel cell and solid polymer type fuel cell system using the separator
GB1132368A (en)	1968-10-30	Method of coating a metal substrate with polyvinyl chloride
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WO1995035611A3 (en)	1996-01-25	A resource model and architecture for a connection handling system
AU2985195A (en)	1996-02-09	Polymeric film containing silicone resin and clay
MY122068A (en)	2006-03-31	Fine particle size low bulk density thermoplastic polymers
ES2046047T3 (es)	1994-01-16	Productos limpiadores liquidos.
IE821209L (en)	1982-11-21	Aqueous coal suspension
Taylor	1981	Interpretation of the adsorption of viruses by clays from their electrokinetic properties
JPS52145489A (en)	1977-12-03	Suspension polymerization for granular cross-linking polymer having uniform particle size
TW328544B (en)	1998-03-21	Expanded articles of biodegradable plastic material and a process for the preparation thereof
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ASHLEY et al.	1988	Mathematical modelling of transport through conducting polymer films. Part 1: Theoretical consideration(Technical Report, Sep. 1987- Jul. 1988)
Cook et al.	1992	Market Prospects for Nickel Cadmium Batteries in Electric Vehicles