[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

TW288183B - - Google Patents

Info

Publication number
TW288183B
TW288183B TW083108069A TW83108069A TW288183B TW 288183 B TW288183 B TW 288183B TW 083108069 A TW083108069 A TW 083108069A TW 83108069 A TW83108069 A TW 83108069A TW 288183 B TW288183 B TW 288183B
Authority
TW
Taiwan
Application number
TW083108069A
Original Assignee
Shellcase Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shellcase Ltd filed Critical Shellcase Ltd
Application granted granted Critical
Publication of TW288183B publication Critical patent/TW288183B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/24Curved surfaces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70241Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70275Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/703Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/7035Proximity or contact printers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/942Masking
    • Y10S438/944Shadow

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW083108069A 1993-09-02 1994-09-02 TW288183B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL106892A IL106892A0 (en) 1993-09-02 1993-09-02 Methods and apparatus for producing integrated circuit devices

Publications (1)

Publication Number Publication Date
TW288183B true TW288183B (zh) 1996-10-11

Family

ID=11065234

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083108069A TW288183B (zh) 1993-09-02 1994-09-02

Country Status (8)

Country Link
US (1) US5716759A (zh)
JP (1) JPH09507607A (zh)
AU (1) AU7537694A (zh)
IL (1) IL106892A0 (zh)
SV (1) SV1994000042A (zh)
TW (1) TW288183B (zh)
WO (1) WO1995006899A1 (zh)
ZA (1) ZA946593B (zh)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0171984B1 (ko) * 1995-12-11 1999-03-30 김주용 박막 트랜지스터의 자기 정렬 노광 방법
JP4000609B2 (ja) * 1995-12-22 2007-10-31 イビデン株式会社 電子部品搭載用基板及びその製造方法
IL123207A0 (en) * 1998-02-06 1998-09-24 Shellcase Ltd Integrated circuit device
EP1095310A4 (en) * 1998-07-10 2004-10-20 Ball Semiconductor Inc REFLECTION SYSTEM FOR IMAGE FORMATION ON NON-PLANAR SUBSTRATE
IL133453A0 (en) * 1999-12-10 2001-04-30 Shellcase Ltd Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
US20060146172A1 (en) * 2002-03-18 2006-07-06 Jacobsen Stephen C Miniaturized utility device having integrated optical capabilities
US7591780B2 (en) * 2002-03-18 2009-09-22 Sterling Lc Miniaturized imaging device with integrated circuit connector system
US8614768B2 (en) * 2002-03-18 2013-12-24 Raytheon Company Miniaturized imaging device including GRIN lens optically coupled to SSID
US7787939B2 (en) * 2002-03-18 2010-08-31 Sterling Lc Miniaturized imaging device including utility aperture and SSID
JP2005523466A (ja) * 2002-04-16 2005-08-04 エクスルーム フォトニクス リミテッド 集積コネクタを有する電気光学回路およびその製造方法
US20040021214A1 (en) * 2002-04-16 2004-02-05 Avner Badehi Electro-optic integrated circuits with connectors and methods for the production thereof
US6908791B2 (en) * 2002-04-29 2005-06-21 Texas Instruments Incorporated MEMS device wafer-level package
WO2003100829A2 (en) * 2002-05-20 2003-12-04 Imagerlabs Forming a multi segment integrated circuit with isolated substrates
US7033664B2 (en) 2002-10-22 2006-04-25 Tessera Technologies Hungary Kft Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
JP4093018B2 (ja) * 2002-11-08 2008-05-28 沖電気工業株式会社 半導体装置及びその製造方法
JP2004165191A (ja) * 2002-11-08 2004-06-10 Oki Electric Ind Co Ltd 半導体装置、半導体装置の製造方法及びカメラシステム
US6943423B2 (en) * 2003-10-01 2005-09-13 Optopac, Inc. Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
US6864116B1 (en) * 2003-10-01 2005-03-08 Optopac, Inc. Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof
US7538358B2 (en) 2003-10-15 2009-05-26 Xloom Communications, Ltd. Electro-optical circuitry having integrated connector and methods for the production thereof
US7122874B2 (en) * 2004-04-12 2006-10-17 Optopac, Inc. Electronic package having a sealing structure on predetermined area, and the method thereof
US6943424B1 (en) 2004-05-06 2005-09-13 Optopac, Inc. Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof
US20060043513A1 (en) * 2004-09-02 2006-03-02 Deok-Hoon Kim Method of making camera module in wafer level
KR100498708B1 (ko) * 2004-11-08 2005-07-01 옵토팩 주식회사 반도체 소자용 전자패키지 및 그 패키징 방법
US7566853B2 (en) * 2005-08-12 2009-07-28 Tessera, Inc. Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture
KR100823179B1 (ko) * 2006-06-21 2008-04-18 오에프티 주식회사 기판 엣지 노광 장치
US7361989B1 (en) 2006-09-26 2008-04-22 International Business Machines Corporation Stacked imager package
US7829438B2 (en) 2006-10-10 2010-11-09 Tessera, Inc. Edge connect wafer level stacking
US7901989B2 (en) * 2006-10-10 2011-03-08 Tessera, Inc. Reconstituted wafer level stacking
US8513789B2 (en) * 2006-10-10 2013-08-20 Tessera, Inc. Edge connect wafer level stacking with leads extending along edges
US7759166B2 (en) * 2006-10-17 2010-07-20 Tessera, Inc. Microelectronic packages fabricated at the wafer level and methods therefor
US7807508B2 (en) * 2006-10-31 2010-10-05 Tessera Technologies Hungary Kft. Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
US7935568B2 (en) * 2006-10-31 2011-05-03 Tessera Technologies Ireland Limited Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
US7952195B2 (en) * 2006-12-28 2011-05-31 Tessera, Inc. Stacked packages with bridging traces
EP2135280A2 (en) 2007-03-05 2009-12-23 Tessera, Inc. Chips having rear contacts connected by through vias to front contacts
KR100847520B1 (ko) 2007-03-19 2008-07-22 오에프티 주식회사 기판의 엣지노광장치
TW200842998A (en) * 2007-04-18 2008-11-01 Siliconware Precision Industries Co Ltd Semiconductor device and manufacturing method thereof
TWI331371B (en) * 2007-04-19 2010-10-01 Siliconware Precision Industries Co Ltd Semiconductor device and manufacturing method thereof
US7777172B2 (en) * 2007-06-01 2010-08-17 Fairchild Semiconductor Corporation Methods for reducing cross talk in optical sensors
US7835074B2 (en) * 2007-06-05 2010-11-16 Sterling Lc Mini-scope for multi-directional imaging
WO2008157722A1 (en) * 2007-06-19 2008-12-24 Vertical Circuits, Inc. Wafer level surface passivation of stackable integrated circuit chips
TW200917391A (en) * 2007-06-20 2009-04-16 Vertical Circuits Inc Three-dimensional circuitry formed on integrated circuit device using two-dimensional fabrication
CN101809739B (zh) * 2007-07-27 2014-08-20 泰塞拉公司 具有后应用的衬垫延长部分的重构晶片堆封装
EP2186131A2 (en) 2007-08-03 2010-05-19 Tessera Technologies Hungary Kft. Stack packages using reconstituted wafers
US8043895B2 (en) 2007-08-09 2011-10-25 Tessera, Inc. Method of fabricating stacked assembly including plurality of stacked microelectronic elements
US8704379B2 (en) 2007-09-10 2014-04-22 Invensas Corporation Semiconductor die mount by conformal die coating
US20090093137A1 (en) * 2007-10-08 2009-04-09 Xloom Communications, (Israel) Ltd. Optical communications module
US7969659B2 (en) * 2008-01-11 2011-06-28 Sterling Lc Grin lens microscope system
US20100053407A1 (en) 2008-02-26 2010-03-04 Tessera, Inc. Wafer level compliant packages for rear-face illuminated solid state image sensors
TWI515863B (zh) 2008-03-12 2016-01-01 英維瑟斯公司 載體安裝式電氣互連晶粒組成件
US20090287048A1 (en) * 2008-05-16 2009-11-19 Sterling Lc Method and apparatus for imaging within a living body
US9153517B2 (en) 2008-05-20 2015-10-06 Invensas Corporation Electrical connector between die pad and z-interconnect for stacked die assemblies
US7863159B2 (en) * 2008-06-19 2011-01-04 Vertical Circuits, Inc. Semiconductor die separation method
WO2009154761A1 (en) * 2008-06-16 2009-12-23 Tessera Research Llc Stacking of wafer-level chip scale packages having edge contacts
CN102137616B (zh) 2008-06-18 2014-09-10 雷神公司 确定焦距的透明内窥镜头
WO2010014792A2 (en) * 2008-07-30 2010-02-04 Sterling Lc Method and device for incremental wavelength variation to analyze tissue
US9060704B2 (en) 2008-11-04 2015-06-23 Sarcos Lc Method and device for wavelength shifted imaging
TWI446498B (zh) * 2009-03-13 2014-07-21 Tessera Inc 具有延伸穿越銲墊之通孔的堆疊微電子總成
US9661996B2 (en) 2009-10-01 2017-05-30 Sarcos Lc Needle delivered imaging device
WO2011041720A2 (en) 2009-10-01 2011-04-07 Jacobsen Stephen C Method and apparatus for manipulating movement of a micro-catheter
WO2011041730A2 (en) 2009-10-01 2011-04-07 Jacobsen Stephen C Light diffusion apparatus
US9147583B2 (en) 2009-10-27 2015-09-29 Invensas Corporation Selective die electrical insulation by additive process
US8828028B2 (en) 2009-11-03 2014-09-09 Raytheon Company Suture device and method for closing a planar opening
US20110221053A1 (en) * 2010-03-11 2011-09-15 Qualcomm Incorporated Pre-processing to reduce wafer level warpage
JP6529812B2 (ja) * 2015-04-22 2019-06-12 株式会社サーマプレシジョン 露光装置
JP6496600B2 (ja) * 2015-04-22 2019-04-03 株式会社サーマプレシジョン 露光装置
US9871019B2 (en) 2015-07-17 2018-01-16 Invensas Corporation Flipped die stack assemblies with leadframe interconnects
US9490195B1 (en) 2015-07-17 2016-11-08 Invensas Corporation Wafer-level flipped die stacks with leadframes or metal foil interconnects
US9825002B2 (en) 2015-07-17 2017-11-21 Invensas Corporation Flipped die stack
US9508691B1 (en) 2015-12-16 2016-11-29 Invensas Corporation Flipped die stacks with multiple rows of leadframe interconnects
US10566310B2 (en) 2016-04-11 2020-02-18 Invensas Corporation Microelectronic packages having stacked die and wire bond interconnects
US9595511B1 (en) 2016-05-12 2017-03-14 Invensas Corporation Microelectronic packages and assemblies with improved flyby signaling operation
US9728524B1 (en) 2016-06-30 2017-08-08 Invensas Corporation Enhanced density assembly having microelectronic packages mounted at substantial angle to board

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1658509A (en) * 1925-10-07 1928-02-07 Wadsworth Watch Case Co Surface-ornamenting process and apparatus
US2507956A (en) * 1947-11-01 1950-05-16 Lithographic Technical Foundat Process of coating aluminum
NL174337B (nl) * 1952-04-03 Corning Glass Works Inrichting voor het opwikkelen van een continue vezel, in het bijzonder glasvezel, op spoelen.
US2796370A (en) * 1955-03-04 1957-06-18 Charles W Ostrander Composition and method for producing corrosion resistant protective coating on aluminum and aluminum alloys
DE1591105A1 (de) * 1967-12-06 1970-09-24 Itt Ind Gmbh Deutsche Verfahren zum Herstellen von Festkoerperschaltungen
US3623961A (en) * 1968-01-12 1971-11-30 Philips Corp Method of providing an electric connection to a surface of an electronic device and device obtained by said method
US3644801A (en) * 1971-01-21 1972-02-22 Gary S Sheldon Semiconductor passivating process and product
US3719981A (en) * 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
DE2341154C2 (de) * 1973-08-14 1975-06-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zur Herstellung einer Zweiphasen-Ladungsverschiebeanordnung
DE2851101C2 (de) * 1978-11-25 1980-09-18 Ulrich 7110 Oehringen Wagner Verfahren zum Gravieren von Werkstückflachen durch Ätzen
JPS5784135A (en) * 1980-11-14 1982-05-26 Toshiba Corp Manufacture of semiconductor element
JPS5895862A (ja) * 1981-11-30 1983-06-07 Mitsubishi Electric Corp 積層構造半導体装置
DE3381187D1 (de) * 1983-11-07 1990-03-08 Irvine Sensors Corp Detektoranordnungsstruktur und -herstellung.
GB8519373D0 (en) * 1985-08-01 1985-09-04 Unilever Plc Encapsulation of fet transducers
IT1186165B (it) * 1985-12-20 1987-11-18 Sgs Microelettronica Spa Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione
US4900695A (en) * 1986-12-17 1990-02-13 Hitachi, Ltd. Semiconductor integrated circuit device and process for producing the same
US5171716A (en) * 1986-12-19 1992-12-15 North American Philips Corp. Method of manufacturing semiconductor device with reduced packaging stress
US4862249A (en) * 1987-04-17 1989-08-29 Xoc Devices, Inc. Packaging system for stacking integrated circuits
JPH0193149A (ja) * 1987-10-02 1989-04-12 Mitsubishi Electric Corp 半導体装置
US4794092A (en) * 1987-11-18 1988-12-27 Grumman Aerospace Corporation Single wafer moated process
US4904610A (en) * 1988-01-27 1990-02-27 General Instrument Corporation Wafer level process for fabricating passivated semiconductor devices
US4784721A (en) * 1988-02-22 1988-11-15 Honeywell Inc. Integrated thin-film diaphragm; backside etch
JPH0217644A (ja) * 1988-07-06 1990-01-22 Hitachi Ltd 集積回路
US4933898A (en) * 1989-01-12 1990-06-12 General Instrument Corporation Secure integrated circuit chip with conductive shield
JP2829015B2 (ja) * 1989-01-19 1998-11-25 株式会社東芝 半導体素子の加工方法
US4984358A (en) * 1989-03-10 1991-01-15 Microelectronics And Computer Technology Corporation Method of assembling stacks of integrated circuit dies
US5135890A (en) * 1989-06-16 1992-08-04 General Electric Company Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip
US5104820A (en) * 1989-07-07 1992-04-14 Irvine Sensors Corporation Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting
US4992908A (en) * 1989-07-24 1991-02-12 Grumman Aerospace Corporation Integrated circuit module
JP2768988B2 (ja) * 1989-08-17 1998-06-25 三菱電機株式会社 端面部分コーティング方法
US5043251A (en) * 1989-11-29 1991-08-27 The United States Of America As Represented By The Secretary Of The Navy Process of three dimensional lithography in amorphous polymers
US5147815A (en) * 1990-05-14 1992-09-15 Motorola, Inc. Method for fabricating a multichip semiconductor device having two interdigitated leadframes
JPH07120646B2 (ja) * 1990-05-16 1995-12-20 株式会社東芝 メサ型半導体ペレットの製造方法
US5140469A (en) * 1990-10-03 1992-08-18 Raytheon Company Illumination apparatus for semiconductor fabrication including conical optical means
US5126286A (en) * 1990-10-05 1992-06-30 Micron Technology, Inc. Method of manufacturing edge connected semiconductor die
FR2670323B1 (fr) * 1990-12-11 1997-12-12 Thomson Csf Procede et dispositif d'interconnexion de circuits integres en trois dimensions.
US5270485A (en) * 1991-01-28 1993-12-14 Sarcos Group High density, three-dimensional, intercoupled circuit structure
US5269882A (en) * 1991-01-28 1993-12-14 Sarcos Group Method and apparatus for fabrication of thin film semiconductor devices using non-planar, exposure beam lithography
US5106455A (en) * 1991-01-28 1992-04-21 Sarcos Group Method and apparatus for fabrication of micro-structures using non-planar, exposure beam lithography
JP2769748B2 (ja) * 1991-05-13 1998-06-25 株式会社オーク製作所 画像形成用露光装置
JPH04346231A (ja) * 1991-05-23 1992-12-02 Canon Inc 半導体装置の製造方法
US5292686A (en) * 1991-08-21 1994-03-08 Triquint Semiconductor, Inc. Method of forming substrate vias in a GaAs wafer
JP2967621B2 (ja) * 1991-08-27 1999-10-25 日本電気株式会社 半導体装置用パッケージの製造方法
JP2769753B2 (ja) * 1991-08-28 1998-06-25 株式会社オーク製作所 画像形成用露光装置
US5266833A (en) * 1992-03-30 1993-11-30 Capps David F Integrated circuit bus structure
FR2691836B1 (fr) * 1992-05-27 1997-04-30 Ela Medical Sa Procede de fabrication d'un dispositif a semi-conducteurs comportant au moins une puce et dispositif correspondant.
DK0660967T3 (da) * 1992-09-14 2001-08-13 Shellcase Ltd Fremgangsmåde til fremstilling af integrerede kredsløbsanordninger
US5376235A (en) * 1993-07-15 1994-12-27 Micron Semiconductor, Inc. Method to eliminate corrosion in conductive elements

Also Published As

Publication number Publication date
SV1994000042A (es) 1996-10-16
US5716759A (en) 1998-02-10
IL106892A0 (en) 1993-12-28
AU7537694A (en) 1995-03-22
WO1995006899A1 (en) 1995-03-09
JPH09507607A (ja) 1997-07-29
ZA946593B (en) 1995-04-03

Similar Documents

Publication Publication Date Title
FR2706990B1 (zh)
FR10C0012I1 (zh)
FR2703510B1 (zh)
FR2702922B1 (zh)
FR2713975B1 (zh)
FR2706815B1 (zh)
FR2706719B1 (zh)
FR2706915B1 (zh)
FR2706788B1 (zh)
FR2711822B1 (zh)
FR2706969B1 (zh)
FR2706791B1 (zh)
FR2710349B1 (zh)
FR2706845B1 (zh)
FR2706827B1 (zh)
FR2706898B1 (zh)
FR2713740B1 (zh)
FR2706977B1 (zh)
FR2719793B1 (zh)
FR2706837B1 (zh)
FR2707067B1 (zh)
FR2706823B1 (zh)
FR2707053B1 (zh)
FR2706932B1 (zh)
IN174538B (zh)