IL106892A0 - Methods and apparatus for producing integrated circuit devices - Google Patents
Methods and apparatus for producing integrated circuit devicesInfo
- Publication number
- IL106892A0 IL106892A0 IL106892A IL10689293A IL106892A0 IL 106892 A0 IL106892 A0 IL 106892A0 IL 106892 A IL106892 A IL 106892A IL 10689293 A IL10689293 A IL 10689293A IL 106892 A0 IL106892 A0 IL 106892A0
- Authority
- IL
- Israel
- Prior art keywords
- methods
- integrated circuit
- circuit devices
- producing integrated
- producing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/703—Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/7035—Proximity or contact printers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/944—Shadow
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL106892A IL106892A0 (en) | 1993-09-02 | 1993-09-02 | Methods and apparatus for producing integrated circuit devices |
ZA946593A ZA946593B (en) | 1993-09-02 | 1994-08-30 | Methods and apparatus for producing integrated circuit devices |
PCT/EP1994/002908 WO1995006899A1 (en) | 1993-09-02 | 1994-09-01 | Method and apparatus for producing integrated circuit devices |
US08/602,853 US5716759A (en) | 1993-09-02 | 1994-09-01 | Method and apparatus for producing integrated circuit devices |
AU75376/94A AU7537694A (en) | 1993-09-02 | 1994-09-01 | Method and apparatus for producing integrated circuit devices |
JP7507954A JPH09507607A (ja) | 1993-09-02 | 1994-09-01 | 集積回路デバイスの製造方法及び製造装置 |
TW083108069A TW288183B (zh) | 1993-09-02 | 1994-09-02 | |
SV1994000042A SV1994000042A (es) | 1993-09-02 | 1994-09-02 | Metodos y aparatos para producir dispositivos de circuitos integrados |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IL106892A IL106892A0 (en) | 1993-09-02 | 1993-09-02 | Methods and apparatus for producing integrated circuit devices |
Publications (1)
Publication Number | Publication Date |
---|---|
IL106892A0 true IL106892A0 (en) | 1993-12-28 |
Family
ID=11065234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL106892A IL106892A0 (en) | 1993-09-02 | 1993-09-02 | Methods and apparatus for producing integrated circuit devices |
Country Status (8)
Country | Link |
---|---|
US (1) | US5716759A (zh) |
JP (1) | JPH09507607A (zh) |
AU (1) | AU7537694A (zh) |
IL (1) | IL106892A0 (zh) |
SV (1) | SV1994000042A (zh) |
TW (1) | TW288183B (zh) |
WO (1) | WO1995006899A1 (zh) |
ZA (1) | ZA946593B (zh) |
Families Citing this family (72)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0171984B1 (ko) * | 1995-12-11 | 1999-03-30 | 김주용 | 박막 트랜지스터의 자기 정렬 노광 방법 |
JP4000609B2 (ja) * | 1995-12-22 | 2007-10-31 | イビデン株式会社 | 電子部品搭載用基板及びその製造方法 |
IL123207A0 (en) | 1998-02-06 | 1998-09-24 | Shellcase Ltd | Integrated circuit device |
WO2000003296A1 (en) * | 1998-07-10 | 2000-01-20 | Ball Semiconductor, Inc. | A reflection system for imaging on a nonplanar substrate |
IL133453A0 (en) * | 1999-12-10 | 2001-04-30 | Shellcase Ltd | Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
US7787939B2 (en) * | 2002-03-18 | 2010-08-31 | Sterling Lc | Miniaturized imaging device including utility aperture and SSID |
US8614768B2 (en) * | 2002-03-18 | 2013-12-24 | Raytheon Company | Miniaturized imaging device including GRIN lens optically coupled to SSID |
US20060146172A1 (en) * | 2002-03-18 | 2006-07-06 | Jacobsen Stephen C | Miniaturized utility device having integrated optical capabilities |
US7591780B2 (en) * | 2002-03-18 | 2009-09-22 | Sterling Lc | Miniaturized imaging device with integrated circuit connector system |
EP1502135A2 (en) * | 2002-04-16 | 2005-02-02 | Xloom Photonics Ltd. | Electro-optical circuitry having integrated connector and methods for the production thereof |
US20040021214A1 (en) * | 2002-04-16 | 2004-02-05 | Avner Badehi | Electro-optic integrated circuits with connectors and methods for the production thereof |
US6908791B2 (en) * | 2002-04-29 | 2005-06-21 | Texas Instruments Incorporated | MEMS device wafer-level package |
DE60335554D1 (de) * | 2002-05-20 | 2011-02-10 | Imagerlabs Inc | Bilden einer integrierten mehrsegmentschaltung mit isolierten substraten |
US7033664B2 (en) | 2002-10-22 | 2006-04-25 | Tessera Technologies Hungary Kft | Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
JP2004165191A (ja) * | 2002-11-08 | 2004-06-10 | Oki Electric Ind Co Ltd | 半導体装置、半導体装置の製造方法及びカメラシステム |
JP4093018B2 (ja) * | 2002-11-08 | 2008-05-28 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
US6943423B2 (en) * | 2003-10-01 | 2005-09-13 | Optopac, Inc. | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
US6864116B1 (en) | 2003-10-01 | 2005-03-08 | Optopac, Inc. | Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof |
EP1676160A4 (en) * | 2003-10-15 | 2008-04-09 | Xloom Photonics Ltd | ELECTRO-OPTICAL CIRCUITRY HAVING AN INTEGRATED CONNECTOR AND METHODS OF PRODUCING THE SAME |
US7122874B2 (en) * | 2004-04-12 | 2006-10-17 | Optopac, Inc. | Electronic package having a sealing structure on predetermined area, and the method thereof |
US6943424B1 (en) | 2004-05-06 | 2005-09-13 | Optopac, Inc. | Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof |
US20060043513A1 (en) * | 2004-09-02 | 2006-03-02 | Deok-Hoon Kim | Method of making camera module in wafer level |
KR100498708B1 (ko) * | 2004-11-08 | 2005-07-01 | 옵토팩 주식회사 | 반도체 소자용 전자패키지 및 그 패키징 방법 |
US7566853B2 (en) * | 2005-08-12 | 2009-07-28 | Tessera, Inc. | Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture |
KR100823179B1 (ko) * | 2006-06-21 | 2008-04-18 | 오에프티 주식회사 | 기판 엣지 노광 장치 |
US7361989B1 (en) * | 2006-09-26 | 2008-04-22 | International Business Machines Corporation | Stacked imager package |
US7901989B2 (en) * | 2006-10-10 | 2011-03-08 | Tessera, Inc. | Reconstituted wafer level stacking |
US8513789B2 (en) * | 2006-10-10 | 2013-08-20 | Tessera, Inc. | Edge connect wafer level stacking with leads extending along edges |
US7829438B2 (en) | 2006-10-10 | 2010-11-09 | Tessera, Inc. | Edge connect wafer level stacking |
US7759166B2 (en) * | 2006-10-17 | 2010-07-20 | Tessera, Inc. | Microelectronic packages fabricated at the wafer level and methods therefor |
US7935568B2 (en) * | 2006-10-31 | 2011-05-03 | Tessera Technologies Ireland Limited | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating |
US7807508B2 (en) * | 2006-10-31 | 2010-10-05 | Tessera Technologies Hungary Kft. | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating |
US7952195B2 (en) * | 2006-12-28 | 2011-05-31 | Tessera, Inc. | Stacked packages with bridging traces |
KR101460141B1 (ko) | 2007-03-05 | 2014-12-02 | 인벤사스 코포레이션 | 관통 비아에 의해 전면 컨택트에 연결되는 배면 컨택트를 갖는 칩 |
KR100847520B1 (ko) | 2007-03-19 | 2008-07-22 | 오에프티 주식회사 | 기판의 엣지노광장치 |
TW200842998A (en) * | 2007-04-18 | 2008-11-01 | Siliconware Precision Industries Co Ltd | Semiconductor device and manufacturing method thereof |
TWI331371B (en) * | 2007-04-19 | 2010-10-01 | Siliconware Precision Industries Co Ltd | Semiconductor device and manufacturing method thereof |
US7777172B2 (en) * | 2007-06-01 | 2010-08-17 | Fairchild Semiconductor Corporation | Methods for reducing cross talk in optical sensors |
US7835074B2 (en) | 2007-06-05 | 2010-11-16 | Sterling Lc | Mini-scope for multi-directional imaging |
WO2008157722A1 (en) * | 2007-06-19 | 2008-12-24 | Vertical Circuits, Inc. | Wafer level surface passivation of stackable integrated circuit chips |
WO2008157779A2 (en) * | 2007-06-20 | 2008-12-24 | Vertical Circuits, Inc. | Three-dimensional circuitry formed on integrated circuit device using two- dimensional fabrication |
EP2186134A2 (en) | 2007-07-27 | 2010-05-19 | Tessera, Inc. | Reconstituted wafer stack packaging with after-applied pad extensions |
CN101861646B (zh) | 2007-08-03 | 2015-03-18 | 泰塞拉公司 | 利用再生晶圆的堆叠封装 |
US8043895B2 (en) * | 2007-08-09 | 2011-10-25 | Tessera, Inc. | Method of fabricating stacked assembly including plurality of stacked microelectronic elements |
US8704379B2 (en) | 2007-09-10 | 2014-04-22 | Invensas Corporation | Semiconductor die mount by conformal die coating |
US20090093137A1 (en) * | 2007-10-08 | 2009-04-09 | Xloom Communications, (Israel) Ltd. | Optical communications module |
US7969659B2 (en) * | 2008-01-11 | 2011-06-28 | Sterling Lc | Grin lens microscope system |
US20100053407A1 (en) | 2008-02-26 | 2010-03-04 | Tessera, Inc. | Wafer level compliant packages for rear-face illuminated solid state image sensors |
KR101554761B1 (ko) | 2008-03-12 | 2015-09-21 | 인벤사스 코포레이션 | 지지부에 실장되는 전기적으로 인터커넥트된 다이 조립체 |
US20090287048A1 (en) * | 2008-05-16 | 2009-11-19 | Sterling Lc | Method and apparatus for imaging within a living body |
US7863159B2 (en) * | 2008-06-19 | 2011-01-04 | Vertical Circuits, Inc. | Semiconductor die separation method |
US9153517B2 (en) | 2008-05-20 | 2015-10-06 | Invensas Corporation | Electrical connector between die pad and z-interconnect for stacked die assemblies |
WO2009154761A1 (en) * | 2008-06-16 | 2009-12-23 | Tessera Research Llc | Stacking of wafer-level chip scale packages having edge contacts |
CN102137616B (zh) | 2008-06-18 | 2014-09-10 | 雷神公司 | 确定焦距的透明内窥镜头 |
US8486735B2 (en) * | 2008-07-30 | 2013-07-16 | Raytheon Company | Method and device for incremental wavelength variation to analyze tissue |
WO2010053916A2 (en) | 2008-11-04 | 2010-05-14 | Sterling Lc | Method and device for wavelength shifted imaging |
US8466542B2 (en) * | 2009-03-13 | 2013-06-18 | Tessera, Inc. | Stacked microelectronic assemblies having vias extending through bond pads |
US9661996B2 (en) | 2009-10-01 | 2017-05-30 | Sarcos Lc | Needle delivered imaging device |
US9144664B2 (en) | 2009-10-01 | 2015-09-29 | Sarcos Lc | Method and apparatus for manipulating movement of a micro-catheter |
US8717428B2 (en) | 2009-10-01 | 2014-05-06 | Raytheon Company | Light diffusion apparatus |
US9147583B2 (en) | 2009-10-27 | 2015-09-29 | Invensas Corporation | Selective die electrical insulation by additive process |
US8828028B2 (en) | 2009-11-03 | 2014-09-09 | Raytheon Company | Suture device and method for closing a planar opening |
US20110221053A1 (en) * | 2010-03-11 | 2011-09-15 | Qualcomm Incorporated | Pre-processing to reduce wafer level warpage |
JP6529812B2 (ja) * | 2015-04-22 | 2019-06-12 | 株式会社サーマプレシジョン | 露光装置 |
JP6496600B2 (ja) * | 2015-04-22 | 2019-04-03 | 株式会社サーマプレシジョン | 露光装置 |
US9871019B2 (en) | 2015-07-17 | 2018-01-16 | Invensas Corporation | Flipped die stack assemblies with leadframe interconnects |
US9825002B2 (en) | 2015-07-17 | 2017-11-21 | Invensas Corporation | Flipped die stack |
US9490195B1 (en) | 2015-07-17 | 2016-11-08 | Invensas Corporation | Wafer-level flipped die stacks with leadframes or metal foil interconnects |
US9508691B1 (en) | 2015-12-16 | 2016-11-29 | Invensas Corporation | Flipped die stacks with multiple rows of leadframe interconnects |
US10566310B2 (en) | 2016-04-11 | 2020-02-18 | Invensas Corporation | Microelectronic packages having stacked die and wire bond interconnects |
US9595511B1 (en) | 2016-05-12 | 2017-03-14 | Invensas Corporation | Microelectronic packages and assemblies with improved flyby signaling operation |
US9728524B1 (en) | 2016-06-30 | 2017-08-08 | Invensas Corporation | Enhanced density assembly having microelectronic packages mounted at substantial angle to board |
Family Cites Families (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1658509A (en) * | 1925-10-07 | 1928-02-07 | Wadsworth Watch Case Co | Surface-ornamenting process and apparatus |
US2507956A (en) * | 1947-11-01 | 1950-05-16 | Lithographic Technical Foundat | Process of coating aluminum |
BE516894A (zh) * | 1952-04-03 | |||
US2796370A (en) * | 1955-03-04 | 1957-06-18 | Charles W Ostrander | Composition and method for producing corrosion resistant protective coating on aluminum and aluminum alloys |
DE1591105A1 (de) * | 1967-12-06 | 1970-09-24 | Itt Ind Gmbh Deutsche | Verfahren zum Herstellen von Festkoerperschaltungen |
US3623961A (en) * | 1968-01-12 | 1971-11-30 | Philips Corp | Method of providing an electric connection to a surface of an electronic device and device obtained by said method |
US3644801A (en) * | 1971-01-21 | 1972-02-22 | Gary S Sheldon | Semiconductor passivating process and product |
US3719981A (en) * | 1971-11-24 | 1973-03-13 | Rca Corp | Method of joining solder balls to solder bumps |
DE2341154C2 (de) * | 1973-08-14 | 1975-06-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung einer Zweiphasen-Ladungsverschiebeanordnung |
DE2851101C2 (de) * | 1978-11-25 | 1980-09-18 | Ulrich 7110 Oehringen Wagner | Verfahren zum Gravieren von Werkstückflachen durch Ätzen |
JPS5784135A (en) * | 1980-11-14 | 1982-05-26 | Toshiba Corp | Manufacture of semiconductor element |
JPS5895862A (ja) * | 1981-11-30 | 1983-06-07 | Mitsubishi Electric Corp | 積層構造半導体装置 |
WO1985002283A1 (en) * | 1983-11-07 | 1985-05-23 | Irvine Sensors Corporation | Detector array module-structure and fabrication |
GB8519373D0 (en) * | 1985-08-01 | 1985-09-04 | Unilever Plc | Encapsulation of fet transducers |
IT1186165B (it) * | 1985-12-20 | 1987-11-18 | Sgs Microelettronica Spa | Dispositivo a semiconduttore di tipo eprom cancellabile con raggi ultravioletti e suo processo di fabbricazione |
US4900695A (en) * | 1986-12-17 | 1990-02-13 | Hitachi, Ltd. | Semiconductor integrated circuit device and process for producing the same |
US5171716A (en) * | 1986-12-19 | 1992-12-15 | North American Philips Corp. | Method of manufacturing semiconductor device with reduced packaging stress |
US4862249A (en) * | 1987-04-17 | 1989-08-29 | Xoc Devices, Inc. | Packaging system for stacking integrated circuits |
JPH0193149A (ja) * | 1987-10-02 | 1989-04-12 | Mitsubishi Electric Corp | 半導体装置 |
US4794092A (en) * | 1987-11-18 | 1988-12-27 | Grumman Aerospace Corporation | Single wafer moated process |
US4904610A (en) * | 1988-01-27 | 1990-02-27 | General Instrument Corporation | Wafer level process for fabricating passivated semiconductor devices |
US4784721A (en) * | 1988-02-22 | 1988-11-15 | Honeywell Inc. | Integrated thin-film diaphragm; backside etch |
JPH0217644A (ja) * | 1988-07-06 | 1990-01-22 | Hitachi Ltd | 集積回路 |
US4933898A (en) * | 1989-01-12 | 1990-06-12 | General Instrument Corporation | Secure integrated circuit chip with conductive shield |
JP2829015B2 (ja) * | 1989-01-19 | 1998-11-25 | 株式会社東芝 | 半導体素子の加工方法 |
US4984358A (en) * | 1989-03-10 | 1991-01-15 | Microelectronics And Computer Technology Corporation | Method of assembling stacks of integrated circuit dies |
US5135890A (en) * | 1989-06-16 | 1992-08-04 | General Electric Company | Method of forming a hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip |
US5104820A (en) * | 1989-07-07 | 1992-04-14 | Irvine Sensors Corporation | Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting |
US4992908A (en) * | 1989-07-24 | 1991-02-12 | Grumman Aerospace Corporation | Integrated circuit module |
JP2768988B2 (ja) * | 1989-08-17 | 1998-06-25 | 三菱電機株式会社 | 端面部分コーティング方法 |
US5043251A (en) * | 1989-11-29 | 1991-08-27 | The United States Of America As Represented By The Secretary Of The Navy | Process of three dimensional lithography in amorphous polymers |
US5147815A (en) * | 1990-05-14 | 1992-09-15 | Motorola, Inc. | Method for fabricating a multichip semiconductor device having two interdigitated leadframes |
JPH07120646B2 (ja) * | 1990-05-16 | 1995-12-20 | 株式会社東芝 | メサ型半導体ペレットの製造方法 |
US5140469A (en) * | 1990-10-03 | 1992-08-18 | Raytheon Company | Illumination apparatus for semiconductor fabrication including conical optical means |
US5126286A (en) * | 1990-10-05 | 1992-06-30 | Micron Technology, Inc. | Method of manufacturing edge connected semiconductor die |
FR2670323B1 (fr) * | 1990-12-11 | 1997-12-12 | Thomson Csf | Procede et dispositif d'interconnexion de circuits integres en trois dimensions. |
US5106455A (en) * | 1991-01-28 | 1992-04-21 | Sarcos Group | Method and apparatus for fabrication of micro-structures using non-planar, exposure beam lithography |
US5269882A (en) * | 1991-01-28 | 1993-12-14 | Sarcos Group | Method and apparatus for fabrication of thin film semiconductor devices using non-planar, exposure beam lithography |
US5270485A (en) * | 1991-01-28 | 1993-12-14 | Sarcos Group | High density, three-dimensional, intercoupled circuit structure |
JP2769748B2 (ja) * | 1991-05-13 | 1998-06-25 | 株式会社オーク製作所 | 画像形成用露光装置 |
JPH04346231A (ja) * | 1991-05-23 | 1992-12-02 | Canon Inc | 半導体装置の製造方法 |
US5292686A (en) * | 1991-08-21 | 1994-03-08 | Triquint Semiconductor, Inc. | Method of forming substrate vias in a GaAs wafer |
JP2967621B2 (ja) * | 1991-08-27 | 1999-10-25 | 日本電気株式会社 | 半導体装置用パッケージの製造方法 |
JP2769753B2 (ja) * | 1991-08-28 | 1998-06-25 | 株式会社オーク製作所 | 画像形成用露光装置 |
US5266833A (en) * | 1992-03-30 | 1993-11-30 | Capps David F | Integrated circuit bus structure |
FR2691836B1 (fr) * | 1992-05-27 | 1997-04-30 | Ela Medical Sa | Procede de fabrication d'un dispositif a semi-conducteurs comportant au moins une puce et dispositif correspondant. |
CA2144323C (en) * | 1992-09-14 | 2005-06-28 | Pierre Badehi | Methods and apparatus for producing integrated circuit devices |
US5376235A (en) * | 1993-07-15 | 1994-12-27 | Micron Semiconductor, Inc. | Method to eliminate corrosion in conductive elements |
-
1993
- 1993-09-02 IL IL106892A patent/IL106892A0/xx unknown
-
1994
- 1994-08-30 ZA ZA946593A patent/ZA946593B/xx unknown
- 1994-09-01 JP JP7507954A patent/JPH09507607A/ja active Pending
- 1994-09-01 AU AU75376/94A patent/AU7537694A/en not_active Abandoned
- 1994-09-01 US US08/602,853 patent/US5716759A/en not_active Expired - Lifetime
- 1994-09-01 WO PCT/EP1994/002908 patent/WO1995006899A1/en active Application Filing
- 1994-09-02 SV SV1994000042A patent/SV1994000042A/es not_active Application Discontinuation
- 1994-09-02 TW TW083108069A patent/TW288183B/zh active
Also Published As
Publication number | Publication date |
---|---|
JPH09507607A (ja) | 1997-07-29 |
US5716759A (en) | 1998-02-10 |
ZA946593B (en) | 1995-04-03 |
TW288183B (zh) | 1996-10-11 |
AU7537694A (en) | 1995-03-22 |
SV1994000042A (es) | 1996-10-16 |
WO1995006899A1 (en) | 1995-03-09 |
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