TW228613B - - Google Patents
Info
- Publication number
- TW228613B TW228613B TW082108570A TW82108570A TW228613B TW 228613 B TW228613 B TW 228613B TW 082108570 A TW082108570 A TW 082108570A TW 82108570 A TW82108570 A TW 82108570A TW 228613 B TW228613 B TW 228613B
- Authority
- TW
- Taiwan
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Formation Of Insulating Films (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019920019239A KR960002066B1 (ko) | 1992-10-20 | 1992-10-20 | 옥시 나이트라이드 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW228613B true TW228613B (el) | 1994-08-21 |
Family
ID=19341412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW082108570A TW228613B (el) | 1992-10-20 | 1993-10-15 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH06209009A (el) |
KR (1) | KR960002066B1 (el) |
DE (1) | DE4335457A1 (el) |
TW (1) | TW228613B (el) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8053826B2 (en) | 2007-09-10 | 2011-11-08 | Renesas Electronics Corporation | Non-volatile semiconductor memory device and method of manufacturing the same |
JP4902716B2 (ja) | 2008-11-20 | 2012-03-21 | 株式会社日立国際電気 | 不揮発性半導体記憶装置およびその製造方法 |
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1992
- 1992-10-20 KR KR1019920019239A patent/KR960002066B1/ko not_active IP Right Cessation
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1993
- 1993-10-15 TW TW082108570A patent/TW228613B/zh active
- 1993-10-18 DE DE4335457A patent/DE4335457A1/de not_active Ceased
- 1993-10-20 JP JP5284230A patent/JPH06209009A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH06209009A (ja) | 1994-07-26 |
KR940010209A (ko) | 1994-05-24 |
KR960002066B1 (ko) | 1996-02-10 |
DE4335457A1 (de) | 1994-04-21 |