TW202432291A - 雷射加工裝置、半導體晶片及半導體晶片之製造方法 - Google Patents
雷射加工裝置、半導體晶片及半導體晶片之製造方法 Download PDFInfo
- Publication number
- TW202432291A TW202432291A TW113100371A TW113100371A TW202432291A TW 202432291 A TW202432291 A TW 202432291A TW 113100371 A TW113100371 A TW 113100371A TW 113100371 A TW113100371 A TW 113100371A TW 202432291 A TW202432291 A TW 202432291A
- Authority
- TW
- Taiwan
- Prior art keywords
- imaging unit
- wafer
- unit
- lenses
- switching
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 title claims description 11
- 238000003754 machining Methods 0.000 title abstract 2
- 238000003384 imaging method Methods 0.000 claims abstract description 225
- 238000012545 processing Methods 0.000 claims description 67
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 206
- 238000005520 cutting process Methods 0.000 description 49
- 230000001681 protective effect Effects 0.000 description 40
- 230000007246 mechanism Effects 0.000 description 30
- 238000000227 grinding Methods 0.000 description 28
- 238000007689 inspection Methods 0.000 description 21
- 238000012937 correction Methods 0.000 description 12
- 238000001179 sorption measurement Methods 0.000 description 11
- 238000003860 storage Methods 0.000 description 10
- 239000013078 crystal Substances 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 230000007547 defect Effects 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000007723 transport mechanism Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000005498 polishing Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 2
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005247 gettering Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003333 near-infrared imaging Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/003608 WO2024161635A1 (ja) | 2023-02-03 | 2023-02-03 | レーザ加工装置、半導体チップおよび半導体チップの製造方法 |
| WOPCT/JP2023/003608 | 2023-02-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202432291A true TW202432291A (zh) | 2024-08-16 |
Family
ID=92146010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113100371A TW202432291A (zh) | 2023-02-03 | 2024-01-04 | 雷射加工裝置、半導體晶片及半導體晶片之製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW202432291A (ja) |
| WO (1) | WO2024161635A1 (ja) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060055457A (ko) * | 2003-05-22 | 2006-05-23 | 가부시키가이샤 토쿄 세이미쯔 | 다이싱장치 |
| KR20210079323A (ko) * | 2018-10-23 | 2021-06-29 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 및 기판 처리 방법 |
| JP2021174806A (ja) * | 2020-04-20 | 2021-11-01 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
-
2023
- 2023-02-03 WO PCT/JP2023/003608 patent/WO2024161635A1/ja unknown
-
2024
- 2024-01-04 TW TW113100371A patent/TW202432291A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024161635A1 (ja) | 2024-08-08 |
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