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TW202101056A - Shape memory alloy actuators and methods thereof - Google Patents

Shape memory alloy actuators and methods thereof Download PDF

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Publication number
TW202101056A
TW202101056A TW109110412A TW109110412A TW202101056A TW 202101056 A TW202101056 A TW 202101056A TW 109110412 A TW109110412 A TW 109110412A TW 109110412 A TW109110412 A TW 109110412A TW 202101056 A TW202101056 A TW 202101056A
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Taiwan
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actuator
sma
bimorph
buckle
shows
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TW109110412A
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Chinese (zh)
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馬克 A 米勒
納撒尼爾 K 貝寧
狄恩 E 邁爾斯
麥可 W 戴維斯
萊恩 N 魯茲卡
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美商哈欽森技術股份有限公司
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Priority claimed from US16/775,207 external-priority patent/US11105319B2/en
Application filed by 美商哈欽森技術股份有限公司 filed Critical 美商哈欽森技術股份有限公司
Publication of TW202101056A publication Critical patent/TW202101056A/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03GSPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F03G7/066Actuator control or monitoring
    • F03G7/0665Actuator control or monitoring controlled displacement, e.g. by using a lens positioning actuator
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F03MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
    • F03GSPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR
    • F03G7/00Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for
    • F03G7/06Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like
    • F03G7/061Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element
    • F03G7/0614Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying or the like characterised by the actuating element using shape memory elements
    • F03G7/06143Wires
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00Focusing arrangements of general interest for cameras, projectors or printers
    • G03B3/10Power-operated focusing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B5/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B5/02Lateral adjustment of lens
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0007Movement of one or more optical elements for control of motion blur
    • G03B2205/0015Movement of one or more optical elements for control of motion blur by displacing one or more optical elements normal to the optical axis
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2205/00Adjustment of optical system relative to image or object surface other than for focusing
    • G03B2205/0053Driving means for the movement of one or more optical element
    • G03B2205/0076Driving means for the movement of one or more optical element using shape memory alloys

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Adjustment Of Camera Lenses (AREA)

Abstract

SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.

Description

形狀記憶合金致動器及其方法Shape memory alloy actuator and method thereof

本發明之實施例係關於形狀記憶合金系統之領域。更特定而言,本發明之實施例係關於形狀記憶合金致動器及其相關方法之領域。The embodiment of the present invention relates to the field of shape memory alloy systems. More specifically, the embodiments of the present invention relate to the field of shape memory alloy actuators and related methods.

形狀記憶合金(「SMA」)系統具有例如可結合一相機鏡頭元件一起用作一自動聚焦驅動器之一移動總成或結構。此等系統可被諸如一屏蔽罩之一結構包圍。移動總成經支撐以藉由諸如複數個滾珠之一軸承在一支撐總成上移動。由諸如磷青銅或不鏽鋼之金屬形成之撓曲元件具有一移動板及撓曲件。撓曲件在移動板與靜止支撐總成之間延伸且用作彈簧以使移動總成能夠相對於靜止支撐總成移動。滾珠允許移動總成以很小阻力移動。移動總成及支撐總成藉由在該等總成之間延伸之四個形狀記憶合金(SMA)線耦接。該等SMA線之各者具有附接至支撐總成之一端及附接至移動總成之一相對端。藉由將電驅動信號施加至SMA線來驅動懸架。然而,此等類型之系統受系統複雜性之困擾,從而導致需要一大覆蓋區及一大高度間隙之龐大系統。此外,本系統未能提供具有一緊湊、低分佈覆蓋區之一高Z衝程範圍。The shape memory alloy ("SMA") system has, for example, a moving assembly or structure that can be used in conjunction with a camera lens element as an autofocus drive. These systems can be surrounded by a structure such as a shield. The moving assembly is supported to move on a supporting assembly by a bearing such as a plurality of balls. The flexure element formed of metal such as phosphor bronze or stainless steel has a moving plate and flexure. The flexure extends between the moving plate and the stationary support assembly and acts as a spring to enable the moving assembly to move relative to the stationary support assembly. The balls allow the moving assembly to move with little resistance. The moving assembly and the support assembly are coupled by four shape memory alloy (SMA) wires extending between the assemblies. Each of the SMA wires has an end attached to the support assembly and an opposite end attached to the mobile assembly. The suspension is driven by applying an electric drive signal to the SMA wire. However, these types of systems are plagued by system complexity, resulting in huge systems requiring a large coverage area and a large height gap. In addition, this system fails to provide a high Z-stroke range with a compact, low-distribution coverage area.

描述SMA致動器及相關方法。一致動器之一項實施例包含:一基座;複數個帶扣臂;及至少一第一形狀記憶合金線,其與該複數個帶扣臂之一對帶扣臂耦接。一致動器之另一實施例包含一基座及至少一個雙壓電晶片致動器,該至少一個雙壓電晶片致動器包含一形狀記憶合金材料。該雙壓電晶片致動器經附接至該基座。Describe SMA actuators and related methods. An embodiment of the actuator includes: a base; a plurality of buckle arms; and at least one first shape memory alloy wire coupled to a pair of buckle arms of the plurality of buckle arms. Another embodiment of the actuator includes a base and at least one piezoelectric bimorph actuator. The at least one piezoelectric bimorph actuator includes a shape memory alloy material. The bimorph actuator is attached to the base.

本發明之實施例之其他特徵及優點將自隨附圖式及自後續詳細描述而變得顯而易見。Other features and advantages of the embodiments of the present invention will become apparent from the accompanying drawings and the following detailed description.

相關申請案之交叉參考Cross reference of related applications

本申請案主張2020年1月28日申請之美國專利申請案第16/775,207號之權益,且進一步主張2019年3月29日申請之美國臨時專利申請案第62/826,106號之權益,所有該等案之全部內容以引用方式併入本文中。This application claims the rights and interests of U.S. Patent Application No. 16/775,207 filed on January 28, 2020, and further claims the rights and interests of U.S. Provisional Patent Application No. 62/826,106 filed on March 29, 2019. The entire contents of such cases are incorporated into this article by reference.

本文中描述一SMA致動器之實施例,其包含一緊湊覆蓋區且提供一高致動高度,例如在正z軸方向(z方向)之移動,本文中稱為z衝程。SMA致動器之實施例包含一SMA帶扣致動器及一SMA雙壓電晶片致動器。SMA致動器可用於諸多應用(包含但不限於作為一自動聚焦致動器之一透鏡總成、一微流體泵、一感測器移位、光學影像穩定、光學變焦總成)中以機械地撞擊兩個表面以產生通常在觸覺回饋感測器及裝置以及其中使用一致動器之其他系統中發現之振動感覺。例如,本文中所描述之一致動器之實施例可用作在手機或可穿戴裝置中使用之一觸覺回饋致動器,該手機或或可穿戴裝置經組態以向使用者提供一警報、通知、警告、觸控區域或按下按鈕回應。此外,一個以上SMA致動器可用於一系統中以達成一更大衝程。An embodiment of an SMA actuator is described herein, which includes a compact footprint and provides a high actuation height, such as movement in the positive z-axis direction (z direction), referred to herein as the z-stroke. Examples of SMA actuators include an SMA buckle actuator and an SMA bimorph actuator. SMA actuators can be used in many applications (including but not limited to a lens assembly as an autofocus actuator, a microfluidic pump, a sensor shift, optical image stabilization, optical zoom assembly) in mechanical The ground hits two surfaces to produce the vibration sensation commonly found in tactile feedback sensors and devices and other systems in which actuators are used. For example, the actuator embodiments described herein can be used as a tactile feedback actuator for use in a mobile phone or wearable device that is configured to provide an alert, Notifications, warnings, touch areas or press buttons to respond. In addition, more than one SMA actuator can be used in a system to achieve a larger stroke.

針對各項實施例,SMA致動器具有大於0.4毫米之一z衝程。此外,針對各項實施例,當SMA致動器處於其初始、非致動位置時,SMA致動器在z方向具有2.2毫米或更小之一高度。經組態為一透鏡總成中之一自動聚焦致動器之SMA致動器之各項實施例可具有比透鏡內徑(「ID」)大僅3毫米之一覆蓋區。根據各項實施例,SMA致動器可具有在一個方向更寬之一覆蓋區以容納包含但不限於感測器、線、跡線及連接器之組件。根據一些實施例,一SMA致動器之覆蓋區在一個方向大0.5毫米,例如SMA致動器之長度比寬度大0.5毫米。For various embodiments, the SMA actuator has a z-stroke greater than 0.4 millimeters. Furthermore, for various embodiments, when the SMA actuator is in its initial, non-actuated position, the SMA actuator has a height of 2.2 mm or less in the z direction. Embodiments of an SMA actuator configured as an autofocus actuator in a lens assembly can have a coverage area that is only 3 mm larger than the inner diameter ("ID") of the lens. According to various embodiments, the SMA actuator may have a wider coverage area in one direction to accommodate components including, but not limited to, sensors, wires, traces, and connectors. According to some embodiments, the footprint of an SMA actuator is 0.5 mm larger in one direction, for example, the length of the SMA actuator is 0.5 mm larger than the width.

圖1a繪示根據一實施例之包含經組態為一帶扣致動器之一SMA致動器之一透鏡總成。圖1b繪示根據一實施例之經組態為一帶扣致動器之一SMA致動器。帶扣致動器102與一基座101耦接。如圖1b中所繪示,SMA線100經附接至帶扣致動器102,使得當SMA線100被致動且收縮時,此致使帶扣致動器102扣住,其導致各帶扣致動器102之至少中心部分104在z衝程方向(例如正z方向)移動,如由箭頭108所指示。根據一些實施例,當透過諸如一壓接物結構106之一線保持器將電流供應至SMA線100之一端時致動該線。電流流過SMA線100,從而歸因於製成SMA線100之SMA材料固有之電阻而加熱SMA線100。SMA線100之另一側具有一線保持器,諸如連接SMA線100以使電路接地之一壓接物結構106。將SMA線材100加熱至一足夠溫度致使獨特材料性質自馬氏體結晶構變為奧氏體結晶結構,此致使該線之一長度變化。改變電流會改變溫度且因此會改變該線之長度,此用來致動及撤銷致動該致動器以控制該致動器在至少z方向之移動。熟習此項技術者將理解,可使用其他技術來將電流提供至一SMA線。Figure 1a shows a lens assembly including an SMA actuator configured as a buckle actuator according to an embodiment. Figure 1b shows an SMA actuator configured as a buckle actuator according to an embodiment. The buckle actuator 102 is coupled to a base 101. As shown in Figure 1b, the SMA wire 100 is attached to the buckle actuator 102 so that when the SMA wire 100 is actuated and contracted, this causes the buckle actuator 102 to buckle, which causes each buckle At least the central portion 104 of the actuator 102 moves in the z-stroke direction (for example, the positive z-direction), as indicated by the arrow 108. According to some embodiments, the SMA wire 100 is activated when current is supplied to one end of the SMA wire 100 through a wire holder such as a crimp structure 106. The current flows through the SMA wire 100, thereby heating the SMA wire 100 due to the inherent resistance of the SMA material from which the SMA wire 100 is made. The other side of the SMA wire 100 has a wire holder, such as a crimp structure 106 connected to the SMA wire 100 to ground the circuit. Heating the SMA wire 100 to a temperature sufficient to cause the unique material property to change from a martensite crystal structure to an austenite crystal structure, which causes a length of the wire to change. Changing the current changes the temperature and therefore the length of the wire, which is used to activate and deactivate the actuator to control the movement of the actuator in at least the z direction. Those familiar with this technique will understand that other techniques can be used to provide current to an SMA wire.

圖2繪示根據一實施例之經組態為一SMA雙壓電晶片致動器之一SMA致動器。如圖2中所繪示,SMA致動器包含與一基座204耦接之雙壓電晶片致動器202。雙壓電晶片致動器202包含一SMA帶206。雙壓電晶片致動器202經組態以隨著SMA帶206收縮而在z衝程方向208移動雙壓電晶片致動器202之至少未固定端。Figure 2 shows an SMA actuator configured as an SMA bimorph actuator according to an embodiment. As shown in FIG. 2, the SMA actuator includes a bimorph actuator 202 coupled to a base 204. The piezoelectric bimorph actuator 202 includes an SMA tape 206. The bimorph actuator 202 is configured to move at least the unfixed end of the bimorph actuator 202 in the z-stroke direction 208 as the SMA band 206 contracts.

圖3繪示根據一實施例之包含一SMA致動器之一自動聚焦總成的一分解圖。如所繪示,一SMA致動器302經組態為根據本文中所描述之實施例之一帶扣致動器。自動聚焦總成亦包含光學影像穩定器(「OIS」) 304、經組態以使用包含此項技術中已知之技術的技術固持一或多個光學透鏡之一透鏡托架306、一復位彈簧308、一垂直滑動軸承310及一引導蓋312。當SMA線使用包含本文中所描述之技術的技術來致動且拉動及扣住帶扣致動器302時,SMA致動器302經組態以隨著SMA致動器302在z衝程方向(例如正z軸方向)移動而抵靠垂直滑動軸承310滑動。復位彈簧308經組態以使用包含此項技術中已知之技術的技術在透鏡托架306上沿與z衝程方向相反之方向施加一力。根據各項實施例,復位彈簧308經組態以當SMA線中之張力隨著撤銷致動SMA線而降低時,在z衝程方向之相反方向移動透鏡托架306。當SMA線中之張力降低至初始值時,透鏡托架306在z衝程方向移動至最低高度。圖4繪示根據圖3中所繪示之一實施例之包含一SMA線致動器之自動聚焦總成。FIG. 3 shows an exploded view of an autofocus assembly including an SMA actuator according to an embodiment. As shown, an SMA actuator 302 is configured as a buckle actuator according to the embodiments described herein. The autofocus assembly also includes an optical image stabilizer ("OIS") 304, which is configured to hold one or more optical lenses, a lens holder 306, and a return spring 308 using technologies including those known in the art. , A vertical sliding bearing 310 and a guide cover 312. When the SMA wire uses a technique including the techniques described herein to actuate and pull and buckle the buckle actuator 302, the SMA actuator 302 is configured to follow the SMA actuator 302 in the z-stroke direction ( For example, the positive z-axis direction) moves and slides against the vertical sliding bearing 310. The return spring 308 is configured to apply a force on the lens holder 306 in a direction opposite to the z-stroke direction using techniques including techniques known in the art. According to various embodiments, the return spring 308 is configured to move the lens holder 306 in the opposite direction of the z-stroke direction when the tension in the SMA wire decreases as the SMA wire is deactivated. When the tension in the SMA wire decreases to the initial value, the lens holder 306 moves to the lowest height in the z-stroke direction. FIG. 4 shows an autofocus assembly including an SMA wire actuator according to an embodiment shown in FIG. 3.

圖5繪示根據一實施例之包含一感測器之一SMA線致動器。針對各項實施例,感測器502經組態以使用包含此項技術中已知之技術的技術量測SMA致動器在z方向之移動或彼SMA致動器正在移動之一組件之移動。SMA致動器包含經組態以使用類似於本文中所描述之SMA線之一或多個SMA線508致動的一或多個帶扣致動器506。例如,在參考圖4所描述之自動聚焦總成中,該感測器經組態以使用包含此項技術中已知之技術的技術判定透鏡托架306在z方向504自一初始位置移動之移動量。根據一些實施例,該感測器係一隧道磁阻(「TMR」)感測器。FIG. 5 shows an SMA wire actuator including a sensor according to an embodiment. For various embodiments, the sensor 502 is configured to measure the movement of the SMA actuator in the z direction or the movement of a component that the SMA actuator is moving using techniques including techniques known in the art. The SMA actuator includes one or more buckle actuators 506 that are configured to actuate using one or more of the SMA wires 508 similar to those described herein. For example, in the autofocus assembly described with reference to FIG. 4, the sensor is configured to determine the movement of the lens holder 306 in the z-direction 504 from an initial position using techniques including techniques known in the art. the amount. According to some embodiments, the sensor is a tunnel magnetoresistive ("TMR") sensor.

圖6繪示根據一實施例之經組態為一帶扣致動器之一SMA致動器602的一俯視圖及一側視圖,SMA致動器602配備有一透鏡托架604。圖7繪示根據圖6中所繪示之實施例之SMA致動器602之一區段的一側視圖。根據圖7中所繪示之實施例,SMA致動器602包含一滑動基座702。根據一實施例,滑動基座702係使用包含此項技術中已知之技術的技術由諸如不鏽鋼之金屬形成。然而,熟習此項技術者將理解,可使用其他材料來形成滑動基座702。此外,根據一些實施例,滑動基座702具有與SMA致動器602耦接之彈簧臂612。根據各項實施例,彈簧臂612經組態以用作兩個功能。第一功能係幫助將例如一透鏡托架604之一物件推入一引導蓋之垂直滑動表面。針對此實例,彈簧臂612抵靠此表面向上預加載透鏡托架604以確保透鏡在致動期間將不會傾斜。針對一些實施例,垂直滑動表面708經組態以與該引導蓋配合。彈簧臂612之第二功能係繼SMA線608在z衝程方向(即,z正方向)移動SMA致動器602之後,幫助例如在z負方向上向下回拉SMA致動器602。因此,當SMA線608被致動時,其等收縮以在z衝程方向移動SMA致動器602且當SMA線被撤銷致動時,彈簧臂612經組態以在z衝程方向之相反方向移動SMA致動器602。6 shows a top view and a side view of an SMA actuator 602 configured as a buckle actuator according to an embodiment. The SMA actuator 602 is equipped with a lens holder 604. FIG. 7 shows a side view of a section of the SMA actuator 602 according to the embodiment shown in FIG. 6. According to the embodiment shown in FIG. 7, the SMA actuator 602 includes a sliding base 702. According to an embodiment, the sliding base 702 is formed of a metal such as stainless steel using a technique including techniques known in the art. However, those skilled in the art will understand that other materials may be used to form the sliding base 702. In addition, according to some embodiments, the sliding base 702 has a spring arm 612 coupled with the SMA actuator 602. According to various embodiments, the spring arm 612 is configured to serve two functions. The first function is to help push an object such as a lens holder 604 into the vertical sliding surface of a guide cover. For this example, the spring arm 612 preloads the lens holder 604 upward against this surface to ensure that the lens will not tilt during actuation. For some embodiments, the vertical sliding surface 708 is configured to mate with the guide cover. The second function of the spring arm 612 is to help pull the SMA actuator 602 downward in the z-negative direction after the SMA wire 608 moves the SMA actuator 602 in the z-stroke direction (ie, the z-positive direction). Therefore, when the SMA wire 608 is actuated, it is contracted to move the SMA actuator 602 in the z-stroke direction and when the SMA wire is deactivated, the spring arm 612 is configured to move in the opposite direction of the z-stroke direction SMA actuator 602.

SMA致動器602亦包含一帶扣致動器710。針對各項實施例,帶扣致動器710由諸如不鏽鋼之金屬形成。此外,帶扣致動器710包含帶扣臂610及一或多個線保持器606。根據圖6及圖7中所繪示之實施例,帶扣致動器710包含四個線保持器606。四個線保持器606各經組態以接納一SMA線608之一端且保持SMA線608之端,使得SMA線608經貼附至帶扣致動器710。針對各項實施例,四個線保持器606係壓接物,其等經組態以向下夾持於SMA線608之一部分上以將該線貼附至該壓接物。熟習此項技術者將理解,可使用此項技術中已知之技術將SMA線608貼附至一線保持器606,包含但不限於黏合劑、焊料及機械貼附。智慧型記憶合金(「SMA」)線608在一對線保持器606之間延伸,使得帶扣致動器710之帶扣臂610經組態以在SMA線608被致動時移動,此導致該對線保持器606被拉得更近。根據各項實施例,當將一電流施加至SMA線608時,SMA線608經電致動以移動且控制帶扣臂610之位置。當電流被移除或低於一臨限值時,撤銷致動SMA線608。此使該對或線保持器606分開地移動且帶扣臂610在與SMA線608被致動時相反之方向移動。根據各項實施例,當SMA線處於其初始位置被撤銷致動時,帶扣臂610經組態以相對於滑動基座702具有5度之一初始角度。而且,根據各項實施例,在全衝程或當SMA線被完全致動時,帶扣臂610經組態以相對於滑動基座702具有10度至12度之一角度。The SMA actuator 602 also includes a buckle actuator 710. For various embodiments, the buckle actuator 710 is formed of metal such as stainless steel. In addition, the buckle actuator 710 includes a buckle arm 610 and one or more wire holders 606. According to the embodiment shown in FIGS. 6 and 7, the buckle actuator 710 includes four wire holders 606. The four wire holders 606 are each configured to receive one end of an SMA wire 608 and hold the end of the SMA wire 608 so that the SMA wire 608 is attached to the buckle actuator 710. For various embodiments, the four wire holders 606 are crimping objects, which are configured to clamp down on a portion of the SMA wire 608 to attach the wire to the crimping object. Those familiar with the art will understand that the SMA wire 608 can be attached to the wire holder 606 using techniques known in the art, including but not limited to adhesive, solder, and mechanical attachment. The smart memory alloy ("SMA") wire 608 extends between the pair of wire holders 606 so that the buckle arm 610 of the buckle actuator 710 is configured to move when the SMA wire 608 is actuated, which results in The pair of wire holders 606 are pulled closer. According to various embodiments, when a current is applied to the SMA wire 608, the SMA wire 608 is electrically actuated to move and control the position of the buckle arm 610. When the current is removed or falls below a threshold, the activation of the SMA wire 608 is deactivated. This causes the pair or wire holders 606 to move separately and the buckle arm 610 moves in the opposite direction to when the SMA wire 608 is actuated. According to various embodiments, when the SMA wire is in its initial position and is deactivated, the buckle arm 610 is configured to have an initial angle of 5 degrees relative to the sliding base 702. Moreover, according to various embodiments, the buckle arm 610 is configured to have an angle of 10 to 12 degrees with respect to the sliding base 702 during the full stroke or when the SMA wire is fully actuated.

根據圖6及圖7中所繪示之實施例,SMA致動器602亦包含組態於滑動基座702與線保持器606之間的滑動軸承706。滑動軸承706經組態以最小化滑動基座702與一帶扣臂610及/或一線保持器606之間的任何摩擦。針對一些實施例,滑動軸承經貼附至滑動軸承706。根據各項實施例,滑動軸承由聚甲醛(「POM」)形成。熟習此項技術者將理解,可使用其他結構來降低該帶扣致動器與該基座之間的任何摩擦。According to the embodiments shown in FIGS. 6 and 7, the SMA actuator 602 also includes a sliding bearing 706 configured between the sliding base 702 and the wire holder 606. The sliding bearing 706 is configured to minimize any friction between the sliding base 702 and a buckle arm 610 and/or a wire retainer 606. For some embodiments, the sliding bearing is attached to the sliding bearing 706. According to various embodiments, the sliding bearing is formed of polyoxymethylene ("POM"). Those skilled in the art will understand that other structures can be used to reduce any friction between the buckle actuator and the base.

根據各項實施例,滑動基座702經組態以與諸如一自動聚焦總成之一自動聚焦基座之一總成基座704耦接。根據一些實施例,致動器基座704包含一蝕刻墊片。當SMA致動器602係諸如一自動聚焦總成之一總成之部分時,此一蝕刻墊片可用來為線及壓接物提供間隙。According to various embodiments, the sliding base 702 is configured to couple with an assembly base 704 such as an autofocus base. According to some embodiments, the actuator base 704 includes an etching pad. When the SMA actuator 602 is part of an assembly such as an autofocus assembly, this etched pad can be used to provide clearance for wires and crimps.

圖8繪示相對於一x軸、一y軸及一z軸之一帶扣致動器802之一實施例的多個視圖。如圖8中所定向,帶扣臂804經組態以當SMA線如本文中所描述般被致動及撤銷致動時在z軸上移動。根據圖8中所繪示之實施例,帶扣臂804透過諸如一吊床部分806之一中心部分彼此耦接。根據各項實施例,一吊床部分806經組態以撐持由帶扣致動器所作用之一物件(例如由帶扣致動器使用包含本文中所描述之技術的技術移動之一透鏡托架)之一部分。根據一些實施例,一吊床部分806經組態以在致動期間向帶扣致動器提供側向剛性。針對其他實施例,一帶扣致動器不包含一吊床部分806。根據此等實施例,帶扣臂經組態以作用於一物件上以移動該物件。例如,帶扣臂經組態以直接作用於一透鏡托架之特徵上以上推該透鏡托架。8 shows multiple views of an embodiment of a buckle actuator 802 with respect to an x-axis, a y-axis, and a z-axis. As oriented in Figure 8, the buckle arm 804 is configured to move on the z-axis when the SMA wire is actuated and de-actuated as described herein. According to the embodiment illustrated in FIG. 8, the buckle arms 804 are coupled to each other through a central part such as a hammock part 806. According to various embodiments, a hammock portion 806 is configured to support an object acted on by a buckle actuator (for example, a lens holder is moved by a buckle actuator using techniques including the techniques described herein) ) Part. According to some embodiments, a hammock portion 806 is configured to provide lateral rigidity to the buckle actuator during actuation. For other embodiments, a buckle actuator does not include a hammock portion 806. According to these embodiments, the buckle arm is configured to act on an object to move the object. For example, the buckle arm is configured to act directly on a feature of a lens holder to push up the lens holder.

圖9繪示根據一實施例之經組態為一SMA雙壓電晶片致動器之一SMA致動器。SMA雙壓電晶片致動器包含雙壓電晶片致動器902,包含本文中所描述之雙壓電晶片致動器。根據圖9中所繪示之實施例,雙壓電晶片致動器902之各者之一端906經貼附至一基座908。根據一些實施例,該端906經焊接至基座908。然而,熟習此項技術者將理解,可使用另一技術來將該端906貼附至基座908。圖9亦繪示一透鏡托架904,其經配置使得雙壓電晶片致動器902經組態以當被致動時在z方向捲曲且在z軸方向抬起該托架904。針對一些實施例,使用一復位彈簧來將雙壓電晶片致動器902回推至一初始位置。一復位彈簧可如本文中所描述般組態以輔助將雙壓電晶片致動器下推至其等初始、撤銷致動位置。由於雙壓電晶片致動器之小覆蓋區,因此可製作與當前致動器技術相比具有一減小的覆蓋區之SMA致動器。Figure 9 shows an SMA actuator configured as an SMA bimorph actuator according to an embodiment. The SMA bimorph actuator includes the bimorph actuator 902, including the bimorph actuator described herein. According to the embodiment shown in FIG. 9, one end 906 of each of the piezoelectric bimorph actuators 902 is attached to a base 908. According to some embodiments, the end 906 is welded to the base 908. However, those skilled in the art will understand that another technique may be used to attach the end 906 to the base 908. Figure 9 also shows a lens holder 904 that is configured such that the bimorph actuator 902 is configured to curl in the z-direction and lift the holder 904 in the z-axis direction when actuated. For some embodiments, a return spring is used to push the bimorph actuator 902 back to an initial position. A return spring can be configured as described herein to assist in pushing the bimorph actuator down to its initial, deactivated position. Due to the small footprint of the bimorph actuator, it is possible to fabricate an SMA actuator with a reduced footprint compared to current actuator technology.

圖10繪示根據一實施例之包含一SMA致動器之一自動聚焦總成之一剖視圖,該SMA致動器包含一位置感測器,諸如一TMR感測器。自動聚焦總成1002包含附接至一移動彈簧1006之一位置感測器1004,及附接至包含諸如本文中所描述之SMA致動器的一SMA致動器之一自動聚焦總成之一透鏡托架1010之一磁體1008。位置感測器1004經組態以使用包含此項技術中已知之技術的技術、基於磁體1008距位置感測器1004之一距離來判定透鏡托架1010在z方向1005上自一初始位置移動之移動量。根據一些實施例,位置感測器1004使用一光學影像穩定總成之一移動彈簧1006之一彈簧臂上之複數個電跡線與一控制器或一處理器(諸如一中央處理單元)電耦接。FIG. 10 shows a cross-sectional view of an autofocus assembly including an SMA actuator including a position sensor, such as a TMR sensor, according to an embodiment. The autofocus assembly 1002 includes a position sensor 1004 attached to a moving spring 1006, and one of the autofocus assemblies attached to an SMA actuator including an SMA actuator such as described herein A magnet 1008 is one of the lens holder 1010. The position sensor 1004 is configured to use a technique including techniques known in the art, based on a distance of the magnet 1008 from the position sensor 1004 to determine the movement of the lens holder 1010 in the z direction 1005 from an initial position The amount of movement. According to some embodiments, the position sensor 1004 is electrically coupled with a controller or a processor (such as a central processing unit) using a plurality of electrical traces on a spring arm of a moving spring 1006 of an optical image stabilization assembly Pick up.

圖11a至圖11c繪示根據一些實施例之雙壓電晶片致動器之視圖。根據各項實施例,一雙壓電晶片致動器1102包含一樑1104及一或多種SMA材料1106,諸如一SMA帶1106b (例如,如根據圖11b之實施例之包含一SMA帶之一雙壓電晶片致動器之一透視圖中所繪示)或SMA線1106a (例如,如根據圖11a之實施例之包含一SMA線之一雙壓電晶片致動器的一截面中所繪示)。使用包含本文中所描述之技術的技術將SMA材料1106貼附至樑1104。根據一些實施例,使用黏合膜材料1108將SMA材料1106貼附至一樑1104。針對各項實施例,SMA材料1106之端與接觸件1110電耦接及機械耦接,接觸件1110經組態以使用包含此項技術中已知之技術的技術將電流供應至SMA材料1106。根據各項實施例,接觸件1110 (例如,如圖11a及圖11b中所繪示)係鍍金的銅焊盤。根據實施例,具有近似1毫米之一長度之一雙壓電晶片致動器1102經組態以產生一大衝程且50毫牛頓(「mN」)之推力用作一透鏡總成之部分,例如如圖11c中所繪示。根據一些實施例,具有大於1毫米之一長度之一雙壓電晶片致動器1102之使用將產生比具有1毫米之一長度之雙壓電晶片致動器1102更大之衝程但更小之力。針對一實施例,一雙壓電晶片致動器1102包含一20微米厚SMA材料1106、一20微米厚絕緣體1112 (諸如聚醯亞胺絕緣體)及一30微米厚不鏽鋼樑1104或鹼金屬。各項實施例包含一第二絕緣體1114,第二絕緣體1114經安置於包含接觸件1110之一接觸層與SMA材料1106之間。根據一些實施例,第二絕緣體1114經組態以使SMA材料1106與未用作接觸件1110之接觸層之部分絕緣。針對一些實施例,第二絕緣體1114係一表塗層,諸如聚醯亞胺絕緣體。熟習此項技術者將理解,可使用其他尺寸及材料來滿足所欲設計特性。11a to 11c show views of piezoelectric bimorph actuators according to some embodiments. According to various embodiments, a bimorph actuator 1102 includes a beam 1104 and one or more SMA materials 1106, such as an SMA tape 1106b (e.g., as the embodiment according to FIG. 11b includes an SMA tape, a double A piezoelectric chip actuator is shown in a perspective view) or an SMA wire 1106a (for example, as shown in a cross section of a bimorph actuator including an SMA wire according to the embodiment of FIG. 11a) ). The SMA material 1106 is attached to the beam 1104 using techniques including the techniques described herein. According to some embodiments, the SMA material 1106 is attached to a beam 1104 using an adhesive film material 1108. For various embodiments, the end of the SMA material 1106 is electrically and mechanically coupled to the contact 1110, and the contact 1110 is configured to supply current to the SMA material 1106 using techniques including techniques known in the art. According to various embodiments, the contact 1110 (eg, as shown in FIG. 11a and FIG. 11b) is a gold-plated copper pad. According to an embodiment, a bimorph actuator 1102 having a length of approximately 1 millimeter is configured to generate a large stroke and 50 millinewtons ("mN") thrust is used as part of a lens assembly, for example As shown in Figure 11c. According to some embodiments, the use of a bimorph actuator 1102 with a length greater than 1 millimeter will produce a larger stroke but smaller stroke than a bimorph actuator 1102 with a length of 1 millimeter. force. For one embodiment, a bimorph actuator 1102 includes a 20-micron thick SMA material 1106, a 20-micron thick insulator 1112 (such as a polyimide insulator), and a 30-micron thick stainless steel beam 1104 or alkali metal. Various embodiments include a second insulator 1114, and the second insulator 1114 is disposed between a contact layer including a contact 1110 and the SMA material 1106. According to some embodiments, the second insulator 1114 is configured to insulate the SMA material 1106 from the part of the contact layer that is not used as the contact 1110. For some embodiments, the second insulator 1114 is a surface coating, such as a polyimide insulator. Those familiar with this technology will understand that other sizes and materials can be used to meet the desired design characteristics.

圖12繪示根據一實施例之一雙壓電晶片致動器之一實施例之視圖。如圖12中所繪示之實施例包含用於施加電力之一中心饋電1204。在SMA材料1202 (線或帶)(諸如本文中所描述之SMA材料)之中心處供應電力。SMA材料1202之端在端焊盤1203處作為一返回路徑接地至樑1206或鹼金屬。端焊盤1203與接觸層1214之其餘部分電隔離。根據實施例,一樑1206或鹼金屬沿SMA材料1202之整個長度極為接近SMA材料1202 (諸如一SMA線)會在電流被關斷時(即,雙壓電晶片致動器被撤銷致動)提供更快線冷卻。結果係一更快線撤銷啟動及致動器回應時間。SMA線或帶之熱分佈予以改良。例如,熱分佈更均勻使得可將一較高總電流可靠地傳遞至該線。在沒有一均勻散熱片之情況下,該線之部分(諸如一中心區)可能過熱且受損,因此需要一減小的電流及減少的運動來可靠地操作。中心饋電1204提供SMA材料1202之線啟動/致動更快(加熱更快)及電力消耗減少(電阻路徑長度更低)而回應時間更快之益處。此允許一更快致動器運動及以一更高移動頻率操作之能力。FIG. 12 shows a view of an embodiment of a piezoelectric bimorph actuator according to an embodiment. The embodiment shown in FIG. 12 includes a center feed 1204 for applying power. Power is supplied at the center of the SMA material 1202 (wire or tape), such as the SMA material described herein. The end of the SMA material 1202 is grounded at the terminal pad 1203 as a return path to the beam 1206 or alkali metal. The terminal pad 1203 is electrically isolated from the rest of the contact layer 1214. According to an embodiment, a beam 1206 or an alkali metal along the entire length of the SMA material 1202 is very close to the SMA material 1202 (such as an SMA wire) when the current is turned off (ie, the bimorph actuator is deactivated) Provides faster line cooling. The result is a faster line to cancel the activation and actuator response time. The heat distribution of SMA wire or tape is improved. For example, the heat distribution is more uniform so that a higher total current can be reliably delivered to the wire. Without a uniform heat sink, parts of the wire (such as a central area) may overheat and be damaged, so a reduced current and reduced movement are required to operate reliably. The center feed 1204 provides the benefits of faster wire start/actuation of the SMA material 1202 (faster heating), reduced power consumption (lower resistance path length) and faster response time. This allows for a faster actuator movement and the ability to operate at a higher frequency of movement.

如圖12中所繪示,樑1206包含與樑1206之其餘部分隔離以形成中心饋電1204之一中心金屬1208。諸如本文中所描述之絕緣體的一絕緣體1210經安置於樑1206上方。絕緣體1210經組態為具有一或多個開口或通孔1212以提供對樑1206之電通路,例如以耦接接觸層之一接地區段1214b,且提供與中心金屬1208之接觸以形成中心饋電1204。根據一些實施例,一接觸層1214 (諸如本文中所描述之接觸層)包含一電源區段1214a及一接地區段1214b,以藉由一電力供應器接觸件1216及一接地接觸件1218來將致動/控制信號提供至雙壓電晶片致動器。一表塗層1220 (諸如本文中所描述之表塗層)經安置於接觸層1214上方以電隔離接觸層,惟在電耦接係所欲的接觸層1214中耦接之部分(例如,一或多個接觸件)處除外。As shown in FIG. 12, the beam 1206 includes a center metal 1208 that is isolated from the rest of the beam 1206 to form a center feed 1204. An insulator 1210, such as the insulator described herein, is placed above the beam 1206. The insulator 1210 is configured to have one or more openings or through holes 1212 to provide electrical paths to the beam 1206, for example to couple to a ground section 1214b of the contact layer, and to provide contact with the center metal 1208 to form a center feed Electricity 1204. According to some embodiments, a contact layer 1214 (such as the contact layer described herein) includes a power section 1214a and a ground section 1214b to connect a power supply contact 1216 and a ground contact 1218 The actuation/control signal is provided to the bimorph actuator. A surface coating 1220 (such as the surface coating described herein) is disposed above the contact layer 1214 to electrically isolate the contact layer, except that the electrically coupled portion of the contact layer 1214 (for example, a Or multiple contacts).

圖13繪示根據如圖12中所繪示之一實施例之一雙壓電晶片致動器的一端焊盤截面。如上文所描述,端焊盤1203藉由形成於端焊盤1203與接觸層1214之間的一間隙1222而與接觸層1214之其餘部分電隔離。根據一些實施例,使用包含此項技術中已知之蝕刻技術的蝕刻技術形成該間隙。端焊盤1203包含經組態以電耦接端焊盤1203與樑1206之一通孔區段1224。通孔區段1224經形成於絕緣體1210中形成之一通孔1212中。SMA材料1202電耦接至端焊盤1213。SMA材料1202可使用包含但不限於焊料、電阻焊接、雷射焊接及直接電鍍之技術電耦接至端焊盤1213。FIG. 13 shows a cross section of one end of a piezoelectric bimorph actuator according to an embodiment as shown in FIG. 12. As described above, the terminal pad 1203 is electrically isolated from the rest of the contact layer 1214 by a gap 1222 formed between the terminal pad 1203 and the contact layer 1214. According to some embodiments, the gap is formed using etching techniques including etching techniques known in the art. The terminal pad 1203 includes a via section 1224 configured to electrically couple the terminal pad 1203 and the beam 1206. The through hole section 1224 is formed in a through hole 1212 formed in the insulator 1210. The SMA material 1202 is electrically coupled to the terminal pad 1213. The SMA material 1202 can be electrically coupled to the terminal pad 1213 using techniques including but not limited to solder, resistance welding, laser welding, and direct plating.

圖14繪示根據如圖12中所繪示之一實施例之一雙壓電晶片致動器之一中心饋電截面。中心饋電1204透過接觸層1214與一電力供應器電耦接且藉由中心饋電1204中之一通孔區段1226與中心金屬1208電耦接及熱耦接,通孔區段1226經形成於絕緣體1210中形成之一通孔1212中。FIG. 14 shows a center feeding section of a piezoelectric bimorph actuator according to an embodiment shown in FIG. 12. The center feeder 1204 is electrically coupled to a power supply through the contact layer 1214 and is electrically and thermally coupled to the central metal 1208 through a through hole section 1226 in the center feeder 1204, the through hole section 1226 is formed in A through hole 1212 is formed in the insulator 1210.

本文中所描述之致動器可用來形成使用多個帶扣及/或多個雙壓電晶片致動器之一致動器總成。根據一實施例,該等致動器可彼此堆疊以便增加可達成之一衝程距離。The actuator described herein can be used to form an actuator assembly using multiple buckles and/or multiple piezoelectric bimorph actuators. According to an embodiment, the actuators can be stacked on each other to increase the achievable stroke distance.

圖15繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器的一分解圖。根據本文中所描述之實施例,兩個帶扣致動器1302、1304相對於彼此配置以使用其等運動彼此相對。針對各項實施例,兩個帶扣致動器1302、1304經組態以彼此成一逆關係移動以定位一透鏡托架1306。例如,第一帶扣致動器1302經組態以接收發送至第二帶扣致動器1304之一電力信號的一逆電力信號。15 shows an exploded view of an SMA actuator including one of two buckle actuators according to an embodiment. According to the embodiments described herein, the two buckle actuators 1302, 1304 are configured relative to each other to use their equal motions to face each other. For various embodiments, the two buckle actuators 1302, 1304 are configured to move in an inverse relationship with each other to position a lens carrier 1306. For example, the first buckle actuator 1302 is configured to receive an inverse power signal sent to a power signal of the second buckle actuator 1304.

圖16繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器。帶扣致動器1302、1304經組態使得各帶扣致動器1302、1304之帶扣臂1310、1312彼此面對且各帶扣致動器1302、1304之滑動基座1314、1316係該兩個帶扣致動器之一外表面。根據各項實施例,各SMA致動器1302、1304之一吊床部分1308經組態以撐持由一或多個帶扣致動器1302、1304所作用之一物件(例如由該等帶扣致動器使用包含本文中所描述之技術的技術來移動之一透鏡托架1306)之一部分。FIG. 16 shows an SMA actuator including one of two buckle actuators according to an embodiment. The buckle actuators 1302, 1304 are configured such that the buckle arms 1310, 1312 of each buckle actuator 1302, 1304 face each other and the sliding bases 1314, 1316 of each buckle actuator 1302, 1304 are attached to the The outer surface of one of the two buckle actuators. According to various embodiments, a hammock portion 1308 of each SMA actuator 1302, 1304 is configured to support an object acted on by one or more buckle actuators 1302, 1304 (for example, by the buckle The actuator uses techniques including the techniques described herein to move a part of a lens carrier 1306).

圖17繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器的一側視圖,其繪示導致在一正z方向或在一向上方向移動諸如一透鏡托架之一物件之SMA線1318之方向。FIG. 17 shows a side view of an SMA actuator including one of two buckle actuators according to an embodiment, which is shown to cause movement in a positive z direction or in an upward direction such as one of a lens holder The direction of the SMA line 1318 of the object.

圖18繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器的一側視圖,其繪示導致在一負z方向或在一向下方向移動諸如一透鏡托架之一物件之SMA線1318之方向。FIG. 18 shows a side view of an SMA actuator including one of two buckle actuators according to an embodiment, which is shown to cause movement in a negative z direction or in a downward direction such as one of a lens holder The direction of the SMA line 1318 of the object.

圖19繪示根據一實施例之包含一SMA致動器之一總成的一分解圖,該SMA致動器包含兩個帶扣致動器。帶扣致動器1902、1904經組態使得各帶扣致動器1902、1904之帶扣臂1910、1912係該兩個帶扣致動器之一外表面,且各帶扣致動器1902、1904之滑動基座1914、1916彼此面對。根據各項實施例,各SMA致動器1902、1904之一吊床部分1908經組態以撐持由一或多個帶扣致動器1902、1904所作用之一物件(例如由該等帶扣致動器使用包含本文中所描述之技術的技術來移動之一透鏡托架1906)之一部分。針對一些實施例,SMA致動器包含經組態以接納第二帶扣致動器1904的一基座部分1918。SMA致動器亦可包含一蓋部分1920。圖20繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器,該SMA致動器包含一基座部分及一蓋部分。19 shows an exploded view of an assembly including an SMA actuator including two buckle actuators according to an embodiment. The buckle actuators 1902, 1904 are configured such that the buckle arms 1910, 1912 of each buckle actuator 1902, 1904 are tied to the outer surface of one of the two buckle actuators, and each buckle actuator 1902 , The sliding bases 1914 and 1916 of 1904 face each other. According to various embodiments, a hammock portion 1908 of each SMA actuator 1902, 1904 is configured to support an object acted on by one or more buckle actuators 1902, 1904 (for example, by the buckle The actuator uses a technique including the technique described herein to move a part of a lens carrier 1906). For some embodiments, the SMA actuator includes a base portion 1918 configured to receive the second buckle actuator 1904. The SMA actuator may also include a cover portion 1920. 20 illustrates an SMA actuator including two buckle actuators according to an embodiment, the SMA actuator including a base part and a cover part.

圖21繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器。針對一些實施例,帶扣致動器1902、1904相對於彼此配置使得第一帶扣致動器1902之吊床部分1908自第二帶扣致動器1904之吊床部分旋轉約90度。90度組態實現諸如一透鏡托架1906之一物件之縱傾(pitch)及側滾(roll)旋轉。此提供對透鏡托架1906之移動之更好控制。針對各項實施例,將差分電力信號施加至各帶扣致動器對之SMA線,此為傾斜OIS運動提供透鏡托架之縱傾及側滾旋轉。Figure 21 shows an SMA actuator including one of two buckle actuators according to an embodiment. For some embodiments, the buckle actuators 1902, 1904 are configured relative to each other such that the hammock portion 1908 of the first buckle actuator 1902 rotates about 90 degrees from the hammock portion of the second buckle actuator 1904. The 90-degree configuration realizes the pitch and roll rotation of an object such as a lens holder 1906. This provides better control of the movement of the lens holder 1906. For each embodiment, a differential power signal is applied to the SMA wire of each buckle actuator pair, which provides pitch and roll rotation of the lens holder for tilt OIS movement.

包含兩個帶扣致動器之SMA致動器之實施例消除具有一復位彈簧之需要。當使用SMA線電阻進行位置回饋時,兩個帶扣致動器之使用可改良/減少磁滯。與包含一復位彈簧之SMA致動器相比,包含兩個帶扣致動器之反作用力SMA致動器歸因於較低磁滯而輔助更準確的位置控制。針對一些實施例,諸如圖22中所繪示之實施例,包含兩個帶扣致動器2202、2204之SMA致動器使用差分電力向各帶扣致動器2202、2204之左SMA線2218a及右SMA線2218b提供2軸傾斜。例如,一左SMA線2218a以高於一右SMA線2218b之電力來致動。此致使透鏡托架2206之左側下移且右側上移(傾斜)。針對一些實施例,第一帶扣致動器2202之SMA線保持處於相等電力以充當用於差動地推動SMA線2218a、2218b以致使傾斜運動之一支點。反轉施加至SMA線之電力信號,例如將相等電力施加至第二帶扣致動器2202之SMA線及將差分電力用於第二帶扣致動器2204之左SMA線2218a及右SMA線2218b導致透鏡托架2206在另一方向之一傾斜。此提供使諸如一透鏡托架之一物件在任一運動軸上傾斜之能力,或可解諧透鏡與感測器之間的任何傾斜以獲得良好動態傾斜,其導致跨所有像素之更好圖片品質。The embodiment of the SMA actuator containing two buckle actuators eliminates the need to have a return spring. When using SMA wire resistance for position feedback, the use of two buckle actuators can improve/reduce hysteresis. Compared with the SMA actuator that includes a return spring, the reaction force SMA actuator that includes two buckle actuators assists in more accurate position control due to lower hysteresis. For some embodiments, such as the embodiment shown in FIG. 22, the SMA actuator including two buckle actuators 2202, 2204 uses differential power to transfer the left SMA wire 2218a of each buckle actuator 2202, 2204 And right SMA wire 2218b provides 2-axis tilt. For example, a left SMA wire 2218a is activated with a higher power than a right SMA wire 2218b. This causes the left side of the lens holder 2206 to move down and the right side to move up (tilt). For some embodiments, the SMA wires of the first buckle actuator 2202 are kept at equal power to serve as a fulcrum for differentially pushing the SMA wires 2218a, 2218b to cause tilting motion. Reverse the power signal applied to the SMA wire, such as applying equal power to the SMA wire of the second buckle actuator 2202 and applying differential power to the left SMA wire 2218a and right SMA wire of the second buckle actuator 2204 2218b causes the lens holder 2206 to tilt in one of the other directions. This provides the ability to tilt an object such as a lens holder on any axis of motion, or can detune any tilt between the lens and the sensor to obtain a good dynamic tilt, which results in better picture quality across all pixels .

圖23繪示根據一實施例之包含兩個帶扣致動器及一耦接器之一SMA致動器。SMA致動器包含兩個帶扣致動器,諸如本文中所描述之帶扣致動器。一第一帶扣致動器2302經組態以使用諸如一耦接器環2305之一耦接器與一第二帶扣致動器2304耦接。帶扣致動器2302、2304相對於彼此配置使得第一帶扣致動器2302之吊床部分2308自第二帶扣致動器2304之吊床部分2309旋轉約90度。用於移動之一有效負載(諸如一透鏡或透鏡總成)經附接至經組態以安置於第一帶扣致動器2302之一滑動基座上之一透鏡托架2306。FIG. 23 shows an SMA actuator including two buckle actuators and a coupler according to an embodiment. The SMA actuator includes two buckle actuators, such as the buckle actuator described herein. A first buckle actuator 2302 is configured to couple with a second buckle actuator 2304 using a coupler such as a coupler ring 2305. The buckle actuators 2302, 2304 are arranged relative to each other such that the hammock portion 2308 of the first buckle actuator 2302 rotates about 90 degrees from the hammock portion 2309 of the second buckle actuator 2304. A payload for moving (such as a lens or lens assembly) is attached to a lens carrier 2306 configured to be placed on a sliding base of the first buckle actuator 2302.

針對各項實施例,可將相等電力施加至第一帶扣致動器2302及第二帶扣致動器2304之SMA線。此可導致最大化SMA致動器在正z方向之z衝程。針對一些實施例,SMA致動器之衝程可具有等於或大於包含兩個帶扣致動器之其他SMA致動器之衝程之兩倍之一z衝程。針對一些實施例,當自SMA致動器移除電力信號時,可新增一額外彈簧以推抵兩個帶扣以輔助向下回推致動器總成及有效負載。可將相同且相反之電力信號施加至第一帶扣致動器2302及第二帶扣致動器2304的SMA線。此使SMA致動器能夠藉由一帶扣致動器在正z軸方向移動且藉由一帶扣致動器在負z方向移動,其實現SMA致動器之位置之準確控制。此外,可將相等且相反之電力信號(差分電力信號)施加至第一帶扣致動器2302及第二帶扣致動器2304之左及右SMA線,以使諸如一透鏡托架2306之一物件在兩個軸之至少一者上傾斜。For various embodiments, equal power can be applied to the SMA wires of the first buckle actuator 2302 and the second buckle actuator 2304. This can result in maximizing the z-stroke of the SMA actuator in the positive z direction. For some embodiments, the stroke of the SMA actuator may have a z-stroke equal to or greater than twice the stroke of other SMA actuators including two buckle actuators. For some embodiments, when the power signal is removed from the SMA actuator, an additional spring can be added to push against the two buckles to assist in pushing back the actuator assembly and the effective load. The same and opposite power signals can be applied to the SMA wires of the first buckle actuator 2302 and the second buckle actuator 2304. This enables the SMA actuator to move in the positive z-axis direction by a buckle actuator and move in the negative z-direction by a buckle actuator, which realizes accurate control of the position of the SMA actuator. In addition, equal and opposite power signals (differential power signals) can be applied to the left and right SMA wires of the first buckle actuator 2302 and the second buckle actuator 2304, so as to make a lens holder 2306 An object is tilted on at least one of two axes.

包含兩個帶扣致動器及一耦接器之SMA致動器(諸如圖23中所繪示之SMA致動器)之實施例可與一額外帶扣致動器及帶扣致動器對耦接以達成大於單個SMA致動器之衝程之一所欲衝程。An SMA actuator including two buckle actuators and a coupler (such as the SMA actuator shown in FIG. 23) can be combined with an additional buckle actuator and buckle actuator Coupled to achieve a desired stroke greater than the stroke of a single SMA actuator.

圖24繪示根據一實施例之包含一SMA致動器之一SMA系統的一分解圖,該SMA致動器包含具有一層壓吊床之一帶扣致動器。如本文中所描述,針對一些實施例,SMA系統經組態以結合一或多個相機鏡頭元件一起用作一自動聚焦驅動器。如圖24中所繪示,SMA系統包含一復位彈簧2403,復位彈簧2403根據各項實施例經組態以當SMA線2408中之張力隨著撤銷致動SMA線而降低時,在z方向之相反方向移動一透鏡托架2406。針對一些實施例,SMA系統包含一殼體2409,殼體2409經組態以接納復位彈簧2403且作用於一滑動軸承以在z衝程方向引導透鏡托架。殼體2409亦經組態以安置於帶扣致動器2402上。帶扣致動器2402包含類似於本文中所描述之滑動基座之一滑動基座2401。帶扣致動器2402包含與一吊床部分(諸如由一層壓板形成之一層壓吊床2406)耦接之帶扣臂2404。帶扣致動器2402亦包含一SMA線附接結構,諸如一層壓形成壓接物連接件2412。24 shows an exploded view of an SMA system including an SMA actuator including a buckle actuator having a laminated hammock according to an embodiment. As described herein, for some embodiments, the SMA system is configured to incorporate one or more camera lens elements for use as an autofocus driver. As shown in Figure 24, the SMA system includes a return spring 2403. The return spring 2403 is configured according to various embodiments so that when the tension in the SMA wire 2408 decreases as the actuation of the SMA wire is deactivated, in the z direction A lens holder 2406 is moved in the opposite direction. For some embodiments, the SMA system includes a housing 2409 configured to receive a return spring 2403 and act on a sliding bearing to guide the lens holder in the z-stroke direction. The housing 2409 is also configured to be placed on the buckle actuator 2402. The buckle actuator 2402 includes a sliding base 2401 similar to the sliding base described herein. The buckle actuator 2402 includes a buckle arm 2404 coupled to a hammock portion, such as a laminated hammock 2406 formed of a laminate. The buckle actuator 2402 also includes an SMA wire attachment structure, such as a laminated forming crimp connector 2412.

如圖24中所繪示,滑動基座2401經安置於一可選適配器板2414上。該適配器板經組態以使SMA系統或帶扣致動器2402與另一系統(諸如一OIS、額外SMA系統或其他組件)配合。圖25繪示根據一實施例之包含一SMA致動器之一SMA系統2501,該SMA致動器包含具有一層壓吊床之一帶扣致動器2402。As shown in FIG. 24, the sliding base 2401 is mounted on an optional adapter plate 2414. The adapter plate is configured to mate the SMA system or buckle actuator 2402 with another system, such as an OIS, additional SMA system, or other components. FIG. 25 illustrates an SMA system 2501 including an SMA actuator including a buckle actuator 2402 having a laminated hammock according to an embodiment.

圖26繪示根據一實施例之包含一層壓吊床之一帶扣致動器。帶扣致動器2402包含帶扣臂2404。帶扣臂2404經組態以當SMA線2412如本文中所描述般致動及撤銷致動時在z軸上移動。使用層壓板成形壓接物連接件2412將SMA線2408附接至該帶扣致動器。根據圖26中所繪示之實施例,帶扣臂2404透過諸如一層壓吊床2406之一中心部分彼此耦接。根據各項實施例,一層壓吊床2406經組態以撐持由該帶扣致動器所作用之一物件(例如由該帶扣致動器使用包含本文中所描述之技術的技術來移動之一透鏡托架)之一部分。Figure 26 illustrates a buckle actuator including a laminated hammock according to an embodiment. The buckle actuator 2402 includes a buckle arm 2404. The buckle arm 2404 is configured to move on the z-axis when the SMA wire 2412 is actuated and de-actuated as described herein. The SMA wire 2408 is attached to the buckle actuator using a laminate forming crimp connector 2412. According to the embodiment shown in FIG. 26, the buckle arms 2404 are coupled to each other through a central part of a laminated hammock 2406, for example. According to various embodiments, a laminated hammock 2406 is configured to support an object acted by the buckle actuator (for example, one of the objects moved by the buckle actuator using techniques including the techniques described herein) Lens bracket) part.

圖27繪示根據一實施例之一SMA致動器之一層壓吊床。針對一些實施例,層壓吊床2406材料係一低剛性材料因此其不抵抗致動運動。例如,層壓吊床2406係使用安置於一第一聚醯亞胺層上之一銅層與安置於該銅上之一第二聚醯亞胺層形成。針對一些實施例,使用包含此項技術中已知之沈積及蝕刻技術的沈積及蝕刻技術在帶扣臂2404上形成層壓吊床2406。針對其他實施例,層壓吊床2406與帶扣臂2404分離地形成且使用包含焊接、黏合劑及此項技術中已知之其他技術的技術附接至帶扣臂2404。針對各項實施例,在層壓吊床2406上使用膠水或其他黏合劑以確保帶扣臂2404保持於相對於一透鏡托架之一位置。Figure 27 shows a laminated hammock of an SMA actuator according to an embodiment. For some embodiments, the material of the laminated hammock 2406 is a low rigidity material so it does not resist the actuation movement. For example, the laminated hammock 2406 is formed by using a copper layer disposed on a first polyimide layer and a second polyimide layer disposed on the copper. For some embodiments, deposition and etching techniques including deposition and etching techniques known in the art are used to form a laminated hammock 2406 on the buckle arm 2404. For other embodiments, the laminated hammock 2406 is formed separately from the buckle arm 2404 and attached to the buckle arm 2404 using techniques including welding, adhesive, and other techniques known in the art. For various embodiments, glue or other adhesive is used on the laminated hammock 2406 to ensure that the buckle arm 2404 remains in a position relative to a lens holder.

圖28繪示根據一實施例之一SMA致動器之一層壓形成壓接物連接件。層壓形成壓接物連接件2412經組態以將一SMA線2408附接至帶扣致動器且與SMA線2408一起產生一電路接頭。針對各項實施例,層壓形成壓接物連接件2412包含由一絕緣體之一或多個層及形成於一壓接物上之導電層之一或多個層形成之一層壓板。Fig. 28 illustrates a laminate of an SMA actuator according to an embodiment to form a crimp connection piece. The laminated formation crimp connector 2412 is configured to attach an SMA wire 2408 to the buckle actuator and create a circuit joint with the SMA wire 2408. For various embodiments, laminating and forming the crimp connector 2412 includes a laminate formed by one or more layers of an insulator and one or more conductive layers formed on a crimp.

例如,將聚醯亞胺層安置於形成一壓接物2413之不鏽鋼部分之至少一部分上。接著將諸如銅之一導電層安置於聚醯亞胺層上,該聚醯亞胺層與安置於帶扣致動器上之一或多個信號跡線2415電耦接。使壓接物變形以與其中之SMA線接觸亦使SMA線與導電層電接觸。因此,與一或多個信號跡線之導電層用來使用包含本文中所描述之技術的技術將電力信號施加至SMA線。針對一些實施例,在導電層上方之導電層將不與SMA線接觸之區域中形成一第二聚醯亞胺層。針對一些實施例,使用包含此項技術中已知之沈積及蝕刻技術的沈積及蝕刻技術在一壓接物2413上形成層壓形成壓接物連接件2412。針對其他實施例,層壓形成壓接物連接件2412及一或多個電跡線與壓接物2413及帶扣致動器分離地形成且使用包含焊接、黏合劑及此項技術中已知之其他技術附接至壓接物2412及帶扣致動器。For example, a polyimide layer is placed on at least a part of the stainless steel portion forming a crimp 2413. A conductive layer such as copper is then placed on the polyimide layer, which is electrically coupled to one or more signal traces 2415 placed on the buckle actuator. Deformation of the crimping object to contact the SMA wire also makes the SMA wire electrically contact the conductive layer. Therefore, the conductive layer with one or more signal traces is used to apply power signals to the SMA wire using techniques including the techniques described herein. For some embodiments, a second polyimide layer is formed in the area where the conductive layer above the conductive layer will not contact the SMA wire. For some embodiments, a deposition and etching technique including deposition and etching techniques known in the art is used to form a crimp connection 2412 by laminating on a crimp 2413. For other embodiments, the crimping object connector 2412 and one or more electrical traces are formed separately from the crimping object 2413 and the buckle actuator by laminating and forming and including welding, adhesive, and those known in the art Other technologies are attached to the crimp 2412 and buckle actuator.

圖29繪示包含具有一層壓吊床之一帶扣致動器之一SMA致動器。如圖29中所繪示,當施加一電力信號時,SMA線收縮或縮短以在正z軸方向移動帶扣臂及層壓吊床。與一物件接觸之層壓吊床繼而在正z軸方向移動彼物件,諸如一透鏡托架。當電力信號減小或移除時,SMA線延長且在一負z軸方向移動帶扣臂及層壓吊床。Figure 29 shows an SMA actuator including a buckle actuator with a laminated hammock. As shown in Figure 29, when a power signal is applied, the SMA wire shrinks or shortens to move the buckle arm and the laminated hammock in the positive z-axis direction. The laminated hammock in contact with an object then moves that object in the positive z-axis direction, such as a lens holder. When the power signal decreases or is removed, the SMA wire extends and moves the buckle arm and laminated hammock in a negative z-axis direction.

圖30繪示根據一實施例之包含一SMA致動器之一SMA系統的一分解圖,該SMA致動器包含一帶扣致動器。如本文中所描述,針對一些實施例,SMA系統經組態以結合一或多個相機鏡頭元件一起用作一自動聚焦驅動器。如圖30中所繪示,SMA系統包含一復位彈簧3003,復位彈簧3003根據各項實施例經組態以當SMA線3008中之張力隨著撤銷致動該SMA線而降低時在z衝程方向之相反方向移動一透鏡托架3005。針對一些實施例,SMA系統包含安置於復位彈簧3003上之一加強件3000。針對一些實施例,SMA系統包含由兩個部分形成之一殼體3009,該兩個部分經組態以接納復位彈簧3003且作用於一滑動軸承以在z衝程方向引導透鏡托架。殼體3009亦經組態以安置於帶扣致動器3002上。帶扣致動器3002包含類似於本文中所描述之一滑動基座之滑動基座3001,滑動基座3001由兩部分形成。滑動基座3001經分裂以電隔離2側(例如一側係接地,另一側係電源),因為根據一些實施例,電流透過滑動基座3001部分流動至該線。Figure 30 shows an exploded view of an SMA system including an SMA actuator including a buckle actuator according to an embodiment. As described herein, for some embodiments, the SMA system is configured to incorporate one or more camera lens elements for use as an autofocus driver. As shown in Figure 30, the SMA system includes a return spring 3003, which is configured according to various embodiments to move in the z-stroke direction when the tension in the SMA wire 3008 decreases as the SMA wire is deactivated Move a lens holder 3005 in the opposite direction. For some embodiments, the SMA system includes a reinforcement 3000 disposed on the return spring 3003. For some embodiments, the SMA system includes a housing 3009 formed from two parts configured to receive a return spring 3003 and act on a sliding bearing to guide the lens carrier in the z-stroke direction. The housing 3009 is also configured to be placed on the buckle actuator 3002. The buckle actuator 3002 includes a sliding base 3001 similar to a sliding base described herein. The sliding base 3001 is formed of two parts. The sliding base 3001 is split to electrically isolate the two sides (for example, one side is grounded, and the other side is a power source), because according to some embodiments, current flows through the sliding base 3001 to the line.

帶扣致動器3002包含帶扣臂3004。各對帶扣致動器3002經形成於帶扣致動器3002之一單獨部分上。帶扣致動器3002亦包含一SMA線附接結構,諸如一電阻焊線壓接物3012。SMA系統視情況包含用於將SMA線3008電耦接至一或多個控制電路之一撓性電路3020。The buckle actuator 3002 includes a buckle arm 3004. Each pair of buckle actuator 3002 is formed on a separate part of the buckle actuator 3002. The buckle actuator 3002 also includes an SMA wire attachment structure, such as a resistance welding wire crimp 3012. The SMA system optionally includes a flexible circuit 3020 for electrically coupling the SMA wire 3008 to one or more control circuits.

如圖30中所繪示,滑動基座3001經安置於一可選適配器板3014上。該適配器板經組態以使SMA系統或帶扣致動器3002與另一系統(諸如一OIS、額外SMA系統或其他組件)配合。圖31繪示根據一實施例之包含一SMA致動器之一SMA系統3101,該SMA致動器包含一帶扣致動器3002。As shown in FIG. 30, the sliding base 3001 is mounted on an optional adapter plate 3014. The adapter plate is configured to mate the SMA system or buckle actuator 3002 with another system (such as an OIS, additional SMA system, or other components). FIG. 31 shows an SMA system 3101 including an SMA actuator including a buckle actuator 3002 according to an embodiment.

圖32繪示根據一實施例之包含一帶扣致動器之一SMA致動器。帶扣致動器3002包含帶扣臂3004。帶扣臂3004經組態以當SMA線3012如本文中所描述般致動及撤銷致動時在z軸上移動。SMA線2408經附接至電阻焊線壓接物3012。根據圖32中所繪示之實施例,帶扣臂3004經組態以與諸如一透鏡托架之一物件配合,而無需使用一雙軛捕獲接頭之一中心部分。Figure 32 shows an SMA actuator including a buckle actuator according to an embodiment. The buckle actuator 3002 includes a buckle arm 3004. The buckle arm 3004 is configured to move on the z-axis when the SMA wire 3012 is actuated and de-actuated as described herein. The SMA wire 2408 is attached to the resistance welding wire crimp 3012. According to the embodiment depicted in FIG. 32, the buckle arm 3004 is configured to cooperate with an object such as a lens holder without using a double yoke to capture a central part of the joint.

圖33繪示根據一實施例之一SMA致動器之一對帶扣臂之一雙軛捕獲接頭。圖33亦繪示用來將可選撓性電路附接至滑動基座之電鍍焊盤。針對一些實施例,電鍍焊盤係使用金形成。圖34繪示根據一實施例之一SMA致動器之一電阻焊壓接物,該SMA致動器用來將一SMA線附接至帶扣致動器。針對一些實施例,膠水或黏合劑亦可經放置於焊之頂部上以輔助機械強度且在操作及衝擊加載期間起到緩解疲勞應變消除(fatigue strain relief)之作用。Figure 33 illustrates a dual yoke capture joint of an SMA actuator to a buckle arm according to an embodiment. Figure 33 also shows the electroplated pads used to attach the optional flex circuit to the sliding base. For some embodiments, the plating pads are formed using gold. FIG. 34 illustrates a resistance welding crimp of an SMA actuator according to an embodiment, the SMA actuator is used to attach an SMA wire to the buckle actuator. For some embodiments, glue or adhesive can also be placed on the top of the weld to assist in mechanical strength and to relieve fatigue strain relief during operation and impact loading.

圖35繪示包含具有一雙軛捕獲接頭之一帶扣致動器的一SMA致動器。如圖35中所繪示,當施加一電力信號時,SMA線收縮或縮短以在正z方向移動帶扣臂。雙軛捕獲接頭與一物件接觸,繼而在正z方向移動彼物件,諸如一透鏡托架。當電力信號減小或消除時,SMA線延長且在一負z軸方向移動帶扣臂。該軛捕獲特徵確保帶扣臂相對於透鏡托架保持於正確位置。Figure 35 shows an SMA actuator including a buckle actuator with a dual yoke capture joint. As shown in Figure 35, when a power signal is applied, the SMA wire contracts or shortens to move the buckle arm in the positive z direction. The double yoke capture joint contacts an object, and then moves that object in the positive z direction, such as a lens holder. When the power signal decreases or disappears, the SMA wire extends and moves the buckle arm in a negative z-axis direction. This yoke capture feature ensures that the buckle arm remains in the correct position relative to the lens holder.

圖36繪示根據一實施例之一SMA雙壓電晶片液體透鏡。SMA雙壓電晶片液體透鏡3501包含一液體透鏡子總成3502、一殼體3504及具有SMA致動器3506之一電路。針對各項實施例,SMA致動器包含4個雙壓電晶片致動器3508,諸如本文中所描述之實施例。雙壓電晶片致動器3508經組態以推動定位於一撓性隔膜3512上之一成形環3510。該環纏繞隔膜3512/液體3514,從而改變通過隔膜3512/液體3514之光路徑。一體容納環3516用來容納隔膜3512與透鏡3518之間的液體3514。來自雙壓電晶片致動器之相等力改變影像在Z方向之焦點(法向於透鏡),此允許其用作一自動聚焦裝置。根據一些實施例,來自雙壓電晶片致動器3508之差分力可使光線在X、Y軸方向移動,此允許其用作一光學影像穩定器。藉由對各致動器進行恰當控制,可同時達成OIS功能及AF功能兩者。針對一些實施例,使用3個致動器。具有SMA致動器之電路3506包含用於控制信號致動SMA致動器之一或多個接觸件3520。根據包含4個SMA致動器之一些實施例,具有SMA致動器之電路3506包含用於各SMA致動器之4個電力電路控制接觸件及一共同復位接觸件。Fig. 36 shows an SMA bimorph liquid lens according to an embodiment. The SMA bimorph liquid lens 3501 includes a liquid lens subassembly 3502, a housing 3504, and a circuit with an SMA actuator 3506. For various embodiments, the SMA actuator includes 4 bimorph actuators 3508, such as the embodiments described herein. The bimorph actuator 3508 is configured to push a shaped ring 3510 positioned on a flexible diaphragm 3512. The ring wraps around the diaphragm 3512/liquid 3514, thereby changing the light path through the diaphragm 3512/liquid 3514. The integral containment ring 3516 is used to contain the liquid 3514 between the diaphragm 3512 and the lens 3518. The equal force from the bimorph actuator changes the focus of the image in the Z direction (normal to the lens), which allows it to be used as an autofocus device. According to some embodiments, the differential force from the bimorph actuator 3508 can move the light in the X and Y axis directions, which allows it to be used as an optical image stabilizer. By appropriately controlling each actuator, both OIS function and AF function can be achieved at the same time. For some embodiments, 3 actuators are used. The circuit 3506 with an SMA actuator includes a control signal to activate one or more contacts 3520 of the SMA actuator. According to some embodiments that include 4 SMA actuators, the circuit 3506 with SMA actuators includes 4 power circuit control contacts for each SMA actuator and a common reset contact.

圖37繪示根據一實施例之一透視SMA雙壓電晶片液體透鏡。圖38繪示根據一實施例之SMA雙壓電晶片液體透鏡的一截面及一仰視圖。Fig. 37 shows a see-through SMA bimorph liquid lens according to an embodiment. FIG. 38 shows a cross-section and a bottom view of an SMA piezoelectric bimorph liquid lens according to an embodiment.

圖39繪示根據一實施例之包含具有雙壓電晶片致動器之一SMA致動器3902之一SMA系統。SMA致動器3902包含使用本文中所描述之技術之4個雙壓電晶片致動器。該等雙壓電晶片致動器之兩者經組態為正z衝程致動器3904且另兩者經組態為負z衝程致動器3906,如圖40中所繪示,圖40繪示根據一實施例之具有雙壓電晶片致動器之SMA致動器3902。相對致動器3906、3904經組態以在整個衝程範圍內控制兩個方向之運動。此提供調諧控制碼以補償傾斜之能力。針對各項實施例,附接至組件頂部之兩個SMA線3908實現正z衝程位移。附接至一組件底部之兩個SMA線實現負z衝程位移。針對一些實施例,使用用來鍵合諸如一透鏡支架3910之一物件之突片附接各雙壓電晶片致動器至該物件。SMA系統包含一頂部彈簧3912,頂部彈簧3912經組態以提供透鏡托架3910在垂直於z衝程軸之軸上(例如,在x軸及y軸之方向)之穩定性。此外,一頂部間隔件3914經配置以安置於頂部彈簧3912與SMA致動器3902之間。一底部間隔件3916經配置於SMA致動器3902與一底部彈簧3918之間。底部彈簧3918經組態以提供透鏡支架3910在垂直於z衝程軸之軸上(例如在x軸及y軸之方向)之穩定性。底部彈簧3918經組態以安置於一基座3920上,諸如本文中所描述之基座。FIG. 39 shows an SMA system including an SMA actuator 3902 with a bimorph actuator according to an embodiment. SMA actuator 3902 includes 4 piezoelectric bimorph actuators using the technology described herein. Two of the bimorph actuators are configured as positive z-stroke actuators 3904 and the other two are configured as negative z-stroke actuators 3906, as shown in FIG. 40, which is depicted in FIG. 40 An SMA actuator 3902 with a bimorph actuator according to an embodiment is shown. The relative actuators 3906, 3904 are configured to control movement in two directions over the entire stroke range. This provides the ability to tune the control code to compensate for tilt. For each embodiment, the two SMA wires 3908 attached to the top of the component achieve a positive z-stroke displacement. The two SMA wires attached to the bottom of a component achieve negative z-stroke displacement. For some embodiments, tabs used to bond an object such as a lens holder 3910 are used to attach each bimorph actuator to the object. The SMA system includes a top spring 3912 that is configured to provide stability of the lens holder 3910 on an axis perpendicular to the z-stroke axis (for example, in the direction of the x-axis and y-axis). In addition, a top spacer 3914 is configured to be placed between the top spring 3912 and the SMA actuator 3902. A bottom spacer 3916 is disposed between the SMA actuator 3902 and a bottom spring 3918. The bottom spring 3918 is configured to provide stability of the lens holder 3910 on an axis perpendicular to the z-stroke axis (for example, in the direction of the x-axis and y-axis). The bottom spring 3918 is configured to rest on a base 3920, such as the base described herein.

圖41繪示一雙壓電晶片致動器之長度4102及用於一SMA線4206使線長度延伸超出雙壓電晶片致動器之一鍵合焊盤4104之位置。長於雙壓電晶片致動器之線用來增加衝程及力。因此,SMA線4206超出雙壓電晶片致動器4103之延伸長度4108用來設定雙壓電晶片致動器4103之衝程及力。Fig. 41 shows the length 4102 of a piezoelectric bimorph actuator and the position of a bonding pad 4104 for an SMA wire 4206 to extend the wire length beyond the piezoelectric bimorph actuator. Lines longer than piezoelectric bimorph actuators are used to increase stroke and force. Therefore, the extension length 4108 of the SMA wire 4206 beyond the piezoelectric bimorph actuator 4103 is used to set the stroke and force of the bimorph actuator 4103.

圖42繪示根據一實施例之包含一SMA雙壓電晶片致動器4202之一SMA系統的一分解圖。根據各項實施例,SMA系統經組態以使用單獨金屬材料及非導電黏合劑來產生一或多個電路以獨立地為SMA線供電。一些實施例不具有AF大小影響且包含4個雙壓電晶片致動器,諸如本文中所描述之雙壓電晶片致動器。該等雙壓電晶片致動器之兩者經組態為正z衝程致動器且另兩者經組態為負z衝程致動器。圖43繪示根據一實施例之SMA致動器之一子區段的一分解圖。該子區段包含一負致動器信號連接件4302、具有雙壓電晶片致動器4306的一基座4304。負致動器信號連接件4302包含用於使用包含本文中所描述之技術的技術連接一雙壓電晶片致動器4306之一SMA線之一線鍵合焊盤4308。使用一黏合劑層4310將負致動器信號連接件4302貼附至基座4304。該子區段亦包含具有一線鍵合焊盤4316之一正致動器信號連接件4314,正致動器信號連接件4314用於使用包含本文中所描述之技術的技術連接一雙壓電晶片致動器4306之一SMA線4312。使用一黏合劑層4318將正致動器信號連接件4314貼附至基座4304。基座4304、負致動器信號連接件4302及正致動器信號連接件4314之各者由金屬形成,例如不鏽鋼。基座4304、負致動器信號連接件4302及正致動器信號連接件4314之各者上之連接焊盤4322經組態以電耦接控制信號及接地以使用包含本文中所描述之技術的技術致動雙壓電晶片致動器4306。針對一些實施例,連接焊盤4322係鍍金的。圖44繪示根據一實施例之SMA致動器之一子區段。針對一些實施例,在不鏽鋼層上形成鍍金焊盤以進行焊料鍵合或其他已知電端接方法。此外,經形成線鍵合焊盤用於信號接頭以電耦接用於電力信號之SMA線。FIG. 42 shows an exploded view of an SMA system including an SMA bimorph actuator 4202 according to an embodiment. According to various embodiments, the SMA system is configured to use separate metal materials and non-conductive adhesives to create one or more circuits to independently power the SMA wires. Some embodiments have no AF size effect and include 4 bimorph actuators, such as the bimorph actuators described herein. Two of the bimorph actuators are configured as positive z-stroke actuators and the other two are configured as negative z-stroke actuators. Figure 43 shows an exploded view of a subsection of an SMA actuator according to an embodiment. This subsection includes a negative actuator signal connector 4302, a base 4304 with a bimorph actuator 4306. The negative actuator signal connector 4302 includes a wire bond pad 4308 for connecting an SMA wire to a bimorph actuator 4306 using techniques including the techniques described herein. An adhesive layer 4310 is used to attach the negative actuator signal connector 4302 to the base 4304. This subsection also includes a positive actuator signal connector 4314 with a wire bond pad 4316, which is used to connect a bimorph using a technique including the techniques described herein One of the actuators 4306 is an SMA wire 4312. An adhesive layer 4318 is used to attach the positive actuator signal connector 4314 to the base 4304. Each of the base 4304, the negative actuator signal connector 4302, and the positive actuator signal connector 4314 is formed of metal, such as stainless steel. The connection pads 4322 on each of the base 4304, the negative actuator signal connector 4302, and the positive actuator signal connector 4314 are configured to electrically couple the control signal and ground to use the technology including the techniques described herein The technology actuates the bimorph actuator 4306. For some embodiments, the connection pads 4322 are gold-plated. Figure 44 shows a subsection of an SMA actuator according to an embodiment. For some embodiments, gold-plated pads are formed on the stainless steel layer for solder bonding or other known electrical termination methods. In addition, formed wire bonding pads are used for signal connectors to electrically couple SMA wires for power signals.

圖45繪示根據一實施例之一5軸感測器移位系統。5軸感測器移位系統經組態以相對於一或多個透鏡在5軸上移動一物件,諸如一影像感測器。此包含X/Y/Z軸平移及縱傾/側滾傾斜。視情況,該系統經組態以僅使用4軸,且X/Y軸平移及縱傾/側滾傾斜連同頂部上之一單獨AF一起進行Z運動。其他實施例包含經組態以相對於一影像感測器移動一或多個透鏡之5軸感測器移位系統。針對一些實施例,靜態透鏡堆疊經安裝於頂蓋上且插入ID內部(不接觸內部之橙色移動托架)。Fig. 45 shows a 5-axis sensor displacement system according to an embodiment. The 5-axis sensor shift system is configured to move an object, such as an image sensor, in 5-axis relative to one or more lenses. This includes X/Y/Z axis translation and trim/roll tilt. Optionally, the system is configured to use only 4 axes, and X/Y axis translation and pitch/roll tilt together with a separate AF on the top perform Z movement. Other embodiments include a 5-axis sensor shift system configured to move one or more lenses relative to an image sensor. For some embodiments, the static lens stack is installed on the top cover and inserted into the ID (not touching the orange moving bracket inside).

圖46繪示根據一實施例之一5軸感測器移位系統的一分解圖。5軸感測器移位系統包含2個電路組件:一撓性感測器電路4602、雙壓電晶片致動器電路4604;及使用包含本文中所描述之技術的技術建置至雙壓電晶片電路組件上之8至12個雙壓電晶片致動器4606。5軸感測器移位系統包含經組態以固持一或多個透鏡之移動托架4608及一外殼4610。根據一實施例,雙壓電晶片致動器電路4604包含8至12個SMA致動器,諸如本文中所描述之SMA致動器。SMA致動器經組態以在類似於本文中所描述之其他5軸系統之5軸上移動移動托架4608,諸如在x方向、在y方向、在z方向、縱傾及側滾。Fig. 46 shows an exploded view of a 5-axis sensor displacement system according to an embodiment. The 5-axis sensor shift system includes 2 circuit components: a flexure sensor circuit 4602, a bimorph actuator circuit 4604; and a technology including the technology described in this article is built to the bimorph 8 to 12 bimorph actuators 4606 on the circuit assembly. The 5-axis sensor displacement system includes a moving bracket 4608 and a housing 4610 configured to hold one or more lenses. According to an embodiment, the bimorph actuator circuit 4604 includes 8 to 12 SMA actuators, such as the SMA actuators described herein. The SMA actuator is configured to move the moving carriage 4608 on 5-axis similar to other 5-axis systems described herein, such as in the x direction, in the y direction, in the z direction, pitch, and roll.

圖47繪示根據一實施例之包含整合至此電路中以進行所有運動之雙壓電晶片致動器之一SMA致動器。一SMA致動器之實施例可包含8至12個雙壓電晶片致動器4606。然而,其他實施例可包含更多或更少雙壓電晶片致動器4606。圖48繪示根據一實施例之包含整合至此電路中以進行所有運動之雙壓電晶片致動器之一SMA致動器4802,SMA致動器4802部分地形成為配備於一對應外殼4804內部。圖49繪示根據一實施例之一5軸感測器移位系統的一截面。FIG. 47 shows an SMA actuator including a bimorph actuator integrated into the circuit for all movements according to an embodiment. An SMA actuator embodiment may include 8 to 12 bimorph actuators 4606. However, other embodiments may include more or fewer bimorph actuators 4606. FIG. 48 shows an SMA actuator 4802 including a bimorph actuator integrated into the circuit to perform all movements according to an embodiment. The SMA actuator 4802 is partially formed to be equipped inside a corresponding housing 4804. FIG. 49 shows a cross-section of a 5-axis sensor displacement system according to an embodiment.

圖50繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器5002。SMA致動器5002經組態以使用4側安裝SMA雙壓電晶片致動器5004來在x及y方向移動一影像感測器、透鏡或其他各種有效負載。圖51繪示包含在不同的x及y位置中移動一影像感測器、透鏡或其他各種有效負載之雙壓電晶片致動器之一SMA致動器的一俯視圖。FIG. 50 shows an SMA actuator 5002 including a piezoelectric bimorph actuator according to an embodiment. The SMA actuator 5002 is configured to use a 4-side mounted SMA bimorph actuator 5004 to move an image sensor, lens, or various other payloads in the x and y directions. FIG. 51 shows a top view of an SMA actuator including a bimorph actuator that moves an image sensor, lens, or various other payloads in different x and y positions.

圖52繪示根據一實施例之包含經組態為一盒式雙壓電晶片自動聚焦裝置之雙壓電晶片致動器5202之一SMA致動器。四個頂部及底部安裝SMA雙壓電晶片致動器(諸如本文中所描述之SMA雙壓電晶片致動器)經組態以一起移動以在z衝程方向產生移動以進行自動聚焦運動。圖53繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器,且兩個頂部安裝雙壓電晶片致動器5302經組態以下推一或多個透鏡。圖54繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器,且兩個底部安裝雙壓電晶片致動器5402經組態以上推一或多個透鏡。圖55繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器以展示四個頂部及底部安裝SMA雙壓電晶片致動器5502 (諸如本文中所描述之SMA雙壓電晶片致動器)用來移動一或多個透鏡以產生傾斜運動。FIG. 52 shows an SMA actuator including a bimorph actuator 5202 configured as a box-type bimorph autofocus device according to an embodiment. The four top and bottom mounted SMA bimorph actuators (such as the SMA bimorph actuators described herein) are configured to move together to produce movement in the z-stroke direction for autofocus movement. FIG. 53 shows an SMA actuator including a bimorph actuator according to an embodiment, and two top-mounted bimorph actuators 5302 are configured to push down one or more lenses. FIG. 54 shows an SMA actuator including a bimorph actuator according to an embodiment, and two bottom-mounted bimorph actuators 5402 are configured to push up one or more lenses. Figure 55 illustrates an SMA actuator including a bimorph actuator according to an embodiment to show four top and bottom mounted SMA bimorph actuators 5502 (such as the SMA bimorph actuator described herein) Electro-chip actuators are used to move one or more lenses to generate tilting motion.

圖56繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含經組態為一雙軸透鏡移位OIS之雙壓電晶片致動器。針對一些實施例,雙軸透鏡移位OIS經組態以在X/Y軸上移動一透鏡。針對一些實施例,Z軸移動來自一單獨AF,諸如本文中所描述之AF。4個雙壓電晶片致動器推動自動聚焦裝置之側以進行OIS運動。圖57繪示根據一實施例之包含一SMA致動器5802之SMA系統的一分解圖,SMA致動器5802包含經組態為一雙軸透鏡移位OIS之雙壓電晶片致動器5806。圖58繪示根據一實施例之包含一SMA致動器5802之SMA系統的一截面,SMA致動器5802包含經組態為一雙軸透鏡移位OIS之雙壓電晶片致動器5806。圖59繪示根據一實施例之用於一SMA系統中之盒式雙壓電晶片致動器5802,盒式雙壓電晶片致動器5802經組態為在其經成形為配備於該系統中之前被製造之一雙軸透鏡移位OIS。此一系統可經組態為具有高OIS衝程OIS (例如,+/-200 um或更高)。此外,此等實施例經組態以使用諸如POM滑動軸承之4個滑動軸承而具有一寬運動範圍及良好OIS動態傾斜。該等實施例經組態以容易地與AF設計(例如,VCM或SMA)整合在一起。Figure 56 shows an SMA system including an SMA actuator including a bimorph actuator configured as a biaxial lens shift OIS, according to an embodiment. For some embodiments, the biaxial lens shift OIS is configured to move a lens on the X/Y axis. For some embodiments, the Z-axis movement comes from a separate AF, such as the AF described herein. Four bimorph actuators push the side of the auto focus device to perform OIS movement. FIG. 57 shows an exploded view of an SMA system including an SMA actuator 5802 according to an embodiment. The SMA actuator 5802 includes a bimorph actuator 5806 configured as a biaxial lens shift OIS . Figure 58 shows a cross-section of an SMA system including an SMA actuator 5802, which includes a bimorph actuator 5806 configured as a biaxial lens shift OIS, according to an embodiment. FIG. 59 shows a box-type bimorph actuator 5802 used in an SMA system according to an embodiment. The box-type bimorph actuator 5802 is configured to be equipped in the system when it is formed One of the biaxial lens shifted OIS that was manufactured before. This system can be configured to have a high OIS stroke OIS (for example, +/-200 um or higher). In addition, these embodiments are configured to use 4 sliding bearings such as POM sliding bearings to have a wide range of motion and good OIS dynamic tilt. These embodiments are configured to easily integrate with AF designs (e.g., VCM or SMA).

圖60繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含經組態為一5軸透鏡移位OIS及自動聚焦裝置之雙壓電晶片致動器。針對一些實施例,5軸透鏡移位OIS及自動聚焦裝置經組態以在X/Y/Z軸上移動一透鏡。針對一些實施例,縱傾及側傾(yaw)軸運動用於動態傾斜調諧能力。使用本文中所描述之技術,8個雙壓電晶片致動器用來提供針對自動聚焦裝置及OIS的運動。圖61繪示根據一實施例之包含一SMA致動器6202之SMA系統的一分解圖,SMA致動器6202包含經組態為一5軸透鏡移位OIS及自動聚焦裝置之雙壓電晶片致動器6204。圖62繪示根據一實施例之包含一SMA致動器6202之SMA系統的一截面,SMA致動器6202包含經組態為一5軸透鏡移位OIS及自動聚焦裝置之雙壓電晶片致動器6204。圖63繪示根據一實施例之用於一SMA系統中之盒式雙壓電晶片致動器6202,盒式雙壓電晶片致動器6202經組態為在其經成形為配備於該系統中之前被製造之一5軸透鏡移位OIS及自動聚焦裝置。此一系統可經組態為具有高OIS衝程OIS (例如,+/-200 um或更高)及一高自動聚焦衝程(例如,400 um或更高)。此外,此等實施例能夠解諧任何傾斜且消除對一單獨自動聚焦總成之需要。FIG. 60 shows an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator configured as a 5-axis lens shift OIS and autofocus device. For some embodiments, the 5-axis lens shift OIS and autofocus device are configured to move a lens on the X/Y/Z axis. For some embodiments, pitch and yaw axis motions are used for dynamic tilt tuning capabilities. Using the technology described in this article, 8 bimorph actuators are used to provide movement for the autofocus device and OIS. Fig. 61 shows an exploded view of an SMA system including an SMA actuator 6202 according to an embodiment. The SMA actuator 6202 includes a bimorph configured as a 5-axis lens shift OIS and autofocus device Actuator 6204. FIG. 62 shows a cross-section of an SMA system including an SMA actuator 6202 according to an embodiment. The SMA actuator 6202 includes a bimorph actuator configured as a 5-axis lens shift OIS and autofocus device器6204. FIG. 63 shows a box-type bimorph actuator 6202 used in an SMA system according to an embodiment. The box-type bimorph actuator 6202 is configured to be equipped in the system when it is formed A 5-axis lens shift OIS and auto-focus device was manufactured before. This system can be configured to have a high OIS stroke OIS (for example, +/-200 um or higher) and a high autofocus stroke (for example, 400 um or higher). In addition, these embodiments can detune any tilt and eliminate the need for a separate autofocus assembly.

圖64繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含經組態為一外推盒之雙壓電晶片致動器。針對一些實施例,雙壓電晶片致動器總成經組態以纏繞於諸如一透鏡托架之一物件周圍。由於電路總成隨透鏡托架一起移動,因此一撓性部分之X/Y/Z剛性較低。該電路之尾部焊盤係靜態的。外推盒可經組態以用於4個或8個雙壓電晶片致動器兩者。因此,外推盒可經組態為位於OIS側上且在X及Y軸上移動之一4雙壓電晶片致動器。外推盒可經組態為在頂部及底部上之一4雙壓電晶片致動器以在z軸上移動時自動聚焦。外推盒可經組態為位於OIS及自動聚焦裝置之頂部、底部及側上且在x、y及z軸上移動及能夠進行3軸傾斜(縱傾/側滾/側傾)之一8雙壓電晶片致動器。圖65繪示根據一實施例之包含一SMA致動器6602之一SMA系統的一分解圖,SMA致動器6602包含經組態為一外推盒之雙壓電晶片致動器6604。因此,SMA致動器經組態使得雙壓電晶片致動器作用於外殼6504上以使用本文中所描述之技術移動透鏡托架6506。圖66繪示根據一實施例之包含一SMA致動器6602之一SMA系統,SMA致動器6602包含經組態以部分地成形為接納一透鏡托架6604之一外推盒之雙壓電晶片致動器。圖67繪示根據一實施例之包含一SMA致動器6602之一SMA系統,SMA致動器6602包含經組態為在其經成形為配備於該系統中之前被製造之一外推盒之雙壓電晶片致動器6604。Figure 64 illustrates an SMA system including an SMA actuator including a bimorph actuator configured as an extrapolation box, according to an embodiment. For some embodiments, the bimorph actuator assembly is configured to wrap around an object such as a lens holder. Since the circuit assembly moves with the lens holder, the X/Y/Z rigidity of a flexible part is low. The tail pad of the circuit is static. The extrapolation box can be configured for use with both 4 or 8 bimorph actuators. Therefore, the extrapolation box can be configured as a 4-bimorph actuator located on the OIS side and moving on the X and Y axis. The extrapolation box can be configured as a 4 bimorph actuator on the top and bottom to automatically focus when moving on the z-axis. The extrapolation box can be configured to be located on the top, bottom and sides of the OIS and autofocus device and move on the x, y, and z axes and be able to perform one of 3 axis tilts (pitch/roll/tilt) 8 Bimorph actuator. 65 shows an exploded view of an SMA system including an SMA actuator 6602, according to an embodiment, the SMA actuator 6602 including a bimorph actuator 6604 configured as an extrapolation box. Therefore, the SMA actuator is configured such that the bimorph actuator acts on the housing 6504 to move the lens holder 6506 using the techniques described herein. Figure 66 shows an SMA system including an SMA actuator 6602, according to an embodiment, the SMA actuator 6602 including a bi-piezo configured to be partially shaped to receive an extrapolation box of a lens holder 6604 Wafer actuator. FIG. 67 shows an SMA system including an SMA actuator 6602 according to an embodiment. The SMA actuator 6602 includes an extrapolation box configured to be manufactured before it is shaped to be equipped in the system Bimorph actuator 6604.

圖68繪示根據一實施例之包含一SMA致動器6802之一SMA系統,SMA致動器6802包含經組態為一3軸感測器移位OIS之雙壓電晶片致動器。針對一些實施例,z軸移動來自一單獨自動聚焦系統。4個雙壓電晶片致動器經組態以使用本文中所描述之技術推動一感測器托架6804之側以提供針對OIS的運動。圖69繪示根據一實施例之包含一SMA致動器6802之SMA的一分解圖,SMA致動器6802包含經組態為一3軸感測器移位OIS之雙壓電晶片致動器。圖70繪示根據一實施例之包含一SMA致動器6802之SMA系統的一截面,SMA致動器6802包含經組態為一3軸感測器移位OIS之雙壓電晶片致動器6806。圖71繪示根據一實施例之用於一SMA系統中之一盒式雙壓電晶片致動器6802組件,該盒式雙壓電晶片致動器6802組件經組態為在其經成形為配備於該系統中之前被製造之一3軸感測器移位OIS。圖72繪示根據一實施例之用於一SMA系統中之一撓性感測器電路,該撓性感測器電路經組態為一3軸感測器移位OIS。此一系統可經組態為具有高OIS衝程OIS (例如,+/-200 um或更高)及一高自動聚焦衝程(例如,400 um或更高)。此外,此等實施例經組態以使用諸如POM滑動軸承之4個滑動軸承而具有一寬雙軸運動範圍及良好OIS動態傾斜。該等實施例經組態以容易地與AF設計(例如,VCM或SMA)整合在一起。Figure 68 shows an SMA system including an SMA actuator 6802, according to an embodiment, which includes a bimorph actuator configured as a 3-axis sensor shift OIS. For some embodiments, the z-axis movement comes from a separate autofocus system. Four piezoelectric bimorph actuators are configured to use the techniques described herein to push the side of a sensor bracket 6804 to provide motion for OIS. FIG. 69 shows an exploded view of an SMA including an SMA actuator 6802 according to an embodiment. The SMA actuator 6802 includes a bimorph actuator configured as a 3-axis sensor shift OIS . FIG. 70 shows a cross-section of an SMA system including an SMA actuator 6802 according to an embodiment. The SMA actuator 6802 includes a bimorph actuator configured as a 3-axis sensor shift OIS 6806. Figure 71 shows a box-type bimorph actuator 6802 assembly used in an SMA system according to an embodiment. The box-type bimorph actuator 6802 assembly is configured to be shaped as Equipped with a 3-axis sensor shifted OIS that was previously manufactured in this system. Fig. 72 shows a flex sensor circuit used in an SMA system according to an embodiment, the flex sensor circuit configured as a 3-axis sensor shift OIS. This system can be configured to have a high OIS stroke OIS (for example, +/-200 um or higher) and a high autofocus stroke (for example, 400 um or higher). In addition, these embodiments are configured to use 4 sliding bearings such as POM sliding bearings to have a wide range of biaxial motion and good OIS dynamic tilt. These embodiments are configured to easily integrate with AF designs (e.g., VCM or SMA).

圖73繪示根據一實施例之包含一SMA致動器7302之一SMA系統,SMA致動器7302包含經組態為一6軸感測器移位OIS及自動聚焦裝置之雙壓電晶片致動器7304。針對一些實施例,6軸感測器移位OIS及自動聚焦裝置經組態以在X/Y/Z/縱傾/側傾/側滾軸上移動一透鏡。針對一些實施例,縱傾及側傾軸運動用於動態傾斜調諧能力。使用本文中所描述之技術,8個雙壓電晶片致動器用來提供針對自動聚焦裝置及OIS的運動。圖74繪示根據一實施例之包含一SMA致動器7402之SMA系統的一分解圖,SMA致動器7402包含經組態為一6軸感測器移位OIS及自動聚焦裝置之雙壓電晶片致動器7404。圖75繪示根據一實施例之包含一SMA致動器之SMA系統的一截面,SMA致動器7402包含經組態為一6軸感測器移位OIS及自動聚焦裝置之雙壓電晶片致動器。圖76繪示根據一實施例之用於一SMA系統中之盒式雙壓電晶片致動器7402,盒式雙壓電晶片致動器7402經組態為在其經成形為配備於該系統中之前被製造之一3軸感測器移位OIS及自動聚焦裝置。圖77繪示根據一實施例之用於一SMA系統中之一撓性感測器電路,該撓性感測器電路經組態為一3軸感測器移位OIS。此一系統可經組態為具有高OIS衝程OIS (例如,+/-200 um或更高)及一高自動聚焦衝程(例如,400 um或更高)。此外,此等實施例能夠解諧任何傾斜且消除對一單獨自動聚焦總成之需要。FIG. 73 shows an SMA system including an SMA actuator 7302 according to an embodiment. The SMA actuator 7302 includes a bimorph actuator configured as a 6-axis sensor shift OIS and autofocus device器7304. For some embodiments, the 6-axis sensor shift OIS and auto focus device are configured to move a lens on the X/Y/Z/pitch/roll/side roll axis. For some embodiments, pitch and roll axis motion is used for dynamic tilt tuning capabilities. Using the technology described in this article, 8 bimorph actuators are used to provide movement for the autofocus device and OIS. FIG. 74 shows an exploded view of an SMA system including an SMA actuator 7402 according to an embodiment. The SMA actuator 7402 includes dual pressure configured as a 6-axis sensor shift OIS and autofocus device Electric wafer actuator 7404. FIG. 75 shows a cross-section of an SMA system including an SMA actuator according to an embodiment. The SMA actuator 7402 includes a bimorph configured as a 6-axis sensor shift OIS and autofocus device Actuator. FIG. 76 shows a box-type bimorph actuator 7402 used in an SMA system according to an embodiment. The box-type bimorph actuator 7402 is configured to be equipped in the system when it is formed A 3-axis sensor shift OIS and auto focus device that was manufactured before. Figure 77 shows a flex sensor circuit used in an SMA system according to an embodiment, the flex sensor circuit configured as a 3-axis sensor shift OIS. This system can be configured to have a high OIS stroke OIS (for example, +/-200 um or higher) and a high autofocus stroke (for example, 400 um or higher). In addition, these embodiments can detune any tilt and eliminate the need for a separate autofocus assembly.

圖78繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含經組態為一雙軸相機傾斜OIS之雙壓電晶片致動器。針對一些實施例,雙軸相機傾斜OIS經組態以在縱傾/側傾軸上移動一相機。使用本文中所描述之技術,4個雙壓電晶片致動器用來推動自動聚焦裝置之頂部及底部以獲得OIS縱傾及側傾運動的整個相機運動。圖79繪示根據一實施例之包含一SMA致動器7902之SMA系統的一分解圖,SMA致動器7902包含經組態為一雙軸相機傾斜OIS之雙壓電晶片致動器7904。圖80繪示根據一實施例之包含一SMA致動器之SMA系統的一截面,該SMA致動器包含經組態為一雙軸相機傾斜OIS之雙壓電晶片致動器。圖81繪示根據一實施例之用於一SMA系統中之盒式雙壓電晶片致動器,該盒式雙壓電晶片致動器經組態為在成形為配備於該系統中之前被製造之一雙軸相機傾斜OIS。圖82繪示根據一實施例之用於一SMA系統中之一撓性感測器電路,該撓性感測器電路經組態為一雙軸相機傾斜OIS。此一系統可經組態為具有高OIS衝程OIS (例如,正/負3度或更高)。該等實施例經組態以容易地與自動聚焦(「AF」)設計(例如,VCM或SMA)整合在一起。Figure 78 shows an SMA system including an SMA actuator including a bimorph actuator configured as a biaxial camera tilt OIS, according to an embodiment. For some embodiments, the dual-axis camera tilt OIS is configured to move a camera on the pitch/roll axis. Using the technology described in this article, 4 bimorph actuators are used to push the top and bottom of the autofocus device to obtain the entire camera movement of OIS pitch and roll motion. Fig. 79 shows an exploded view of an SMA system including an SMA actuator 7902 including a bimorph actuator 7904 configured as a biaxial camera tilt OIS according to an embodiment. Figure 80 shows a cross-section of an SMA system including an SMA actuator including a bimorph actuator configured as a biaxial camera tilt OIS according to an embodiment. Figure 81 shows a box-type bimorph actuator used in an SMA system according to an embodiment, the box-type bimorph actuator is configured to be formed before being equipped in the system Manufactured a dual-axis camera tilted OIS. Figure 82 shows a flex sensor circuit used in an SMA system according to an embodiment, the flex sensor circuit configured as a dual-axis camera tilt OIS. This system can be configured to have a high OIS stroke OIS (for example, plus/minus 3 degrees or higher). These embodiments are configured to easily integrate with auto-focus ("AF") designs (e.g., VCM or SMA).

圖83繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含經組態為一3軸相機傾斜OIS之雙壓電晶片致動器。針對一些實施例,雙軸相機傾斜OIS經組態以在縱傾/側傾/側滾軸上移動一相機。使用本文中所描述之技術,4個雙壓電晶片致動器用來推動自動聚焦裝置之頂部及底部以獲得OIS縱傾及側傾運動的整個相機運動,且使用本文中所描述之技術,4個雙壓電晶片致動器用來推動自動聚焦裝置之側以獲得OIS側滾運動之整個相機運動。圖84繪示根據一實施例之包含一SMA致動器8402之SMA系統的一分解圖,SMA致動器8402包含經組態為一3軸相機傾斜OIS之雙壓電晶片致動器8404。圖85繪示根據一實施例之包含一SMA致動器之SMA系統的一截面,該SMA致動器包含經組態為一3軸相機傾斜OIS之雙壓電晶片致動器。圖86繪示根據一實施例之用於一SMA系統中之盒式雙壓電晶片致動器,該盒式雙壓電晶片致動器經組態為在其經成形為配備於該系統中之前被製造之一3軸相機傾斜OIS。圖87繪示根據一實施例之用於一SMA系統中之一撓性感測器電路,該撓性感測器電路經組態為一3軸相機傾斜OIS。此一系統可經組態為具有高OIS衝程OIS (例如,正/負3度或更高)。該等實施例經組態以容易地與AF設計(例如,VCM或SMA)整合在一起。FIG. 83 shows an SMA system including an SMA actuator including a bimorph actuator configured as a 3-axis camera tilt OIS, according to an embodiment. For some embodiments, the dual axis camera tilt OIS is configured to move a camera on the pitch/roll/roll axis. Using the technique described in this article, 4 bimorph actuators are used to push the top and bottom of the autofocus device to obtain the entire camera movement of OIS pitch and roll motion, and using the technique described in this article, 4 A bimorph actuator is used to push the side of the autofocus device to obtain the entire camera movement of the OIS roll movement. FIG. 84 shows an exploded view of an SMA system including an SMA actuator 8402 including a bimorph actuator 8404 configured as a 3-axis camera tilt OIS, according to an embodiment. FIG. 85 shows a cross-section of an SMA system including an SMA actuator including a bimorph actuator configured as a 3-axis camera tilt OIS, according to an embodiment. Figure 86 shows a box-type bimorph actuator used in an SMA system according to an embodiment, the box-type bimorph actuator is configured to be equipped in the system when it is shaped A 3-axis camera tilted OIS was previously manufactured. Fig. 87 shows a flex sensor circuit used in an SMA system according to an embodiment, the flex sensor circuit configured as a 3-axis camera tilt OIS. This system can be configured to have a high OIS stroke OIS (for example, plus/minus 3 degrees or higher). These embodiments are configured to easily integrate with AF designs (e.g., VCM or SMA).

圖88繪示根據實施例之一SMA致動器之一雙壓電晶片致動器之實例性尺寸。該等尺寸係較佳實施例,但熟習此項技術者將理解,可基於一SMA致動器之所欲特性使用其他尺寸。Fig. 88 shows exemplary dimensions of a bimorph actuator of an SMA actuator according to an embodiment. These dimensions are preferred embodiments, but those familiar with the art will understand that other dimensions can be used based on the desired characteristics of an SMA actuator.

圖89繪示根據一實施例之用於一折疊式相機的一透鏡系統。該折疊式相機包含一折疊透鏡8902,折疊透鏡8902經組態以將光彎曲至包含一或多個透鏡8903a至8903d的一透鏡系統8901。針對一些實施例,該折疊透鏡係一稜鏡及透鏡之任何一或多者。透鏡系統8901經組態為具有一主軸8904,主軸8904相對於一透射軸8906成一角度,透射軸8906平行於光到達折疊透鏡8902之前的行進方向。例如,在一相機電話系統中使用一折疊式相機以減小一透鏡系統8901在一透射軸8906方向之高度。Fig. 89 shows a lens system for a folding camera according to an embodiment. The folding camera includes a folding lens 8902 that is configured to bend light to a lens system 8901 that includes one or more lenses 8903a to 8903d. For some embodiments, the folding lens is any one or more of a lens and a lens. The lens system 8901 is configured to have a main axis 8904, the main axis 8904 is at an angle relative to a transmission axis 8906, and the transmission axis 8906 is parallel to the traveling direction of the light before reaching the folding lens 8902. For example, a folding camera is used in a camera phone system to reduce the height of a lens system 8901 in the direction of a transmission axis 8906.

透鏡系統之實施例包含一或多個液體透鏡,諸如本文中所描述之液體透鏡。圖89中所繪示之實施例包含兩個液體透鏡8903b、8903d,諸如本文中所描述之液體透鏡。一或多個液體透鏡8903b、8903d經組態以使用包含本文中所描述之技術的技術來致動。使用致動器致動一液體透鏡,包含但不限於帶扣致動器、雙壓電晶片致動器及其他SMA致動器。圖108繪示根據一實施例之使用帶扣致動器60致動之一液體透鏡。該液體透鏡包含一成形環耦接器64、一液體透鏡總成61、一或多個帶扣致動器60 (諸如本文中所描述之帶扣致動器)、一滑動基座65及一基座62。一或多個帶扣致動器60經組態以移動成形環/耦接器64以改變液體透鏡總成61之一撓性隔膜之形狀以使光線移動或成形,例如如本文中所描述。針對一些實施例,使用3或4個致動器。一液體透鏡可獨自地或組合其他透鏡組態以充當一自動聚焦裝置或光學影像穩定器。一液體透鏡亦可經組態以依其他方式將一影像引導至一影像感測器上。Embodiments of the lens system include one or more liquid lenses, such as the liquid lenses described herein. The embodiment depicted in Fig. 89 includes two liquid lenses 8903b, 8903d, such as the liquid lenses described herein. One or more liquid lenses 8903b, 8903d are configured to be actuated using techniques including the techniques described herein. Actuators are used to actuate a liquid lens, including but not limited to buckle actuators, bimorph actuators, and other SMA actuators. FIG. 108 illustrates the use of a buckle actuator 60 to actuate a liquid lens according to an embodiment. The liquid lens includes a shaped ring coupling 64, a liquid lens assembly 61, one or more buckle actuators 60 (such as the buckle actuators described herein), a sliding base 65, and a Base 62. One or more buckle actuators 60 are configured to move the shaping ring/coupler 64 to change the shape of the flexible diaphragm of the liquid lens assembly 61 to move or shape the light, for example as described herein. For some embodiments, 3 or 4 actuators are used. A liquid lens can be used alone or in combination with other lens configurations to act as an autofocus device or optical image stabilizer. A liquid lens can also be configured to direct an image to an image sensor in other ways.

圖90繪示一透鏡系統9001之若干實施例,透鏡系統9001包含液體透鏡9002a至9002h以將一影像聚焦於一影像感測器9004上。如所繪示,液體透鏡9002a至9002h可包含任何透鏡形狀且經組態以使用包含本文中所描述之技術的技術動態地調整穿過透鏡之光路徑。90 shows several embodiments of a lens system 9001. The lens system 9001 includes liquid lenses 9002a to 9002h to focus an image on an image sensor 9004. As shown, the liquid lenses 9002a to 9002h can include any lens shape and are configured to dynamically adjust the light path through the lens using techniques including the techniques described herein.

用於一折疊式相機的一透鏡系統經組態為包含一致動式折疊透鏡9100。一致動式折疊透鏡之一實例係一傾斜稜鏡,諸如圖91中所繪示之傾斜稜鏡。在圖91中所繪示之實例中,折疊透鏡係安置於一致動器9104上之一稜鏡9102。該致動器包含但不限於一SMA致動器,包含本文中所描述之SMA致動器。針對一些實施例,該傾斜稜鏡經安置於包含4個雙壓電晶片致動器9106之一SMA致動器上,諸如本文中所描述之雙壓電晶片致動器。根據一些實施例,使用包含本文中所描述之技術的技術,致動式折疊透鏡9100經組態為一光學影像穩定器。例如,一致動式折疊透鏡經組態為包含一SMA系統,諸如圖39中所繪示之SMA系統。一致動式折疊透鏡之另一實例可包含一SMA致動器,諸如圖21中所繪示之SMA致動器。然而,折疊透鏡亦可包含其他致動器。A lens system for a folding camera is configured to include an actuating folding lens 9100. An example of an actuating folding lens is a tilting lens, such as the tilting lens shown in FIG. 91. In the example shown in FIG. 91, the folding lens is mounted on a ring 9102 of the actuator 9104. The actuator includes, but is not limited to, an SMA actuator, including the SMA actuator described herein. For some embodiments, the tilting beam is placed on an SMA actuator including four bimorph actuators 9106, such as the bimorph actuator described herein. According to some embodiments, using techniques including the techniques described herein, the actuated folding lens 9100 is configured as an optical image stabilizer. For example, the actuating folding lens is configured to include an SMA system, such as the SMA system shown in FIG. 39. Another example of an actuating folding lens may include an SMA actuator, such as the SMA actuator shown in FIG. 21. However, the folding lens may also include other actuators.

圖92繪示根據一實施例之具有一偏移之一雙壓電晶片臂。雙壓電晶片臂9201包含具有一經形成偏移9203之一雙壓電晶片樑9202。與沒有一偏移之一雙壓電晶片臂相比,經形成偏移9203增加機械優勢以產生一更高力。根據一些實施例,偏移9204之深度(在本文中亦稱為彎曲平面z偏移9204)及偏移9206之長度(在本文中亦稱為槽寬度9206)經組態以定義雙壓電晶片臂之特性,例如峰值力。例如,圖106中之曲線圖繪示根據一實施例之彎曲平面z偏移9204、槽寬度9206與一雙壓電晶片樑9202之峰值力之間的關係。Figure 92 shows a bimorph arm with an offset according to an embodiment. The bimorph arm 9201 includes a bimorph beam 9202 with a formed offset 9203. Compared to a bimorph arm without an offset, forming an offset 9203 increases the mechanical advantage to generate a higher force. According to some embodiments, the depth of offset 9204 (also referred to herein as bending plane z offset 9204) and the length of offset 9206 (also referred to herein as groove width 9206) are configured to define a bimorph The characteristics of the arm, such as peak force. For example, the graph in FIG. 106 illustrates the relationship between the bending plane z offset 9204, the groove width 9206, and the peak force of a bimorph beam 9202 according to an embodiment.

雙壓電晶片臂包含諸如一SMA帶或SMA線9210之一或多種SMA材料,諸如本文中所描述之SMA材料。使用包含本文中所描述之技術的技術將SMA材料貼附至該樑。針對一些實施例,將諸如一SMA線9210之SMA材料貼附至雙壓電晶片臂之一固定端9212及雙壓電晶片臂之一負載點端9214,使得經形成偏移9203在貼附SMA材料之兩端之間。針對各項實施例,SMA材料之端與經組態以使用包含此項技術中已知之技術的技術將電流供應至SMA材料之接觸件電耦接及機械耦接。具有一偏移之雙壓電晶片臂可包含於諸如本文中所描述之SMA致動器及系統之SMA致動器及系統中。The bimorph arm includes one or more SMA materials such as an SMA tape or SMA wire 9210, such as the SMA materials described herein. The SMA material is attached to the beam using techniques including the techniques described herein. For some embodiments, an SMA material such as an SMA wire 9210 is attached to a fixed end 9212 of the bimorph arm and a load point end 9214 of the bimorph arm, so that an offset 9203 is formed when the SMA is attached. Between the two ends of the material. For the various embodiments, the ends of the SMA material are electrically and mechanically coupled to the contacts configured to supply current to the SMA material using techniques including techniques known in the art. Piezoelectric bimorph arms with an offset can be included in SMA actuators and systems such as the SMA actuators and systems described herein.

圖93繪示根據一實施例之具有一偏移及一限制器之一雙壓電晶片臂。雙壓電晶片臂9301包含具有一經形成偏移9303及相鄰於經形成偏移9303之一限制器9304之一雙壓電晶片樑9302。與沒有一偏移之雙壓電晶片臂9301相比,偏移9303增加機械優勢以產生一更高力且限制器9304防止該臂在遠離雙壓電晶片致動器之未固定、負載點端9306之方向運動。具有一經形成偏移9303及限制器9304之雙壓電晶片臂9301可包含於諸如本文中所描述之SMA致動器及系統的SMA致動器及系統中。雙壓電晶片臂9301包含諸如一SMA帶或SMA線9308之一或多種SMA材料,諸如使用包含本文中所描述之技術的技術貼附至雙壓電晶片臂9301之本文中所描述之SMA材料。Figure 93 shows a bimorph arm with an offset and a limiter according to an embodiment. The bimorph arm 9301 includes a bimorph beam 9302 with a formed offset 9303 and a limiter 9304 adjacent to the formed offset 9303. Compared with the bimorph arm 9301 without an offset, the offset 9303 increases the mechanical advantage to generate a higher force and the limiter 9304 prevents the arm from moving away from the unfixed, point-of-load end of the bimorph actuator Movement in the direction of 9306. The bimorph arm 9301 with a formed offset 9303 and limiter 9304 may be included in SMA actuators and systems such as the SMA actuators and systems described herein. The piezoelectric bimorph arm 9301 includes one or more SMA materials such as an SMA tape or SMA wire 9308, such as the SMA material described herein attached to the piezoelectric bimorph arm 9301 using a technique including the techniques described herein .

圖94繪示根據一實施例之具有一偏移及一限制器之一雙壓電晶片臂。雙壓電晶片臂9401包含具有一經形成偏移9403及相鄰於經形成偏移9403之一限制器9404之一雙壓電晶片樑9402。限制器9404經形成為用於雙壓電晶片臂9401的一基座9406之部分。基座9406經組態以接納一雙壓電晶片臂9401且包含經組態以接納雙壓電晶片樑之偏移部分之一凹部9408。該凹部之底部經組態為相鄰於經形成偏移9403之一限制器9404。基座9406亦可包含經組態以在雙壓電晶片臂未被致動時支撐雙壓電晶片臂之部分之一或多個部分9410。具有一經形成偏移9403及限制器9404之雙壓電晶片臂9401可包含於諸如本文中所描述之SMA致動器及系統的SMA致動器及系統中。雙壓電晶片臂9401包含諸如一SMA帶或SMA線之一或多種SMA材料,諸如使用包含本文中所描述之技術的技術貼附至雙壓電晶片臂9401之本文中所描述之SMA材料。Fig. 94 shows a bimorph arm with an offset and a limiter according to an embodiment. The bimorph arm 9401 includes a bimorph beam 9402 having a formed offset 9403 and a limiter 9404 adjacent to the formed offset 9403. The limiter 9404 is formed as part of a base 9406 for the bimorph arm 9401. The base 9406 is configured to receive a bimorph arm 9401 and includes a recess 9408 configured to receive the offset portion of the bimorph beam. The bottom of the recess is configured to be adjacent to a limiter 9404 formed with an offset 9403. The base 9406 may also include one or more portions 9410 configured to support the piezoelectric bimorph arm when the bimorph arm is not actuated. The bimorph arm 9401 with a formed offset 9403 and limiter 9404 can be included in SMA actuators and systems such as the SMA actuators and systems described herein. The piezoelectric bimorph arm 9401 includes one or more SMA materials, such as an SMA tape or SMA wire, such as the SMA material described herein attached to the piezoelectric bimorph arm 9401 using techniques including the techniques described herein.

圖95繪示根據一實施例之包含具有一偏移之一雙壓電晶片臂的一基座之一實施例。雙壓電晶片臂9501包含具有一經形成偏移9504之一雙壓電晶片樑9502。該雙壓電晶片臂亦可使用包含本文所描述之技術的技術之一限制器。雙壓電晶片臂9501包含諸如一SMA帶或SMA線9506之一或多種SMA材料,諸如使用包含本文中所描述之技術的技術貼附至雙壓電晶片臂9501之本文中所描述之SMA材料。Fig. 95 shows an embodiment of a pedestal including a bimorph arm with an offset according to an embodiment. The bimorph arm 9501 includes a bimorph beam 9502 having a formed offset 9504. The piezoelectric bimorph arm can also use one of the limiters including the technology described herein. The piezoelectric bimorph arm 9501 includes one or more SMA materials such as an SMA tape or SMA wire 9506, such as the SMA material described herein attached to the piezoelectric bimorph arm 9501 using techniques including the techniques described herein .

圖96繪示根據一實施例之包含具有一偏移之兩個雙壓電晶片臂的一基座9608之一實施例。各雙壓電晶片臂9601a、9601b包含具有一經形成偏移9604a、9604b之一雙壓電晶片光樑9602a、9602b。各雙壓電晶片臂9601a、9601b包含諸如一SMA帶或SMA線9606a、9606b之一或多種SMA材料,諸如使用包含本文中所描述之技術的技術貼附至雙壓電晶片臂9601之本文中所描述之SMA材料。各雙壓電晶片臂9601a、9601b亦可使用包含本文中所描述之技術的技術之一限制器。一些實施例包含一基座,該基座包含使用包含本文中所描述之技術的技術形成之兩個以上雙壓電晶片臂。根據一些實施例,雙壓電晶片臂9601與基座9608一體地形成。針對其他實施例,使用包含但不限於焊料、電阻焊接、雷射焊接及黏合劑之技術,雙壓電晶片臂9602a、9602b之一或多者與基座9608分離地形成且貼附至基座9608。針對一些實施例,兩個或更多個雙壓電晶片臂9601a、9601b經組態以作用於單個物件上。此實現有能力增加施加至一物件之力。以下圖107中之曲線圖繪示作為環繞整個雙壓電晶片致動器之一盒之一近似物之一盒體積如何與每個雙壓電晶片組件之功相關之實例。使用雙壓電晶片致動器9612之一長度、雙壓電晶片致動器9610之一寬度及雙壓電晶片致動器9614之高度來近似盒體積(統稱為「盒體積」)。Fig. 96 shows an embodiment of a base 9608 including two piezoelectric bimorph arms with an offset according to an embodiment. Each bimorph arm 9601a, 9601b includes a bimorph beam 9602a, 9602b with a formed offset 9604a, 9604b. Each bimorph arm 9601a, 9601b includes one or more SMA materials such as an SMA tape or SMA wire 9606a, 9606b, such as being attached to the text of the bimorph arm 9601 using a technique including the technology described herein The described SMA material. Each bimorph arm 9601a, 9601b can also use one of the limiters including the technology described herein. Some embodiments include a pedestal that includes two or more piezoelectric bimorph arms formed using techniques including the techniques described herein. According to some embodiments, the bimorph arm 9601 is integrally formed with the base 9608. For other embodiments, using technologies including but not limited to solder, resistance welding, laser welding and adhesives, one or more of the bimorph arms 9602a, 9602b are formed separately from the base 9608 and attached to the base 9608. For some embodiments, two or more bimorph arms 9601a, 9601b are configured to act on a single object. This implementation has the ability to increase the force applied to an object. The graph in FIG. 107 below shows an example of how the volume of a box as an approximation of a box surrounding the entire bimorph actuator is related to the work of each bimorph assembly. The length of the bimorph actuator 9612, the width of the bimorph actuator 9610, and the height of the bimorph actuator 9614 are used to approximate the box volume (collectively referred to as "box volume").

圖97繪示根據一實施例之包含負載點延伸部之一帶扣臂。帶扣臂9701包含一樑部分9702及自樑部分9702延伸之一或多個負載點延伸部9704a、9704b。帶扣臂9701之各端9706a、9706b經組態以使用包含本文中所描述之技術的技術貼附至或一體地形成至或一板或其他基座。根據一些實施例,一或多個負載點延伸部9704a、9704b以自樑部分9702之一負載點9710a、9710b之一偏移與樑部分9702貼附或一體地形成。負載點9710a、9710b係樑部分9702之部分,其經組態以將帶扣臂9701之力傳遞至另一物件。針對一些實施例,負載點9710a、9710b係樑部分9702之中心。針對其他實施例,負載點9710a、9710b在除樑部分9702之中心之外之一位置處。一負載點延伸9704a、9704b經組態以在樑部分9702之縱軸方向自接合至樑部分9702之點朝向樑部分9702之負載點9710a、9710b延伸。針對一些實施例,負載點延伸部9704a、9704b之端延伸至樑部分9702之至少負載點9710a、9704b。帶扣臂9701包含諸如一SMA帶或SMA線9712之一或多種SMA材料,諸如本文中所描述之SMA材料。諸如一SMA線9712之SMA材料經貼附於樑部分9702之相對端處。SMA材料使用包含本文中所描述之技術的技術貼附至樑部分之相對端。針對一些實施例,負載點延伸部9704a、9704b之長度可經組態為帶扣臂9701之相關聯平坦(撤銷致動)樑部分9702之縱向長度內所含之任何長度。Fig. 97 shows a buckle arm including a point-of-load extension according to an embodiment. The buckle arm 9701 includes a beam portion 9702 and one or more load point extension portions 9704a, 9704b extending from the beam portion 9702. Each end 9706a, 9706b of the buckle arm 9701 is configured to be attached to or integrally formed to or a plate or other base using techniques including the techniques described herein. According to some embodiments, one or more load point extensions 9704a, 9704b are attached to or integrally formed with the beam portion 9702 at an offset from one of the load points 9710a, 9710b of the beam portion 9702. The load points 9710a, 9710b are parts of the beam portion 9702, which are configured to transfer the force of the buckle arm 9701 to another object. For some embodiments, the load points 9710a, 9710b are the center of the beam portion 9702. For other embodiments, the load points 9710a, 9710b are at a position other than the center of the beam portion 9702. A load point extension 9704a, 9704b is configured to extend in the longitudinal direction of the beam portion 9702 from the point joining to the beam portion 9702 toward the load points 9710a, 9710b of the beam portion 9702. For some embodiments, the end of the point of load extension 9704a, 9704b extends to at least the point of load 9710a, 9704b of the beam portion 9702. The buckle arm 9701 includes one or more SMA materials such as an SMA tape or SMA wire 9712, such as the SMA materials described herein. SMA material such as an SMA wire 9712 is attached to the opposite end of the beam portion 9702. The SMA material is attached to the opposite end of the beam section using techniques including the techniques described herein. For some embodiments, the length of the point-of-load extensions 9704a, 9704b can be configured to be any length contained within the longitudinal length of the associated flat (de-actuated) beam portion 9702 of the buckle arm 9701.

圖98繪示根據一實施例之包含處於一致動位置之負載點延伸部9810之一帶扣臂9801。使用包含本文中所描述之技術的技術致動貼附至樑部分9802之相對端的SMA材料。負載點9804使帶扣臂9801能夠在沒有延伸部之情況下增加帶扣臂上之衝程範圍。因此,包含負載點延伸部之帶扣臂可實現一更大的最大垂直衝程。具有負載點延伸部之帶扣臂可包含於諸如本文中所描述之SMA致動器及系統的SMA致動器及系統中。FIG. 98 shows a buckle arm 9801 including a point-of-load extension 9810 in an actuated position according to an embodiment. The SMA material attached to the opposite end of the beam portion 9802 is actuated using techniques including the techniques described herein. The load point 9804 enables the buckle arm 9801 to increase the stroke range on the buckle arm without an extension. Therefore, the buckle arm including the point-of-load extension can achieve a greater maximum vertical stroke. Buckle arms with point-of-load extensions may be included in SMA actuators and systems such as the SMA actuators and systems described herein.

圖99繪示根據一實施例之包含負載點延伸部之一雙壓電晶片臂。雙壓電晶片臂9901包含一樑部分9902及自該樑部分延伸之一或多個負載點延伸部9904a、9904b。雙壓電晶片臂9901之一端經組態以使用包含本文中所描述之技術的技術貼附或一體地形成至一板或其他基座。樑部分9902中與貼附或一體形成端相對之端係不固定的且可自由移動。根據一些實施例,一或多個負載點延伸部9904a、9904b以自樑部分9902之自由端之一偏移與樑部分9902貼附或一體地形成。負載點延伸部9904a、9904b經組態以在遠離包含樑部分9902之縱軸之一平面之一方向自接合至樑部分9902之點延伸。例如,負載點延伸部9904a、9904b在該樑部分之自由端在被致動時延伸之方向延伸。一雙壓電晶片臂9901之一些實施例包含具有一縱軸之一或多個負載點延伸部9904a、9904b,該縱軸與包含該樑部分之縱軸之一平面形成包含1度至90度之一角度。針對一些實施例,負載點延伸部9904a、9904b之端9910a、9910b經組態以鍵合經組態以被移動之一物件。Fig. 99 shows a piezoelectric bimorph arm including a point-of-load extension according to an embodiment. The bimorph arm 9901 includes a beam portion 9902 and one or more load point extensions 9904a, 9904b extending from the beam portion. One end of the piezoelectric bimorph arm 9901 is configured to be attached or integrally formed to a board or other base using techniques including the techniques described herein. The end of the beam portion 9902 opposite to the attached or integrated end is not fixed and can move freely. According to some embodiments, one or more load point extensions 9904a, 9904b are attached to or integrally formed with the beam portion 9902 at an offset from one of the free ends of the beam portion 9902. The point-of-load extensions 9904a, 9904b are configured to extend from the point joined to the beam portion 9902 in a direction away from a plane containing the longitudinal axis of the beam portion 9902. For example, the point-of-load extensions 9904a, 9904b extend in the direction in which the free end of the beam portion extends when actuated. Some embodiments of a piezoelectric bimorph arm 9901 include one or more load point extensions 9904a, 9904b with a longitudinal axis, the longitudinal axis and a plane containing the longitudinal axis of the beam portion forming a plane including 1 degree to 90 degrees One angle. For some embodiments, the ends 9910a, 9910b of the point-of-load extensions 9904a, 9904b are configured to bond to an object configured to be moved.

雙壓電晶片臂9901包含諸如一SMA帶或SMA線9906之一或多種SMA材料,諸如本文中所描述之SMA材料。諸如一SMA線9906之SMA材料經貼附於樑部分9902之相對端處。SMA材料使用包含本文中所描述之技術的技術貼附至樑部分9902之相對端。針對一些實施例,負載點延伸部9904a、9904b之長度可經組態為任何長度。根據一些實施例,由負載點延伸部9904a、9904b之一端9910a、9910b鍵合一物件之點之位置可經組態為沿樑部分9902之縱向長度之任何點。當一負載點延伸部之端之樑部分係平坦(撤銷致動)時,該樑部分上方之高度可經組態為任何高度。針對一些實施例,當雙壓電晶片臂被致動時,負載點延伸部可經組態為至少在雙壓電晶片臂之其他部分上方。The piezoelectric bimorph arm 9901 includes one or more SMA materials such as an SMA tape or SMA wire 9906, such as the SMA materials described herein. An SMA material such as an SMA wire 9906 is attached to the opposite ends of the beam portion 9902. The SMA material is attached to the opposite end of the beam portion 9902 using techniques including the techniques described herein. For some embodiments, the length of the point-of-load extensions 9904a, 9904b can be configured to any length. According to some embodiments, the position of the point at which one end 9910a, 9910b of the point-of-load extension 9904a, 9904b is bonded to an object can be configured to be any point along the longitudinal length of the beam portion 9902. When the beam part at the end of a load point extension is flat (deactivation), the height above the beam part can be configured to any height. For some embodiments, when the bimorph arm is actuated, the point of load extension may be configured to be at least above other parts of the bimorph arm.

圖100繪示根據一實施例之包含處於一致動位置之負載點延伸部之一雙壓電晶片臂。使用包含本文中所描述之技術的技術致動貼附至樑部分2之相對端的SMA材料。與沒有延伸部之雙壓電晶片臂相比,負載點延伸部10使雙壓電晶片臂1能夠增加衝程力。因此,包含負載點延伸部10之雙壓電晶片臂1實現由雙壓電晶片臂1施加一更大力。具有負載點延伸部10之雙壓電晶片臂1可包含於諸如本文中所描述之SMA致動器及系統的SMA致動器及系統中。FIG. 100 shows a piezoelectric bimorph arm including a point-of-load extension in an actuated position according to an embodiment. The SMA material attached to the opposite end of the beam portion 2 is actuated using a technique including the technique described herein. Compared with a piezoelectric bimorph arm without an extension, the point-of-load extension 10 enables the piezoelectric bimorph arm 1 to increase the stroke force. Therefore, the piezoelectric bimorph arm 1 including the point-of-load extension 10 enables the piezoelectric bimorph arm 1 to apply a larger force. The bimorph arm 1 with the point-of-load extension 10 may be included in an SMA actuator and system such as the SMA actuator and system described herein.

圖101繪示根據一實施例之一SMA光學影像穩定器。SMA光學影像穩定器20包含一移動板22及一靜態板24。移動板22包含與移動板22一體地形成之彈簧臂26。針對一些實施例,移動板22及靜態板24各經形成為單一、一件式板。移動板22包含一第一SMA材料附接部分28a及一第二SMA材料附接部分28b。靜態板24包含一第一SMA材料附接部分30a及一第二SMA材料附接部分30b。各SMA材料附接部分28、30經組態以使用電阻焊接頭將諸如一SMA線之一SMA材料固定至一板。移動板22之第一SMA材料附接部分28a包含安置於其與該靜態板之一第一SMA材料附接部分30a之間的一第一SMA線32a及安置於其與靜態板24之第二SMA附接部分30b之間的一第二SMA線32b。移動板22之第二SMA材料附接部分28b包含安置於其與該靜態板之一第二SMA材料附接部分30b之間的一第三SMA線32c及安置於其與靜態板24之第一SMA附接部分30a之間的一第四SMA線32d。使用包含本文中所描述之技術的技術致動各SMA線使移動板22遠離靜態板24移動。圖102繪示根據一實施例之一移動部分之一SMA材料附接部分40。SMA材料附接部分經組態為具有電阻焊接至SMA材料附接部分40之SMA材料,諸如一SMA線41。圖103繪示根據一實施例之其中電阻焊接SMA線43附接至其之一靜態板之一SMA附接部分42。FIG. 101 shows an SMA optical image stabilizer according to an embodiment. The SMA optical image stabilizer 20 includes a moving plate 22 and a static plate 24. The moving plate 22 includes a spring arm 26 formed integrally with the moving plate 22. For some embodiments, the moving plate 22 and the static plate 24 are each formed as a single, one-piece plate. The mobile board 22 includes a first SMA material attachment portion 28a and a second SMA material attachment portion 28b. The static board 24 includes a first SMA material attachment portion 30a and a second SMA material attachment portion 30b. Each SMA material attachment portion 28, 30 is configured to fix an SMA material such as an SMA wire to a board using a resistance welding head. The first SMA material attachment portion 28a of the mobile board 22 includes a first SMA wire 32a disposed between it and a first SMA material attachment portion 30a of the static board, and a second SMA wire 32a disposed between it and the static board 24 A second SMA wire 32b between the SMA attachment portions 30b. The second SMA material attachment portion 28b of the mobile board 22 includes a third SMA wire 32c disposed between it and a second SMA material attachment portion 30b of the static board, and a first SMA wire 32c disposed between it and the static board 24 A fourth SMA wire 32d between the SMA attachment portions 30a. The SMA wires are actuated to move the moving plate 22 away from the static plate 24 using techniques including the techniques described herein. FIG. 102 shows an SMA material attachment part 40 of a moving part according to an embodiment. The SMA material attachment portion is configured to have an SMA material such as an SMA wire 41 that is resistance welded to the SMA material attachment portion 40. FIG. 103 shows an SMA attachment portion 42 in which a resistance welding SMA wire 43 is attached to one of the static plates according to an embodiment.

圖104繪示根據一實施例之包含一帶扣致動器之一SMA致動器45。帶扣致動器46包含帶扣臂47,諸如本文中所描述之帶扣臂。帶扣臂47經組態以當使用包含本文中所描述之技術的技術致動及撤銷致動SMA線48時在z軸上移動。使用電阻焊接將各SMA線48附接至一各自電阻焊線壓接物部49。各電阻焊線壓接物49包含與金屬51隔離之一島狀物50,島狀物50在SMA線48之至少一側上形成帶扣臂47。該島狀物結構可用於其他致動器、光學影像穩定器及自動聚焦系統中以將一SMA線之至少一側連接至形成於鹼金屬層中之一隔離島狀物結構,諸如圖101中所展示之OIS應用。FIG. 104 shows an SMA actuator 45 including a buckle actuator according to an embodiment. The buckle actuator 46 includes a buckle arm 47, such as the buckle arm described herein. The buckle arm 47 is configured to move on the z-axis when the SMA wire 48 is activated and deactivated using techniques including the techniques described herein. Each SMA wire 48 is attached to a respective resistance welding wire crimp portion 49 using resistance welding. Each resistance welding wire crimping object 49 includes an island 50 isolated from the metal 51, and the island 50 forms a buckle arm 47 on at least one side of the SMA wire 48. The island structure can be used in other actuators, optical image stabilizers, and autofocus systems to connect at least one side of an SMA wire to an isolated island structure formed in an alkali metal layer, such as in FIG. 101 The OIS application shown.

圖105繪示根據一實施例之包含用於一SMA致動器之一島狀物之一電阻焊壓接物,該SMA致動器用來使用包含本文所描述之技術的技術將一SMA線48附接至一帶扣致動器46。圖105a繪示SMA致動器45之一底部部分。根據一些實施例,SMA致動器45由一不鏽鋼基層51形成。諸如聚醯亞胺層之一介電層52經安置於不鏽鋼基層51之底部部分上。根據一些實施例,一導體層53透過介電層52中之一通孔電連接至不鏽鋼島狀物50,從而能夠在焊接至不鏽鋼島狀物50之線與附接至該不鏽鋼島狀物之導體電路之間建立電連接。根據一些實施例,自不鏽鋼基層50蝕刻一島狀物50。介電層52將島狀物50之位置維持於不鏽鋼基層51內。島狀物50經組態以使用包含本文中所描述之技術的技術(例如,電阻焊接)將一SMA線附接至其。圖105b繪示包含一島狀物50之SMA致動器45之一頂部部分。針對一些實施例,膠水或黏合劑亦可經放置於焊之頂部上以輔助機械強度且在操作及衝擊負載期間起到疲勞應變消除之作用。FIG. 105 shows a resistance welding crimp including an island for an SMA actuator used to connect an SMA wire 48 using a technique including the technique described herein, according to an embodiment Attached to a buckle actuator 46. FIG. 105a shows a bottom part of the SMA actuator 45. According to some embodiments, the SMA actuator 45 is formed of a stainless steel base layer 51. A dielectric layer 52 such as a polyimide layer is disposed on the bottom portion of the stainless steel base layer 51. According to some embodiments, a conductor layer 53 is electrically connected to the stainless steel island 50 through a through hole in the dielectric layer 52, so that the wires welded to the stainless steel island 50 and the conductor attached to the stainless steel island Electrical connections are established between the circuits. According to some embodiments, an island 50 is etched from the stainless steel base layer 50. The dielectric layer 52 maintains the position of the island 50 in the stainless steel base layer 51. The island 50 is configured to attach an SMA wire to it using techniques including the techniques described herein (eg, resistance welding). FIG. 105b shows a top portion of an SMA actuator 45 including an island 50. FIG. For some embodiments, glue or adhesive can also be placed on the top of the weld to assist in mechanical strength and to relieve fatigue strain during operation and impact loading.

圖108包含根據一實施例之具有帶扣致動器之一SMA致動器的一透鏡系統。該透鏡系統包含安置於一基座62上之一液體透鏡總成61。該透鏡系統亦包含與帶扣致動器60機械地耦接之一成形環/耦接器64。包含諸如本文中所描述之帶扣致動器的帶扣致動器60之SMA致動器經安置於一滑動基座65上,滑動基座65經安置於基座62上。SMA致動器經組態以藉由使用包含本文中所描述之技術的技術致動帶扣致動器60來沿液體透鏡總成61之光學軸移動成形環/耦接器64。此使成形環/耦接器64移動以改變液體透鏡總成中之液體透鏡之焦點。Fig. 108 includes a lens system with an SMA actuator of a buckle actuator according to an embodiment. The lens system includes a liquid lens assembly 61 mounted on a base 62. The lens system also includes a shaped ring/coupler 64 that is mechanically coupled to the buckle actuator 60. The SMA actuator including the buckle actuator 60 such as the buckle actuator described herein is placed on a sliding base 65 which is placed on the base 62. The SMA actuator is configured to move the shaping ring/coupler 64 along the optical axis of the liquid lens assembly 61 by actuating the buckle actuator 60 using techniques including the techniques described herein. This moves the forming ring/coupler 64 to change the focus of the liquid lens in the liquid lens assembly.

圖109繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端。一雙壓電晶片臂之未固定、負載點端70包含一平坦表面71以貼附SMA材料,諸如一SMA線72。SMA線72藉由一電阻焊73貼附至平坦表面71。電阻焊73係使用包含此項技術中已知之技術的技術形成。Fig. 109 shows an unfixed, point-of-load end of a piezoelectric bimorph arm according to an embodiment. The unfixed, load-point end 70 of a bimorph arm includes a flat surface 71 for attaching SMA material, such as an SMA wire 72. The SMA wire 72 is attached to the flat surface 71 by a resistance welding 73. The resistance welding 73 is formed using techniques including techniques known in the art.

圖110繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端。一雙壓電晶片臂之未固定、負載點端76包含一平坦表面77以貼附SMA材料,諸如一SMA線78。SMA線78藉由類似於圖109中所繪示之電阻焊的一電阻焊貼附至平坦表面77。一黏合劑79經安置於電阻焊上。此實現SMA線78與未固定、負載點端76之間的一更可靠接頭。黏合劑79包含但不限於導電黏合劑、非導電黏合劑及此項技術中已知之其他黏合劑。FIG. 110 illustrates an unfixed, point-of-load end of a piezoelectric bimorph arm according to an embodiment. The unfixed, load-point end 76 of a bimorph arm includes a flat surface 77 for attaching SMA material, such as an SMA wire 78. The SMA wire 78 is attached to the flat surface 77 by a resistance welding similar to the resistance welding shown in FIG. 109. An adhesive 79 is placed on the resistance welding. This achieves a more reliable connection between the SMA wire 78 and the unfixed, load point end 76. The adhesive 79 includes but is not limited to conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

圖111繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端。一雙壓電晶片臂之未固定、負載點端80包含一平坦表面81以貼附SMA材料,諸如一SMA線82。一金屬夾層84經安置於平坦表面81上。金屬夾層84包含但不限於一金層、一鎳層或合金層。SMA線82藉由一電阻焊83貼附至安置於平坦表面81上之金屬夾層84。電阻焊83係使用包含此項技術中已知之技術的技術形成。金屬夾層84實現與未固定、負載點端80之更好黏合。FIG. 111 illustrates an unfixed, point-of-load end of a piezoelectric bimorph arm according to an embodiment. The unfixed, point-of-load end 80 of a bimorph arm includes a flat surface 81 for attaching SMA material, such as an SMA wire 82. A metal interlayer 84 is disposed on the flat surface 81. The metal interlayer 84 includes but is not limited to a gold layer, a nickel layer or an alloy layer. The SMA wire 82 is attached to the metal interlayer 84 placed on the flat surface 81 by a resistance welding 83. The resistance welding 83 is formed using a technique including techniques known in the art. The metal interlayer 84 achieves better adhesion with the unfixed, load point end 80.

圖112繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端。一雙壓電晶片臂之未固定、負載點端88包含一平坦表面89以貼附SMA材料,諸如一SMA線90。一金屬夾層92經安置於平坦表面89上。金屬夾層92包含但不限於一金層、一鎳層或合金層。SMA線90藉由類似於圖111中所繪示之電阻焊的一電阻焊貼附至平坦表面89。一黏合劑91經安置於電阻焊上。此實現SMA線90與未固定、負載點端88之間的一更可靠接頭。黏合劑91包含但不限於導電黏合劑、非導電黏合劑及此項技術中已知之其他黏合劑。Fig. 112 shows an unfixed, point-of-load end of a piezoelectric bimorph arm according to an embodiment. The unfixed, load-point end 88 of a bimorph arm includes a flat surface 89 for attaching SMA material, such as an SMA wire 90. A metal interlayer 92 is disposed on the flat surface 89. The metal interlayer 92 includes but is not limited to a gold layer, a nickel layer or an alloy layer. The SMA wire 90 is attached to the flat surface 89 by a resistance welding similar to the resistance welding shown in FIG. 111. An adhesive 91 is placed on the resistance welding. This achieves a more reliable connection between the SMA wire 90 and the unfixed, load point end 88. The adhesive 91 includes but is not limited to conductive adhesives, non-conductive adhesives and other adhesives known in the art.

圖113繪示根據一實施例之一雙壓電晶片臂之一固定端。一雙壓電晶片臂之固定端95包含一平坦表面96以貼附SMA材料,諸如一SMA線97。SMA線97藉由一電阻焊98貼附至平坦表面96。電阻焊98係使用包含此項技術中已知之技術的技術形成。FIG. 113 shows a fixed end of a piezoelectric bimorph arm according to an embodiment. The fixed end 95 of a bimorph arm includes a flat surface 96 for attaching an SMA material, such as an SMA wire 97. The SMA wire 97 is attached to the flat surface 96 by a resistance welding 98. The resistance welding 98 is formed using techniques including techniques known in the art.

圖114繪示根據一實施例之一雙壓電晶片臂之一固定端。一雙壓電晶片臂之固定端120包含一平坦表面121以貼附SMA材料,諸如一SMA線122。SMA線122藉由類似於圖113中所繪示之電阻焊的一電阻焊貼附至平坦表面121。一黏合劑123經安置於電阻焊上。此實現SMA線122與固定端120之間的一更可靠接頭。黏合劑123包含但不限於導電黏合劑、非導電黏合劑及此項技術中已知之其他黏合劑。Fig. 114 shows a fixed end of a piezoelectric bimorph arm according to an embodiment. The fixed end 120 of a bimorph arm includes a flat surface 121 for attaching an SMA material, such as an SMA wire 122. The SMA wire 122 is attached to the flat surface 121 by a resistance welding similar to the resistance welding shown in FIG. 113. An adhesive 123 is placed on the resistance welding. This achieves a more reliable connection between the SMA wire 122 and the fixed end 120. The adhesive 123 includes, but is not limited to, conductive adhesives, non-conductive adhesives, and other adhesives known in the art.

圖115繪示根據一實施例之一雙壓電晶片臂之一固定端。一雙壓電晶片臂之固定端126包含一平坦表面127以貼附SMA材料,諸如一SMA線128。一金屬夾層130經安置於平坦表面127上。金屬夾層130包含但不限於一金層、一鎳層或合金層。SMA線128藉由一電阻焊129貼附至安置於平坦表面127上之金屬夾層130。電阻焊129係使用包含此項技術中已知之技術的技術形成。金屬夾層130實現與固定端126之更好黏合。FIG. 115 shows a fixed end of a piezoelectric bimorph arm according to an embodiment. The fixed end 126 of a bimorph arm includes a flat surface 127 for attaching an SMA material, such as an SMA wire 128. A metal interlayer 130 is disposed on the flat surface 127. The metal interlayer 130 includes but is not limited to a gold layer, a nickel layer or an alloy layer. The SMA wire 128 is attached to the metal interlayer 130 placed on the flat surface 127 by a resistance welding 129. The resistance welding 129 is formed using techniques including techniques known in the art. The metal interlayer 130 achieves better adhesion with the fixed end 126.

圖116繪示根據一實施例之一雙壓電晶片臂之一固定端。一雙壓電晶片臂之固定端135包含一平坦表面136以貼附SMA材料,諸如一SMA線137。一金屬夾層138經安置於平坦表面136上。金屬夾層136包含但不限於一金層、一鎳層或合金層。SMA線137藉由類似於圖115中所繪示之電阻焊的一電阻焊貼附至平坦表面136。一黏合劑139經安置於電阻焊上。此實現SMA線137與固定端135之間的一更可靠接頭。黏合劑139包含但不限於導電黏合劑、非導電黏合劑及此項技術中已知之其他黏合劑。FIG. 116 shows a fixed end of a piezoelectric bimorph arm according to an embodiment. The fixed end 135 of a bimorph arm includes a flat surface 136 for attaching an SMA material, such as an SMA wire 137. A metal interlayer 138 is disposed on the flat surface 136. The metal interlayer 136 includes but is not limited to a gold layer, a nickel layer or an alloy layer. The SMA wire 137 is attached to the flat surface 136 by a resistance welding similar to the resistance welding shown in FIG. 115. An adhesive 139 is placed on the resistance welding. This achieves a more reliable connection between the SMA wire 137 and the fixed end 135. The adhesive 139 includes but is not limited to conductive adhesives, non-conductive adhesives and other adhesives known in the art.

圖117繪示根據一實施例之一雙壓電晶片臂之一固定端之一後視圖。根據本文中所描述之實施例組態雙壓電晶片臂143。一雙壓電晶片臂之固定端143包含與固定端143之外部145隔離之一島狀物144。此使島狀物144與外部145能夠電及/或熱隔離。針對一些實施例,貼附至雙壓電晶片臂之固定端143之相對側之SMA材料透過一通孔與諸如一SMA線之SMA材料電耦接。島狀物144經安置於一絕緣體146上,諸如本文中所描述之絕緣體。島狀物144可使用包含此項技術中已知之蝕刻技術的蝕刻技術形成。FIG. 117 shows a rear view of a fixed end of a piezoelectric bimorph arm according to an embodiment. The bimorph arm 143 is configured according to the embodiments described herein. The fixed end 143 of a bimorph arm includes an island 144 isolated from the outer portion 145 of the fixed end 143. This enables the island 144 to be electrically and/or thermally isolated from the exterior 145. For some embodiments, the SMA material attached to the opposite side of the fixed end 143 of the bimorph arm is electrically coupled to the SMA material such as an SMA wire through a through hole. The island 144 is disposed on an insulator 146, such as the insulator described herein. The islands 144 can be formed using etching techniques including etching techniques known in the art.

將理解,如本文中用作方便術語之諸如「頂部」、「底部」、「上方」、「下方」及x方向、y方向及z方向之術語表示部件相對於彼此而非任何特定空間或重力定向之空間關係。因此,該等術語意欲於涵蓋組件部件之一總成,而不管該總成是否呈圖式中所展示及說明書中所描述之特定定向而定向,自彼定向倒置或任何其他旋轉變動。It will be understood that terms such as "top", "bottom", "above", "below" and the x-direction, y-direction, and z-direction as used as convenient terms herein indicate that the components are relative to each other rather than any particular space or gravity The spatial relationship of orientation. Therefore, these terms are intended to cover an assembly of component parts, regardless of whether the assembly is oriented in a specific orientation as shown in the drawings and described in the specification, inverted from that orientation, or any other rotational variation.

將明白,如本文中所使用之術語「本發明」不應被解釋為意謂僅呈現具有單個基本元件或元件群組或之單個發明。類似地,亦將明白,術語「本發明」涵蓋數個單獨創新,該等創新可各被視為係單獨發明。儘管已關於較佳實施例及其圖式詳細地描述本發明,但對於熟習此項技術者應顯而易見的是,可在不脫離本發明之精神及範疇之情況下實現本發明之實施例之各種調適及修改。另外,本文中所描述之技術可用來製作具有兩個、三個、四個、五個、六個或更通常n個雙壓電晶片致動器及帶扣致動器之一裝置。據此,應理解,如上文中所闡述之詳細描述及隨附圖示並非意欲於限制本發明之廣度,該廣度僅應自下文發明申請專利範圍及其適當解釋之合法等效物來推斷。It will be understood that the term "present invention" as used herein should not be interpreted as meaning only presenting a single invention with a single basic element or group of elements or a single invention. Similarly, it will also be understood that the term "present invention" encompasses several separate innovations, each of which can be regarded as a separate invention. Although the present invention has been described in detail with respect to preferred embodiments and drawings, it should be obvious to those familiar with the art that various embodiments of the present invention can be implemented without departing from the spirit and scope of the present invention. Adapt and modify. In addition, the techniques described herein can be used to make a device with two, three, four, five, six or more usually n bimorph actuators and buckle actuators. Accordingly, it should be understood that the detailed description and accompanying drawings as set forth above are not intended to limit the breadth of the present invention, and the breadth should only be inferred from the scope of the patent application below and the legal equivalents of the proper interpretation.

1:雙壓電晶片臂 2:樑部分 10:負載點延伸部 20:形狀記憶合金(SMA)光學影像穩定器 22:移動板 24:靜態板 26:彈簧臂 28a:第一SMA材料附接部分 28b:第二SMA材料附接部分 30a:第一SMA材料附接部分 30b:第二SMA材料附接部分 32a:第一SMA線 32b:第二SMA線 32c:第三SMA線 32d:第四SMA線 40:SMA材料附接部分 42:SMA附接部分 45:SMA致動器 50:島狀物 51:金屬/不鏽鋼基層 52:介電層 53:導體層 60:帶扣致動器 61:液體透鏡總成 62:基座 64:成形環耦接器/成形環/耦接器 65:滑動基座 70:未固定、負載點端 71:平坦表面 72:SMA線 73:電阻焊 76:未固定、負載點端 77:平坦表面 78:SMA線 79:黏合劑 80:未固定、負載點端 81:平坦表面 82:SMA線 83:電阻焊 84:金屬夾層 88:未固定、負載點端 89:平坦表面 90:SMA線 91:黏合劑 92:金屬夾層 95:固定端 96:平坦表面 97:SMA線 98:電阻焊 100:形狀記憶合金(SMA)線 101:基座 102:帶扣致動器 104:中心部分 106:壓接物結構 108:z衝程方向 120:固定端 121:平坦表面 122:SMA線 123:黏合劑 126:固定端 127:平坦表面 128:SMA線 129:電阻焊 130:金屬夾層 135:固定端 136:平坦表面 137:SMA線 138:金屬夾層 139:黏合劑 143:雙壓電晶片臂/固定端 144:島狀物 145:外部 146:絕緣體 202:雙壓電晶片致動器 204:基座 206:SMA帶 208:z衝程方向 302:SMA致動器 304:光學影像穩定器(「OIS」) 306:透鏡托架 308:復位彈簧 310:垂直滑動軸承 312:引導蓋 502:感測器 504:z方向 506:帶扣致動器 508:SMA線 604:透鏡托架 606:線保持器 608:智慧型記憶合金(「SMA」)線/智慧型記憶合金(「SMA」)線 610:帶扣臂 612:彈簧臂 702:滑動基座 704:總成基座 706:滑動軸承 708:垂直滑動表面 710:帶扣致動器 802:帶扣致動器 804:帶扣臂 806:吊床部分 902:雙壓電晶片致動器 904:透鏡托架 906:端 908:基座 1002:自動聚焦總成 1004:位置感測器 1005:z方向 1006:移動彈簧 1008:磁體 1010:透鏡托架 1106b:SMA帶 1202:S MA材料 1204:中心饋電 1206:樑 1208:中心金屬 1210:絕緣體 1212:開口或通孔 1214a:電源區段 1214b:接地區段 1216:電力供應器接觸件 1218:接地接觸件 1220:表塗層 1222:間隙 1224:通孔區段 1226:通孔區段 1302:第一帶扣致動器 1304:第二帶扣致動器 1306:透鏡托架 1314:滑動基座 1316:滑動基座 1902:第一帶扣致動器 1904:第二帶扣致動器 1906:透鏡托架 1914:滑動基座 1916:滑動基座 1918:基座部分 1920:蓋部分 2202:第一帶扣致動器 2204:第二帶扣致動器 2206:透鏡托架 2218a:左SMA線 2218b:右SMA線 2302:第一帶扣致動器 2304:第二帶扣致動器 2305:耦接器環 2306:透鏡托架 2401:滑動基座 2402:帶扣致動器 2403:復位彈簧 2406:透鏡托架 2409:殼體 2413:壓接物 2414:適配器板 2415:信號跡線 2501:SMA系統 3000:加強件 3002:帶扣致動器 3003:復位彈簧 3014:適配器板 3020:撓性電路 3101:SMA系統 3501:SMA雙壓電晶片液體透鏡 3502:液體透鏡子總成 3504:殼體 3506:SMA致動器 3508:雙壓電晶片致動器 3510:成形環 3512:撓性隔膜 3514:液體 3516:體容納環 3518:透鏡 3520:接觸件 3902:SMA致動器 3904:正z衝程致動器 3906:負z衝程致動器 3908:SMA線 3910:透鏡支架 3912:頂部彈簧 3914:頂部間隔件 3916:底部間隔件 3918:底部彈簧 3920:基座 4102:長度 4103:雙壓電晶片致動器 4104:鍵合焊盤 4108:延伸長度 4202:SMA雙壓電晶片致動器 4302:負致動器信號連接件 4304:基座 4308:線鍵合焊盤 4310:黏合劑層 4314:正致動器信號連接件 4316:線鍵合焊盤 4318:黏合劑層 4322:連接焊盤 4602:撓性感測器電路 4604:雙壓電晶片致動器電路 4606:雙壓電晶片致動器 4608:移動托架 4610:外殼 4802:SMA致動器 4804:外殼 5002:SMA致動器 5004:4側安裝SMA雙壓電晶片致動器 5202:雙壓電晶片致動器 5402:底部安裝雙壓電晶片致動器 5502:頂部及底部安裝SMA雙壓電晶片致動器 5802:SMA致動器/盒式雙壓電晶片致動器 5806:雙壓電晶片致動器 6202:SMA致動器/盒式雙壓電晶片致動器 6204:雙壓電晶片致動器 6504:外殼 6506:透鏡托架 6602:SMA致動器 6604:雙壓電晶片致動器/透鏡托架 6802:SMA致動器/盒式雙壓電晶片致動器 6804:感測器托架 7402:SMA致動器/盒式雙壓電晶片致動器 7404:雙壓電晶片致動器 7902:SMA致動器 7904:雙壓電晶片致動器 8402:SMA致動器 8404:雙壓電晶片致動器 8901:透鏡系統 8902:折疊透鏡 8903a:透鏡 8903b:液體透鏡 8903c:透鏡 8903d:液體透鏡 8904:主軸 8906:透射軸 9001:透鏡系統 9002a:液體透鏡 9002b:液體透鏡 9002c:液體透鏡 9002d:液體透鏡 9002e:液體透鏡 9002f:液體透鏡 9002g:液體透鏡 9002h:液體透鏡 9004:影像感測器 9100:致動式折疊透鏡 9102:稜鏡 9104:致動器 9106:雙壓電晶片致動器 9201:雙壓電晶片臂 9202:雙壓電晶片樑 9203:經形成偏移 9204:偏移/彎曲平面z偏移 9206:偏移/槽寬度 9210:SMA帶或SMA線 9212:固定端 9214:負載點端 9301:雙壓電晶片臂 9302:雙壓電晶片樑 9303:經形成偏移 9304:限制器 9306:未固定、負載點端 9308:SMA帶或SMA線 9401:雙壓電晶片臂 9402:雙壓電晶片樑 9403:經形成偏移 9404:限制器 9406:基座 9408:凹部 9410:部分 9501:雙壓電晶片臂 9502:雙壓電晶片樑 9504:經形成偏移 9506:SMA帶或SMA線 9601a:雙壓電晶片臂 9601b:雙壓電晶片臂 9602a:雙壓電晶片光樑 9602b:雙壓電晶片光樑 9604a:經形成偏移 9604b:經形成偏移 9606a:SMA帶或SMA線 9606b:SMA帶或SMA線 9608:基座 9610:雙壓電晶片致動器 9612:雙壓電晶片致動器 9614:雙壓電晶片致動器 9701:帶扣臂 9702:樑部分 9704a:負載點延伸部 9704b:負載點延伸部 9706a:端 9706b:端 9710a:負載點 9710b:負載點 9712:SMA帶或SMA線 9801:帶扣臂 9802:樑部分 9804:負載點 9810:負載點延伸部 9901:雙壓電晶片臂 9902:樑部分 9904a:負載點延伸部 9904b:負載點延伸部 9906:SMA帶或SMA線 9910a:端 9910b:端1: Bimorph arm 2: beam part 10: Load point extension 20: Shape memory alloy (SMA) optical image stabilizer 22: mobile board 24: Static board 26: spring arm 28a: The first SMA material attachment part 28b: second SMA material attachment part 30a: The first SMA material attachment part 30b: second SMA material attachment part 32a: The first SMA line 32b: The second SMA line 32c: third SMA line 32d: Fourth SMA line 40: SMA material attachment part 42: SMA attachment part 45: SMA actuator 50: island 51: Metal/Stainless Steel Base 52: Dielectric layer 53: Conductor layer 60: Buckle actuator 61: Liquid lens assembly 62: Pedestal 64: forming ring coupling/forming ring/coupling 65: Sliding base 70: Unfixed, load point end 71: Flat surface 72: SMA wire 73: Resistance welding 76: Unfixed, load point end 77: Flat surface 78: SMA wire 79: Adhesive 80: Unfixed, load point end 81: Flat surface 82: SMA wire 83: Resistance welding 84: Metal sandwich 88: Unfixed, load point end 89: flat surface 90: SMA wire 91: Adhesive 92: Metal sandwich 95: fixed end 96: flat surface 97: SMA wire 98: Resistance welding 100: Shape memory alloy (SMA) wire 101: Pedestal 102: Buckle actuator 104: central part 106: Crimp structure 108: z stroke direction 120: fixed end 121: flat surface 122: SMA line 123: Adhesive 126: fixed end 127: Flat surface 128: SMA line 129: Resistance welding 130: Metal sandwich 135: fixed end 136: Flat surface 137: SMA wire 138: Metal sandwich 139: Adhesive 143: Bimorph arm/fixed end 144: Island 145: External 146: Insulator 202: Bimorph actuator 204: Pedestal 206: SMA belt 208: z stroke direction 302: SMA actuator 304: Optical Image Stabilizer (``OIS'') 306: lens holder 308: return spring 310: Vertical sliding bearing 312: boot cover 502: Sensor 504: z direction 506: Buckle actuator 508: SMA cable 604: lens holder 606: line holder 608: Smart Memory Alloy ("SMA") Cable/Smart Memory Alloy ("SMA") Cable 610: Buckle arm 612: Spring arm 702: Sliding base 704: Assembly base 706: Sliding bearing 708: Vertical sliding surface 710: Buckle actuator 802: Buckle actuator 804: Buckle arm 806: hammock part 902: Bimorph actuator 904: lens holder 906: end 908: Pedestal 1002: Auto focus assembly 1004: position sensor 1005: z direction 1006: moving spring 1008: Magnet 1010: lens holder 1106b: SMA belt 1202: S MA material 1204: Center feed 1206: beam 1208: Center Metal 1210: Insulator 1212: opening or through hole 1214a: Power section 1214b: Grounded section 1216: Power supply contact 1218: Ground contact 1220: surface coating 1222: gap 1224: Through hole section 1226: Through hole section 1302: First buckle actuator 1304: Second buckle actuator 1306: lens holder 1314: Sliding base 1316: Sliding base 1902: First buckle actuator 1904: second buckle actuator 1906: lens holder 1914: Sliding base 1916: Sliding base 1918: base part 1920: cover part 2202: first buckle actuator 2204: second buckle actuator 2206: lens holder 2218a: Left SMA wire 2218b: Right SMA wire 2302: The first buckle actuator 2304: second buckle actuator 2305: Coupler ring 2306: lens holder 2401: Sliding base 2402: Buckle actuator 2403: return spring 2406: lens holder 2409: shell 2413: Crimp 2414: Adapter board 2415: signal trace 2501: SMA system 3000: reinforcement 3002: Buckle actuator 3003: return spring 3014: Adapter plate 3020: flexible circuit 3101: SMA system 3501: SMA bimorph liquid lens 3502: Liquid lens sub-assembly 3504: shell 3506: SMA actuator 3508: Bimorph actuator 3510: forming ring 3512: Flexible diaphragm 3514: Liquid 3516: body containment ring 3518: lens 3520: Contact 3902: SMA actuator 3904: Positive z-stroke actuator 3906: Negative z-stroke actuator 3908: SMA cable 3910: lens holder 3912: top spring 3914: Top spacer 3916: bottom spacer 3918: bottom spring 3920: Pedestal 4102: length 4103: Bimorph actuator 4104: Bonding pad 4108: extended length 4202: SMA bimorph actuator 4302: Negative actuator signal connector 4304: Pedestal 4308: Wire bond pad 4310: Adhesive layer 4314: Positive actuator signal connector 4316: Wire bond pad 4318: Adhesive layer 4322: connection pad 4602: Torsion Sensor Circuit 4604: Bimorph actuator circuit 4606: Bimorph actuator 4608: mobile carriage 4610: shell 4802: SMA actuator 4804: Shell 5002: SMA actuator 5004: SMA bimorph actuator mounted on 4 sides 5202: Bimorph actuator 5402: Bimorph actuator mounted on the bottom 5502: SMA bimorph actuator mounted on the top and bottom 5802: SMA actuator/box type bimorph actuator 5806: Bimorph actuator 6202: SMA actuator/box type bimorph actuator 6204: Bimorph actuator 6504: Shell 6506: lens holder 6602: SMA actuator 6604: Bimorph actuator/lens holder 6802: SMA actuator/box type bimorph actuator 6804: Sensor bracket 7402: SMA actuator/box type bimorph actuator 7404: Bimorph actuator 7902: SMA actuator 7904: Bimorph actuator 8402: SMA actuator 8404: Bimorph actuator 8901: lens system 8902: Folding lens 8903a: lens 8903b: Liquid lens 8903c: lens 8903d: Liquid lens 8904: Spindle 8906: Transmission axis 9001: lens system 9002a: Liquid lens 9002b: Liquid lens 9002c: Liquid lens 9002d: Liquid lens 9002e: Liquid lens 9002f: Liquid lens 9002g: Liquid lens 9002h: Liquid lens 9004: Image sensor 9100: Actuated folding lens 9102: 稜鏡 9104: Actuator 9106: Bimorph actuator 9201: bimorph arm 9202: Bimorph beam 9203: Warp formed offset 9204: Offset/curved plane z offset 9206: Offset/slot width 9210: SMA tape or SMA wire 9212: fixed end 9214: Point of Load 9301: Bimorph arm 9302: Bimorph beam 9303: Warp formed offset 9304: limiter 9306: Unfixed, point-of-load end 9308: SMA tape or SMA cable 9401: bimorph arm 9402: Bimorph beam 9403: warp formed offset 9404: limiter 9406: Pedestal 9408: recess 9410: part 9501: Bimorph arm 9502: Bimorph beam 9504: Formed offset 9506: SMA tape or SMA wire 9601a: bimorph arm 9601b: Bimorph arm 9602a: Bimorph optical beam 9602b: Bimorph optical beam 9604a: formed offset 9604b: formed offset 9606a: SMA tape or SMA wire 9606b: SMA tape or SMA cable 9608: Pedestal 9610: Bimorph actuator 9612: Bimorph actuator 9614: Bimorph actuator 9701: Buckle arm 9702: beam part 9704a: point of load extension 9704b: point of load extension 9706a: end 9706b: end 9710a: point of load 9710b: point of load 9712: SMA tape or SMA wire 9801: Buckle arm 9802: beam part 9804: point of load 9810: Point of Load Extension 9901: bimorph arm 9902: beam part 9904a: Load point extension 9904b: point of load extension 9906: SMA tape or SMA wire 9910a: end 9910b: end

在隨附圖式之圖中以實例且非限制之方式繪示本發明之實施例,其中類似元件符號指示類似元件且其中:The figures of the accompanying drawings illustrate embodiments of the present invention by way of example and not limitation, wherein similar element symbols indicate similar elements and among them:

圖1a繪示根據一實施例之包含經組態為一帶扣致動器之一SMA致動器之一透鏡總成;Figure 1a shows a lens assembly including an SMA actuator configured as a buckle actuator according to an embodiment;

圖1b繪示根據一實施例之一SMA致動器;Figure 1b shows an SMA actuator according to an embodiment;

圖2繪示根據一實施例之一SMA致動器;Figure 2 shows an SMA actuator according to an embodiment;

圖3繪示根據一實施例之包含一SMA線致動器之一自動聚焦總成的一分解圖;FIG. 3 shows an exploded view of an autofocus assembly including an SMA wire actuator according to an embodiment;

圖4繪示根據一實施例之包含一SMA致動器之自動聚焦總成;Fig. 4 shows an autofocus assembly including an SMA actuator according to an embodiment;

圖5繪示根據一實施例之包含一感測器之一SMA致動器;FIG. 5 shows an SMA actuator including a sensor according to an embodiment;

圖6繪示根據一實施例之經組態為一帶扣致動器之一SMA致動器的一俯視圖及一側視圖,該SMA致動器配備有一透鏡托架;6 shows a top view and a side view of an SMA actuator configured as a buckle actuator according to an embodiment, the SMA actuator is equipped with a lens holder;

圖7繪示根據該實施例之SMA致動器之一區段的一側視圖;Fig. 7 shows a side view of a section of the SMA actuator according to the embodiment;

圖8繪示一帶扣致動器之一實施例的多個視圖;Figure 8 shows multiple views of an embodiment of a buckle actuator;

圖9繪示根據一實施例之具有一透鏡托架之一雙壓電晶片致動器;Fig. 9 shows a bimorph actuator with a lens holder according to an embodiment;

圖10繪示根據一實施例之包含一SMA致動器之一自動聚焦總成之一剖視圖;10 shows a cross-sectional view of an auto-focus assembly including an SMA actuator according to an embodiment;

圖11a至圖11c繪示根據一些實施例之雙壓電晶片致動器之視圖;11a to 11c show views of a bimorph actuator according to some embodiments;

圖12繪示根據一實施例之一雙壓電晶片致動器之一實施例之視圖;FIG. 12 shows a view of an embodiment of a piezoelectric bimorph actuator according to an embodiment;

圖13繪示根據一實施例之一雙壓電晶片致動器的一端焊盤截面;FIG. 13 shows a cross-section of a pad of a piezoelectric bimorph actuator according to an embodiment;

圖14繪示根據一實施例之一雙壓電晶片致動器的一中心供應焊盤截面;14 shows a cross section of a center supply pad of a piezoelectric bimorph actuator according to an embodiment;

圖15繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器的一分解圖;15 shows an exploded view of an SMA actuator including one of two buckle actuators according to an embodiment;

圖16繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器;FIG. 16 shows an SMA actuator including one of two buckle actuators according to an embodiment;

圖17繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器的一側視圖;FIG. 17 shows a side view of an SMA actuator including one of two buckle actuators according to an embodiment;

圖18繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器的一側視圖;18 shows a side view of an SMA actuator including one of two buckle actuators according to an embodiment;

圖19繪示根據一實施例之包含一SMA致動器之一總成的一分解圖,該SMA致動器包含兩個帶扣致動器;FIG. 19 shows an exploded view of an assembly including an SMA actuator according to an embodiment, the SMA actuator including two buckle actuators;

圖20繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器;FIG. 20 shows an SMA actuator including one of two buckle actuators according to an embodiment;

圖21繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器;Figure 21 shows an SMA actuator including one of two buckle actuators according to an embodiment;

圖22繪示根據一實施例之包含兩個帶扣致動器之一SMA致動器;Figure 22 shows an SMA actuator including one of two buckle actuators according to an embodiment;

圖23繪示根據一實施例之包含兩個帶扣致動器及一耦接器之一SMA致動器;FIG. 23 shows an SMA actuator including two buckle actuators and a coupler according to an embodiment;

圖24繪示根據一實施例之包含一SMA致動器之一SMA系統的一分解圖,該SMA致動器包含具有一層壓吊床之一帶扣致動器;FIG. 24 shows an exploded view of an SMA system including an SMA actuator including a buckle actuator having a laminated hammock according to an embodiment;

圖25繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含具有一層壓吊床之一帶扣致動器2402;25 illustrates an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a buckle actuator 2402 having a laminated hammock;

圖26繪示根據一實施例之包含一層壓吊床之一帶扣致動器;Figure 26 illustrates a buckle actuator including a laminated hammock according to an embodiment;

圖27繪示根據一實施例之一SMA致動器之一層壓吊床;Figure 27 illustrates a laminated hammock of an SMA actuator according to an embodiment;

圖28繪示根據一實施例之一SMA致動器之一層壓形成壓接物連接件;FIG. 28 illustrates a laminate of an SMA actuator according to an embodiment to form a crimp connection piece;

圖29繪示包含具有一層壓吊床之一帶扣致動器之一SMA致動器;Figure 29 shows an SMA actuator including a buckle actuator with a laminated hammock;

圖30繪示根據一實施例之包含一SMA致動器之一SMA系統的一分解圖,該SMA致動器包含一帶扣致動器;30 shows an exploded view of an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a buckle actuator;

圖31繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含一帶扣致動器;FIG. 31 shows an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a buckle actuator;

圖32繪示根據一實施例之包含一帶扣致動器之一SMA致動器;FIG. 32 shows an SMA actuator including a buckle actuator according to an embodiment;

圖33繪示根據一實施例之一SMA致動器之一對帶扣臂之一雙軛捕獲接頭;Figure 33 illustrates a dual yoke capture joint of an SMA actuator to a buckle arm according to an embodiment;

圖34繪示根據一實施例之一SMA致動器之一電阻焊壓接物,該SMA致動器用來將一SMA線附接至帶扣致動器;FIG. 34 shows a resistance welding crimp of an SMA actuator according to an embodiment, the SMA actuator is used to attach an SMA wire to the buckle actuator;

圖35繪示包含具有一雙軛捕獲接頭之一帶扣致動器之一SMA致動器;Figure 35 shows an SMA actuator including a buckle actuator with a double yoke capture joint;

圖36繪示根據一實施例之一SMA雙壓電晶片液體透鏡;Fig. 36 shows an SMA bimorph liquid lens according to an embodiment;

圖37繪示根據一實施例之一透視SMA雙壓電晶片液體透鏡;Fig. 37 shows a see-through SMA bimorph liquid lens according to an embodiment;

圖38繪示根據一實施例之SMA雙壓電晶片液體透鏡的一截面及一仰視圖;38 shows a cross-section and a bottom view of an SMA bimorph liquid lens according to an embodiment;

圖39繪示根據一實施例之包含具有雙壓電晶片致動器之一SMA致動器之一SMA系統;FIG. 39 shows an SMA system including an SMA actuator with a bimorph actuator according to an embodiment;

圖40繪示根據一實施例之具有雙壓電晶片致動器之SMA致動器;FIG. 40 shows an SMA actuator with a bimorph actuator according to an embodiment;

圖41繪示一雙壓電晶片致動器之長度及用於一SMA線使線長度延伸超出雙壓電晶片致動器之一鍵合焊盤之位置;Figure 41 shows the length of a piezoelectric bimorph actuator and the position of a bonding pad used for an SMA wire to extend the wire length beyond the piezoelectric bimorph actuator;

圖42繪示根據一實施例之包含一雙壓電晶片致動器之一SMA系統的一分解圖;FIG. 42 shows an exploded view of an SMA system including a piezoelectric bimorph actuator according to an embodiment;

圖43繪示根據一實施例之SMA致動器之一子區段的一分解圖;Figure 43 shows an exploded view of a subsection of the SMA actuator according to an embodiment;

圖44繪示根據一實施例之SMA致動器之一子區段;Figure 44 shows a subsection of an SMA actuator according to an embodiment;

圖45繪示根據一實施例之一5軸感測器移位系統;FIG. 45 shows a 5-axis sensor displacement system according to an embodiment;

圖46繪示根據一實施例之一5軸感測器移位系統的一分解圖;Fig. 46 shows an exploded view of a 5-axis sensor shift system according to an embodiment;

圖47繪示根據一實施例之包含整合至此電路中以用於所有運動之雙壓電晶片致動器之一SMA致動器;FIG. 47 shows an SMA actuator including a bimorph actuator integrated into the circuit for all movements according to an embodiment;

圖48繪示根據一實施例之包含整合至此電路中以用於所有運動之雙壓電晶片致動器之一SMA致動器;FIG. 48 shows an SMA actuator including a bimorph actuator integrated into the circuit for all movements according to an embodiment;

圖49繪示根據一實施例之一5軸感測器移位系統的一截面;FIG. 49 illustrates a cross-section of a 5-axis sensor displacement system according to an embodiment;

圖50繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器;FIG. 50 shows an SMA actuator including a bimorph actuator according to an embodiment;

圖51繪示根據一實施例之包含在不同的x及y位置中移動一影像感測器之雙壓電晶片致動器之一SMA致動器的一俯視圖;FIG. 51 shows a top view of an SMA actuator including a bimorph actuator that moves an image sensor in different x and y positions according to an embodiment;

圖52繪示根據一實施例之經組態為一盒式雙壓電晶片自動聚焦裝置之包含雙壓電晶片致動器之一SMA致動器;FIG. 52 shows an SMA actuator including a piezoelectric bimorph actuator configured as a box-type bimorph autofocus device according to an embodiment;

圖53繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器;FIG. 53 shows an SMA actuator including a bimorph actuator according to an embodiment;

圖54繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器;FIG. 54 shows an SMA actuator including a bimorph actuator according to an embodiment;

圖55繪示根據一實施例之包含雙壓電晶片致動器之一SMA致動器;FIG. 55 shows an SMA actuator including a bimorph actuator according to an embodiment;

圖56繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;FIG. 56 shows an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator;

圖57繪示根據一實施例之包含一SMA致動器之SMA系統的一分解圖,該SMA致動器包含經組態為一雙軸透鏡移位OIS之雙壓電晶片致動器;FIG. 57 shows an exploded view of an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator configured as a biaxial lens shift OIS;

圖58繪示根據一實施例之包含一SMA致動器之SMA系統的一截面,該SMA致動器包含經組態為一雙軸透鏡移位OIS之雙壓電晶片致動器;Figure 58 shows a cross-section of an SMA system including an SMA actuator including a bimorph actuator configured as a biaxial lens shift OIS according to an embodiment;

圖59繪示根據一實施例之一盒式雙壓電晶片致動器;Fig. 59 shows a box-type bimorph actuator according to an embodiment;

圖60繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;FIG. 60 shows an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator;

圖61繪示根據一實施例之包含一SMA致動器之SMA系統的一分解圖,該SMA致動器包含雙壓電晶片致動器;Fig. 61 shows an exploded view of an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator;

圖62繪示根據一實施例之包含一SMA致動器之SMA系統的一截面,該SMA致動器包含雙壓電晶片致動器;FIG. 62 shows a cross-section of an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator;

圖63繪示根據一實施例之盒式雙壓電晶片致動器;Fig. 63 shows a box-type bimorph actuator according to an embodiment;

圖64繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;FIG. 64 illustrates an SMA system including an SMA actuator, the SMA actuator including a bimorph actuator, according to an embodiment;

圖65繪示根據一實施例之包含一SMA致動器之一SMA系統的一分解圖,該SMA致動器包含雙壓電晶片致動器;FIG. 65 shows an exploded view of an SMA system including an SMA actuator, the SMA actuator including a bimorph actuator, according to an embodiment;

圖66繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;FIG. 66 illustrates an SMA system including an SMA actuator including a bimorph actuator according to an embodiment;

圖67繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;FIG. 67 illustrates an SMA system including an SMA actuator including a bimorph actuator according to an embodiment;

圖68繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;FIG. 68 illustrates an SMA system including an SMA actuator including a bimorph actuator according to an embodiment;

圖69繪示根據一實施例之包含一SMA致動器之SMA的一分解圖,該SMA致動器包含雙壓電晶片致動器;FIG. 69 shows an exploded view of an SMA including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator;

圖70繪示根據一實施例之包含一SMA致動器之SMA系統的一截面,該SMA致動器包含經組態為一3軸感測器移位OIS之雙壓電晶片致動器;FIG. 70 shows a cross-section of an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator configured as a 3-axis sensor shift OIS;

圖71繪示根據一實施例之一盒式雙壓電晶片致動器組件;Figure 71 shows a box-type bimorph actuator assembly according to an embodiment;

圖72繪示根據一實施例之用於一SMA系統中之一撓性感測器電路;FIG. 72 shows a flex sensor circuit used in an SMA system according to an embodiment;

圖73繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;FIG. 73 shows an SMA system including an SMA actuator including a bimorph actuator according to an embodiment;

圖74繪示根據一實施例之包含一SMA致動器之SMA系統的一分解圖,該SMA致動器包含雙壓電晶片致動器;FIG. 74 shows an exploded view of an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator;

圖75繪示根據一實施例之包含一SMA致動器之SMA系統的一截面;FIG. 75 shows a cross-section of an SMA system including an SMA actuator according to an embodiment;

圖76繪示根據一實施例之盒式雙壓電晶片致動器;Fig. 76 shows a box-type bimorph actuator according to an embodiment;

圖77繪示根據一實施例之用於一SMA系統中之一撓性感測器電路;Figure 77 shows a flex sensor circuit used in an SMA system according to an embodiment;

圖78繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;FIG. 78 shows an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator;

圖79繪示根據一實施例之包含一SMA致動器之SMA系統的一分解圖,該SMA致動器包含雙壓電晶片致動器;FIG. 79 shows an exploded view of an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator;

圖80繪示根據一實施例之包含一SMA致動器之SMA系統的一截面;80 shows a cross-section of an SMA system including an SMA actuator according to an embodiment;

圖81繪示根據一實施例之盒式雙壓電晶片致動器;Figure 81 shows a cassette type bimorph actuator according to an embodiment;

圖82繪示根據一實施例之用於一SMA系統中之一撓性感測器電路;Figure 82 shows a flex sensor circuit used in an SMA system according to an embodiment;

圖83繪示根據一實施例之包含一SMA致動器之一SMA系統,該SMA致動器包含雙壓電晶片致動器;FIG. 83 shows an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator;

圖84繪示根據一實施例之包含一SMA致動器之SMA系統的一分解圖;FIG. 84 shows an exploded view of an SMA system including an SMA actuator according to an embodiment;

圖85繪示根據一實施例之包含一SMA致動器之SMA系統的一截面,該SMA致動器包含雙壓電晶片致動器;FIG. 85 shows a cross-section of an SMA system including an SMA actuator according to an embodiment, the SMA actuator including a bimorph actuator;

圖86繪示根據一實施例之用於一SMA系統中之盒式雙壓電晶片致動器;FIG. 86 shows a box-type bimorph actuator used in an SMA system according to an embodiment;

圖87繪示根據一實施例之用於一SMA系統中之一撓性感測器電路;Fig. 87 shows a flex sensor circuit used in an SMA system according to an embodiment;

圖88繪示根據實施例之一SMA致動器之一雙壓電晶片致動器之實例性尺寸;Fig. 88 shows an exemplary size of a bimorph actuator of an SMA actuator according to an embodiment;

圖89繪示根據一實施例之用於一折疊式相機的一透鏡系統;FIG. 89 shows a lens system for a folding camera according to an embodiment;

圖90繪示根據一實施例之包含液體透鏡的一透鏡系統之若干實施例;FIG. 90 shows several embodiments of a lens system including a liquid lens according to an embodiment;

圖91繪示根據一實施例之作為一稜鏡、安置於一致動器上之一折疊透鏡;Fig. 91 shows a folding lens as a ridge and arranged on an actuator according to an embodiment;

圖92繪示根據一實施例之具有一偏移之一雙壓電晶片臂;Figure 92 shows a bimorph arm with an offset according to an embodiment;

圖93繪示根據一實施例之具有一偏移及一限制器之一雙壓電晶片臂;Fig. 93 shows a bimorph arm with an offset and a limiter according to an embodiment;

圖94繪示根據一實施例之具有一偏移及一限制器之一雙壓電晶片臂;FIG. 94 shows a bimorph arm with an offset and a limiter according to an embodiment;

圖95繪示根據一實施例之包含具有一偏移之一雙壓電晶片臂的一基座之一實施例;FIG. 95 shows an embodiment of a base including a piezoelectric bimorph arm with an offset according to an embodiment;

圖96繪示根據一實施例之包含具有一偏移之兩個雙壓電晶片臂的一基座之一實施例;FIG. 96 illustrates an embodiment of a pedestal including two piezoelectric bimorph arms with an offset according to an embodiment;

圖97繪示根據一實施例之包含負載點延伸部之一帶扣臂;Fig. 97 shows a buckle arm including a load point extension according to an embodiment;

圖98繪示根據一實施例之包含負載點延伸部9810之一帶扣臂9801;FIG. 98 shows a buckle arm 9801 including a point-of-load extension 9810 according to an embodiment;

圖99繪示根據一實施例之包含負載點延伸部之一雙壓電晶片臂;FIG. 99 shows a piezoelectric bimorph arm including a point-of-load extension according to an embodiment;

圖100繪示根據一實施例之包含負載點延伸部之一雙壓電晶片臂;FIG. 100 shows a piezoelectric bimorph arm including a point-of-load extension according to an embodiment;

圖101繪示根據一實施例之一SMA光學影像穩定器;FIG. 101 shows an SMA optical image stabilizer according to an embodiment;

圖102繪示根據一實施例之一移動部分之一SMA材料附接部分40;FIG. 102 shows an SMA material attachment part 40 of a moving part according to an embodiment;

圖103繪示根據一實施例之一靜態板之一SMA附接部分,其中電阻焊接SMA線經附接至該SMA附接部分;FIG. 103 shows an SMA attachment part of a static board according to an embodiment, in which a resistance welding SMA wire is attached to the SMA attachment part;

圖104繪示根據一實施例之包含一帶扣致動器之一SMA致動器45;FIG. 104 shows an SMA actuator 45 including a buckle actuator according to an embodiment;

圖105a至圖105b繪示根據一實施例之包含用於一SMA致動器之一島狀物之一電阻焊壓接物;105a to 105b illustrate a resistance welding crimp including an island for an SMA actuator according to an embodiment;

圖106繪示根據一實施例之彎曲平面z偏移、槽寬度與一雙壓電晶片樑之峰值力之間的關係;FIG. 106 shows the relationship between the z-offset of the bending plane, the groove width, and the peak force of a piezoelectric bimorph beam according to an embodiment;

圖107繪示根據一實施例之作為環繞整個雙壓電晶片致動器之一盒之一近似物之一盒體積如何與每個雙壓電晶片組件之功相關之實例;FIG. 107 shows an example of how the volume of a box as an approximation of a box surrounding the entire bimorph actuator is related to the work of each bimorph assembly according to an embodiment;

圖108繪示根據一實施例之使用帶扣致動器致動之一液體透鏡;Fig. 108 illustrates the use of a buckle actuator to actuate a liquid lens according to an embodiment;

圖109繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端;FIG. 109 illustrates an unfixed, load point end of a piezoelectric bimorph arm according to an embodiment;

圖110繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端;FIG. 110 illustrates an unfixed, load point end of a piezoelectric bimorph arm according to an embodiment;

圖111繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端;FIG. 111 illustrates an unfixed, load point end of a piezoelectric bimorph arm according to an embodiment;

圖112繪示根據一實施例之一雙壓電晶片臂之一未固定、負載點端;Fig. 112 shows an unfixed, load point end of a piezoelectric bimorph arm according to an embodiment;

圖113繪示根據一實施例之一雙壓電晶片臂之一固定端;FIG. 113 shows a fixed end of a piezoelectric bimorph arm according to an embodiment;

圖114繪示根據一實施例之一雙壓電晶片臂之一固定端;Fig. 114 shows a fixed end of a piezoelectric bimorph arm according to an embodiment;

圖115繪示根據一實施例之一雙壓電晶片臂之一固定端;FIG. 115 shows a fixed end of a piezoelectric bimorph arm according to an embodiment;

圖116繪示根據一實施例之一雙壓電晶片臂之一固定端;及Fig. 116 shows a fixed end of a piezoelectric bimorph arm according to an embodiment; and

圖117繪示根據一實施例之一雙壓電晶片臂之一固定端之一後視圖。FIG. 117 shows a rear view of a fixed end of a piezoelectric bimorph arm according to an embodiment.

9212:固定端 9212: fixed end

9214:負載點端 9214: Point of Load

Claims (30)

一種致動器,其包括: 一樑部分; 一固定端; 一負載點端,該樑部分經安置於該固定端與該負載點端之間;及 形狀記憶合金(SMA)材料,其經貼附至該固定端及該負載點端。An actuator, which includes: A beam part A fixed end A load point end, the beam part is arranged between the fixed end and the load point end; and A shape memory alloy (SMA) material is attached to the fixed end and the load point end. 如請求項1之致動器,其包含一限制器。Such as the actuator of claim 1, which includes a limiter. 如請求項1之致動器,其中該負載點端經組態以使用一電阻焊來貼附該SMA材料。Such as the actuator of claim 1, wherein the load point end is configured to use a resistance welding to attach the SMA material. 如請求項1之致動器,其中該固定端經組態以使用一電阻焊來貼附該SMA材料。Such as the actuator of claim 1, wherein the fixed end is configured to use a resistance welding to attach the SMA material. 如請求項4之致動器,其中該固定端包含一平坦表面。The actuator of claim 4, wherein the fixed end includes a flat surface. 如請求項5之致動器,其中該SMA材料藉由該電阻焊貼附至該平坦表面。The actuator of claim 5, wherein the SMA material is attached to the flat surface by the resistance welding. 如請求項6之致動器,其中一黏合劑經安置於該電阻焊及該平坦表面之至少一部分上。Such as the actuator of claim 6, wherein one of the adhesives is disposed on at least a part of the resistance welding and the flat surface. 如請求項5之致動器,其包括安置於該平坦表面上之一金屬夾層。Such as the actuator of claim 5, which includes a metal interlayer disposed on the flat surface. 如請求項3之致動器,其中該固定端包含一平坦表面。The actuator of claim 3, wherein the fixed end includes a flat surface. 如請求項9之致動器,其中該SMA材料藉由該電阻焊貼附至該平坦表面。The actuator of claim 9, wherein the SMA material is attached to the flat surface by the resistance welding. 如請求項10之致動器,其中一黏合劑經安置於該電阻焊及該平坦表面之至少一部分上。Such as the actuator of claim 10, wherein an adhesive is disposed on at least a part of the resistance welding and the flat surface. 如請求項9之致動器,其包括安置於該平坦表面上之一金屬夾層。The actuator of claim 9, which includes a metal interlayer disposed on the flat surface. 如請求項10之致動器,其包括在與該電阻焊相對之一側上形成於該固定端上之一島狀物,該島狀物與該SMA材料電耦接。The actuator of claim 10, which includes an island formed on the fixed end on a side opposite to the resistance welding, and the island is electrically coupled to the SMA material. 如請求項1之致動器,其中該樑部分包含一經形成偏移。The actuator of claim 1, wherein the beam portion includes a formed offset. 如請求項14之致動器,其包括經組態以相鄰於該經形成偏移之一限制器。Such as the actuator of claim 14, which includes a limiter configured to be adjacent to the formed offset. 如請求項15之致動器,其中該限制器經形成為一基座之部分。The actuator of claim 15, wherein the limiter is formed as part of a base. 如請求項1之致動器,其中該SMA材料係一SMA線。Such as the actuator of claim 1, wherein the SMA material is an SMA wire. 如請求項1之致動器,其包括一或多個負載點延伸部。Such as the actuator of claim 1, which includes one or more load point extensions. 如請求項18之致動器,其中該一或多個負載點延伸部與該樑部分成一角度形成。The actuator of claim 18, wherein the one or more load point extensions are formed at an angle with the beam portion. 如請求項18之致動器,其中該一或多個負載點延伸部與該樑部分平行地形成。The actuator of claim 18, wherein the one or more load point extensions are formed parallel to the beam portion. 一種致動器,其包括: 一基座;及 一或多個雙壓電晶片臂,該一或多個雙壓電晶片臂包含: 一樑部分; 一固定端; 一負載點端,該樑部分經安置於該固定端與該負載點端之間;及 形狀記憶合金(SMA)材料,其經貼附至該固定端及該負載點端。An actuator, which includes: A base; and One or more bimorph arms, the one or more bimorph arms comprising: A beam part A fixed end A load point end, the beam part is arranged between the fixed end and the load point end; and A shape memory alloy (SMA) material is attached to the fixed end and the load point end. 如請求項21之致動器,其中該一或多個雙壓電晶片臂之該SMA材料係一SMA線。The actuator of claim 21, wherein the SMA material of the one or more bimorph arms is an SMA wire. 如請求項21之致動器,其中該等雙壓電晶片臂與該基座一體地形成。The actuator of claim 21, wherein the bimorph arms are integrally formed with the base. 如請求項21之致動器,其中該一或多個雙壓電晶片臂之該固定端及該負載點端之至少一者包含一平坦表面。The actuator of claim 21, wherein at least one of the fixed end and the load point end of the one or more bimorph arms includes a flat surface. 如請求項24之致動器,其中該一或多個雙壓電晶片臂之該SMA材料藉由一電阻焊貼附至該固定端及該負載點端之至少一者之該平坦表面。The actuator of claim 24, wherein the SMA material of the one or more bimorph arms is attached to the flat surface of at least one of the fixed end and the load point end by a resistance welding. 如請求項25之致動器,其中一黏合劑經安置於該電阻焊與該固定端及該負載點端之至少一者之該平坦表面上。Such as the actuator of claim 25, wherein an adhesive is disposed on the flat surface of the resistance welding and at least one of the fixed end and the load point end. 如請求項25之致動器,其中該固定端及該負載點端之至少一者包含安置於該平坦表面上之一金屬夾層。The actuator of claim 25, wherein at least one of the fixed end and the load point end includes a metal interlayer disposed on the flat surface. 如請求項25之致動器,其包括在與該電阻焊相對之一側上形成於該固定端及該負載點端之至少一者上之一島狀物,該島狀物與該SMA材料電耦接。The actuator of claim 25, which includes an island formed on at least one of the fixed end and the load point end on a side opposite to the resistance welding, the island and the SMA material Electrically coupled. 如請求項21之致動器,其中該一或多個雙壓電晶片臂之該樑部分包含一經形成偏移。The actuator of claim 21, wherein the beam portion of the one or more piezoelectric bimorph arms includes a formed offset. 如請求項29之致動器,其中該一或多個雙壓電晶片臂包含經組態以相鄰於該經形成偏移之一限制器。The actuator of claim 29, wherein the one or more piezoelectric bimorph arms include a limiter configured to be adjacent to the formed offset.
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