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TW201836957A - Device handler, and transferring method for device - Google Patents

Device handler, and transferring method for device Download PDF

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Publication number
TW201836957A
TW201836957A TW107107737A TW107107737A TW201836957A TW 201836957 A TW201836957 A TW 201836957A TW 107107737 A TW107107737 A TW 107107737A TW 107107737 A TW107107737 A TW 107107737A TW 201836957 A TW201836957 A TW 201836957A
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TW
Taiwan
Prior art keywords
component
loading
tray
refining
tool
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Application number
TW107107737A
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Chinese (zh)
Inventor
柳弘俊
Original Assignee
南韓商宰體有限公司
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Publication of TW201836957A publication Critical patent/TW201836957A/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867Handlers or transport devices, e.g. loaders, carriers, trays
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention relates to a device handler and, more specifically, to a device handler which withdraws a device then inserts a new device into a board having a plurality of device sockets mounted thereon. Disclosed is a device handler capable of more quickly performing device withdrawal and insertion operations by comprising: a first board table (210) for moving a board (20) for device withdrawal in a Y-axis direction; and a second board table (220) for moving the board (20) for device insertion, in which a DC test was performed, in the Y-axis direction by receiving the board (20), from which the device (10) is withdrawn, from the first board table (210).

Description

元件處理器及元件傳輸方法  Component processor and component transmission method  

本發明涉及元件處理器,尤其是涉及在設置有複數個元件插座的煉板導出元件之後插入新的元件的元件處理器,以及拾取並放置元件的元件拾取和放置方法。 BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to an element processor, and more particularly to an element processor for inserting a new element after a refining plate deriving element provided with a plurality of component sockets, and a component picking and placing method for picking up and placing the component.

半導體元件(以下,稱為「元件」)在完成封裝製程之後,進行對電氣特性、熱或者壓力的可靠性檢查等各種檢查。 The semiconductor element (hereinafter referred to as "element") performs various inspections such as reliability inspection of electrical characteristics, heat, or pressure after the packaging process is completed.

在這種對半導體元件的檢查中有例如老化測試(Burn-in Test),老化測試是指在老化測試基板(Burn-in Board)的元件插座21插入複數個元件,將該老化測試基板收納於老化測試裝置內,施加預定時間的熱或壓力之後,判別是否出現不合格的元件。 In the inspection of the semiconductor element, for example, a burn-in test is performed. The burn-in test means that a plurality of components are inserted in the component socket 21 of the Burn-in Board, and the burn-in test substrate is accommodated in the test. In the burn-in test apparatus, after a predetermined time of heat or pressure is applied, it is discriminated whether or not a defective component is present.

老化測試用元件處理器一般是指如下的裝置:根據合格、不合格等各個元件分別的檢查結果和賦予的分類基準,從正在搭載完成老化測試的元件的老化測試基板將元件分類(卸載)至各個托盤,同時在放置過元件的老化測試基板的空位置(插座)重新插入待執行老化測試的元件。 The component device for aging test generally refers to a device that classifies (unloads) components from an aged test substrate on which components that are performing the burn-in test are mounted, according to inspection results of respective components such as pass and fail, and classification criteria given thereto. Each of the trays was reinserted into the component to be subjected to the burn-in test at the empty position (socket) of the burn-in test substrate on which the component was placed.

另外,如上所述的元件處理器的性能通過每單位時間的分揀個數(UPH:Units Per Hour)來評價,UPH由構成元件處理器的各個構成要素之間中移送元件、移送老化測試基板的所需時間來決定。 In addition, the performance of the component processor as described above is evaluated by the number of sorting per unit time (UPH: Units Per Hour), and the UPH transfers the components between the constituent elements constituting the component processor, and transfers the aged test substrate. The time required to decide.

因此,為了提高元件處理器的性能,即UPH,需改善各個構成要素的結構及配置。 Therefore, in order to improve the performance of the component processor, that is, UPH, it is necessary to improve the structure and configuration of each component.

如上所述,作為用於提高UPH的元件處理器如下:韓國註冊專利第10-1133188號(專利文獻1)、韓國註冊專利第10-1177319號(專利文獻2)及韓國公開專利第10-2016-48628號(專利文獻3)等。 As described above, the component processor for improving the UPH is as follows: Korean Patent No. 10-1133188 (Patent Document 1), Korean Patent No. 10-1177319 (Patent Document 2), and Korean Patent Publication No. 10-2016 -48628 (Patent Document 3) and the like.

另一方面,隨著SD RAM到最近的NAND快閃記憶體等的規格化元件的市場規模不斷擴大,大量生產也正在不斷擴大。 On the other hand, as the market size of SD RAM to the standardized components such as the recent NAND flash memory continues to expand, mass production is also expanding.

另外,在大量生產元件時,也增加了對元件的檢查需求;隨著後續製程設置複數個元件處理器,以用於根據檢查結果分類元件,根據元件處理器的物流供應結構裝置的佔據空間有所不同,對於該裝置的托盤、煉板等的供應結構在裝置的佈置中是非常重要的因素。 In addition, in the mass production of components, the inspection requirements for components are also increased; with the subsequent process setting a plurality of component processors for classifying components according to the inspection results, according to the space occupied by the component processor's logistics supply structure device Differently, the supply structure of the tray, the plate, and the like of the device is a very important factor in the arrangement of the device.

而且,元件(即,被處理的物件)處於小型化,薄型化的趨勢,特別是在底面形成有用於與外部端子連接的複數個端子,而各端子間的間距也趨於縮小,因此應具有能夠充分應對這一趨勢的性能。 Moreover, the component (that is, the object to be processed) is in a trend of miniaturization and thinning, and in particular, a plurality of terminals for connecting to external terminals are formed on the bottom surface, and the pitch between the terminals is also tended to be reduced, so Ability to fully cope with the performance of this trend.

《專利文獻》  Patent Literature  

(專利文獻1)KR10-1133188 B (Patent Document 1) KR10-1133188 B

(專利文獻2)KR10-1177319 B (Patent Document 2) KR10-1177319 B

(專利文獻3)KR1020160048628 A (Patent Document 3) KR1020160048628 A

(專利文獻4)KR10-0805655 B (Patent Document 4) KR10-0805655 B

(專利文獻5)KR10-1177319 B (Patent Document 5) KR10-1177319 B

(專利文獻6)KR10-1216359 B (Patent Document 6) KR10-1216359 B

(專利文獻7)KR1020150122031 A (Patent Document 7) KR1020150122031 A

(專利文獻8)KR1020130099783 A (Patent Document 8) KR1020130099783 A

本發明的目的在於,認識到如上所述的問題以及趨勢,提供能夠對設置有元件插座的煉板更加快速執行元件導出以及元件插入作業的元件處理器。 SUMMARY OF THE INVENTION An object of the present invention is to provide an element processor capable of performing component derivation and component insertion work more quickly on a refining plate provided with a component socket, in view of the problems and trends as described above.

本發明的另一目的在於,提供可以由元件處理器對各種規格的元件有效拾取並放置元件的元件拾取和放置方法。 Another object of the present invention is to provide a component picking and placing method that can efficiently pick up and place components of components of various specifications by an element processor.

本發明是為了達成如上所述的目的而提出的,本發明揭露一種元件處理器,包括:一第一煉板台210,從一煉板裝載器800接收設置有複數個元件插座21的一煉板20,並以一Y軸方向移動煉板20,進而導出插入於元件插座21的元件10,其中元件插座21插入有元件10;一卸載緩衝部310,設置在第一煉板台210的一側,並以Y軸方向設定一元件卸載位置UL1和一元件分揀位置UL2, 向元件卸載位置UL1和元件分揀位置UL2輪流設置複數個托盤30,其中元件卸載位置UL1從位於第一煉板台210的煉板20接收元件10,元件分揀位置UL2根據預先設定的分類基準分類裝載元件10;一卸載運送工具510,從位於第一煉板台210的煉板20導出元件10,將元件10運送到位於元件卸載位置UL1的該托盤30;一分揀托盤部320,鄰接於卸載緩衝部310的元件分揀位置UL2,根據預先設定的分類等級以一X軸方向放置複數個托盤30;一元件分揀工具520,根據預先設定的分類等級,將元件10分別再配置在位於元件分揀位置UL2的托盤30以及位於分揀托盤部320的托盤30;一第二煉板台220,以X軸方向從第一煉板台210接收完成元件導出的煉板20,並以Y軸方向移動煉板20,以使新的元件10插入於煉板20的元件插座21;一DC測試部230,設置以鄰接第二煉板台220,並且以X軸方向配置用於DC測試的一DC測試插座231;一裝載運送工具530,從DC測試部230導出檢查為合格品的元件10,將元件10插入於第二煉板台220的元件插座21;一裝載托盤部110,設置以鄰接DC測試部230,並且設置有用於向DC測試部230供應元件10的一個以上的托盤30;一DC不合格品托盤部120,鄰接於DC測試部230,對於裝載托盤部110以X軸方向配置有一個以上的托盤30,以根據DC測試部230檢查為不合格品的檢查結果分類裝載元件10;以及一個以上的元件裝載工具540,用於從裝載托盤部110向DC測試部230傳送元件,以及從DC測試部230向DC不合格品托盤部120傳送元件。 The present invention has been made in order to achieve the above object. The present invention discloses a component processor comprising: a first refining table 210, receiving a refining provided with a plurality of component sockets 21 from a refining plate loader 800 The plate 20 moves the plate 20 in a Y-axis direction to derive the component 10 inserted into the component socket 21, wherein the component socket 21 is inserted with the component 10; an unloading buffer portion 310 is disposed at the first platen 210 Side, and a component unloading position UL1 and a component sorting position UL2 are set in the Y-axis direction, and a plurality of trays 30 are alternately arranged to the component unloading position UL1 and the component sorting position UL2, wherein the component unloading position UL1 is located at the first refining plate The refining plate 20 of the stage 210 receives the component 10, and the component sorting position UL2 sorts the loading component 10 according to a predetermined sorting criterion; an unloading transporting tool 510 derives the component 10 from the refining plate 20 located at the first refining plate 210, and the component 10 is transported to the tray 30 at the component unloading position UL1; a sorting tray portion 320 is adjacent to the component sorting position UL2 of the unloading buffer portion 310, and is placed in an X-axis direction according to a predetermined classification level. a tray 30; a component sorting tool 520, which reconfigures the components 10 in the tray 30 at the component sorting position UL2 and the tray 30 in the sorting tray portion 320 according to a predetermined classification level; a second panel The stage 220 receives the refining plate 20 from which the component is led out from the first refining plate 210 in the X-axis direction, and moves the refining plate 20 in the Y-axis direction so that the new component 10 is inserted into the component socket 21 of the refining plate 20; The DC test unit 230 is disposed adjacent to the second refining table 220, and is configured with a DC test socket 231 for DC test in the X-axis direction; a loading and transporting tool 530, and the component that is inspected as a good product is output from the DC test unit 230. 10, the component 10 is inserted into the component socket 21 of the second pallet station 220; a loading tray section 110 is provided adjacent to the DC test section 230, and one or more trays 30 for supplying the component 10 to the DC test section 230 are provided. The DC defective product tray unit 120 is adjacent to the DC test unit 230, and one or more trays 30 are disposed in the X-axis direction with respect to the loading tray unit 110, and are classified and loaded according to the inspection result of the defective test by the DC test unit 230. Element 10; and one Loading tool element 540, a DC test unit for conveying member 230, and transmitting the tray 230 to the DC defective portion 120 from the loading tray element portion 110 from the DC test unit.

該元件處理器以X軸方向設定一第一煉板運送線BL1,以從煉板裝載器800向第一煉板台210傳送煉板20;以X軸方向設定一第二煉板運送線BL2,以從第二煉板台210向煉板裝載器800傳送煉板20;第二煉板運送線BL2位於比第一煉板運送線BL1更低的下側,以防止與第一煉板運送線BL1發生干涉。 The component processor sets a first plate transport line BL1 in the X-axis direction to transfer the refining plate 20 from the plate loader 800 to the first refining plate 210; and sets a second plate transport line BL2 in the X-axis direction. To transfer the refining plate 20 from the second refining table 210 to the refining plate loader 800; the second refining plate conveying line BL2 is located on the lower side than the first refining plate conveying line BL1 to prevent transportation with the first refining plate Line BL1 interferes.

卸載緩衝部310可以包括:一對托盤30,輪流位於元件卸載位置UL1以及元件分揀位置UL2;以及一托盤運送部311,移動托盤30,以使一對托盤30輪流位於元件卸載位置UL1以及元件分揀位置UL2。 The unloading buffer portion 310 may include a pair of trays 30 that are alternately located at the component unloading position UL1 and the component sorting position UL2, and a tray transporting portion 311 that moves the tray 30 such that the pair of trays 30 are alternately positioned at the component unloading position UL1 and the components Sorting position UL2.

卸載運送工具510結合一圖像獲取部519,該圖像獲取部519在導出元件10之後拍攝元件插座21的圖像,以確認在煉板20上各個元件插座21的連接端子的位置。 The unloading conveyance tool 510 is combined with an image acquisition section 519 that takes an image of the component socket 21 after deriving the component 10 to confirm the position of the connection terminal of each component socket 21 on the refining plate 20.

本發明揭露一種元件拾取和放置方法,通過一運送工具從一第一裝載部拾取一元件10放置到一第二裝載部,其中該運送工具以一間隔距離x設置有k個拾取器,該第一裝載部以一第一間隔距離x1設置有m個元件10,該第二裝 載部以一第二間隔距離x2配置插入元件10的n個裝載槽,該第二間隔距離x2與該第一間隔距離x1不同,其中,該方法包括:一第一拾取步驟,當該第一間隔距離x1小於該第二間隔距離x2一預定尺寸時,將該運送工具的該間隔距離x設定成該第一裝載部中的該第一間隔距離x1的兩倍,從該第一裝載部每間隔一個地拾取元件10;一第二拾取步驟,將在該第一拾取步驟中未拾取元件10的拾取器設置成該第一裝載部的該第一間隔距離x1的兩倍,進而每間隔一個地從該第一裝載部拾取元件10;一放置步驟,該運送工具向該第二裝載部移動的同時將一第三間隔距離x3設定成該第二間隔距離x2,將元件10分別放置於該第二裝載部的裝載槽。 The invention discloses a component picking and placing method for picking up a component 10 from a first loading portion by a transporting tool and placing it on a second loading portion, wherein the transporting tool is provided with k pickers at a spacing distance x, the first A loading portion is provided with m elements 10 at a first spacing distance x1, and the second loading portion is configured with a second spacing distance x2 for n loading slots of the insertion element 10, the second spacing distance x2 and the first spacing The distance x1 is different, wherein the method comprises: a first picking step, when the first spacing distance x1 is less than the second spacing distance x2 by a predetermined size, setting the spacing distance x of the conveying tool to the first loading The first interval distance x1 in the portion is doubled from the first loading portion to pick up the component 10; a second picking step is to set the pickup of the component 10 not picked up in the first picking step to The first spacing portion of the first loading portion is twice the distance x1, and the component 10 is picked up from the first loading portion every interval; in a placing step, the conveying tool moves toward the second loading portion Three intervals The distance x3 is set to the second separation distance x2, and the components 10 are placed in the loading slots of the second loading portion, respectively.

較佳為,該運送工具的拾取器的數量與該第二裝載部的裝載槽數量相同。 Preferably, the number of pickers of the transporting tool is the same as the number of loading slots of the second loading section.

該第一裝載部是使用於一燒機分揀器的托盤30;該第二裝載部是設置在該燒機分揀器的一DC測試部230;該運送工具還設置一個以上的堆積拾取器,該堆積拾取器用以拾取由DC測試部230檢查為不合格品的元件10。 The first loading portion is a tray 30 for use in a burner sorter; the second loading portion is a DC test portion 230 disposed in the burner sorter; the transporting tool is further provided with more than one stacking picker The stacking picker is used to pick up the component 10 that is inspected by the DC test unit 230 as a defective product.

本發明的元件處理器包括第一煉板台210、第二煉板台220,能夠更加迅速地執行元件導出以及元件插入作業,其中第一煉板台210以Y軸方向移動用於導出元件的煉板20,第二煉板台220接收從第一煉板台210導出元件10的煉板20,以Y軸方向移動用於插入執行DC測試的元件的煉板20。 The component processor of the present invention includes a first refining table 210 and a second refining table 220, which can perform component derivation and component insertion operations more quickly, wherein the first refining table 210 is moved in the Y-axis direction for deriving components. The refining plate 20 and the second refining table 220 receive the refining plate 20 from which the component 10 is led out from the first refining table 210, and move the refining plate 20 for inserting the component for performing the DC test in the Y-axis direction.

本發明的元件處理器具有如下的優點:通過在從煉板20導出元件的元件卸載工具510還結合拍攝元件插座21的圖像獲取部519,進而在導出元件的同時獲取元件插座21的圖像,因此能夠更加準確地執行在第二煉板台220裝載元件。 The component processor of the present invention has the advantage that the component unloading tool 510 is also incorporated in the image acquiring portion 519 of the photographing element socket 21 by the component unloading tool 510 that derives the component from the refining plate 20, thereby acquiring the image of the component socket 21 while deriving the component. Therefore, it is possible to perform loading of the components on the second refining table 220 more accurately.

尤其是,具有如下的優點:隨著元件10的小型化、集成化在底面形成非常小的間隔距離,據此需要元件10更加準確地位於煉板20上,因此在裝載元件時,校正對於元件插座21的元件10的裝載狀態,進而能夠使元件10更加準確地位於煉板20上。 In particular, it has the advantage that as the miniaturization and integration of the component 10 form a very small separation distance on the bottom surface, it is required that the component 10 is more accurately positioned on the refining plate 20, so that when the component is loaded, the correction is performed on the component. The loading state of the component 10 of the socket 21, in turn, enables the component 10 to be positioned more accurately on the refining plate 20.

10‧‧‧元件 10‧‧‧ components

20‧‧‧煉板 20‧‧‧Refer

21‧‧‧元件插座 21‧‧‧Component socket

30‧‧‧托盤 30‧‧‧Tray

80‧‧‧攝影機 80‧‧‧ camera

110‧‧‧裝載托盤部 110‧‧‧Loading tray section

120‧‧‧DC不合格品托盤部 120‧‧‧DC unqualified product tray department

130‧‧‧空托盤部 130‧‧‧ Empty tray department

140‧‧‧托盤裝載部 140‧‧‧Tray loading department

210‧‧‧第一煉板台 210‧‧‧First refining platform

220‧‧‧第二煉板台 220‧‧‧Second refining platform

230‧‧‧DC測試部 230‧‧‧DC Test Department

231‧‧‧DC測試插座(插座) 231‧‧‧DC test socket (socket)

232‧‧‧DC測試部 232‧‧‧DC Test Department

310‧‧‧卸載緩衝部 310‧‧‧Unloading buffer

311‧‧‧托盤運送部 311‧‧‧Tray Delivery Department

320‧‧‧分揀托盤部 320‧‧‧ sorting tray department

510‧‧‧卸載運送工具 510‧‧‧Unloading transport tools

511‧‧‧拾取器 511‧‧‧ Picker

512‧‧‧圖像獲取部 512‧‧‧Image Acquisition Department

519‧‧‧圖像獲取部 519‧‧‧Image Acquisition Department

520‧‧‧元件分揀工具 520‧‧‧Component sorting tool

530‧‧‧裝載運送工具 530‧‧‧Loading and transporting tools

531‧‧‧拾取器 531‧‧‧ Picker

539‧‧‧圖像獲取部 539‧‧‧Image Acquisition Department

540‧‧‧元件裝載工具 540‧‧‧Component loading tool

541‧‧‧拾取器 541‧‧‧ Picker

542‧‧‧堆積拾取器 542‧‧‧Stack Pickup

610‧‧‧第一識別部 610‧‧‧First Identification Department

611、621、641‧‧‧圖像獲取部 611, 621, 641‧‧‧Image Acquisition Department

620‧‧‧第二識別部 620‧‧‧Second Identification Department

649‧‧‧攝影機 649‧‧‧ camera

670‧‧‧第三識別部 670‧‧‧ Third Identification Department

680‧‧‧第四識別部 680‧‧‧ Fourth Identification Department

800‧‧‧煉板裝載器 800‧‧‧Board loader

810、820、830、840‧‧‧吸附墊更換部 810, 820, 830, 840‧‧ ‧Adsorption pad replacement

UL1‧‧‧元件卸載位置 UL1‧‧‧ component unloading position

UL2‧‧‧元件分揀位置 UL2‧‧‧ component sorting position

BL1‧‧‧第一煉板運送線 BL1‧‧‧First board transportation line

BL2‧‧‧第二煉板運送線 BL2‧‧‧Second board transportation line

BIN1~BIN4‧‧‧托盤裝載部(分類等級) BIN1~BIN4‧‧‧Tray loading department (classification level)

x1‧‧‧第一間隔距離 x 1 ‧‧‧first separation distance

x2‧‧‧第二間隔距離 x 2 ‧‧‧Second separation distance

x3‧‧‧第三間隔距離 x 3 ‧‧‧ third separation distance

G、DC1、DC2、E‧‧‧托盤裝載部 G, DC1, DC2, E‧‧‧ pallet loading department

圖1是顯示本發明的元件處理器的一示例的平面圖; 圖2是顯示由圖1的元件處理器裝載以及卸載煉板的過程的示意圖;圖3是顯示在圖1的元件處理器中卸載緩衝部的結構的一示例的側視圖;圖4是顯示在圖1的元件處理器中以裝載托盤部-DC測試部-煉板的順序拾取以及放置元件的過程的示意圖;圖5a以及圖5b是作為圖4之所示的示意圖的變化,顯示在裝載托盤部中的托盤上拾取元件,以用於從裝載托盤部向DC測試部運送元件的過程的示意圖;圖6是顯示在圖4所示之元件的運送中從裝載托盤部向DC測試部運送元件的過程的平面圖;圖7是顯示使用於圖1之元件處理器的卸載運送工具以及裝載運送工具的一示例的視圖;以及圖8是顯示使用於圖1之元件處理器的元件裝載工具的一示例的視圖。 1 is a plan view showing an example of a component processor of the present invention; FIG. 2 is a schematic view showing a process of loading and unloading a panel by the component processor of FIG. 1; FIG. 3 is a diagram showing uninstallation in the component processor of FIG. Side view of an example of the structure of the buffer portion; FIG. 4 is a schematic view showing a process of picking up and placing components in the order of loading the tray portion - DC test portion - the plate in the component processor of FIG. 1; FIG. 5a and FIG. 5b As a variation of the schematic diagram shown in FIG. 4, a schematic diagram showing a process of picking up components on a tray in the loading tray section for transporting components from the loading tray section to the DC test section; FIG. 6 is shown in FIG. A plan view showing a process of transporting components from the loading tray portion to the DC test portion in the transport of the components; FIG. 7 is a view showing an example of the unloading transport tool and the loading and transporting tool used in the component processor of FIG. 1; Is a view showing an example of a component loading tool used in the component processor of Fig. 1.

以下,參照附圖說明本發明的元件處理器以及元件拾取和放置方法。 Hereinafter, an element processor and a component picking and placing method of the present invention will be described with reference to the drawings.

如圖1所示,本發明的元件處理器包括:第一煉板台210,從煉板裝載器800接收煉板20並以Y軸方向移動煉板20,以導出插入於元件插座21的元件10,其中煉板20設置有複數個元件插座21,元件插座插入有元件10;卸載緩衝部310,設置在第一煉板台210一側,並且以Y軸方向設定元件卸載位置UL1和元件分揀位置UL2,並且使複數個托盤30輪流位於元件卸載位置UL1和元件分揀位置UL2,其中元件卸載位置UL1從位於第一煉板台210的煉板20接收元件10,元件分揀位置UL2是根據預先設定的分類基準分類並裝載元件10;卸載運送工具510,從位於第一煉板台210的煉板20導出元件10,將元件10運送至位於元件卸載位置UL1的托盤30;分揀托盤部320,鄰接於卸載緩衝部310的元件分揀位置UL2,根據預先設定的分類等級以X軸方向設置複數個托盤30;元件分揀工具520,根據預先設定的分類等級,將元件10再配置在位於元件分揀位置UL2的托盤30以及位於分揀托盤部320的托盤30;第二煉板台220,以X軸方向從第一煉板台210接收完成元件導出的煉板20之後以Y軸方向移動,以使新的元件10插入於煉板20的元件插座21;DC測試部230,設置以鄰接第二煉板台220,並且以X軸方向配置用於元件10的DC測試的DC測試插座231;裝載運送工具530,從DC測試部230導出檢查為合格品的元件10,將元件10插入於第二煉板台220的元件插座21;裝載托盤部110,設置以鄰接DC測試部230,並且設置有用於向DC測試部230供 應元件10的一個以上的托盤30;DC不合格品托盤部120,鄰接於DC測試部230對裝載托盤部110以X軸方向配置一個以上的托盤30,以根據由DC測試部230檢查為不合格品的檢查結果分類裝載元件10;一個以上的元件裝載工具540,用於從裝載托盤部110向DC測試部230傳送元件,以及從DC測試部230向DC不合格品托盤部120傳送元件。 As shown in FIG. 1, the component processor of the present invention includes a first refining table 210, which receives the refining plate 20 from the refining loader 800 and moves the refining plate 20 in the Y-axis direction to derive components inserted in the component socket 21. 10, wherein the refining plate 20 is provided with a plurality of component sockets 21, the component sockets are inserted with the components 10; the unloading buffer portion 310 is disposed on the side of the first refining table 210, and the component unloading position UL1 and the component points are set in the Y-axis direction. The position UL2 is sorted, and a plurality of trays 30 are alternately placed at the component unloading position UL1 and the component sorting position UL2, wherein the component unloading position UL1 receives the component 10 from the refining plate 20 located at the first refining table 210, and the component sorting position UL2 is Sorting and loading the component 10 according to a predetermined classification criterion; unloading the transport tool 510, deriving the component 10 from the refining plate 20 located at the first refining plate 210, and transporting the component 10 to the tray 30 at the component unloading position UL1; the sorting tray The part 320 is adjacent to the component sorting position UL2 of the unloading buffer unit 310, and sets a plurality of trays 30 in the X-axis direction according to a predetermined classification level; the component sorting tool 520, according to a predetermined classification level, The piece 10 is further disposed in the tray 30 located at the component sorting position UL2 and the tray 30 located in the sorting tray portion 320; the second palletizing station 220 receives the finished panel from the first pallet stage 210 in the X-axis direction. 20 is then moved in the Y-axis direction so that the new component 10 is inserted into the component socket 21 of the refining plate 20; the DC test section 230 is disposed to abut the second refining plate 220, and is disposed in the X-axis direction for the component 10. The DC test socket 231 of the DC test; the loading and transporting tool 530, the component 10 that is inspected as a good product is taken out from the DC test unit 230, the component 10 is inserted into the component socket 21 of the second platen table 220, and the loading tray portion 110 is set to The DC test unit 230 is adjacent to the DC test unit 230, and one or more trays 30 for supplying the components 10 to the DC test unit 230 are provided. The DC defective product tray unit 120 is disposed adjacent to the DC test unit 230 in the X-axis direction with respect to the loading tray unit 110. The above tray 30 sorts the loading member 10 based on the inspection result of the defective product by the DC test portion 230; one or more component loading tools 540 for transferring the component from the loading tray portion 110 to the DC test portion 230, and DC test part 230 DC defective transfer member 120 of the tray part.

在此,作為本發明元件處理器的處理物件的元件10可以是記憶體半導體或者CPU(Central Processing Unit,中央處理單元)、GPU(Graphics Processing Unit,圖形處理單元)、系統LSI(Large Scale Integration,大型積體電路)等。 Here, the component 10 as a processing object of the component processor of the present invention may be a memory semiconductor or a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and a system LSI (Large Scale Integration, Large integrated circuit) and so on.

尤其是,對於元件10,只要是插入於煉板20的元件插座21執行預先設定的檢查(電氣性測試等)的元件均可,可以是任意一種元件。 In particular, the element 10 may be any element that can be inserted into the component socket 21 of the refining plate 20 to perform a predetermined inspection (electrical test or the like).

例如,元件10可以是底面形成有球形狀外部端子的BGA元件。 For example, the component 10 may be a BGA component having a spherical outer terminal formed on its bottom surface.

煉板20係作為設置有插入元件10的元件插座21的煉板(老化測試基板等)以執行元件檢查,根據對元件的檢查種類,可以具有任意一種結構。 The refining plate 20 is used as a refining plate (aging test substrate or the like) provided with the component receptacle 21 of the insertion member 10 to perform component inspection, and may have any configuration depending on the type of inspection of the component.

另一方面,如圖1所示,通過煉板裝載器800持續接收煉板20。 On the other hand, as shown in FIG. 1, the refining plate 20 is continuously received by the plate loader 800.

煉板裝載器800是裝載並安裝插入有元件10的煉板20的同時依次裝載並排出插入有元件10的煉板20的結構,即係作為與第一煉板台210持續供應煉板20的結構,可以具有各種結構,具體由專利文獻1至5所揭露的煉板裝載器構成等。 The plate loader 800 is a structure in which the refining plate 20 in which the component 10 is inserted is sequentially loaded and discharged while loading and unloading the refining plate 20 in which the component 10 is inserted, that is, as the first refining plate 20 is continuously supplied to the first refining plate 210. The structure may have various structures, and is specifically constituted by a plate loader disclosed in Patent Documents 1 to 5.

例如,對於煉板裝載器800,在從煉板20的導入方向向-X軸方向(例如,在圖1中,從右側方向向左側方向)觀察時,在一側複數個煉板20裝載於齒條的狀態下被導入/排出,之後在另一側導出裝載於齒條的煉板20,將煉板20傳送於後述的第一煉板台210,之後從後述的第二煉板台220所接收的煉板20可以裝載於齒條。 For example, when the plate loader 800 is viewed from the introduction direction of the refining plate 20 in the -X axis direction (for example, in the right direction to the left direction in FIG. 1), a plurality of refining plates 20 are loaded on one side. After the rack is introduced/discharged, the refining plate 20 loaded on the rack is guided to the other side, and the refining plate 20 is conveyed to the first laminating table 210, which will be described later, and then from the second refining table 220, which will be described later. The received refining plate 20 can be loaded on a rack.

另一方面,煉板裝載器800以通過後述的第一煉板台210移動煉板20的方向(即,與Y軸垂直的X軸方向)將煉板20傳送於第一煉板台210。 On the other hand, the plate loader 800 conveys the refining plate 20 to the first refining table 210 in a direction in which the refining plate 20 is moved by the first refining table 210 to be described later (that is, in the X-axis direction perpendicular to the Y-axis).

為此,如圖1以及圖2所示,本發明的元件處理器以X軸方向設定第一煉板運送線BL1。 Therefore, as shown in FIGS. 1 and 2, the component processor of the present invention sets the first plate conveyance line BL1 in the X-axis direction.

對於第一煉板運送線BL1,係作為為了從煉板裝載器800向第一煉板台210傳送煉板20而設定的煉板20的運送線,只要是能夠從煉板裝載器800向第一煉板台210傳送煉板20的結構均可,可以是任何一種結構。 The first plate conveyance line BL1 is a conveyance line of the refining plate 20 set to convey the refining plate 20 from the plate loader 800 to the first refining table 210, as long as it can be moved from the plate loader 800 to the first A refining plate 210 can transfer the structure of the refining plate 20, and can be any structure.

然後,可以設置第一識別部610,該第一識別部610設置在從煉板裝載器800傳送至第一煉板台210的途徑上,以獲取煉板20與插入於煉板20的元件10的資訊。 Then, a first identification portion 610 may be provided, which is disposed on the route from the plate loader 800 to the first platen stage 210 to acquire the plate 20 and the component 10 inserted into the plate 20 Information.

第一識別部610係作為設置在從煉板裝載器800傳送至第一煉板台210的途徑上,以獲取煉板20和插入於煉板20的元件10的資訊的結構,可以是攝影機等各種結構。 The first recognition unit 610 is configured to be disposed on the route from the plate loader 800 to the first platen stage 210 to acquire the information of the plate 20 and the component 10 inserted in the plate 20, and may be a camera or the like. Various structures.

另外,第一識別部610可以具有各種結構,具體地說,根據資訊獲取形態拍攝煉板20的整體,或者識別另外的標識(諸如,在煉板20另外標記的QR碼)。 In addition, the first recognition portion 610 may have various configurations, specifically, photographing the entirety of the refining plate 20 according to the information acquisition form, or identifying another identification (such as a QR code additionally marked on the refining plate 20).

第一煉板台210可以具有各種結構,該第一煉板台210從煉板裝載器800接收設置有插入元件10的複數個元件插座21的煉板20,以Y軸方向移動以導出插入於元件插座21的元件10。 The first slab 210 may have various structures, and the first slab 210 receives the slab 20 provided with the plurality of component sockets 21 of the insertion member 10 from the slab loader 800, and moves in the Y-axis direction to derive the insertion. Element 10 of component socket 21.

具體地說,第一煉板台210經過第一煉板運送線BL1從煉板裝載器800接收煉板20。 Specifically, the first slab 210 receives the slab 20 from the slab loader 800 via the first slab transfer line BL1.

另外,第一煉板台210以固定煉板20的狀態下以Y軸方向移動,進而可以通過後述的卸載運送工具510導出元件。 Further, the first slab 210 is moved in the Y-axis direction while the slab 20 is fixed, and the components can be led out by the unloading conveyance tool 510 which will be described later.

為此,第一煉板台210可以包括:用於固定煉板20的固定工具;用於以Y軸方向移動固定煉板20的固定工具的第一線性煉板運送部(圖未顯示)。 To this end, the first refining table 210 may include: a fixing tool for fixing the refining plate 20; a first linear refining conveying portion for moving the fixing tool of the fixing plate 20 in the Y-axis direction (not shown) .

然後,在第一煉板台210的上部可以設置第三識別部670,該第三識別部670用於識別煉板20的Y軸方向移動。 Then, a third identification portion 670 for identifying the movement in the Y-axis direction of the refining plate 20 may be provided on the upper portion of the first refining table 210.

第三識別部670係作為設置在第一煉板台210上部用於識別煉板20的Y方向移動的結構,可以是攝影機等。 The third recognition unit 670 is configured to be disposed on the upper portion of the first refining table 210 for identifying the Y-direction movement of the refining plate 20, and may be a camera or the like.

此時,第三識別部670只要是能夠識別煉板20的Y軸方向移動的結構均可,可以是任意一種結構,具體有識別煉板20的元件插座21本身或者識別在煉板20上另外標記的標識等。 In this case, the third recognition unit 670 may have any configuration as long as it can recognize the movement of the refining plate 20 in the Y-axis direction, and specifically may include the component socket 21 itself for identifying the refining plate 20 or the identification on the refining plate 20. Marked identifiers, etc.

另一方面,在通過卸載運送工具510導出元件10的位置設置插座加壓器(圖未顯示),該插座加壓器從上側加壓元件插座21,以從煉板20導出元件10。 On the other hand, a socket presser (not shown) is provided at a position where the component 10 is discharged by the unloading conveyance tool 510, and the socket pressurizer pressurizes the component receptacle 21 from the upper side to derive the component 10 from the refining plate 20.

該插座加壓器係作為從上側加壓元件插座以在通過卸載運送工具510導出元件10的位置從煉板20導出元件10的結構,可以具有各種結構。 The socket presser has a structure in which the element 10 is led out from the refining plate 20 at a position where the element 10 is led out by the unloading conveyance tool 510 as a structure from the upper side pressurizing element socket.

另一方面,可以自動或者手動更換地設置該插座加壓器,以對應於元件10的大小、元件插座21之間的間隔等。 On the other hand, the socket pressurizer may be provided automatically or manually to correspond to the size of the component 10, the interval between the component receptacles 21, and the like.

另外,該插座加壓器可以改變對應於各元件插座21的插座加壓部(圖未顯示)之間的間隔,以對應於元件插座21之間的間隔變化。 In addition, the socket pressurizer may change the interval between the socket pressurizing portions (not shown) corresponding to the respective component sockets 21 to correspond to the interval change between the component receptacles 21.

另外,該插座加壓器也可以改變對應於各元件插座21的開口大小,以對應於元件10的大小、元件插座21之間的間隔等。 In addition, the socket pressurizer may also change the size of the opening corresponding to each of the component receptacles 21 to correspond to the size of the component 10, the interval between the component receptacles 21, and the like.

卸載緩衝部310可以具有各種結構,該卸載緩衝部310設置在第一煉板台210一側,並且以Y軸方向設定元件卸載位置UL1與元件分揀位置UL2,將複數個托盤30輪流位於元件卸載位置UL1和元件分揀位置UL2,其中元件卸載位置UL1從位於第一煉板台210的煉板20接收元件10,元件分揀位置UL2根據預先設定的分類基準分類裝載元件10。 The unloading buffer portion 310 may have various structures, and the unloading buffer portion 310 is disposed on the side of the first refining table 210, and sets the component unloading position UL1 and the component sorting position UL2 in the Y-axis direction, and turns the plurality of trays 30 in turn on the components. The unloading position UL1 and the component sorting position UL2, wherein the component unloading position UL1 receives the component 10 from the refining plate 20 located at the first refining plate 210, and the component sorting position UL2 sorts the loading component 10 according to a predetermined classification reference.

例如,如圖1以及圖3所示,卸載緩衝部310可以包括:輪流位於元件卸載位置UL1和元件分揀位置UL2的一對托盤30;為使一對托盤30輪流位於元件卸載位置UL1和元件分揀位置UL2而移動托盤30的托盤運送部311。 For example, as shown in FIGS. 1 and 3, the unloading buffer portion 310 may include a pair of trays 30 that are alternately positioned at the component unloading position UL1 and the component sorting position UL2; in order to rotate the pair of trays 30 at the component unloading position UL1 and the components The tray transport unit 311 of the tray 30 is moved by sorting the position UL2.

托盤運送部311為使一對托盤30輪流位於元件卸載位置UL1和元件分揀位置UL2而移動托盤30的結構,可以是移動引導部、線性驅動部等各種結構。 The tray transport unit 311 is configured to move the tray 30 by rotating the pair of trays 30 at the component unloading position UL1 and the component sorting position UL2, and may be various structures such as a moving guide portion and a linear drive portion.

另一方面,卸載緩衝部210的托盤30較佳為使用與後述的分揀托盤部320的托盤、裝載托盤部110的托盤等相同的托盤。 On the other hand, it is preferable that the tray 30 of the unloading buffer unit 210 uses the same tray as the tray of the sorting tray unit 320, the tray of the loading tray unit 110, and the like, which will be described later.

另外,根據元件10的規格可以更換卸載緩衝部210的托盤30。 In addition, the tray 30 of the unloading buffer portion 210 can be replaced according to the specifications of the element 10.

卸載運送工具510可以具有各種結構,卸載運送工具510是從位於第一煉板台210的煉板20導出元件10以將元件10傳送至位於元件卸載位置UL1的托盤30的結構。 The unloading conveyance tool 510 may have various structures, and the unloading conveyance tool 510 is a structure that discharges the component 10 from the refining plate 20 located at the first refining table 210 to convey the component 10 to the tray 30 at the component unloading position UL1.

例如,卸載運送工具510可以包括:在末端具有通過真空壓吸附元件10的吸附頭的一個以上的拾取器511;以X-Z、Y-Z或者X-Y-Z方向(較佳為,X-Z方向)移動拾取器511的拾取器運送裝置。 For example, the unloading conveyance tool 510 may include: one or more pickups 511 having a suction head passing through the vacuum pressure adsorption element 10 at the end; picking up the pickup 511 in the XZ, YZ or XYZ direction (preferably, the XZ direction) Transport device.

尤其是,卸載運送工具510將拾取器511配置成一排,或者可以配置成8×1、8×2等的各種形狀。 In particular, the unloading conveyance tool 510 arranges the pickups 511 in a row, or may be configured in various shapes of 8 × 1, 8 × 2, and the like.

尤其是,如圖7所示,卸載運送工具510可以具有對應於以X軸方向在煉板20上配置元件插座21的數量的1/N(N是自然數)的數量和排列的拾取器511,以從煉板20上整個行導出元件10。 In particular, as shown in FIG. 7, the unloading conveyance tool 510 may have a pickup 511 corresponding to the number and arrangement of 1/N (N is a natural number) of the number of the component sockets 21 disposed on the refining plate 20 in the X-axis direction. The component 10 is derived from the entire row on the refining plate 20.

另外,由於煉板20上的元件插座21的間隔(即,托盤30上的元件裝載間距)可以相互不同,因此卸載運送工具510能夠調節拾取元件10的拾取器511之間的間距。 In addition, since the intervals of the component receptacles 21 on the refining plate 20 (i.e., the component loading pitch on the tray 30) may be different from each other, the unloading conveyance tool 510 can adjust the spacing between the pickups 511 of the pickup component 10.

另一方面,隨著元件10的大小的縮小或者在元件10底面形成的球柵之類的端子之間的間距細化,為了將元件10插入於煉板20的元件插座21,精確移動元件10的位置非常重要。 On the other hand, as the size of the element 10 is reduced or the pitch between the terminals such as the ball grid formed on the bottom surface of the element 10 is refined, in order to insert the element 10 into the component socket 21 of the refining plate 20, the component 10 is accurately moved. The location is very important.

據此,較佳的是,需要在通過卸載運送工具510從煉板20導出元件10的過程中瞭解形成在煉板20上的元件插座21的連接端子的準確的位置。 Accordingly, it is preferable to know the exact position of the connection terminal of the component receptacle 21 formed on the refining plate 20 in the process of deriving the component 10 from the refining plate 20 by the unloading conveyance tool 510.

為此,如圖7所示,卸載運送工具510可以結合圖像獲取部519,該圖像獲取部519在導出元件10之後拍攝元件插座21的圖像,以確認各元件插座21在煉板20上的位置。 To this end, as shown in FIG. 7, the unloading conveyance tool 510 may be combined with an image acquisition section 519 that takes an image of the component socket 21 after deriving the component 10 to confirm that each component socket 21 is on the refining plate 20. The location on the top.

圖像獲取部519可以由攝影機等構成,圖像獲取部519是在導出元件10之後拍攝元件插座21圖像,進而在結合於卸載運送工具510一同移動的同時確認在煉板20上形成在各元件插座21的連接端子的位置。 The image acquisition unit 519 can be configured by a camera or the like, and the image acquisition unit 519 captures an image of the component socket 21 after deriving the component 10, and confirms that it is formed on the refining plate 20 while being moved together with the unloading conveyance tool 510. The position of the connection terminal of the component socket 21.

另一方面,圖像獲取部519也一同識別用於確認煉板20的規格、尺寸等的標識,進而可以確認煉板20上的各元件插座21的位置。 On the other hand, the image acquisition unit 519 also recognizes the identification for confirming the specifications, dimensions, and the like of the refining plate 20, and can also confirm the position of each component socket 21 on the refining plate 20.

例如,用於確認煉板20的規格、尺寸等的標識可以以各種形式形成,諸如在直角四邊形煉板的每個頂點處標記的四個標識等。 For example, the identification for confirming the specifications, dimensions, and the like of the refining plate 20 may be formed in various forms, such as four marks or the like marked at each vertex of the rectangular plate.

對於由圖像獲取部519獲得的各個元件插座21在煉板20上的位置,通過從第一煉板台210導出所有元件10傳送至後述的第二煉板台220之後固定在第二煉板台220,在這一狀態下該位置靈活用作各元件插座21在煉板20上的位置資訊,能夠更加迅速並準確地執行通過裝載運送工具530裝載元件10的作業。 The position of each component socket 21 obtained on the refining plate 20 obtained by the image acquisition section 519 is transmitted to the second refining plate 220, which will be described later, by deriving all the components 10 from the first refining table 210, and then fixed to the second refining plate. The stage 220, in this state, is flexibly used as positional information of each component receptacle 21 on the refining plate 20, and the work of loading the component 10 by the loading and transporting tool 530 can be performed more quickly and accurately.

另一方面,靈活應用用於確認煉板20的規格、尺寸等的標識,以在固定第二煉板台220的狀態下可以確認煉板20以及各個元件插座21在煉板20上的準確的位置。 On the other hand, the identification for confirming the specifications, dimensions, and the like of the refining plate 20 is flexibly applied to confirm the accuracy of the refining plate 20 and the respective component receptacles 21 on the refining plate 20 in a state where the second refining table 220 is fixed. position.

分揀托盤部320係作為鄰接於卸載緩衝部310的元件分揀位置UL2根據預先設定的分類等級以X軸方向設置複數個托盤30的結構,根據托盤30的配置、托盤30的運送可以具有各種結構。 The sorting tray unit 320 has a configuration in which a plurality of trays 30 are disposed in the X-axis direction in accordance with a predetermined sorting level as the component sorting position UL2 adjacent to the unloading buffer unit 310, and the tray 30 can be transported depending on the arrangement of the trays 30. structure.

例如,分揀托盤部320鄰接於卸載緩衝部310的元件分揀位置UL2,可以根據預先設定的分類等級BIN1、BIN2、BIN3、BIN4以X軸方向配置複數個托盤30。 For example, the sorting tray unit 320 is adjacent to the component sorting position UL2 of the unloading buffer unit 310, and a plurality of trays 30 can be arranged in the X-axis direction based on the predetermined classification levels BIN1, BIN2, BIN3, and BIN4.

在此,分揀托盤部320的托盤30中的至少一個,較佳為賦予BIN4的托盤30最初可以直接接收並佈置卸載緩衝部310的托盤30。 Here, at least one of the trays 30 of the sorting tray portion 320, preferably the tray 30 to which the BIN 4 is given, can directly receive and arrange the tray 30 of the unloading buffer portion 310.

另外,在位於卸載緩衝部310的元件分揀位置UL2的托盤30中將合格品除外,之後傳送至相當於預先設定的分類等級BIN1、BIN2、BIN3、BIN4的托盤30,並從最初傳送至分揀托盤部320的托盤30導出合格品,以裝載於位於元件分揀位置UL2的托盤30中的空位置。 In addition, the defective product is excluded from the tray 30 located at the component sorting position UL2 of the unloading buffer unit 310, and then transferred to the tray 30 corresponding to the predetermined classification levels BIN1, BIN2, BIN3, and BIN4, and is transmitted from the initial to the minute. The tray 30 of the sorting tray unit 320 is derivatized to be loaded in an empty position in the tray 30 located at the component sorting position UL2.

然後,全部填充了合格品且位於元件分揀位置UL2的托盤30傳送至另外設置的托盤卸載部G,而在卸載緩衝部310的元件分揀位置UL2放置未被托盤運送裝置(圖未顯示)填充元件10之新的空托盤30。 Then, the trays 30 that are all filled with the good products and located at the component sorting position UL2 are transferred to the additionally provided tray unloading portion G, and are not placed in the component sorting position UL2 of the unloading buffer portion 310 without the tray transporting device (not shown). A new empty tray 30 of the filling element 10.

元件分揀工具520係作為根據預先設定的分類等級將元件10分別再配置在位於元件分揀位置UL2的托盤30和元件分揀托盤部320的托盤30的結構,可以具有各種結構。 The component sorting tool 520 has a configuration in which the components 10 are relocated to the tray 30 of the tray 30 and the component sorting tray unit 320 located at the component sorting position UL2 according to a predetermined classification level, and can have various configurations.

例如,元件分揀工具520可以包括:在末端具有吸附頭來通過真空壓吸附元件10的一個以上的拾取器;以X-Z、Y-Z、X-Y-Z方向(較佳為,X-Y-Z方向)移動拾取器的拾取器運送裝置。 For example, the component sorting tool 520 may include: one or more pickers having an adsorption head at the end to pass the vacuum pressure adsorbing element 10; and a picker that moves the picker in the XZ, YZ, XYZ directions (preferably, the XYZ direction) Shipping device.

尤其是,元件分揀工具520可以將拾取器排列成一排或佈置成各種形狀,例如8×1、10×1、8×2等。 In particular, the component sorting tool 520 can arrange the pickers in a row or in various shapes, such as 8x1, 10x1, 8x2, and the like.

第二煉板台220可以具有各種結構,第二煉板台220以X軸方向從第一煉板台210接收完成元件導出的煉板20,之後以Y軸方向移動,進而在煉板20的元件插座21插入新的元件10。 The second refining table 220 may have various structures, and the second refining table 220 receives the refining plate 20 from which the component is led out from the first refining table 210 in the X-axis direction, and then moves in the Y-axis direction, and further in the refining plate 20 The component socket 21 is inserted into the new component 10.

具體地說,第二煉板台220以X軸方向從第一煉板台210接收完成元件導出的煉板20。 Specifically, the second slab 220 receives the slab 20 from which the component is led out from the first slab 210 in the X-axis direction.

此時,第二煉板台220與要求精確度相對低的第一煉板台210不同,應該對於元件插座21準確裝載元件10。 At this time, the second refining table 220 is different from the first refining table 210 which requires relatively low accuracy, and the component 10 should be accurately loaded for the component receptacle 21.

據此,從第一煉板台210傳送煉板20的途徑上可以設置第二識別部620,第二識別部620用於獲取煉板20和插入於煉板20的元件10的資訊。 Accordingly, the second identification portion 620 can be provided in the way of transporting the refining plate 20 from the first refining table 210, and the second identification portion 620 is used to acquire the information of the refining plate 20 and the component 10 inserted in the refining plate 20.

第二識別部620係作為設置在從第一煉板台210傳送煉板20的傳送途徑上獲取煉板20和插入於煉板20的元件10的資訊的結構,可以具有各種結構,具體有攝影機等。 The second recognition unit 620 is configured to acquire information on the refining plate 20 and the component 10 inserted in the refining plate 20 on the transport path for transporting the refining plate 20 from the first refining plate 210, and may have various structures, specifically a camera. Wait.

另外,第二識別部620根據資訊獲取形態可以具有各種結構,具體地說,拍攝整個煉板20,或者識別在煉板20另外標記的QR碼之類的另外的標識。 Further, the second recognition unit 620 may have various configurations depending on the information acquisition form, specifically, the entire refining plate 20 may be photographed, or another mark such as a QR code additionally marked on the refining plate 20 may be identified.

另外,較佳為,第二煉板台220與第一煉板台210不同,第二煉板台220能夠以X-Y軸方向移動,以使元件10能夠準確地裝載於元件插座21。 Further, it is preferable that the second slab 220 is different from the first slab 210, and the second slab 220 is movable in the X-Y axis direction so that the component 10 can be accurately mounted on the component socket 21.

為此,第一煉板台220可以包括:用於固定煉板20的固定工具;用於以X-Y軸方向移動固定煉板20的固定工具的第二線性煉板運送部(圖未顯示)。 To this end, the first refining table 220 may include: a fixing tool for fixing the refining plate 20; and a second linear refining conveying portion (not shown) for moving the fixing tool of the fixed refining plate 20 in the X-Y axis direction.

另外,在第二煉板台220的上部可以設置第四識別部680,該第四識別部用於識別煉板20以X-Y軸方向的移動。 Further, a fourth identification portion 680 for identifying the movement of the refining plate 20 in the X-Y axis direction may be provided on the upper portion of the second refining table 220.

第四識別部680係作為設置在第二煉板台220的上部來識別煉板20以X-Y軸方向的移動的結構,可以使用攝影機等。 The fourth recognition unit 680 is configured to be disposed on the upper portion of the second platen 220 to recognize the movement of the plate 20 in the X-Y axis direction, and a camera or the like can be used.

此時,對於第四識別部680,只要是能夠識別煉板20以X-Y軸方向的移動的結構均可,可以是任意一種結構;具體地說為識別煉板20的元件插座21本身或者在煉板20上另外標記的標識等。 In this case, the fourth recognition unit 680 may have any configuration as long as it can recognize the movement of the refining plate 20 in the XY-axis direction; specifically, the component socket 21 itself for identifying the refining plate 20 or An additional marking or the like on the board 20.

另一方面,在通過裝載運送工具530插入元件10的位置設置有從上側加壓元件插座21的插座加壓器(圖未顯示),以使元件10能夠插入於煉板20。 On the other hand, a socket presser (not shown) from the upper side pressurizing element receptacle 21 is provided at a position where the component 10 is inserted by the loading and transporting tool 530, so that the component 10 can be inserted into the refining plate 20.

該插座加壓器可以具有各種結構,並且該插座加壓器是在通過元件運送工具530插入元件10的位置從上側加壓元件插座21,以使元件10能夠插入於煉板20的元件插座21。 The socket pressurizer may have various structures, and the socket pressurizer pressurizes the component receptacle 21 from the upper side at a position where the component 10 is inserted by the component transporting tool 530, so that the component 10 can be inserted into the component receptacle 21 of the refining plate 20. .

另一方面,可以更換該插座加壓器,以對應於元件10的尺寸、元件插座21之間的間隔等。 Alternatively, the socket pressurizer can be replaced to correspond to the size of the component 10, the spacing between the component receptacles 21, and the like.

另外,該插座加壓器可以改變對應於元件插座21的插座加壓部(圖未顯示)之間的間隔,以對應於元件插座21之間的間隔變化。 In addition, the socket pressurizer may change the interval between the socket pressurizing portions (not shown) corresponding to the component receptacle 21 to correspond to the interval change between the component receptacles 21.

另外,該插座加壓器也可以改變對應於各個元件插座21的開口的尺寸,以對應於元件10的尺寸、元件插座21之間的間隔等。 In addition, the socket presser may also change the size of the opening corresponding to each of the component receptacles 21 to correspond to the size of the component 10, the interval between the component receptacles 21, and the like.

另一方面,在第二煉板台220中完成元件10插入的煉板20向下側(即,Z軸方向)移動,之後以X軸方向移動傳送至煉板裝載器800。 On the other hand, the refining plate 20 in which the component 10 is inserted in the second refining table 220 is moved to the lower side (i.e., the Z-axis direction), and then moved to the plate loader 800 in the X-axis direction.

為此,如圖1以及圖2所示,本發明元件處理器以X軸方向設定第二煉板運送線BL2。 Therefore, as shown in FIGS. 1 and 2, the component processor of the present invention sets the second material conveying line BL2 in the X-axis direction.

第二煉板運送線BL2係作為為了從第二煉板台210向煉板裝載器800傳送煉板20而設定的煉板20的運送線,只要是能夠從第二煉板台210向煉板裝載器800傳送煉板20的結構均可,也可以設定成任意一種結構。 The second plate transport line BL2 serves as a transport line for the plate 20 to be transported from the second platen 210 to the plate loader 800, as long as it can be transferred from the second platen 210 to the plate. The loader 800 may transfer the structure of the refining plate 20, or may be set to any one of the structures.

另一方面,如圖2所示,第二煉板運送線BL2與上述的第一煉板運送線BL1可能發生干涉,為了防止這一現象,第二煉板運送線BL2較佳為位於低於第一煉板運送線BL1的位置。 On the other hand, as shown in FIG. 2, the second plate transport line BL2 may interfere with the first plate transport line BL1 described above. To prevent this, the second plate transport line BL2 is preferably located below The position of the first sheet conveying line BL1.

若第二煉板運送線BL2位於低於第一煉板運送線BL1的下側,則裝載及卸載煉板20的過程順暢,進一步地說具有可以將裝置的大小最小化的優點。 If the second plate transport line BL2 is located below the lower side of the first plate transport line BL1, the process of loading and unloading the plate 20 is smooth, and further has the advantage that the size of the device can be minimized.

DC測試部230係作為鄰接於第二煉板台220並且以X軸方向配置DC測試插座231(用於DC測試元件10)的結構,可以具有各種結構。 The DC test unit 230 is configured to be adjacent to the second refining table 220 and to arrange the DC test socket 231 (for the DC test element 10) in the X-axis direction, and may have various configurations.

DC測試部230可以由能夠電氣性連接元件10的複數個插座231構成等,可以具有各種結構,較佳為能夠以對應於在煉板20上以X軸方向配置元件插座21的數量的1/N(N為自然數)的數量和排列設置DC測試部230。 The DC test unit 230 may be constituted by a plurality of sockets 231 capable of electrically connecting the elements 10, etc., and may have various configurations, and it is preferable to be able to correspond to the number of the component sockets 21 arranged in the X-axis direction on the refining plate 20. The DC test unit 230 is provided in the number and arrangement of N (N is a natural number).

另一方面,根據DC測試部230測試各元件10的結果,對於檢查為不合格品的元件10靈活用作後述的元件分揀工具540分揀元件的資料。 On the other hand, according to the result of testing the respective elements 10 by the DC test unit 230, the element 10 inspected as a defective product is flexibly used as the material of the sorting element of the component sorting tool 540 to be described later.

另外,如圖1所示,DC測試部230可以自動或者手動更換成其他種類的DC測試部232,以對應於元件10的規格(例如,元件10的規格)、元件插座21之間的間隔等變化。 In addition, as shown in FIG. 1, the DC test unit 230 can be automatically or manually replaced with another type of DC test portion 232 to correspond to the specifications of the component 10 (for example, the specifications of the component 10), the interval between the component receptacles 21, and the like. Variety.

裝載運送工具530可以具有各種結構,並且裝載運送工具530導出由DC測試部230檢查為合格品的元件10,並將元件10插入於第二煉板台220的元件插座21。 The loading and transporting tool 530 may have various structures, and the loading and transporting tool 530 derives the component 10 inspected as a good product by the DC testing section 230, and inserts the component 10 into the component socket 21 of the second baking table 220.

例如,如圖7所示,裝載運送工具530可以包括:一個以上的拾取器531,在末端具有通過真空壓吸附元件10的拾取頭;拾取器運送裝置,以X-Z、Y-Z或者X-Y-Z方向(較佳為,X-Y-Z-θ方向)移動拾取器531。 For example, as shown in FIG. 7, the loading and transporting tool 530 may include: one or more pickers 531 having a pick-up head passing through the vacuum pressure-sucking element 10 at the end; and a pick-up transporting device in the XZ, YZ or XYZ direction (preferably The pickup 531 is moved in the XYZ-θ direction.

在此,在由DC測試部230拾取及運送元件10的過程中可能出現元件10的水平旋轉誤差(θ方向旋轉誤差),為了校正該誤差,裝載運送工具530較佳為能夠以水平旋轉(即,θ方向)以旋轉各拾取器531。 Here, the horizontal rotation error (theta direction rotation error) of the element 10 may occur during the pickup and transport of the component 10 by the DC test portion 230, and in order to correct the error, the loading and transporting tool 530 is preferably capable of horizontal rotation (ie, , θ direction) to rotate each of the pickups 531.

另外,裝載運送工具530可以具有各種結構,在校正由拾取器531拾取的元件10的水平旋轉誤差(θ方向旋轉誤差)時,需精確地旋轉拾取器531;在旋轉由拾取器531拾取的元件10時,需全部旋轉複數個拾取器531或者分別旋轉拾取器531等。 In addition, the loading and transporting tool 530 may have various structures for accurately rotating the pickup 531 when correcting the horizontal rotation error (theta-direction rotation error) of the component 10 picked up by the pickup 531; rotating the component picked up by the pickup 531 At 10 o'clock, it is necessary to rotate a plurality of pickups 531 or to rotate the pickups 531 and the like, respectively.

另外,可以通過設置在裝載運送工具530的移動途徑上的圖像獲取部641測量在由DC測試部230拾取及運送元件10的過程中的元件10的水平旋轉誤差(θ方向旋轉誤差)。 In addition, the horizontal rotation error (θ direction rotation error) of the element 10 in the process of picking up and transporting the element 10 by the DC test portion 230 can be measured by the image acquisition portion 641 provided on the moving path of the loading and transporting tool 530.

圖像獲取部641係作為在由DC測試部230拾取及運送元件10的過程中測量元件10的水平旋轉誤差(θ方向旋轉誤差)的結構,根據裝載運送工具530的結構以及拾取方式,可以具有各種結構。 The image acquisition unit 641 is configured to measure the horizontal rotation error (the θ direction rotation error) of the element 10 in the process of picking up and transporting the element 10 by the DC test unit 230, and may have a configuration according to the loading and transporting tool 530 and a picking method. Various structures.

另外,裝載運送工具530可以將拾取器排列成一排或佈置成各種形狀,例如8×1、10×1、8×2等。 In addition, the loading and transporting tool 530 may arrange the pickers in a row or in various shapes, such as 8x1, 10x1, 8x2, and the like.

尤其是,裝載運送工具530可以具有對應於煉板20上以X軸方向配置元件插座21的數量的1/N(N為自然數)的數量和排列的拾取器531,以在煉板20的整個行上插入元件10。 In particular, the loading and transporting tool 530 may have a pickup 531 corresponding to the number and arrangement of 1/N (N is a natural number) of the number of the component receptacles 21 arranged in the X-axis direction on the refining plate 20, in the refining plate 20 Element 10 is inserted across the entire line.

另外,由於煉板20上的元件插座21的間隔(即,間距)、托盤30上的元件裝載間距可以相互不同,因此裝載運送工具530可以調節拾取元件10的拾取器531之間的間距。 In addition, since the intervals (i.e., the pitch) of the component receptacles 21 on the refining plate 20 and the component loading pitch on the tray 30 can be different from each other, the loading and transporting tool 530 can adjust the spacing between the pickups 531 of the pickup components 10.

但是,較佳為,DC測試部230中的插座間隔與煉板20上的元件插座21的間隔相同,在這種情況下,沒必要要求調整拾取元件10的拾取器之間的間距。 However, it is preferable that the socket interval in the DC test portion 230 is the same as the interval of the component socket 21 on the refining plate 20, and in this case, it is not necessary to adjust the interval between the pickups of the pickup member 10.

另一方面,隨著元件10的大小的縮小或者在元件10底面形成的球柵之類的端子之間的間距細化,為了將元件10插入於煉板20的元件插座21,精確移動元件10的位置非常重要。 On the other hand, as the size of the element 10 is reduced or the pitch between the terminals such as the ball grid formed on the bottom surface of the element 10 is refined, in order to insert the element 10 into the component socket 21 of the refining plate 20, the component 10 is accurately moved. The location is very important.

據此,較佳為,通過裝載運送工具530在煉板20裝載元件10的過程中瞭解形成煉板20上的元件插座21的連接端子的準確的位置。 Accordingly, it is preferable to understand the exact position of the connection terminal of the component receptacle 21 on the refining plate 20 during the loading of the component 10 by the loading and transporting tool 530.

為此,如上所述,在卸載運送工具510設置圖像獲取部512,以獲取並靈活應用各個元件插座21的圖像,同時作為替代方案(如圖7所示),可以在卸載運送工具510設置圖像獲取部539,圖像獲取部539在導出元件10之後拍攝元件插座21的圖像,以確認各個元件插座21在煉板20上的位置。 To this end, as described above, the image acquisition section 512 is provided at the unloading conveyance tool 510 to acquire and flexibly apply the image of each component socket 21, and as an alternative (as shown in FIG. 7), the unloading conveyance tool 510 may be employed. The image acquisition unit 539 is provided, and the image acquisition unit 539 photographs the image of the component socket 21 after deriving the component 10 to confirm the position of each component socket 21 on the refining plate 20.

圖像獲取部539係作為在導出元件10之後拍攝元件插座21圖像,以確認在煉板20上的元件插座21所形成的連接端子的位置的結構,可以由攝影機等構成。 The image acquisition unit 539 is configured to photograph the position of the component socket 21 after the element 10 is derivatized to confirm the position of the connection terminal formed by the component socket 21 on the refining plate 20, and may be constituted by a camera or the like.

另一方面,圖像獲取部539也一同識別用於確認煉板20的規格、尺寸等的標識,進而可以確認煉板20上的各個元件插座21的位置。 On the other hand, the image acquisition unit 539 also recognizes the identification for confirming the specifications, dimensions, and the like of the refining plate 20, and can also confirm the position of each component socket 21 on the refining plate 20.

例如,用於確認煉板20的規格、尺寸等的標識可以以各種形式形成,諸如在直角四邊形煉板的每個頂點處標記的四個標識等。 For example, the identification for confirming the specifications, dimensions, and the like of the refining plate 20 may be formed in various forms, such as four marks or the like marked at each vertex of the rectangular plate.

然後,對於由圖像獲取部539獲得的各個元件插座21在煉板20上的位置,通過從第一煉板台210導出所有元件10傳送至後述的第二煉板台220之後固定在第二煉板台220,在這一狀態下該位置靈活用作各元件插座21在煉板20上的位置資訊,能夠更加迅速並準確地執行後述之通過裝載運送工具530裝載元件10的作業。 Then, with respect to the position of each component socket 21 obtained on the refining plate 20 obtained by the image acquisition section 539, all the components 10 are transferred from the first refining table 210 to the second refining table 220, which will be described later, and then fixed to the second. In this state, the platen table 220 is flexibly used as the positional information of the component receptacles 21 on the refining plate 20, and the operation of loading the component 10 by the loading and transporting tool 530, which will be described later, can be performed more quickly and accurately.

另一方面,靈活應用於確認煉板20的規格、尺寸等的標識,以在固定第二煉板台220的狀態下可以確認煉板20及各個元件插座21在煉板20上的準確位置。 On the other hand, it is applied flexibly to the identification of the specifications, dimensions, and the like of the refining plate 20, so that the accurate position of the refining plate 20 and the respective component receptacles 21 on the refining plate 20 can be confirmed in a state where the second refining table 220 is fixed.

裝載托盤部110可以具有各種結構,裝載托盤部110鄰接於DC測試部230並且放置有一個以上的托盤30,以向DC測試部230供應元件10。 The loading tray portion 110 may have various structures, the loading tray portion 110 is adjacent to the DC testing portion 230 and more than one tray 30 is placed to supply the component 10 to the DC testing portion 230.

例如,裝載托盤部110以X軸方向可以配置有兩個以上的托盤30,該兩個以上的托盤30鄰接於DC測試部230,以向DC測試部230供應元件10。 For example, the loading tray portion 110 may have two or more trays 30 disposed in the X-axis direction, and the two or more trays 30 are adjacent to the DC test portion 230 to supply the components 10 to the DC test portion 230.

在此,裝載托盤部110配置兩個以上的托盤30的理由如下:在通過後述之元件裝載工具540某一托盤30向DC測試部230傳送所有元件10的情況下,從鄰接的托盤30向DC測試部230傳送元件10,進而即便托盤30是空的,也能夠不間斷地向DC測試部傳送元件10。 Here, the reason why the two or more trays 30 are disposed in the loading tray unit 110 is as follows: When all the components 10 are transferred to the DC test unit 230 by a certain component 30 of the component loading tool 540 to be described later, the adjacent trays 30 are turned to DC. The test unit 230 transports the component 10, and even if the tray 30 is empty, the component 10 can be transferred to the DC test unit without interruption.

另一方面,在裝載托盤部110的托盤30向DC測試部230傳送所有的元件10而被空出的情況下,空托盤30通過托盤運送部可以傳送並裝載到另外設定的空托盤部130。 On the other hand, when the tray 30 of the loading tray unit 110 transports all the components 10 to the DC test unit 230 and is vacated, the empty tray 30 can be transported by the tray transport unit and loaded to the additionally set empty tray unit 130.

另外,裝載托盤部110的托盤30通過托盤運送部當然也能夠傳送至上述的卸載緩衝部310、分揀托盤部320等。 Further, the tray 30 of the loading tray unit 110 can of course be transported to the unloading buffer unit 310, the sorting tray unit 320, and the like described above by the tray transport unit.

另外,從在裝載托盤部110中移除托盤30的位置另外設置的托盤裝載部(圖未顯示)接收裝有元件10之新的托盤30。 Further, a tray loading portion (not shown) additionally provided at a position where the tray 30 is removed from the loading tray portion 110 receives a new tray 30 in which the component 10 is mounted.

DC不合格品托盤部120可以具有各種結構,DC不合格品托盤部120鄰接於DC測試部230,對於裝載托盤部110以X軸方向配置一個以上的托盤30,以根據由DC測試部230檢查為不合格品的檢查結果分類裝載元件10。 The DC defective product tray unit 120 may have various configurations, and the DC defective product tray unit 120 is adjacent to the DC test unit 230, and one or more trays 30 are arranged in the X-axis direction with respect to the loading tray unit 110 to be inspected by the DC test unit 230. The loading element 10 is classified for the inspection result of the defective product.

例如,DC不合格品托盤部120可以具有與上述的分揀托盤部320類似的結構及配置。 For example, the DC defective tray portion 120 may have a similar structure and configuration to the sorting tray portion 320 described above.

另一方面,裝載托盤部110、DC不合格品托盤部120、空托盤部130以及分揀托盤部320具體能夠以X軸方向將托盤30排成一排,以通過一個托盤運送部能夠運送托盤30,進而順利運送托盤30。 On the other hand, the loading tray unit 110, the DC defective product tray unit 120, the empty tray unit 130, and the sorting tray unit 320 can specifically arrange the trays 30 in a row in the X-axis direction, so that the tray can be transported by one tray transport unit. 30, and the tray 30 is smoothly transported.

另外,可以設置對應於裝載托盤部110、DC不合格品托盤部120、空托盤部130以及分揀托盤部320的托盤裝載部140、G、DC1、DC2、BIN1、BIN2、BIN3、BIN4、E,進而能夠執行對裝載托盤部110供應托盤30、從DC不合格品托盤部120導出填滿元件10的托盤30、對空托盤部130供應及/或導出托盤30、從分揀托盤部320導出填滿元件10的托盤30。 Further, a tray loading unit 140, G, DC1, DC2, BIN1, BIN2, BIN3, BIN4, E corresponding to the loading tray unit 110, the DC defective product tray unit 120, the empty tray unit 130, and the sorting tray unit 320 can be provided. Further, it is possible to execute the tray 30 for loading the tray portion 110, the tray 30 for discharging the filled member 10 from the DC defective tray portion 120, the tray tray 130 for the empty tray portion 130, and/or the tray 30, and the tray tray 320. The tray 30 of the component 10 is filled.

托盤裝載部140可以具有各種結構,托盤裝載部140位於構成裝置主體的下部或者上部,對應於裝載托盤部110、DC不合格品托盤部120、空托盤部130以及分揀托盤部320裝載托盤30,以執行對裝載托盤部110供應托盤30、從DC不合格品托盤部120導出填滿元件10的托盤30、對空托盤部130供應及/或導出托盤30、從分揀托盤部320導出填滿元件10的托盤30。 The tray loading unit 140 may have various configurations, and the tray loading unit 140 is located at a lower portion or an upper portion of the apparatus main body, and loads the tray 30 corresponding to the loading tray unit 110, the DC defective product tray unit 120, the empty tray unit 130, and the sorting tray unit 320. The tray 30 for loading the tray portion 110, the tray 30 for discharging the filled component 10 from the DC defective tray portion 120, the tray 30 for the empty tray portion 130, and/or the tray 30 are discharged, and the tray 30 is discharged from the sorting tray portion 320. A tray 30 full of components 10.

另一方面,可以通過各種方法執行對本發明的元件處理器外部供應以及搬出托盤30。 On the other hand, the external supply of the component processor of the present invention and the carry-out of the tray 30 can be performed by various methods.

一個以上的元件裝載工具540係作為從裝載托盤部110向DC測試部230傳送元件及從DC測試230向DC不合格品托盤部120傳送元件的結構,可以具有各種結構。 One or more component loading tools 540 are configured to transmit components from the loading tray portion 110 to the DC test portion 230 and from the DC test 230 to the DC defective tray portion 120, and may have various configurations.

例如,元件裝載工具540可以包括:在末端具有通過真空壓吸附元件10的吸附頭的一個以上的拾取器511;以X-Z、Y-Z或者X-Y-Z方向(較佳為,X-Y-Z-θ方向)移動拾取器511的拾取器運送裝置。 For example, the component loading tool 540 may include: one or more pickers 511 having a suction head passing through the vacuum pressure adsorbing element 10 at the end; moving the pickup 511 in the XZ, YZ or XYZ direction (preferably, the XYZ-θ direction) Pickup conveyor.

在此,如圖4至圖8所示,較佳為可以如下設置元件裝載工具540:在從托盤30拾取元件10、DC測試部230的插座231的插入過程中可能發生元件10水平旋轉誤差(θ方向旋轉誤差),為了校正該誤差,可以使各個拾取器541能夠水平旋轉(即,θ方向旋轉)。 Here, as shown in FIGS. 4 to 8, it is preferable to provide the component loading tool 540 such that the horizontal rotation error of the component 10 may occur during the insertion of the socket 231 of the pickup component 10 and the DC test portion 230 from the tray 30 ( In the θ direction rotation error), in order to correct the error, each of the pickups 541 can be horizontally rotated (that is, rotated in the θ direction).

尤其是,卸載運送工具540將拾取器541配置成一排,或者可以配置成8×1、8×2等的各種形狀。 In particular, the unloading conveyance tool 540 arranges the pickups 541 in a row, or may be configured in various shapes of 8 × 1, 8 × 2, and the like.

另外,元件裝載工具540都執行從裝載托盤部110向DC測試部230傳送元件及從DC測試部230向DC不合格品托盤部120傳送元件,或者具有二個元件裝載工具540可以分別執行從裝載托盤部110向DC測試部230傳送元件及從DC測試部230向DC不合格品托盤部120傳送元件。 In addition, the component loading tool 540 performs the transfer of the component from the loading tray portion 110 to the DC test portion 230 and the transfer from the DC test portion 230 to the DC reject tray portion 120, or has two component loading tools 540 that can be separately loaded from the load. The tray unit 110 transmits the component to the DC test unit 230 and transmits the component from the DC test unit 230 to the DC defective tray unit 120.

另一方面,如上所述,卸載運送工具510、元件分揀工具520、裝載運送工具530以及元件裝載工具540包括複數個拾取器。 On the other hand, as described above, the unloading transporting tool 510, the component sorting tool 520, the loading and transporting tool 530, and the component loading tool 540 include a plurality of pickers.

另外,複數個拾取器末端可拆卸地結合吸附頭,以通過真空壓拾取元件。 In addition, a plurality of pickup ends are detachably coupled to the adsorption head to pick up the components by vacuum pressing.

另外,較佳為,在拾取元件10的規格(尺寸等)不同或者因長時間使用而受損等的情況下,能夠使該吸附頭(墊)更換新的吸附頭。 Moreover, it is preferable that the adsorption head (pad) can be replaced with a new adsorption head when the specifications (size, etc.) of the pickup element 10 are different or damaged due to long-term use.

為此,卸載運送工具510、元件分揀工具520、裝載運送工具530以及元件裝載工具540中的至少一個通過水平移動及垂直方向移動至設置在移動途徑上的吸附墊更換部810、820、830、840,以自動更換新的吸附頭。 To this end, at least one of the unloading transporting tool 510, the component sorting tool 520, the loading and transporting tool 530, and the component loading tool 540 is moved by horizontal movement and vertical direction to the adsorption pad replacing portions 810, 820, 830 disposed on the moving path. , 840, to automatically replace the new adsorption head.

吸附墊更換部810、820、830、840也可以是任意一種結構,吸附墊更換部810、820、830、840設置在卸載運送工具510、元件分揀工具520、裝載運送工具530以及元件裝載工具540中的至少一個的移動途徑上,通過水平移動以及垂直方向移動可以自動更換吸附頭,以自動更換新的吸附頭。 The adsorption pad replacement portions 810, 820, 830, and 840 may be of any configuration, and the adsorption pad replacement portions 810, 820, 830, and 840 are disposed in the unloading conveyance tool 510, the component sorting tool 520, the loading and transporting tool 530, and the component loading tool. On the moving path of at least one of 540, the adsorption head can be automatically replaced by horizontal movement and vertical movement to automatically replace the new adsorption head.

例如,吸附墊更換部810、820、830、840和吸附頭的結構以及更換方式包括專利文獻8的圖9a至圖11b所示的結構以及更換方式等,可以具有各種方式。 For example, the structure and replacement method of the adsorption pad replacement portions 810, 820, 830, and 840 and the adsorption head include the structures shown in FIGS. 9a to 11b of Patent Document 8, the replacement method, and the like, and may have various forms.

另外,在通過吸附墊更換部810、820、830、840更換吸附頭時,可以設置一個以上的圖像獲取部611、621,用於確認結合於拾取器的吸附頭的狀態。 Further, when the adsorption head is replaced by the adsorption pad replacement units 810, 820, 830, and 840, one or more image acquisition units 611 and 621 may be provided for confirming the state of the adsorption head coupled to the pickup.

另一方面,對於向煉板20插入元件10及/或向DC測試部230插入元件10,有需要精確地放置元件10,以執行準確的測試。 On the other hand, for inserting the component 10 into the refining plate 20 and/or inserting the component 10 into the DC test portion 230, it is necessary to accurately place the component 10 to perform an accurate test.

但是,根據拾取器的拾取過程、吸附頭的更換等,存在著出現元件10的水平位置誤差及旋轉誤差的問題。 However, there is a problem that the horizontal position error and the rotation error of the element 10 occur depending on the pickup process of the pickup, the replacement of the adsorption head, and the like.

為此,有必要使裝載運送工具530及/或元件裝載工具540構成在插入元件10(即,裝載過程)中能夠被更加精確地控制。 To this end, it is necessary for the loading and transporting tool 530 and/or the component loading tool 540 to be configured to be more precisely controlled in the insertion member 10 (i.e., the loading process).

在此,裝載運送工具530及/或元件裝載工具540可以具有在專利文獻1至8揭露的運送工具的結構。 Here, the loading and transporting tool 530 and/or the component loading tool 540 may have the structure of the transporting tool disclosed in Patent Documents 1 to 8.

尤其是,裝載運送工具530及/或元件裝載工具540可以具有在專利文獻7的圖5a至圖7所示之運送工具的結構。 In particular, the loading and transporting tool 530 and/or the component loading tool 540 may have the structure of the transporting tool shown in FIGS. 5a to 7 of Patent Document 7.

另外,較佳為,裝載運送工具530及/或元件裝載工具540使拾取器以拾取器的長度方向為旋轉軸進行θ方向旋轉,以在拾取元件10的狀態下校正元件10的水平旋轉誤差(θ方向誤差)。 Further, it is preferable that the loading and transporting tool 530 and/or the component loading tool 540 rotate the pickup in the θ direction with the longitudinal direction of the pickup as the rotation axis to correct the horizontal rotation error of the component 10 in the state of the pickup component 10 ( θ direction error).

尤其是,在裝載運送工具530及/或元件裝載工具540具有專利文獻7的圖5a至圖7所示之運送工具的結構的情況下,通過構成運送工具一部分的攝影機80測量在拾取元件10的狀態下元件10的水平旋轉誤差(θ方向誤差),在插入元件(即,裝載元件)時通過拾取元件10的拾取頭等的旋轉或者運送工具的整體旋轉等校正水平旋轉誤差(θ方向誤差)。 In particular, in the case where the loading and transporting tool 530 and/or the component loading tool 540 has the structure of the transporting tool shown in FIGS. 5a to 7 of Patent Document 7, the camera 80 constituting a part of the transporting tool measures the picking member 10 The horizontal rotation error (theta direction error) of the element 10 in the state, the horizontal rotation error (the θ direction error) is corrected by the rotation of the pickup head or the like of the pickup element 10 or the entire rotation of the transport tool when the component (i.e., the loading component) is inserted. .

在此,對於該吸附頭等的旋轉,通過在固定構成拾取器的桿的狀態下另外設置的旋轉限制部件等旋轉拾取元件10的吸附頭等,進而可以校正水平旋轉誤差(θ方向誤差)。 Here, in the rotation of the adsorption head or the like, the horizontal rotation error (the θ direction error) can be corrected by rotating the adsorption head or the like of the pickup element 10 by a rotation restricting member or the like provided separately in a state in which the rod constituting the pickup is fixed.

另一方面,根據在元件10的底面形成的端子的間距、是否伴隨水平旋轉誤差(θ方向誤差)的修正,裝載運送工具530及/或元件裝載工具540拾取及放置元件的方式可以有所不同。 On the other hand, the manner in which the loading and transporting tool 530 and/or the component loading tool 540 picks up and places the components may vary depending on the pitch of the terminals formed on the bottom surface of the component 10 and whether or not the horizontal rotation error (theta direction error) is corrected. .

例如,若不需要校正水平旋轉誤差(θ方向誤差),則裝載運送工具530及/或元件裝載工具540在複數個拾取器一次性拾取(1Pick)元件10,之後可以一次性裝載(1place)於DC測試部230或者煉板20上。 For example, if it is not necessary to correct the horizontal rotation error (theta direction error), the loading and transporting tool 530 and/or the component loading tool 540 picks up (1Pick) the component 10 at a time in a plurality of pickers, and then can load (1place) at a time. The DC test unit 230 is on the refining plate 20.

另外,若需要校正水平旋轉誤差(θ方向誤差),則要求對各元件10校正旋轉誤差,複數個拾取器一次性拾取(1Pick)元件10之後各元件10可以分別裝載(n place;n是拾取元件10的拾取的數量)於DC測試部230或者煉板20上。 In addition, if it is necessary to correct the horizontal rotation error (θ direction error), it is required to correct the rotation error for each component 10, and after the plurality of pickups pick up the (1Pick) component 10 at a time, each component 10 can be loaded separately (n place; n is pickup) The number of picks up of the component 10 is on the DC test section 230 or the refining plate 20.

在此,若為了校正該旋轉誤差需要各個拾取器個別旋轉,則當然可以通過各拾取器的個別旋轉校正旋轉誤差之後一次性裝載於DC測試部230或者煉板20上。 Here, if it is necessary to individually rotate each of the pickups in order to correct the rotation error, it is of course possible to correct the rotation error by the individual rotation of each pickup and then load it on the DC test unit 230 or the refining plate 20 at one time.

另一方面,如上所述,因吸附頭的更換等,可能發生拾取器的水平中心位置的誤差,因此有必要對該誤差進行校正。 On the other hand, as described above, an error in the horizontal center position of the pickup may occur due to replacement of the adsorption head or the like, and therefore it is necessary to correct the error.

據此,裝載運送工具530及/或元件裝載工具540設置在移動途徑上以獲取各拾取器的底面圖像(即,吸附頭的底面圖像)來計算吸附頭的中心,由此在更換吸附頭之後計算更換前吸附頭的中心的偏差,因此可以通過更換吸附頭校正拾取器的水平中心位置的誤差。 Accordingly, the loading and transporting tool 530 and/or the component loading tool 540 are disposed on the moving path to acquire the bottom surface image of each of the pickups (ie, the bottom surface image of the adsorption head) to calculate the center of the adsorption head, thereby replacing the adsorption The deviation of the center of the adsorption head before replacement is calculated after the head, so that the error of the horizontal center position of the pickup can be corrected by replacing the adsorption head.

為此,可以設置攝影機649,攝影機649設置在裝載運送工具530及/或元件裝載工具540的移動途徑(例如,DC測試部230的附近)上,在下側獲取構成裝載運送工具530及/或元件裝載工具540的拾取器的底面圖像。 To this end, a camera 649 can be provided, which is disposed on the moving path of the loading and transporting tool 530 and/or the component loading tool 540 (for example, in the vicinity of the DC test portion 230), and acquires the loading and transporting tool 530 and/or components on the lower side. An image of the bottom surface of the pickup of the loading tool 540.

另一方面,根據元件10的尺寸,可以決定裝載運送工具530拾取元件10、向煉板20插入元件10及/或通過元件裝載工具540拾取元件、向DC測試部230插入元件10的執行速度。 On the other hand, depending on the size of the component 10, the execution speed at which the loading tool 530 picks up the component 10, inserts the component 10 into the refining plate 20, and/or picks up the component through the component loading tool 540, and inserts the component 10 into the DC test portion 230 can be determined.

具體地說,根據元件10的規格,元件10在裝載托盤部110中的托盤30的排列有所不同,諸如6列、7列、8列、10列、12列等,並且用於拾取元件的元件裝載工具540的拾取器541的第一間隔距離x1也可以不同。 Specifically, the arrangement of the trays 30 of the components 10 in the loading tray portion 110 differs according to the specifications of the components 10, such as 6 columns, 7 columns, 8 columns, 10 columns, 12 columns, etc., and is used for picking up components. The first separation distance x 1 of the pickup 541 of the component loading tool 540 may also be different.

另外,根據元件處理器的設計以及規格,DC測試部230的元件插入槽(插座231)的第二間隔距離x2可以有所不同。 In addition, the second separation distance x 2 of the component insertion slot (socket 231) of the DC test portion 230 may vary depending on the design and specifications of the component processor.

另外,根據元件處理器的設計以及規格,煉板20上的元件插入槽(插座21)的第三間隔距離x3可以有所不同。 In addition, the third spacing distance x 3 of the component insertion slots (sockets 21) on the refining plate 20 may vary depending on the design and specifications of the component processor.

據此,一般情況是拾取元件10的裝載運送工具530以及元件裝載工具540可以改變構成拾取器的間隔距離x。 Accordingly, it is generally the case that the loading and transporting tool 530 of the pickup member 10 and the component loading tool 540 can change the separation distance x constituting the pickup.

但是,在改變構成拾取器的間隔距離以對應於所有元件10的規格的情況下,由於可變距離的範圍大,導致增加各拾取器之間的位置誤差,難以控制,並且運送工具的尺寸變大,結構複雜,也存在難以控制的問題。 However, in the case where the separation distance constituting the pickup is changed to correspond to the specifications of all the elements 10, since the range of the variable distance is large, the positional error between the respective pickups is increased, it is difficult to control, and the size of the conveying tool is changed. Large, complex, and difficult to control.

據此,作為新的元件拾取和放置方法,較佳為,本發明將比第一間隔距離x1(以下,基準間距)稍微小的值作為最小間距值;將比第二間隔距離x2稍微大的值作為最大間距值,以改變構成元件裝載工具540的拾取器的數量以及構成拾取器的第三間隔距離x3,其中第一間隔距離x1是托盤30的裝載槽21的間隔距離,而托盤30具有對應於拾取器數量的列,其中第二間隔距離x2是DC測試部230的元件插入槽231的間隔距離。 Accordingly, as a new component picking and placing method, it is preferable that the present invention has a value slightly smaller than the first separation distance x 1 (hereinafter, the reference pitch) as the minimum pitch value; and will be slightly smaller than the second separation distance x 2 The large value is taken as the maximum pitch value to change the number of the pickups constituting the component loading tool 540 and the third separation distance x 3 constituting the pickup, wherein the first separation distance x 1 is the separation distance of the loading slot 21 of the tray 30, The tray 30 has a column corresponding to the number of pickups, wherein the second separation distance x 2 is the separation distance of the component insertion grooves 231 of the DC test portion 230.

另外,若在托盤30的裝載槽21的第一間隔距離x1小於基準間距,則可以如下構成元件裝載工具540:在托盤30上間隔一個元件10地拾取元件10,之後未拾取元件10的拾取器在托盤30上間隔一個元件10地拾取元件10。 Further, if the first separation distance x 1 of the loading slot 21 of the tray 30 is smaller than the reference pitch, the component loading tool 540 may be configured as follows: the component 10 is picked up by one element 10 on the tray 30, and then the pickup of the component 10 is not picked up. The device 10 picks up the component 10 on the tray 30 with a component 10 interposed therebetween.

在此,結束元件拾取的元件裝載工具540,能夠以較小的可變間距將元件10裝在於DC測試部230。 Here, the component loading tool 540 that ends the component pickup can mount the component 10 in the DC test section 230 with a small variable pitch.

即,如圖4、圖5a以及圖5b所示,作為新的元件拾取和放置方法,本發明揭露一種元件拾取和放置方法,通過運送工具(元件裝載工具540)從第 一裝載部(例如,托盤20)拾取元件10放置到第二裝載部,其中運送工具以間隔距離x設置有k個(k為2以上的自然數)拾取器,第一裝載部以第一間隔距離x1設置有m個(m是2以上的自然數)元件10,第二裝載部以第二間隔距離x2配置插入元件10的n個(n為2以上的自然數)裝載槽,第二間隔距離x2與第一間隔距離x1不同,包括:第一拾取步驟,當第一間隔距離x1小於第二間隔距離x2一預定尺寸時,將運送工具的間隔距離x設定成第一裝載部中之第一間隔距離x1的兩倍,從第一裝載部每間隔一個地拾取元件10;第二拾取步驟,在第一拾取步驟中未拾取元件10的拾取器設置成第一裝載部的第一間隔距離x1的兩倍,進而每間隔一個地從第一裝載部拾取元件10;放置步驟,運送工具向第二裝載部移動的同時將第三間隔距離x3設定成第二間隔距離x2,將元件10分別放置於第二裝載部的裝載槽。 That is, as shown in FIGS. 4, 5a, and 5b, as a new component picking and placing method, the present invention discloses a component picking and placing method from a first loading portion by a transporting tool (component loading tool 540) (for example, The tray 20) the pickup member 10 is placed to the second loading portion, wherein the transport tool is provided with k (k is a natural number of 2 or more) pickups at a separation distance x, and the first loading portion is provided with a m at a first separation distance x 1 (m is a natural number of 2 or more) element 10, the second loading portion is disposed a second distance x 2 is inserted into element n (n is a natural number of 2 or more) of the loading slot 10, and a second distance x 2 The first spacing distance x 1 is different, including: a first picking step, when the first spacing distance x 1 is less than the second spacing distance x 2 by a predetermined size, setting the separation distance x of the conveying tool to the first loading portion a separation distance x 1 twice, picking up the component 10 from the first loading portion one at a time; in the second pickup step, the pickup of the unpicked component 10 in the first pickup step is set to the first interval of the first loading portion twice the distance x 1, and then every other from the first Pickup element 10 carrying portion; placing step, while the tool is moved toward the second conveying unit loading the third distance x 3 is set to a second distance x 2, the loading elements 10 are placed in the groove of the second loading portion.

在此,較佳為,運送工具的拾取器的數量與第二裝載部的裝載槽的數量相同。 Here, it is preferable that the number of the pickups of the transporting tool is the same as the number of the loading slots of the second loading section.

第一裝載部可以是使用於老化測試分揀機(Burn-In Sorter)的托盤30,而第二裝載部可以是設置在該老化測試分揀機的DC測試部230。 The first loading portion may be a tray 30 for use in a Burn-In Sorter, and the second loading portion may be a DC test portion 230 disposed in the burn-in test sorter.

另一方面,運送工具作為元件裝載工具540還可以設置一個以上的堆積拾取器542,堆積拾取器542用於拾取由DC測試部230檢查為不合格品的元件10。 On the other hand, the transporting tool as the component loading tool 540 may further be provided with one or more stacking pickers 542 for picking up the components 10 which are inspected as defective by the DC testing section 230.

堆積拾取器542係作為用於拾取由DC測試部230檢查為不合格品的元件10且包含於元件裝載工具540的結構,可以具有各種結構。 The build-up pickup 542 has a structure for picking up the component 10 which is inspected as a defective product by the DC test section 230 and is included in the component loading tool 540, and can have various configurations.

尤其是,堆積拾取器542拾取由DC測試部230檢查為不合格品的元件10,之後在托盤30與DC測試部230之間運送元件的過程中,可以將元件10裝載到上述的DC不合格品托盤部120的托盤30。 In particular, the build-up picker 542 picks up the component 10 that has been inspected as defective by the DC test section 230, and then, during the transport of the component between the tray 30 and the DC test section 230, the component 10 can be loaded to the aforementioned DC failure. The tray 30 of the product tray unit 120.

在此,因半導體製程的改善,由DC測試部230檢查為不合格品的元件10的數量非常少,因此可以使用一個或者兩個拾取器。 Here, the number of components 10 inspected as defective by the DC test unit 230 is very small due to the improvement of the semiconductor process, and thus one or two pickers can be used.

另一方面,堆積拾取器542不僅拾取由DC測試部230檢查為不合格品的元件10,還可以具有與構成元件裝載工具540的拾取器相同或者類似的結構。 On the other hand, the stack pickup 542 not only picks up the component 10 which is inspected as defective by the DC test section 230, but also has the same or similar structure as the pickup which constitutes the component loading tool 540.

以上僅僅對能夠由本發明實現的較佳實施例的一部分進行了說明,眾所周知本發明的範圍不得被上述的實施例限定,在以上說明的本發明的技術思想及其根本的技術思想應包含在本發明的範圍內。 The foregoing is only a part of a preferred embodiment that can be implemented by the present invention. It is to be understood that the scope of the present invention is not limited by the above embodiments, and the technical idea of the present invention and its essential technical idea described above should be included in the present invention. Within the scope of the invention.

Claims (8)

一種元件處理器,包括:一第一煉板台(210),從一煉板裝載器(800)接收設置有複數個元件插座(21)的一煉板(20),並且以一Y軸方向移動該煉板(20),進而導出插入於該元件插座(21)的元件(10),其中該元件插座(21)插入有該元件(10);一卸載緩衝部(310),設置在該第一煉板台(210)的一側,並且以該Y軸方向設定一元件卸載位置(UL1)和一元件分揀位置(UL2),向該元件卸載位置(UL1)和該元件分揀位置(UL2)輪流設置複數個托盤(30),其中該元件卸載位置(UL1)從位於該第一煉板台(210)的該煉板(20)接收該元件(10),該元件分揀位置(UL2)根據預先設定的分類基準分類裝載該元件(10);一卸載運送工具(510),從位於該第一煉板台(210)的該煉板(20)導出該元件(10),將該元件(10)運送到位於該元件卸載位置(UL1)的該托盤(30);一分揀托盤部(320),鄰接於該卸載緩衝部(310)的該元件分揀位置(UL2),根據預先設定的分類等級以一X軸方向放置複數個該托盤(30);一元件分揀工具(520),根據預先設定的分類等級,將該元件(10)分別再配置在位於該元件分揀位置(UL2)的該托盤(30)以及位於該分揀托盤部(320)的該托盤(30);一第二煉板台(220),以該X軸方向從該第一煉板台(210)接收完成元件導出的該煉板(20),並以該Y軸方向移動該煉板(20),以使新的該元件(10)插入於該煉板(20)的該元件插座(21);一DC測試部(230),設置以鄰接該第二煉板台(220),並且以該X軸方向配置用於DC測試的一DC測試插座(231);一裝載運送工具(530),從該DC測試部(230)導出檢查為合格品的該元件(10),將該元件(10)插入於該第二煉板台(220)的該元件插座(21);一裝載托盤部(110),設置以鄰接該DC測試部(230),並且設置有用於向該DC測試部(230)供應該元件(10)之一個以上的該托盤(30);一DC不合格品托盤部(120),鄰接於該DC測試部(230),對於該裝載托盤部(110)以該X軸方向配置有一個以上的該托盤(30),以根據該DC測試部(230)檢查為不合格品的檢查結果分類裝載該元件(10);以及 一個以上的元件裝載工具(540),用於從該裝載托盤部(110)向該DC測試部(230)傳送元件,以及從該DC測試部(230)向該DC不合格品托盤部(120)傳送元件。  A component processor includes: a first refining table (210), receiving a refining plate (20) provided with a plurality of component sockets (21) from a plate loader (800), and in a Y-axis direction Moving the refining plate (20), and then deriving an element (10) inserted into the component socket (21), wherein the component socket (21) is inserted with the component (10); an unloading buffer portion (310) is disposed at the One side of the first refining table (210), and a component unloading position (UL1) and a component sorting position (UL2) are set in the Y-axis direction, the component unloading position (UL1) and the component sorting position are (UL2) arranging a plurality of trays (30) in turn, wherein the component unloading position (UL1) receives the component (10) from the slab (20) located at the first slab (210), the component sorting position (UL2) loading the component (10) according to a predetermined classification criterion; an unloading transport tool (510), and deriving the component (10) from the refining plate (20) located at the first refining plate (210), The component (10) is transported to the tray (30) at the component unloading position (UL1); a sorting tray portion (320) adjacent to the component sorting position (UL2) of the unloading buffer portion (310) ,root The preset classification level places a plurality of the trays (30) in an X-axis direction; a component sorting tool (520) reconfigures the components (10) in the component sorting according to a preset classification level a tray (30) at a position (UL2) and the tray (30) located in the sorting tray portion (320); a second refining table (220) from the first refining table in the X-axis direction ( 210) receiving the refining plate (20) from which the component is derived, and moving the refining plate (20) in the Y-axis direction to insert the new component (10) into the component socket of the refining plate (20) ( 21); a DC test portion (230) disposed adjacent to the second refining table (220), and configured in the X-axis direction a DC test socket (231) for DC testing; a loading and transporting tool (530) The component (10) inspected as a good product is derived from the DC test unit (230), and the component (10) is inserted into the component socket (21) of the second platen station (220); a loading tray a portion (110) disposed adjacent to the DC test portion (230) and provided with one or more trays (30) for supplying the DC test portion (230) to the DC test portion (230); a DC reject tray Department (120), adjacent In the DC test unit (230), one or more trays (30) are arranged in the X-axis direction with respect to the loading tray unit (110), and inspection results of the defective products are checked based on the DC test unit (230). Loading the component (10); and more than one component loading tool (540) for transferring components from the loading tray portion (110) to the DC testing portion (230), and from the DC testing portion (230) The DC defective product tray portion (120) transports the components.   如申請專利範圍第1項所述之元件處理器,其中,以該X軸方向設定一第一煉板運送線(BL1),以從該煉板裝載器(800)向該第一煉板台(210)傳送該煉板(20);以該X軸方向設定一第二煉板運送線(BL2),以從該第二煉板台(210)向該煉板裝載器(800)傳送該煉板(20);該第二煉板運送線(BL2)位於比該第一煉板運送線(BL1)更低的下側,以防止該第一煉板運送線(BL1)發生干涉。  The component processor of claim 1, wherein a first plate transport line (BL1) is set in the X-axis direction to the first platen from the plate loader (800) (210) conveying the slab (20); setting a second slab transfer line (BL2) in the X-axis direction to transfer the second slab (210) to the slab loader (800) The plate (20); the second plate transport line (BL2) is located on a lower side than the first plate transport line (BL1) to prevent interference of the first plate transport line (BL1).   如申請專利範圍第1項所述之元件處理器,其中,該卸載緩衝部(310)包括:一對托盤(30),輪流位於該元件卸載位置(UL1)和該元件分揀位置(UL2);以及一托盤運送部(311),移動該托盤(30),以使該對托盤(30)輪流位於該元件卸載位置(UL1)和該元件分揀位置(UL2)。  The component processor of claim 1, wherein the unloading buffer (310) comprises: a pair of trays (30) in turn at the component unloading position (UL1) and the component sorting position (UL2) And a tray transport portion (311) that moves the tray (30) such that the pair of trays (30) are alternately located at the component unloading position (UL1) and the component sorting position (UL2).   如申請專利範圍第1項所述之元件處理器,其中,該卸載運送工具(510)結合一圖像獲取部(519),該圖像獲取部(519)在導出該元件(10)之後拍攝該元件插座(21)的圖像,以確認在該煉板(20)上各個該元件插座(21)的連接端子的位置。  The component processor of claim 1, wherein the unloading transport tool (510) incorporates an image acquisition unit (519) that takes a picture after deriving the component (10) An image of the component socket (21) to confirm the position of the connection terminals of the component sockets (21) on the composite board (20).   如申請專利範圍第1項所述之元件處理器,其中,該裝載運送工具(530)結合一圖像獲取部(539),該圖像獲取部(539)在導出該元件(10)之後拍攝該元件插座(21)的圖像,以確認在該煉板(20)上各個該元件插座(21)的連接端子的位置。  The component processor according to claim 1, wherein the loading and transporting tool (530) incorporates an image acquiring unit (539), and the image acquiring unit (539) photographs after the component (10) is derived. An image of the component socket (21) to confirm the position of the connection terminals of the component sockets (21) on the composite board (20).   一種元件拾取和放置方法,通過一運送工具從一第一裝載部拾取一元件(10)放置到一第二裝載部,其中該運送工具以間隔距離(x)設置有k個拾取器,該第一裝載部以第一間隔距離(x 1)設置有m個元件(10),該第二裝載部以第二間隔距離(x 2)配置插該元件(10)的n個裝載槽,該第二間隔距離(x 2)與該第一間隔距離(x 1)不同,其中,該方法包括: 一第一拾取步驟,當該第一間隔距離(x 1)小於該第二間隔距離(x 2)一預定尺寸時,將該運送工具的間隔距離(x)設定成該第一裝載部中的該第一間隔距離(x 1)的兩倍,從該第一裝載部每間隔一個地拾取該元件(10);一第二拾取步驟,將在該第一拾取步驟中未拾取該元件(10)的拾取器設置成該第一裝載部的該第一間隔距離(x 1)的兩倍,進而每間隔一個地從該第一裝載部拾取該元件(10);一放置步驟,該運送工具向該第二裝載部移動的同時將一第三間隔距離(x 3)設定成該第二間隔距離(x 2),將該元件(10)分別放置於該第二裝載部的裝載槽。 A component picking and placing method for picking up an element (10) from a first loading portion by a transporting tool and placing it on a second loading portion, wherein the transporting tool is provided with k pickers at a spacing distance (x), the first a loading unit is provided with m elements (10) at a first spacing distance (x 1 ), and the second loading unit is configured to insert n loading slots of the element (10) at a second spacing distance (x 2 ). The two spacing distance (x 2 ) is different from the first spacing distance (x 1 ), wherein the method comprises: a first picking step, when the first spacing distance (x 1 ) is less than the second spacing distance (x 2 a predetermined size, the separation distance (x) of the transport tool is set to be twice the first separation distance (x 1 ) in the first loading portion, and the first loading portion picks up the interval Element (10); a second picking step of setting the picker that does not pick up the component (10) in the first picking step to twice the first separation distance (x 1 ) of the first loading portion, Further picking up the component (10) from the first loading portion at intervals of one; and in the placing step, moving the transport tool to the second loading portion At the same time, a third separation distance (x 3 ) is set to the second separation distance (x 2 ), and the element (10) is placed in the loading slot of the second loading portion, respectively. 如申請專利範圍第6項所述之元件拾取和放置方法,其中,該運送工具的拾取器的數量與該第二裝載部的裝載槽數量相同。  The component picking and placing method of claim 6, wherein the number of pickers of the transporting tool is the same as the number of loading slots of the second loading section.   如申請專利範圍第6項所述之元件拾取和放置方法,其中,該第一裝載部是使用於一燒機分揀器的托盤(30);該第二裝載部是設置在該燒機分揀器的一DC測試部(230);該運送工具還設置一個以上的堆積拾取器,該堆積拾取器用以拾取由該DC測試部(230)檢查為不合格品的該元件(10)。  The component picking and placing method according to claim 6, wherein the first loading portion is a tray (30) used in a burning machine sorter; the second loading portion is disposed in the burning machine A DC test portion (230) of the picker; the transport tool is further provided with more than one stacking picker for picking up the component (10) which is inspected as defective by the DC test portion (230).  
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* Cited by examiner, † Cited by third party
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