KR20150109132A - Handler for semiconductor package - Google Patents

Abstract

The present invention relates to a semiconductor package handler, more specifically, in a semiconductor package handler for performing visual inspection, an electric property inspection, a marking operation, a selecting operation of a defect product, and a final packing operation of a good product by receiving a semiconductor package from a feeder to a semiconductor package handler which provides the feeder for a package consecutively supplied at the high speed in a vibrating rotation plate capable of doing an ultra-high speed inspection (20,000 ea/hr or more), to be accurately supplied to a mounting block of a turn table passing through an arc type supply rail (one oscillator provided to the vibrating rotation plate is enough) or a straight line type supply rail (an extra oscillator is mounted as necessary). Furthermore, the invention comprises a vision inspection unit for performing visual inspection as the first and second inspection units for inspecting individually photograph a lower surface and a side surface of the semiconductor package, allowing for an errorless inspection by arranging a test unit for the electric property inspection after the first inspection unit, and enabling for a more perfect quality inspection due to arranging the second inspection unit thereafter. Thereby, the handler not only increases accuracy and reliability with the ultra-high speed inspection, but also eventually enables the packing operation to be performed.

Description

[0001] DESCRIPTION [0002] HANDLER FOR SEMICONDUCTOR PACKAGE [

The present invention relates to a semiconductor package handler,

More particularly, the present invention relates to a semiconductor package handler for receiving a semiconductor package from a feeder, performing a visual inspection, an electrical characteristic inspection, a marking operation, a screening operation for defective products,

In order to enable high-speed inspection (more than 20,000 pieces / hr), the package which continuously supplies ultra-high speed from the vibration rotary table is provided with arc-shaped supply rails (one oscillator provided in the vibration rotary table is sufficient) And a part feeder for precisely feeding the turntable to a seating block of the turret through an additional vibrator mount,

Furthermore, the vision inspection unit for performing the visual inspection is composed of first and second inspection units for photographing and inspecting the lower surface and the side surface of the semiconductor package, respectively. After the first inspection unit, test units for electrical property inspection are arranged, And then the second inspection unit is arranged to enable a more complete quality inspection, thereby greatly improving the accuracy and reliability of the inspection together with the high-speed inspection, and finally, the packaging operation can be completed.

Conventionally used semiconductors are manufactured in the form of a chip on a wafer, processed in the form of a semiconductor package that protects the semiconductor circuit through a separate packaging operation, and then shipped through a package.

The semiconductor package is fabricated to have a plurality of leads for electrical connection while the semiconductor chip is molded. The processed semiconductor package is finally subjected to an electrical characteristic test before final packaging to determine whether the semiconductor package is defective, Packaged.

The inspection process of the semiconductor package uses a device that simultaneously inspects, selects, and packages semiconductor packages so as to increase productivity.

The testing apparatus uses a test unit equipped with various measuring instruments such as a computer and a handler for automatically transferring the package and placing the package on a test unit. Such a device is called a semiconductor package handler.

Typically, the semiconductor package handler marks various kinds of information (type of semiconductor package, manufacturer, mutual name, manufacturing date, etc.) on the semiconductor package determined as good after checking the electrical characteristics of the semiconductor package, and then packages the semiconductor package.

However, in many known semiconductor package handlers, after the marking process, the appearance inspection of the semiconductor package is concurrently performed. Most of the semiconductor package handlers inspect only the portions related to the marking, A plurality of inspectors are manually inspecting the appearance of the semiconductor package, so that not only the inspection process time itself takes a long time, but also accuracy is very low.

Also, since a large number of inspectors must be employed, there is a problem in that an increase in manufacturing cost due to an increase in labor costs can not be avoided.

In spite of this, the appearance inspection of the semiconductor package is indispensable because it is not necessary to check the shape (angle, length) of the lead provided in the semiconductor package, And it is a major cause of lowering the trust of the buyer.

As a conventional technique related to the above-described semiconductor package handler, there is a semiconductor package cutting and handler device (hereinafter referred to as "prior art 1") of Korean Patent Laid-Open No. 10-2008-0074530 (Aug. 13, 2008)

In the conventional technique 1, a strip cutting process is performed to cut the strips in which the semiconductor packages are integrated to separate the semiconductor packages, an intermediate coiling portion on which the cut semiconductor packages are mounted, an unloading portion for aligning the semiconductor packages of the intermediate processing portion on the trays A vision inspection unit for picking up an image of the upper surface of the semiconductor packages mounted on the intermediate frame and inspecting alignment states and positions of the semiconductor packages by picking up the semiconductor packages on the intermediate frame, And an unloading picker having a nozzle.

However, the above-mentioned prior art 1 relates to a device for putting the semiconductor package in a tray after rearranging the alignment state and position of the semiconductor package through an unloading picker, and after the semiconductor package is subjected to the external inspection, There is a limitation as an apparatus for solving the above-mentioned problem.

Particularly, in the above prior art 1, since the vision inspection part photographs only the alignment state and position of the semiconductor package and inspects it, it can not perform the standoff defective detection of the lead such as the deflection of the lead of the semiconductor package in the wrong shape, There is a problem.

As a conventional technique for solving the above problems, Korean Patent Registration No. 10-0867386 (October 31, 2008) entitled "Semiconductor Device Appearance Inspection System" (hereinafter referred to as Prior Art 2)

The conventional art 2 includes an sorting device for inspecting the external appearance of the semiconductor device using a magazine loaded with a plurality of trays loaded with the semiconductor devices and then selectively discharging the inspecting device.

However, according to the conventional art 2, since only the upper surface of the semiconductor device is inspected and inspected, it is difficult to precisely grasp the lead failure of the semiconductor package, and all processes are performed through the tray.

As another conventional technique for solving the above problems, Korean Patent Laid-Open No. 10-2007-0059654 (Jun. 12, 2007) entitled " Pick and place system and method thereof "

The prior art 3 includes a first rotary that rotates and rotates with a first picker picking up a semiconductor package from a carrier, a second picker that re-picks up the semiconductor package of the first rotary, And a first and a second checking unit arranged in a vertical direction and arranged in one direction of the first and second rotary members to perform a visual inspection.

The prior art 3 aims at improving the inspection speed and accuracy by performing the visual inspection twice on the semiconductor package through the first and second inspection units. In the prior art 3, however, There is a limitation in detecting all of the lead defects in various types of semiconductor packages.

Furthermore, since the double pick-up structure through the first and second rotaries makes it difficult to manufacture the equipment, and since it is very difficult to control the re-pick-up, it is inconvenient to use. There is a disadvantage in that it can not be used as a semiconductor package handler in which electric characteristic inspection, visual inspection, marking, sorting, and packaging processes are integrally performed through a single facility.

Accordingly, the present invention has been made to solve the above-mentioned problems,

Each unit performing the above operations is sequentially arranged along the rotating direction of the turret so as to perform a series of processes consisting of electrical characteristic inspection, visual inspection, marking, sorting, and packaging operations very quickly and accurately, A test for accurately detecting all kinds of lead standoff defects occurring in various forms of a semiconductor package, that is, a semiconductor package to be tested, and conducting an electrical characteristic test so as to enable individual discharging of the defective semiconductor package and individual packaging of the good semiconductor package And a vision inspection unit comprising a first inspection unit and a second inspection unit for photographing and inspecting the lower surface and the side surface of the semiconductor package before and after the rotating direction of the turret with the unit therebetween The purpose.

The present invention also provides a semiconductor device comprising a 2-1 camera for photographing one side of a semiconductor so as to discriminate a defect of a more precise and refined semiconductor package by photographing and inspecting both sides of the semiconductor package, And a second inspection unit composed of a mirror for reflecting the other side in the vertical direction and a second camera for photographing the image reflected on the mirror.

Further, the present invention provides a semiconductor package of a single product, which is supplied at a high speed, so that chucks of the turret can be individually picked up accurately so as to prevent the operation stoppage of the equipment from being picked up, A stopper for stopping the semiconductor package to be transported through the lifting and lowering to a supply rail to which the semiconductor package is continuously transported and a package for the single part seated through the forward and backward movements when the stopper is lifted, And a semiconductor package handler in which a separating means composed of a mounting block is introduced.

Further, according to the present invention, semiconductor packages are sorted according to various defective types of semiconductor packages (for example, various defective types of leads, defective electrical inspection, defective marking, and defective lead types) A plurality of discharge members for individually discharging the semiconductor packages for each type of defective item so as to achieve a reduction in the subsequent process time for the defective semiconductor package and thereby a reduction in labor costs and an improvement in productivity; And a sorting member which rotates to be delivered to the discharge member according to the type of the defective product, and a sorting unit including the sorting unit.

As a result, the present invention provides a semiconductor package handler that performs a visual inspection, an electrical property inspection, a marking operation, a defective product selection operation, and a final packaging operation of good products by receiving a semiconductor package from a feeder, The turntable can be mounted on a vibrating turntable through a turntable via an arc-shaped supply rail (one vibrator provided on the vibrating turntable is sufficient) or a straight supply rail (with additional vibrator if necessary) And a feeder that feeds the semiconductor package accurately to the block, and further includes a first inspection unit and a second inspection unit for photographing and inspecting the lower surface and the side surface of the semiconductor package, respectively, So as to allow the error-free inspection to proceed, and then the second inspection unit is arranged And an object thereof is to byeokhan quality inspection is to be provided by a semiconductor package handler to enable to significantly improve the accuracy and reliability Sikkim as well, and finally the packaging operation of the inspection with high speed inspection.

According to an aspect of the present invention, there is provided a semiconductor package handler comprising: a feeder having a plurality of semiconductor packages stored therein;

A turret that individually picks up the semiconductor packages supplied from the feeder and rotates so that each of the semiconductor packages is transferred to the corresponding working position;

A vision inspection unit for performing visual inspection of the semiconductor package;

A test unit for conducting an electrical characteristic test of the semiconductor package;

A marking unit for marking information on an appearance inspection and a semiconductor package on which an electrical characteristic inspection is completed;

A sorting unit for discharging the semiconductor package determined to be a defective product; And

And a packaging unit for individually packaging and discharging the semiconductor packages determined as good products,

The vision inspection unit

A first inspection section for photographing a lower surface of the semiconductor package;

And a second inspection section for photographing a side surface of the semiconductor package.

In the semiconductor package handler according to the present invention, the second inspection unit may include a second camera for photographing one side of the semiconductor package, a reflector for reflecting the other side of the semiconductor package in a vertical direction, And a (2-2) camera for photographing.

Further, in the semiconductor package handler according to the present invention, the feeder further includes a supply rail through which a semiconductor package is continuously transferred to the chuck of the turret, the supply rail separating the semiconductor packages to be transferred into a single semiconductor package, And a separating means for separating the semiconductor package and the semiconductor package from each other, wherein the separating means comprises: a mounting block for receiving only the semiconductor package of the single article transported in connection with the supply rail, And a stopper installed to move up and down and to stop the semiconductor package which is moved up and down from the supply rail when the seating block is moved backward.

Further, in the semiconductor package handler according to the present invention, the sorting unit includes a plurality of discharge members for individually discharging the semiconductor packages for each type of defective item, and a sorting unit for rotating the defective semiconductor packages, And a member.

 The semiconductor package handler according to the present invention sequentially performs a series of processes such as electrical property inspection, visual inspection, marking, sorting, and packaging of a semiconductor package sequentially, thereby increasing productivity and minimizing the time required for final shipment of the semiconductor package Can be shortened,

In particular, by introducing a vision inspection unit comprising a first inspection unit and a second inspection unit for individually photographing and inspecting the lower surface and the side surface of the semiconductor package, the plurality of leads provided in the semiconductor package are provided with a multi- Since inspection can be performed for all types of defects of the lead, the accuracy of the inspection can be greatly increased.

The second inspection unit may include a 2-1 camera for photographing one side of the semiconductor package, a reflector for reflecting the other side of the semiconductor package in a vertical direction, and a 2-2 camera It is possible to inspect the appearance of the semiconductor package through photographing on both side surfaces of the semiconductor package, rather than on either side of the semiconductor package, thereby making it possible to more precisely and finely inspect the lead defects of the semiconductor package.

Further, the semiconductor package handler according to the present invention includes a stopper for temporarily stopping the semiconductor package to be transferred from the feeder to the turret by lifting and lowering, and a stopper for supplying the semiconductor package of the single article, The separating means composed of the mounting block is introduced into the supply rail connecting the feeder and the turret, and thus the rotating speed is high and a series of processes are successively performed at the working position. However, And it is possible to increase the work speed more rapidly by correct supply and transfer, thereby remarkably increasing the productivity improvement effect, which is a very advantageous invention for industrial power generation.

The semiconductor package handler according to the present invention includes a plurality of discharge members individually discharging a semiconductor package for each type of defective product and a sorting member rotating to transfer the defective semiconductor package separated from the chuck to the discharge member by type, Since the semiconductor package handler is selectively discharged only by the good and defective products, the defective semiconductor packages can be separated and discharged according to the type, so that the subsequent process of the defective semiconductor package can be performed very quickly and easily, Productivity, and the like can be expected.

1 is a view for explaining a semiconductor package;
2 is a plan view schematically showing a semiconductor package according to the present invention;
FIGS. 3 to 11 are side views schematically showing the respective configurations of the semiconductor package handler according to the present invention. FIG.

While the present invention has been described in connection with certain embodiments, it is obvious that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

In the drawings, the same reference numerals are used for the same reference numerals, and in particular, the numerals of the tens and the digits of the digits, the digits of the tens, the digits of the digits and the alphabets are the same, Members referred to by reference numerals can be identified as members corresponding to these standards.

In the drawings, the components are expressed by exaggeratingly larger (or thicker) or smaller (or thinner) in size or thickness in consideration of the convenience of understanding, etc. However, It should not be.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise.

 In the present application, the term " comprising " or " consisting of ", or the like, refers to the presence of a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

It is to be understood that the first to second aspects described in the present specification are merely referred to in order to distinguish between different components and are not limited to the order in which they are manufactured, It may not match.

In describing the semiconductor package handler according to the present invention, for the sake of convenience, when an unambiguous approximate direction reference is specified with reference to Figs. 3 to 11, the direction in which the gravitational force acts is set downward, .

In particular, the direction in which the turret 20 rotates in FIG. 2 and the direction in which the semiconductor package is fed from the feeder 10 to the turret 20 in FIG. 3 are respectively forward and reverse in the relative direction, The front and rear directions will be described with reference to the respective working positions in relation to the rotating direction of the turret 20. The mounting block 17 in Fig. 3 has a relatively moving direction toward the outward direction of the turret 20 For the sake of convenience of explanation, the front and the outside, the rear and the inside are used in combination, and unless otherwise specified in the description and claims of the invention relating to other drawings, Describe the direction according to the standard.

Hereinafter, a semiconductor package handler according to the present invention will be described with reference to the accompanying drawings.

1 to 11, the semiconductor package handler according to the present invention includes a feeder 10 for storing and supplying a plurality of semiconductor packages C, The turret 20 and the turret 20 so as to perform various inspection operations, marking operations, screening operations, discharging of defective products, and packaging and discharging of good products at the corresponding positions And a work unit 100 composed of work units.

As shown in FIG. 2, the feeder 10 accommodates a plurality of semiconductor packages in a circular reservoir 11, and the bottom surface of the reservoir 11 is connected to the bottom of the reservoir 11 through a vibration rotating motor And a vibrating rotary plate 12 for generating vibrations while rotating in a counterclockwise direction in FIG.

When the vibrating rotary plate 12 is vibrated while being rotated in one direction, the semiconductor packages are mounted on the side surface of the vibrating rotary plate 12 So that the semiconductor package of the single article is discharged to the supply rail 13 through the discharge port 11a and the semiconductor packages are aligned in a line along the transfer path 14 of the supply rail 13, (20).

Although not shown in the drawing, the vibrating rotary plate 12 is provided with a sloped surface inclined from the center to the upper side of the outer surface, and a plane portion waiting to rotate while the semiconductor packages which are bent toward the outside are rotated are provided at the upper end of the sloped surface.

The semiconductor packages may be guided while being aligned with the discharge port 11a by providing a spiral guide path formed on the outer side of the vibrating rotary plate 12 or the side wall of the reservoir 11 in the upward direction.

2 and 3, a supply rail 13 connected to the discharge port 11a is formed with a transfer path 14 of a semiconductor package between a pair of walls 13A, 14, the semiconductor packages to be transferred are placed and transported so that the leads C1 on both sides are arranged in the same direction as the longitudinal direction of the conveying path 14.

Therefore, it is preferable that the wall is configured to be able to control the width of the conveying path 14 in accordance with the left and right widths of the semiconductor package.

2, the feed rail 13 has a curved structure formed in the same direction as the vibration rotation direction of the vibration rotary plate 12 of the feeder 10, Vibration is generated in the conveying direction in association with the vibration rotary motor connected to the rotary plate 12 so that the semiconductor package is discharged from the feeder 10 to the supply rail 13 and from the supply rail 13 to the chuck It is preferable that the semiconductor package is simultaneously transported to the semiconductor package.

That is, as shown in the drawing, the conveying path may be an arcuate feed rail (or arc-shaped conveying path) (one vibrator provided in the vibrating rotary plate is sufficient, and the circularly conveyed package in the vibrating rotary plate is inertia- Or alternatively a linear feed rail (or a linear feed path) (in addition to a first oscillator provided on a vibrating rotary plate, a second oscillator may also be mounted on the straight feed rail) And can be transported at a faster speed).

More specifically, when employing an arc-shaped supply rail (or arc-shaped transfer path), the supply rail 13 having a curved structure formed in the same direction as the oscillation rotation direction of the feeder 10 is introduced, A vibration motor connected to the vibrating rotary plate 12 of the feeder 10 is connected to the vibration transmission means (for example, various gears, shafts, and shafts) The semiconductor package discharged onto the transfer path 14 can be transported by vibration while being pushed by another semiconductor package which is discharged later.

In contrast, when the supply rail is provided in a direction orthogonal to the rotation direction of the rotary plate, the linear supply rail acts on the outer side of the rotary plate by the centrifugal force acting on the semiconductor package due to the rotation of the rotary plate, In order to enable the feeding through the vibration by the vibration of the feeding rail, another vibration motor other than the vibration motor of the vibration feeder must be installed so as to be connected to the feeding rail, And complication of the equipment. However, it is preferable to select the semiconductor package considering the advantages and disadvantages according to the kind of the semiconductor package and the requirement specification of the handler, because relatively fast and accurate transfer can be ensured.

The supply rail 13 is connected to the lower position of the chuck 21 of the turret 20 (the first correct position P1) so that the semiconductor package is supplied to the turret 20.

2, the turret 20 is rotated in one direction (clockwise in the drawing) through a column (not shown) connected to a rotating motor (not shown) provided at a lower portion of the turret 20, And a plurality of chucks (21) spaced apart from each other by a predetermined distance are provided around the outer periphery.

The chuck 21 provided in the turret 20 may be varied according to the type and number of work units constituting the work unit 100. In the figure, a total of 24 chucks 21 are spaced apart by the same angle It can be confirmed that it is provided.

4, the chuck 21 is mounted on the mounting arm 20A of the turret 20 so as to move up and down, and is connected to the upper surface of the semiconductor package through a separate vacuum suction means (not shown) , When the turret 20 is rotated for a predetermined time after the turret 20 is rotated by a distance of the chucks 21 in the adsorbed state, So that the next operation is sequentially performed simultaneously.

The chuck 21 is resiliently supported by a mounting arm 20A of the turret 20 via an elastic body 21A and an upper end of the chuck 21 is fixed to the stationary frame 22 above the turret 20 in a downward direction The chuck 21 is lowered while the striking bar 23 strikes the chuck 21 and then the striking bar 23 is returned to the chuck 21, (21A).

The working units for performing the respective tasks are disposed in the predetermined positions P1 to P7 of the positions where the chucks 21 are temporarily stopped and the chucks 21 of the intermediate position S1, 21) function as a base portion of the semiconductor package.

The work units constituting the work unit 100 may be variously configured according to the type and number of work performed on the semiconductor package,

As shown in FIG. 2, there are basically an appearance inspection unit 110 that performs a visual inspection on a semiconductor package, a test unit 120 that performs electrical property inspection of the semiconductor package, an appearance inspection, A marking unit 130 for marking information on the completed semiconductor package, a sorting unit 140 for discharging the semiconductor package determined as a defective product, and a packaging unit 150 for individually packaging and discharging the semiconductor package determined as good .

The working units are sequentially installed in the rotating direction of the turret 20 at appropriate positions along the periphery of the turret 20. The order of arrangement may vary depending on the type, size, and the like of the semiconductor package.

In the drawing, a first inspection unit 111 (vision inspection unit 110), a second inspection unit (inspection unit) 110, and a second inspection unit 110 are arranged in a rotating direction of the turret 20 from a chuck 21 to which a semiconductor package is supplied from a feeder 10, A marking unit 130, a second inspection unit 113 (vision inspection unit 110), a sorting unit 140, and a packaging unit 150 are respectively installed.

2 and 3, at the first predetermined position P1 where the supply of the semiconductor package is performed from the supply rail 13 to the chuck 21, the supply rail 13 and the turret 20 And separating means 15 for separating the semiconductor packages, which are successively transferred and aligned in a line, into a single semiconductor package and picked up the chuck 21 of the turret 20.

That is, when the end portion of the supply rail 13 is formed to extend in a direction perpendicular to the chuck 21 of the turret 20, the transfer distance of the semiconductor package due to the vibration can not be uniformly secured. The position of the top surface of the semiconductor package to be vacuumed and adsorbed by the vacuum cleaner 21 can not be maintained constant. In this case,

The above problem can be solved by introducing the separating means 15 for allowing only the single package to be accurately placed and supplied to the first correct position P1 at the end of the supply rail 13. [

The separating means 15 separates only the semiconductor package mounted on the supply rail 13 and the semiconductor package mounted on the front side and the rear side to be picked up on the chuck 21 of the turret 20, And a stopper 16 installed to move upward and downward from the lower portion of the supply rail 13 and stopping the semiconductor package in contact with the front end of the semiconductor package which is moved upward when the seat back 17 is moved backward.

The stopper 16 and the seating block 17 are connected to each other in a cam driving manner through a single motor (not shown) to move upward and downward and forward and backward. In the seating block 17, And the outer end of the receiving groove 17A is opened to serve as a charging port through which the semiconductor package is inserted into the receiving groove 17A in the conveying path 14. [

In some cases, the seating block 17 may be formed to be different from the receiving groove 17A according to the size and type of the semiconductor package.

The chuck 21 of the turret 20 descends and sucks the semiconductor package of the receiving groove 17A in vacuum while the seating block 17 is retracted, The other end of the transfer path 14 is blocked so that another semiconductor package aligned at the rear is further forwardly transferred and separated from the supply rail 13 or placed in the receiving groove 17A of the mounting block 17 prevent.

When the turret 20 rotates, the stopper 16 descends at a high speed, and at the same time, the mounting block 17 moves forward at a high speed toward the conveying path 14, The receiving groove 17A of the mounting block 17 and the supply rail 13 are connected to each other by the transfer path 14 so that the transfer path 14 is interlinked The semiconductor package of the single product is transferred to the receiving groove 17A and is seated.

Next, the seating block 17 is retracted again, and the stopper 16 is sequentially raised so as to block the advancement and the conveyance of another semiconductor package to be subsequently conveyed. In the state where the seating block 17 has been retracted The next chuck 21 of the rotated turret 20 moves to the first correct position P1 and then descends to be sucked and supplied to the semiconductor package of the seating block 17. [

Therefore, even if the turret 20 is rotated at a high speed, the semiconductor package is supplied to the chuck 21 of the turret 20 in a separate state in accordance with the speed, The productivity can be improved by reducing the time.

Meanwhile, although not shown in the drawings, the present invention may further include an air injection means on the supply rail 13 to assist in transferring the semiconductor package to the seating block 17. [

That is, the air injection means is provided at the bottom of the conveying path 14 or at the upper portion of the conveying path 14, and the air injection means injects compressed air in cooperation with the advancement of the seating block 17, ) Can be instantaneously delivered to the seating groove 17A when the stopper is lowered.

2 and 5, the semiconductor package sucked by the chuck 21 at the first correct position P1 is moved to the second correct position P2 in accordance with the rotation of the turret 20 . At this time, the chucks 21 disposed between the first correcting position P1 and the second correcting position P2 function as the atmosphere of the semiconductor package as described above.

At the second correct position P2, the vision inspection unit 110 photographs the lower surface of the semiconductor package through the first inspection unit 111 provided below the chuck 21. [

The first inspection unit 111 is mounted on the mounting member 113 provided at the base of the turret 20 such that the lens of the first camera 112 faces upward so as to photograph the lower surface of the semiconductor package, The first appearance inspection such as the spacing, warping, and alignment of the first surface is performed.

The first camera 112 compares the information on the lower surface of the semiconductor package, which is a conventional good product, and determines whether the semiconductor package 112 is defective or not.

The measurement equipment is connected to the second inspection unit 113 by being interlocked with each other as a test unit 120, a marking unit 130 and a vision inspection unit 110 to be described later.

Therefore, the measuring instrument discriminates the good or defective article based on the information photographed through the first inspection section 111, judges whether or not the chuck 21 to which the semiconductor package is adsorbed is to be carried out by another unit, Or a subsequent work corresponding to a defective product is sequentially performed.

As shown in FIGS. 2 and 6, the semiconductor package having undergone the first appearance inspection at the second predetermined position P2 is moved to the third fixed position P3 in accordance with the rotation of the turret 20. FIG.

In the third correcting position P3, the electrical characteristics of the semiconductor package moved through the test unit 120 are inspected. The test unit 120 is placed under the chuck 21 at the third correcting position P3 And a socket 121 capable of electrical connection.

When the chuck 21 of the turret 20 descends at the third correct position P3 to connect the lead of the semiconductor package to the socket 121, an electrical signal from the test unit 120 is transmitted to the socket 121 To the semiconductor package to inspect the electrical characteristics of the semiconductor package,

The measuring instrument identifies and stores the semiconductor package of the chuck 21 according to whether the semiconductor package is defective or not, thereby determining whether or not the subsequent operation is to be performed.

At this time, as described above, the test unit 120 may be configured not to perform the electrical characteristic test on the semiconductor package determined as a defective product in the primary visual inspection according to the control of the measuring instrument.

This is because, even if the semiconductor package determined as the lead failure in the primary appearance inspection is connected to the socket 121, an electrical signal is not applied due to the lead failure, and the semiconductor package is easily identified as a defective product.

Next, as shown in FIG. 2 and FIG. 7, the semiconductor package having undergone the electrical characteristic inspection at the third correct position P3 is moved to the fourth correct position P4 in accordance with the rotation of the turret 20. FIG.

In the fourth correcting position P4, a marking operation is performed on the surface of the semiconductor package with respect to the good products which have passed the primary visual inspection and the electrical characteristic inspection through the marking unit 130 using laser.

The marking unit 130 includes a rotary member 131 installed below the chuck 21 at the fourth fixed position P4 to receive the semiconductor package and various information And a marking inspection camera 135 for photographing and inspecting whether or not a marking defect of the marked semiconductor package is detected.

The rotary member 131 is provided with a plurality of radially arranged seating portions 132. It is more preferable that four rotary members 131 are arranged at an angle of 90 degrees for convenience of the marking operation.

The rotation member 131 is installed to be inclined upward in the outward direction and connected to the motor at a lower portion to rotate the seat portion 132 of the rotation member 131.

At this time, the rotary member 131 is provided such that the seat portion 132 is inclined downward and outward with respect to the rotary member 131 so that the uppermost seat portion 131A can be maintained in a horizontal state while being inclined.

The laser irradiator 137 is installed so as to be inclined at an upper side of the rotary member 131 so as to be orthogonal to the lowermost seating portion 131B in the inclined state of the rotary member 131, The member 131 is installed to be inclined on the upper side of the rotary member 131 so as to be orthogonal to the seating portion 132 positioned in front of the rotation direction of the seating portion 132 in which the marking is proceeding in the inclined state.

The chuck 21 of the turret 20 is first lowered and the semiconductor package is first seated in the uppermost seating portion 131A.

When the semiconductor package is moved to the lowermost position by the rotation of the rotary member 131, the laser irradiator 137 irradiates the laser on the upper surface of the semiconductor package to mark the information.

Thereafter, when the rotating member 131 rotates to move the marked semiconductor package to the intermediate position, the marking inspection camera 135 photographs the marked surface to check whether the marking is bad or not.

At this time, the marking inspection camera 135 is installed so as to deviate to one side from the fourth correct position P4 so as not to overlap with the laser irradiator 137 (refer to FIG. 2).

Therefore, when the rotary member 131 rotates in the clockwise direction, the marking inspection camera faces the upper surface of the marked semiconductor package positioned at the middle height, and the marking can be more accurately inspected.

During the above-described operation, the turret 20 continues rotating and pausing, and sequentially seats the semiconductor package on the other seating part 132 where the semiconductor package is not seated.

At this time, at the fourth correct position P4, the striking rod 23 strikes the chuck 21 while the turret 20 is temporarily stopped to move up and down.

That is, when the chuck 21 is lowered, the semiconductor package is moved to the seating part 132 by the air pressure, and when the rotary member 131 rotates without the lifting action of the striking rod, the chuck 21 rotates with air pressure and vacuum pressure After picking up the marked package to be moved, the next operation is carried out.

Therefore, after the semiconductor package is seated from the chuck 21, which is moved for the fourth time when the semiconductor package handler is operated, to the last empty seating part 132, the marked semiconductor package of the seating part 132, To be moved to the working position.

2 and 7, the semiconductor package C, which has undergone the marking operation at the fourth predetermined position P4, moves to the fifth fixed position P5 in accordance with the rotation of the turret 20. As shown in FIGS.

The side surface of the semiconductor package C marked through the second inspection unit 113 (appearance inspection unit 110) installed in the outer lateral direction of the turret 20 is photographed at the fifth predetermined position P5, Inspection proceeds.

The second inspection unit 113 includes a second camera 114 for photographing one side of the semiconductor package C, a reflector 115 for reflecting the other side of the semiconductor package C in the vertical direction, And a second -2 camera 116 for photographing an image reflected by the reflecting mirror 115.

Therefore, according to the present invention, one side (outer side) of the semiconductor package (C) is simply photographed due to the arrangement of the adjacent units, Further,

Since both the side faces (inner side and outer side) of the semiconductor package C are photographed and the secondary appearance inspection is performed, not only the spacing, warping, and alignment of the leads C1 of the semiconductor package C, It is possible to precisely discriminate and inspect all kinds of appearance defects, such as defects in length, and thus, the accuracy of inspection can be greatly improved.

At this time, in order to inspect both side surfaces of the semiconductor package C, the direction of the semiconductor package C adsorbed on the chuck 21 should be formed in a direction different from the adsorption direction in the first correct position P1.

That is, considering the rotation of the turret 20 and the other working units in the adjacent position, the second-first camera 114 must be installed outside the turret 20. In the first fixed position P1, (I.e., the one side lead C1 of the semiconductor package C is not attracted toward the second-first camera 114 in the direction in which the rear end thereof is directed to the outer side with respect to the chuck 21) 4), the direction of the semiconductor package C adsorbed on the chuck 21 must be rearranged.

2 and 11, the present invention provides a semiconductor package (not shown) fixed to the chuck 21 at an intermediate position S1 between the third fixed position P3 and the fourth fixed position P4. C, and an alignment state, for example.

The aligning unit 160 may be installed in all or a part of the intermediate position S1 between the different positive positions P1 to P7, which will be described later.

The alignment unit 160 includes an alignment member 161 on which the semiconductor package C is mounted and which realigns the orientation of the semiconductor package C through rotation.

The aligning member 161 is connected to the motor (not shown) and rotates to reorient the direction of the semiconductor package C. The aligning member 161 further includes fixing means connected to the motor of the aligning member 161 in a cam driving manner, (C) is pressed and fixed to prevent the semiconductor package (C) from being detached upon rotation.

That is, when the chuck 21 is temporarily stopped at the intermediate position S1 where the alignment unit 160 is provided, the chuck 21 descends to seat the semiconductor package C on the alignment member 161, When the chuck 21 rises again after the alignment member 161 rotates instantaneously, the semiconductor package C is initially supplied and re-arranged in a direction different from the direction in which the semiconductor package C is sucked.

Therefore, in the first correct position P1, the direction in which the semiconductor package C is oriented in the same direction as the longitudinal direction of the transfer path 14 (the direction in which the front end of the semiconductor package C faces the center of the turret 20; see FIG. 4) The semiconductor package C is rotated at an angle of 90 degrees by the aligning unit 160 at the fifth predetermined position P5, while the semiconductor package C is attracted to the chuck 21 at the fifth predetermined position P5.

Meanwhile, the aligning unit 160 may be disposed at all or a part of an intermediate position between the right positions P1 to P7 where the work unit of the present invention is installed, as described above, C are rearranged.

Accordingly, in the drawings of the present specification, it can be seen that between the second and third correct positions P2 and P3, between the third and fourth correct positions P3 and P4, and between the sixth and seventh correct positions P6 and P7 The aligning units 160 are arranged at an intermediate position S1 between the two alignment units 160, respectively.

The aligning unit 160 installed at the intermediate position S1 between the second and third correct positions P2 and P3 may be positioned at a predetermined position in the semiconductor package C So that the alignment member 161 does not rotate so that the semiconductor package C can be accurately positioned and repositioned through the descending of the semiconductor package C without any change in direction do.

This is a structure for preventing the semiconductor package C adsorbed on the chuck 21 from being disturbed in accordance with the high-speed rotation of the turret 20 of the present invention. Therefore, in addition to the intermediate position S1 shown in the drawing, The aligning unit 160 may be added or omitted individually to all or a part of the intermediate position S1 between the work units of the work station.

Of course, it is obvious that the adsorption direction of the semiconductor package C is rearranged through the alignment unit 160 when the direction of the next operation and the installation direction of the operation unit are set differently.

Next, as shown in FIG. 2 and FIG. 9, the semiconductor package, which has undergone the marking operation at the fifth predetermined position P5, moves to the sixth fixed position P6 in accordance with the rotation of the turret 20. FIG.

At the sixth predetermined position P6, the semiconductor packages determined as defective through the first and second inspection units 113 and 120 are separately discharged by the sorting unit 140 according to the failure type.

The sorting unit 140 includes a plurality of discharge tubes 141 disposed below the chuck 21 of the turret 20 to allow the semiconductor packages to be separated and discharged individually according to the defective type and a discharge tube 141 disposed between the chuck 21 and the discharge tube 141 And a guide member 142 for receiving the defective semiconductor package falling from the chuck 21 and guiding the defective semiconductor package to one of the discharge pipes 141.

The discharge tubes 141 are radially arranged around the sixth correcting position P6 and the guide member 142 has a vertical tube portion 142A arranged in line with the sixth correcting position P6, And a bending pipe portion 142B bent at a predetermined angle from the lower end of the bending portion 142A.

Therefore, when the semiconductor package sucked by the chuck 21 of the turret 20 is determined to be a defective product, the chuck 21 releases the suction at the sixth correct position P6 to drop the semiconductor package. At this time, ) Rotates the bending pipe portion 142B to the upper position of the discharge pipe 141 according to the failure type so that the semiconductor package is discharged through the corresponding discharge pipe 141 so that the defective product can be separately stored for each failure type.

Here, the concept of the defect type of the semiconductor package is not only different from the defect types determined according to the first inspection unit 111, the test unit 120, the marking inspection camera 135 and the second camera, And sorting by grade according to their status.

Therefore, according to the present invention, defective products are sorted and stored in accordance with the defective type, so that it is possible to prevent defective products (or grades) from being rejected at the time of discarding or further processing of defective semiconductor packages.

Finally, as shown in FIG. 2 and FIG. 10, the semiconductor package of good goods not sorted and discharged at the sixth predetermined position P6 moves to the seventh fixed position P7 in accordance with the rotation of the turret 20 do.

In the seventh correct position P7, the semiconductor packages identified as good are separately packaged by the packaging unit 150 and discharged.

The packaging unit 150 is configured such that a carrier tape T1 having a storage portion T1a through which the semiconductor package can be housed is inserted into the lower position of the chuck 21 at the seventh fixed position P7 through the sprocket 151 Conveyed, supplied,

The chuck 21 releases the adsorption of the good-quality semiconductor package, and the chuck 21 is put into the accommodating portion T1a.

The carrier tape T1 in which the good semiconductor package is housed is moved by the sprocket 151 and the cover tape T2 is supplied through the feeder 152 provided in the upper part of the packaging unit 150 to be received in the carrier tape T1 of the housing portion T1a.

The carrier tape T1 and the cover tape T2 which are continuously moved are then bonded to each other through the sealing machine 153 and wrapping is completed. The wrapped carrier tape T1 is wound on the take-up reel 154 Final discharge is completed and shipped.

As described above, each of the working units constituting the present invention can be rearranged in accordance with the order of the last process before shipment, the type of the semiconductor package, or the like, or other additional working units can be additionally installed, The present invention is not limited thereto. The nature of the stationary position may be that the turret 20 is temporarily stopped It will be in all the positions.

For convenience of explanation, the movement of the chuck 21 according to the rotation of the turret 20 is shifted to the right positions P1 to P7 having different rotational angles. However, as described above, The turret is operated to pause after rotating by a distance between chucks according to the number of chucks.

Further, in the present specification, it is to be understood that the present invention may be applied to other fixing means (e.g., clamping member) for variously setting the arrangement order of the operation units, various sensors for sensing semiconductor packages, flash for camera shooting, The additional equipment and the like are not related to the essential features of the present invention and thus are omitted for the sake of convenience of explanation. However, such a configuration can be reproduced by adding, modifying, The right interpretation of the right should not be limited.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it should be understood that various changes, omissions and substitutions may be made thereto without departing from the spirit and scope of the invention as defined by the appended claims. And should be construed as falling within the scope of protection of the present invention.

10: feeder 11: reservoir
12: Vibrating swing plate 13: Supply rail
14: Feed path 15: Separation means
16: stopper 17: seat block
20: turret 21: chuck
100:
110: vision inspection unit 111: first inspection unit
112: first camera 113: second inspection unit
114: 2-1 camera 115: reflector
116: Camera 2-2
120: Test unit 121: Socket
130: marking unit 131: rotating member
132: seat part 135: marking inspection camera
137: Laser Irradiator
140: Selection unit 141:
142: guide member
150: Packing unit
160: alignment unit

Claims (4)

A feeder in which a plurality of semiconductor packages are stored;
A turret that individually picks up the semiconductor packages supplied from the feeder and rotates so that each of the semiconductor packages is transferred to the corresponding working position;
A vision inspection unit for performing visual inspection of the semiconductor package;
A test unit for conducting an electrical characteristic test of the semiconductor package;
A marking unit for marking information on an appearance inspection and a semiconductor package on which an electrical characteristic inspection is completed;
A sorting unit for discharging the semiconductor package determined to be a defective product; And
And a packaging unit for individually packaging and discharging the semiconductor packages determined as good products,
The vision inspection unit
A first inspection section for photographing a lower surface of the semiconductor package;
And a second inspection section for photographing a side surface of the semiconductor package.
The method according to claim 1,
The second checking unit
A 2-1 camera for photographing one side of the semiconductor package,
A reflector for reflecting the other side of the semiconductor package in a vertical direction,
And a second camera for photographing an image reflected by the reflecting mirror.
The method according to claim 1,
Wherein the feeder further comprises a supply rail through which the semiconductor package is continuously transported to the chuck of the turret,
Wherein the supply rail further comprises separating means for separating the semiconductor packages to be transferred into a semiconductor package of the single product and picking up the semiconductor packages to the chuck of the turret,
The separating means
A mounting block on which a semiconductor package of a single article to be transferred and connected to the supply rail is mounted and which supplies only a semiconductor package seated through forward and backward movement to a lower position of the chuck;
And a stopper installed to move up and down and to stop the semiconductor package to be lifted up when the seat back is moved backward and to be delivered from the supply rail.
4. The method according to any one of claims 1 to 3,
The sorting unit includes a plurality of discharge members formed to individually discharge semiconductor packages for each type of defective product,
And a selection member which rotates the defective semiconductor package separated from the chuck so as to be transmitted to the discharge member according to the defective type.

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