TW201633705A - Piezoelectric vibrating reed and piezoelectric vibrator - Google Patents

Abstract

To provide a small-sized piezoelectric vibrating reed and a piezoelectric vibrator with excellent durability. The piezoelectric vibrating reed includes a piezoelectric plate having a rectangular shape, a vibrating portion formed on a principal surface of the piezoelectric plate and a pair of mount portions for mounting the piezoelectric plate. The pair of mount portions are formed at both end portions of the piezoelectric plate in a longitudinal direction. The piezoelectric vibrator includes the piezoelectric vibrating reed and a package on which the mount portions of the piezoelectric vibrating reed are mounted.

Description

Piezoelectric vibrating piece and piezoelectric vibrator

The present invention relates to a piezoelectric vibrating piece and a piezoelectric vibrator.

A mobile phone, an action information terminal device, a radio timepiece, or the like uses a piezoelectric vibrator using a crystal or the like as a time source or a reference signal source such as a time source or a control signal. Conventionally, in the piezoelectric vibrator, the piezoelectric vibrating reed is stored in a state of being fixed to the package by a conductive adhesive for mounting.

For example, Patent Document 1 describes a piezoelectric vibrator in which a rectangular piezoelectric vibrating reed is supported by a cantilever in a package.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2014-116388

However, the piezoelectric vibrator piezoelectric vibrating piece described in Patent Document 1 is attached to the package at the mounting portion at the end portion in the longitudinal direction. Therefore, when a force other than an impact acts on the piezoelectric vibrator, a large moment is applied to the piezoelectric vibrating piece, and there is a possibility that the piezoelectric vibrating piece is peeled off from the package at the mounting portion. In particular, when the piezoelectric vibrating reed is reduced in size, the area of the mounting portion is reduced, so that the peeling in the mounting portion is more likely to occur. Therefore, in the conventional piezoelectric vibrator and the piezoelectric vibrating piece, the durability is lowered as the size is reduced.

Thus, the present invention provides a small piezoelectric vibrating piece and a piezoelectric vibrator excellent in durability.

A piezoelectric vibrating piece according to the present invention includes a piezoelectric plate having a rectangular shape, a vibrating portion formed on a main surface of the piezoelectric plate, and a pair of mounting portions for mounting the piezoelectric plate, and the pair of mounting The portions are formed on both end portions of the piezoelectric plate in the longitudinal direction. Further, it is preferably in the vicinity of a corner portion formed at one end portion of the piezoelectric plate in the short side direction.

According to the present invention, when the piezoelectric vibrating reed is mounted, a rectangular piezoelectric plate is supported by one of the end portions formed in the short-side direction of the piezoelectric plate, so that the conventional structure is In the case where it is supported at one end of the longitudinal direction, the moment centered on the mounting portion becomes small. As a result, the stress applied to the mounting portion is reduced. Therefore, even when the piezoelectric vibrating piece is reduced in size, the mounting portion is reduced, and the fixing force at the time of mounting is reduced, damage to the mounting portion can be suppressed. Therefore, it is possible to obtain a small piezoelectric excellent in durability. Vibrating piece.

In the piezoelectric vibrating piece described above, the vibrating portion is formed to be thinner than the mounting portion at least around the mounting portion.

According to the present invention, even when the piezoelectric vibrating reed is attached to the package, even if a moment centering on the mounting portion is generated, the stress acting on the mounting portion can be alleviated in the thin vibrating portion. Therefore, a piezoelectric vibrating piece having more excellent durability can be obtained.

In the piezoelectric vibrating piece described above, the piezoelectric plate is formed by cutting an AT substrate, and the longitudinal direction of the piezoelectric plate is characterized by a Z'-axis direction of the AT-cut crystal substrate.

The thickness shear vibration of the main vibration mode of the AT-cut crystal substrate is a vibration that is largely displaced in the X-axis direction. According to the present invention, the piezoelectric vibrating piece is supported by the cantilever at two points along the Z'-axis direction orthogonal to the X-axis direction, so that the mounting portion does not interfere with the displacement of the vibrating portion in the X-axis direction. When the mounting portion interferes with the displacement of the vibrating portion, unnecessary vibration is generated in the vibrating portion or the mounting portion. As a result, it is difficult to obtain the desired vibration characteristics. However, in the above configuration, the mounting direction of the mounting portion is The displacement direction of the vibrating portion is in an orthogonal relationship, so when compared with the case where the directions are the same direction, the generation of unnecessary vibration can be remarkably reduced. Therefore, a piezoelectric vibrating piece excellent in vibration characteristics can be obtained.

The piezoelectric vibrating piece is characterized in that the outer shape along the longitudinal direction of the piezoelectric plate is 1.4 times or less the outer dimension along the short side direction of the piezoelectric plate.

According to the present invention, the piezoelectric vibrating piece is shaped by the long side direction Since it is 1.4 times or less of the dimension outside the short-side direction, it can correspond to the mounting of a small package which is close to a square shape, for example, in plan view.

In the piezoelectric vibrating piece described above, the mounting portion protrudes from the piezoelectric plate along the surface direction of the piezoelectric plate.

According to the present invention, since the mounting portion protrudes from the piezoelectric plate, when the piezoelectric vibrating piece is mounted, it is possible to prevent the mounting member such as the conductive paste from adhering to the vibrating portion when it is wet. Thereby, variations in the vibration characteristics of the piezoelectric vibrating piece can be suppressed. Therefore, a piezoelectric vibrating piece excellent in vibration characteristics can be obtained.

The piezoelectric vibrator of the present invention is characterized by comprising the piezoelectric vibrating reed and the package in which the mounting portion of the piezoelectric vibrating reed is mounted.

According to the present invention, since the piezoelectric vibrating reed is provided, a small piezoelectric vibrator excellent in durability can be obtained.

The piezoelectric vibrator includes a mounting member that is disposed between the mounting portion of the piezoelectric vibrating reed and the package, and the mounting portion is mounted on the package, the mounting member and the mounting. The main surface of the portion is in contact with the side surface of the mounting portion as a feature.

According to the present invention, since the piezoelectric vibrating reed is fixed at least from the two directions by the mounting member, the piezoelectric vibrating reed and the mounting member that are fixed to each other are hardly peeled off. Therefore, a piezoelectric vibrator excellent in durability can be obtained.

When the piezoelectric vibrating piece of the present invention is used, the piezoelectric device is mounted. In the case of the vibrating piece, the piezoelectric plate is supported by the one of the one end portion of the piezoelectric plate in the short-side direction, so that it is supported at one end in the longitudinal direction as in the conventional structure. In the case, the torque centering on the mounting portion becomes small. As a result, the stress applied to the mounting portion is reduced. Therefore, even when the piezoelectric vibrating piece is reduced in size, the mounting portion is reduced, and the fixing force at the time of mounting is reduced, damage to the mounting portion can be suppressed. Therefore, a small piezoelectric vibrating piece excellent in durability can be obtained.

1, 101, 201‧ ‧ piezoelectric vibrators

5‧‧‧Package

9‧‧‧Installation components

10,110,310‧‧‧ Piezoelectric vibrating piece

11,111,311‧‧‧ piezoelectric plates

12, 112, 312‧‧‧ vibration department

21, 22, 121, 122, 321, 322, 421, 422‧‧‧ Installation Department

Fig. 1 is a plan view showing a piezoelectric vibrating piece according to a first embodiment.

Fig. 2 is an exploded perspective view showing the piezoelectric vibrator according to the first embodiment.

Figure 3 is a cross-sectional view taken along line III-III of Figure 2.

Fig. 4 is a cross-sectional view showing a piezoelectric vibrator according to a second embodiment.

Fig. 5 is a bottom plan view showing a piezoelectric vibrating reed according to a second embodiment.

Fig. 6 is a cross-sectional view showing another piezoelectric vibrating piece according to a second embodiment.

Fig. 7 is a cross-sectional view showing another piezoelectric vibrating piece according to a second embodiment.

Fig. 8 is a cross-sectional view showing a piezoelectric vibrator according to a modification of the second embodiment.

Fig. 9 is a plan view showing a piezoelectric vibrating reed according to a third embodiment.

Fig. 10 is a plan view showing another configuration of the piezoelectric vibrating reed.

Fig. 11 is a plan view showing another configuration of the piezoelectric vibrating reed.

Hereinafter, embodiments of the present invention will be described based on the drawings. Further, in describing the configuration of each drawing, an XY'Z' coordinate system is used. Each of the axes in the XY'Z' coordinate system has a crystal axis of a crystal to be described later and a relationship between the following. That is, the X-axis is the electric axis, and the Z'-axis is inclined by only 35 degrees and 15 minutes around the X-axis with respect to the Z-axis which is the optical axis, and the Y'-axis is an axis orthogonal to the X-axis and the Z'-axis. In addition, the X-axis direction, the Y'-axis direction, and the Z'-axis direction will be described by setting the direction of the arrow in the figure to the + direction and the direction opposite to the arrow as the - direction.

[First embodiment]

First, a piezoelectric vibrating piece and a piezoelectric vibrator of the first embodiment will be described.

Fig. 1 is a plan view showing a piezoelectric vibrating piece according to a first embodiment.

As shown in FIG. 1, the piezoelectric vibrating reed 10 includes a piezoelectric plate 11, mounting electrodes 31 and 32, and an excitation electrode 34.

The piezoelectric plate 11 is formed in a rectangular shape in a plan view by cutting the crystal substrate by AT. Here, the AT cutting system cuts out three crystal axes of the electric axis (X axis), the mechanical axis (Y axis), and the optical axis (Z axis) of the crystal axis of the artificial crystal, and only the X axis around the Z axis. The processing method of tilting 35 degrees and 15 minutes (Z' axis direction). The piezoelectric vibrating piece 10 having the piezoelectric plate 11 cut by AT cutting is stable in frequency temperature characteristics, and has a structure or shape Pure and easy to process, with the advantage of low CI value. The piezoelectric plate 11 is formed such that the longitudinal direction thereof is along the Z'-axis direction, and the outer dimension in the longitudinal direction (Z'-axis direction) is 1.4 times or less the outer dimension in the short-side direction (X-axis direction). Further, the piezoelectric plate 11 has a thickness direction in the Y'-axis direction and main faces 11A and 11B on both sides in the Y'-axis direction.

The vibrating portion 12 is formed on the piezoelectric plate 11, and one of the pair of piezoelectric plates 11 is attached to the mounting portions 21 and 22.

The vibrating portion 12 has a rectangular shape in plan view, and is formed in the longitudinal direction along the Z'-axis direction. The vibrating portion 12 is formed with one excitation electrode 34A formed on one main surface 11A of the piezoelectric plate 11 and the other excitation electrode 34B formed on the other main surface 11B. The other excitation electrode 34A is formed in a rectangular shape at a substantially center in the plan view of the vibrating portion 12. The other excitation electrode 34B is formed to overlap with the excitation electrode 34A formed on one of the principal surfaces 11A in plan view. According to this configuration, by applying a voltage to the excitation electrodes 34A and 34B, the piezoelectric plate 11 can be shear-vibrated in the thickness in the X direction.

The pair of attachment portions 21 and 22 are formed at one end portion of the piezoelectric plate 11 in the short-side direction (X-axis direction), and are formed at both end portions in the longitudinal direction (Z'-axis direction).

The first mounting portion 21 is formed at a corner portion in the (-X, +Z') direction from the center of the piezoelectric plate 11 in a plan view. The first mounting portion 21 has a first mounting electrode 31A formed on one of the principal surfaces 11A of the piezoelectric plate 11 and a first mounting electrode 31B formed on the other main surface 11B. One of the first mounting electrodes 31A is formed in a rectangular shape in a plan view The drawn wire 36A is connected to one of the excitation electrodes 34A. The other first mounting electrode 31B is formed to overlap one of the first mounting electrodes 31A in plan view.

The other first mounting electrode 31B of the first mounting electrode 31A is connected to each other via the first side surface electrode 37 formed on the side surface facing the -X direction of the first mounting portion 21 and the side surface facing the +Z' direction. .

The second mounting portion 22 is formed at a corner portion in the (-X, -Z') direction from the center of the piezoelectric plate 11 in a plan view. The second mounting portion 22 has a second mounting electrode 32A formed on one of the principal surfaces 11A of the piezoelectric plate 11 and a second mounting electrode 32B formed on the other main surface 11B. One of the second mounting electrodes 32A is formed in a rectangular shape in a plan view. The other second mounting electrode 32B is formed to overlap one of the second mounting electrodes 32A in plan view. The other second mounting electrode 32B is connected to the other excitation electrode 34B via the wire 36B.

The second mounting electrode 32A and the other second mounting electrode 32B are formed on the side surface facing the -X direction of the second mounting portion 22 and the second side surface electrode 38 facing the side surface in the -Z' direction. connection.

Next, the piezoelectric vibrator 1 including the piezoelectric vibrating reed 10 will be described.

Fig. 2 is an exploded perspective view showing the piezoelectric vibrator according to the first embodiment. Figure 3 is a cross-sectional view taken along line III-III of Figure 2. In addition, in FIG. 3, for the sake of easy understanding, the film thickness of the second mounting electrode 32 is exaggerated (it is the same even in the cross-sectional view below).

As shown in FIG. 2, the piezoelectric vibrator 1 of this embodiment is packaged. The piezoelectric vibrating reed 10 is housed inside the cavity C of the body 5. The package 5 is formed by overlapping the base substrate 2 and the top cover substrate 3.

The base board 2 is provided with a bottom wall portion 2a formed in a rectangular plate shape, and a side wall portion 2b which is erected from a peripheral edge portion of the bottom wall portion 2a. The bottom wall portion 2a and the side wall portion 2b are formed of a ceramic material or the like.

A pair of internal electrodes 7 are formed on the surface of the bottom wall portion 2a in the inside of the cavity C. A pair of internal electrodes 7 are formed by being spaced apart in a specific direction. Further, a pair of external electrodes (not shown) are formed on the surface of the bottom wall portion 2a in the outer portion of the cavity C. Further, the internal electrode 7 and the external electrode are connected by a through electrode (not shown) that penetrates the bottom wall portion 2a in the thickness direction. Further, the connection type of the internal electrode 7 and the external electrode is not limited thereto. For example, even if the wiring extends in the surface direction of the ceramic sheet, the internal electrode 7 and the external electrode may be connected.

Further, the top cover substrate 3 is formed into a rectangular plate shape by a ceramic material or the like. The peripheral edge portion of the top cover substrate 3 is bonded to the end surface of the side wall portion 2b of the base substrate 2. Further, a cavity C is formed in a region surrounded by the bottom wall portion 2a of the base substrate 2 and the side wall portion 2b and the canopy substrate 3.

As shown in FIG. 3, the piezoelectric vibrating reed 10 is housed inside the cavity C. The piezoelectric vibrating reed 10 is attached to the bottom wall portion 2a of the base substrate 2 via a mounting member 9 such as a conductive paste. More specifically, the pair of internal electrodes 7 formed on the bottom wall portion 2a of the base substrate 2 are attached to the first mounting electrode of the mounting portions 21 and 22 via one of the piezoelectric vibrating reeds 10 via the mounting member 9. 31 and the second mounting electrode 32. Accordingly, the piezoelectric vibrating reed 10 is mechanically held in the package 5 while the first mounting electrode 31 is mounted. The second mounting electrode 32 and the internal electrode 7 are electrically connected to each other.

In this manner, the piezoelectric vibrating reed 10 of the present embodiment includes the piezoelectric plate 11 formed in a rectangular shape in plan view, the vibrating portion 12 formed in the central portion of the main surface of the piezoelectric plate 11, and the piezoelectric plate 11 mounted thereon. One of the pair of mounting portions 21 and 22, the pair of mounting portions 21 and 22 are formed at one end portion of the piezoelectric plate 11 in the short-side direction, and both end portions of the piezoelectric plate 11 in the longitudinal direction.

According to this configuration, when the piezoelectric vibrating reed 10 is mounted, the rectangular portion is supported by the mounting portions 21 and 22 by one of the end portions formed in the short-side direction of the short-shaped piezoelectric plate 11. In the case of the conventional structure, the plate 11 has a smaller torque centering on the mounting portions 21 and 22 than when it is supported at one end in the longitudinal direction. With this, the stress applied to the mounting portions 21 and 22 is reduced. Therefore, even when the piezoelectric vibrating reed 10 is downsized, the mounting portions 21 and 22 are reduced, and the fixing force at the time of mounting is reduced, the mounting can be suppressed. The damage of the parts 21, 22 is broken.

Therefore, the small-sized piezoelectric vibrating reed 10 excellent in durability can be obtained.

Further, the distance between the mounting portions 21 and 22 and the excitation electrode 34 becomes longer than the structure in which the mounting portion is provided in the vicinity of the center in the short side direction of the diaphragm. Therefore, since the propagation distance when the vibration generated by the vibrating portion 12 propagates to the mounting portions 21 and 22 can be increased, the vibration generated in the vibrating portion 12 can be sufficiently attenuated, and the vibration energy can be reduced from the mounting portions 21, 22 The problem of so-called vibration leakage to the outside.

Further, the piezoelectric plate 11 is formed by cutting a crystal substrate by AT, and the longitudinal direction of the piezoelectric plate 11 is along the Z'-axis direction. Here, for The thickness shear vibration of the main vibration mode of the AT-cut crystal substrate is a vibration that is displaced in the X-axis direction. Therefore, the supporting portions 21 and 22 do not interfere with the displacement of the vibrating portion 12 in the X-axis direction by supporting the piezoelectric vibrating reed 10 at two points along the Z'-axis direction orthogonal to the X-axis direction. When the mounting portion interferes with the displacement of the vibrating portion, unnecessary vibration is generated in the vibrating portion or the attaching portion. As a result, it is difficult to obtain the desired vibration characteristics. However, in the above configuration, the mounting portions 21 and 22 are required. The arrangement direction and the displacement direction of the vibrating portion 12 are in an orthogonal relationship, so that when the directions are the same direction, the generation of unnecessary vibration can be remarkably reduced.

Further, since the shape of the piezoelectric plate 11 outside the longitudinal direction is 1.4 times or less the outer dimension of the piezoelectric plate 11 in the short-side direction, the piezoelectric vibrating piece 10 can correspond to, for example, a square shape in plan view. Installation of small packages.

In addition, the piezoelectric vibrator 1 of the present embodiment includes the piezoelectric vibrating reed 10 and the package 5 in which the mounting portions 21 and 22 of the piezoelectric vibrating reed 10 are mounted, so that the piezoelectric vibrator excellent in durability can be obtained. 1.

[Second embodiment]

Next, a piezoelectric vibrator and a piezoelectric vibrating piece according to the second embodiment will be described.

Fig. 4 is a cross-sectional view showing a piezoelectric vibrator according to a second embodiment, and corresponds to a cross-sectional view taken along line III-III of Fig. 2; Fig. 5 is a bottom plan view showing a piezoelectric vibrating reed according to a second embodiment.

The piezoelectric vibrating piece 110 of the second embodiment shown in Figs. 4 and 5 is The vibrating portion 112 is formed to be thinner than the mounting portions 121 and 122, and is different from the piezoelectric vibrating reed 10 of the first embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted (the same applies to the following embodiments).

As shown in FIG. 4, the piezoelectric vibrator 101 has the piezoelectric vibrating piece 110 attached to the package 5 via the mounting member 9. Further, as the mounting member 9, a conductive bonding agent, an electric paste, or the like can be applied.

As shown in FIG. 4 and FIG. 5, the piezoelectric plate 111 included in the piezoelectric vibrating piece 110 has a first mounting portion 121 which is formed one layer higher than the other main surface 111B of the vibrating portion 112 in the +Y' direction. And the second mounting portion 122.

The first mounting portion 121 is defined in a rectangular shape in a plan view by the side surface of the piezoelectric plate 111 and the step portion 115. The step portion 115 is continuously formed around the first mount electrode 31B, and is viewed from the first mount electrode 31B on the +X side and the -Z' side. The main surface 121a of the first mounting portion 121 is formed in parallel with the other main surface 111B of the piezoelectric plate 111.

The second mounting portion 122 is defined in a rectangular shape in a plan view by the side surface of the piezoelectric plate 111 and the step portion 116. The step portion 116 is continuously formed around the second mounting electrode 32B, and is viewed from the second mounting electrode 32B on the +X side and the +Z' side. The main surface 122a of the second mounting portion 122 is formed in parallel with the other principal surface 111B of the piezoelectric plate 111.

The vibrating portion 112 is thinner than the mounting portions 121 and 122 around the mounting portions 121 and 122.

As shown in FIG. 4, the piezoelectric vibrating piece 110 is formed such that the other main surface 111B of the piezoelectric plate 111 faces the bottom wall portion 2a of the base substrate 2. It is installed in the state. At this time, the main surface 121a of the first mounting portion 121 and the main surface 122a of the second mounting portion 122 are attached to the internal electrode 7 of the package 5 via the mounting member 9.

As described above, the piezoelectric vibrating piece 110 of the present embodiment forms the vibrating portion 112 which is thinner than the mounting portions 121 and 122 around the mounting portions 121 and 122. Therefore, even when the piezoelectric vibrating piece 110 is attached to the package 5, even if a moment centering on the mounting portions 121 and 122 is generated, the thin vibrating portion 112 can be moderately applied to the mounting portions 121 and 122. The stress. Therefore, the piezoelectric vibrating piece 110 having more excellent durability can be obtained.

Further, when the piezoelectric vibrating piece 110 is attached to the package 5, the mounting member 9 can be prevented from coming into contact with the main faces 121a and 122a of the mounting portions 121 and 122 which are higher than the other main surface 111B. The mounting member 9 is wetted and expanded from the main faces 121a and 122a and adhered to the vibrating portion 112. Thereby, variations in the vibration characteristics of the piezoelectric vibrating piece 110 can be suppressed.

Further, in the present embodiment, the piezoelectric vibrating piece 110 is attached to the package by bringing the mounting member 9 into contact with the main faces 121a and 122a of the mounting portions 121 and 122 on the other main surface 111B side of the piezoelectric plate 111. 5, but is not limited to this. The piezoelectric vibrating piece 110 may be in contact with the main surface of the mounting portions 121 and 122 in the one main surface 111A side of the piezoelectric plate 111. At this time, the effect of relieving the stress acting on the mounting portions 121 and 122 in the vibrating portion 112 can be obtained.

Furthermore, in the present embodiment, although the mounting portion 121, 122 is only one of the thickness directions (Y'-axis direction) of the piezoelectric plate 111, but is not limited thereto.

6 and FIG. 7 are cross-sectional views of other piezoelectric vibrating reeds according to the second embodiment, and correspond to a cross-sectional view taken along line VI-VI of FIG. 5.

As shown in FIG. 6, the mounting portions 121 and 122 may be higher than one of the main surface 111A and the other main surface 111B of the vibrating portion 112, respectively. With this configuration, even when the piezoelectric vibrating piece 110 is mounted on the package 5, one of the two main faces 111A and 111B of the piezoelectric plate 111 faces the bottom wall portion 2a of the base substrate 2, The mounting member 9 can be brought into contact with the main faces 121a, 122a formed one higher than the mounting portions 121, 122. Therefore, the manufacturing efficiency of the piezoelectric vibrator 101 can be improved, and the manufacturing can be performed at low cost.

In addition, as shown in FIG. 7, the piezoelectric vibrating piece 110 may be a so-called high-profile piezoelectric vibrating piece having a thick portion 112a in which the vibrating portion 112 protrudes from the principal surfaces 111A and 111B of the piezoelectric plate 111. . At this time, the thick portion 112a and the mounting portions 121 and 122 are formed separately from the two main faces 111A and 111B of the piezoelectric plate 111. According to this, in addition to the above-described effects, the piezoelectric vibrating piece 110 can block the vibration energy in the thick portion 112a and suppress the vibration from propagating toward the mounting portions 121 and 122. Further, in FIG. 7, although the height of one floor is disclosed as the thick portion 112a, the present invention is not limited thereto. Even as the thick portion 112a, the shape may be a high-rise portion having a plurality of stages. Further, the thick portion 112a may be formed on the main surface of at least one of the two main surfaces 111A and 111B.

Further, in the piezoelectric vibrating piece 110 shown in FIG. 7, the height of the thick portion 112a and the mounting portions 121 and 122 is not particularly limited, but the thick portion 112a and the mounting portions 121 and 122 have the same height. good. According to this configuration, since the piezoelectric plate 111 is formed so that the thick portion 112a and the mounting portions 121 and 122 can be simultaneously formed, the manufacturing process can be simplified.

Further, in the piezoelectric vibrating piece 110 shown in FIG. 7, the main surface of the thick portion 112a is formed to be one layer higher than the main surfaces 111A, 111B of the piezoelectric plate 111, but the main surface of the thick portion is formed even if it is formed. The two main faces 111A, 111B of the piezoelectric plate 111 may be stacked in multiple layers.

[Modification of Second Embodiment]

Next, a piezoelectric vibrator 201 according to a modification of the second embodiment will be described.

Fig. 8 is a cross-sectional view showing a piezoelectric vibrator according to a modification of the second embodiment, and corresponds to a cross-sectional view taken along line III-III of Fig. 2;

In the piezoelectric vibrator 101 of the second embodiment shown in FIG. 4, the mounting member 9 is brought into contact only with the main faces 121a and 122a of the mounting portions 121 and 122 of the piezoelectric vibrating reed 110. On the other hand, the piezoelectric vibrator 201 according to the modification shown in FIG. 8 is in contact with the mounting faces 9 on the main faces 121a and 122a and the side faces 121b and 122b of the mounting portions 121 and 122 of the piezoelectric vibrating piece 110 (refer to FIG. 5). The point of contact is different from the second embodiment. The same components as those in the second embodiment are denoted by the same reference numerals and will not be described in detail.

As shown in FIG. 8, the piezoelectric vibrator 201-based piezoelectric vibrating piece 110 is attached to the package 5 via the mounting member 9. Piezoelectric vibrator In 201, the mounting member 9 is in contact with the main faces 121a and 122a of the mounting portions 121 and 122 of the piezoelectric vibrating piece 110 on the side faces 121b and 122b of the entire mounting portions 121 and 122.

As described above, the piezoelectric vibrator 201 of the present modification has the mounting member 9 that is in contact with the main faces 121a and 122a of the mounting portions 121 and 122 and the side faces 121b and 122b of the mounting portions 121 and 122. According to this configuration, the piezoelectric vibrating reed 110 is fixed at least from the two directions by the mounting member 9, so that the piezoelectric vibrating reed 110 and the mounting member 9 that are fixed to each other are less likely to be peeled off. Therefore, the piezoelectric vibrator 201 having more excellent durability can be obtained.

[Third embodiment]

Next, a piezoelectric vibrating piece of the third embodiment will be described.

Fig. 9 is a plan view showing a piezoelectric vibrating reed according to a third embodiment.

The piezoelectric vibrating piece 310 shown in FIG. 9 is a point where the mounting portions 321 and 322 protrude from the piezoelectric plate 311 in the surface direction (XZ′ plane direction) of the piezoelectric plate 311, and the pressure of the first embodiment. The electric vibrating piece 10 is different.

As shown in FIG. 9, the piezoelectric plate 311 has a vibration portion 312 having a rectangular shape in plan view, and a pair of mounting portions 321, 322 protruding from the piezoelectric plate 311.

The pair of attachment portions 321 and 322 are formed at one end portion of the piezoelectric plate 311 in the short-side direction (X-axis direction), and are formed at both end portions in the longitudinal direction (Z'-axis direction). That is, it is formed so as to protrude from the corner portion spaced apart in the longitudinal direction toward the outer side in the plane direction of the piezoelectric plate 311.

Further, in the present embodiment, the shapes of the mounting portions 321, 322 are However, it is rectangular in the upper view, but the shape of the mounting portions 321, 322 is not limited thereto. It may be a parallelogram shape extending from the corner of the piezoelectric plate 311 to the (-X, +Z') direction and the (-X, -Z') direction. Further, even at the front end of the parallelogram shape, it may be mounted on the base substrate 2. At this time, since the mounting position of the piezoelectric vibrating piece 310 can be made further away from the vibrating portion 312, the possibility that the vibration leaks to the base substrate 2 at the mounting position can be reduced.

The first attachment portion 321 is disposed at a corner portion of the vibrating portion 312 in the (-X, +Z') direction, and is disposed to be in contact with the side surface of the vibrating portion 312 facing the -X direction. Further, the first attachment portion 321 is arranged to protrude from the side surface of the vibrating portion 312 facing the +Z' direction to the +Z' side.

The first mounting portion 321 has a first mounting electrode 331 formed on the main surface, and a first side surface electrode 337 formed on the side surface. The first mounting electrode 331 and the first side surface electrode 337 are formed to cover the entire surface of the first mounting portion 321 . The first mounting electrode 331 is connected to one of the main surfaces 311A of the piezoelectric plate 311, and is connected to the excitation electrode 34A formed on one of the vibrating portions 312 via the wire 336A.

The second attachment portion 322 is disposed at a corner portion in the (-X, -Z') direction of the vibrating portion 312, and is disposed to be in contact with the side surface of the vibrating portion 312 facing the -X direction. Further, the second attachment portion 322 is disposed to protrude from the side surface of the vibrating portion 312 facing the -Z' direction to the -Z' side.

The second mounting portion 322 has a second mounting electrode 332 formed on the main surface and a second side surface electrode 338 formed on the side surface. The second mounting electrode 332 is formed to cover the entire surface of the second mounting portion 322. 2nd installation The pole 332 is connected to the other main surface 311B of the piezoelectric plate 311, and is connected to the other excitation electrode 34B formed on the other side of the vibrating portion 312 via the wire 336B.

In this manner, the piezoelectric vibrating piece 310 of the present embodiment is attached from the piezoelectric plate 311 along the surface direction (XZ' plane direction) of the piezoelectric plate 311. According to this configuration, since the mounting portions 321 and 322 protrude from the piezoelectric plate 311, it is possible to prevent the wet-and-expanding mounting member 9 from adhering to the piezoelectric plate 311, particularly the vibrating portion 312, when the piezoelectric vibrating piece 310 is mounted. The situation. Thereby, variations in the vibration characteristics of the piezoelectric vibrating piece 310 can be suppressed.

Further, the mounting portions 321 and 322 are the same as the mounting portions 121 and 122 of the piezoelectric vibrating reed 110 shown in Fig. 5, and may be formed in a layer higher than the other main surface 311B of the piezoelectric plate 311 in the +Y' direction. According to this configuration, when the piezoelectric vibrating piece 310 is mounted, it is possible to more reliably suppress the wet expansion of the mounting member toward the vibrating portion 312. Further, as described with reference to FIG. 7, the piezoelectric vibrating piece 310 may have a so-called high-profile shape even if a thick portion is provided on both main surfaces 311A and 311B of the vibrating portion 312. At this time, the thickness of the mounting portions 321 and 322 and the thickness of the thick portion (the distance between the top surfaces of the thick portions of the front and back) may be the same thickness. Further, at this time, the mounting member 9 may be in contact with the entire surface of at least one of the main surface, the inner side surface, and the outer side surface of the mounting portions 321 and 322. As a result, the mounting strength of the piezoelectric vibrating piece 310 can be improved, and the piezoelectric vibrator 301 having excellent durability can be obtained.

Furthermore, the present invention is not limited to the description with reference to the drawings. In the above embodiment, various modifications can be considered within the technical scope thereof.

For example, in the above-described embodiment, a piezoelectric vibrating piece having a flat vibrating portion or a so-called high-profile piezoelectric vibrating piece is used, but the present invention is not limited thereto, even if a so-called bevel type or convex surface is used. A piezoelectric vibrating piece can also be used.

Furthermore, the electrode pattern formed on the piezoelectric plate is not limited to the above pattern. For example, as shown in Fig. 10, the mounting electrodes 431 and 432 may have a shape extending in the Z'-axis direction (a shape in which the dimension in the Z'-axis direction is longer than the dimension in the X-axis direction). In such a configuration, since the mounting electrodes 431 and 432 extend in a direction orthogonal to the direction in which the vibrating portion 12 is displaced, the vibration characteristics are not lowered, and the mounting areas of the mounting portions 421 and 422 can be increased. Further, as shown in FIG. 11, when the excitation electrode 34 and the mounting electrodes 31, 32 are connected, first, the electrode extends from the excitation electrode 34 in the X-axis direction, and thereafter, the electrode is connected to the Z'-axis direction. The pattern of the mounting electrodes 31, 32 may also be used. At this time, when compared with the pattern shown in Fig. 1, since the distance from the excitation electrode 34 to the electrodes of the mounting electrodes 31, 32 can be increased, the vibration energy propagating along the electrode can be sufficiently attenuated. Accordingly, the problem of vibration leakage can be reduced.

Further, in the above-described embodiment, the Z' axis direction of the crystal axis of the crystal is the longitudinal direction of the piezoelectric plate, but the X axis direction of the crystal axis of the crystal may be a long side direction. . In this case, on both sides of the +X axis side and the -Z' axis side, a mounting portion having a rectangular shape or a parallelogram shape protruding in the surface direction of the piezoelectric plate may be formed.

Furthermore, the mounting portions 421, 422 are formed not only on the short side of the piezoelectric plate The vicinity of the corner portion of one end of the direction may be formed on the end side of one of the short side directions and the other end side. That is, the mounting portions 421 and 422 may be formed even in a diagonal position.

In addition, the constituent elements in the above-described embodiments may be appropriately replaced with well-known constituent elements without departing from the gist of the invention.

10‧‧‧ Piezoelectric vibrating piece

11‧‧‧Piezoelectric plate

11A‧‧‧One side

11B‧‧‧The other side of the main

12‧‧‧Vibration Department

21, 22‧‧‧ Installation Department

31‧‧‧Installation electrode

31A‧‧‧1st mounting electrode

31B‧‧‧1st mounting electrode

32‧‧‧Installation electrode

32A‧‧‧2nd mounting electrode

32B‧‧‧2nd mounting electrode

34‧‧‧Excitation electrode

34A‧‧‧Excitation electrode

34B‧‧‧Exciting electrode

36A‧‧‧wiring wiring

36B‧‧‧wiring wiring

37‧‧‧1st side electrode

38‧‧‧2nd side electrode

Claims (8)

A piezoelectric vibrating piece comprising: a rectangular piezoelectric plate; a vibrating portion formed on a principal surface of the piezoelectric plate; and a pair of mounting portions of the piezoelectric plate, wherein the pair of mounting portions are It is formed on both ends of the piezoelectric plate in the longitudinal direction. The piezoelectric vibrating piece according to claim 1, wherein the pair of mounting portions are formed in the vicinity of a corner portion of one end portion of the piezoelectric plate in the short-side direction. The piezoelectric vibrating piece according to claim 1 or 2, wherein the vibrating portion is formed to be thinner than the mounting portion at least around the mounting portion. The piezoelectric vibrating piece according to claim 1 or 2, wherein the piezoelectric plate is formed by an AT-cut crystal substrate, and a longitudinal direction of the piezoelectric plate is along a Z'-axis direction of the AT-cut crystal substrate. The piezoelectric vibrating piece according to claim 1 or 2, wherein the dimension outside the longitudinal direction of the piezoelectric plate is 1.4 times or less the dimension outside the short side direction of the piezoelectric plate. The piezoelectric vibrating piece according to claim 1 or 2, wherein the mounting portion protrudes from the piezoelectric plate along a surface direction of the piezoelectric plate. A piezoelectric vibrator characterized by having: The piezoelectric vibrating piece according to any one of claims 1 to 6, wherein the piezoelectric vibrating piece is mounted on the mounting portion of the piezoelectric vibrating piece. The piezoelectric vibrator according to the seventh aspect of the invention, wherein the piezoelectric vibrator is disposed between the mounting portion of the piezoelectric vibrating reed and the package, and the mounting portion is mounted on the mounting member of the package, and the mounting is performed. The member is in contact with a main surface of the mounting portion and a side surface of the mounting portion.