TW201547139A - Contact pin unit and electric components using the same - Google Patents

Abstract

A contact-pin unit, for removably receiving IC package and electrically connected to the IC package and a circuit board, comprises a contact pin (26) and a contact pin frame (36). One end of the contact pin (26) is in contact with the IC package and other end is in contact with the circuit board. The contact pin frame (36) includes a plurality of grooves (36b) formed in parallel along a surface of the circuit board body; the contact pin (26) is arranged along the groove, and laminated on a thickness direction (D2), in a state that the one end and the other end are projecting to the outside of the circuit board body. Then, under the state of lamination, adjacently connected contact pin frames (36) are abutted against a surface (36a) and an inner surface (36c) in a lamination direction, and a micro-protrusion part (36k) is formed on a portion of the surface (36a). The micro-protrusion part (36k) is crushed and disintegrated when the laminated contact pin frames (36) are compressed in a lamination direction (D2).

Description

Contact foot unit and socket for electronic parts using the same

The present invention relates to a contact foot unit that detachably houses an electronic component such as an IC package and electrically connects the electronic component and the circuit substrate by contact with a foot; and a socket for an electronic component using the same.

For example, in an IC socket that is detachably housed in an electronic component such as an IC package and mounted on a circuit board, a housing portion constituting the IC package is disposed, and one end is in contact with the IC package and the other end is in contact with The contact leg of the circuit board is provided with a contact leg unit for electrically connecting the IC package and the circuit board.

With regard to such a contact leg unit, it has been proposed to use a so-called wash-plate-shaped contact foot frame in which a plurality of grooves which are transversely cut along the surface of the plate body are formed in parallel, and are arranged along the groove. The one end and the other end of the contact leg are formed by laminating in the direction of the plate thickness in a state of protruding toward the outer side of the plate body to serve as a contact leg unit (for example, refer to Patent Document 1). "Prior Technical Literature" <Patent Literature>

<Patent Document 1> JP-A-2012-89389

"The subject to be solved by the invention"

However, in the case where the size of the contact leg unit in the lamination direction of the contact foot frame exceeds the design flaw, since the contact pin unit is compressed even in the lamination direction, no compression direction of the lamination direction is provided between the adjacent contact foot frames. Therefore, it is difficult to adjust the size by compression to achieve design flaws.

Therefore, although it is desired to perform micro-correction for the mold for molding the contact-foot frame to perform dimensional adjustment, when the contact-foot frame formed in the modified mold is laminated, the size in the lamination direction of the contact-foot unit is If you deviate from the design, you will have to re-correct the mold, so that the size adjustment of the contact unit will become more complicated.

In view of the above, it is an object of the present invention to provide a contact pin unit which can solve such problems and solve the problem of sizing of the lamination direction, and a socket for an electronic component using the same. "Methods for Solving Problems"

In order to solve the above problems, the contact foot unit according to the present invention is premised on detachably accommodating electronic components and electrically connecting the electronic components and the circuit substrate, and is composed of a contact foot and a contact foot frame; One end is in contact with the electronic component and the other end is in contact with the circuit substrate; the contact leg frame is formed by forming a plurality of grooves parallel along the surface of the plate body, and the contact leg is disposed along the groove, at one end thereof and The end is laminated in the plate thickness direction in a state of protruding toward the outer side of the plate body; and in the laminated state, the adjacent contact leg frame is formed on at least a part of the abutting surface of the abutting direction in the lamination direction. There is a small convex portion which is an object which can be deformed when the laminated contact foot frame is compressed in the lamination direction.

Furthermore, the socket for an electronic component according to the present invention is an object including the following: a socket body provided with a contact foot unit as described above, a socket cover rotatably supported on the socket body, and a rotatable shaft Supported on the socket cover and in a state in which the socket cover is closed, the heat dissipating member accommodated in the electronic component of the contact leg unit and the latch member capable of holding the socket cover in the closed state can be pressed. Invention effect

According to the contact leg unit and the socket for an electronic component of the present invention, the contact leg unit in the lamination direction of the contact leg frame can be more easily sized.

Hereinafter, the embodiments for carrying out the invention will be described in detail with reference to the attached drawings. Fig. 1 to Fig. 5 show an example of a socket for an electronic component according to the embodiment.

The socket for an electronic component is housed in an IC (Integrated Circuit) package 100 for use as an electronic component, and is disposed on the circuit substrate 200 for electrically connecting the IC package 100 and the circuit substrate 200; for example, for An IC socket 10 that performs a performance test such as burn-in testing.

The IC socket 10 includes a socket body 12 that can accommodate the IC package 100, is detachably mounted to the socket body 12, presses the socket cover 16 of the IC package 100 via the heat dissipation member 14, and holds the socket cover 16 The locking mechanism 18 in a closed state (hereinafter referred to as a "closed state") can abut the heat sink member 14 with the IC package 100 housed in the socket body 12 to dissipate heat from the IC package 100.

In the following description, the IC package 100 housed in the socket body 12 is formed on the bottom surface 100a of the package body which is approximately square in plan view as shown in FIG. 20, and has a hemispherical terminal 100b. A BGA (Ball Grid Array) type IC package in which an array of m rows × n columns (m, n is a natural number other than 0) is arranged in plural.

The socket main body 12 is formed in a substantially rectangular shape in a plan view, and the first rotation axis X1 is provided on one end portion 12a, and the second rotation axis parallel to the first rotation axis X1 is provided on the other side end portion 12b. X2.

The socket cover 16 is a frame having a substantially square shape, and one side of the frame is a base end portion 16a of the socket cover 16, and the base end portion 16a is rotatably supported by the first rotation axis X1 of the socket body 12, Further, when rotated from the state of the broken line in Fig. 2, the distal end portion 16b of the opposite socket cover 16 facing the one side of the proximal end portion 16a is locked to a latch member to be described later.

Further, the socket cover 16 has a space formed by pressing the heat dissipation member 14 of the IC package 100 in a closed state in a closed state, and the heat dissipation member 14 is connected via a third rotation axis provided in parallel with the first rotation axis X1. The X3 is rotatably supported on the socket cover 16 and pressed against the upper surface of the IC package 100 with a uniform pressure when the socket cover 16 is closed. Thereby, the deviation of the pressure distribution applied to the IC package 100 is reduced, and the heat generated from the IC package 100 is transmitted to the heat radiating member 14 with good efficiency. The heat dissipating member 14 mainly radiates heat from the main fins 14a to the air.

The locking mechanism 18 includes, in the other side end portions 12b of the socket body 12, a latch member 20 and a crank member 22 of a substantially U-shaped shape; the latch member 20 is provided for facing the slave The potential energy is added away from the direction in which the socket body 12 is away, and can be locked with the front end portion 16b of the socket cover 16; the crank lever member 22 is rotated, and the latch member 20 is brought close to the socket via the cam mechanism of the omitted figure. The direction of the body 12 moves. The lock mechanism 18 is configured such that the crank lever member 22 is rotated from the state of the broken line of FIG. 2 in a state where the front end portion 16b of the socket cover 16 is locked by the latch member 20, and is tilted until it is opposed to The socket body 12 is approximately parallel, and moves the latch member 20 in proximity to the socket body 12, thereby causing the heat dissipation member 14 to press the IC package 100 through the socket cover 16 whose front end portion 16b is locked by the latch member 20; In the pressed state, the lock state of the operation of the crank lever member 22 is restricted.

A recess portion 12c penetrating to the bottom portion in a plan view is formed in the socket body 12, and a contact leg unit 24 is disposed on the recess portion 12c. The contact leg unit 24 is formed in the socket body 12 to constitute an accommodating portion for accommodating the IC package 100, and is configured to constitute an object for electrically connecting the IC package 100 and the circuit substrate 200.

6 to 13 show the contents of the contact foot unit 24. The contact leg unit 24 includes a unit body 28 having a plurality of contact legs 26, and a floating plate 34 that can be mounted on the unit body 28 and that houses the IC package 100 from the bottom surface 100a side.

The floating plate 34 is as shown in FIG. 8, and can be biased in the direction in which the unit body 28 is separated via the elastic member 24a interposed between the unit body 28 and the floating plate 34. Further, the floating plate 34 is formed with one end (a first contact portion to be described later) of the plurality of contact legs 26 disposed on the unit main body 28 so as to penetrate from the unit main body 28 side toward the bottom surface 100a side of the IC package 100. The foot penetrates the hole 34a. In addition, a guiding member 34b for guiding each corner of the IC package 100 is attached to the floating plate 34, thereby determining that the hemispherical terminal 100b in the bottom surface 100a of the IC package 100 accommodated on the floating plate 34 is connected. The foot passes through the appropriate position on the hole 34a.

The unit body 28 is provided with a contact leg 26 and a contact leg frame 36 for arranging the contact leg 26, and one end of the contact leg 26 is hemispherical in the bottom surface 100a of the IC package 100 housed on the floating plate 34. The terminal 100b is in contact with each other, and the other end is in contact with the electrode portion of the circuit board 200, thereby electrically connecting the IC package 100 and the circuit board 200.

The contact leg 26 has a first contact portion 26a that can be in contact with the hemispherical terminal 100b of the IC package 100, a second contact portion 26b that can contact the electrode portion (not shown) of the circuit board 200, and two contact portions. The spring portion 26c is bent into, for example, an S-shape. The spring portion 26c is formed such that the first contact portion 26a is in contact with the hemispherical terminal 100b and the second contact portion 26b is in contact with the electrode portion of the circuit board 200, and the floating plate 34 is pressed against the additional potential. At the unit main body 28 side, elastic deformation occurs due to a compressive force applied between the first contact portion 26a and the second contact portion 26b, thereby shortening the distance between the first contact portion 26a and the second contact portion 26b.

The contact leg frame 36 is formed by parallel formation of a plurality of grooves 36b transverse to the plate body along the surface 36a of the plate body, that is, a so-called wash plate-shaped plate body. For example, in the case where the contact foot frame 36 is a substantially rectangular flat plate, the groove 36b extending from one side to the opposite side is formed in parallel in the surface 36a of the flat plate. In the contact leg frame 36, the contact leg 26 is disposed along the groove 36b, and the first contact portion 26a and the second contact portion 26b of the contact leg 26 are stacked in the plate thickness direction Dt in a state of protruding toward the outside of the plate body. This constitutes the unit body 28 (e.g., approximately cuboid).

The shape and size of the groove 36b of the contact leg frame 36 are set such that even if the contact leg 26 interferes with the contact leg frame 36 when the contact foot frame 36 is laminated, the size of the contact leg frame 36 in the lamination direction is not affected. Further, the position in the parallel direction of the grooves 36b formed in parallel is set in accordance with the pitch direction of the hemispherical terminals 100b arranged in an array or the pitch of any one of the column directions (for example, the row direction). .

In the groove 36b of the contact leg frame 36, a central portion of the groove 36b excluding a part of the circuit board 200 side and a part of the IC package 100 side is a through groove 36d penetrating the inner surface 36c from the surface 36a of the contact leg frame 36. When the contact leg 26 is disposed along the groove 36b, the spring portion 26c is inserted into the through groove 36d. When each of the through grooves 36d of the contact leg frame 36 is formed to contact the leg frame 36 to form the unit main body 28, the unit through hole 28a penetrating the unit main body 28 is continuously formed in the lamination direction. When the spring portion 26c of the contact leg 26 is accommodated and a compressive force is applied between the first contact portion 26a and the second contact portion 26b of the contact leg 26, the unit through hole 28a is prevented by deformation of the spring portion 26c. Interfering with the contact foot frame 36.

Among the grooves 36b of the contact leg frame 36, the first bottomed groove 36e of a part of the IC package 100 side of the non-through groove 36d is closed by the inner surface 36c of the contact leg frame 36 adjacent to the laminated state. Since the opening of the bottom groove 36e is formed, the first insertion hole 36f that is inserted into the first contact portion 26a from the spring portion 26c of the contact leg 26 is formed. Since the spring portion 26c of the contact leg 26 is deformed by the spring portion 26c of the contact leg 26, the first contact portion 26a side can be directed from the IC package 100 toward the circuit substrate 200 in the first insertion hole 36f. Reciprocating action.

Further, among the grooves 36b of the contact leg frame 36, the second bottomed groove 36g of a part of the non-through groove 36d on the side of the circuit board 200 is the same as the opening for closing the first bottomed groove 36e. Since the inner surface 36c of the contact leg frame 36 closes the opening of the second bottomed groove 36g, the second insertion hole 36h that is inserted into the second contact portion 26b side from the spring portion 26c of the contact leg 26 is formed. The contact portion 26 is formed from the spring portion 26c, and the second contact portion 26b side is deformable from the spring portion 26c of the contact leg 26, and is directed from the IC package 100 toward the circuit board 200 in the second insertion hole 36h. The direction is reciprocating.

Contact pins laminated frame 36, specifically, in a direction parallel to the first direction D of the groove 36b in both end portions 36I _1, the guide shaft 38 is inserted through the thickness direction Dt of, i.e., the contact pins 36 of the frame laminate The guide holes 36j penetrating in the second direction D ₂ of the direction are laminated in accordance with the row direction of the hemispherical terminals 100b arranged in the array or the other side (for example, the column direction) of the column direction. A predetermined number is reached.

Further, the unit main body 28 formed by stacking a predetermined number of contact leg frames 36 is such that the first contact portion 26a and the second contact portion 26b of the contact leg 26 are respectively formed from the openings 30a, 32a of the square tubular body. The first frame body 30 and the second frame body 32 having a substantially square shape are formed so as to protrude from the opening direction, and are formed into a square tubular body formed by overlapping the individual openings 30a and 32a. The unit body 28 to be inserted is fixed to the first contact portion 26a and the second contact portion 26b that do not interfere with the contact leg 26 by the first frame body 30 and the second frame body 32, for example, at the contact foot. both end portions of the frame 36 in a first direction D ₁ is sandwiched by the fixing 36i.

Here, in any one of the row direction or the column direction (for example, the row direction) of the hemispherical terminals 100b arranged in an array, the contacts are arranged on the contact foot frame 36 through the pin through holes 34a. For forming the first contact portion 26 of the foot 26a, and correctly in contact with the hemispherical terminal 100b things, it is able to manage a direction parallel to the groove 36b formed in parallel by, i.e. in the first direction D ₁ location accuracy .

However, even in the other direction (for example, the column direction) of the row-like arrangement of the hemispherical terminals 100b in the row direction or the column direction, even if the forming precision of the contact foot frame 36 is strictly managed, a plurality of contact foot frames are laminated due to the lamination. 36 and the error cause of the laminate, the laminating direction of the unit body 28, i.e. actual dimensions in the second direction D ₂ will be greater than design Zhi Yu. Therefore, the first contact portion 26a of the contact leg 26 disposed on the contact leg frame 36 may not be in contact with the hemispherical terminal 100b through the pin through hole 34a.

On the other hand, even if the contact leg unit 24 is compressed in the lamination direction, there is no compression substitute for the lamination direction between the adjacent contact leg frames 36, so that the size is adjusted by compression to achieve the design. It is difficult.

Further, even if the mold for molding the contact foot frame 36 is subjected to dimensional adjustment by, for example, micro-correction of 0.0001 mm unit, when the laminated body frame 36 formed by the modified mold is laminated, if the foot unit is laminated, If the size of the lamination direction of 24 deviates from the design flaw, the micro-correction of the mold has to be performed again, and thus the size adjustment of the contact foot unit 24 becomes complicated.

Therefore, as shown in FIGS. 14 to 18, in the laminated state, the adjacent contact leg frames 36 are in contact with (or in contact with, the same below) the surface 36a and a portion of the surface 36a of the inner surface 36c in the lamination direction. The micro convex portion 36k capable of crushing and disintegrating when the contact contact frame 36 of the laminated layer is compressed in the lamination direction is formed; as shown in FIG. 19(a), the lamination when simply laminating the contact foot frame 36 is increased in advance. The size of the direction is intentionally made larger than the design direction of the lamination direction of the unit main body 28, and then the actual size of the lamination direction of the unit main body 28 can be obtained by compressing in the lamination direction as shown in Fig. 19(b). Adjust to design 値.

The crushing and disintegration of the minute convex portion 36k means plastic deformation in which the minute convex portion 36k is subjected to pressure and collapses, so that the plastic deformation of the contact protrusion frame 36 other than the minute convex portion 36k and its vicinity is hardly caused. Therefore, by crushing and disintegrating the minute convex portions 36k, when the minute convex portions 36k are not formed between the adjacent contact leg frames 36 in the laminated state, the other surfaces 36a can be brought into contact with each other. The inner surface 36c of the side is closer to the surface 36a, and the effect of reducing the size of the stacking direction of the unit main body 28 formed by the predetermined number of contact leg frames 36 can be achieved. In other words, in the crushing and disintegration of the minute convex portion 36k, between the adjacent contact leg frames 36 in the laminated state, the one surface 36a and the other inner surface 36c are not formed with the minute convex portions 36k. In other words, the same applies to the case where the laminated surface is not in contact with each other except for the one surface 36a and the other inner surface 36c and the small convex portion 36k.

As described above, the contact protrusion frame 36 that is adjacent to each other in the laminated state is formed in the surface 36a and the inner surface 36c that abut on the lamination direction, and may be formed in addition to the surface 36a. On the inner surface 36c or on both sides. In other words, the small convex portion 36k may be formed on a portion of the contact surface of the contact leg frame 36 that is adjacent to each other in the laminated state.

The shape, size, and the like of the minute convex portion 36k can be designed such that the size of the contact direction of the contact leg frame 36 with a predetermined number of layers is a design exceeding the lamination direction of the unit body 28, and the contact foot frame for the laminated layer 36 is shortened to at least design flaws when compressing in the lamination direction.

The minute convex portion 36k can be formed such that when the unit body 28 is compressed in the lamination direction, pressure can be efficiently transmitted to the minute convex portions 36k of the contact foot frames 36. For example, it may be arranged at approximately the same position in each of the contact foot frames 36.

Moreover, the minute projections 36k can be such that the distance between the contact foot frames 36 of the laminate (i.e., the distance between the surface 36a and the inner surface 36c) is more compressible than any portion of the contact foot frame 36. Achieve a more uniform way to shorten. For example, as described in the present embodiment, the small convex portion 36k may be formed in the contact leg frame 36, and the first contact portion 26a side and the second contact portion 26b side of the contact leg 26 disposed along the groove 36b. On both sides of the separation, a straight line is formed across the parallel direction of the grooves 36b formed in parallel.

Further, the size of the small convex portion 36k in the lamination direction when the contact leg frame 36 is laminated with a predetermined number is a design exceeding the lamination direction of the unit main body 28, and the contact leg frame 36 of the laminated layer is compressed in the lamination direction. When the design is reduced to at least, various positions, shapes, and sizes can be used. Thus, for example, the minute projections 36k is not defined, but may be a discontinuous point is formed on the contact surface, or across the first direction D ₁ continuously or intermittently constituting the one or more line or curve The method is formed on the abutting surface. For the same reason, the minute convex portion 36k may have various cross-sectional shapes such as a cross-sectional rectangular shape, a cross-sectional triangular shape, a cross-sectional semicircular shape, a cross-sectional trapezoidal shape, and a cross-sectional reverse trapezoidal shape.

The method of manufacturing the contact leg unit 24 by the contact leg frame 36 having such a small convex portion 36k will be described. First, in each of the grooves 36b of the contact leg frame 36, the spring portion 26c of the contact leg 26 is inserted into the insertion groove 36d, and the first contact portion 26a side is disposed from the spring portion 26c to the first bottomed groove 36e, and the spring portion 26c is provided. The second contact portion 26b side is disposed on the second bottomed groove 36g, and the contact leg 26 is disposed on the contact leg frame 36.

The contact body frame 36 of the contact leg 26 is arranged in a predetermined number, and is laminated in the plate thickness direction Dt to form the unit body 28. As described above, since the size of the laminated contact leg frame 36 in the lamination direction is set to exceed the design 藉 by forming the minute convex portion 36k in advance, the contact contact frame 36 of the laminated layer is compressed in the lamination direction until the The size has become a design.

For example, the stacking direction is about a right angle with respect to the reference plane, and the guide shaft 38 is inserted through the guide hole 32i, and the laminated contact leg frame 36 is placed on the reference plane. Further, in the case of being disposed on the reference plane, the distance between the reference plane and the reference plane in the stacking direction of the unit body 28 is set to be two of the contact contact frame 36 of the laminated layer. The reference plane on the side. Then, one or a plurality of pressing jigs having a flat pressing surface that can be placed between the jig modules are set on the laminated end faces of the laminated contact leg frames 36 while avoiding the guide shafts 38. Pressing parallel to the reference plane until it abuts the fixture modules on both sides. Thereby, the laminated contact frame 36 is compressed in the lamination direction.

The compressed unit main body 28 is inserted into the approximately square shape so that the first contact portion 26a and the second contact portion 26b of the contact leg 26 protrude from the openings 30a and 32a of the rectangular tubular body in the opening direction. The first frame body 30 and the second frame body 32 are square tubular bodies formed by uniformly overlapping the individual openings 30a and 32a. Then, the unit body 28 that has been inserted is held by the first frame body 30 and the second frame body 32 at positions that do not interfere with the first contact portion 26a and the second contact portion 26b of the contact leg 26. The unit main body 28 held by the first frame body 30 and the second frame body 32 is coupled to the floating plate 34 via the elastic member 24a attached to the first frame body 30, thereby being formed into a contact foot unit. twenty four.

Next, the operation of the IC socket 10 including the contact leg unit 24 will be described. First, as shown in the dotted line of FIG. 2, the socket cover 16 and the crank lever member 22 of the IC socket 10 are opened, and the IC package is guided by the guide member 34b. 100 is placed on the floating plate 34 of the contact foot unit 24.

Then, the socket cover 16 is rotated to be closed approximately parallel to the socket body 12, and as shown in Fig. 4, the front end portion 16b of the socket cover 16 is locked by the latch member 20. Further, the crank member 22 is rotated, as shown in FIG. 2, by being tilted to be approximately parallel to the socket body 12, and the latch member 20 is moved toward the socket body 12 by a cam mechanism omitted from the drawing. The heat sink member 14 presses the IC package 100, and in this pressed state, it is in a locked state that restricts the operation of the crank lever member 22.

Since the heat dissipating member 14 is rotated relative to the socket cover 16, the heat dissipating member 14 first contacts the IC package 100 and then becomes a locked state. Since the heat dissipating member 14 and the IC package 100 are almost in a surface contact state, the heat dissipating member 14 can be reduced. The variation in the pressure distribution applied to the IC package 100 by the heat dissipation member 14 and the heat generated by the IC package 100 can be efficiently transmitted to the heat dissipation member 14.

By pressing the IC package toward the unit body 28 by the heat radiating member 14, the floating plate 34 is urged toward the unit body 28 against the additional potential of the elastic member 24a. On the other hand, the first contact portion 26a of the contact leg 26 comes into contact with the hemispherical terminal 100b of the IC package 100 through the pin through hole 34a of the floating plate 34, and the compressive force reaches the first contact portion 26a and the second contact. Between the parts 26b. However, since the spring portion 26c of the contact leg 26 absorbs the compressive force due to the elastic deformation, the first contact portion 26a and the second contact portion 26b of the contact leg 26 are respectively at a predetermined pressure and the hemispherical terminal 100b and the circuit substrate. 200 contacts.

Further, the lower surface of the heat dissipation member 14 is in contact with the upper surface of the IC package 100, and is radiated from the heat dissipation fins 14a. Next, in this state, a voltage is applied to the IC package 100 to perform a performance test such as an aging test.

According to such a contact leg unit 24, the size of the laminated contact frame 36 in the lamination direction is set such that the design of the lamination direction of the unit main body 28 is achieved by forming the minute convex portion 36k in advance. Therefore, since the laminated contact frame 36 is compressed in the lamination direction, the design can be made in the lamination direction of the unit main body 28. Therefore, the mold for molding the contact leg frame 36 is slightly corrected for contact. In comparison with the case where the size of the leg frame 36 is adjusted in the thickness direction, the ease of dimensional adjustment of the stacking direction of the unit main body 28 can be further improved. Thus, the manufacturing time of the contact leg unit 24 and the IC socket 10 can be shortened, which is also advantageous for improving the manufacturing efficiency.

Further, in the above-described embodiment, the present invention is applied to the IC socket 10 for accommodating the IC package 100 as a socket for an electronic component. However, the present invention is not limited thereto, and the present invention can also be applied to other components. The device for electronic parts.

Further, in the above-described embodiment, the minute projections 36k are partially formed of the contact leg frame 36 integrally formed with the contact leg frame 36. However, in order to facilitate the crushing and disintegration of the micro projections 36k, The two-color molding is integrally formed by combining different materials (materials) from each other, whereby the material of the minute convex portion 36k is different from that of the contact foot frame 36.

Further, in the above-described embodiment, the minute projection 36k has been described as a part of the contact leg frame 36 integrally formed with the contact leg frame 36. However, instead of the contact lens frame 36, it may be 36. The minute projections of the other individual formed separately are integrally formed with the contact foot frame 36 by all known joining methods such as joining, fusing, welding, mechanical joining, and the like. In such a case, the minute projections of the other individual may be made different from the material of the contact foot frame 36 in order to make it easy to crush and disintegrate. Alternatively, the small convex portions of the other individual may be formed by, for example, forming an extremely thin sheet between the adjacent contact leg frames 36 in the laminated state, instead of being integrated with the contact foot frame 36. .

Further, in the above-described embodiment, when the laminated contact frame 36 is compressed, the minute projections 36k are plastically deformed to crush and disintegrate, and the size is adjusted to reach the unit body 28. Instead of designing the lamination direction, the design of the lamination direction of the unit body 28 can be achieved by elastically deforming the minute projections 36k and performing dimensional adjustment.

In the case where the small convex portion 36k is elastically deformed to be dimensioned so as to reach the design direction of the unit body 28, the laminated end face of the compressed contact leg frame 36 can be attached to the guide pin. A stopper piece is provided to constitute the unit body 28, so that after the laminated contact foot frame 36 is compressed, it is not returned to the original state. In contrast to the contact foot frame 36, a material rich in elasticity should be used, and the minute convex portion 36k can be formed by the two-color forming method as described above; or a material rich in elasticity more than the contact foot frame 36 can also be used. Small protrusions of other individuals.

From the description of the present disclosure, it will be apparent to those skilled in the art that the embodiments described above are merely selected to illustrate or illustrate the invention; in addition, as defined in the appended claims. Various modifications and changes are possible without departing from the scope of the invention.

In addition, the foregoing description of the embodiments of the present invention is provided by way of example only, and thus is not intended to limit the invention (including the invention as claimed in the appended claims and equivalent inventions).

10‧‧‧IC socket
12‧‧‧ socket body
12a‧‧‧One end
12b‧‧‧Other side ends
12c‧‧‧Depression
14‧‧‧Heat components
16‧‧‧ Socket cover
16a‧‧‧ base end
16b‧‧‧ front end
20‧‧‧Lock member
22‧‧‧Crank member
24‧‧‧ contact foot unit
26‧‧‧Contact feet
26a‧‧‧1st contact
26b‧‧‧2nd contact
28‧‧‧ Unit Ontology
36‧‧‧Contact foot frame
36a‧‧‧Surface
36b‧‧‧ditch
36c‧‧‧ inside
36k‧‧‧Small convex
100‧‧‧IC package
200‧‧‧ circuit substrate

1 is a plan view of an IC socket, the upper half of which shows the state in which the socket cover is open, and the lower half shows the state in which the socket cover is closed. Figure 2 is a front elevational view of the IC socket. Figure 3 is a side view of the IC socket. Figure 4 is a cross-sectional view taken along line A-A of Figure 1. Figure 5 is a cross-sectional view taken along line B-B of Figure 1. Figure 6 is a perspective view of the contact foot unit. Figure 7 is a plan view of the contact foot unit. Figure 8 is a cross-sectional view taken along line C-C of Figure 7. Figure 9 is a cross-sectional view taken along line D-D of Figure 7. Fig. 10 is a plan view showing a contact unit in which the first housing has been removed. Figure 11 is a perspective view showing a laminated state of the contact foot frame. Figure 12 is a plan view of the contact foot frame. Figure 13 is a cross-sectional view taken along line E-E of Figure 12 . Figure 14 is a cross-sectional view taken along line F-F of Figure 12 . Fig. 15 is an enlarged view showing the portion G of Fig. 13 enlarged. Fig. 16 is an enlarged view showing the portion H of Fig. 14 enlarged. Fig. 17 is an enlarged view showing the portion I of Fig. 14 enlarged. Fig. 18 is an explanatory view showing a laminated state of the unit body of the H portion of Fig. 14; Fig. 19 is an explanatory view for explaining a compression effect of a stacking direction of a unit body; (a) is a state before compression, and (b) is a state after compression. Fig. 20 is a view showing an example of an IC package; (a) is a front view and (b) is a bottom view.

26‧‧‧Contact feet

28‧‧‧ Unit Ontology

36‧‧‧Contact foot frame

36a‧‧‧Surface

36b‧‧‧ditch

36c‧‧‧ inside

36d‧‧‧through trench

36e‧‧‧ditch

36f‧‧‧ inserted through hole

36k‧‧‧Small convex

D ₂ ‧‧‧ Direction

Claims (10)

The contact foot unit is characterized in that: the contact foot unit is detachably accommodating the electronic component and electrically connecting the electronic component and the circuit substrate; and is composed of the following accessories; the contact leg has one end and the foregoing The electronic component contacts, the other end is in contact with the circuit substrate; and the contact leg frame is formed by forming a plurality of grooves parallel to the surface of the plate body, wherein the contact leg is disposed along the groove, the one end and the foregoing The other end is laminated in the plate thickness direction in a state of protruding toward the outer side of the plate body; and in the laminated state, at least one of the adjacent contact pin frames abutting the abutting surface in the lamination direction A part of the side surface is provided with a minute convex portion which is deformed when the contact foot frame of the laminated layer is compressed in the lamination direction. The contact leg unit according to claim 1, wherein the minute projections are crushed and disintegrated when the laminated contact frame is compressed in the lamination direction. The contact leg unit according to claim 1, wherein the minute projections are elastically deformable when the laminated contact frame is compressed in the lamination direction. The contact leg unit according to claim 1, wherein the minute projections are formed across a parallel direction of the grooves formed in parallel. The contact leg unit according to claim 1, wherein the minute projections are formed in the contact leg frame along both sides of the one end side of the contact leg and the other end side of the contact leg disposed in the groove. The contact leg unit according to claim 1, wherein the minute projections are formed in a straight line shape. The contact leg unit according to claim 6, wherein the minute convex portion has a rectangular cross section. The contact leg unit according to claim 1, wherein the minute convex portion is integrally formed by the same material as the contact foot frame. The contact leg unit according to claim 1, wherein the minute convex portion is formed of a material different from the contact foot frame, and is integrated with the contact foot frame by two-color molding. A socket for an electronic component, comprising: the socket body, wherein the contact foot unit according to any one of claims 1 to 9; the socket cover is rotatable; The ground shaft is supported on the socket body; the heat dissipating member is rotatably supported on the socket cover body, and the electronic component received in the contact foot unit is pressed in a state in which the socket cover body is closed; A latch member for holding the aforementioned socket cover in a closed state.