JP6251624B2 - Contact pin unit and socket for electrical parts using the same - Google Patents

Description

  The present invention relates to a contact pin unit that detachably accommodates an electrical component such as an IC package and electrically connects the electrical component to a circuit board by a contact pin, and a socket for an electrical component using the contact pin unit.

  2. Description of the Related Art Conventionally, in an IC socket that detachably accommodates an electrical component such as an IC package and is mounted on a circuit board, the IC package housing portion is configured, one end is in contact with the IC package, and the other end is in contact with the circuit board. In some cases, contact pins are arranged so that contact pin units for electrically connecting the IC package and the circuit board are arranged.

  As such a contact pin unit, a plurality of grooves that cross the plate body along the surface of the plate body are formed in parallel, a so-called washing plate-like contact pin frame, the contact pins are arranged along the groove, There was one in which one end and the other end of the contact pin unit were laminated in the thickness direction with the plate body protruding outward (see, for example, Patent Document 1).

JP 2012-89389 A

  However, even if the contact pin unit is compressed in the stacking direction when the dimension of the contact pin unit in the stacking direction of the contact pin frame exceeds the design value, a compression allowance in the stacking direction is provided between adjacent contact pin frames. Therefore, it is difficult to adjust the dimensions to the design value by compression.

  For this reason, the mold for molding the contact pin frame is finely corrected to adjust the dimensions. However, when the contact pin frame molded with the corrected mold is stacked, the dimension in the stacking direction of the contact pin unit is If it deviates from the design value, the mold must be finely corrected again, and the dimension adjustment of the contact pin unit may be complicated.

  SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a contact pin unit that addresses such problems and improves the ease of dimension adjustment in the stacking direction and an electrical component socket using the contact pin unit.

  In order to solve the above problems, a contact pin unit according to the present invention detachably accommodates an electrical component, and one end of the contact pin unit contacts the electrical component on the premise that the electrical component and the circuit board are electrically connected. A contact pin whose other end is in contact with the circuit board and a plurality of grooves are formed in parallel along the surface of the plate body, and the contact pin is disposed along the groove and one end and the other end are outside the plate body. A contact pin frame stacked in the thickness direction in a protruding state, and stacked on at least a part of at least one of the contact surfaces where adjacent contact pin frames contact in the stacked direction The contact pin frame formed is formed with minute convex portions that are crushed when compressed in the stacking direction.

  In such a contact pin unit, the minute protrusions may be formed over the parallel direction of the grooves formed in parallel. And such a micro convex part may be formed in the both sides which were spaced apart by the one end side and other end side of the contact pin arrange | positioned along a groove | channel among contact pin frames.

  Moreover, the micro convex part may be formed in linear form. And this micro convex part may have a rectangular-shaped cross section.

  An electrical component socket according to the present invention includes a socket body in which any one of the contact pin units as described above is disposed, a socket cover pivotally supported with respect to the socket body, and a socket cover. A heat dissipating member that presses an electrical component housed in the contact pin unit when the socket cover is closed, and a latch member that holds the socket cover in a closed state. It is composed of

  According to the contact pin unit and the electrical component socket of the present invention, the dimension adjustment of the contact pin unit in the stacking direction of the contact pin frame can be performed more easily.

It is a top view of IC socket, the upper half shows the state which opened the socket cover, and the lower half has shown the state which closed the socket cover. It is a front view of an IC socket. It is a side view of an IC socket. It is sectional drawing in the AA of FIG. It is sectional drawing in the BB line of FIG. It is a perspective view of a contact pin unit. It is a top view of a contact pin unit. It is sectional drawing in the CC line of FIG. It is sectional drawing in the DD line | wire of FIG. It is a top view of the contact pin unit which removed the 1st frame. It is a perspective view which shows the lamination | stacking state of a contact pin frame. It is a top view of a contact pin frame. It is sectional drawing in the EE line | wire of FIG. It is sectional drawing in the FF line of FIG. It is the enlarged view to which the G section of FIG. 13 was expanded. It is the enlarged view to which the H section of FIG. 14 was expanded. It is the enlarged view to which the I section of FIG. 14 was expanded. It is explanatory drawing which showed the lamination | stacking state of the unit main body in the H section of FIG. It is explanatory drawing explaining the compression effect in the lamination direction of a unit main body, (a) is the state before compression, (b) is the state after compression. An example of an IC package is shown, (a) is a front view and (b) is a bottom view.

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings.
1-5 shows an example of the socket for electrical components which concerns on this embodiment.

  The electrical component socket accommodates an IC (Integrated Circuit) package 100 as an electrical component, and is disposed on the circuit board 200 to electrically connect the IC package 100 and the circuit board 200, for example. An IC socket 10 for performing a performance test such as a burn-in test.

  The IC socket 10 is provided with a socket main body 12 in which the IC package 100 is accommodated, a socket cover 16 that is provided on the socket main body 12 so as to be openable and closable. And a lock mechanism 18 that holds the closed state (hereinafter referred to as “closed state”), and the heat dissipation member 14 is brought into contact with the IC package 100 accommodated in the socket body 12 to enable heat dissipation of the IC package 100. ing.

  In the following description, as shown in FIG. 20, the IC package 100 accommodated in the socket body 12 has hemispherical terminals 100b of m rows × n columns on the bottom surface 100a of the substantially square package body in plan view. Assume that a plurality of BGA (Ball Grid Array) type IC packages are arranged in a matrix (m and n are natural numbers excluding 0).

  The socket body 12 is configured in a substantially rectangular shape in plan view, and is provided with a first rotation axis X1 at one end 12a and a second in parallel with the first rotation axis X1 at the other end 12b. The rotation axis X2 is provided.

  The socket cover 16 is a substantially quadrangular frame body. One side of the frame body serves as a base end portion 16 a of the socket cover 16, and the base end portion 16 a can rotate about the first rotation axis X <b> 1 of the socket body 12. 2 so that the distal end portion 16b of the socket cover 16 that is opposite to the one side that is the base end portion 16a is engaged with a latch member that will be described later. It is configured.

  Further, the socket cover 16 has the above-described heat radiating member 14 that presses the IC package 100 in a closed state in a space surrounded by a frame, and the heat radiating member 14 is provided in parallel with the first rotation axis X1. When the socket cover 16 is closed, the upper surface of the IC package 100 is pressed with a uniform pressure when the socket cover 16 is closed. Thereby, the bias of the pressure distribution applied to the IC package 100 is reduced, and the heat generated from the IC package 100 is efficiently transmitted to the heat radiating member 14. The heat radiating member 14 mainly radiates the transferred heat from the heat radiating fins 14a to the air.

  The lock mechanism 18 is urged in a direction away from the socket body 12 at the other end 12b of the socket body 12, and is rotated by a latch member 20 that engages with the tip 16b of the socket cover 16. Accordingly, a substantially U-shaped lever member 22 that moves the latch member 20 in a direction approaching the socket body 12 via a cam mechanism (not shown) is included. The lock mechanism 18 is substantially parallel to the socket body 12 by rotating the lever member 22 from the dotted line in FIG. 2 in a state where the tip end portion 16 b of the socket cover 16 is locked to the latch member 20. The heat dissipation member 14 presses the IC package 100 through the socket cover 16 with the tip end portion 16 b locked to the latch member 20 by moving the latch member 20 so as to approach the socket body 12. In this pressed state, the lever member 22 is configured to be in a locked state that restricts the operation of the lever member 22.

  The socket body 12 is formed with a recess 12c that penetrates to the bottom at the center in plan view, and a contact pin unit 24 is disposed in the recess 12c. The contact pin unit 24 constitutes a housing part in which the IC package 100 is detachably housed in the socket body 12 and constitutes a connection part that electrically connects the IC package 100 and the circuit board 200.

6 to 13 show the contents of the contact pin unit 24.
The contact pin unit 24 includes a unit main body 28 having a plurality of contact pins 26 and a floating plate 34 attached to the unit main body 28 and accommodating the IC package 100 from the bottom surface 100a side.

  As shown in FIG. 8, the floating plate 34 is urged in a direction away from the unit main body 28 by an elastic member 24 a inserted between the unit main body 28 and the floating plate 34. In addition, one end (a first contact portion described later) of a plurality of contact pins 26 disposed in the unit main body 28 penetrates through the floating plate 34 from the unit main body 28 side toward the bottom surface 100a side of the IC package 100. A pin through hole 34a is formed. Further, the floating plate 34 guides each corner of the IC package 100 so that the hemispherical terminal 100b on the bottom surface 100a of the IC package 100 accommodated on the floating plate 34 is positioned on the pin through hole 34a. A member 34b is attached.

  The unit main body 28 has one end in contact with the hemispherical terminal 100b on the bottom surface 100a of the IC package 100 accommodated in the floating plate 34, and the other end in contact with the electrode portion of the circuit board 200. And a contact pin frame 36 on which the contact pins 26 are arranged.

  The contact pin 26 includes a first contact portion 26a that contacts the hemispherical terminal 100b of the IC package 100, a second contact portion 26b that contacts an electrode portion (not shown) of the circuit board 200, and both of these contacts. For example, a spring portion 26c curved in an S shape is provided between the portions. The spring portion 26c is a unit that resists the urging force of the floating plate 34 in a state where the first contact portion 26a is in contact with the hemispherical terminal 100b and the second contact portion 26b is in contact with the electrode portion of the circuit board 200. When pressed against the main body 28 side, it is elastically deformed by the compressive force applied between the first contact portion 26a and the second contact portion 26b, and the first contact portion 26a and the second contact portion 26b The distance is reduced.

  The contact pin frame 36 is a so-called washing plate-like plate (for example, a substantially rectangular flat plate) formed by parallelly forming a plurality of grooves 36b crossing the plate along the surface 36a of the plate. For example, when the contact pin frame 36 is a substantially rectangular flat plate, grooves 36b extending from one side to the opposite side are formed in parallel on the flat surface 36a. The contact pin frame 36 has the contact pin 26 disposed along the groove 36b, and the thickness of the contact pin frame 36 in a state where the first contact portion 26a and the second contact portion 26b of the contact pin 26 protrude outward. The unit main body 28 (for example, a substantially rectangular parallelepiped) is configured by stacking in the direction Dt.

  The shape and size of the groove 36b of the contact pin frame 36 affects the size of the contact pin frame 36 in the stacking direction because the contact pin 26 interferes with the contact pin frame 36 when the contact pin frame 36 is stacked. It is set not to. Further, the position in the parallel direction of the grooves 36b formed in parallel is set according to either the number of rows or the number of columns (for example, m rows) of the hemispherical terminals 100b arranged in a matrix.

  In the groove 36b of the contact pin frame 36, the central portion of the groove 36b excluding a part on the circuit board 200 side and a part on the IC package 100 side is a through groove 36d penetrating from the front surface 36a of the contact pin frame 36 to the back surface 36c. The spring portion 26c is inserted into the through groove 36d when the contact pin 26 is disposed along the groove 36b. Each through groove 36d of the contact pin frame 36 forms a unit through hole 28a that penetrates the unit main body 28 in the stacking direction continuously when the contact pin frame 36 is stacked to form the unit main body 28. The unit through-hole 28a accommodates the spring part 26c of the contact pin 26, and when a compressive force is applied between the first contact part 26a and the second contact part 26b of the contact pin 26, the unit through-hole 28a By deformation, interference with the contact pin frame 36 is avoided.

  In the first bottomed groove 36e which is a part of the IC package 100 side which is not the through groove 36d in the groove 36b of the contact pin frame 36, the opening of the first bottomed groove 36e is adjacent to the contact pin frame 36 in the stacked state. Thus, a first insertion hole 36f through which the first contact portion 26a side of the contact pin 26 is inserted from the spring portion 26c is formed. The first contact portion 26a side of the spring portion 26c of the contact pin 26 reciprocates in the direction from the IC package 100 to the circuit board 200 in the first insertion hole 36f due to the deformation of the spring portion 26c of the contact pin 26. Is possible.

  Further, in the second bottomed groove 36g, which is a part of the circuit board 200 side that is not the through groove 36d in the groove 36b of the contact pin frame 36, the opening of the second bottomed groove 36g is formed in the first bottomed groove 36e. The opening is closed by the back surface 36c of the same contact pin frame 36, thereby forming a second insertion hole 36h through which the second contact portion 26b side of the contact pin 26 is inserted from the spring portion 26c. . Of the contact pin 26, the second contact portion 26 b side of the spring portion 26 c is reciprocated in the direction from the IC package 100 to the circuit board 200 in the second insertion hole 36 h due to the deformation of the spring portion 26 c of the contact pin 26. It is possible to operate.

Lamination of the contact pin frame 36, specifically, at both ends 36i of the first direction D ₁ is a parallel direction of the groove 36b, the thickness direction Dt, i.e., the second is the stacking direction of the contact pin frame 36 by inserting the direction D ₂ guide holes 36j a guide shaft 34 which is formed in the matrix number of the other matrix to arrayed hemispherical terminal 100b (eg, n columns) a predetermined number corresponding to the stacked Done.

The unit main body 28 formed by laminating a predetermined number of contact pin frames 36 in this way has a substantially rectangular first frame body 30 and second frame body 32 overlapped with their respective openings 30a and 32a being aligned. Thus, the first contact portion 26a and the second contact portion 26b of the contact pin 26 are inserted into the square cylinder formed so as to protrude from the openings 30a and 32a of the square cylinder in the opening direction. The inserted unit main body 28 is located at a position where the first frame 30 and the second frame 32 do not interfere with the first contact portion 26a and the second contact portion 26b of the contact pin 26, for example, the contact pin frame 36. It is nipped fixed by the first end portions 36i in a direction D ₁ of the.

Here, the first contact portion 26a of the contact pin 26 arranged in the contact pin frame 36 is passed through the pin through hole 34a with respect to one (for example, the row direction) of the matrix of the hemispherical terminals 100b arranged in a matrix. to into contact with the hemispherical terminal 100b, the parallel direction of the grooves 36b in parallel form, i.e., it is possible to manage the forming accuracy on the position or the like in the first direction D _1.

However, for the other side of the matrix of hemispherical terminals 100b arranged in a matrix (for example, the column direction), the stacking direction of the unit main body 28, that is, the stacking direction of the unit bodies 28, that is, the actual dimension in a second direction D ₂ is larger than the design value, in contact with the hemispherical terminal 100b through a first contact portion 26a is the pin holes 34a of the contact pins 26 which are arranged in the contact pin frame 36 There is a risk of disappearing.

  On the other hand, even if the contact pin unit 24 is compressed in the stacking direction, there is no compression allowance in the stacking direction between the adjacent contact pin frames 36, so the dimensions are adjusted to the design value by compression. It is difficult.

  Further, even if the mold for molding the contact pin frame 36 is finely corrected, for example, in units of 0.0001 mm, and the dimensions are adjusted, when the contact pin frame 36 molded with the corrected mold is laminated, If the dimension in the stacking direction of the contact pin unit 24 deviates from the design value, the mold must be finely corrected again, and the dimension adjustment of the contact pin unit 24 may be complicated.

  For this reason, as shown in FIGS. 14 to 18, a part of the front surface 36 a out of the front surface 36 a and the back surface 36 c in which the contact pin frames 36 adjacent in the stacked state abut (or contact, the same applies hereinafter) in the stacking direction, When the laminated contact pin frame 36 is compressed in the laminating direction, a minute convex portion 36k is formed, and as shown in FIG. 19A, the dimension in the laminating direction when the contact pin frame 36 is simply laminated is formed. Is intentionally made larger than the design value in the stacking direction of the unit main bodies 28, and then compressed in the stacking direction, so that the actual dimensions of the unit main bodies 28 in the stacking direction are as shown in FIG. Can be adjusted to the design value.

  The crushing of the minute protrusions 36k means a plastic deformation in which the minute protrusions 36k are crushed by pressure, and hardly cause plastic deformation of the contact pin frame 36 other than the minute protrusions 36k and the vicinity thereof. Therefore, by crushing the minute projections 36k, when the minute projections 36k are not formed between the adjacent contact pin frames 36 in the stacked state, the other back surface 36c that comes into contact with one surface 36a is formed on the surface 36a. As a result, the unit body 28 in which a predetermined number of contact pin frames 36 are stacked is reduced in size in the stacking direction. In other words, the crushing of the minute protrusions 36k includes a case where the one surface 36a and the other back surface 36c do not form the minute protrusions 36k between the contact pin frames 36 adjacent in a stacked state. Similarly, it includes not only the case of contacting in the stacking direction but also the case where one surface 36a and the other back surface 36c do not contact in the stacking direction except for the minute projections 36k.

  As described above, the minute protrusions 36k are formed on the back surface 36c or both sides except when the contact pin frames 36 adjacent to each other in the stacked state are formed on the front surface 36a of the front surface 36a and the back surface 36c. May be. In other words, the minute convex portion 36k only needs to be formed on a part of one of the contact surfaces with which the contact pin frames 36 adjacent in the stacked state contact in the stacking direction.

  When the predetermined number of contact pin frames 36 are stacked, the minute protrusion 36k exceeds the design value in the stacking direction of the unit main body 28, and the stacked contact pin frames 36 are compressed in the stacking direction. The shape, dimensions, etc. are designed so as to be reduced to at least the design value.

  The minute projections 36k can be formed so that pressure is efficiently transmitted to the minute projections 36k of each contact pin frame 36 when the unit main body 28 is compressed in the stacking direction. For example, each contact pin frame 36 may be provided at substantially the same position.

  Further, the minute protrusions 36k are such that the distance between the stacked contact pin frames 36 (that is, the distance between the front surface 36a and the back surface 36c) is reduced relatively uniformly by compression in any part of the contact pin frame 36. Can be formed. For example, as in the present embodiment, the minute protrusions 36k are arranged on the first contact portion 26a side and the second contact portion 26b side of the contact pin 26 arranged along the groove 36b in the contact pin frame 36. It may be formed in a straight line over the parallel direction of the grooves 36b formed in parallel on both spaced sides.

The minute protrusions 36k are such that the dimension in the stacking direction when a predetermined number of contact pin frames 36 are stacked exceeds the design value in the stacking direction of the unit main body 28, and the stacked contact pin frames 36 are compressed in the stacking direction. If it is shortened to at least the design value at that time, all positions, shapes, and dimensions can be adopted. Thus, for example, fine convex portions 36k is either formed dot the abutment surface, and continuously or intermittently one or more straight-curve for a first direction D ₁ on the abutment surface How it is formed is not limited. For the same reason, the minute protrusions 36k can adopt various cross-sectional shapes such as a cross-sectional rectangular shape, a cross-sectional triangular shape, a cross-sectional semicircular shape, a cross-sectional trapezoidal shape, and a cross-sectional inverted trapezoidal shape.

A method of manufacturing the contact pin unit 24 by using the contact pin frame 36 having such a minute protrusion 36k will be described.
First, in each groove 36b of the contact pin frame 36, the spring portion 26c of the contact pin 26 is inserted into the through groove 36d, and the first contact portion 26a side from the spring portion 26c is disposed in the first bottomed groove 36e, and the spring The second contact portion 26b side from the portion 26c is arranged in the second bottomed groove 36g, and the contact pins 26 are arranged in the contact pin frame 36.

A unit body 28 is formed by laminating a predetermined number of contact pin frames 36 in which contact pins 26 are arranged in the thickness direction Dt.
As described above, the dimension of the stacked contact pin frame 36 in the stacking direction is set to exceed the design value by forming the minute protrusions 36k in advance, so that the dimension becomes the design value. The stacked contact pin frames 36 are compressed in the stacking direction.

  For example, the contact pin frame 36 that is stacked by inserting the guide shaft 34 through the guide hole 32i is disposed on the reference plane so that the stacking direction is substantially perpendicular to the reference plane. Further, when arranged on the reference plane, the jig blocks whose distance in the direction substantially perpendicular to the reference plane is a design value in the stacking direction of the unit bodies 28 are arranged on the reference planes on both sides of the stacked contact pin frames 36. To place. Then, one or a plurality of pressing jigs having dimensions that can be installed between the jig blocks and having a flat pressing surface are set on the stacked end surfaces of the stacked contact pin frames 36 while avoiding the guide shaft 34. Then, press in parallel to the reference plane until it comes into contact with the jig blocks on both sides. As a result, the stacked contact pin frames 36 are compressed in the stacking direction.

The compressed unit main body 28 is transferred to the rectangular tube formed by overlapping the substantially rectangular first frame body 30 and second frame body 32 with the openings 30a and 32a aligned with each other. The first contact portion 26a and the second contact portion 26b are inserted so as to protrude from the openings 30a and 32a of the rectangular tube body in the opening direction, respectively. Then, the inserted unit main body 28 is sandwiched and fixed by the first frame body 30 and the second frame body 32 at a position where it does not interfere with the first contact portion 26a and the second contact portion 26b of the contact pin 26.
The unit main body 28 sandwiched and fixed by the first frame body 30 and the second frame body 32 is connected to the floating plate 34 via the spring portion 26c attached to the first frame body 30, and the contact pin unit 24 is connected. Make it.

Next, the operation of the IC socket 10 provided with such a contact pin unit 24 will be described.
First, as shown by the upper half of FIG. 1 and the dotted line in FIG. 2, the IC package 100 is guided by the guide member 34b while the socket cover 16 and the lever member 22 of the IC socket 10 are opened, and the contact pins are contacted. It is housed on the floating plate 34 of the unit 24.

  Then, the socket cover 16 is rotated and closed so as to be substantially parallel to the socket body 12, and the latch member 20 is locked to the front end portion 16 b of the socket cover 16 as shown in FIG. 4. Further, by rotating the lever member 22 and tilting the lever member 22 so as to be substantially parallel to the socket body 12 as shown in FIG. 2, the latch member 20 is moved closer to the socket body 12 by a cam mechanism (not shown). The IC package 100 is pressed by the heat radiating member 14 and the lever member 22 is locked in this pressed state.

  Since the heat radiating member 14 rotates with respect to the socket cover 16, the heat radiating member 14 and the IC package 100 are almost in surface contact until the heat radiating member 14 first comes into contact with the IC package 100 and becomes locked. In addition, it is possible to reduce the uneven pressure distribution applied to the IC package 100 from the heat radiating member 14, and to efficiently transfer heat generated from the IC package 100 to the heat radiating member 14.

  When the heat radiating member 14 presses the IC package toward the unit main body 28, the floating plate 34 is pressed in a direction approaching the unit main body 28 against the urging force of the spring portion 26 c material. In contrast, the first contact portion 26a of the contact pin 26 contacts the hemispherical terminal 100b of the IC package 100 through the pin through hole 34a of the floating plate 34, and the first contact portion 26a and the second contact portion 26b Compressive force is exerted during However, since the spring portion 26c of the contact pin 26 is elastically deformed to absorb the compressive force, the first contact portion 26a and the second contact portion 26b of the contact pin 26 are the hemispherical terminal 100b and the circuit board, respectively. 200 is contacted at a predetermined pressure.

  Further, the lower surface of the heat radiating member 14 comes into contact with the upper surface of the IC package 100 to radiate heat from the heat radiating fins 14a. In this state, a voltage is applied to the IC package 100 to perform a performance test such as a burn-in test.

According to such a contact pin unit 24, the dimension of the stacked contact pin frame 36 in the stacking direction is larger than the design value in the stacking direction of the unit main body 28 by forming the minute protrusions 36k in advance. Is set.
Accordingly, it is possible to obtain the design value in the stacking direction of the unit main body 28 by simply compressing the stacked contact pin frame 36 in the stacking direction. Therefore, as in the past, a mold for molding the contact pin frame 36 As compared with the case where the dimension adjustment in the plate thickness direction of the contact pin frame 36 is performed by slightly correcting the above, the ease of the dimension adjustment in the stacking direction of the unit main bodies 28 can be improved. This shortens the manufacturing time of the contact pin unit 24 and the IC socket 10 and contributes to the improvement of manufacturing efficiency.

  In the above-described embodiment, the present invention is applied to the IC socket 10 that accommodates the IC package 100 as the electrical component socket. However, the present invention is not limited to this, and the present invention can also be applied to an apparatus that accommodates other electrical components.

  In the above-described embodiment, the minute convex portion 36k has been described as a part of the contact pin frame 36 integrally formed with the contact pin frame 36. However, in order to make the minute convex portion 36k easy to be crushed, a different material ( The material of the minute projections 36k may be different from that of the contact pin frame 36 by two-color molding in which materials are combined and molded integrally.

  In the above-described embodiment, the minute protrusion 36k has been described as a part of the contact pin frame 36 that is integrally formed with the contact pin frame 36. However, instead of this, the minute protrusion 36k is formed separately from the contact pin frame 36. The separate minute convex portion may be integrated with the contact pin frame 36 by any known joining method such as adhesion, welding, welding, or mechanical joining. In this case, the separate minute convex portion may be made of a material different from that of the contact pin frame 36 in order to facilitate crushing. Alternatively, the separate minute convex portion may be configured without being integrated with the contact pin frame 36, for example, by sandwiching an extremely thin sheet between the contact pin frames 36 adjacent in the stacked state.

  Furthermore, in the above-described embodiment, when the stacked contact pin frame 36 is compressed, the dimensional adjustment is performed so that the design value in the stacking direction of the unit main body 28 is obtained by crushing the micro-projections 36k to cause plastic deformation. However, instead of this, the dimensional adjustment may be performed so that the minute convex portion 36k is elastically deformed to be a design value in the stacking direction of the unit main bodies 28.

  When adjusting the dimensions so that the micro-projections 36k are elastically deformed so as to be the design value in the stacking direction of the unit main body 28, the stacked contact pin frames 36 are not restored to the original state after being compressed. A unit body 28 is configured by attaching a stopper to the guide pin at the laminated end face of the compressed contact pin frame 36. In order to make the material rich in elasticity compared to the contact pin frame 36, the minute projections 36k are formed by two-color molding as described above, or a material rich in elasticity compared to the contact pin frame 36 is used. It is good also as a separate minute convex part.

DESCRIPTION OF SYMBOLS 10 IC socket 12 Socket main body 12a One side edge part 12b Other side edge part 12c Recessed part 14 Heat radiation member 16 Socket cover 16a Base end part 16b Tip part 20 Latch member 22 Lever member 24 Contact pin unit 26 Contact pin 26a First contact Part 26b Second contact part 28 Unit body 36 Contact pin frame 36a Front surface 36b Groove 36c Back surface 36k Micro convex part 100 IC package 200 Circuit board

Claims (6)

A contact pin unit that detachably accommodates an electrical component and electrically connects the electrical component and the circuit board,
A contact pin having one end in contact with the electrical component and the other end in contact with the circuit board;
A plurality of grooves are formed in parallel along the surface of the plate body, and the contact pin is disposed along the groove so that the one end and the other end protrude outward from the plate body. Contact pin frames stacked in a direction;
Comprising
Formed on one part of at least one of the contact surfaces with which the contact pin frames adjacent to each other in the stacked state contact in the stacking direction are tiny projections that are crushed when the stacked contact pin frames are compressed in the stacking direction. Contact pin unit characterized by this.   The contact pin unit according to claim 1, wherein the minute protrusions are formed in a parallel direction of the grooves formed in parallel.   2. The minute projections are formed on both sides of the contact pin frame, which are disposed along the groove, on the one end side and the other end side, which are spaced apart from each other. Or the contact pin unit of Claim 2.   The contact pin unit according to claim 1, wherein the minute convex portion is formed in a linear shape.   The contact pin unit according to claim 4, wherein the minute convex portion has a rectangular cross section. A socket body in which the contact pin unit according to any one of claims 1 to 5 is disposed;
A socket cover pivotally supported with respect to the socket body;
In a state where the socket cover is pivotally supported with respect to the socket cover and the socket cover is closed, a heat radiating member that presses the electrical component housed in the contact pin unit;
A latch member for holding the socket cover closed;
A socket for electric parts composed of.