CN202335186U - Electronic device and cleanable heat dissipation structure thereof - Google Patents

Abstract

An electronic device and a cleanable heat dissipation structure thereof. The cleanable heat dissipation structure is applied to a heat dissipation module of a portable electronic device, the heat dissipation module includes a fan and a heat pipe, and the cleanable heat dissipation structure includes: a main body, a fin module and an operating member; the main body includes a through portion, the through portion is used to accommodate the heat pipe; the fin module is combined with the outer surface of the main body, and the fin module is arranged corresponding to the air outlet position of the fan; the operating member is connected to the main body; by operating the operating member, the main body drives the fin module to rotate relative to the heat pipe to adjust the position of the fin module. The utility model can clean dead corners that are usually invisible, eliminating the tedious process of disassembling the casing of general electronic devices for cleaning, greatly reducing the time required for cleaning and improving the convenience of cleaning.

Description

Electronic device and its cleanable heat dissipation structure

technical field

The utility model relates to an electronic device and a cleanable heat dissipation structure thereof, in particular to a cleanable heat dissipation structure applied to the electronic device and easy to clean.

Background technique

Most electronic devices today still use a heat dissipation module composed of a fan and heat dissipation fins to achieve the heat dissipation function inside the device. Because the air is full of dust and other impurities, for fans that need to use air to generate heat convection, it is easy to accumulate dust on the fan or fins. Too much dust will reduce the heat dissipation efficiency and increase the fan rotation noise. What's more, it will cause the fan to stop rotating and cause the device to overheat and so on.

In order to prevent the above situation from happening, the user must regularly clean the inside of the device to avoid serious accumulation of dust. At this time, the device casing needs to be disassembled for easy cleaning. However, portable electronic devices (such as notebook computers, tablet computers, etc.) are currently developing toward thinner and thinner devices, and their internal component configurations are relatively complex and sophisticated, and issues such as overall electromagnetic shielding will be considered. Once the user disassembles the casing by himself, it may affect the stability of the device due to the difficulty in assembly, and even cause problems such as malfunction, which is extremely troublesome for the user.

Therefore, how to design an electronic device that can be easily cleaned by the user and its cleanable heat dissipation structure to prevent the accumulation of impurities such as dust is a topic worthy of research.

Utility model content

The main purpose of the utility model is to provide a cleanable heat dissipation structure applied to electronic devices and easy to clean.

Another object of the present invention is to provide an electronic device using the aforementioned cleanable heat dissipation structure.

In order to achieve the above purpose, the cleanable heat dissipation structure of the present invention is applied to a heat dissipation module of an electronic device, and the heat dissipation module includes a fan and a heat pipe. The cleanable heat dissipation structure includes a main body, a fin module, and an operating part; the main body includes a through part for accommodating a heat pipe; the fin module is combined with the outer surface of the main body, and the fin module is arranged corresponding to the air outlet of the fan; The operating part is connected to the main body. By operating the operating part, the main body drives the fin module to rotate relative to the heat pipe, so as to adjust the position of the fin module.

The cleanable heat dissipation structure of the present invention is applied to a heat dissipation module of a portable electronic device. The heat dissipation module includes a fan and a heat pipe. The cleanable heat dissipation structure includes: a main body, the main body includes a through part, the The through part is used to accommodate the heat pipe; a fin module, the fin module is combined with the outer surface of the main body, and the fin module is arranged corresponding to the position of the air outlet of the fan; and an operating part, the operating part is connected to The main body; by operating the operating part, the main body drives the fin module to rotate relative to the heat pipe to adjust the position of the fin module.

The electronic device of the utility model includes a casing, at least one heating component and a heat dissipation module, and the at least one heating component and the heat dissipation module are arranged in the casing. The heat dissipation module includes at least one heat pipe, a fan, and the aforementioned cleanable heat dissipation structure. At least one heat pipe contacts at least one heating component for heat conduction, and transfers the heat to the main body and the fin module of the cleanable heat dissipation structure; The fan is arranged corresponding to the fin module of the cleanable heat dissipation structure. With this design, the user can operate the operating member to adjust the position of the fin module, so as to clean the side of the fin module facing the fan.

The electronic device of the present invention comprises: a casing; at least one heating component, the at least one heating component is arranged in the casing; and a heat dissipation module, the heat dissipation module is arranged in the casing, and the heat dissipation module includes: at least one heating element Conduit, the at least one heat pipe contacts the at least one heating component to conduct heat; a cleanable heat dissipation structure, the cleanable heat dissipation structure includes: a main body, the main body includes a through part, and the through part is used to accommodate the at least one heat pipe; a fin module, the fin module is combined with the outer surface of the main body; and an operation part, the operation part is connected to the main body; and a fan, the fan is arranged corresponding to the fin module; The operating part makes the main body drive the fin module to rotate relative to the at least one heat pipe, so as to adjust the position of the fin module.

The utility model can clean the blind corners that cannot be seen normally, avoid the cumbersome process of dismantling the casing of the general electronic device for cleaning, greatly reduce the time required for cleaning and improve the convenience of cleaning.

Because the utility model is novel in structure, can provide industrial utilization, and really has the promotion effect, so apply for the utility model patent according to law.

Description of drawings

FIG. 1 is a system block diagram of an embodiment in which the cleanable heat dissipation structure of the present invention is applied to an electronic device.

Fig. 2 is an exploded view of the cleanable heat dissipation structure of the present invention.

FIG. 3 is a schematic diagram of the operation of the cleanable heat dissipation structure of the present invention.

FIG. 4 is a partial schematic diagram of an embodiment of the electronic device of the present invention.

Description of main component symbols:

Cleanable heat dissipation structure 1 flip cover 111

Main body 10 Air outlet 112

Through part 11 Opening hole 113

Fin module 20 Heating components 120

Operating parts 30 Heat dissipation module 130

Anti-slip part 31 Heat pipe 131

Electronics 100 Fan 132

Shell 110

Detailed ways

In order to make the above and other objects, features and advantages of the present invention more comprehensible, specific embodiments of the present invention are specifically listed below, together with the accompanying drawings, for detailed description as follows.

The cleanable heat dissipation structure of the present utility model is applied to electronic devices. In the following embodiments of the present utility model, the electronic device is described by taking a notebook computer as an example, but the electronic device can also be a desktop computer or a small notebook computer. , tablet computer or other similar electronic devices or portable electronic devices, the utility model is not limited thereto.

Please refer to FIG. 1 first. FIG. 1 is a system block diagram of an embodiment in which the cleanable heat dissipation structure 1 of the present invention is applied to an electronic device 100 . As shown in FIG. 1 , the electronic device 100 includes a casing 110 , at least one heating component 120 and a heat dissipation module 130 . At least one heating component 120 and the heat dissipation module 130 are disposed in the casing 110 . The heat dissipation module 130 includes at least one heat pipe 131 , a fan 132 and a cleanable heat dissipation structure 1 , and the fan 132 is disposed corresponding to the position of the cleanable heat dissipation structure 1 . The electronic device 100 utilizes each heat pipe 131 to correspond to each heat generating component 120, so that the heat generated by each heat generating component 120 is exported by each heat pipe 131 and transferred to the cleanable heat dissipation structure 1, and then the fan 132 is used for cleaning The heat dissipation structure 1 blows air for cooling, and sends the hot air out of the casing 110 . Here, the heat-generating component 120 may be a component that easily generates high temperature, such as CPU, GPU or other processing chips, but the present invention is not limited thereto.

Please refer to FIG. 2 , which is an exploded view of the cleanable heat dissipation structure 1 of the present invention. As shown in FIG. 2 , in an embodiment of the present invention, the cleanable heat dissipation structure 1 of the present invention includes a main body 10 , a fin module 20 and an operating member 30 . The main body 10 includes a through portion 11 for accommodating the aforementioned heat pipe 131 , and the heat pipe 131 transfers heat to the main body 10 through the contact between the heat pipe 131 and the inner surface of the through portion 11 . The diameter length of the through portion 11 is not less than the diameter length of the heat pipe 131 so as to maintain the contact state between them. In one embodiment of the present invention, the total length of the main body is about 7 cm, and the diameter of the through portion 11 is about 6 mm to 8 mm. However, depending on the design, the corresponding size of the main body 10 will also change accordingly.

In addition, in order to increase the heat conduction effect and fill the gap between the heat pipe 131 and the through portion 11, a heat dissipation material may be included between the two, such as commonly used heat dissipation paste, etc., and the heat dissipation material is disposed on the through portion 11 by coating. The inner surface or the outer surface of the heat pipe 131, but the present invention is not limited thereto.

The fin module 20 is combined on the outer surface of the main body 10 , and the fin module 20 is composed of a plurality of fins, and a gap is maintained between adjacent fins for arrangement. The fin module 20 is disposed corresponding to the air outlet of the fan 132 , so that the heat transferred from the main body 10 to the fin module 20 can be taken away by the cold air blown out by the fan 132 . In one embodiment of the present utility model, each fin of the fin module 20 adopts a circular fin design, so that it is not easy to touch and interfere with the housing 110 or other components during the adjustment process, but this The utility model is not limited thereto, and the fins of the fin module 20 can also adopt other forms such as rectangles, arbitrary curved surfaces or other forms that can provide a larger heat dissipation area.

In addition, the above-mentioned main body 10 and fin module 20 are made of metal materials with good thermal conductivity and low thermal resistance, such as copper, aluminum, etc., to improve the heat dissipation effect, but the main body 10 and fin module 20 can also use other materials. Replaced by materials with similar cooling effects.

The operating part 30 is connected to the main body 10 , so that the main body 10 and the fin module 20 can produce a linkage effect along with the operating part 30 . In one embodiment of the present invention, the operating member 30 is a rotating member, such as a turntable, which is convenient for the user to rotate for corresponding adjustment. limit. The operating member 30 can be connected to the main body 10 by means of tight fit or adhesive. In addition, the outer side of the operating member 30 also includes a plurality of non-slip parts 31, so that the user can operate manually. The operating recess and other similar structures can also be sleeved on the operating member 30 by using components such as rubber rings, which are not limited to this embodiment.

Please refer to FIG. 3 . FIG. 3 is a schematic diagram of the operation of the cleanable heat dissipation structure 1 of the present invention. As shown in FIG. 3 , the user can manually rotate the operating member 30 , through which the main body 10 can drive the fin module 20 to rotate relative to the heat pipe 131 to adjust the position of the fin module 20 . Since the part of the fin module 20 facing the air outlet is most likely to accumulate dust and other impurities, the part of the fin module 20 originally facing the air outlet of the fan 132 can be turned outward and exposed after adjustment. At this time, the user can use pointed objects, such as clips, pens, bamboo sticks, etc., to penetrate into the gaps between the fins for cleaning, and can clean different parts of the fin module 20, thereby achieving the purpose of the present invention. Cleaning effect.

Please refer to FIG. 2 , FIG. 3 and FIG. 4 together below. FIG. 4 is a partial schematic diagram of an embodiment of the electronic device 100 of the present invention. As shown in FIGS. 2 and 4 , the electronic device 100 of the present invention includes a casing 110 and a heat dissipation module, and the heat dissipation module is disposed in the casing 110 . The heat dissipation module includes at least one heat pipe 131, a fan 132, and the cleanable heat dissipation structure 1 as described above. At least one heat pipe 131 conducts heat to the main body 10 and the fin module 20 of the cleanable heat dissipation structure 1, and through The fan 132 blows air to conduct heat out of the casing 110 . For the related structure and operation state of the cleanable heat dissipation structure 1 , please refer to the foregoing description, and details are not repeated here.

In an embodiment of the present invention, the housing 110 includes a flip cover 111, which is disposed corresponding to the fin module 20, and the flip cover 111 is pivotally connected to the housing 110 so as to be in an open state and a closed state relative to the housing 110. . As shown in FIG. 3 , when the flip cover 111 is in an open state, the fin module 20 will be exposed to facilitate cleaning by the user; and as shown in FIG. 4 , when the flip cover 111 is in a closed state, the fins will be hidden. Module 20. The flip cover 111 includes a plurality of air outlet holes 112 for discharging hot air from the plurality of air outlet holes 112 when the flip cover 111 is in a closed state.

In addition, the housing 110 further includes an opening 113 disposed corresponding to the operating member 30 , and the operating member 30 can pass through the opening 113 to be exposed on the surface of the housing 110 for easy operation by the user.

With the aforementioned design, the electronic device 100 of the present utility model can provide the function of conveniently cleaning the heat dissipation structure, and the position of the fin module can be adjusted by operating the operating part to clean the dead corners that cannot be seen normally, eliminating the need for general electronic devices to The cumbersome process of disassembling the case for cleaning greatly reduces the time required for cleaning and improves the convenience of cleaning.

In summary, no matter the purpose, means and effect of the present utility model, it shows its characteristics different from those of the known technology everywhere, but it should be noted that the above-mentioned embodiments are only examples for ease of description. The scope of the rights to be protected should naturally be based on the scope of the claims, rather than being limited to the above-mentioned embodiments.

Claims (17)

1. A cleanable heat dissipation structure, the cleanable heat dissipation structure is applied to a heat dissipation module of a portable electronic device, the heat dissipation module includes a fan and a heat pipe, it is characterized in that the cleanable heat dissipation structure includes: a main body, the main body includes a through portion for accommodating the heat pipe; a fin module, the fin module is combined with the outer surface of the main body, and the fin module is arranged corresponding to the position of the air outlet of the fan; and an operating part connected to the main body; By operating the operating member, the main body drives the fin module to rotate relative to the heat pipe to adjust the position of the fin module. 2. The cleanable heat dissipation structure according to claim 1, wherein the fin module is composed of a plurality of circular fins. 3 . The cleanable heat dissipation structure according to claim 1 , further comprising a heat dissipation material between the through portion and the heat pipe to improve the heat conduction effect between the main body and the heat pipe. 4. The cleanable heat dissipation structure according to claim 1, wherein the operating member is a rotating member. 5. The cleanable heat dissipation structure according to claim 4, characterized in that, the outer side of the operating member further comprises a plurality of anti-slip parts. 6 . The cleanable heat dissipation structure according to claim 4 , wherein the operating member is connected to the main body in a tight fit or adhesive manner. 7 . 7 . The cleanable heat dissipation structure according to claim 1 , wherein the main body and the fin module are metal material main body and metal material fin module. 8. An electronic device comprising: a shell; at least one heating element, the at least one heating element is disposed in the housing; and A heat dissipation module, the heat dissipation module is arranged in the housing, and the heat dissipation module includes: At least one heat pipe, the at least one heat pipe contacts the at least one heat generating component to conduct heat; A cleanable heat dissipation structure, characterized in that the cleanable heat dissipation structure comprises: a main body, the main body includes a through portion for accommodating the at least one heat pipe; a fin module coupled to the outer surface of the body; and an operating member connected to the main body; and a fan, the fan is set corresponding to the fin module; By operating the operating member, the main body drives the fin module to rotate relative to the at least one heat pipe, so as to adjust the position of the fin module. 9 . The electronic device according to claim 8 , wherein the casing comprises a flip cover, the flip cover is disposed corresponding to the fin module, and the fin module is exposed by opening the flip cover. 10. The electronic device as claimed in claim 9, wherein the flip cover comprises a plurality of air outlet holes. 11. The electronic device according to claim 8, wherein the fin module is composed of a plurality of circular fins. 12 . The electronic device according to claim 8 , further comprising a heat dissipation material between the through portion and the at least one heat pipe, so as to improve the heat conduction effect between the main body and the at least one heat pipe. 13 . 13. The electronic device according to claim 8, wherein the operating element is a rotating element. 14. The electronic device according to claim 13, wherein the outer side of the operating member further comprises a plurality of anti-slip parts. 15. The electronic device as claimed in claim 13, wherein the operating member is connected to the main body in a tight fit or adhesive manner. 16. The electronic device according to claim 13, wherein the housing further comprises an opening, the opening is disposed corresponding to the operating member, and the operating member can pass through the opening to be exposed on the housing. surface for easy operation by the user. 17. The electronic device according to claim 8, wherein the main body and the fin module are a metal material main body and a metal material fin module.

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