TW201306043A - Memory module and power supply system having same - Google Patents

Abstract

The disclosure provides a memory module having a rated voltage and a rated power. The memory module is configured for being inserted into a memory slot. The memory slot includes a first ground pin and a first power pin. A power supply for providing a first direct current (DC) voltage is connected to the first ground pin and the first power pin. The memory module includes a second ground pin, a second power pin, and a voltage regulator down (VRD). The second ground pin and the second power pin are respectively electrically connected to the first ground pin and the first power pin. The output power of the VRD is corresponding to the rated power. The VRD is configured for converting the first DC voltage to the rated voltage provided to the memory module. The disclosure also provides a power supply system for the memory module.

Description

Memory and memory power supply system having the same

The invention relates to a memory and a memory power supply system having the same.

The computer motherboard usually includes a voltage regulator down (VRD) for converting the voltage. The external power supply is supplied to the memory through the buck regulator. When the computer motherboard is designed, the output power of the buck regulator is generally designed to be equal to or slightly larger than the sum of the working powers when the number of memories is the largest, to meet the power supply requirements. At present, the number of memories on the computer motherboard is increasing, so the output power of the buck regulator is also getting higher and higher. However, in general, if the load of the buck regulator is smaller (the number of loaded memory is less than or even much smaller than the maximum number set at the time of design), the lower the power conversion efficiency, the larger the load (such as the loaded memory). The number is close to or equal to the maximum number set at design time), and the power conversion efficiency is higher. Thus, when a smaller number of memories are mounted on the computer motherboard, the conversion efficiency of the buck regulator becomes poorer, that is, more energy is wasted.

In view of this, it is necessary to provide a memory and memory power supply system that improves the energy efficiency of the memory power source.

A memory having a rated voltage and a rated power, the memory being for mounting to a memory slot, the memory slot including a first ground pin and a first power pin, the first The ground pin and the first power pin are for electrically connecting to a power supply, and the power supply is for providing a first DC voltage. The memory includes a second ground pin, a second power pin, and a buck regulator. The second ground pin is for electrically connecting to the first ground pin, the second power pin is for electrically connecting to the first power pin, and an output power of the buck regulator corresponds to the rated The buck regulator is electrically coupled to the second power pin for converting the first DC voltage to a second DC voltage, the second DC voltage being equal to the rated voltage.

A memory power supply system includes a power supply, a plurality of memory slots, and at least one memory. The power supply is electrically connected to the plurality of memory slots and configured to respectively supply power to the plurality of memory slots to provide a first DC voltage. Each memory has a rated voltage and a rated power, the memory is for mounting to a memory slot, the memory slot includes a first ground pin and a first power pin, the first The ground pin and the first power pin are for electrically connecting to a power supply, and the power supply is for providing a first DC voltage. The memory includes a second ground pin, a second power pin, and a buck regulator. The second ground pin is for electrically connecting to the first ground pin, the second power pin is for electrically connecting to the first power pin, and an output power of the buck regulator corresponds to the rated The buck regulator is electrically coupled to the second power pin for converting the first DC voltage to a second DC voltage, the second DC voltage being equal to the rated voltage.

Relative to the prior art, since for each buck regulator its load corresponds to only one memory. That is, when each memory is loaded into a corresponding one of the memory slots, each buck regulator operates under full load conditions, thereby increasing the power conversion efficiency of each buck regulator.

Referring to FIG. 1 and FIG. 2, a memory power supply system 100 according to an embodiment of the present invention includes a power supply 10 and a plurality of memory slots 20 (slot 1, slot 2, slot 3 ... slot N), a baseboard management controller 30 (BMC), a memory 40 corresponding to the plurality of memory slots 20, and a pull-up resistor corresponding to the plurality of memory slots 20 50.

The power supply 10 is configured to provide a first DC voltage to each of the memory slots 20. In this embodiment, the first DC voltage is a DC voltage of 12 volts.

Each of the memory slots 20 is adapted to be loaded with a memory 40. Each of the memory slots 20 includes a first ground pin 201 and a first power pin 202. Each of the first ground pins 201 is connected to the power supply 10 via a corresponding one of the pull-up resistors 50. Each of the first ground pins 201 is also electrically connected to an input of the substrate management controller 30. Each of the first ground pins 201 is for outputting an installation signal. When a corresponding memory slot 20 is not loaded into a corresponding memory 40, the mounting signal is at a high level, and the substrate management controller 30 receives the high level. When a memory 40 is mounted corresponding to one memory slot 20, the mounting signal is low, and the substrate management controller 30 receives the low level. Each of the first power pins 202 is electrically connected to the power supply source 10.

An input end of the substrate management controller 30 is connected to each of the first ground pins 201, and an output end of the substrate management controller 30 is electrically connected to each of the first power pins 202. The substrate management controller 30 is configured to determine, according to the installation signal, whether a memory 40 is loaded in the corresponding memory slot 20, and is used to obtain the power of the memory 40 loaded in the corresponding memory slot 20. News. It can be understood that in other embodiments, the substrate management controller 30 can also be replaced with a south bridge chip integrated with the substrate management controller 30.

Each memory 40 has a rated voltage and a rated power. In this embodiment, the rated voltage is 1.5 volts, and the rated power is 10 watts. Each memory 40 includes a second ground pin 401, a second power pin 402, a buck regulator 403, and a memory module 404. Each of the second ground pins 401 corresponds to a first ground pin 201. Each second power pin 402 corresponds to a first power pin 202. Each buck regulator 403 is electrically coupled to each of the second power pin 402. Each of the buck regulators 403 is configured to convert the first DC voltage provided by the power supply 10 into a second DC voltage and output the second DC voltage. In this embodiment, the second DC voltage is equal to the rated voltage, that is, the second DC voltage is 1.5 volts. Each memory module 404 is electrically coupled to each of the buck regulators 403 and receives the second DC voltage. Each of the storage modules 404 is configured to store data. In this embodiment, the plurality of memories 40 are dual in-line memory modules (DIMMs).

When a memory 40 is loaded into a memory slot 20, each second ground pin 401 is electrically connected to a corresponding first ground pin 201, and each second power pin 402 is electrically connected to a corresponding first power pin. 202. Each of the first ground pins 201 outputs a low level mounting signal to the substrate management controller 30. The substrate management controller 30 obtains the installation signal of the low level and acquires power information of the memory loaded in the corresponding memory slot 20 through a base input/output system (BIOS). The substrate management controller 30 sends a control signal to the corresponding buck regulator 403 according to the power information, and the corresponding buck regulator 403 converts the first DC voltage into the first according to the control signal. The two DC voltages are output to a corresponding one of the storage modules 404.

Relative to the prior art, since for each buck regulator 403, its load corresponds to only one memory 40. That is, when each memory 40 is loaded into a corresponding one of the memory slots 20, each buck regulator 403 operates under full load conditions, thereby increasing the power conversion efficiency of each buck regulator 403.

It can be understood that the rated power of the plurality of memories 40 may be different, and the output power of the corresponding buck regulator 403 in the plurality of memories 40 may be designed according to the corresponding rated power, thus increasing The design flexibility of the output power of each buck regulator 403 is varied.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims.

100. . . Memory power supply system

10. . . Power supply

20. . . Memory slot

201. . . First ground pin

202. . . First power pin

30. . . Baseboard management controller

40. . . Memory

401. . . Second ground pin

402. . . Second power pin

403. . . Buck regulator

404. . . Storage module

50. . . Pull-up resistor

1 is a circuit diagram of a memory power supply system in accordance with a preferred embodiment of the present invention.

2 is a schematic diagram of the operation of the memory power supply system of FIG. 1.

100. . . Memory power supply system

10. . . Power supply

20. . . Memory slot

201. . . First ground pin

202. . . First power pin

30. . . Baseboard management controller

40. . . Memory

50. . . Pull-up resistor

Claims (8)

A memory having a rated voltage and a rated power, the memory being for mounting to a memory slot, the memory slot including a first ground pin and a first power pin, the first The power pin and the first ground pin are electrically connected to a power supply, the power supply is configured to provide a first DC voltage; the memory includes a second ground pin, a second power pin, and a drop a voltage regulator; the second ground pin is for electrically connecting to the first ground pin, the second power pin is for electrically connecting to the first power pin, and an output power of the buck regulator is corresponding And at the rated power, the buck regulator is electrically coupled to the second power pin for converting the first DC voltage to a second DC voltage, the second DC voltage being equal to the rated voltage. The memory of claim 1, wherein the memory further comprises a memory module electrically connected to the buck regulator, the memory module receiving the second DC voltage and for Store data. The memory of claim 2, wherein the first DC voltage is 12 volts and the second DC voltage is 1.5 volts. A memory power supply system includes a power supply, a plurality of memory slots, and at least one memory; the power supply is electrically connected to the plurality of memory slots and is respectively for the plurality of memory slots The power supply separately provides a first DC voltage; each memory has a rated voltage and a rated power, the memory is used for mounting to a memory slot, and the memory slot includes a first ground pin and a a first power pin, the first ground pin and the first power pin are electrically connected to a power supply, the power supply is used to provide a first DC voltage; and the memory includes a second ground pin a second power pin and a buck regulator; the second ground pin is for electrically connecting to the first ground pin, and the second power pin is for electrically connecting to the first power pin The output power of the buck regulator corresponds to the rated power, and the buck regulator is electrically connected to the second power pin for converting the first DC voltage Two dc voltage, the second DC voltage equal to the rated voltage. The memory power supply system of claim 4, wherein the memory power supply system further comprises a pull-up resistor corresponding to the memory slot, and each of the first ground pins passes through a corresponding one. The pull resistor is connected to a voltage source, and each of the ground pins is used to output a mounting signal; when a corresponding memory slot is not loaded into a corresponding memory, the mounting signal is high; when corresponding to a memory When the body slot is mounted corresponding to one memory, the installation signal is low. The memory power supply system of claim 5, wherein: the memory power supply system further comprises a substrate management controller, wherein each of the first ground pins is further electrically connected to the substrate management controller. The input end, the substrate management controller is configured to receive the installation signal, and determine, according to the installation signal, whether a memory is inserted into the corresponding memory slot. The memory power supply system of claim 4, wherein: the memory further comprises a memory module electrically connected to the buck regulator, and the memory module receives the second DC voltage And used to store data. The memory power supply system of claim 4, wherein the first DC voltage is 12 volts and the second DC voltage is 1.5 volts.