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TW201129769A - Heat conduction piece - Google Patents

Heat conduction piece

Info

Publication number
TW201129769A
TW201129769A TW99105111A TW99105111A TW201129769A TW 201129769 A TW201129769 A TW 201129769A TW 99105111 A TW99105111 A TW 99105111A TW 99105111 A TW99105111 A TW 99105111A TW 201129769 A TW201129769 A TW 201129769A
Authority
TW
Taiwan
Prior art keywords
heat conduction
magnetic metal
metal particles
particles
electric component
Prior art date
Application number
TW99105111A
Other languages
Chinese (zh)
Other versions
TWI482940B (en
Inventor
Yusuke Kubo
Tatsuo Kumura
Yoshihiro Kato
Kazuhiko Suzuki
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Priority to TW099105111A priority Critical patent/TWI482940B/en
Publication of TW201129769A publication Critical patent/TW201129769A/en
Application granted granted Critical
Publication of TWI482940B publication Critical patent/TWI482940B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Soft Magnetic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The invention provides a heat conduction piece having both functions of superior heat conduction feature and electromagnetic wave restriction feature while seeking high filling of magnetic metal particles and heat conduction particles in which the heat conduction is higher than the magnetic metal particles. A heat conduction piece disposed between an electric component (14) and a metal made heat dissipation component (12) capable of dissipating heat generated by the electric component (14) is characterized by comprising flexible resin containing sphere magnetic metal particles (capable of absorbing electromagnetic wave released by the electric component (14)) and heat conduction particles in which the heat conduction is higher than the magnetic metal particles. The average particle diameter of the magnetic metal particles is larger than the average particle diameter of the heat conduction particles. The volume ratio for the magnetic metal particles occupying on the heat conduction piece is above 55vol%.
TW099105111A 2010-02-22 2010-02-22 Thermally conductive TWI482940B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099105111A TWI482940B (en) 2010-02-22 2010-02-22 Thermally conductive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099105111A TWI482940B (en) 2010-02-22 2010-02-22 Thermally conductive

Publications (2)

Publication Number Publication Date
TW201129769A true TW201129769A (en) 2011-09-01
TWI482940B TWI482940B (en) 2015-05-01

Family

ID=50180047

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099105111A TWI482940B (en) 2010-02-22 2010-02-22 Thermally conductive

Country Status (1)

Country Link
TW (1) TWI482940B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103959929A (en) * 2011-12-05 2014-07-30 迪睿合电子材料有限公司 Electromagnetic wave-absorbing thermal-conductive sheet and method for manufacturing electromagnetic wave-absorbing thermal-conductive sheet
CN112888758A (en) * 2018-10-04 2021-06-01 昭和电工材料株式会社 Heat radiating material, method for producing heat radiating material, composition, and heat generating body

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3719382B2 (en) * 2000-10-25 2005-11-24 信越化学工業株式会社 Electromagnetic wave absorbing silicone rubber composition
JP2002329995A (en) * 2001-05-07 2002-11-15 Shin Etsu Chem Co Ltd Electromagnetic wave absorbing body
JP4311653B2 (en) * 2004-03-30 2009-08-12 株式会社タイカ Electromagnetic wave absorber

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103959929A (en) * 2011-12-05 2014-07-30 迪睿合电子材料有限公司 Electromagnetic wave-absorbing thermal-conductive sheet and method for manufacturing electromagnetic wave-absorbing thermal-conductive sheet
TWI553673B (en) * 2011-12-05 2016-10-11 Dexerials Corp Electromagnetic wave absorptive heat conducting sheet and electromagnetic wave absorptive heat conducting sheet
CN112888758A (en) * 2018-10-04 2021-06-01 昭和电工材料株式会社 Heat radiating material, method for producing heat radiating material, composition, and heat generating body

Also Published As

Publication number Publication date
TWI482940B (en) 2015-05-01

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