201113400 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種電鍍用治具。 【先前技術】 以治具將印刷佈線基板等基板保持站立狀態、並浸潰於電 鍍液中的技術已為人所知。關於此種技術，於下述專利文獻 1及2中，記載有—種基板保持用治具之發明，其係將基板 保持於由分別對向之一對橫檔與縱檔所構成之矩形框體而 供電鍍處理。 [先行技術文獻] [專利文獻] 專利文獻1 :日本專利特開平10-145030號公報 專利文獻2 :日本專利特開2000-355797號公報 【發明内容】 然而’上述文獻中記载之治具存在如下問題：相對於自電 鍍液中取出之基板，由於來自設置於其上邊上部之橫檔之電 錢液垂滴而會導致電鍍液再附著。當基板之表面再附著有電 鑛液，則所形成之電鍍之膜厚變得不均勻，故需要對電鍍後 之基板表面進行研磨的後處理步驟。 本發明係鑒於上述課題而完成者，其提供一種電鍍用治 具，係可防止電鍍液垂滴到自電鍍液中取出之基板。 本發明之電鍍用治具係可裝卸地保持矩形之基板並用以 099107053 4 201113400 將上述基板浸潰於紐液中者，其特徵在於： 包括： 對縱構件，其對上述基板之寬度方向之兩側邊予以保 持；及 ' 1部橫構件，其設置於較被保持之上述基板之上邊更上 部，將上述縱構件彼此連結；且 上述上部橫構件之下側緣形成為朝上之凸形狀。 又，本發明之電鍍用治具中，作為更具體的實施態樣，上 述下側緣之上述凸形狀，係以上述基板之寬度方向之中間位 置作為頂點’分別朝向上述縱構件單獨調整而下降傾斜。 另外，本發明之電鍵用治具中，作為更具體的實施態樣， 其係將可撓性之印刷佈線基板作為上述基板予以保持者，並 進而包括： w 支持框，其含有上述一對縱構件；及 開關框’其設置成相對於上述支持框而可開關自如，並與 上述縱構件一併夾持上述基板之上述兩側邊；且 於上述支持框或上述開關框之至少一者，突出地設置有數 個彈性構件’以使上述基板之上述兩側邊分別朝上下方向之 外側施加能量。 而且’於本發明之電鑛用、冶具中，作為更具體的實施態 樣’包括：第-上述彈性構件’以對上述基板之上述兩側邊 分別向上施加能量、及第二上述彈性構件，以對上述基板之 099107053 5 201113400 上述兩側邊分別向下施加能量，且 以位於上述支持框或上述開關框之中間高度下側作為邊 界高度，且於上述邊界高度上方設置有上述第一彈性構件， 並於上述邊界高度下方設置有上述第二彈性構件。 又，於本發明之電鍍用治具中，作為更具體的實施態樣， 上述開關框係以於上述基板之下方朝寬度方向延伸之旋轉 軸作為中心，而可相對於上述支持框轉動，且 相較於上述第二彈性構件，上述第一彈性構件高於自上述 支持框或上述開關框之突出高度。 另外，於本發明之電㈣料巾，料更具㈣實施態 樣，上述第一及第二彈性構件係彎曲板簧，其中的一片自上 述支持框或上述開關框朝上下方向之上述外側站立賢起。 又，於本發明之電鍵用治具中，作為更具體的實施態樣， 於上述彈性構件之上述-片之前端部附近，突起狀地形成有 用以擠壓被保持之上述基板之擠壓點。 又於本發明之電鍍用治具中，作為更具體的實施態樣， 上述彈性構件係於上述擠壓點前端側包含平板狀之延伸 部’在由上述支持框與上述開關框夾持上述基板時，相較於 上述擠壓點’上述延伸部係先擠壓上述基板。 再者，本發明中已規定上下方向，但其係為了簡單說明本 發明之構成要素之相對關係而方便地規定者，而並非係限定 在實施本發明之情況下的製造時或使用時之方向。 099107053 6 201113400 又’本發明之各種構成要素不必各自獨立地存在，亦可 為.數個構成要素㊉成為—個構件；—個構成要耗由數個 構件所形成；某構成要讀、其他構成要素之—科；某構成 要素之一部分與其他構成要素之一部分重複等。 根據本發明之電錢用治具，設置於基板之上邊上部之上部 橫構件下側緣形成為朝上之凸形狀，因此，附著於上部橫構 件表面之電鑛液會朝兩側之縱構件而沿下側緣流動。藉此， 電鍍液不會自上部橫構件朝基板落下，且基板不會產生液 滴。 上述目的及其他目的、特徵及優點可透過以下敍述的較佳 實施形態及隨附於其之以下圖式而更明瞭。 【實施方式】 以下，根據圖式來說明本發明之實施形態。再者，於所有 圖式中，對於相同的構成要素標註相同的符號，適當省略^ 明。 。 圖1(a)係表示本發明之實施形態之電鍍用治具1〇 的前視圖’圖1(b)係其右側視圖。 圖2⑷係表示相對於支持框20而開放開關框3〇之狀雖 電鍍用治具10的右側視圖，圖2(b)係表示圖2(a)中由圓B 包圍之區域之部分放大圖。 圖3係對保持有基板50之本實施形態之電錢用治美1 〇 之使用狀態進行說明的立體圖。 099107053 7 201113400 於圖1、2中’為了便於說明，以圖示之方式規定上下方 向及左右方向。又，於圖3中，除上下方向及左右方向外， 還以圖示方式規定前後方向。上下方向及左右方向為基板 、5〇之面内方向’前後方向為與基板50之面垂直方向。 首先’對本實施形態之電錢用治具1 〇之概要進行說明。 電鑛用治具10係可裝卸地保持矩形之基板50，並將基板 50浸潰於電鍍液60中之治具。 電鏟用治具10包括：一對縱構件21、22，其對基板50 之寬度方向之兩側邊51、52予以保持；及上部橫構件23， 其設置於被保持之基板50之上邊53上部，以將縱構件21、 22彼此連結。 而且，本實施形態之電鍍用治具10中，上部橫構件23 之下側緣231形成為朝上之凸形狀。 其次，對本實施形態之電鍍用治具1〇進行詳細說明。 如圖3所示，電鍍用治具10係將基板50浸潰於上方設有 開口之電鍍槽62所蓄積之電鍍液60中，用以對基板50之 表面貫施電鍛處理之治具。 電鍍用治具1〇藉由搬送裝置70而可自如地進行前後方向 之進退驅動及上下方向之升降驅動。 電鍍槽62於前後方向設置有數台，其中蓄積有種類彼此 相同或不同之電鍍液60或清洗液。 對基板50實施之電鍍處理並無特別限定，除電氣（電解) 099107053 8 201113400 電鍵或無電解電鍍之金屬電鍍之外，還可例示各種化學合成 處理、預處理。作為金屬電鍍，可舉出銅電鍍或鎳電鍍、鉻 電鍍、鋅電鍍、錫電鍍、銀電鍍、金電鍍、焊錫等之合金電 鍛作為一例。 振·送裂置7〇包括：支桿(carrier bar)72，其水平地架設’ 並垂下保持電鍍用治具10 ;升降部76，其保持支桿72之兩 端部73 ;及樞架78，其於上下方向上設置有對升降部76 進行升降驅動之滑軌79。 對框架78而言，藉由滑執79而使升降部76進行升降驅 動’同時框架78自身向前後方向進退。 升降部76自框架78朝左右方向内側突出。設置於升降部 76上之保持器74，係對支桿72之端部73予以保持。 藉此’保持有基板50之狀態之電鍍用治具10，藉由搬送 裝置70而進退及升降自如地受到驅動。並且，使設置於既 定之電鍍槽62上部之電鍍用治具1〇下降，將基板5〇與電 鍵用治具10 —併浸潰於電鍍液60中，再將其取出，藉此對 基板50之主面55進行電鑛處理。 本實施形態之電鍍用治具10,係可防止在取出時電鍍液 60垂滴到基板50之主面55。 如圖1及3所示，電鍍用治具1〇包括上部橫構件23，其 設置於被保持之基板50之上邊53上部，以將縱構件21、 22彼此連結。並且’本實施形態之上部橫構件23之下側緣 099107053 9 201113400 231形成為朝上之凸形狀。 藉此，在將基板50自電鍍槽62取出時，附著於位於基板 50上部之上部橫構件23的電鍍液60,會沿下侧緣231向左 右方向流動，並自縱構件21、22向下方流下。此處，在附 著於上部橫構件23之電鍍液60,因重力而同時與下側緣231 之親和力會作用。因此，於重力中之下側緣231之傾斜方向 成分之作用下，電鍍液60沿下側緣231向左右方向流下。 而且，在與下側緣231之親和力之作用下，電鍍液60不會 自下側緣231脫離，故附著於上部橫構件23之電鍍液60 不會自上部橫構件23落下，故沒有電鍍液垂滴。 此處，在下側緣231朝左右之任一方向單獨調整而下降傾 斜之情況下，亦可使附著於上部橫構件23之電鍍液60，朝 位於下降傾斜方向前端的縱構件21或縱構件22而流下。然 而，此時，沿上部橫構件23之流下距離變長，故電鑛液60 於中途易自下側緣231脫離而朝向基板50落下。 相對於此，本實施形態之上部橫構件23，其下側緣231 之凸形狀係以基板50之寬度方向之中間位置作為頂點 232，分別朝向縱構件21、22單獨調整而下降傾斜。 藉此，自頂點232至縱構件21或縱構件22的距離變得相 等，故在左右方向上可獲得均等之電鍍液垂滴到基板50之 防止效果。 頂點232之高度並無特別限定，舉一例而言，在使上部橫 099107053 10 201113400 構件23之寬度尺寸為500mm之情況下，使頂點232為5〜 l〇mm左右以上之高度即可。即，使下側緣231之傾斜角度 之正切（tan)為〇.〇2〜0.04或其以上即可。 由圖1所示之本實施形態之電鍍用治具1〇所保持、且供 電锻處理之基板50並無特別限定。可舉出如下一例：厚度 為30〜150/zm之可撓性印刷佈線基板（FPC : Flexible Printed Circuits)、或厚度為600 # m左右以下之剛性基板。 基板50形成為矩形，藉由本實施形態之電鍍用治具1〇 之支持框20，至少可保持對向之兩側邊（縱邊)51、52。 基板50以站立狀態被電鍍用治具10保持，並浸潰於電鍍 液60 〇 此處，所謂侧邊51、52被支持框20保持，係指該側邊 51、52或其附近被支持框20所保持，未必要使左右兩側緣 接觸到支持框20。即，侧邊51、52亦可較支持框2〇朝左 右之外方稍突出。 再者，所謂基板50為矩形，係指對向之一對側邊51、52 為大致平行，未必要使側邊51、52嚴格地平行，於支持框 20之縱構件2卜22之寬度内亦可不平行。又，關於基板5〇 之上邊53及下邊54,可相互平行，亦可不平行。 又，在不損及電鍍用治具1G之保持性之限度内 ，基板50 之各邊可為直線狀亦可包含凹凸部。 電鐘用治具10將可撓性之印刷佈線基板作為基板5〇而可 099107053 11 201113400 裝卸地保持。關於電鍍用治具10對基板5〇之保持態樣，口 要將上部橫構件23以一距離設置於基板5〇之上邊 方，則並無特別限定。 如圖1、2所示，本實施形態之電鍍用治具1〇中，例示出 藉由包含朝上下方向延伸之一對縱構件21、22之支持框 及開關框30而崎基板％之態樣。本實施形態之開= 30，係被設置成相對於支持框2G而可開關自如地夾持 件21、22與基板50之兩側邊51、52之框體。 然而’本發明並不限於此’例如，可藉由縱構件2 而吸引保持基板5〇，亦可藉由具有彈性之失具 2 保持基板50之側邊51、52。 輯 對基板5〇之寬度方向之兩側邊5卜52予以保接 21、22的雜並無特職定，可為板狀或棒狀|實，件 態之縱構件21、22，係形成為與基板5〇平行且上下P形 伸之長條的板狀。 上下方向延 縱構件21 22之上端部經彎折而形成釣部27 係用以將電鍍用治且。釣部27 。具10懸架於搬送裝置7〇之 圖3)之部位。 叉杯72(參照 懸架於支桿72之雷你 •縱構件21、22之!=^：：被擠_釘28固定。 從而形成上方延伸部29 °後方_曲之程度與其板厚相當， 此可將基板50保持於支桿心下方。灸方、今曲，藉 099107053 12 201113400 於縱構件21、22前面，貼附有底座板辦如、 座板26形成為長條之矩形板狀，寬度較縱構件以、22 : 本實施形態之支持框20包括將縱構件21、22 .(. 之下端彼此 連結之下部㈣件24。本發日种，是否由下部横構件μ來 - 保持基板50之下邊54均可。 本實施形態中，基板50之下邊54抵接於下部橫構件％ 之前面，但未被開關框30及下部橫構件24所夾持。藉此， 從自電鍍槽62中取出之基板50流下之電鍍液6〇之垂滴不 會受到開關框30之阻礙，從而不會有電鍍液6〇滯留於下邊 54附近之情況。 另一方面，本實施形態之電鍍用治具10並不保持基板5〇 之上邊53 ’且不具有與上邊53抵接之橫構件。此係為了回 避電鍍液自對基板50之上邊53予以保持或與其抵接之橫構 件垂滴。即，本實施形態之開關框30藉由向上下方向延伸 之縱檔33a、33b而僅保持基板50之兩侧邊。 本貫^a形態之支持框20藉由對向之一對縱構件21、22， 以及於左右方向連結§亥專之上部橫構件23及下部橫構件 24，而形成為大致矩形狀。 可相對於支持框20轉動、且與支持框2〇 —起夾持基板 50之開關框30包括：與縱構件21、22對向之一對縱標 33(33a、33b)、以及將縱檔33a、33b相互連結之旋轉軸32 及橫檔37。 099107053 13 201113400 縱標33係相對於延伸方向（上下方向）而垂直切下之橫剖 面成「口」字(u字）狀。具體而言，縱檔33包含：與支持 框20之底座板26對向之長條的擠壓板34、及站立設置於 擠壓板34之寬度方向（圖1(a)中之左右方向）之兩側的一對 側板 35(35a、35b)。 本實施形態中，設置於縱檔33之下端附近之旋轉軸32、 及設置於上端附近之橫檔37，分別成圓柱狀。然而，橫檔 37之橫剖面形狀並無特別限定。 旋轉軸32及橫檔37 ’係於寬度方向貫通縱檔33之側板 35 ° 於縱構件21之下端附近，朝電鍍用治具10前方（圖 中之左方）突出地設置有可轉動地約束旋轉軸32之兩端部 之轴承36。 另一方面，橫檔37設置為貫通一對縱檔33所具有之共計 4 塊侧板 35(35a、35b)。 橫檔37之兩端係向縱檔33之兩外側突出。於縱構件2卜 22寬度方向之兩外側，可轉動地設置有鉤25(25a、25b)。 而且，在以旋轉軸32為中心而使開關框30轉動、並將其壓 到支持框20之狀態下，將鉤25掛合於橫檔37，藉此，開 關框30與支持框20彼此鎖扣。 構成本實施形態之電鍵用治具1 〇之材料並無特別限定， 典型地可使用不鏽鋼(SUS)等之金屬材料。 099107053 14 201113400 又，有可能與浸潰於雷 電錢液60中的基板50接觸之底座板 26或縱檔33，亦可將龙矣 一表面形成為非導電性。此時，可藉 由非金屬之非導電性材料而製作底座板26或㈣33，或者 於金屬材料之表面塗牒形士丄 联I成由溶膠(S〇l)等非導電性材料所 形成之絕緣層。 於支持框2〇或開關框3〇之至少-者，突出地設置有數個 彈性構件4G，崎由物㈣具H)所祕之絲50之兩 側邊51、52 ’分別朝上下方向之外側施加能量。 彈性構件4〇係自支持框20朝向開關框30、或者自開關 框30朝向支持框20而突出。料，彈性構件4〇可僅設置 於支持框20 ’亦可僅設置於開關框％，還可分別設置於兩 者上。 本實施形,％中，將自開關框30朝向支持框20❿突出之板 黃例示為彈性構件40。然而，本發明並非限於此，亦可使 用棒狀或球狀之構件作為彈性構件4〇。 祕構件4 0係用以對可撓性之基板5 〇施加既定之張力並 平坦地保持之施力構件。 藉由彈性構件40將基板50張設於支持框2〇或開關框 3〇由此可防止經電鍍處理之基板50產生鬆弛或褶皺。 又，根據以彈性構件40擠壓支持基板5〇之本實施形態之 電鍍用治具1〇，可通用地保持板厚彼此不同之多數種類之 基板50。 099107053 15 201113400 彈性構件40之材質並無特別限定，但從彈性及财久性之 觀點而言，適合使用不鏽鋼（sus)等之金屬材料。 此處’以金屬材料等之導電性材料來製作彈性構件4〇， 藉此可將彈性構件40用作電解電鍍中之電極。 即，於基板50之表面，利用金屬材料預先形成由任意圖 案所形成之被電鑛區域。另—方面，沿基板5()之側邊51、 52設置相對於被電鍍區域而導通之電極墊，於其上擠壓彈 性構件40。然後’通過開關框3〇使彈性構件4〇通電，藉 此，基板50於被電鍍區域中進行電解電鍍。 電鍍用治具ίο包括第-彈性構件41及第二彈性構件42 作為彈性構件4G，其中，上述第―彈性構件41係對一對縱 播33a、33b分別朝基板50之兩側邊51、52分別向上施加 能量，上述第二彈性構件42係對基板5〇之兩側邊Η、^ 分別向下施加能量。 又，如圖2⑻所示’該電錢用治具1〇中，以支持框2〇或 開關框30之中間高度位於下側作為邊界高度bh，於邊界 高度BH上方設置第一彈性構件41，且於邊界高度下方 設置第二彈性構件42。 更具體而言，本實施形態中，將較以旋轉軸32為基準之 開關框30之中間高度下方作為邊界高度BH，於其上方設 置有數個第一彈性構件41，於邊界高度BH之下方設置有 數個第二彈性構件42。第一彈性構件41與第二彈性構件42 099107053 16 201113400 並排配設於縱檔33之擠壓板34上。 再者’所明第-彈性構件41位於邊界高度BH上方，係 指第-彈性構件41之至少一部分位於邊界高度冊之上 方。同樣地’所謂第二彈性構件42位於邊界高度BH下方， 係指第二彈性構件42之至少—部分位於邊界高度册之下 方。 如圖2(b)之放大圖所示，第一彈性構件41(彈性構件4〇) 藉由螺釘491及螺帽術而安裝於縱槽33之擠壓板34。 圖4⑻係彈性構件40之俯視圖，圖咐)係其站立俯視圖。 第一及第二彈性構件4卜42係彎曲板簧，其中的一片(站 立片43)自支持框20或開關框3〇朝向上下方向之外側站立 豎起。 本實施形態之彈性構件4〇(第一彈性構件41及第二彈性 構件42)’係將金屬等板材料於彎曲部48折彎成銳角而成。 被折彎的一片（站立片43)自擠壓板34傾斜地站立，另一片 (基底片44)設置有螺釘孔49並插通螺釘491。 彈性構件40之站立片43之前端部附近，突起狀地形成有 用以擠壓被保持之基板5〇之擠壓點45。藉此，彎曲板簧之 彈性力集中地施加能量於基板5〇。 圖5係由第一彈性構件41擠壓基板5〇之狀態之示意圖。 本實施形態之第一彈性構件41，係於較擠壓點45更靠近 站立片43之前端側包含平板狀之延伸部47。而且，如圖5 099107053 201113400 所示’在以支持框20與開關框30夾持基板50時，延伸部 47較擠壓點45先抵接於基板50而擠壓基板。 如圖5(a)所示’在開關框30相對於支持框20而關閉時， 第一彈性構件41中的站立片43之前端之延伸部47首先抵 接於基板50。 於該狀態下’若進一步關閉開關框30，則如圖5(b)中箭 頭所示第一彈性構件41被壓縮，站立片43與基底片44之 彎曲角減少。藉此，相較於延伸部47，於彎曲部48之附近 自站立片43向後方突出地設置之擠壓點45會抵接於基板 50 ° 此處，於圖5(b)之狀態下若進一步壓縮第一彈性構件41， 則擠壓點45會朝以彎曲部48為中心之大致圓弧狀之箭頭方 向位移。該位移方向為相對於開關框3〇之前方且為上方。 因此，由擠壓點45對基板50所賦予之集中負重包含基板 50之面内方向之向上的成分。藉此.，第一彈性構件4丨對基 板50之側邊51(或側邊52)向上施加能量。 再者，在自圖5(a)至圖5(b)的期間，站立片43之延伸部 47對基板50之施力亦因與上述相同之理由，包含向上成分。 又，本貫施形悲之電鐘用治具1 〇中，相較於擠壓點45 平坦的延伸部47會先抵接於基板5〇，故在將擠壓點45之 集中負重附加於基板50之前’既定之施力自延伸部47作用 於基板50而對基板50賦予張力。因此，在設置於支持框 099107053 201113400 20的初期狀態之基板5G之鬆他或餘，储由延伸部47 而被預先拉伸之狀態下，擠壓點45抵接於基板5〇。 因此’相較於對基板50從最初於擠壓點45施加能量之情 況，基板50之急遽延伸受到抑制，從而可防止基板50破損。 再者，第一彈性構件41中，相較於彎曲部48，站立片43 向上方延伸’故延伸部47或擠壓點45之施加能量方向包含 基板50之面之正後方並且朝上方。另一方面，關於第二彈 性構件42，如圖2(b)所示，站立片43之突出方向為朝下， 因此與第一彈性構件41相反，可對基板5〇賦予包含向下之 成分的施力。 藉此，根據本實施形態之電鍍用治具1〇，可於上下方向 延伸之狀態下，藉由既定之張力而將基板5〇予以保持。 又，本實施形態中，將對基板50向上施加能量之負重點 及向下施加能量之負重點劃分為上下的邊界高度BH，係位 於支持框20或開關框30之中間高度下側。藉此，在以電錢 用治具10爽持高度不同的各種基板50時，可對各個基板 50賦予向上方及向下方之施力。即，例如當邊界高度bh 為開關框30之中間高度時，在對開關框30之一半以下之高 度的基板50予以保持時，無法由彈性構件40對該基板50 賦予向上方之施力，從而難以充分地張設基板50。 相對於此’如本實施形態之電鍍用治具10，藉由將開關 框30之中間高度下方設為邊界高度BH，具體而言將開關 099107053 19 201113400 框3〇之四刀之—左右之高度作為邊界高度BH，藉此，對 於不足開關框30之—半之高度的基板5()，亦可利用電鑛用 治具10適當地夾持。 50之下方朝寬度方 本實施形態之開關框30，係以於基板 向延伸之旋轉車由32為中心，而可相對於支持框20轉動。即， 開關框30係相對於支持框2〇而於上方設置開口。而且，相 較於第二彈性構件42，第—彈性構件41自支持框2〇或開 關框30之突出高度大。 本實施形感中，如圖2⑻所示，設置於開關框3〇上方侧 之第-彈性構件41自縱檔33突出之高度，大於第二彈性構 件42自縱檔33突出之高度。 藉此，可使開關框30相對於支持框2〇而關閉，並可使第 一彈性構件41對基板5〇開始擠壓之時間點與第二彈性構件 42對基板50開始擠壓之時間點大致同時。因此，對於基板 50之向上的施力及向下的施力大致同時作用於基板％，故 基板50 +會相對於支持框2〇而產生位置偏移，可對基板 50賦予張力。 再者’本實施形態之電鍍用治具10中，於數個第一彈性 構件41或第二彈性構件42中，分別將配置於開關框3〇之 上部者之突出高度設為小於配置於下部者之突出高度。 具體而言’數個（圖2(a)中圖示出7個）第一彈性構件41 中，°又置於開關框30之上側者（该圖中為4個）之突出高度 099107053 20 201113400 大於設置於該等下側者(該圖中為3個）之突出高度。 上述第一彈性構件41係可使圖4(b)所示之站立基端部46 之長度L2彼此不同。對於基底片44之長度或延伸部们 之長度L3 ’所有的第一彈性構件41及第二彈性構件42可 作為共同’或者亦可彼此不同。 又，本實施形態中，亦可使第一彈性構件41與第二彈性 構件42之一者或兩者，可相對於電鍍用治具1〇裴卸。並且， 亦可根據由電鍍心具1()所料的基板5G之高度尺寸或厚 度、材質等之特性’使第-彈性構件41或第二彈性構件^ 中之站立基端部46之突出方向上下反轉，或更換為大小不 同之其他彈性構件。例如，當基板50之厚度為既定以下時， 亦可更換為第-彈性構件41或第二彈性構件42巾站立基端 部46之長度L2更短、或者板簧之彈簧f數更低的其他彈性 構件。藉此’在以開關框30及支持框2〇失持基板5〇時， 對基板50朝面内之上下方向賦予之張力得以緩和，從而防 止基板5 0破損。 又田基板5〇之南度尺寸為既定以下時，亦可使數個（圖 2⑻中圖示出4個）第二彈性構件42中位於上側之丨個或2 個以上的安裝方向上下反轉。藉此，在以電則治具10保 持高度較㈣基板5G時，亦可使對基板5()之_所賦予之 張力於上下平衡。 圖6係示意性表示由本實施形態之電鍵用治具H)來保持 099107053 21 201113400 基板50之狀態的立體圖。 於電鍍用治具10上，在自後方組合有吸附治具80之狀態 下設置基板50。 吸附治具80包括：穿設有多數個可進行負壓吸引之吸引 孔83之平坦的吸附面82 ;及於吸附面82之左右兩側以下 降階梯狀而設置的段部84。 吸引孔83與段部84之段差之高度，係與電鍍用治具 之縱構件21或22與底座板26之厚度總合相等。 又，吸附面82之左右方向之寬度尺寸，稍小於縱構件2^ 與縱構件22之間隔。並且，吸附面82之上下方向之高度尺 寸，小於下部橫構件24與上部橫構件23之最小間隔。 綜上所述，可將吸附治具80之吸附面82自後方嵌合至支 持框20之内部，又，在將吸附治具80嵌合於支持框20之 狀態下，吸附面82與底座板26排列於同一平面上。 於該狀態下，利用鼓風機（未圖示）對吸引孔83之内部進 行吸引，藉此可跨及一對底座板26而將所分配的基板5〇 吸附保持於吸附面82。 因此，在開關框30進行關閉作業時，即便作業者的手從 基板50離開’亦可將基板50保持為張設於支持框20上之 狀態。 由此，特別在使用可撓性之印刷佈線基板作為基板5〇 時，即便基板5 0於站立狀態不具有形態安定性之情況下， 099107053 22 201113400 亦可在使電翻治具1G站立之狀態下，將基板5G設置於支 持框20。因此’與浸潰於電鍍液⑼之情況相同，可使電鍵 八於站立狀恶下設置基板50，並可達到提高基板5〇 之安裝作業性及減少作業空間。 . 再者’亦可將其他的吸引孔83穿設於吸附治具8〇之段部 84同時相對於縱構件2卜22及底座板％❿設置與上述其 他的吸引孔83連通之通孔。 藉此，於基板50之兩側邊51、52及其附近，亦可在開關 框30關閉時進行吸附保持。 而且’以開關框3〇與支持框20來夾持基板50，並藉由 鉤25而鎖扣開關框3〇之橫檔37，之後使鼓風機停止，使 電鍍用治具10及基板50自吸附治具80脫離而供電鍍處理 (參照圖3)。 另外’在將電鍍處理後之基板5〇自電鑛用治具10上卸下 時，亦可相對於支持框20而自後方組合吸附治具80，並利 用鼓風機對吸引孔83進行負壓吸引，於使基板50之背面吸 引至吸附面82之狀態下進行作業。又，於使基板50吸附於 吸附面82之狀態下，將鉤25自橫檔37卸下、並將開關框 . 30自支持框20打開後，作業者可取出基板50。 本申請案係以2009年3月12日提出申請之日本申請特願 2009-59008為基礎而主張優先權，其公開之全部内容併入 於此。 099107053 23 201113400 【圖式簡單說明】 圖1(a)係表示本發明之實施形態之電鍍用治具之一例的 前視圖，圖1(b)係其右側視圖。 圖2(a)係表示相對於支持框開放開關框之狀態之電鍍用 治具的右側視圖，圖2(b)係其部分放大圖。 圖3係對保持有基板之電鍍用治具之使用狀態進行說明 的立體圖。 圖4(a)係彈性構件之俯視圖，圖4(b)係其站立俯視圖。 圖5係表示由第一彈性構件擠壓基板之狀態的示意圖。 圖6係示意性表示由本實施形態之電鍍用治具保持基板 之狀態的立體圖。 【主要元件符號說明】 10 電鍍用治具 20 支持框 21 > 22 縱構件 23 上部橫構件 24 下部橫構件 25(25a ' 25b) 釣 26(26a、26b) 底座板 27 鉤部 28 螺釘 29 上方延伸部 099107053 24 201113400 30 開關框 32 旋轉軸 33(33a、33b) 縱檔 34 擠壓板 35(35a > 35b) 側板 36 軸承 37 橫檔 40 彈性構件 41 第一彈性構件 42 第二彈性構件 43 站立片 44 基底片 45 擠壓點 46 站立基端部 47 延伸部 48 彎曲部 49 螺釘孔 50 基板 51 > 52 側邊(縱邊） 53 上邊 54 下邊 55 主面 099107053 25 201113400 60 電鍍液 62 電鍍槽 70 搬送裝置 72 支桿 73 端部 74 保持器 76 升降部 78 框架 79 滑軌 80 吸附治具 82 吸附面 83 吸引孔 84 段部 231 下側緣 232 頂點 491 螺釘 492 螺帽 B 圓 BH 邊界高度 Li ' L2 ' L3 長度 099107053 26201113400 VI. Description of the Invention: [Technical Field to Be Invented] The present invention relates to a jig for electroplating. [Prior Art] A technique in which a substrate such as a printed wiring board is held in a standing state and impregnated in an electroplating solution is known. In the following Patent Documents 1 and 2, the invention relates to a substrate holding jig which holds a substrate in a rectangular frame which is formed by a pair of a pair of crosspieces and a longitudinal direction. Body and power plating treatment. [Patent Document] [Patent Document] Patent Document 1: Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. No. 2000-355797. There is a problem in that the plating solution is reattached due to the dripping of the electro-money liquid from the crosspiece provided on the upper side of the upper surface of the substrate taken out from the plating solution. When the surface of the substrate is further adhered with the electromineral liquid, the thickness of the formed plating becomes uneven, so that a post-treatment step of polishing the surface of the substrate after plating is required. The present invention has been made in view of the above problems, and provides a plating tool for preventing a plating solution from dripping onto a substrate taken out from a plating solution. The electroplating jig of the present invention is a method for detachably holding a rectangular substrate and immersing the substrate in a liquid solution by using 099107053 4 201113400, comprising: a pair of vertical members, which are opposite to the width direction of the substrate The side members are held; and 'one horizontal member is disposed above the upper surface of the substrate to be held, and the vertical members are coupled to each other; and the lower side edge of the upper horizontal member is formed in an upward convex shape. Further, in the jig for plating according to the present invention, in a more specific embodiment, the convex shape of the lower side edge is individually adjusted and lowered toward the vertical member at an intermediate position in the width direction of the substrate. tilt. Further, in the jig for a key of the present invention, as a more specific embodiment, a flexible printed wiring board is held as the substrate, and further includes: a w support frame including the pair of verticals And a switch frame that is slidably connectable with respect to the support frame and that sandwiches the two sides of the substrate together with the vertical member; and at least one of the support frame or the switch frame A plurality of elastic members are protrudedly provided to apply energy to the outer sides of the substrate in the upper and lower directions. Further, in the electric ore and metallurgical tool of the present invention, as a more specific embodiment, the present invention includes: the first-the above-mentioned elastic member', which applies energy to the both side edges of the substrate, and the second elastic member, Applying energy to each of the two sides of the substrate 099107053 5 201113400, and the lower side of the middle of the support frame or the switch frame as a boundary height, and the first elastic member is disposed above the boundary height And the second elastic member is disposed below the boundary height. Further, in the plating fixture of the present invention, in a more specific embodiment, the switch frame is rotatable with respect to the support frame with a rotation axis extending downward in the width direction below the substrate as a center, and The first elastic member is higher than the protruding height from the support frame or the switch frame as compared with the second elastic member. In addition, in the electric (four) towel of the present invention, the material is more (4), the first and second elastic members are curved leaf springs, one of which stands from the support frame or the switch frame to the outer side in the up and down direction. Xianqi. Further, in the jig for a key of the present invention, as a more specific embodiment, a pressing point for pressing the held substrate is formed in a protrusion shape in the vicinity of the front end portion of the elastic member. . Further, in a plating fixture according to the present invention, in a more specific embodiment, the elastic member includes a flat extending portion on a distal end side of the pressing point, and the substrate is sandwiched by the support frame and the switch frame At the time of the above-mentioned extrusion, the above-mentioned substrate is extruded first. Further, although the vertical direction is defined in the present invention, it is convenient to specify the relative relationship of the constituent elements of the present invention, and is not limited to the manufacturing or use direction in the case of implementing the present invention. . 099107053 6 201113400 Further, the various constituent elements of the present invention do not have to exist independently, and may be a plurality of constituent elements ten as one member; one composition is formed by a plurality of members; a certain composition is to be read, and other components are formed. Element--section; one part of a component is repeated with one of the other components. According to the jig for electric money according to the present invention, the lower side edge of the upper member of the upper portion of the upper portion of the substrate is formed in an upward convex shape, and therefore, the electro-mineral liquid adhering to the surface of the upper cross member faces the longitudinal members on both sides. And flowing along the lower side edge. Thereby, the plating solution does not fall from the upper cross member toward the substrate, and the substrate does not generate droplets. The above and other objects, features, and advantages of the invention will be apparent from the description and appended claims [Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. In the drawings, the same components are denoted by the same reference numerals, and the description thereof will be omitted as appropriate. . Fig. 1(a) is a front view showing a plating jig 1〇 according to an embodiment of the present invention. Fig. 1(b) is a right side view thereof. Fig. 2 (4) is a right side view showing the jig 10 for plating when the switch frame 3 is opened with respect to the support frame 20, and Fig. 2 (b) is a partially enlarged view showing a region surrounded by the circle B in Fig. 2 (a). . Fig. 3 is a perspective view for explaining a state in which the utility model of the electric money for holding the substrate 50 is held. 099107053 7 201113400 In the drawings 1 and 2, the upper and lower directions and the left and right directions are defined as shown in the drawings for convenience of explanation. Further, in Fig. 3, the front-rear direction is defined in the figure except for the vertical direction and the left-right direction. The up-and-down direction and the left-right direction are the substrate, and the in-plane direction of 5 〇 is the direction perpendicular to the surface of the substrate 50. First, the outline of the jig for electric money of the present embodiment will be described. The electro-metal jig 10 is a jig that detachably holds the rectangular substrate 50 and immerses the substrate 50 in the plating solution 60. The jig harness 10 includes a pair of vertical members 21, 22 that hold both side edges 51, 52 of the substrate 50 in the width direction, and an upper cross member 23 that is disposed on the upper side of the substrate 50 to be held 53. The upper portion connects the longitudinal members 21 and 22 to each other. Further, in the jig 10 for electroplating of the present embodiment, the lower side edge 231 of the upper cross member 23 is formed in a convex shape upward. Next, the jig for plating for the present embodiment will be described in detail. As shown in Fig. 3, the plating jig 10 is obtained by impregnating the substrate 50 with the plating solution 60 accumulated in the plating tank 62 having the opening thereon, and for performing the electric forging treatment on the surface of the substrate 50. The plating jig 1 is freely movable in the front-rear direction and in the up-and-down direction by the conveying device 70. The plating tank 62 is provided in a plurality of stages in the front-rear direction, in which the plating liquid 60 or the cleaning liquid of the same or different types are accumulated. The plating treatment to be performed on the substrate 50 is not particularly limited, and various chemical synthesis treatments and pretreatments can be exemplified in addition to electrical (electrolysis) 099107053 8 201113400 electric or electroless plating. Examples of the metal plating include alloy electroforming such as copper plating, nickel plating, chromium plating, zinc plating, tin plating, silver plating, gold plating, and solder. The vibration/transmission arrangement 7 includes: a carrier bar 72 horizontally erected and suspended to hold the plating fixture 10; a lifting portion 76 that holds both end portions 73 of the struts 72; and a pivot 78 A slide rail 79 for driving the lift unit 76 up and down is provided in the vertical direction. With respect to the frame 78, the lift portion 76 is lifted and lowered by the slipper 79, while the frame 78 itself advances and retreats in the forward and backward directions. The lifting portion 76 protrudes inward in the left-right direction from the frame 78. The holder 74 provided on the lifting portion 76 holds the end portion 73 of the strut 72. By this, the plating jig 10 for holding the substrate 50 is moved forward and backward and lifted by the transfer device 70. Then, the plating jig 1〇 provided on the upper portion of the plating tank 62 is lowered, and the substrate 5〇 and the jig 10 for the electric key are immersed in the plating solution 60, and then taken out, thereby the substrate 50 is removed. The main surface 55 is subjected to an electric ore treatment. In the plating jig 10 of the present embodiment, it is possible to prevent the plating solution 60 from dripping onto the main surface 55 of the substrate 50 at the time of taking out. As shown in Figs. 1 and 3, the jig for plating is provided with an upper cross member 23 which is provided on the upper portion of the upper side 53 of the substrate 50 to be held to connect the vertical members 21 and 22 to each other. Further, in the present embodiment, the lower side edge of the upper cross member 23 is 099107053 9 201113400 231 formed in a convex shape upward. As a result, when the substrate 50 is taken out from the plating tank 62, the plating solution 60 adhering to the upper cross member 23 located on the upper portion of the substrate 50 flows in the left-right direction along the lower side edge 231, and downward from the vertical members 21 and 22. Flow down. Here, the plating solution 60 attached to the upper cross member 23 acts on the lower side edge 231 due to gravity. Therefore, the plating solution 60 flows downward in the left-right direction along the lower side edge 231 under the action of the oblique direction component of the lower side edge 231 of gravity. Further, under the action of the affinity with the lower side edge 231, the plating solution 60 is not detached from the lower side edge 231, so the plating solution 60 adhering to the upper cross member 23 does not fall from the upper cross member 23, so there is no plating solution. Dripping drops. Here, when the lower side edge 231 is individually adjusted in the left-right direction and inclined downward, the plating liquid 60 adhering to the upper cross member 23 may be directed to the vertical member 21 or the vertical member 22 located at the front end in the descending inclination direction. And shed. However, at this time, the distance traveled along the upper cross member 23 becomes longer, so that the electro-mineral liquid 60 is easily detached from the lower side edge 231 in the middle and falls toward the substrate 50. On the other hand, in the upper cross member 23 of the present embodiment, the convex shape of the lower side edge 231 is defined as the vertex 232 at the intermediate position in the width direction of the substrate 50, and is individually adjusted toward the vertical members 21 and 22 to be inclined downward. Thereby, the distance from the vertex 232 to the vertical member 21 or the vertical member 22 becomes equal, so that the effect of preventing the dripping of the plating liquid onto the substrate 50 in the right and left direction can be obtained. The height of the apex 232 is not particularly limited. For example, when the width dimension of the upper horizontal member 099107053 10 201113400 member is 500 mm, the vertex 232 may have a height of about 5 to 1 mm or more. That is, the tangent (tan) of the inclination angle of the lower side edge 231 may be 〇.〇2 to 0.04 or more. The substrate 50 held by the plating jig 1 of the present embodiment shown in Fig. 1 and subjected to electric forging is not particularly limited. An example of a flexible printed wiring board (FPC: Flexible Printed Circuits) having a thickness of 30 to 150/zm or a rigid substrate having a thickness of about 600 m or less is exemplified. The substrate 50 is formed in a rectangular shape, and at least the opposite sides (longitudinal sides) 51 and 52 can be held by the support frame 20 of the plating jig 1 of the present embodiment. The substrate 50 is held by the plating fixture 10 in a standing state and is immersed in the plating solution 60. Here, the side edges 51, 52 are held by the support frame 20, meaning that the side edges 51, 52 or the vicinity thereof are supported by the frame. The 20 holds, and it is not necessary to bring the left and right side edges into contact with the support frame 20. That is, the side edges 51, 52 may also protrude slightly beyond the support frame 2 〇 to the left and right. Further, the substrate 50 is rectangular, which means that the pair of side edges 51, 52 are substantially parallel, and it is not necessary to make the side edges 51, 52 strictly parallel, within the width of the longitudinal member 2 of the support frame 20. It can also be non-parallel. Further, the upper side 53 and the lower side 54 of the substrate 5A may be parallel to each other or may not be parallel. Further, the sides of the substrate 50 may be linear or include irregularities within the limits of the retention of the plating fixture 1G. The electric clock fixture 10 holds the flexible printed wiring board as a substrate 5 and can be detachably held by 099107053 11 201113400. The plating jig 10 is not particularly limited as long as the upper cross member 23 is disposed at a distance above the substrate 5A. As shown in FIG. 1 and FIG. 2, the plating fixture 1 of the present embodiment exemplifies a state in which the support frame and the switch frame 30 of the pair of vertical members 21 and 22 are extended in the vertical direction. kind. The opening of the embodiment is set to 30, and the frame 21 of the two sides 51 and 52 of the substrate 50 is sandwiched between the holders 21 and 22 so as to be rotatable with respect to the support frame 2G. However, the present invention is not limited thereto. For example, the holding substrate 5 can be attracted by the vertical member 2, and the side edges 51, 52 of the substrate 50 can be held by the elastic loss. The pair of sides 52b of the width direction of the substrate 5〇 are protected by the joints 21 and 22, and there is no special purpose, which may be a plate shape or a rod shape. The vertical members 21 and 22 are formed. It is a long plate shape parallel to the substrate 5A and extending P above and below. The upper end portion of the vertical member 21 22 is bent to form the fishing portion 27 for the purpose of plating. Fishing Department 27 . The portion 10 is suspended from the conveying device 7 (Fig. 3). Fork cup 72 (refer to the suspension of the struts 72, the vertical members 21, 22! = ^:: is squeezed _ nails 28 fixed. Thus forming the upper extension 29 ° rear _ the degree of the song is equivalent to its thickness, this The substrate 50 can be held under the struts. Moxibustion, the current song, by 099107053 12 201113400 in front of the longitudinal members 21, 22, attached to the base plate, such as, the seat plate 26 is formed into a rectangular strip shape, width The longitudinal member is 22, and the support frame 20 of the present embodiment includes the longitudinal members 21, 22 (the lower ends are connected to each other to the lower portion (four) member 24. The present invention, whether or not the lower cross member μ is used to hold the substrate 50 In the present embodiment, the lower side 54 of the substrate 50 abuts against the front surface of the lower cross member %, but is not sandwiched by the switch frame 30 and the lower cross member 24. Thereby, from the self-plating tank 62 The dripping of the plating solution 6 flowing down from the substrate 50 to be taken out is not hindered by the switch frame 30, and the plating solution 6〇 is not retained in the vicinity of the lower side 54. On the other hand, the plating jig of the present embodiment 10 does not hold the upper side 53' of the substrate 5〇 and does not have a contact with the upper side 53 In order to avoid the horizontal drop of the plating solution from the upper side 53 of the counter substrate 50, the switch frame 30 of the present embodiment is only extended by the vertical positions 33a and 33b extending in the vertical direction. The support frame 20 of the present embodiment is held by the pair of longitudinal members 21 and 22 facing each other, and the upper cross member 23 and the lower cross member 24 are coupled to each other in the left-right direction. The switch frame 30 that can be rotated relative to the support frame 20 and that sandwiches the support frame 50 includes: a pair of longitudinal indexes 33 (33a, 33b) opposite to the longitudinal members 21, 22. And a rotating shaft 32 and a crosspiece 37 that connect the vertical positions 33a and 33b to each other. 099107053 13 201113400 The vertical direction 33 is a cross section perpendicular to the extending direction (up and down direction) and is formed into a "mouth" character (u word). Specifically, the vertical position 33 includes: a pressing plate 34 that is elongated from the base plate 26 of the support frame 20, and a standing plate disposed in the width direction of the pressing plate 34 (Fig. 1(a)) a pair of side plates 35 (35a, 35b) on both sides of the left-right direction. In the present embodiment, The rotating shaft 32 near the lower end of the gear 33 and the crosspiece 37 provided near the upper end are respectively formed in a cylindrical shape. However, the cross-sectional shape of the crosspiece 37 is not particularly limited. The rotating shaft 32 and the crosspiece 37' are tied to the width. The side plate 35 of the direction through the vertical stage 33 is adjacent to the lower end of the vertical member 21, and a bearing 36 that rotatably supports both end portions of the rotary shaft 32 is provided to protrude toward the front side of the plating fixture 10 (to the left in the drawing). On the other hand, the crosspiece 37 is provided to penetrate a total of four side plates 35 (35a, 35b) of the pair of vertical positions 33. Both ends of the crosspiece 37 project toward both outer sides of the vertical position 33. Hooks 25 (25a, 25b) are rotatably provided on both outer sides in the width direction of the longitudinal members 2b. Further, in a state where the switch frame 30 is rotated about the rotary shaft 32 and pressed against the support frame 20, the hook 25 is hooked to the crosspiece 37, whereby the switch frame 30 and the support frame 20 are locked to each other. . The material of the jig for the electric key of the present embodiment is not particularly limited, and a metal material such as stainless steel (SUS) can be typically used. Further, it is possible to form the surface of the tarragon with a base plate 26 or a vertical position 33 which is in contact with the substrate 50 which is immersed in the lightning liquid 60, and the surface of the tarragon may be made non-conductive. In this case, the base plate 26 or the (4) 33 may be made of a non-metallic non-conductive material, or the surface of the metal material may be formed by a non-conductive material such as a sol (S〇l). Insulation. In the support frame 2〇 or at least the switch frame 3〇, a plurality of elastic members 4G are protrudedly provided, and the side edges 51, 52' of the wire 50 of the secret object (4) having H) are respectively outward and downward. Apply energy. The elastic member 4 is protruded from the support frame 20 toward the switch frame 30 or from the switch frame 30 toward the support frame 20. The elastic members 4' may be disposed only on the support frame 20' or may be disposed only on the switch frame %, and may be separately disposed on the two. In the present embodiment, in the %, the yellow plate protruding from the switch frame 30 toward the support frame 20 is exemplified as the elastic member 40. However, the present invention is not limited thereto, and a rod-shaped or spherical member may be used as the elastic member 4''. The secret member 40 is an urging member for applying a predetermined tension to the flexible substrate 5 并 and holding it flat. The substrate 50 is stretched by the elastic member 40 to the support frame 2 or the switch frame 3, whereby slack or wrinkles of the plated substrate 50 can be prevented. Further, according to the plating jig 1 of the present embodiment in which the support member 5 is pressed by the elastic member 40, a plurality of types of the substrates 50 having different thicknesses can be held in common. 099107053 15 201113400 The material of the elastic member 40 is not particularly limited, but a metal material such as stainless steel (sus) is suitably used from the viewpoint of elasticity and durability. Here, the elastic member 4 is made of a conductive material such as a metal material, whereby the elastic member 40 can be used as an electrode in electrolytic plating. That is, on the surface of the substrate 50, an electric ore region formed by an arbitrary pattern is formed in advance by a metal material. On the other hand, the electrode pads which are electrically connected to the plated region are provided along the side edges 51, 52 of the substrate 5, and the elastic member 40 is pressed thereon. Then, the elastic member 4 is energized by the switch frame 3, whereby the substrate 50 is electrolytically plated in the plated region. The electroplating jig includes the first elastic member 41 and the second elastic member 42 as the elastic member 4G, wherein the first elastic member 41 is paired with the pair of vertical projections 33a and 33b toward the both sides 51, 52 of the substrate 50, respectively. Energy is applied upward, and the second elastic member 42 applies energy to the sides of the substrate 5, respectively. Further, as shown in Fig. 2 (8), in the jig for electric money, the first elastic member 41 is disposed above the boundary height BH such that the intermediate height of the support frame 2 or the switch frame 30 is located on the lower side as the boundary height bh. And a second elastic member 42 is disposed below the boundary height. More specifically, in the present embodiment, a lower limit of the middle height of the switch frame 30 based on the rotation axis 32 is defined as a boundary height BH, and a plurality of first elastic members 41 are provided above the boundary height BH. There are a plurality of second elastic members 42. The first elastic member 41 and the second elastic member 42 099107053 16 201113400 are arranged side by side on the pressing plate 34 of the vertical stage 33. Further, the first elastic member 41 is located above the boundary height BH, and means that at least a part of the first elastic member 41 is located above the boundary height. Similarly, the so-called second elastic member 42 is located below the boundary height BH, meaning that at least a portion of the second elastic member 42 is located below the boundary height. As shown in the enlarged view of Fig. 2(b), the first elastic member 41 (elastic member 4) is attached to the pressing plate 34 of the longitudinal groove 33 by a screw 491 and a nut. Fig. 4 (8) is a plan view of the elastic member 40, which is a top view of the standing position. The first and second elastic members 4 are 42-type curved leaf springs, and one of them (the standing piece 43) stands up from the support frame 20 or the switch frame 3〇 toward the outer side in the up-and-down direction. The elastic member 4A (the first elastic member 41 and the second elastic member 42)' of the present embodiment is formed by bending a plate material such as metal into an acute angle at the curved portion 48. The bent piece (standing piece 43) stands obliquely from the pressing plate 34, and the other piece (base piece 44) is provided with a screw hole 49 and is inserted through the screw 491. In the vicinity of the front end portion of the standing piece 43 of the elastic member 40, a pressing point 45 for pressing the held substrate 5 is formed in a projecting manner. Thereby, the elastic force of the curved leaf spring collectively applies energy to the substrate 5''. FIG. 5 is a schematic view showing a state in which the substrate 5 is pressed by the first elastic member 41. The first elastic member 41 of the present embodiment includes a flat extending portion 47 on the end side of the standing piece 43 closer to the pressing point 45. Further, as shown in Fig. 5 099107053 201113400, when the substrate 50 is sandwiched by the support frame 20 and the switch frame 30, the extending portion 47 abuts against the substrate 50 at a pressing point 45 to press the substrate. As shown in Fig. 5(a), when the switch frame 30 is closed with respect to the support frame 20, the extension portion 47 of the front end of the standing piece 43 in the first elastic member 41 first abuts against the substrate 50. In this state, if the switch frame 30 is further closed, the first elastic member 41 is compressed as shown by the arrow in Fig. 5(b), and the bending angle of the standing piece 43 and the base piece 44 is reduced. Thereby, compared with the extending portion 47, the pressing point 45 which is provided to protrude rearward from the standing piece 43 in the vicinity of the curved portion 48 abuts against the substrate 50°, in the state of FIG. 5(b). Further, when the first elastic member 41 is compressed, the pressing point 45 is displaced in the direction of the substantially arc-shaped arrow centering on the curved portion 48. The displacement direction is relative to the front of the switch frame 3〇 and above. Therefore, the concentrated load imparted to the substrate 50 by the pressing point 45 includes the component in the upward direction of the in-plane direction of the substrate 50. Thereby, the first elastic member 4 向上 applies energy upward to the side 51 (or the side 52) of the substrate 50. Further, during the period from Fig. 5 (a) to Fig. 5 (b), the biasing portion 47 of the standing piece 43 exerts an upward force on the substrate 50 for the same reason as described above. Moreover, in the fixture 1 of the electric clock, the flat extension 47 is abutted against the substrate 5 较 before the pressing point 45, so the concentrated load of the pressing point 45 is attached to Before the substrate 50, a predetermined biasing force from the extending portion 47 acts on the substrate 50 to apply tension to the substrate 50. Therefore, in a state in which the substrate 5G provided in the initial state of the support frame 099107053 201113400 20 is loosened, and the extension portion 47 is preliminarily stretched, the pressing point 45 abuts against the substrate 5A. Therefore, the rapid extension of the substrate 50 is suppressed as compared with the case where the substrate 50 is applied with energy from the first pressing point 45, so that the substrate 50 can be prevented from being damaged. Further, in the first elastic member 41, the standing piece 43 extends upward as compared with the curved portion 48. Therefore, the direction of application of the extending portion 47 or the pressing point 45 is directly behind the surface of the substrate 50 and faces upward. On the other hand, regarding the second elastic member 42, as shown in FIG. 2(b), the protruding direction of the standing piece 43 is downward, so that the substrate 5 is provided with a downward composition as opposed to the first elastic member 41. Force. As a result, according to the plating jig 1 of the present embodiment, the substrate 5 can be held by a predetermined tension in a state in which it is extended in the vertical direction. Further, in the present embodiment, the negative focus of the energy applied to the substrate 50 and the negative focus of the downward application of energy are divided into the upper and lower boundary heights BH, which are located below the intermediate height of the support frame 20 or the switch frame 30. As a result, when the various substrates 50 having different heights are held by the jig 10, the respective substrates 50 can be biased upward and downward. In other words, for example, when the boundary height bh is the intermediate height of the switch frame 30, when the substrate 50 having a height of one half or less of the switch frame 30 is held, the upper surface of the substrate 50 cannot be biased by the elastic member 40, thereby It is difficult to sufficiently stretch the substrate 50. In contrast, the electroplating jig 10 of the present embodiment has a height of the middle of the switch frame 30 as the boundary height BH, specifically, the height of the switch of 099107053 19 201113400 As the boundary height BH, the substrate 5 () having a height less than half of the switch frame 30 can be appropriately sandwiched by the jig for electric ore 10 . The switch frame 30 of the present embodiment is rotatable relative to the support frame 20 around the rotating vehicle from the substrate 32. That is, the switch frame 30 is provided with an opening above the support frame 2〇. Moreover, the protruding height of the first elastic member 41 from the support frame 2 〇 or the switch frame 30 is large as compared with the second elastic member 42. In the present embodiment, as shown in Fig. 2 (8), the height of the first elastic member 41 provided on the upper side of the switch frame 3 from the vertical position 33 is larger than the height of the second elastic member 42 protruding from the vertical position 33. Thereby, the switch frame 30 can be closed with respect to the support frame 2, and the time point at which the first elastic member 41 starts to be pressed against the substrate 5〇 and the time when the second elastic member 42 starts to be pressed against the substrate 50 can be made. At the same time. Therefore, the upward biasing force and the downward biasing force on the substrate 50 act on the substrate % at substantially the same time, so that the substrate 50 + is displaced relative to the support frame 2, and the substrate 50 can be subjected to tension. In the jig 10 for electroplating of the present embodiment, the protruding heights of the first elastic members 41 and the second elastic members 42 which are disposed on the upper portion of the switch frame 3〇 are smaller than those disposed in the lower portion. The height of the person. Specifically, in the first (the seven illustrated in FIG. 2(a)), the protrusion height of the first elastic member 41, which is placed on the upper side of the switch frame 30 (four in the figure), 099107053 20 201113400 It is larger than the protruding height of the lower side (three in the figure). The first elastic member 41 is such that the length L2 of the standing base end portion 46 shown in Fig. 4(b) is different from each other. The first elastic member 41 and the second elastic member 42 may be common or different from each other for the length of the base sheet 44 or the length L3' of the extension portion. Further, in the present embodiment, one or both of the first elastic member 41 and the second elastic member 42 may be detachable from the plating jig 1 . Further, the protruding direction of the standing base end portion 46 of the first elastic member 41 or the second elastic member can be made based on the characteristics of the height dimension, the thickness, the material, and the like of the substrate 5G which is processed by the plating core 1 (). Reverse up and down, or replace with other elastic members of different sizes. For example, when the thickness of the substrate 50 is less than or equal to a predetermined value, it may be replaced with the first elastic member 41 or the second elastic member 42. The length L2 of the standing base end portion 46 is shorter, or the spring f of the leaf spring is lower. Elastic member. Therefore, when the substrate 5 is lost by the switch frame 30 and the support frame 2, the tension applied to the in-plane direction of the substrate 50 is alleviated, and the substrate 50 is prevented from being damaged. When the southerness of the landscaping substrate 5 is less than or equal to a predetermined value, a plurality of (four in FIG. 2(8)) second elastic members 42 may be vertically reversed in the upper or lower mounting directions of the second elastic member 42. . Thereby, when the height of the electric fixture 10 is kept higher than that of the (4) substrate 5G, the tension applied to the substrate 5 () can be balanced up and down. Fig. 6 is a perspective view schematically showing a state in which the substrate 50 of the 099107053 21 201113400 is held by the jig for the electric key of the present embodiment. On the jig 10 for electroplating, the substrate 50 is placed in a state in which the adsorption jig 80 is combined from the rear. The adsorption jig 80 includes a flat adsorption surface 82 through which a plurality of suction holes 83 for suctioning the negative pressure are applied, and a segment portion 84 which is provided in a stepped manner on the left and right sides of the adsorption surface 82. The height difference between the suction hole 83 and the segment portion 84 is equal to the thickness of the vertical member 21 or 22 of the plating jig and the base plate 26. Further, the width dimension of the adsorption surface 82 in the left-right direction is slightly smaller than the distance between the vertical member 2^ and the vertical member 22. Further, the height dimension of the upper surface of the adsorption surface 82 is smaller than the minimum interval between the lower cross member 24 and the upper cross member 23. In summary, the adsorption surface 82 of the adsorption jig 80 can be fitted into the inside of the support frame 20 from the rear, and in the state in which the adsorption jig 80 is fitted to the support frame 20, the adsorption surface 82 and the base plate 26 are arranged on the same plane. In this state, the inside of the suction hole 83 is sucked by a blower (not shown), whereby the distributed substrate 5A can be adsorbed and held on the adsorption surface 82 across the pair of base plates 26. Therefore, when the switch frame 30 is closed, even if the operator's hand is separated from the substrate 50, the substrate 50 can be held in a state of being stretched over the support frame 20. Therefore, in particular, when a flexible printed wiring board is used as the substrate 5, even if the substrate 50 does not have form stability in the standing state, 099107053 22 201113400 can also stand in the state of the electric turning fixture 1G. Next, the substrate 5G is placed on the support frame 20. Therefore, in the same manner as in the case of immersing in the plating solution (9), the substrate 50 can be placed under the standing state, and the mounting workability of the substrate 5 can be improved and the working space can be reduced. Further, other suction holes 83 may be provided in the section 84 of the suction jig 8 while a through hole communicating with the other suction holes 83 is provided with respect to the vertical member 2b and the base plate %. Thereby, the suction holding can be performed when the switch frame 30 is closed on both side edges 51, 52 of the substrate 50 and its vicinity. Further, the substrate 50 is held by the switch frame 3A and the support frame 20, and the crosspiece 37 of the switch frame 3 is locked by the hook 25, and then the blower is stopped, so that the plating fixture 10 and the substrate 50 are self-adsorbed. The jig 80 is detached and supplied with a plating process (see Fig. 3). In addition, when the substrate 5 after the plating treatment is removed from the jig 10 for electric mining, the adsorption jig 80 may be combined from the rear with respect to the support frame 20, and the suction hole 83 may be suction-collected by the blower. The operation is performed in a state where the back surface of the substrate 50 is attracted to the adsorption surface 82. Further, in a state where the substrate 50 is attracted to the adsorption surface 82, the hook 25 is removed from the crosspiece 37, and the switch frame 30 is opened from the support frame 20, and the operator can take out the substrate 50. Priority is claimed on the basis of Japanese Patent Application No. 2009-59008, filed on March 12, 2009, the entire disclosure of which is incorporated herein. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1(a) is a front view showing an example of a plating jig according to an embodiment of the present invention, and Fig. 1(b) is a right side view thereof. Fig. 2(a) is a right side view showing the plating jig in a state in which the switch frame is opened with respect to the support frame, and Fig. 2(b) is a partially enlarged view thereof. Fig. 3 is a perspective view for explaining a state of use of a jig for plating in which a substrate is held. Fig. 4(a) is a plan view of the elastic member, and Fig. 4(b) is a standing plan view thereof. Fig. 5 is a schematic view showing a state in which a substrate is pressed by a first elastic member. Fig. 6 is a perspective view schematically showing a state in which a substrate is held by the jig for plating of the embodiment. [Main component symbol description] 10 Electroplating fixture 20 Support frame 21 > 22 Vertical member 23 Upper cross member 24 Lower cross member 25 (25a ' 25b) Fishing 26 (26a, 26b) Base plate 27 Hook portion 28 Screw 29 Above Extension 099107053 24 201113400 30 Switch frame 32 Rotary shaft 33 (33a, 33b) Longitudinal 34 Extruded plate 35 (35a > 35b) Side plate 36 Bearing 37 Crosspiece 40 Elastic member 41 First elastic member 42 Second elastic member 43 Standing piece 44 Base piece 45 Pressing point 46 Standing base end 47 Extension 48 Bending 49 Screw hole 50 Substrate 51 > 52 Side (longitudinal) 53 Upper side 54 Lower side 55 Main surface 099107053 25 201113400 60 Plating solution 62 Plating Slot 70 Transfer device 72 Strut 73 End 74 Retainer 76 Elevator 78 Frame 79 Slide 80 Adsorption fixture 82 Adsorption surface 83 Suction hole 84 Segment 231 Lower edge 232 Vertex 491 Screw 492 Nut B Circle BH Boundary height Li ' L2 ' L3 Length 099107053 26