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TW201003969A - Light emitting diode - Google Patents

Light emitting diode Download PDF

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Publication number
TW201003969A
TW201003969A TW97125343A TW97125343A TW201003969A TW 201003969 A TW201003969 A TW 201003969A TW 97125343 A TW97125343 A TW 97125343A TW 97125343 A TW97125343 A TW 97125343A TW 201003969 A TW201003969 A TW 201003969A
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TW
Taiwan
Prior art keywords
light
emitting diode
emitting
package
recessed
Prior art date
Application number
TW97125343A
Other languages
Chinese (zh)
Inventor
Chia-Shou Chang
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW97125343A priority Critical patent/TW201003969A/en
Publication of TW201003969A publication Critical patent/TW201003969A/en

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Abstract

A light emitting diode (LED) includes an LED chip and an encapsulation. The LED chip is packaged in the encapsulation. The encapsulation includes a top wall and a side wall. The top wall defines a depression in a central portion thereof and a light-emitting portion surrounding the depression. The depression is located at a central axis of the LED chip. The side wall downwardly extends from the circumference of the light-emitting section. The side wall is ladder-shaped and includes a plurality of sidesteps. An area of the cross-section of the side wall decreases downwardly from the top wall.

Description

201003969 九、發明說明: 【發明所屬之技術領域】 本發明涉及一種發光二極體,特別是涉及一種發光二 極體之封裝改良結構。 【先前技術】 發光二極體(Light Emitting Diode,LED)具有環保、 亮度高、省電、壽命長等諸多特點,將漸漸成為主要照明 光源。然,發光二極體之中心軸線區域所發出之光線較為 集中,出光不均勻,這使得照明效果隨照射距離及照明面 積而發生變化。 【發明内容】 鑒於此,有必要提供一種出光均勻之發光二極體。 一種發光二極體,包括一發光二極體晶粒以及包覆於 該發光二極體晶粒週緣之一封裝體,該封裝體包括一頂面 及一側面,該頂面包括一凹陷部及一出光部,該凹陷部正 對發光二極體晶粒之中心轴線設置,該出光部環繞於該凹 陷部之週緣,該側面由出光部之外緣向下延伸形成,該侧 面呈階梯狀,包括複數台階,該側面之橫截面積自頂面向 下減少。 一種發光二極體,包括一發光二極體晶粒以及包覆於 該發光二極體晶粒週緣之一封裝體,該封裝體包括一頂面 及一側面,該頂面正對該發光二極體晶粒之中心軸線位置 6 201003969 設有一凹陷部,該 部,該發光二極體晶粒之週緣形成為出光 後射向物之側面,再經過==凹陷部發生反射 光部,並經由出光部射出封農體。㈣而射向頂面之出 線區光:::均:!光二極體晶粒中心軸 均句分佈。 先線刀佈’使得從封裝體射出之光線 【實施方式】 -二1 所示’發光二極體包括-基板1、-發光 難體3。基板1呈圓形板狀,包括上表 面12’上表面u與下表面以相對設置,基板 之兩端開設有第—導電柱131及第二導電柱132,第一導 電柱131及第二導電柱132分別貫通基板i之上表面^及 表面12基板1之上表面η設有第一内電極I。及第二 内電極112,基板1之下表面12設有第-外電極121及第 二外電極122,第-内電極m及第一外電極121分別位於 第一導電柱131之上下兩端周圍,第一導電柱131將第一 外電極121與第-内電極m電連接,第二内電極ιΐ2及 第二外電極122分別位於第二導電柱132之上下兩端周 圍弟·一導電柱132將第二外電極122與第二内電極U2 電連接。 發光二極體晶粒2固設於基板1之上表面u上且位於 基板1之中心,發光二極體晶粒2包括第一電極21及第二 7 201003969 電極22,第-電極21與基板χ之第一内電極ηι電連接, 第二電極22與基板1之第二内電極112電連接。 封裝體3由透光材料製成,如環氧樹脂、石夕勝、壓克 力等。該封裝體3包覆於發光二極體晶粒2之週緣。該封 裝體3包括-頂面31、-底面33及—侧面%,側面料 接於頂面31與側面32之間,封裝體3之底面33平貼於基 板1之上表面u。㈣31包括一凹陷部311及一出光部 312 ’該ίϋ光部312為圓環形平面,環繞於該凹陷部3ιι之 ,緣,該凹陷部m位於該頂面31之中央處即位於發光二 極體晶粒2之正上方’該凹陷部311為自出光部312之内 緣向封裝體3之中心逐漸凹陷且向外彎曲而成之外幫曲 面。該側面32由出光部3U之外緣向下延伸而成,該侧面 2由頂* 向下漸縮,使該侧自32之橫截面積自頂面3ι =下逐漸減少’該側面32呈階梯狀,包括複數台階%,每 :台階34包括一肩部342及一頭部341,該肩部如為一 2平面’該頸部341自肩冑342之内側向下且向内傾斜 ^ ° _ 32為全反射^ ’側φ 32 _可塗敷反射材料以 日加反射效果,反射材料可採用鋁、水銀及銀等。 封裝體3之凹陷部3η起到發散發光二極體晶粒2中 心輪線區賴糾光線之仙。發光L作時,發光 -極體晶粒2發出光線,發光二極體晶粒2之中心轴線區 域發出之光線射向封裝體3之凹陷部祀,發光二極體晶粒 2中心軸線區域發出之部分光線經由該凹陷部3ιι射出,而 其他大部分光線在凹陷部311之作用下發生全反射,該大 201003969 部分光線發生全反射後射向封裝體3之侧面32,再經過侧 面32之反射而向上射向頂面31之出光部312,並最終經由 出光部312射出封裝體3 ’從而可均衡發光二極體晶粒^ 中心軸線區域與週緣區域之光線分佈,使得從封裝體3射 出之光線均勻分佈。 圖3示出本發明發光二極體照明裝置之又一較佳實施 例’與上一實施例不同之處在於,出光部412為自該凹陷 部411之外緣向外並向下彎曲延伸而成之外彎曲面,凹陷 部411之中央處則開設一自頂面41向下漸縮之盲孔5,該 盲孔5呈圓錐狀或棱錐狀,即沿封裝體4之徑向向内,該 封裝體4之頂面41整體呈外凸之曲面狀,由頂面41之= 緣逐漸向上凸出形成外彎曲面狀之出光部412,再向下滑落 以形成外彎曲面狀之凹陷部411,並於封裝體4之中央處形 成一盲孔5。該盲孔5可增加全反射作用,使得發光二極體 晶粒2中心軸線區域發出之更多光線發生全反射,從而射 向封裝體4之侧面42’在經過侧面42之反射後射向出光部 412,該外彎曲面狀之出光部412起到聚光作用,使得射出 之光線豎直向上射出。 綜上所述’本發明符合發明專利之要件,爰依法提出 專利申請。惟以上所述者僅為本發明之較佳實施例,舉凡 熟悉本案技藝之人士’在爰依本發明精神所作之等效修飾 或變化’皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 9 201003969 圖1為本發明之發光二極體照明裝置之一較佳實施例 之立體示意圖。 圖2為圖1沿Π - Π之剖面示意圖。 圖3為本發明之發光二極體照明裝置之又一較佳實施 例之剖面示意圖。 【主要元件符號說明】 基板 1 上表面 11 下表面 12 第一内電極 111 第二内電極 112 第一外電極 121 第二外電極 122 第一導電柱 131 第二導電柱 132 發光二極體晶粒 2 第一電極 21 第二電極 22 封裝體 3、4 頂面 31、41 凹陷部 311 、411 出光部 312 、412 側面 32、 42台階 34 頸部 341 肩部 342 底面 33 盲孔 5 10201003969 IX. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode, and more particularly to a package-improved structure of a light-emitting diode. [Prior Art] Light Emitting Diode (LED) has many characteristics such as environmental protection, high brightness, power saving and long life, and will gradually become the main illumination source. However, the light emitted by the central axis region of the light-emitting diode is concentrated and the light is uneven, which causes the illumination effect to vary with the illumination distance and the illumination area. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a light-emitting diode having uniform light emission. A light emitting diode comprising a light emitting diode die and a package covering a periphery of the light emitting diode die, the package body comprising a top surface and a side surface, the top surface comprising a recessed portion a light-emitting portion is disposed opposite to a central axis of the light-emitting diode die, and the light-emitting portion surrounds a periphery of the concave portion, and the side surface is formed by extending downward from an outer edge of the light-emitting portion, the side surface being stepped Including a plurality of steps, the cross-sectional area of the side is reduced from the top to the bottom. A light-emitting diode includes a light-emitting diode die and a package covering a periphery of the light-emitting diode die, the package body comprising a top surface and a side surface, the top surface is opposite to the light-emitting diode The central axis position of the polar body grain 6 201003969 is provided with a recessed portion, the peripheral edge of the light-emitting diode crystal grain is formed to be emitted to the side of the object, and then the reflected light portion is generated through the == recessed portion, and The light-emitting part emits the agricultural body. (4) Shooting to the top surface Line:::::: The average axis distribution of the photodiode grain center axis. The first-hand knives ′ make the light emitted from the package [Embodiment] - 2 shows that the 'light-emitting diodes' include the substrate 1 and the luminescent body 3. The substrate 1 has a circular plate shape, and the upper surface of the upper surface 12' is disposed opposite to the lower surface. The two ends of the substrate are provided with a first conductive pillar 131 and a second conductive pillar 132, and the first conductive pillar 131 and the second conductive layer The pillars 132 respectively penetrate the upper surface of the substrate i and the surface 12 of the surface 12 of the substrate 1 are provided with a first internal electrode I. And the second inner electrode 112, the lower surface 12 of the substrate 1 is provided with a first outer electrode 121 and a second outer electrode 122, and the first inner electrode m and the first outer electrode 121 are respectively located around the upper and lower ends of the first conductive pillar 131 The first conductive pillar 131 electrically connects the first outer electrode 121 and the first inner electrode m, and the second inner electrode ι2 and the second outer electrode 122 are respectively located around the upper and lower ends of the second conductive pillar 132. The second outer electrode 122 is electrically connected to the second inner electrode U2. The light emitting diode die 2 is fixed on the upper surface u of the substrate 1 and located at the center of the substrate 1. The light emitting diode die 2 includes the first electrode 21 and the second 7 201003969 electrode 22, and the first electrode 21 and the substrate The first inner electrode ηι is electrically connected, and the second electrode 22 is electrically connected to the second inner electrode 112 of the substrate 1. The package 3 is made of a light transmissive material such as epoxy resin, Shi Xisheng, acrylic, and the like. The package 3 is coated on the periphery of the light-emitting diode die 2. The package body 3 includes a top surface 31, a bottom surface 33, and a side surface. The side surface is connected between the top surface 31 and the side surface 32, and the bottom surface 33 of the package body 3 is flatly attached to the upper surface u of the substrate 1. (4) 31 includes a recessed portion 311 and a light exiting portion 312. The light-emitting portion 312 is an annular plane surrounding the edge of the recessed portion 3, and the recessed portion m is located at the center of the top surface 31, that is, at the light emitting diode Immediately above the bulk crystal grain 2, the recessed portion 311 is gradually recessed from the inner edge of the light-emitting portion 312 toward the center of the package body 3 and is outwardly curved to form a curved outer surface. The side surface 32 is formed by extending the outer edge of the light exit portion 3U downwardly, and the side surface 2 is tapered downward from the top * such that the cross-sectional area of the side 32 is gradually reduced from the top surface 3ι = lower. The shape includes a plurality of steps. Each of the steps 34 includes a shoulder portion 342 and a head portion 341. The shoulder portion is a 2-plane. The neck portion 341 is inclined downward and inward from the inner side of the shoulder blade 342. ^ _ 32 is total reflection ^ 'side φ 32 _ can be coated with reflective material for daily reflection, reflective materials can be aluminum, mercury and silver. The recessed portion 3n of the package 3 serves to diverge the light in the center line of the divergent light-emitting diode die 2. When the illuminating L is performed, the illuminating-pole body 2 emits light, and the light emitted from the central axis region of the illuminating diode die 2 is directed toward the depressed portion of the package 3, and the central axis region of the illuminating diode die 2 Part of the emitted light is emitted through the recessed portion 3, and most of the other light is totally reflected by the recessed portion 311. The large portion of the light of 201003969 is totally reflected and then directed toward the side 32 of the package 3, and then passes through the side 32. The light is emitted upwardly toward the light exit portion 312 of the top surface 31, and finally the package 3' is emitted through the light exit portion 312, so that the light distribution of the central axis region and the peripheral region of the light emitting diode die can be balanced, so as to be emitted from the package 3. The light is evenly distributed. 3 is a view showing a further preferred embodiment of the illuminating diode illuminating device of the present invention, which differs from the previous embodiment in that the light exiting portion 412 is outwardly and downwardly curved from the outer edge of the recessed portion 411. In the outer curved surface, a blind hole 5 which tapers downward from the top surface 41 is formed at the center of the concave portion 411. The blind hole 5 has a conical shape or a pyramid shape, that is, radially inward along the package body 4, The top surface 41 of the package body 4 has a convex curved surface as a whole, and gradually protrudes upward from the edge of the top surface 41 to form an outwardly curved surface light-emitting portion 412, and then slides downward to form an outer curved surface-shaped depressed portion. 411, and a blind hole 5 is formed at the center of the package 4. The blind hole 5 can increase the total reflection effect, so that more light emitted from the central axis region of the light-emitting diode die 2 is totally reflected, so that the side surface 42' that is directed toward the package body 4 is reflected by the side surface 42 and is emitted toward the light. In the portion 412, the outer curved surface portion 412 serves to condense light so that the emitted light is emitted vertically upward. In summary, the invention conforms to the requirements of the invention patent, and the patent application is filed according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS 9 201003969 FIG. 1 is a perspective view of a preferred embodiment of a light-emitting diode lighting device of the present invention. Figure 2 is a schematic cross-sectional view of Figure 1 along the Π - Π. Fig. 3 is a cross-sectional view showing still another preferred embodiment of the light-emitting diode lighting device of the present invention. [Main component symbol description] substrate 1 upper surface 11 lower surface 12 first inner electrode 111 second inner electrode 112 first outer electrode 121 second outer electrode 122 first conductive pillar 131 second conductive pillar 132 light emitting diode crystal grain 2 first electrode 21 second electrode 22 package 3, 4 top surface 31, 41 recessed portion 311, 411 light exit portion 312, 412 side 32, 42 step 34 neck 341 shoulder 342 bottom surface 33 blind hole 5 10

Claims (1)

201003969 十、申請專利範圍 1. 二種發光二極體,包括一發光二極體晶粒以及包覆該 發光二極體晶粒之一封裝體,其改良在於:該封裝體 包括-頂面及-侧面’該頂面包括—凹陷部及一出光 部,該凹陷部正對發光二極體晶粒之中心軸線設置, 該出光部環繞於該凹陷部之週緣,該侧面由出光部之 外緣向下延伸形成,該側面呈階梯狀,包括複數台階, 該側面之橫截面積自頂面向下減少。 2. 根據中請專利範圍第i項所述之發光二極體,其中, 該凹陷部為自該出光部之内緣向封裝體之中心逐漸凹 )½且向外’考曲而成之外彎曲面。 3. 根據中請專利範圍第i項所述之發光二極體,其中, 该出光部為一圓環形平面。 4.根據中請專利範圍第i項所述之發光二極體,其中, 該出光部為自該凹陷之外緣向外並向下彎伸、 之外彎曲面。 ~ IT W 5. 根據中請專利範圍第1項所述之發光:極體,立中, 每:台階包括-頸部及一肩部,該頸部自該肩部之内 側向下且向内傾斜。 6. 根據ΐ請專利範圍第5項所述之發光二極體, 該肩部為一環形平面。 /、 7. 根據申請專圍第1ίΜ所述之發光二極體, =凹陷部之中央處開言卜自頂面向下漸縮之盲孔、,該 目孔位於發光二極體晶粒之正上方。 8. 根據申請專利範圍第7項所述之發光二極體,其中, 11 201003969 該盲孔呈圓錐或棱錐狀。 M艮據中請專利範圍第1項所述之發光二極體,其中, 该側面塗敷反射材料。 二一種發光二極體’包括一發光二極體晶粒以及包覆 =二極體晶粒之一封裝體,其改良在於:該封裝 頂面及-側面’該頂面正對該發光二極體晶 軸線位置設有一凹陷部,該頂面環繞該凹陷 線經由兮形出光部’該發光二極體晶粒發出之光 過側而'"凹陷部發生反射後射向封裝體之側面,再經 出封裝體。 出先邛,並經由出光部射 面積1"頂®6頂面向下呈漸縮延伸,使該側面之橫截 面槓自頂面向下減少。 m據申請專利錢第1G項所述之發光二極體,其 :位:::部之中央處向下開設—漸縮之窗孔,該盲 孔位於發光二極體晶粒之正上方。 1 中3.:據申請專利範圍第10項所述之發光二極體,其 為自該出光部之内緣向封裝體之中心逐 漸凹且向外彎曲而成之外彎曲面。 m申請專利範圍第13項所述之發光二極體,a :面該出光部為一圓環形平面或者為向外突出!外弯 12201003969 X. Patent application scope 1. Two kinds of light-emitting diodes, comprising a light-emitting diode die and a package covering the light-emitting diode die, the improvement is that the package comprises a top surface and a side surface comprising: a recessed portion and a light exiting portion, the recessed portion being disposed opposite a central axis of the light emitting diode die, the light exiting portion surrounding a periphery of the recessed portion, the side surface being surrounded by the outer edge of the light exiting portion Formed downwardly, the side surface is stepped, including a plurality of steps, and the cross-sectional area of the side surface decreases from the top surface to the bottom. 2. The light-emitting diode according to the item [i], wherein the recessed portion is gradually recessed from the inner edge of the light-emitting portion toward the center of the package body and is outwardly curved. Curved surface. 3. The light-emitting diode according to item i of the patent application, wherein the light exiting portion is an annular plane. 4. The light-emitting diode according to the item [i], wherein the light-emitting portion is outwardly and downwardly curved from the outer edge of the recess, and the outer curved surface. ~ IT W 5. Illumination according to item 1 of the scope of the patent application: pole body, center, each: the step includes a neck and a shoulder from the inside of the shoulder downward and inward tilt. 6. The light-emitting diode according to claim 5, wherein the shoulder is an annular plane. /, 7. According to the application of the illuminating diode according to the first , , = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = 发光 发光 发光Above. 8. The light-emitting diode according to claim 7, wherein 11 201003969 the blind hole has a conical or pyramidal shape. The light-emitting diode according to the first aspect of the invention, wherein the side surface is coated with a reflective material. The second light-emitting diode includes a light-emitting diode die and a package of a cladding-diode die, and the improvement is that the top surface of the package and the side surface of the package are opposite to the light-emitting diode The position of the polar body axis is provided with a recessed portion, and the top surface surrounds the recessed line via the 出-shaped light-emitting portion 'the light-emitting side of the light-emitting diode die and the concave portion is reflected and then is incident on the side of the package body Then pass through the package. First, the cross-section bar of the side is reduced from the top to the bottom by the light-emitting area of the area 1" According to the light-emitting diode described in claim 1G, the position of the ::: portion is opened downwardly - a tapered window hole, which is located directly above the crystal grain of the light-emitting diode. The light-emitting diode according to claim 10, wherein the light-emitting diode of the light-emitting portion is gradually recessed from the inner edge of the light-emitting portion and bent outward to form an outer curved surface. m. The light-emitting diode according to Item 13 of the patent application, a: the light-emitting portion is an annular plane or protrudes outward! Outer bend 12
TW97125343A 2008-07-04 2008-07-04 Light emitting diode TW201003969A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104752597A (en) * 2013-12-30 2015-07-01 展晶科技(深圳)有限公司 Light-emitting diode packaging structure and packaging method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104752597A (en) * 2013-12-30 2015-07-01 展晶科技(深圳)有限公司 Light-emitting diode packaging structure and packaging method thereof
CN104752597B (en) * 2013-12-30 2018-09-07 展晶科技(深圳)有限公司 Light-emitting diode encapsulation structure and its packaging method

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