[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

TW200728379A - Resin composition, cured product of the same, and printed circuit board made of the same - Google Patents

Resin composition, cured product of the same, and printed circuit board made of the same

Info

Publication number
TW200728379A
TW200728379A TW095132758A TW95132758A TW200728379A TW 200728379 A TW200728379 A TW 200728379A TW 095132758 A TW095132758 A TW 095132758A TW 95132758 A TW95132758 A TW 95132758A TW 200728379 A TW200728379 A TW 200728379A
Authority
TW
Taiwan
Prior art keywords
resin composition
same
photo
circuit board
printed circuit
Prior art date
Application number
TW095132758A
Other languages
Chinese (zh)
Other versions
TWI333499B (en
Inventor
Yoko Shibazaki
Masao Arima
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200728379A publication Critical patent/TW200728379A/en
Application granted granted Critical
Publication of TWI333499B publication Critical patent/TWI333499B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

This invention provides a photo curable and thermal curable resin composition which owns high photo-polymerization capability by a laser beam of 400~420 nm wavelength into a compound of cured surface ,with sufficient degree of cure at the depth of the cured products together with excellent thermal stability. This invention also provides the cured products of the same and the patterned printed circuit board made of the same. The resin composition comprises (A) a carboxylic acid containing resin, (B) the oxime-based photo-polymerization initiator having oxime group as indicated in general formula (I), (C) an amino acetophenone based photo-polymerization initiator having the structure as indicated in general formula (II), (D) a compound having more than one ethylenic unsaturated group in the molecule, and (E) a blue dye. Moreover, this resin composition can be raster displayed from the reaction of dilute alkaline solution. A coated thin film from this resin composition gives an absorbency of 0.5 ~ 1.2 per 25 μm at the wavelength of 400~420 nm.
TW095132758A 2005-09-06 2006-09-05 Resin composition, cured product of the same, and printed circuit board made of the same TW200728379A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005257525 2005-09-06

Publications (2)

Publication Number Publication Date
TW200728379A true TW200728379A (en) 2007-08-01
TWI333499B TWI333499B (en) 2010-11-21

Family

ID=37858091

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132758A TW200728379A (en) 2005-09-06 2006-09-05 Resin composition, cured product of the same, and printed circuit board made of the same

Country Status (4)

Country Link
JP (1) JP5567543B2 (en)
KR (1) KR100787341B1 (en)
CN (1) CN1927944B (en)
TW (1) TW200728379A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5291893B2 (en) * 2007-05-08 2013-09-18 太陽ホールディングス株式会社 Photocurable resin composition and cured product thereof
JP4663679B2 (en) * 2007-05-08 2011-04-06 太陽ホールディングス株式会社 Photocurable resin composition, dry film, cured product, and printed wiring board
JP4975579B2 (en) * 2007-10-01 2012-07-11 太陽ホールディングス株式会社 Composition, dry film, cured product and printed wiring board
JP5513711B2 (en) * 2007-10-01 2014-06-04 太陽ホールディングス株式会社 Photosensitive resin composition and cured product thereof
JP5376793B2 (en) * 2007-11-07 2013-12-25 太陽ホールディングス株式会社 Photocurable resin composition, cured product pattern thereof, and printed wiring board comprising the cured product pattern
WO2009078407A1 (en) * 2007-12-19 2009-06-25 Toyo Ink Mfg. Co., Ltd. Color composition, method for producing color filter, and color filter
JP5973431B2 (en) * 2011-05-31 2016-08-23 デンカ株式会社 Energy ray curable resin composition
WO2013084283A1 (en) 2011-12-05 2013-06-13 日立化成株式会社 Method for forming protective film for touch panel electrodes, photosensitive resin composition, and photosensitive element
WO2013084282A1 (en) 2011-12-05 2013-06-13 日立化成株式会社 Method for forming resin cured film pattern, photosensitive resin composition, and photosensitive element
JP2014006499A (en) * 2012-05-29 2014-01-16 Taiyo Ink Mfg Ltd Photosensitive composition and print wiring board having cured layer thereof
JP5523642B1 (en) * 2013-07-26 2014-06-18 太陽インキ製造株式会社 Photocurable composition for producing printed wiring board, cured product thereof and printed wiring board
KR101835500B1 (en) * 2014-12-24 2018-03-07 삼성에스디아이 주식회사 Photosensitive resin composition and color filter using the same
JP6783600B2 (en) * 2016-09-20 2020-11-11 太陽インキ製造株式会社 Curable resin composition, dry film, printed wiring board, and method for manufacturing printed wiring board
KR101840584B1 (en) 2017-01-17 2018-03-20 동우 화인켐 주식회사 Colored Photosensitive Resin Composition, Color Filter and Display Device
CN113025202B (en) * 2021-02-25 2022-04-15 长沙市湘鼎涂料有限公司 Acrylic acid modified epoxidized organic silicon photocureable coating and preparation method thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0755925B2 (en) 1986-02-28 1995-06-14 旭化成工業株式会社 Novel oxime ester compound and synthetic method thereof
JPS62286961A (en) 1986-06-05 1987-12-12 Asahi Chem Ind Co Ltd Novel oxime ester compound and production thereof
JP3782134B2 (en) * 1995-07-20 2006-06-07 旭化成エレクトロニクス株式会社 Method for manufacturing printed wiring board
TW494276B (en) * 1999-05-06 2002-07-11 Solar Blak Water Co Ltd Solder resist ink composition
NL1016815C2 (en) * 1999-12-15 2002-05-14 Ciba Sc Holding Ag Oximester photo initiators.
WO2002100903A1 (en) * 2001-06-11 2002-12-19 Ciba Specialty Chemicals Holding Inc. Oxime ester photoinitiators having a combined structure
JP4008273B2 (en) * 2002-03-26 2007-11-14 太陽インキ製造株式会社 Alkali development type photosensitive resin composition and printed wiring board using the same
JP4087650B2 (en) * 2002-07-12 2008-05-21 太陽インキ製造株式会社 Photocurable / thermosetting resin composition and cured product thereof
TW200417294A (en) * 2002-11-28 2004-09-01 Taiyo Ink Mfg Co Ltd Photo- and thermo-setting resin composition and printed wiring boards made by using the same
JP4437651B2 (en) * 2003-08-28 2010-03-24 新日鐵化学株式会社 Photosensitive resin composition and color filter using the same
JP4489566B2 (en) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 Curable resin composition, cured product thereof, and printed wiring board
JP2005221739A (en) * 2004-02-05 2005-08-18 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element obtained by using same, method for producing photoresist pattern and method for producing printed wiring board
JP2005232195A (en) * 2004-02-05 2005-09-02 Taiyo Ink Mfg Ltd Thermosetting resin composition and its cured coating film

Also Published As

Publication number Publication date
JP5567543B2 (en) 2014-08-06
KR20070027459A (en) 2007-03-09
KR100787341B1 (en) 2007-12-18
TWI333499B (en) 2010-11-21
JP2012103703A (en) 2012-05-31
CN1927944A (en) 2007-03-14
CN1927944B (en) 2010-05-12

Similar Documents

Publication Publication Date Title
TW200728379A (en) Resin composition, cured product of the same, and printed circuit board made of the same
HK1091907A1 (en) Radiation curable compositions
JP5643163B2 (en) Active energy ray-curable composition and cured product thereof
KR101487789B1 (en) Inkjet ink
WO2007121110A3 (en) Flooring substrate having a coating of a curable composition
WO2006099168A3 (en) Polymerizable compositions comprising nanoparticles
JP2009040880A (en) Photocurable type ink composition set, inkjet recording method and recorded material
TW200720845A (en) Black paste composition, method for black matrix pattern formation using the same, and its black matrix pattern
TWI622857B (en) Photo-curable inkjet ink, cured film,microlens, optical component and liquid crystal display
WO2008108390A1 (en) Photocurable composition and cured product using the same
WO2008103776A3 (en) Thermally cured underlayer for lithographic application
TW201202358A (en) Pattern-forming ink composition, light-guide plate, light-emitting unit, and liquid crystal display element containing the light-emitting unit
JP5697977B2 (en) Heat resistant anaerobically curable composition
TWI585167B (en) Photo-curable ink-jet ink, liquid-repellent cured film, laminated body, optical component and video display device
TW200643040A (en) Liquid curable composition, cured film, and antistatic layered product
CN105210174A (en) Imprint material
DE60328088D1 (en) RESINATE FROM MONOMER FATTY ACIDS
KR20210068387A (en) Dialkyl peroxide having a thioxanthone skeleton, and polymerizable composition containing the compound
ATE332934T1 (en) COATING COMPOSITION CONTAINING HYDROXYLAMINE ESTER
TW200624485A (en) Curable liquid composition, cured film, and antistatic laminate
JP2013203830A (en) Curable inkjet solventless ink composition
CN116806326A (en) Photosensitive resin composition, cured product, partition wall, organic electroluminescent element, color filter, and image display device
TW201222152A (en) Active energy ray-curable resin composition for forming pattern on light guiding plate
TW200832065A (en) Polymerizable resin composition
TWI656163B (en) Liquid solder resist composition and coated printed wiring board (2)