[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

TW200538502A - Halogen free ignition resistant thermoplastic resin compositions - Google Patents

Halogen free ignition resistant thermoplastic resin compositions Download PDF

Info

Publication number
TW200538502A
TW200538502A TW93114090A TW93114090A TW200538502A TW 200538502 A TW200538502 A TW 200538502A TW 93114090 A TW93114090 A TW 93114090A TW 93114090 A TW93114090 A TW 93114090A TW 200538502 A TW200538502 A TW 200538502A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
weight
polymer composition
halogen
retardant polymer
Prior art date
Application number
TW93114090A
Other languages
Chinese (zh)
Inventor
Joseph Gan
Bruce A King
Jose M Rego
Chris G Youngson
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Priority to TW93114090A priority Critical patent/TW200538502A/en
Publication of TW200538502A publication Critical patent/TW200538502A/en

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention is a halogen-free ignition resistant polymer composition comprising: (A) a thermoplastic polymer or polymer blend, (B) a modified multi-functional epoxy resin containing from 0-20 wt. percent residual epoxy groups, based on the total weight of the epoxy resin, and (C) a phosphorus containing compound. The use of a modified multifunctional epoxy compound having from 0-20 weight percent residual epoxy groups, enhances the flame retardancy of the thermoplastic polymer, and can increase the compatibility of the epoxy resin with the thermoplastic polymer through the use of the modified functionalities, without causing black specks in the final product. It has been additionally discovered that modified multi-functional epoxy resins can also contribute to improved mechanical properties, melt flow rate and processability.

Description

200538502 玖、發明說明: 【發明所廣i技術領域】 本發明係有關於未使用含鹵素之化合物而能展現阻燃 性之熱塑性聚合物組成物。 5 【先前技術】 阻燃性聚合物典型上使用含鹵素之化合物提供阻燃 性。但是,於阻燃性聚合物市場已增加不含鹵素之組成物 之需求。聚苯撐基醚樹脂及三苯基膦化氧之混合物亦已被 作為阻燃性組份,如Haaf等人於美國專利第4,107,232號案 10 所揭示。但是,此等組成物由於高分子量之聚苯撐基醚樹 脂之存在而具有高黏度,使其難以經由擠塑或注出成型設 備處理。200538502 发明 Description of the invention: [Technical Field of the Invention] The present invention relates to a thermoplastic polymer composition capable of exhibiting flame retardancy without using a halogen-containing compound. 5 [Prior art] Flame-retardant polymers typically use halogen-containing compounds to provide flame retardancy. However, the demand for halogen-free compositions has increased in the flame-retardant polymer market. Mixtures of polyphenylene ether resin and triphenylphosphine oxide have also been used as flame retardant components, as disclosed by Haaf et al. In U.S. Patent No. 4,107,232. However, these compositions have high viscosity due to the presence of high molecular weight polyphenylene ether resins, making them difficult to handle through extrusion or injection molding equipment.

已提議於熱固性環氧樹脂組成物中使用以磷為主之阻 燃劑替代鹵化阻燃劑,例如,於EP A 0384939,EP A 15 0384940, EP A 0408990, DE A 4308184, DE A 4308185, DE A 4308187, WO A 96/07685,及WO A 96/07686案中所述。於 此等組成物,磷阻燃劑係以環氧樹脂預處理形成二-或多官 能性之壤乳樹爿曰’然後以胺基交聯劑(諸如,二氰基二酸 胺、磺胺,或某些其它含氮元素之交聯劑)固化形成網絡。 20但是,此等組成物係熱固性,其不能被用於射出成型應用。 JP2001 -49096案揭示一種聚酯樹脂、笨乙烯樹脂(例如, HIPS),及與芳香族環氧樹脂組合之阻燃劑(例如,含碟化 合物)之阻燃性樹脂組成物。jP2〇〇〇_239543案揭示一種阻 燃性樹脂組成物,其包含熱塑性樹脂及與聚芳基化物或芳 200538502 香族環氧樹脂結合之含磷化合物。於Polymer 43(2002) 2249-2253之”ABS之熱安定化促進研究;藉由三苯基磷酸酯 及環氧樹脂之混合物之協合效果’’(“Studies on the thermal stabilization enhancement of ABS; synergistic effect by 5 triphenyl phosphate and epoxy resin mixtures),含有各種環 氧樹脂與三苯基磷酸酯共阻燃劑之ABS組成物被探討。 但是’於上述組成物中使用之環氧樹脂含有高含量之反應 性環氧基’其於聚合物處理期間反應,於完成產品中造成 黑色斑點。 因此’仍需求提供一種能克服習知技藝缺點之可用於 射出成型應用、具良好阻燃性及耐熱性之不含鹵素之熱塑 性聚合物組成物。 C 明内^^】 本發明係有關於一種不含鹵素之阻燃性熱塑性聚合物 15 組成物,包含: A) 熱塑性之聚合物或聚合物摻合物;及 B) 經改質之多官能性環氧樹脂,其含有0-20重量%之 殘餘%、氧基’其係以環氧樹脂總重量為基準計;及 C) 含磷之化合物。 20 本發明之另一實施例係一種不含i素之阻燃性聚合物 級成物,包含: A) 40至94重量%(以組成物總重量為基準計)熱塑性聚 合物’選擇性地與1〇-35重量%(以組成物總重量為基準計) 之聚笨撐鱗聚合物(諸如,聚苯撐化氧(PP0))摻合, 200538502 b) 1至30重量%(以組成物總重量為基準計)之經改質 曰夕g把性%氧樹脂,其含有0_20重量%(以環氧樹脂總重 里為基準計)之殘餘環氧基;及 C) 5至30重量%(以組成物總重量為基準計)之磷化合 5物(諸如,芳基磷酸酯)。 使用具0-20重量%殘餘環氧基之經改質之多官能性環 氧化物促進熱塑性聚合物之阻燃性,且可經由使用經改質 之B犯性增加環氧樹脂與熱塑性聚合物之相容性,且不會 於最終產品中造成黑色斑點。另外發現經改質之多官能性 環氧樹脂亦有助於改良之機械性質、熔融流速率及加工處 理性。 不含鹵素之阻燃性聚合物組成物之組份(A)係熱塑性 聚合物或聚合物摻合物。典型之熱塑性聚合物不受限地包 含乙烯基芳香族單體及其氫化型式(包含二烯及芳香族氫 化型式)製得之聚合物,諸如,苯乙烯-丁二稀之篏段共聚 物、聚苯乙稀(包含高衝擊性聚苯乙烯)、丙歸猜_ 丁二烯_苯 乙烯(ABS)共聚物,及苯乙烯-丙烯腈共聚物(SAN);聚碳 酸酯(PC)、ABS/PC組成物、聚對苯二甲酸乙二醋、環氧 樹脂、羥基苯氧基醚聚合物(PHE),諸如,於美國專利第 20 5,275,853;5,496,910;3,305,528所教示者,乙稀乙烯基醇共 聚物、乙烯丙稀酸共聚物、聚稀烴一氧化碳異種共聚物、 聚烯烴、環狀烯烴共聚物(COC)、其它烯烴之共聚物(特別 是聚乙稀共聚物)及同聚物(例如,使用傳統非均質催化劑製 得者)、聚苯撐基醚聚合物(PPO)及其等之任何混合物或換 200538502 合物。 熱塑性聚合物及製造方法係熟習此項技藝者已知。 於一實施例,熱塑性聚合物係橡膠改質之單乙烯叉基 芳香族聚合物,其係藉由於溶解之彈性體或橡膠存在中使 5 乙烯基芳香族單體聚合而製得。乙烯基芳香族單體不受限 地包含美國專利第4,666,987,4,572,819及4,585,825號案中 所述者。較佳地,單體係具如下化學式: 其中,R係氫或甲基,Ar係具有1至3個具有或不具有烷基、 鹵基或i烷基取代之芳香族環之芳香族環結構,其中,任 15何烷基含有1至6個碳原子,且i烷基係指以i基取代之烷 基。較佳地,Ar係苯基或烷基苯基,其中,烷基苯基係指 以烷基取代之苯基,且苯基係最佳。可被使用之典型乙烯 基芳香族單體包含:笨乙稀、甲基苯乙稀、乙稀基甲苯 之所有異構物,特別是對乙烯基甲苯,乙基苯乙烯、丙基 20苯乙稀、乙烯基聯笨、乙稀基萘、乙烯基蒽之所有異構物, 及其等之此合物。乙烯基芳香族單體亦可與其它可共聚合 單體混合。此等單體之例子不受限地包含丙烯系單體,諸 如,丙烯腈、甲基丙烯腈、曱基丙烯酸、甲基丙烯酸甲酯、 丙稀酸,及丙稀酸甲醋;馬來醯亞胺、苯基馬來酿亞胺, 25 及馬來酸酐。 用以製造橡膠改質之單乙烯叉基芳香族聚合物之橡膠 200538502 可為會促進單乙烯叉基芳香族聚合物之衝擊性質之任何橡 膠,包含任何分子結構,諸如,線性、分枝、星狀分枝, 5 10 15 及同-及共-聚物之二烯橡膠、嵌段橡膠、官能化橡膠 '低順 式、咼順式之橡膠,及其等之混合物。較佳被使用之彈性 體或橡膠係展現不鬲於0°c,較佳係不高於20°C,且更佳係 不高於40°C,之第二級轉變溫度(使用傳統技術決定或估 計,例如,ASTM測試方52 τ)之聚合物及共聚物。 橡膠典型上係以使以橡膠強化之聚合物產物含有3(較 佳係4,更佳係5,且最佳係6)至2〇(較佳係切,更佳係托,且 最佳係14)重《%之橡膠(其係以乙烯基芳香族單體及橡膠 組份之總4量為絲計,以橡膠紐科化辣之量使 用。“橡膠”或“橡膠等化物”於此被使用時係指,對於橡膠 同聚物,諸如’聚了H簡單地為橡膠之量,且對於 喪段共聚物,自當同聚合時形成橡膠聚合物之單體所組成 之共聚物之ϊ ’諸如’對於丁二稀_苯乙烯喪段共聚物,係 欲段共聚物之丁 一缔組份之量。 橡勝係以個別之橡膠顆粒存在於單乙烯叉基芳香族聚 合物基質内’且可具有任何型式,包含單峰型、雙峰型或 多峰型之顆粒尺持佈及顆粒尺寸,及任何型態,包含多 孔、芯殼’及羊i皮’與其等之任何混合。 使乙烯基芳香族單體▼人夕取人 平股♦ 口之水合反應方法及處理條 件,其以橡膠改質之聚人$ 剩、生 口 之衣及用以製造所欲平均顆 粒尺寸所需之條件係孰習士卜想姑藐. …、白此項技蟄者所知。雖然任何聚合 反應方法可被使用, 典型之方法係連續式本體或溶液聚合 20 200538502 反應,如US-A-2,727,884及US-A-3,639,372中所述。乙烯基 芳香族單體之聚合反應係於預溶彈性體存在中進行’以製 造衝擊改質,或接枝之含橡膠產物,其例孑係描述於 US-A-3,123,655, US-A-3,346,520, US-A-3,639,522,及 5 US-A-4,409,369號案。橡膠典型上係丁二烯或異戊間二烯橡 膠,較佳係聚丁二稀。較佳地,以橡膠改質之乙稀基芳香 族聚合物係高衝擊聚苯乙烯(HIPS)或丙烯腈-丁二烯-笨乙 烯(ABS),且HIPS係最佳。 熱塑性聚合物或聚合物摻合物(A)係以至少40重量份 10.(較佳係至少50重量份.,較佳係至少55重量份,更佳係至少 60重量份,且最佳係至少65重量份,以100重量份之本發明 之不含li素之阻燃性聚合物組成物為基準計)之量用於本 發明之不含i素之阻燃性聚合物組成物。一般,熱塑性聚 合物組份(A)係以少於或等於94重量份(較佳係少於或等於 15 80重量份,其係以100重量份之本發明之不含鹵素之阻燃性 聚合物組成物為基準計)之量使用。 於一實施例,本發明之組成物包含一熱塑性聚合物及 一另外之熱塑性聚合物(諸如,聚苯撐醚)之熱塑性摻合 物。聚苯撐醚係藉由各種催化及未催化之方法自相對應之 20 酚或其反應性衍生物製得。舉例而言,某些聚苯撐醚係揭 示於美國專利第3,306,874及3,306,875號案,及Stamatoff之 美國專利第3,257,357及3,257,358號案。於Hay之專利,聚苯 撐醚係藉由包含使含氧之氣體通過酚及金屬·胺錯合物催 化劑之反應溶液之氧化偶合反應製得。其它有關於製造聚 10 200538502 笨撐醚樹脂(包含聚苯撐醚與苯乙烯型化合物之接枝共聚 物)之方法之揭示内容係發現於Fox之美國專利第3,356,761 號案;Sumitomo之英國專利第1,291,609號案;Bussink等人 之美國專利第3,337,499號案;Blanchard等人之美國專利第 5 3,219,626號案;Laakso等人之美國專利第3,342,892號案;It has been proposed to use phosphorus-based flame retardants instead of halogenated flame retardants in thermosetting epoxy resin compositions, for example, in EP A 0384939, EP A 15 0384940, EP A 0408990, DE A 4308184, DE A 4308185, DE A 4308187, WO A 96/07685, and WO A 96/07686. In these compositions, the phosphorus flame retardant is pre-treated with epoxy resin to form a bi- or polyfunctional soil milkweed 然后 and then an amine-based cross-linking agent (such as dicyanodiamide, sulfa, Or some other nitrogen-containing cross-linking agent) curing to form a network. 20 However, these compositions are thermosetting and cannot be used for injection molding applications. JP2001-49096 discloses a flame-retardant resin composition of a polyester resin, a stupid vinyl resin (for example, HIPS), and a flame retardant (for example, a dish-containing compound) combined with an aromatic epoxy resin. The jP2000-239543 case discloses a flame-retardant resin composition comprising a thermoplastic resin and a phosphorus-containing compound combined with a polyarylate or aromatic 200538502 aromatic epoxy resin. Polymer 43 (2002) 2249-2253, "Studies on the thermal stabilization enhancement of ABS; synergistic" effect by 5 triphenyl phosphate and epoxy resin mixtures), ABS composition containing various flame retardants of epoxy resin and triphenyl phosphate is investigated. However, 'the epoxy resin used in the above composition contains a high content of reactive epoxy groups' which reacts during the polymer treatment, causing black spots in the finished product. Therefore, there is still a need to provide a halogen-free thermoplastic polymer composition which can be used for injection molding applications, has good flame retardancy and heat resistance, which can overcome the shortcomings of conventional techniques. C Ming Nai ^^ The present invention relates to a halogen-free flame retardant thermoplastic polymer 15 composition, including: A) a thermoplastic polymer or polymer blend; and B) modified polyfunctional -Based epoxy resin, which contains a residual% of 0-20% by weight, oxygen based on the total weight of the epoxy resin; and C) a compound containing phosphorus. 20 Another embodiment of the present invention is a flame retardant polymer-grade product containing no element I, comprising: A) 40 to 94% by weight (based on the total weight of the composition) of a thermoplastic polymer Blended with 10-35% by weight (based on the total weight of the composition) of a polybenzyl scale polymer (such as polyphenylene oxide (PP0)), 200538502 b) 1 to 30% by weight (based on composition (Based on the total weight of the material) based on the modified yttrium% oxygen resin, which contains 0-20% by weight (based on the total weight of the epoxy resin) of residual epoxy groups; and C) 5 to 30% by weight Phosphorus compound (such as aryl phosphate) based on the total weight of the composition. The use of modified polyfunctional epoxides with 0-20% by weight of residual epoxy groups promotes the flame retardancy of thermoplastic polymers, and the use of modified B can increase the epoxy resin and thermoplastic polymers. Compatibility, and will not cause black spots in the final product. It has also been found that modified polyfunctional epoxy resins also contribute to improved mechanical properties, melt flow rates, and processing properties. Component (A) of the halogen-free flame-retardant polymer composition is a thermoplastic polymer or a polymer blend. Typical thermoplastic polymers include, without limitation, polymers made from vinyl aromatic monomers and their hydrogenated forms (including dienes and aromatic hydrogenated forms), such as styrene-butadiene fluorene copolymers, Polystyrene (including high-impact polystyrene), Acrylic acid_butadiene_styrene (ABS) copolymer, and styrene-acrylonitrile copolymer (SAN); Polycarbonate (PC), ABS / PC composition, polyethylene terephthalate, epoxy resin, hydroxyphenoxy ether polymer (PHE), such as taught by U.S. Patent Nos. 20,275,853; 5,496,910; 3,305,528, vinyl alcohol Copolymers, ethylene acrylic acid copolymers, paraffin carbon monoxide heteropolymers, polyolefins, cyclic olefin copolymers (COC), copolymers of other olefins (especially polyethylene copolymers), and homopolymers (such as , Using traditional heterogeneous catalysts), polyphenylene ether polymer (PPO) and any mixtures thereof or 200538502 compounds. Thermoplastic polymers and methods of manufacture are known to those skilled in the art. In one embodiment, the thermoplastic polymer is a rubber-modified monovinylidene aromatic polymer, which is prepared by polymerizing a 5 vinyl aromatic monomer due to the presence of a dissolved elastomer or rubber. Vinyl aromatic monomers include, without limitation, those described in U.S. Patent Nos. 4,666,987, 4,572,819, and 4,585,825. Preferably, the single system has the following chemical formula: wherein R is hydrogen or methyl, and Ar is an aromatic ring structure having 1 to 3 aromatic rings with or without alkyl, halo or i alkyl substitution. Wherein any 15 alkyl group contains 1 to 6 carbon atoms, and the i alkyl group refers to an alkyl group substituted with an i group. Preferably, Ar is phenyl or alkylphenyl, of which alkylphenyl means phenyl substituted with alkyl, and phenyl is most preferred. Typical vinyl aromatic monomers that can be used include: all isomers of styrene, methylstyrene, ethyltoluene, especially p-toluene, ethylstyrene, propyl 20 styrene All isomers of dilute, vinylbiben, vinylnaphthalene, vinylanthracene, and the like. Vinyl aromatic monomers can also be mixed with other copolymerizable monomers. Examples of such monomers include without limitation acrylic monomers, such as acrylonitrile, methacrylonitrile, methacrylic acid, methyl methacrylate, acrylic acid, and methyl acetate; maleic acid Imine, phenylmaleimide, 25 and maleic anhydride. Rubber used to make rubber modified monovinylidene aromatic polymers 200538502 Any rubber that can promote the impact properties of monovinylidene aromatic polymers, including any molecular structure, such as linear, branched, star Branching, 5 10 15 and iso- and co-polymer diene rubber, block rubber, functional rubber 'low-cis, cis-cis rubber, and mixtures thereof. The preferred elastomer or rubber system exhibits a temperature of no less than 0 ° C, preferably no higher than 20 ° C, and more preferably no higher than 40 ° C. The second-stage transition temperature (determined using traditional techniques Or estimate, for example, polymers and copolymers of ASTM Test Method 52 τ). Rubber is typically formulated so that the rubber-reinforced polymer product contains 3 (preferred system 4, more preferred system 5, and optimal system 6) to 20 (preferred system cut, better system support, and optimal system). 14) The weight of "% of rubber (which is based on the total amount of vinyl aromatic monomers and rubber components of 4 as silk, used as the amount of rubber Nucor's spicy." Rubber "or" rubber equivalent "here When used, it means that for rubber homopolymers, such as' polymerized H is simply the amount of rubber, and for funnel copolymers, it is a copolymer consisting of monomers that form rubber polymers when homopolymerized. 'Such as' For succinic styrene copolymer, the amount of succinic component of the desired copolymer. Oak Rubber is present as individual rubber particles in the monovinylidene aromatic polymer matrix' And it can have any type, including unimodal, bimodal or multimodal particle ruler cloth and particle size, and any type, including porous, core-shell, and sheep skin, and any mixture of them. Vinyl aromatic monomers ▼ Renxi take people flat shares ♦ mouth hydration reaction methods and processing conditions, which are based on The rubber-refined gatherer's leftovers, the raw clothing, and the conditions required to make the desired average particle size are known to those skilled in the art.…, Know to those skilled in the art. Although any polymerization reaction Methods can be used, typical methods are continuous bulk or solution polymerization 20 200538502 reaction, as described in US-A-2,727,884 and US-A-3,639,372. The polymerization of vinyl aromatic monomers is based on pre-dissolved elastomers Existence is carried out to produce impact-modified, or grafted rubber-containing products, examples of which are described in US-A-3,123,655, US-A-3,346,520, US-A-3,639,522, and 5 US-A- No. 4,409,369. The rubber is typically a butadiene or isoprene rubber, preferably polybutadiene. Preferably, the rubber-modified vinyl aromatic polymer is a high impact polystyrene ( (HIPS) or acrylonitrile-butadiene-benzyl ethylene (ABS), and HIPS is the best. The thermoplastic polymer or polymer blend (A) is at least 40 parts by weight 10. (preferably at least 50 parts by weight ., Preferably at least 55 parts by weight, more preferably at least 60 parts by weight, and most preferably at least 65 parts by weight, based on 100 parts by weight The amount of the invention-free flame retardant polymer composition based on Li) is used in the present invention as the content of I-free flame retardant polymer composition. Generally, the thermoplastic polymer component (A) is based on It is used in an amount of less than or equal to 94 parts by weight (preferably less than or equal to 15 to 80 parts by weight based on 100 parts by weight of the halogen-free flame-retardant polymer composition of the present invention). In one embodiment, the composition of the present invention comprises a thermoplastic polymer and a thermoplastic blend of another thermoplastic polymer such as polyphenylene ether. Polyphenylene ether is self-catalyzed by various catalyzed and uncatalyzed methods Corresponding to 20 phenol or its reactive derivative. For example, certain polyphenylene ethers are disclosed in U.S. Patent Nos. 3,306,874 and 3,306,875, and U.S. Patent Nos. 3,257,357 and 3,257,358 to Stamatoff. In Hay's patent, polyphenylene ether is produced by an oxidative coupling reaction comprising a reaction solution containing a phenol and a metal-amine complex catalyst. Other disclosures of methods for making poly 10 200538502 polyphenylene ether resins (including graft copolymers of polyphenylene ether and styrenic compounds) are found in US Patent No. 3,356,761 to Fox; US Patent No. 3 to Sumitomo No. 1,291,609; U.S. Patent No. 3,337,499 to Bussink et al .; U.S. Patent No. 5 3,219,626 to Blanchard et al .; U.S. Patent No. 3,342,892 to Laakso et al .;

Borman之美國專利第3,344,166號案;Hod等人之美國專利 第3,384,619號案;Faurote等人之美國專利第3,440,217號 案;且有關於以金屬為主之催化劑(其不含胺)之揭示内容可 由諸如下述之專利案得知,諸如,Wieden等人之美國專利 10第3,442,885號案(銅"·脒);Nakashio等人之美國專利第 3,5?3,257號案(金屬醇鹽或盼鹽);Kobayashi等人之美國專 利弟3,455,880號案(銘螯合物)。於stamat〇ff之專利案,聚苯 撐醚係藉由使相對應之酚鹽離子與起始劑(諸如,過氧酸 鹽、酸過氧化物,及次_酸鹽)於錯合劑存在中反應而製 15得。有關於非催化方法(諸如,與二氧化雜、氧化銀等之氧 化反應)之揭示係描述%Price等人之美國專利第3,382,212 號案。Cizek等人之美國專利第3,383,435號案揭示聚苯樓鍵 •苯乙烯樹脂組成物。 聚苯撐醚樹脂較佳係具如下重複結構化學式之型式: 11 200538502Borman U.S. Patent No. 3,344,166; Hod et al. U.S. Patent No. 3,384,619; Faurote et al. U.S. Patent No. 3,440,217; and disclosures on metal-based catalysts (which do not contain amines) The content can be known from patents such as U.S. Patent No. 3,442,885 (copper " 铜) by Wieden et al .; U.S. Patent No. 3,5? 3,257 (metal alkoxide) by Nakashio et al. Or salt); Kobayashi et al. US Patent No. 3,455,880 (Ming Chelate). In the patent of Stamatoff, polyphenylene ethers are based on the presence of corresponding phenate ions and initiators (such as peroxyacids, acid peroxides, and hypoacids) in the presence of a complexing agent. 15 was obtained by the reaction. Disclosures related to non-catalytic methods (such as oxidation reactions with heterodioxide, silver oxide, etc.) are described in US Patent No. 3,382,212 to% Price et al. U.S. Patent No. 3,383,435 to Cizek et al. Discloses a polystyrene bond. A styrene resin composition. The polyphenylene ether resin preferably has the following repeating structural chemical formula: 11 200538502

其中,一單元之氧醚原子係連接至下一鄰接單元之苯核,n 係正整數且係至少50,且每一 (^係選自氫、鹵素、無三級“ 碳原子之烴基、於鹵素原子及苯基核間具有至少二個碳原 5 子之鹵烴基、烴氧基及具有至少二個碳原子之_烴氧基所 組成族群之單價取代基。較佳之聚苯撐醚樹脂係聚(2,6_二 曱基-1,4-笨撐基)醚樹脂。 當與另一熱塑性聚合物結合使用時,聚苯撐醚樹脂較 佳係以至少10重量份(較佳係至少12重量份,更佳係至少15 1〇重量份,且最佳係至少18重量份)且最高達35重量份(較佳係 最高達30重量份,更佳係最高達28重量份,更佳係最高達 25重量份,其係以1〇〇重量份之本發明之不含_素之阻燃性 聚合物組成物為基準計)之量用於本發明之不含_素之阻 燃性聚合物組成物。熱塑性及聚笨樓醚之聚合物可於併納 15 於本發明組成物内之前以摻合物製造,或每一聚合物可個 別被併納。 本發明之不含ii素之阻燃性聚合物組成物中之組份 係經改質之多官能性環氧樹脂。經改質之多官能性環氧樹 脂係起始具有至少二個環氧基之環氧樹脂,其已與至少一 12 200538502 能與環氧基反應之化合物(其後稱為改質劑)反應,如此,起 始環氧基之數量被降低且以改質劑化合物之官能性取代。 改質劑亦可被選擇以增加經改質之多官能性環氧樹脂與熱 塑性聚合物或摻合物之相容性。經改質之多官能性環氧樹 月曰係知生自未鹵素化之多官能性環氧樹脂,或實質上無鹵 素之多官能性環氧樹赌。”實f上無_素,,之樹脂係意指 此樹脂係完全無函素,即,0%之由素,或此樹脂含有不合 ,樹脂之性質或性能且對樹脂無不利之一些微量齡: 10 某些多官能性環氧樹脂,可具有非常小量之自製 氧_2^素雜質° —航’用於本發明之多宫能性環 =糸起始(與改質劑化合物反應前)每一分子平 夕於1(較佳係至少J 8, 氧美之㈣ K健W,且最佳❹於3)個環 虱基之材科。於改質劑化合物盥 後,形成之產物(經改質之多州氧樹脂反應 重衫之_彻,^;:=舞^含有娜 從2,且更佳#3 5ί 〇(一般係從卜較佳係 小 至少於15,較佳係少於12,且w土從 夕於10)重量%之殘餘 、 更么係 氧樹脂之總*量為基二經改質之多輸環 20 墙可為任何飽和或不餘和之脂族多宫能性環氧樹 之化合物,爱#自^ 衣月日無、芳香族或雜環 生。 具有夕於〜個U環氧基之環氧樹脂衍 可被”料本發明組⑽之 包έ環氧線型酚醛樹脂(諸如 ^夕s月匕性%虱樹脂 439,其係陶氏化學公司之商\,ϋ·Ε·Ν·ΤΜ 43δ^·Ε·Ν, ° 。名且可自其購得);二環戊 13 200538502 二烯酚環氧線型酚醛樹脂;環氧化之雙酚-A線型酚醛樹 月旨、環氧化之甲酚線型酚醛樹脂,或於U.S· 5,405,931 ; U.S· 6,291,627 及 U.S· 6,486,242 與 WO 99/00451 中發現之其它 者。 5 環氧線型酚醛樹脂(有時稱為環氧化之線型酚醛樹 脂,用以包含環氧酚線型酚醛樹脂及環氧甲醛線型酚醛樹 脂之用辭)具有下列一般化學結構化學式:Among them, one unit of the oxygen ether atom is connected to the benzene nucleus of the next adjacent unit, n is a positive integer and is at least 50, and each (^ is selected from hydrogen, halogen, a hydrocarbon group without a third-order "carbon atom, A monovalent substituent of a group consisting of a halohydrocarbyl group having at least two carbon atoms, a alkoxy group, and a _alkoxy group having at least two carbon atoms between a halogen atom and a phenyl core. A preferred polyphenylene ether resin system Poly (2,6-difluorenyl-1,4-benzylidene) ether resin. When used in combination with another thermoplastic polymer, the polyphenylene ether resin is preferably at least 10 parts by weight (preferably at least 12 parts by weight, more preferably at least 15 10 parts by weight, and most preferably at least 18 parts by weight) and up to 35 parts by weight (preferably up to 30 parts by weight, more preferably up to 28 parts by weight, more preferably It is up to 25 parts by weight, which is based on 100 parts by weight of the non-flammable flame-retardant polymer composition of the present invention as a basis) for the non-flammable flame-retardant property of the present invention. Polymer composition. Polymers of thermoplastics and polyphenylene ethers can be manufactured from blends before being incorporated into the composition of the present invention, or A polymer can be incorporated individually. The component in the II-free flame-retardant polymer composition of the present invention is a modified polyfunctional epoxy resin. A modified polyfunctional epoxy resin It is an epoxy resin with at least two epoxy groups at the beginning, which has been reacted with at least one 12 200538502 compound capable of reacting with epoxy groups (hereinafter referred to as modifiers). Thus, the number of starting epoxy groups Is reduced and replaced with the functionality of the modifier compound. The modifier may also be selected to increase the compatibility of the modified multifunctional epoxy resin with a thermoplastic polymer or blend. Functional epoxy resins are known to be derived from non-halogenated polyfunctional epoxy resins, or polyfunctional epoxy resins which are substantially halogen-free. Resin is completely non-functional, that is, 0% free base, or the resin contains some trace ages that are not compatible with the properties or properties of the resin and are not detrimental to the resin: 10 Some polyfunctional epoxy resins can have very small Amount of homemade oxygen _2 ^ element impurity °-Hang 'used in the present invention Ring = 糸 start (before reacting with modifier compounds) per molecule at 1 (preferably at least J 8, oxime K K W, and most preferably 3) ring lice-based materials Section. The product formed after the modifier compound was washed (the modified multi-state oxyresin reaction jacket of __, ^ ;: = 舞 ^ contains 从 从 2, and better # 3 5ί 〇 (General Department It is preferably less than 15, preferably less than 12, and w soil from 10 to 10% by weight of the residual, moreover the total amount of oxygen resin is more than 20 based on the modified base. The wall can be any compound of saturated or unrefined aliphatic polyglycemic epoxy tree, love # 自 ^ 衣 月 日 无, aromatic or heterocyclic. Epoxy resin with ~~ U epoxy groups "Yan Ke Yi" materials include the epoxy epoxy novolac resins of the present invention group (such as ^ s month month sex lice resin 439, which is a quotation of the Dow Chemical Company, ϋ · Ε · Ν · Τ 43δ ^ · Ε · Ν, °. Name and can be purchased from it); Dicyclopentan 13 200538502 Dienol epoxy novolac resin; Epoxidized bisphenol-A novolac tree purpose, epoxidized cresol novolac resin, or in US 5,405,931 US 6,291,627 and US 6,486,242 and others found in WO 99/00451; 5 Epoxy novolac resin (sometimes called epoxidized novolac resin, used to include the term epoxy phenol novolac resin and epoxy formaldehyde novolac resin) has the following general chemical structure and chemical formula:

R RR R

其中’ “R”係氫、Q-C3烧基經基,或Q-C3烧基,例如,甲 10 基;且“Π”係0或1至10之整數。,’η”較佳具有〇至5之平均值。Where "" R "is hydrogen, Q-C3 alkyl, or Q-C3 alkyl, for example, methyl 10; and" Π "is an integer of 0 or 1 to 10. '' "Preferably has an average value of 0 to 5.

多官能性之環氧樹脂可輕易購得,例如,商品名為 D.E.N·(陶氏化學公司之商標),及QuatrexTM,及三環氧 物,諸如,Tactix™ 742 (Ciba之商標)。商業產品一般包含 各種上述化學式物種之混合物,且描述此等混合物特性之 15方便方式係各種不同物種之η值之平均值,n,。依據本發 明使用之較佳多官能性環氧樹脂環氧線型酚醛樹脂、環 氧甲酚線型酚醛樹脂及環氧化之雙酚Α線型酚醛樹脂,其 間,N具有2.05至10之值,更佳係2.5至5。 環氧化雙酚A線型酚醛樹脂包含具有下列結構之聚合 2〇 物,其中,GLY係縮水甘油基: 14 200538502Polyfunctional epoxy resins are readily available, for example, under the trade names D.E.N. (trademark of The Dow Chemical Company), and QuatrexTM, and triepoxides such as Tactix ™ 742 (trademark of Ciba). Commercial products generally include mixtures of various species of the above chemical formula, and a convenient way to describe the characteristics of such mixtures is the average value of n, n, for various species. The preferred multifunctional epoxy resin epoxy novolac resin, epoxycresol novolac resin, and epoxidized bisphenol A novolac resin used in accordance with the present invention, in which N has a value of 2.05 to 10, more preferably 2.5 to 5. Epoxidized bisphenol A novolac resin contains a polymer 20 having the following structure, of which GLY is a glycidyl group: 14 200538502

三環氧樹脂包含具有下述結構之聚合物:The tri-epoxy resin contains a polymer having the following structure:

典型上,多官能性環氧樹脂之重量平均分子量(Mw) 係依本發明組成物中所用之熱塑性聚合物而定,且一般係 從150(較佳係從250,更佳係從350,且最佳係從450)至 !_00,000(—般係至50,000,典型上係至25,000,較佳係至 10 8,000,且更佳係至5,000)個原子質量單元(amu)。 用於改良多官能性環氧樹脂之改質劑係含有會與環 15 200538502 氧官能性反應之反應性基之化合物,諸如,酴酸基,例如, 盼搭化合物,諸如,2-苯基紛、4-苯基齡、二甲基驗、三級 丁基酚、雙酚-a、雙酚-f,聚異氰酸酯,諸如,曱撐基二 苯基二異氰酸酯及甲苯二異氰酸酯,酸基,酸化合物,諸 5 如’水楊酸’胺基,諸如’續胺;酸if基,諸如,號轴酸 酐、十二烷基琥珀酸酐;或可與不含鹵素之多官能性環氧 樹脂化合物之環氧基反應之任何不含鱗之基。其它改質劑 包含含有能促進組成物之機械性質且能與熱塑性樹脂相容 之官能性之化合物。。對於熱塑性樹脂,諸如,單乙稀又 10 基芳香族化合物及共耗二稀,此等官能性可不受限地包含 丁二烯、苯乙烯-馬來酸酐、聚異氰酸酯,諸如,甲撐基二 笨基二異氰酸酯及甲苯二異氰酸酯,聚丁二烯-馬來酸酐共 聚物,以羧酸為端基之丁二烯,及以羧酸官能化之聚苯乙 烯。改質劑之任何混合可被用以改良多官能性之環氧樹 15 脂。 改質劑化合物每分子平均可含有一或多於一個能與環 氧基反應之官能性。此改質劑化合物較佳係每分子平均含 有〇·8至5(更佳係〇·9至4,且最佳係1至3)個能與環氧樹脂反 應之官能基。 20 經改質之多官能性環氧樹脂一般可藉由任何方法製 得’但典型上係如此項技藝所知般藉由使多官能性環氧樹 脂及改質劑於催化劑(胺、酸、媾或銨催化劑)存在中加熱至 高於80 °C而獲得。 本發明之不含_素之阻燃性聚合物組成物内之經改質 16 200538502 的多官能性環氧樹脂之量係依組成物内所用之熱塑性聚合 物而定’且典型上係至少1重量%,一般係至少5重量%,較 佳係至少1〇重量%,更佳係至少15重量%,且最佳係至少2〇 重量%,且少於30重量%,較佳係少於28重量%,更佳係少 5 於25重量%,且最佳係少於20重量%,其係以不含鹵素之阻 燃性聚合物組成物之總重量為基準計。 含磷元素之化合物亦可被包含於本發明組成物内。此 等化合物可為非含環氧之含磷元素之化合物。用於本發明 之不含_素之阻燃性聚合物組成物中作為組份(C)之適當 10 磷化合物係有機磷化合物,其包含有機磷酸酯、有機亞膦 酸酯、有機膦酸酯、有機亞填酸酯、有機次膦酸酯、有機 次鱗酸酯,其它含雄元素之化合物,諸如,9,10-二氫-9-。惡 ,10-鱗菲-10-氧化物(DOP); 1〇-(2,,5,-二經基苯基)-9,10-二 氫-9-噁-10-磷菲]氧化物(D〇P-HQ);雙(4_羥基苯基)-氧 15化膦,二(2、羥基苯基)氧化膦;二甲基-1-雙(4-羥基苯基)-1-苯基甲基膦酸酯;三(2_羥基4/5-甲基笨基)氧化膦三(4_羥基 =基)氧化膦,雙(2-羥基苯基)苯基氧化膦,雙(2_羥基苯基) 笨基-人科酸酷,三(2邊基甲基笨基)氧化麟;或其等之混 合物,其係進一步描述如下。 I田之有機、化合物係揭示於,例如,美國專利第^^· ’ ’ 2’645,及5,276,〇77號案。較佳之有機磷化合物係 以化學式I表示之單魏合物: 25 〇Typically, the weight average molecular weight (Mw) of the polyfunctional epoxy resin depends on the thermoplastic polymer used in the composition of the present invention, and is generally from 150 (preferably from 250, more preferably from 350, and The optimal range is from 450) to! _00,000 (typically up to 50,000, typically up to 25,000, preferably up to 10 8,000, and more preferably up to 5,000) atomic mass units (amu). Modifiers for improving polyfunctional epoxy resins are compounds containing a reactive group that reacts with the oxygen functionality of the ring 15 200538502, such as a phosphonate group, for example, a compound such as 2-phenylphenol , 4-phenyl age, dimethylbenzene, tertiary butylphenol, bisphenol-a, bisphenol-f, polyisocyanates such as fluorenyl diphenyl diisocyanate and toluene diisocyanate, acid groups, acids Compounds, such as' salicylic acid 'amine groups, such as' continuous amines; acid if groups, such as horn anhydride, dodecyl succinic anhydride; or with halogen-free polyfunctional epoxy compounds Any scale-free group of epoxy groups. Other modifiers include compounds containing functionalities that promote the mechanical properties of the composition and are compatible with the thermoplastic resin. . For thermoplastic resins, such as monoethylene and 10-based aromatic compounds and co-consumed dilutes, these functionalities may include butadiene, styrene-maleic anhydride, polyisocyanates such as methylenedidiol, without limitation Benzyl diisocyanate and toluene diisocyanate, polybutadiene-maleic anhydride copolymer, butadiene terminated with carboxylic acid, and polystyrene functionalized with carboxylic acid. Any combination of modifiers can be used to improve polyfunctional epoxy resins. The modifier compound may contain, on average, one or more functionalities capable of reacting with epoxy groups per molecule. The modifier compound preferably contains an average of 0.8 to 5 (more preferably 0.9 to 4, and most preferably 1 to 3) functional groups capable of reacting with epoxy resin per molecule. 20 Modified polyfunctional epoxy resins can generally be made by any method ', but are typically known in the art by using polyfunctional epoxy resins and modifiers on catalysts (amines, acids, Gadolinium or ammonium catalyst) is obtained by heating above 80 ° C. The amount of the modified polyfunctional epoxy resin in the non-flammable flame-retardant polymer composition of the present invention 16 200538502 depends on the thermoplastic polymer used in the composition, and is typically at least 1 At least 5% by weight, preferably at least 10% by weight, more preferably at least 15% by weight, and most preferably at least 20% by weight and less than 30% by weight, preferably less than 28% % By weight, more preferably less than 5% by weight, and most preferably less than 20% by weight, based on the total weight of the halogen-free flame-retardant polymer composition. Compounds containing a phosphorus element may also be included in the composition of the present invention. These compounds may be non-epoxy-containing phosphorus-containing compounds. Appropriate 10 phosphorus compound-based organic phosphorus compounds as component (C) in the non-flammable flame-retardant polymer composition used in the present invention, which include organic phosphates, organic phosphites, and organic phosphonates , Organic linoleate, organic phosphinate, organic hypophosphonate, other androgen-containing compounds, such as 9,10-dihydro-9-. Ox, 10-phenanthrene-10-oxide (DOP); 10- (2,, 5, -dienylphenyl) -9,10-dihydro-9-ox-10-phenanthroline] oxide (D〇P-HQ); bis (4-hydroxyphenyl) -phosphine oxide, bis (2, hydroxyphenyl) phosphine oxide; dimethyl-1-bis (4-hydroxyphenyl) -1- Phenylmethylphosphonate; tris (2-hydroxy4 / 5-methylbenzyl) phosphine oxide; tris (4-hydroxy = yl) phosphine oxide; bis (2-hydroxyphenyl) phenylphosphine oxide; bis ( 2-hydroxyphenyl) benzyl-human acid, tris (2-side methylbenzyl) oxide; or a mixture thereof, which is further described below. The organic and compound systems of ITO are disclosed in, for example, U.S. Patent Nos. ^^ '' 2'645, and 5,276,007. The preferred organic phosphorus compound is a mono-weil compound represented by Chemical Formula I: 25 〇

p II i'(〇)mrP-(〇) m3-R3 (丨) 200538502p II i '(〇) mrP- (〇) m3-R3 (丨) 200538502

(〇)m2 I R2 其中,R!,R2,及R3每一者係表示芳基及烷芳基,其係彼此 個別被選擇,且rih,m2,及m3每一者彼此個別係0或1。 最佳之單礎化合物係單構酸酯,其中,nh,m2,及m3皆 係1,且Ri,112,及113個別係甲基、苯基、甲苯基、二甲苯基、 10 枯基、萘基,例如,三甲基填酸酯、三苯基填酸酯、三甲 苯基磷酸酯之所有異構物,及其等之混合物,特別是三(4-甲基苯基)磷酸酯、三(二甲苯基)磷酸酯之所有異構物,及 其等之混合物,特別是三(2,6-二甲基苯基)磷酸酯、三甲苯 基石粦酸自旨、三枯基填酸g旨之所有異構物,及其等之混合物, 15 及三萘基填酸酯,或其等之混合物。 另一較佳有機磷化合物係以化學式II表示之多磷化合 物: Ο 0(〇) m2 I R2 wherein each of R !, R2, and R3 represents an aryl group and an alkaryl group, which are individually selected from each other, and each of rih, m2, and m3 is independently 0 or 1 from each other . The best monobasic compounds are monobasic acid esters, among which nh, m2, and m3 are all 1, and Ri, 112, and 113 are each methyl, phenyl, tolyl, xylyl, 10-cumyl, Naphthyl, for example, all isomers of trimethyl salt, triphenyl salt, tricresyl phosphate, and mixtures thereof, especially tris (4-methylphenyl) phosphate, All isomers of tris (xylyl) phosphate, and mixtures thereof, especially tris (2,6-dimethylphenyl) phosphate, tricresylcarboxylic acid, tricumyl filling acid g. all isomers, and mixtures thereof, 15 and trinaphthyl phthalates, or mixtures thereof. Another preferred organic phosphorus compound is a polyphosphorus compound represented by Chemical Formula II: 0 0

II II 20 R1-(0)m1-P-0-(-X-0-P-(0) m4 -)n-R4II II 20 R1- (0) m1-P-0-(-X-0-P- (0) m4-) n-R4

(II) I I (O) m2 (O) m3(II) I I (O) m2 (O) m3

I I R2 R3 25 其中,1^,112,113,及114每一者表示芳基或烷芳基,其係彼此 個別被選擇,X係自二經基化合物衍生之芳樓基,mb m2, m3, 及m4每一者彼此個別係0或1,且當η係等於或大於1時,η 平均具有大於〇且少於10之值。多磷化合物有時被稱為寡聚 30 填化合物。 較佳之多墙化合物係多構酸酯,其中,及 200538502 m4係1,Rb r2, &,及仏個別係甲基、笨基、甲苯基、二甲 苯基、括基、萘基,X係自二羥基化合物衍生之芳撐基, 例如間苯二酚、氫醌、雙齡A,且η具有大於〇且少於5之 平均值,較佳地,η具有大於1且少於5之平均值。例如,較 5么·之具有1與2間之η值之寡聚鱗酸酯係間苯撐基-雙(二苯基 41¾)、對-笨撐基-雙(二苯基碟酸酯)、間-苯撐基-雙(二 甲苯基磷酸酯)、對-苯撐基-雙(二甲苯基磷酸酯)、間-苯撐 基_雙(二(二甲笨基)碟酸醋)、對-苯撐基-雙(二(二甲苯基) 碑酸醋)、雙酚-A-雙(二苯基磷酸酯)、雙酚A-雙(二甲苯基 1〇磷酸酯)、雙酚A-雙(二(二甲苯基)磷酸酯),或其等之混合 物。 石4化合物組份(c)係以至少5(較佳係至少7,且更佳係至 、)重里%(其係以100重量份之本發明之不含鹵素之阻燃 性聚合物組成物為基準計)之量,及最高達30(較佳係最高達 15 27更乜係最高達25,更佳係最高達23,且更佳係最高達 2 〇)重置% (其係以不含函素之阻燃性聚合物組成物之總重 量為基準計)之量使用於本發明之不含i素之阻燃性聚合 物組成物。 此外,不含鹵素之阻燃性聚合物組成物亦可選擇性地 2〇含有一或多種普遍用於此型聚合物組成物之添加劑。較佳 之此型添加劑不受限地包含:抗氧化劑、衝擊改質劑,諸 如,苯乙烯-丁二烯橡膠;塑化劑,諸如,礦物油;抗靜電 劑;流動促進劑;脫模劑;色料;濕潤劑;螢光添加劑; 填料,諸如,碳酸鈣、氫氧化鈣、氫氧化鎂、滑石、黏土、 19 200538502 母、石夕灰土、中二玻㈣珠、氧化鈇、 夕石、碳黑、玻璃 纖維、鈦酸鉀、單層之鍚離子交換屏壯 換妓㊉«材料或其混 合物’及全氟烧之寡聚物及聚合物(諸如 、 聚四氟乙烯),其 5 15 係用於改良UL 94之液滴”’不含“之物理性及化學性 之發泡劑(包含二氧化碳)。再者,使_,_合物組成物安 定以對抗由熱、光及氧,或其混合物(但不限於此)造成之降II R2 R3 25 Among them, 1 ^, 112, 113, and 114 each represent an aryl group or an alkaryl group, which are individually selected from each other, and X is an aryl group derived from a dibasic compound, mb m2, m3 , And m4 are each independently 0 or 1, and when η is equal to or greater than 1, η has a value greater than 0 and less than 10 on average. Polyphosphorus compounds are sometimes referred to as oligomeric compounds. Preferred multi-walled compounds are polymorphic acid esters, among which, 200538502 m4 is 1, Rb r2, &, and 仏 is methyl, benzyl, tolyl, xylyl, bracket, naphthyl, and X. An arylene group derived from a dihydroxy compound, such as resorcinol, hydroquinone, double age A, and η has an average value greater than 0 and less than 5, preferably, η has an average value greater than 1 and less than 5 value. For example, compared with 5 ·, oligomeric scale esters having an η value between 1 and 2 are m-phenylene-bis (diphenyl 41¾), p-benzylidene-bis (diphenyl diacetate) , M-phenylene-bis (xylyl phosphate), p-phenylene-bis (xylyl phosphate), m-phenylene_bis (bis (dimethylbenzyl) acetic acid vinegar) , P-phenylene-bis (bis (xylyl) stele vinegar), bisphenol-A-bis (diphenyl phosphate), bisphenol A-bis (xylyl 10 phosphate), bis Phenol A-bis (bis (xylyl) phosphate), or a mixture thereof. Stone 4 compound component (c) is at least 5 (preferably at least 7, and more preferably, to)% by weight (which is 100 parts by weight of the halogen-free flame-retardant polymer composition of the present invention). As the benchmark), and up to 30 (preferably up to 15 27, more up to 25, more up to 23, and more up to 20) reset% (which is based on The total amount of the flame retardant polymer composition containing the functional element is based on the total weight of the flame retardant polymer composition used in the present invention. In addition, the halogen-free flame-retardant polymer composition may optionally contain one or more additives commonly used in this type of polymer composition. Preferred additives of this type include without limitation: antioxidants, impact modifiers such as styrene-butadiene rubber; plasticizers such as mineral oil; antistatic agents; flow promoters; release agents; Colorants; Wetting agents; Fluorescent additives; Fillers, such as calcium carbonate, calcium hydroxide, magnesium hydroxide, talc, clay, 19 200538502 mother, stone ash limestone, sintered glass beads, osmium oxide, evening stone, carbon Black, glass fiber, potassium titanate, single-layer ion exchange screens to replace prostitutes «materials or mixtures thereof» and perfluorocarbon oligomers and polymers (such as, polytetrafluoroethylene), its 5 15 series Physical and chemical foaming agent (including carbon dioxide) used to improve UL 94 droplets. Furthermore, the _, _ compound composition is stabilized against degradation caused by heat, light, and oxygen, or a mixture thereof (but not limited thereto).

'量之”素之添加劑可被使 用,但較佳係組成物係不含_素,其中,組成物不含高於 0.1重量%(其係以組成物總重量為基準計)含量之任何鹵 素。若被使用,此等添加劑之量會改變且需依特定最終用 途而控制,其可由熟習此項技藝者輕易且適當地實施。Additives of the "amount of" element can be used, but preferably the composition is free of element, wherein the composition does not contain any halogen above 0.1% by weight (which is based on the total weight of the composition) If used, the amount of these additives will change and need to be controlled according to the specific end use, which can be easily and appropriately implemented by those skilled in the art.

於一實施例,本發明之組成物可用於製造發泡體。不 含鹵素之阻燃性聚合物組成物藉由使其與發泡劑溶融加工 處理而播塑形成可發泡之混合物,使該可發泡混合物經模 具擠塑至減壓區域,且使可發泡混合物膨脹及冷卻。傳統 之發泡體擠塑設備,諸如,螺桿擠塑機、雙螺桿擠塑機及 累積擠塑裝置,可被使用。用以自樹脂/發泡劑混合物製造 經擠塑之發泡體之適當方法係描述於美國專利第2,409,910; 2,515,250; 2,669,751; 2,848,428; 2,928,130; 3,121,130; 20 3,121,911; 3,770,688; 3,815,674; 3,960,792; 3,966,381; 4,085,073; 4,146,563; 4,229,396; 4,302,910; 4,421,866; 4,438,224; 4,454,086及4,486,550號案。 發泡劑較佳係不含鹵素之物理性或化學式之發泡劑, 且可藉由任何方便裝置併入或混入聚合物材料内。最典型 20 200538502 地,物理性發泡劑係於加壓下饋入擠塑機之套筒内,其間 〃‘嘁聚合物混合。但是,此等混合可藉由各種其它裝置 一成包含所謂之靜式混合器或界面表面產生器,諸如, 吴國專利第3,751,377及3,817,669號案中所述者。化學式發 蜊可事先與聚合物混合,或與聚合物一起饋入擠塑機 内。然後,聚合物/發泡劑之混合物係於於使形成之可發泡 混合物至通過擠塑模具才膨脹之足夠壓力下,被加熱至高 ;舍/包則之彿騰溫度(於物理性發泡劑之情況)或分解(於化 學式發泡劑之情況)溫度。典型上,可發泡之混合物於擠塑 1〇機其它混合裝置或個別熱交換器内冷卻至發泡溫度,以 七成斜最佳發泡溫度具有所欲密度及所欲胞孔尺寸之發泡 體。然後,可發泡之混合物通過模具進入減壓及減溫區域, 其間’發泡體膨脹及冷卻形成胞孔狀結構。 發泡體可被擠塑成任何各種不同形狀,但最普遍係擠 15 塑形成片狀(13mm或更少之公稱厚度)或板狀(超過13mm之 公稱厚度nominal)之產物。片狀產物係使用圓狀模具方便地 製得。產生管狀發泡體,其被切割形成平狀片材。板狀產 物係使用矩形或“狗骨狀”之模具方便地製得。 適當之物理性發泡劑包含二氧化碳、氮、較低級之醇、 20 烧基醚、水,及/或烴,特別是具有最高達6個破原子者。 烴發泡劑包含曱烷、乙烷、丙烷、正丁烷、異丁烷、正戊 烷、異戊烷、新戊烷、環己烷及環戊烷。醇包含甲醇、乙 醇、正丙醇及異丙醇。適當烷基醚包含二甲基醚、二乙基 醚及曱基乙基醚。二或更多種此等物理性發泡劑之混合物 21 200538502 可被使用。 適當之化學性發泡劑包含偶氮二碳驢胺、偶氮二異丁 腈、苯續基-酸肼、4,4-氧苯石黃醯基半-卡巴腓、對-甲苯續酉备 基半-卡巴肼、偶氮二羧酸鋇、N,Nf-二甲基-N,Nf-二亞硝基 5 對苯二甲醯胺、三醯肼基三秦及碳酸氫鈉。 雖然本發明係有關於不含鹵素之阻燃性組成物’需注 意鹵化之發泡粉亦可適當地施行產生發泡體。但是,較佳 地,未鹵化之發泡劑被使用。 於一實施例,含有具1至4個碳原子之較低級醇、烷基 10 醚、烷基酯、烴、水(最高達50%)及二氧化碳之非鹵化發泡 劑混合物之發泡劑混合物被使用。 各種輔助材料可被用於發泡方法。普遍之此等輔助材 料包含胞孔控制劑(成核劑)、胞孔擴大劑、安定控制劑(滲 透改質劑)、抗靜電劑、交聯劑、加工處理助劑(諸如,滑動 15 劑)、安定劑、阻燃劑、紫外線吸收劑、酸清除劑、分散助 劑、擠塑助劑、抗氧化劑、著色劑,及無機填料。胞孔控 制劑及安定控制劑被使用。 車父佳之胞孔控制劑包含細微切割之無機物質,諸如, 碳酸鈣、矽酸鈣、靛藍劑、滑石、黏土、二氧化鈦、矽石、 20硬脂酸鈣或矽藻土,與小量之能於擠塑條件下反應形成氣 體之化學品’諸如’檸檬酸或檸檬酸納及碳酸氫鈉之浪合 物。所用成核劑之量範圍可為每100重量份聚合物樹脂係 〇·〇1至5重量份。較佳範圍係01至3重量份。 當發泡劑被作為緣熱劑時,衰減經發泡體結構之紅外 22 200538502 線透射之添加劑可被併入以增加絕緣性質,即使當發泡劑 包含絕緣氣體時。紅外衰減劑之例子包含碳黑材料、石墨、 二氧化鈦·,及鋁顆粒。當紅外衰減劑被使用時,降低比例 之絕緣發泡劑可被使用。 5 若要的話,發泡劑可接受各種其後之加工處理步驟。 一般,所欲係使發泡體固化(即,以空氣替換胞孔内之發泡 劑)。用以降低固化時間之處理步驟包含穿孔,如美國專利 第5,424,016號案中所述,使發泡體於些微升高(i〇〇_13〇〇f) 之溫度加熱數天至數週,或其等之結合。此外,發泡體可 被粉碎以使胞孔打開。交聯步驟亦可被實施。 本發明之不含_素之阻燃性聚合物組成物之製造可藉 由此項技藝已知之之適當混合手段完成,包含使個別組份 乾燥摻合及其後熔融混合,其可於用以製造完成物件所用 之擠塑機内直接為之或於個別擠塑機内預混合。組成物之 15乾燥摻合物亦可直接被射出成型而未獅融混合。 本發明之不含齒素之阻燃性聚合物組成物,及包含於 1内之聚合物係熱塑性聚合物。當藉由施熱而軟化或炼融 時’本發明之不含_素之阻燃性聚合物組成物可使用傳統 2術形成或模製,諸如,壓模成型、射出成型、氣體輔助 式射出成型、壓延、真空成型、熱成形、擠塑及/或吹塑成 型,其可單獨或結合使用。j 不3幽素之阻燃性聚合物組成 物亦可被成刑、紡製,或 伸成溥%、纖維、多層之層合 物擠塑之片材,或可與一 '更夕種之有機或無機之物質於 任何適於此目的之機器上化合。 23 200538502 於一實施例,本發明係一種不含鹵素之阻燃性聚合物 組成物,其基本上係由下述組成: A) 熱塑性聚合物或聚合物摻合物, B) 經改質之多官能性環氧樹脂,含有0-20重量%之 5 殘餘環氧基,其係以環氧樹脂總重量為基準計,及 C) 含碟之化合物。 於另一實施例,本發明係一種不含鹵素之阻燃性聚合 物組成物,其基本上由下述組成: A) 40-94重量%,以組成物總重量為基準計,之熱塑 10 性聚合物,其可選擇性包含10-35重量%,以組成物總重量 為基準計,之聚苯撐基醚聚合物,諸如,聚苯撐基化氧 (PPO), B) 1-30重量%,以組成物總重量為基準計,之經改質之 多官能性環氧樹脂,其含有0-20重量%之殘餘環氧基,其 15 係以環氧樹脂總重量為基準計,及 C) 5-30重量%,以組成物總重量為基準計,之磷化合 物,諸如,芳基構酸自旨。 ‘基本上由...組成’一辭係意指所列組份係基本的,即使 其它材料可以不會顯著改變本發明組成物之性質或目的之 20 小量存在。較佳地,本發明組成物不含熱固性聚合物。 本發明之不含鹵素之阻燃性聚合物組成物係用於製造 各種有用之物件及零件。特別適合之一些物件包含典型上 需具有優異燃燒分級之電視外殼、電腦螢幕、相關之印表 機外殼。其它應用包含汽車及小器具。 200538502 【實施方式】 下列貫施例係堤供例示本發明。此等實施例非用以限 制本發明範圍,且其不應被如此闡釋。除其它指示外,含 量係以重量份或重量百分率計。 5 燃燒分級係藉由於UL-94垂直(V)或UL-94水平(HB)燃 燒性測試下測試而獲得。對於垂直燃燒測試,垂直懸浮於 手術用棉花上之五個測量為12·5毫米(mm) χ 125 mm之具 所欲厚度之測試樣本以1875111111 Bunsen燃燒器火焰燃燒; 對樣本施以二次燃燒(每次1〇秒)。分級標準包含每次點燃後 10之燒燼時間總,第二次點燃後之成長時間,及棒材是否滴 下使棉花點燃之焰顆粒。 熔融流速率係依據ASTM D1238決定 懸臂樑係依據ASTM D256決定 抗張性係依據ASTM D638決定 15 伸長率係依據ASTM D638決定 維卡(Vicat)係依據ASTM D1525決定 經改質之環氣線剞酚醛樹脂之製造裎序 經改質之環氧線型酚醛樹脂係於10公升之鋼反應器 (其係裝設機械攪拌器、加熱套管,裝設N2入口及冷凝器) 20 中製造。DEN 438 (陶氏之環氧線型酚醛)(57重量%)與2-苯 基酚(43重量%)於125與185°C間之溫度接觸。約20-30%之紛 被注入具環氧線型紛酸之反應器,並加熱至110°C。約1〇〇〇 ppm之三苯基乙基鱗乙酸鹽催化劑(以總固體組份為基準計) 被添加至樹脂,且加熱至最高達130 °C。剩餘之改質劑化 25 200538502 合物係一份份地添加至反應混合物内,如此,反應混合物 之溫度可被控制於185 °C下。所有改質劑化合物被被添加 後’反應混合物之溫度於175°C維持約30分鐘,且產物被片 化成固體。最終產物具有2.83%之環氧含量,〇.20?3^之熔 5 融黏度(於150°C)及45/43°C之樹脂Tg。 高衝擊性聚苯乙烯(HIPS,Mw 185,000,橡膠含量 10.5% ’單峰型分佈(平均2微米),ο』重量%礦物油),聚苯 撐化氧及經改質之環氧線型酚醛(如上製造,DEN/ΟΡΡ)之 組成物被、熔融按合並射出成型。產物於Wernej^phieiderer 30 10 mm雙螺桿擠塑機(其具有125, 18〇, 245, 25〇&26〇。。之區域 溫度)上化合'。樣品於DeMag射出成型機(226,226,230及 23(TC之區域溫度)上射出成型,且模具溫度係54。〇。In one embodiment, the composition of the present invention can be used for manufacturing a foam. The halogen-free flame-retardant polymer composition is spread to form a foamable mixture by melt processing with a foaming agent, and the foamable mixture is extruded through a mold to a reduced pressure region, and The foaming mixture expands and cools. Conventional foam extrusion equipment such as a screw extruder, a twin screw extruder, and a cumulative extrusion device can be used. A suitable method for making extruded foam from a resin / foaming agent mixture is described in U.S. Patent Nos. 2,409,910; 2,515,250; 2,669,751; 2,848,428; 2,928,130; 3,121,130; 20 3,121,911 3,770,688; 3,815,674; 3,960,792; 3,966,381; 4,085,073; 4,146,563; 4,229,396; 4,302,910; 4,421,866; 4,438,224; 4,454,086 and 4,486,550. The blowing agent is preferably a halogen-free blowing agent of a physical or chemical formula, and may be incorporated or mixed into the polymer material by any convenient means. The most typical 20 200538502, the physical foaming agent is fed into the sleeve of the extruder under pressure, during which the polymer is mixed. However, such mixing can be accomplished by various other means including a so-called static mixer or interface surface generator, such as described in Wu Guo Patent Nos. 3,751,377 and 3,817,669. Chemical clams can be mixed with the polymer beforehand or fed into the extruder with the polymer. The polymer / foaming agent mixture is then heated to a high pressure under sufficient pressure to expand the formed foamable mixture through an extrusion die; the Foten temperature (in physical foaming) In the case of chemical agents) or decomposition (in the case of chemical blowing agents) temperature. Typically, the foamable mixture is cooled to the foaming temperature in other mixing devices of the extruder 10 or in individual heat exchangers. The optimal foaming temperature at a 70% slope has the desired density and the desired cell size. Foam. Then, the foamable mixture enters the decompression and temperature reduction region through the mold, during which the 'foam expands and cools to form a cell structure. Foams can be extruded into any of a variety of different shapes, but are most commonly extruded to form a sheet (nominal thickness of 13 mm or less) or a plate (nominal thickness exceeding 13 mm). Sheet products are conveniently prepared using round molds. A tubular foam was produced, which was cut to form a flat sheet. Plate-shaped products are conveniently made using rectangular or "dog-bone" molds. Suitable physical blowing agents include carbon dioxide, nitrogen, lower alcohols, 20-alkyl ethers, water, and / or hydrocarbons, especially those with up to 6 atom breaks. Hydrocarbon blowing agents include pinane, ethane, propane, n-butane, isobutane, n-pentane, isopentane, neopentane, cyclohexane and cyclopentane. Alcohols include methanol, ethanol, n-propanol, and isopropanol. Suitable alkyl ethers include dimethyl ether, diethyl ether and fluorenyl ethyl ether. Mixtures of two or more of these physical blowing agents 21 200538502 may be used. Suitable chemical foaming agents include azobiscarbon donkey amine, azobisisobutyronitrile, benzodiazide-hydrazine, 4,4-oxobenzothanthrene semi-carbaphe, p-toluene -Carbahydrazine, barium azodicarboxylate, N, Nf-dimethyl-N, Nf-dinitroso5 p-xylylenediamine, trishydrazinetriqin and sodium bicarbonate. Although the present invention relates to a halogen-free flame-retardant composition ', it should be noted that the halogenated foaming powder may be suitably implemented to generate a foam. However, preferably, an unhalogenated blowing agent is used. In one embodiment, a blowing agent containing a non-halogenated blowing agent mixture of lower alcohols having 1 to 4 carbon atoms, alkyl 10 ethers, alkyl esters, hydrocarbons, water (up to 50%) and carbon dioxide The mixture was used. Various auxiliary materials can be used in the foaming method. These auxiliary materials generally include cell control agents (nucleating agents), cell expansion agents, stability control agents (penetration modifiers), antistatic agents, cross-linking agents, processing aids (such as sliding agent 15) ), Stabilizers, flame retardants, UV absorbers, acid scavengers, dispersion aids, extrusion aids, antioxidants, colorants, and inorganic fillers. Cell control agents and stability control agents are used. Chevron Cell Control contains finely cut inorganic substances such as calcium carbonate, calcium silicate, indigo, talc, clay, titanium dioxide, silica, 20 calcium stearate, or diatomaceous earth, with a small amount of energy Chemicals that react to form gases under extrusion conditions, such as' citric acid or sodium citrate and undulated sodium bicarbonate. The amount of the nucleating agent used may range from 0.001 to 5 parts by weight per 100 parts by weight of the polymer resin system. A preferred range is 01 to 3 parts by weight. When a foaming agent is used as a marginal heating agent, additives that attenuate the infrared transmission through the foam structure may be incorporated to increase the insulating properties, even when the foaming agent contains an insulating gas. Examples of the infrared attenuating agent include a carbon black material, graphite, titanium dioxide, and aluminum particles. When an infrared attenuator is used, a reduced proportion of the insulating foaming agent can be used. 5 If desired, the foaming agent may undergo various subsequent processing steps. Generally, it is desired to cure the foam (ie, to replace the foaming agent in the cells with air). The processing step to reduce the curing time includes perforation, as described in U.S. Patent No. 5,424,016, to heat the foam at a slightly elevated (io_13_00f) temperature for several days to weeks, or Their combination. In addition, the foam can be pulverized to open the cells. A crosslinking step can also be performed. The production of the flame retardant polymer composition free of vitamins in the present invention can be accomplished by appropriate mixing means known in the art, including dry blending of individual components and subsequent melt mixing, which can be used in The extruder used to make the finished item is either directly in the extruder or pre-mixed in the individual extruder. The 15 dry blends of the composition can also be directly injection molded without mixing. The flame retardant polymer composition containing no tooth element of the present invention, and the polymer-based thermoplastic polymer contained in 1. When softened or smelted by applying heat, the non-flammable flame-retardant polymer composition of the present invention can be formed or molded using conventional techniques such as compression molding, injection molding, and gas-assisted injection. Forming, calendering, vacuum forming, thermoforming, extrusion and / or blow molding can be used alone or in combination. j The flame retardant polymer composition of 3 leucoline can also be formed, spun, or stretched into a sheet of extruded 溥%, fiber, or multilayer laminate, or it can be grown with Organic or inorganic substances are combined on any machine suitable for this purpose. 23 200538502 In one embodiment, the present invention is a halogen-free flame-retardant polymer composition, which basically consists of the following: A) a thermoplastic polymer or polymer blend, B) modified Multifunctional epoxy resin, containing 0-20% by weight of 5 residual epoxy groups, which is based on the total weight of the epoxy resin, and C) a compound containing a dish. In another embodiment, the present invention is a halogen-free flame-retardant polymer composition, which basically consists of the following: A) 40-94% by weight, based on the total weight of the composition, thermoplastic 10-based polymer, which may optionally contain 10-35% by weight, based on the total weight of the composition, a polyphenylene ether polymer, such as polyphenylene oxide (PPO), B) 1- 30% by weight, based on the total weight of the composition, the modified polyfunctional epoxy resin contains 0-20% by weight of residual epoxy groups, and 15 is based on the total weight of the epoxy resin , And C) 5-30% by weight, based on the total weight of the composition, a phosphorus compound, such as an aryl acid, is intended. The term "consisting essentially of" means that the listed components are essential, even though other materials may be present in small amounts without significantly altering the nature or purpose of the composition of the invention. Preferably, the composition of the present invention does not contain a thermosetting polymer. The halogen-free flame-retardant polymer composition of the present invention is used for manufacturing various useful objects and parts. Some items that are particularly suitable include TV cases, computer screens, and related printer cases that typically require excellent combustion classification. Other applications include automobiles and gadgets. 200538502 [Embodiment] The following implementation examples are examples of the present invention. These examples are not intended to limit the scope of the invention, and they should not be construed as such. Contents are, inter alia, parts or percentages by weight. 5 Combustion classification is obtained by testing under UL-94 vertical (V) or UL-94 horizontal (HB) flammability tests. For the vertical combustion test, five test specimens of a desired thickness measuring 12.5 mm (mm) x 125 mm suspended vertically on surgical cotton were burned with a 1875111111 Bunsen burner flame; the sample was subjected to secondary combustion (10 seconds each time). The grading criteria include the total embers time of 10 after each ignition, the growth time after the second ignition, and whether the bar drips the flame particles that ignite the cotton. Melt flow rate is determined according to ASTM D1238. Cantilever beam is determined according to ASTM D256. Tensile resistance is determined according to ASTM D638. 15 Elongation is determined according to ASTM D638. Vicat is determined according to ASTM D1525. Resin manufacturing process The modified epoxy novolac resin is manufactured in a 10-liter steel reactor (which is equipped with a mechanical stirrer, a heating jacket, an N2 inlet and a condenser). DEN 438 (Dow's epoxy novolac) (57% by weight) and 2-phenylphenol (43% by weight) were contacted at a temperature between 125 and 185 ° C. About 20-30% of the water is injected into the reactor with epoxy linear water and heated to 110 ° C. About 1,000 ppm of triphenylethyl squamyl acetate catalyst (based on total solids) was added to the resin and heated up to 130 ° C. The remaining modifiers were added to the reaction mixture in portions. In this way, the temperature of the reaction mixture can be controlled at 185 ° C. After all the modifier compounds were added, the temperature of the reaction mixture was maintained at 175 ° C for about 30 minutes, and the product was tabletted into a solid. The final product has an epoxy content of 2.83%, a melt viscosity of 0.20 to 3 ^ 5 (at 150 ° C) and a resin Tg of 45/43 ° C. High-impact polystyrene (HIPS, Mw 185,000, rubber content 10.5% 'unimodal distribution (average 2 microns), ο' wt% mineral oil), polyphenylene oxide and modified epoxy novolac ( Manufactured as above, the composition of DEN / OPP) is molded by injection molding after melting and melting. The product was compounded on a Wernej phieiderer 30 10 mm twin-screw extruder (which has a zone temperature of 125, 18, 245, 25 ° & 26 ° ...). The samples were injection molded on DeMag injection molding machines (226, 226, 230, and 23 (area temperature of TC)), and the mold temperature was 54 °.

26 200538502 比較例 貫施例I 比較例 比較例 HIPS之重量% 60 55 55 55 PPO之重量% 22 22 22 22 FP-500之重量% 18 18 18 18 環氧之重量% 0 5 5 5 環氧 — DEN/OP 線型酚 環氧線型 P 醛 熔融流速率(克/10 3.8 5.6 44 4.2 分鐘) 懸臂樑 (英叹•碎/英口寸) 2.2 1.7 1.4 1.2 (J/m) 115 90 75 65 抗張屈服 (psi) 5878 4245 5560 5790 (MPa) 40 29 38 40 伸長率 8 19 11 4 維卡(°c) 96 93 103 93 火焰滴液 5/5 0/10 0/10 0/10 UL 分級 2.5 mm V-2 V-0 V-0 V-0 DEN=陶氏之環氧線型酚醛438 OPP係2-苯基酚 FP-500係可得自Daihachi Chemical之二碟酸g旨 線型紛酸(Novolac)係Bakelite之產品,產品編號係〇79〇κ〇3 5環氧線型酚醛係具有5.5之官能性平均值及ΐ87之環氧當量 之多官能性之環氧線型酚醛。 進一步之組成物一般可依如上所述方法相似地製造, 以提供使用下述測試方法於表中綜述及評估之組成物· 熔融流速率(MFR)係依據ISO 1183決定。 10 懸臂樑係依據ISO 180決定。 200538502 抗張屈服(Ty)、抗張模量及伸長率係依據ISO 527決定。 熱扭變溫度(HDT)係依據ISO 75於1·8 Mpa及12〇 X之 條件下經1小時而決定。 於此等實驗,所用之PPO組份係Asahi N-2245品牌之 5 樹脂,其係約70%聚苯撐基化氧聚合物(PP0)及約30%之聚 笨乙烯及橡膠之摻合物(其被認為係下表中之整體HIPS組 份之一部份)之摻合物。下表中所指之HIPS Feedstock樹脂 係於如上實施例中所述及使用之高衝墼聚苯乙烯樹脂。於 此等組成物,含磷之化合物係BAPP(其係雙酚A雙(二苯基 塒酸酯))及RDP(其係甲苯二酚雙(二苯基磷酸酯))。經改質 之環氧樹脂係如上實驗所述般製得之經改質之環氧線型酚 醛樹脂,且係鄰苯基酚與陶氏之環氧線型酚醛(DEN 438) 之反應產物。下述樣品組成物7及8所示之結果係以熟習此 項技藝者之組成及性質模擬技術。26 200538502 Comparative Example Throughout Example I Weight% of Comparative Example HIPS 60 55 55 55 Weight% of PPO 22 22 22 22 Weight% of FP-500 18 18 18 18 Weight% of epoxy 0 5 5 5 Epoxy— DEN / OP Novolac epoxy novolac P aldehyde melt flow rate (g / 10 3.8 5.6 44 4.2 minutes) Cantilever (sigh • broken / inch size) 2.2 1.7 1.4 1.2 (J / m) 115 90 75 65 Tensile Yield (psi) 5878 4245 5560 5790 (MPa) 40 29 38 40 Elongation 8 19 11 4 Vicat (° c) 96 93 103 93 Flame drip 5/5 0/10 0/10 0/10 UL classification 2.5 mm V-2 V-0 V-0 V-0 DEN = Dow ’s Epoxy Novolac 438 OPP is 2-phenylphenol FP-500 is available from Daihachi Chemical It is a product of Bakelite, and the product number is 〇79〇κ〇3. Epoxy novolac is a polyfunctional epoxy novolac having a functional average of 5.5 and an epoxy equivalent of ΐ87. Further compositions can generally be manufactured similarly as described above to provide compositions reviewed and evaluated in the table using the following test methods. • Melt flow rate (MFR) is determined in accordance with ISO 1183. 10 Cantilever beam system is determined according to ISO 180. 200538502 The tensile yield (Ty), tensile modulus and elongation are determined according to ISO 527. The heat torsion temperature (HDT) is determined in accordance with ISO 75 under conditions of 1 · 8 Mpa and 12.0X over 1 hour. In these experiments, the PPO component used was Asahi N-2245 brand 5 resin, which is a blend of about 70% polyphenylene oxide polymer (PP0) and about 30% polystyrene and rubber. (It is considered a part of the overall HIPS component in the table below). The HIPS Feedstock resins referred to in the table below are high-impact polystyrene resins as described and used in the examples above. Among these compositions, the phosphorus-containing compounds are BAPP (which is bisphenol A bis (diphenylphosphonate)) and RDP (which is tolylene bisphenol bis (diphenyl phosphate)). The modified epoxy resin is a modified epoxy novolac resin prepared as described in the above experiment, and is a reaction product of o-phenylphenol and Dow's epoxy novolac (DEN 438). The results shown in the following sample compositions 7 and 8 are based on the composition and property simulation techniques of those skilled in the art.

28 200538502 樣品組成 物 2 3 4 5 6 7 8 HIPS Feedstock 之重量% 40.8 39.6 43 36.8 31 o 〇 〇 JD.D 19.3 HIPS*之 總重量% 51.9 49.6 53 47.8 44 43.3 34.3 Asahi N-2245 之重量% 37.1 34.3 32.9 37.1 42.9 38.6 48.6 PP0 之重量% 26.0 24.0 23.0 26.0 30.0 28.0 34.0 經改質之 環氧線型 酚醛樹脂 之重量% 5 5 5 5 5 5 5 聚磷酸酯 RDP BAPP BAPP BAPP BAPP BAPP BAPP 磷酸酯之 重量% 17 21 19 21 21 23 27 Teflon 6-CN 之% 0.1 0.1 0.1 0.1 0.1 0.1 0.1 樣品性質 MFR (克/10分 鐘) 9.3 11.2 10 9.9 9.0 9 5.0 懸壁樑 (J/m) 103 81 80 80 70 65 50 Ty (MPa) 38.5 43.8 40 45.1 48.7 46 50 伸長率 (%) 55 49 50 42 32 25 15 模量 (MPa) 2271 2500 2450 2520 2580 2550 2650 HDT (°C) 59.7 61.5 62 61.5 64.2 62 67 Sp. Dens (kg/1) 1.112 1.112 1.114 1.113 1.115 1.124 1.132 UL V-94 燃燒分級 (3.0 mm) VI VI VI VO VO VO VO 總HIPS組份包含Asahi N-2245中所含之聚苯乙烯及及 橡膠之摻合物。 200538502 i:圖式簡單說明3 (無) 【._式之主要元件代表符號表】 (無)28 200538502 Sample composition 2 3 4 5 6 7 8% by weight of HIPS Feedstock 40.8 39.6 43 36.8 31 o 〇〇JD.D 19.3% by weight of HIPS * 51.9 49.6 53 47.8 44 43.3 34.3% by weight of Asahi N-2245 37.1 34.3 32.9 37.1 42.9 38.6 48.6% by weight of PP0 26.0 24.0 23.0 26.0 30.0 28.0 34.0% by weight of modified epoxy novolac resin 5 5 5 5 5 5 5 Polyphosphate RDP BAPP BAPP BAPP BAPP BAPP BAPP BAPP Phosphate % 17 21 19 21 21 23 27% of Teflon 6-CN 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Sample properties MFR (g / 10 min) 9.3 11.2 10 9.9 9.0 9 5.0 Cantilever beam (J / m) 103 81 80 80 70 65 50 Ty (MPa) 38.5 43.8 40 45.1 48.7 46 50 Elongation (%) 55 49 50 42 32 25 15 Modulus (MPa) 2271 2500 2450 2520 2580 2550 2650 HDT (° C) 59.7 61.5 62 61.5 64.2 62 67 Sp Dens (kg / 1) 1.112 1.112 1.114 1.113 1.115 1.124 1.132 UL V-94 combustion classification (3.0 mm) VI VI VI VO VO VO VO The total HIPS component contains polystyrene and rubber contained in Asahi N-2245 Of its blend. 200538502 i: Brief description of the drawing 3 (None) [The main component representative symbol table of ._ type] (None)

3030

Claims (1)

200538502 拾、申請專利範圍·· 1·一種不含鹵素之阻燃性聚合物組成物,包含·· A)熱塑性之聚合物或聚合物摻合物; )、工改貝之夕g月巨性裱氧樹脂,其含有重量%之 5殘餘環氧基,其係以該環氧樹脂總重量為基準計,·及 C)含碟之化合物。 2.如申睛專利範圍第χ項之不含鹵素之_性聚合物組成 物’其中,八)係廷自乙烯基芳香族單體及其氯化型式製得 之聚合物1碳酸酉旨 '丙烯腈_丁二稀_笨乙稀共聚物/聚碳 1〇 _旨之組成物、減笨氧基醚聚合物、聚笨撐基㈣合物、 聚對苯二甲酸乙二醋、環氧樹脂、乙稀乙稀基醇之共㈣、 乙烯丙烯酸共聚物]«烴—氧化碳異種共聚物、聚烯烴、 環狀烤烴共聚物、烯煙之共聚物及同聚物、聚苯撐基化氧 及其等之任何混合物所組成之族群。 15 3.如中請專利範圍第2項之不含_素之阻燃性聚合物組成 物’其中,A)係選自苯乙烯-丁二稀嵌段共聚物、聚苯乙稀、 φ 南衝擊性之聚苯乙烯、丙稀腈-丁二稀_苯乙稀之共聚物,及 苯乙烯-丙烯腈之共聚物。 4. 如申請專利範圍第i項之不含齒素之阻燃性聚合物組成 2〇物,其中,A)係該不含i素之阻燃性聚合物組成物總重量 之40至94重量% ; B)係1至3〇重量% ;且〇)係$至3〇重量%。 5. 如申請專利範圍第!項之不含自素之阻燃性聚合物組成 物,其中,B)係-經改質之多官能性環氧樹脂,其係衍生 自選自下列結構之多官能性環氧樹脂: 31 200538502200538502 Scope of patent application ... 1. A halogen-free flame retardant polymer composition, including ... A) thermoplastic polymer or polymer blend; The mounting epoxy resin contains 5% by weight of a residual epoxy group, which is based on the total weight of the epoxy resin, and C) a compound containing a dish. 2. A halogen-free polymer composition as described in item χ of the patent claim 'wherein, eight) is a polymer made from vinyl aromatic monomers and their chlorinated forms. Acrylonitrile_Butadiene_Styrene Copolymer / Polycarbon 10__ Purpose composition, streak-free oxyether polymer, polybenzyl adduct, polyethylene terephthalate, epoxy Resin, ethylene glycol copolymer, ethylene acrylic acid copolymer] «hydrocarbon-carbon oxide heteropolymer, polyolefin, cyclic roasted hydrocarbon copolymer, olefinic copolymer and homopolymer, polyphenylene group A group of oxygen and any mixture of them. 15 3. The flame retardant polymer composition containing no element as described in item 2 of the patent, wherein A) is selected from styrene-butadiene block copolymer, polystyrene, φ South Impact polystyrene, acrylonitrile-butadiene-styrene copolymer, and styrene-acrylonitrile copolymer. 4. For example, the flame retardant polymer composition 20 without tooth element in the scope of patent application item i, wherein A) is 40 to 94 weight of the total weight of the flame retardant polymer composition without element I. %; B) is 1 to 30% by weight; and 0) is $ to 30% by weight. 5. Such as the scope of patent application! The self-priming flame-retardant polymer composition of the item, wherein B) is a modified multifunctional epoxy resin, which is derived from a polyfunctional epoxy resin selected from the following structure: 31 200538502 -Jn 其中,“R”係氫、CrQ烷基羥基,或CpCs烷基,例如,甲 基;且“η”係0或1至10之整數,”η”較佳具有0至5之平均值;-Jn wherein "R" is hydrogen, CrQ alkylhydroxy, or CpCs alkyl, for example, methyl; and "η" is an integer of 0 or 1 to 10, and "η" preferably has an average value of 0 to 5 ; 5 其中,Gly係縮水甘油基;及5 wherein Gly is glycidyl; and 6.如申請專利範圍第1項之不含鹵素之阻燃性聚合物組成 物,其中,該經改質之多官能性環氧樹脂係一自每分子平 32 200538502 均擁有多於1個環氧基之環氧樹脂製得之材料。 7.如申請專利範圍第1項之不含鹵素之阻燃性聚合物組成 物,其中,該經改質之多官能性環氧樹脂係以多於一種改 質劑改質之官能性。 5 8.如申請專利範圍第1項之不含鹵素之阻燃性聚合物組成 物,其中,該經改質之多官能性環氧樹脂含有少於15重量 %之殘餘環氧基,其係以該環氧樹脂總重量計。 9. 如申請專利範圍第8項之不含函素之阻燃性聚合物組成 物,其中,該經改質之多官能性環氧樹脂含有少於12重量 10 %之殘餘環氧基,其係以該環氧樹脂總重量計。 10. 如申請專利範圍第9項之不含鹵素之阻燃性聚合物組成 物,其中,該經改質之多官能性環氧樹脂含有少於10重量 %之殘餘環氧基,其係以該環氧樹脂總重量計。 11. 如申請專利範圍第1項之不含鹵素之阻燃性聚合物組成 15 物,基本上係由下述組成: A) 40至94重量%(以該組成物總重量為基準計)之熱塑 性聚合物,選擇性地包含1〇-35重量%(以該組成物總重量為 基準計)之聚苯撐醚聚合物; B) 1至30重量%(以該組成物總重量為基準計)之經改 20 質之多官能性環氧樹脂,其含有0-20重量%(以該環氧樹脂 總重量為基準計)之殘餘環氧基;及 C) 5至30重量%(以該組成物總重量為基準計)之磷化合 物,諸如,芳基磷酸酯。 12. 如申請專利範圍第11項之不含S素之阻燃性聚合物組成 33 200538502 物,其中,A)之該熱塑性聚合物係選自乙烯基芳香族單體 及其氫化型式製得之聚合物、聚碳酸酯、丙烯腈-丁二烯-苯乙烯/聚碳酸酯之組成物、聚苯撐基醚樹脂、羥基苯氧基 醚聚合物、聚對苯二甲酸乙二酯、環氧樹脂、乙烯乙烯基 5 醇之共聚物、乙烯丙烯酸共聚物、聚烯烴一氧化碳異種共 聚物、聚烯烴、環狀烯烴共聚物、烯烴之共聚物及同聚物, 及其等之任何混合物所組成之族群。 13. 如申請專利範圍第12項之不含鹵素之阻燃性聚合物組 成物,其中,A)之該熱塑性聚合物係選自苯乙烯-丁二烯嵌 10 段共聚物、聚苯乙烯、高衝擊性之聚苯乙烯、丙烯腈-丁二 烯-苯乙烯(ABS)之共聚物,及苯乙烯-丙烯腈之共聚物。 14. 如申請專利範圍第11項之不含鹵素之阻燃性聚合物組成 物,其中,該經改質之多官能性環氧樹脂係一自每分子平 均擁有多於1個環氧基之環氧樹脂製得之材料。 15 15.如申請專利範圍第11項之不含鹵素之阻燃性聚合物組成 物,其中,該經改質之多官能性環氧樹脂係以多於一種改 質劑改質之官能性。 16. 如申請專利範圍第11項之不含鹵素之阻燃性聚合物組成 物,其中,該經改質之多官能性環氧樹脂含有少於15重量 20 %之殘餘環氧基,其係以該環氧樹脂總重量計。 17. 如申請專利範圍第16項之不含鹵素之阻燃性聚合物組 成物,其中,該經改質之多官能性環氧樹脂含有少於12重 量%之殘餘環氧基,其係以該環氧樹脂總重量計。 18. 如申請專利範圍第17項之不含鹵素之阻燃性聚合物組 34 200538502 成物,其中,該經改質之多官能性環氧樹脂含有少於ίο重 量%之殘餘環氧基,其係以該環氧樹脂總重量計。 19.一種物件,其係自申請專利範圍第1或18項之不含鹵素 之阻燃性聚合物組成物製得。6. The halogen-free flame-retardant polymer composition according to item 1 of the scope of the patent application, wherein the modified polyfunctional epoxy resin has more than one ring from 32 200538502 per molecule. Material made from epoxy resin. 7. The halogen-free flame-retardant polymer composition according to item 1 of the patent application scope, wherein the modified polyfunctional epoxy resin has functionalities modified with more than one modifier. 5 8. The halogen-free flame-retardant polymer composition according to item 1 of the scope of patent application, wherein the modified polyfunctional epoxy resin contains less than 15% by weight of residual epoxy groups, which is Based on the total weight of the epoxy resin. 9. For example, a flame-retardant polymer composition containing no halogen in the scope of patent application, wherein the modified polyfunctional epoxy resin contains less than 12% by weight of 10% of residual epoxy groups, which Based on the total weight of the epoxy resin. 10. If the halogen-free flame-retardant polymer composition of item 9 of the patent application scope, wherein the modified polyfunctional epoxy resin contains less than 10% by weight of residual epoxy groups, it is based on The total weight of the epoxy resin. 11. For example, the halogen-free flame-retardant polymer composition 15 in the scope of the patent application is basically composed of the following: A) 40 to 94% by weight (based on the total weight of the composition) Thermoplastic polymer, optionally comprising 10 to 35% by weight (based on the total weight of the composition) of a polyphenylene ether polymer; B) 1 to 30% by weight (based on the total weight of the composition) ) Modified 20-functional polyfunctional epoxy resin, which contains 0-20% by weight (based on the total weight of the epoxy resin) of residual epoxy groups; and C) 5 to 30% by weight (based on the Phosphorus compounds such as aryl phosphates based on the total weight of the composition. 12. For example, the flame retardant polymer composition containing no S element in the scope of patent application No. 33 200538502, wherein the thermoplastic polymer of A) is selected from the group consisting of vinyl aromatic monomer and its hydrogenation type. Polymer, polycarbonate, acrylonitrile-butadiene-styrene / polycarbonate composition, polyphenylene ether resin, hydroxyphenoxy ether polymer, polyethylene terephthalate, epoxy Resin, copolymer of ethylene vinyl alcohol, ethylene acrylic acid copolymer, polyolefin carbon monoxide heteropolymer, polyolefin, cyclic olefin copolymer, olefin copolymer and homopolymer, and any mixture thereof Ethnic group. 13. For example, a halogen-free flame-retardant polymer composition according to item 12 of the application, wherein the thermoplastic polymer of A) is selected from the group consisting of styrene-butadiene 10-stage copolymer, polystyrene, High impact polystyrene, acrylonitrile-butadiene-styrene (ABS) copolymer, and styrene-acrylonitrile copolymer. 14. For example, the halogen-free flame-retardant polymer composition according to item 11 of the application, wherein the modified polyfunctional epoxy resin is an epoxy resin having an average of more than one epoxy group per molecule. Material made of epoxy resin. 15 15. The halogen-free flame-retardant polymer composition according to item 11 of the patent application scope, wherein the modified polyfunctional epoxy resin has functionalities modified with more than one modifier. 16. For example, the halogen-free flame-retardant polymer composition according to item 11 of the application, wherein the modified polyfunctional epoxy resin contains less than 15% by weight and 20% of residual epoxy groups, which is Based on the total weight of the epoxy resin. 17. The halogen-free flame-retardant polymer composition according to item 16 of the application, wherein the modified polyfunctional epoxy resin contains less than 12% by weight of residual epoxy groups, which is based on The total weight of the epoxy resin. 18. For example, the halogen-free flame-retardant polymer group 34 200538502 of the scope of application for the patent, wherein the modified multifunctional epoxy resin contains less than 18% by weight of residual epoxy groups, It is based on the total weight of the epoxy resin. 19. An article produced from a flame-retardant polymer composition containing no halogens in the scope of claims 1 or 18. 35 200538502 柒、指定代表圖: (一) 本案指定代表圖為:第()圖。(無) (二) 本代表圖之元件代表符號簡單說明: 捌、本案若有化學式時,請揭示最能顯示發明特徵的化學式:35 200538502 (1) Designated representative map: (1) The designated representative map in this case is: (). (None) (II) Brief description of the element representative symbols of this representative diagram: 捌 If there is a chemical formula in this case, please disclose the chemical formula that can best show the characteristics of the invention:
TW93114090A 2004-05-19 2004-05-19 Halogen free ignition resistant thermoplastic resin compositions TW200538502A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93114090A TW200538502A (en) 2004-05-19 2004-05-19 Halogen free ignition resistant thermoplastic resin compositions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93114090A TW200538502A (en) 2004-05-19 2004-05-19 Halogen free ignition resistant thermoplastic resin compositions

Publications (1)

Publication Number Publication Date
TW200538502A true TW200538502A (en) 2005-12-01

Family

ID=52349066

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93114090A TW200538502A (en) 2004-05-19 2004-05-19 Halogen free ignition resistant thermoplastic resin compositions

Country Status (1)

Country Link
TW (1) TW200538502A (en)

Similar Documents

Publication Publication Date Title
US20050239975A1 (en) Halogen free ignition resistant thermoplastic resin compositions
EP1592746B1 (en) Halogen free ignition resistant thermoplastic resin compositions
KR101473774B1 (en) Thermoplastic resin composition with polyphenylene ether having improved impact resistance and flame retardancy
JP2004176068A (en) Flame-retardant resin composition
KR19990014062A (en) Thermoplastic resin composition
JP2009521536A (en) Flame retardant thermoplastic resin composition
JP2007530774A (en) Method for producing poly (arylene ether) composition
JPH10310694A (en) Thermoplastic resin composition
KR101473776B1 (en) Flame Retardant Thermoplastic Resin Composition Having Improved Environmental Stress Cracking Resistance
TW200538502A (en) Halogen free ignition resistant thermoplastic resin compositions
JPS63275661A (en) Polyphenylene ether resin composition of excellent flame retardancy
TW200427749A (en) Ignition resistant polymer compositions
JP3245474B2 (en) Flame retardant resin composition with excellent surface impact strength and rigidity
JP2002210734A (en) Method for manufacturing styrene resin pellet
JPH09188791A (en) Flame-retardant styrene resin composition
JPS6036550A (en) Impact-resistant polyphenylene ether resin composition
JPS63139940A (en) Low molecular brominated polystyrene as fire retardant for polyphenylene ether-containing resin composition
JP2000017165A (en) Thermoplastic resin composition
JPH0812831A (en) Flame-retardant resin housing material
JP2000119484A (en) Flame retardant resin composition
JP2000345045A (en) Silicon-type nonhalogen flame retardant
JPS5853947A (en) Polyphenylene ether composition for injection molding use and its preparation
JPH11116791A (en) Thermoplastic resin composition
JPH10306207A (en) Thermoplastic resin composition
JPH0270750A (en) Thermoplastic resin composition