TW200524186A - Light emitting device and lighting apparatus using the same - Google Patents

Abstract

A light emitting device includes: a plurality of LED mounted substrates (4), each having an LED element (12) emitting light of a short wavelength; a case (2) having a concave portion having a reflection surface (2a) on which a wavelength conversion unit (3) is arranged for emitting converted light by the short-wavelength light of the LED element (12); and a thermo-conductive substrate support plate (5) standing at the center portion of the bottom of the concave portion of the case (2). The reflection surface (2a) is a parabolic plane formed along the both sides of the LED substrate support plate (5). The LED mounted substrates (4) are arranged at the both sides of the LED substrate support plate (5) in such a manner that the light emitting surfaces of the LED elements (12) respectively face the reflection surface (2a).

Description

200524186 IX. Description of the invention: [Technical field to which the invention belongs]-The present invention relates to a high-efficiency light emitting device using a light source of a light emitting diode and a lighting device using the device. [Prior Art] Many inventions have been made about conventional light-emitting devices and lighting devices using light-emitting diodes (LEDs). Among them, for example, several methods are proposed to realize a high-efficiency lighting device that takes out reflective light after converting the emitted light from the LED into the second light. The following is an example in which a light emitting device is realized by combining a short-wavelength [ED and a fluorescent substance]. In the conventional light-emitting diode, a part of the emitted light beam emitted from the light-emitting diode element is directed toward the light-emitting surface side of the light-emitting diode element and the reflecting surface facing the light-emitting diode element, and a part is directly transmitted. The light-transmitting member is projected backwards®. On the reflecting surface, a light-emitting object that emits visible light by receiving an emission beam from the light-emitting diode element is mainly used to emit light in a visible light range of more than 50 nm. In addition, the components in the ultraviolet light range below 400 nm in the emitted light beam directly to the surface of the light-transmitting member are reflected by the dry / y film 20, and then returned to the transparent resin material to encounter the fluorescent light of the adhesive layer μ. The object is converted into visible light, and the self-emission surface is emitted from the interference film directly or after being reflected to the reflective surface (for example, refer to Patent Document 丨). [Patent Document U.S. Patent No. 2001-345483 (paragraphs 0020 to 0026, FIG. 1). 2148-6713-PF 5 200524186 [Summary of the Invention] Problems to be Solved by the Invention Since the conventional light emitting diode can effectively utilize the ultraviolet light field of the light beam emitted from the light emitting diode element, the device device using the light emitting diode can High performance and energy saving. In addition, since the deterioration and yellowing of the light-transmitting member caused by ultraviolet rays from sunlight can be prevented, the life of the light-emitting diode when used outdoors can be improved, and it is particularly suitable as a room-phase image display device. However, the structure of the electrode member is an obstacle in this structure, and has a disadvantage that the light extraction efficiency is reduced. In addition, in the case of a plurality of LEDs in order to increase the light emission amount of the device body, it is difficult to increase the electrode area while maintaining the efficiency to increase the light emission amount. In addition, a method of directly providing an interference film on the light-transmitting member, ^ However, the light-transmitting member must be a liquid or jam-like material that is not solid enough to be used as a transparent material. In the case of using the light-emitting surface facing down, the LED element is buried in the transparent LED The structure reduces the heat radiation and luminous efficiency of the heat generated on the surface of the element, or shortens the life of the element. The purpose of the present invention is to obtain a high-efficiency, long-life light-emitting device and a lighting device using the device: Use ―lower use of short-wave county umbrellas such as LED components ° Use multiple to make or dissipate heat. ', ^ The efficiency of the case of the light is reduced, the problem of hand-free problem solving

2148-6713-PF 6 200524186 The light-emitting device of the present invention includes: a plurality of LED assembly substrates, assembling LED elements that emit short-wavelength light; and a housing having a concave portion provided with a wavelength of the short-wavelength light emitting converted light using the LED element The reflecting surface of the transforming part; and the thermally conductive LED substrate supporting board standing on the central part of the bottom surface of the concave part of the casing, the reflecting surface is formed by a paraboloid formed on both sides of the standing part of the substrate supporting plate Structure; The LED assembly substrate is mounted on both sides of the LED substrate supporting plate so that the light emitting surfaces of the LED elements face the reflecting surface, respectively. [Embodiment] Embodiment 1 FIG. 1 is a cross-sectional view of a light-emitting device according to an embodiment of the present invention (cross-sectional view of FIG. 2B), FIG. 2 is a top view of the light-emitting device, and FIG. 3 is an LED assembly substrate of the light-emitting device From the top view, FIG. 4 is a cross-sectional view of a LED assembly substrate of a light-emitting device (cross-sectional view of FIG. 3B), and FIG. 5 is an explanatory view of a wavelength conversion material of the light-emitting device. In FIG. 1 and FIG. 2, this light-emitting device is composed of the following components. An LED assembly substrate 4 is assembled with a short-wavelength led 7G member 12 having a peak in the near ultraviolet region, and a housing 2 having a reflective surface 2 & The concave portion; the wavelength conversion portion 3, which is provided on the reflective surface 2a inside the housing 2, uses the light emitted from the LED element 12 as the excitation light, converts the wavelength, and emits the second light that is the converted light. The substrate support plate 5, stands It is provided at the center of the bottom of the reflective surface 2a of the recessed portion, and supports the LED assembly substrate 4 on both sides, which has thermal conductivity; a light-transmitting plate i is installed in the opening portion of the casing 2; and a highly thermally conductive member 40 is disposed in the basket The central part of the back of the body 2. Alas, two pieces of LED assembly substrate 4 are mounted on both sides of the substrate support 2148-6713-PF 7 200524186 board 5 so that each of them is an LED element. In the light emission, the lateral direction of the reflection ❿ of the concave portion of the MU body is a translucent plate! As a light-emitting surface that emits light emitted from the inside of the body to the outside, you can use a light-transmitting plate such as glass grease. The reflecting surface 2a of the recessed portion is formed by a ridgeline portion 2 "'formed at the center of the bottom portion, and a reflecting surface 2a2 composed of two parabolic surfaces having a valley portion along both sides of the ridgeline portion 2al, and the parabolic surface. The side surfaces 2a4 at both ends are formed. The substrate supporting plate 5 is fitted in a groove provided in the ridge portion w to stand on one side of the substrate supporting plate 5 and the high thermal conductivity member 40 partially contacts. In addition, the housing 2 is considered to be processed It is made of a resin with good heat resistance, but it may be made of a highly thermally conductive member such as metal in consideration of heat dissipation. Next, the structure of the LED assembly substrate 4 is shown in FIGS. 3 and 4. For the heat dissipation of the LED element 12 related to the lifetime or luminous efficiency of 12, a metal substrate is used for the LED substrate 10. In order to maintain the electrical insulation of the metal substrate, an insulating layer 15 is provided on the substrate, and a conductive pattern η is provided thereon. The LED element is assembled on the substrate 2. In addition, a structure in which an insulating layer 15 is provided in a portion excluding the assembly portion of the LED element 12 on the conductive pattern 11 is used. In addition, the LED layer 16 is placed on the LED via the adhesive layer 16. The light distribution characteristic of the front surface of the mounting substrate 4 is a structure in which the LED assembly substrate upper plate 13 and the LED substrate 10 that emit the short-wavelength light emitted from the LED element 12 to the side direction are joined. The LED assembly substrate upper plate 13 is matched with the LED element 12 Reflective holes 1 4 are set in the configuration, and the side of the reflective hole 14 is set to diffuse 2148-6713-pp 8 200524186 or mirror-like high reflectance surface-At H. The hand is emitted from other surfaces from Γ p η: LJ Τ The surface of the LED assembly substrate upper plate 13 is, for example, metal bite tree = two perforations 14 and other surfaces in order to improve the lighting efficiency: ° In addition, the soil is painted, or the surface is evaporated with a highly reflective material. In addition, In order to improve the extraction efficiency of light from Τρη-Μ ^ Α, 1212, the reflection on the LED, and the mounting plate on the substrate 1 3 a 7 π also, 4 14 branch transparent molding material 17 to make the LED Element 12. Here, because the LED το 12 is a short-wavelength light, the transparent molding material 17 is made of, for example, and ## α, a silicon or glass material with light resistance. LED element 12 # Miscellaneous + 乜 & ^

It is also possible to use a structure with a foul path, and by adopting this structure, the light extraction efficiency can be improved. The LED substrate 1G is a glass epoxy substrate that does not interfere with its function as a light emitting device. However, as described above, a metal substrate is used in order to improve the heat dissipation of the heat generated by the LED element 12. For other heat-dissipating substrates, a thin heat-conductive substrate with a high thermal conductivity can be used, or a ceramic material can be used. Here, the LED element 12 does not specify a type of light-emitting type of a front-mount type or a flip-chip type. In addition, in order to improve the overall reflectance of the reflection hole 14 Θ, the surface insulating layer on the metal substrate t led substrate is coated with a paint or the like having a high reflectance. In addition, in the structure similar to the LED assembly substrate 4 of this embodiment, there are LED package components on the market which are integrated with the LED substrate and the LED substrate upper plate and are made of ceramic or high thermal conductivity resin. In the case of using such a commercially available LED package in the light emitting portion of the light emitting device, the same effect as that of the present embodiment can be obtained without losing its essential function. 2148-6713-PF 9 200524186-Here, the reflection hole 14 of this embodiment and the reflection hole of the package on the market have high reflectivity for the short-wavelength light emitted by the LED and the surface of the upper board 13 of the LED assembly substrate and The surface of the package on the market is composed of a member having a high reflectance of the converted wavelength light converted by the wavelength conversion section, and a light emitting device with high light emitting efficiency with little light loss in those parts can be obtained. As shown in FIG. 5, for example, the wavelength conversion section 3 is composed of three kinds of mixed glazes each having a blue emission spectrum, a green emission spectrum S3, and a red emission spectrum 84 that emit light with a spectrum that excites the short-wavelength LED emission spectrum S1. This structure is used to achieve white light emission, but when the fluorescent materials are mixed, the mixing ratio of the three fluorescent materials is achieved in accordance with the ratio of improving the luminous efficiency and improving the color separation (c0r rendering). With this structure of the wavelength conversion section 3, the conventionally used blue light-emitting LED element and YAG (Yttrium that emits yellow light when excited by its wavelength)

Compared with the method of achieving white light emission by a light-emitting object, a light emitting device with high color separation properties can be obtained because the spectral components of the emission spectrum are continuous in the converted light domain. ^ However, the short-wavelength LEDs constituting this light-emitting device emit ultraviolet, near-ultraviolet, or purple or blue light, and the above is not limited to the use of blue light-emitting LED elements and YAG-based fluorescent materials. In addition, in the case of short-wavelength LED light using ultraviolet light or near-ultraviolet light having purple or blue-violet light, the types of fluorescent materials excited by the light include blue, green, and red. Therefore, by using its selection and combination to obtain any light color other than white or, for example, S2, S3, and S4 shown in FIG. 5, which have a narrow-spectrum spectrum, for example, a color 2148 that can also be applied to liquid crystal display devices can be obtained. -6713-PF 10 200524186 A light emitting device that reproduces a wide field. In addition, when the short-wavelength LED emits light with a near-ultraviolet light emission having a violet or blue-violet emission wavelength (approximately 36 to 43nm), it is generally more fluorescent in this wavelength range than the ultraviolet light. It has low excitation efficiency, but has the characteristics of low light absorption and high luminous efficiency. Therefore, by using a near-ultraviolet LED, a light-emitting device having less deterioration of a member and less adverse effects on a biological surface can be obtained while maintaining high luminous efficiency. & As shown above, since

There are a lot of fluorescent objects with excitation bands, which has the advantage of being able to design the luminescent color arbitrarily. The LED element 12 generally reduces the luminous efficiency when the internal temperature or ambient temperature of the element increases, but when the light-emitting device is used as a lighting device 'In many cases, the light-emitting surface of the light-emitting device is used in a downward direction. In this case, the structure of the present invention in consideration of heat dissipation is effective in terms of light emission efficiency or element life. In particular, the substrate supporting plate 5 is made of a thermally conductive material such as metal, and the thermally conductive member 40 having a structure in which one side is located in the air provided on the back surface of the housing 2 is brought into contact with the LED element. The thermal spring heat dissipation path can improve heat dissipation. Examples of thermally conductive materials include thermal conductivity, copper, and metal ceramics. In addition, 'as shown in FIG. 2', by making the end of the button side of the substrate support plate 5 and the side of the recessed portion inside the housing 2 at 4 (point A on the dotted line in FIG. 2), The contact end is on the upper side and emits light as a side

When the device is used, it is possible to ensure the heat radiation control along the base plate support floor plate 5 and to obtain a high heat radiation effect. 2148-6713-PF 11 200524186-In this structure, the LED element 12 of the LED assembly substrate 4 mounted on both sides of the substrate support plate 5 standing freely in the center of the recess of the housing 2 emits short-wavelength light as excitation light. The converted light that emits light after the wavelength is converted by the wavelength conversion unit 3 provided on the reflective surface 2a of the concave portion of the housing 2 is radiated through the translucent plate 1.

As shown above, including the child body 2, the concave portion has a reflecting surface 2a provided with a wavelength conversion portion 3 that converts the short-wavelength light emission conversion light of the ED element 12; and a thermally conductive substrate support plate 5, which is erected in the present The center of the bottom surface of the recessed part of the casing 2 is because the LED assembly substrate 4 with the LED elements 12 assembled on both sides of the substrate support plate 5 can improve the heat dissipation of the LED assembly substrate 4 and use a large output composed of a plurality of LED elements. In the case of an LED assembly substrate, an increase in the temperature of the LED element can be suppressed, and as a result, a large-beam light-emitting device having a long life can be obtained. The effect of the present invention is also effective in a case where there is only one LED element. In addition, the LED yak has a large current drive and a large pure output that has been accelerated in recent years, so that it can also be installed with LED components (high power components) with high heat generation. In addition, in this embodiment, a highly thermally conductive member is mounted on the back surface of the housing 2 so as to be in contact with the substrate supporting plate 5, but the highly thermally conductive member 40 'is not installed, so that at least the substrate supporting floor plate 5 is constituted by the highly thermally conductive member. The center of the bottom surface of the recessed portion of the casing 2 may be used. Also, as shown in FIG. 6, by disposing a heat-radiating member such as a heat sink 24 instead of the high-thermal-conductivity member 40 in contact with the end portion of the substrate supporting plate 5, the heat radiation effect can be further improved. Another example is a case where the casing 2 is formed of a metal plate, but

2148-6713-PF 12 200524186% Because the heat from the substrate support plate 5 transfers heat to the radiating fins 24, the material of the casing 2 shown in Figure 丨 may be a non-metallic material such as resin or plastic. In addition, a structure other than the heat sink 24 which provides a high heat radiation effect may be a structure in which a heat pipe or a Peltier element is used in contact with the end portion of the substrate support plate 5 like the heat sink 24. As shown in FIG. 31, the LED mounting substrate 4 may be positioned diagonally above the reflecting surface 2a for the substrate mounting portion 5a of the substrate supporting plate 5. With this structure, the image of the light source of the 1Ed element 12 cannot be directly seen from the front side of the translucent plate 丨. Also, as shown in FIG. 32, the substrate mounting portion 5a of the substrate support plate 5 may be formed in an inverted triangle shape. The old surface of the LED assembly substrate 4 has a thickness to improve the heat dissipation effect. The inverted surface of the substrate mounting portion a of the present structure is preferably a reflectance reflecting surface, and may be in contact with the light-transmitting plate 1. In addition, instead of the thick casing 2 as shown in Figs. 1 and 6, a thin metal plate may be used as shown in Fig. 7. In Fig. 7, not only the housing 2 but also the reflection portion 29 provided with the wavelength conversion portion 3 is also constituted by the same metal plate. In addition, the use of the LED support board waste 41 41 to support the substrate support plate made of a highly thermally conductive material can improve the heat dissipation effect by being mounted on the metal casing 2. Further, by installing a highly heat-radiating member such as a heat sink 24 on the rear surface of the Kuang body 2, the heat radiation characteristics can be improved. In addition, as a result of improving the heat dissipation of the LED element 12, the wavelength shift unique to [ΕΕ) can be suppressed to a small range. As a result, when using a plurality of fluorescent substances, the respective emission spectrum changes can be changed. Very small, can get the luminous color of son-in-law. 2148-6713-PF 13 200524186 In addition to directly placing the skin change office 3 on the reflective surface 2a of the recessed part of the casing 2, it is connected in the figure, and an additional soft wavelength at the wavelength k is not set-drag # 斗 立 田ϋ? Apply a wavelength conversion length in advance: 25 pieces for changing materials. With this structure, in the method of the reflection section 29, even when the radiation surface H reflection section 29 转 is directly turned to the wavelength conversion section 3, the reverse uniformity is deteriorated. In addition, the 7-shaped system is complicated, which can eliminate the uniformity of the thickness of the coating film. At this time, the wavelength is changed: the method is simple, and the luminous efficiency can be improved. 3, as shown in FIG. 3, the adhesive 61 in the structure # 卜卢 八 田 contains a system, which is cured on the basis of one or more fluorescent substances 60 of the main sword. == For example, it is resin or water, but it is selected on the premise that it can be processed between the product and the work material: the light is not affected by the light. In this embodiment, the shape of the reflective surface 2a of the concave portion that is good in weatherability and light transmittance and can be adapted to 1 # # ti is made of, for example, a silicon material having flexibility. Also, with respect to at least] P-the short-wavelength light emitted from 1 1, 70 and 12 is high-reflection. Brother surface or diffusive material constitutes the surface of sheet 25 for additional soft wavelength conversion material. With this structure, by using the surface 7 of the additional flexible wavelength conversion sheet 5 that once passed through the wavelength conversion section 3, the light is directed toward the adhesive (UV12). Improve wavelength conversion efficiency. At this time, if the surface reflectance of the sheet 25 for adding a soft wavelength conversion material is also a material having a high reflectance for the wavelength-converted light, it is possible to efficiently reflect the light after the wavelength conversion in the adhesive to the device. 'A light emitting device having a higher light emitting efficiency can be obtained. As the sheet 25 for adding a soft wavelength conversion material, for example, a multilayer structure sheet such as pET, polyimide, or silver can be used. This directly sets the wavelength conversion section 3 on the reflective surface 2a of the recessed part of the housing 2. At 2148-6713-PF 14 200524186, at least the wavelength conversion section 3 is formed by using the material of the high reflection section, which is like a fruit. In addition, the high-reflectivity material system and the body can also be formed, or it can be formed on the Dong body 2 by using Shao or silver or other electroplating.义 菇 # Also, the wavelength conversion section 3 of the light-emitting device can be directly coated with the adhesive material or spray mixed with the phosphor, or the vapor-evaporation can be used to form the phosphor. At this time, With the above-mentioned & high = emissivity material, at least the wavelength conversion portion 3 is provided as an arrangement portion, and a light-emitting device with high light-emitting efficiency can be provided. 〃 In addition, as shown in FIG. 7, by providing a light-emitting wavelength portion of the reflective LED element 12 on the inner back surface of the translucent plate, a light emitting device or an evaporation material that transmits light in other wavelength regions is transmitted. Light reflection; 26 'does not cause the emitted light of the LED element 12 to emit light directly to the outside because it can be used again as a light efficiency of a member that contributes to light emission from the wavelength conversion section 3. Back ~: Outside 'has nothing to do with the presence or absence of the LED light-reflecting portion 26. The surface of the casing 2 is completely blocked by the light-transmitting plate U, and then the mouse is sealed inside the casing 2 or it is set to a true state, etc.' A structure for improving airtightness is also possible. ^ The light-transmitting plate i has the function of improving the contact protection of the parts inside the house: weather resistance function. However, depending on the use conditions, the basic function of the light-emitting device can be used to implement it, and it may not be installed. Furthermore, by using the lens system 27 in the opening of the housing 2 in structure, the light distribution can be changed arbitrarily. The lens is made of optical glass or stone material with good light resistance, and the shape of the lens is changed to convex or concave according to the purpose. (The picture makes 2148-6713-PF 15 200524186 the light is concentrated to the front center of the device to some extent). 5 i is also reversed on the substrate support. For example, by setting a diffused reflective mask 28 'with a high & emissivity, the light source image of the LED element 12 when viewed from the light emitting side can be eliminated, and the diffused reflection can be reduced. Sexual cover $ 28 in itself. η. In addition, in Figs. 1, 6, and 7, the shape of the recessed portion of the housing 2 is set to a curved shape. However, for example, the bottom surface of the recessed portion may be flat. The function of the light-emitting device is not affected by the recessed portion. Shape disappears. For example, in Fig. M, the bottom surface and side surface of the concave portion are not made flat, and Fig.% Shows a structure diagram where the bottom surface of the concave trowel is flat and the side surface is curved. The reflecting surface 2a is preferably a paraboloid, but at least a part of the paraboloid is changed to a paraboloid that is as large as the paraboloid. A plane with a substantially similar surface can also be used to improve processing, but it can also be used as a separate component. In the above, the substrate support plate is described as a separate component. ^ The substrate support plate and the thermal conductivity value 2-the structure of the body 22 The structure of the metal plate and the like installed below the yak structure will maintain the same heat dissipation function. Embodiment 2 Fig. 8 is a cross-sectional view (a cross-section B of Fig. 9) of a light-emitting device showing the second example of the present September, and Fig. 9 is a top view of the light-emitting device. In FIG. 8 and FIG. 9, # + cogni i — eight η ^ is the same as or equivalent to that in FIG. 1 of the first embodiment 丨 The symbol & On the carcass 2 night ρ Xiao »The opposite sides of the adjacent edge of the sweat mouth will have high thermal conductivity loss

2148-6713-PF 16 200524186 piece 40 is installed so that the side faces the reflective surface 2a2 at the bottom of the recess and is inclined so as to protrude inward. The reflecting surface 2a2 at the bottom is a plane, forming the opposite side 2a3 where the highly thermally conductive member 40 is installed, so that the reflecting surface 2 & 2 from the bottom is enlarged outward toward the opening 邛, and the other facing sides are formed so that the reflecting surface at the bottom 2a2 is vertical. The LED assembly substrate 4 'is mounted on the inner surface side of the thermally conductive member 40 so that the light emitting surface of the LED το component faces the reflective surface 2a2 of the bottom surface of the recessed portion. In this structure, the light emitted from the LED element 12 of the LED assembly substrate 4 is used as the excitation light, and the second light that emits light after the wavelength is converted by the wavelength conversion of the reflective surface 2a provided on the inside of the housing 2 passes through the light-transmitting plate.丨 Launch. At this time, the heat generated from the led element 12 is dissipated through the LED assembly substrate 4, the substrate support plate 5, the highly thermally conductive member 40, and the heat sink 24. As shown above, the highly thermally conductive member 40 mounted on the inside of the opening edge of the housing 2 with the inner side facing the reflecting surface 2a2 of the bottom surface of the recessed portion is installed so that the light emitting surface of the LED 70 piece 12 faces the bottom reflecting surface 2a2. The LED and the broken substrate 4 ′ make it impossible to directly see the image of the light source of the element 12 from the front side of the light-transmissive plate 丨 and the wavelength conversion section 3 adopts the same structure as that of the embodiment i to obtain white light emission. In addition, the heat dissipation property of the LED assembly substrate 4 can be improved, and the luminous efficiency of the led element 12 itself can be prevented from being reduced, and the life can be shortened. In addition, in this embodiment, the LED assembly substrate 4 is located on two opposite sides of the edge portion of the opening portion of the casing 2, but as shown in FIG. 10, it may be provided on four sides. Moreover, although the shape of the bottom surface of the recessed part of the casing 2 is made into a flat surface, it may be made into a curved shape, for example, and it does not affect the light emitting function. A side view of the situation 2148-6713-: PF 17 200524186 is shown in Figure 36. The recessed part of the casing 2 is a quadrangle in a top view, but it may be a circular shape. In addition, as shown in FIG. 11 (cross-sectional view B in FIG. 12) and FIG. 9, -._ "口 i2, the high thermal conductivity structure 彳 40 is provided on the back of the high thermal conductivity member 40, so that the heat dissipation effect is also obtained. can. In this embodiment, a high thermal conductivity member 40 supporting the LED assembly substrate 4 is mounted on the opening edge portion of the housing 2. However, instead of the portion where the high thermal conductivity member 40 is mounted, it is also possible to form at least this part with a high thermal conductivity member. . Further, the structure in which the substrate support plate and the heat-conducting casing are integrated can also be used to maintain the heat dissipation function ζ in this case, as in the case of separate component construction. Embodiment 3 FIG. 13 shows Embodiment 3 (section B in FIG. 14) of the present invention, and FIG. 14 shows FIG. 14 of a light-emitting device. The same or similar symbols as those in Embodiment 丨 are omitted from description. Sectional view of a light emitting device. In Fig. 13, the reflecting surface 2a of the recessed part of the same casing 2 as the same figure is composed of two parabolic surfaces with a tube-like shape with valley portions on both sides along the central ridgeline portion 2al and the main ridgeline portion 2a. The reflecting surface 2a2 is shaped, and the two side surfaces 2a3 which are flush with the ridge line portion 2ai ^ — * 女 strike the LED assembly substrate 4 so that the [ED element reflecting surface 2a2. The first surfaces of the soil face β, and highly radiating members such as fins are attached to the back surfaces of the two side surfaces 2a3 of the value body 2. X, the diffuse reflective mask 28 is set to protrude inward at the edge portion of the opening surface of the housing on the light extraction side, so that the image of the light source of 2148-6713-PF 18 200524186 LED element 12 cannot be directly seen. In this structure, the light emitted from the LED element 12 of the LED assembly substrate 4 is used as the excitation light, and the second light (white light) emitted after the wavelength is converted by the wave ^ conversion section 3 of the reflection surface 2a2 provided inside the housing 2 Prepared for transmission through the translucent plate i. At this time, the heat generated from the LED το member 12 is radiated through the LED assembly substrate 4, the side surface 2a3 of the casing 2, and the heat sink 24. As described above, the reflecting surface 2a of the recessed portion of the housing 2 is composed of a ridgeline portion 2al in the central portion and two paraboloid-shaped reflection surfaces 2a2 having a tubular shape with valley portions on both sides along the ridgeline portion 2al. The LED assembly substrate 4 is mounted parallel to the two side surfaces 2a3 of the portion 2a1, so that the light emitting surfaces of the LED elements 12 face the reflective surface 2a2 respectively. Since the heat sink 24 is installed on the two side surfaces 2a3, the heat generated from the LED element 12 passes through the housing 2 The heat sink 24 on the side dissipates heat into the air, so that the LED element 12 can maintain high luminous efficiency, and the life of the LED element 12 can be extended. Since the diffuse reflective mask 28 is provided on the edge of the opening surface, the image of the light source of the LED element 12 when viewed from the light emitting surface side can be eliminated. In addition, 'without women's heat sinks 2 4', at least two sides 2 & 3 of the recess 2 of the housing 2 on which the LED assembly substrate 4 is mounted may be constituted by a highly thermally conductive member, and heat sinks 24 may also be installed to improve the heat dissipation effect. . As shown in FIG. 15 (section of FIG. 16B) and FIG. 16, the LED assembly substrate 4 is provided on the two sides 2 a 3 of the recessed portion of the housing 2 with an opening having the same size as the LED assembly substrate 4. There is no light leakage from the recessed portion of the housing, and the LED assembly substrate 4 is in direct contact with the air through the opening, so that the heat dissipation characteristics may be good. At this time, by disposing the heat sink 24 on the back of the LED assembly substrate 4 2148-6713-PF 19 200524186-, the heat dissipation characteristics can be further improved. In addition, the structure is such that the ridge line portion 2a1 of the recessed portion of the housing in which the wavelength conversion portion 3 is provided in FIG. 13 is located above the optical axis center (line c in FIG. 13) of the LED element 12, and the wavelength conversion portion can be highly efficient. The light emitted from the LED element t can be limited to the wavelength conversion efficiency of the station. In addition, as shown in FIG. 37, the reflecting surface formed as a 杬 line σ 卩 in FIG. 13 has a structure having a flat portion on the reflecting surface, and the wavelength conversion function can be maintained. As shown in FIGS. 17 and 18, the concave portion of the casing 2 is circular, and a convex portion 2a5 is disposed at the center and a reflective surface 2a2 formed by a circular paraboloid formed along the outer periphery of the convex portion 2a5. also may. With this structure, it is possible to improve the wavelength, the odor exchange efficiency, and the light extraction efficiency. The circular shape of the concave portion of the housing 2 may be a polygonal shape close to a circular shape. In addition, the LED assembly substrate 4 may be composed of a metal substrate or a ceramic substrate having high heat dissipation properties. However, considering the ease of assembling to the housing 2, for example, a flexible substrate having a high heat resistance such as polyimide may be used. In addition, as shown in FIG. 14, the heat dissipation effect can be improved by installing a heat sink 24 on the back of the casing 2. Embodiment 4 FIG. 19 is a cross-sectional view of a light-emitting device according to Embodiment 4 of the present invention (section B of FIG. 20), FIG. 20 is a top view of the light-emitting device, and FIG. 2 is a cross-sectional view of the light-emitting device (FIG. 20A section). In FIG. 19 to FIG. 21, the same reference numerals are given to the same or equivalent parts as those in the figure of the embodiment 丨, and the description is omitted. The reflecting surface 2a of the concave portion of the casing 2 is a reflecting surface 2a2 composed of a ridgeline portion 2a1 on both sides and a rectangular parabolic surface having a rectangular shape in the upper view, with a valley portion between this 2148-6713-PF 20 200524186-ridgeline portion 2al. The plurality of ridgeline portions 2a1 are arranged in contact with each other, and both end portions in the direction of the ridgeline portion 2al of each reflection surface 2a2 are supported by the side surface 2a3 of the casing 2. The LED assembly substrate 4 is mounted on the side surface 2a3 of the opposite casing so that the optical axis of the LED element 12 assembled on the LED assembly substrate 4 passes between the reflection surfaces 2a2 formed by the paraboloids. In this structure, the light emitted from the LED element 12 of the LED assembly substrate 4 is used as the excitation light. The second light that is emitted after the wavelength is converted by the wavelength conversion unit 3 of the respective reflection surface 2a2 provided inside the housing 2 is transmitted through the light. Sex board 丨 launch. At this time, the heat generated from the LED element 12 is dissipated through the LED assembly substrate 4, the side surface 2 a 3 of the casing 2, and the heat sink 24. As described above, the reflecting surface 2a is composed of a complex ridgeline portion 2a1 and a reflecting surface 2a2 composed of a tubular paraboloid having a valley portion on both sides along the ridgeline portion 2al. The side 2 & 3 of the housing is mounted on the LED assembly substrate 4 with the LED and the light emitting surface of the wave substrate 4 facing the reflecting surface 2a2, so that the light emitted from the LED element 12 can be converted in a range along the optical axis. Since the wavelength is converted by the wavelength conversion section 3 without a large light loss, the wavelength conversion efficiency and the light extraction efficiency from the light-emitting device can be improved. Embodiment 5 FIGS. 22 to 25 are cross-sectional views showing a light-emitting device according to Embodiment 5 of the present invention. 22, 23, and 24 are diagrams of Embodiment 6 of FIG. 6, FIG. 8 of Embodiment 2, and FIG. 13 of Embodiment 3, and FIG. 25 shows the wavelength of 2148-6713-PP 21 200524186 in FIG. 6 The size of the transform section 3. In FIGS. 22 to 24, adjust the reflection shape angle of the reflection hole 14 of the reflection hole 14 of the upper plate 13 of the LED group substrate in Example 1 to FIG. 4 as shown in FIG. 22, as shown in FIG. 22 ~ Figure 24 + ^ _ No, structurally, the light distribution of the light emitted from the LED element 12 of the LED assembly substrate 4 is entered into the recess of the housing 2 seen from the coffee _ member 12 (make the figure Within the angle δ with the led element ^ optical axis). With this structure, it is possible to reduce the wavelength change, and radiate the light emitted from the LED element 12 with high efficiency, thereby realizing a light emitting device with high efficiency. In addition, as shown in FIG. 25, the drilled part of the wavelength conversion section 3 provided on the reflecting surface 2a of the recessed part of the housing 2 is structured so as to be located in the irradiation range (irradiation angle β) of the emitted light of the erbium element 12. With this structure, the area of the wavelength conversion section 3 can be reduced, the cost of the wavelength conversion section can be reduced, and the device can be made cheap. At this time ', by setting the reflection φ 2a of the material without the wavelength conversion portion to a state of high reflectivity, high luminous efficiency can be maintained. The reflective surface 2a may be formed of a specular reflective material such as Shao, but if it is formed of a white material with high diffuse reflectivity, it is difficult to recognize the boundary between the wavelength conversion section 3 and the reflective surface 2a from the light-emitting surface side, and a beautiful light-emitting device can be obtained. Embodiment 6 ^ FIG. 26 FIG. 28 to FIG. 30 are cross-sectional views (FIG. 27A) of a lighting device using a light-emitting device according to Embodiment 6 of the present invention, and FIG. 27 is a top view of FIG. 26 and FIG. 28 to FIG. . In this embodiment, four light-emitting devices shown in Embodiments 1 to 3 are used.

2148-6713-PF 200524186 is installed as the earliest open lighting fixture. In FIGS. 26 to 30, a lighting device 52 for lighting the light-emitting device 51 is provided on the upper portion of the lighting device in structure, and a commercial power source of the lighting device 52 can be supplied through the power input section 53 of the lighting device. The lighting power is supplied via the lighting device 52 to the power supply input section led element 12 provided in the light emitting device 51. Four light emitting devices 5 i are arranged from the center in four directions. Fig. 26 shows a case where the light-emitting device 5 of the first embodiment is used, and the light-emitting device body 50 of the lighting device is provided with a south thermally-conductive member 40 made of metal or the like directly or via a high-thermal-conducting seal.

In this structure, the heat generated from the LEDs of the light emitting device 51 is dissipated to the luminaire housing 50 via the LED assembly substrate 4, the substrate support plate 5, and the highly thermally conductive member 40. FIG. 28 shows a case where the light-emitting device 5 j of the first embodiment in which the heat sink 24 is worn is applied to a lighting device. The mounting portion of the light-emitting device 51 of the lighting fixture is configured such that the heat sink 24 of the light-emitting device 51 and the air are in direct contact. With this structure, the convection cooling at the upper part of the lighting fixture can also be used, and the heat radiation effect can be further improved. FIG. 29 shows the high thermal conductivity of the light-emitting device 51 installed in the lighting fixture basket 50 of the lighting fixture directly or via a high thermal conductivity seal, etc., using a light emitting device 51 equipped with a high thermal conductivity member 40 in Example 2. Building block 40. With this structure, the heat generated by the side of the light-emitting device 51 is dissipated to the lighting fixture housing 50 through the 基板 assembly substrate 4 and the highly thermally conductive member 40. Fig. 30 shows a light emitting device 51 equipped with a high heat conducting element 40 in place of the heat sink 24 in Example 3, and the lighting device 2148-6713-PF 23 200524186 -body 50 directly or via A portion of the housing 2 of the light-emitting device 51 on which the LED assembly substrate 4 is mounted is sealed with a high thermal conductivity. In this structure, the heat generated from the LEDs of the self-luminous clothes 5 is dissipated to the lighting fixture housing 50 through the LED, the substrate 4 and the high thermal conductivity member 40 of the housing 2. As described above, the temperature rise of the LED element 12 can be suppressed, and a lighting device having excellent light emitting efficiency and a long life can be obtained. In addition, part of the emitted light from the light emitting device 51, and the other part is the light reflected by the reflection 56, and the illumination light can be obtained by using the mixed light. At this time, in order to improve the lighting efficiency, the reflecting plate 56 is preferably a highly reflective material. Depending on the purpose of the lighting application, it is also possible to use a diffusing surface or mirror finishing. Embodiment 7 FIG. 38 is a cross-sectional view (a cross-section in FIG. 39B) of a light-emitting device according to Embodiment 7 of the present invention, and FIG. 39 is a top view of the light-emitting device. In Figure u, Figure 37, For and Example! The same symbols are assigned to the items or equivalent parts, and the description is omitted. The LED assembly substrate 4 is used to assemble the LED element 12 that emits short-wavelength light in the same manner as in the first embodiment; and the housing is provided with a reflecting surface 2a of the wavelength conversion section 3 that emits converted light using the short-wavelength light of the LED element in the recess. Here, the reflecting surface 2a is formed of a parabolic surface formed opposite to the LED assembly substrate 4. The LED assembly substrate 4 is structured such that one of the side surfaces in the recessed portion of the housing faces the light emitting surface of the LED assembly substrate 4 on which the reflecting surface 2a is mounted. A light-emitting device 2148-6713-PF 24 200524186 for the LED assembly substrate 4 is installed on one side of the casing 2 except that the light-transmitting plate 1 is used to face the lower side. The side of the heat sink 24) becomes the upper side, so that the light-transmitting plate 丨 faces the rank direction. The heat generated by the LED element 12 can be heated upward along the casing, and a light-emitting device with good heat dissipation and high luminous efficiency can be obtained. . At this time, by limiting the maximum light distribution angle of the LED emitted light to the angle δ of the maximum light distribution in FIG. 38 in the reflecting surface 2a, the wavelength conversion section 3 can be efficiently irradiated to become the primary excitation light of the wavelength conversion section. LED emits light, which can realize a light-emitting device with high luminous efficiency. Again, as shown in Figure 40, and implementation

In Example 3, the use of a mirror surface or a light-reflective mask 62 'having a high diffusivity on a similar surface can also reduce the ratio of the light emitted from the LED directly incident on the light-transmitting plate 1, and a light-emitting device with good light-emitting efficiency can be obtained. In addition, a structure in which the light reflection mask 62 is integrated with the housing is also possible. In addition, the reflecting surface of the concave portion: a, for example, as shown in item 41, is also composed of a plane approximately similar to a paraboloid. As shown in FIG. 42, a wavelength conversion function can also be realized by forming a paraboloid and a flat surface. ^ In FIG. 43 (cross section B in FIG. 44), the wavelength conversion section 3 is formed of a paraboloid formed opposite to the LED and the mounting substrate 4, and is structurally formed on the edge of the opening of the concave part of the value body. The highly thermally conductive member 40 of one of the inclined members may face the light-emitting surface of the LED assembly substrate 4 toward the reflecting surface 2a. And Figures 3, 8 and 9-for mounting, in addition to the use of the light-transmitting plate 1 facing downward, the use of the light-transmitting plate i facing laterally as L ρ η ~ # breaks the substrate 4 to the upper side The method can also provide a light emitting device with good heat dissipation and high light emitting efficiency. Cardiac heart Figure 45 is an assembly of LEDs with a thick thermal conductive member 54

2148-6713-PF 25 200524186 Example of the back surface of the substrate 4 'can obtain a high heat dissipation effect. Here, as shown in FIG. 45, the wavelength conversion unit 3 may be provided on the side of the light source in terms of structure. In addition, FIG. 43 and FIG. 45 show the case where the reflecting surface 2a is a parabolic surface, but it is also possible to change at least part of the parabolic surface to a plane approximately similar to the parabolic surface. Depending on the mounting position of the LED assembly substrate 4, the bottom is also a flat surface. Yes, it is composed of parabolic surface and flat surface, which can improve workability. As shown in FIG. 46, a recess is provided in a part of the bottom surface inside the housing 2, and a wavelength conversion section 3 is disposed in the recess. A light emitting device having a high luminous efficiency can also be obtained with a structure in which the light distribution angle g is located in this area. In addition, by narrowing the light distribution angle and reducing the area of the wavelength conversion section, a light-emitting device that is inexpensive can be obtained. In addition, the light-emitting device 51 having the structure shown in this embodiment is, for example, as shown in FIG. 47 (showing the surface of the appliance), "the lighting device housing 5G for improving the heat dissipation of the light-emitting device is incorporated", and it can be used as a light-emitting device with high light-emitting efficiency. Large beam lighting fixture. In the case of arranging a plurality of rectangular lighting fixtures arranged in the direction of the paper surface, also shown in the figure: 'The structure side of the device or the back of the casing is brought into contact (close contact) with the lighting fixture casing 5 made of a thermally conductive material. 〇 to ensure heat dissipation. At this time, since the light-emitting device 51 can diffuse white light 'from the wide wavelength conversion portion thereof, it is possible to obtain a lighting fixture with reduced uncomfortable strong light. As shown in «48 (Cross-section view of the table), it can be used as a luminaire equipped with a plurality of light-emitting devices 51 to improve the heat dissipation structure. By arranging a plurality of them in the depth direction of the paper surface, a luminaire with a large beam surface can be obtained. . Fig. 48 The opening of the lighting fixture casing formed of a thermally conductive material

2148-6713-PF 26 200524186 • An example of the light-emitting surface (translucent plate 1) of the light-emitting device fitted after 50c. .... The moon appliance value body 50 has a front opening portion 50a (the surface of the light emitting surface of the lighting fixture) on the front, and a bottom portion 50b having an opening portion 50c on the light emitting surface side of the housing 2 to which the light emitting device 51 is inserted, forming a box shape. The inner surface of the bottom 50b is covered with a high reflectance material, and the front opening portion 50a is covered with a diffuse transmission plate 63. In addition, a standing portion 50d is provided on the back side from the front opening portion 50a, so that the lighting fixture housing 50 and The light emitting device 51 is easy to conduct heat and is easy to fix. In addition, it is preferable that the bottom surface 5013 of the lighting fixture housing 50 and the respective surfaces of the light-transmitting plate 1 of the light-emitting device have no step. In this structure, the light emitted from the self-luminous device 5 丨 transmits the diffuse transmission plate 3 and the light is reflected by the diffusion transmission plate 63. The light reflected by the diffusion transmission plate 63 is reflected by the high reflectivity material at the bottom 50b of the lighting fixture housing 50. The transmission diffuses behind the transmission plate 63 and emits. In addition, the heat generated from the light emitting device 51 is radiated from the housing 2 to the lighting fixture housing 50 through the standing portion 50d of the lighting fixture housing 50. As a result, the temperature rise of the LED element 12 can be suppressed, and a lighting device having a good light emitting efficiency and a long life can be obtained. Also, because part of the emitted light from the light-emitting device 51, and the other blade is the light reflected by the reflection plate 56, the illumination light is transmitted after transmitting the diffusion transmission plate 63, which can become uniform illumination light, which can obtain high luminous efficiency, Lighting equipment with uniform lighting. In addition, by controlling the driving power of each light emitting device, the divided lighting of the light emitting surface can also be controlled. Moreover, the lighting fixture of this structure can also be used as a lighting light source, such as a 2148-6713-PF 27 200524186 liquid crystal display device. Hereinafter, another structure of the wavelength conversion unit 3 of the present light-emitting device will be described with reference to Fig. 49, Fig. Vn gate 50, and Fig. 51. Fig. 49 is a sectional view of the light-emitting device, and Fig. 51 is a plan view of Fig. 49 and Fig. 50. The reflectance surface between the wavelength conversion sections 3 in FIG. 49 constitutes an arrangement portion thereof, and the surface of the wavelength conversion section 3 is opened. The shape of the clothes + clothes is formed into an uneven shape. With this structure, in the case of a basket having a certain fixed size ^ relatively flat structure of the wavelength conversion unit 3 ', it is possible to ensure that the LEDs on the surface of the wave-changing unit are always Λ

LtDj has a wide light area, and as a result, a highly efficient light-emitting device can be obtained. In addition, as shown in FIG. 5Q, the surface of the wavelength conversion section 3 is formed into a concave-convex shape, and the reflection φ 2a is formed in accordance with the shape: the thickness of the fluorescent conversion section can be fixed by increasing the LED lighting area. The spears are as shown in Fig. 49, and a light emitting device with a high luminous efficiency can be obtained. In addition, the concave-convex shape of the wavelength conversion section 3 is, for example, as shown in FIG. 51 (^), and may be a pyramid shape as shown in FIG. 51 (b), or may be a straight triangular wave I. Also, as shown in FIG. 5 (1). It can also be set as a curved triangular waveform. All make the distance between the inclined parts of the reflecting surface 2a smaller than that of the flat part. As shown in Figure 5 1 (c), when the number of LED elements 12 is small, The distance between the concave-convex shape part and the element 12 is the same, and the effect is good. Also, the structure of the wavelength conversion section is not limited to this embodiment, and it can be implemented with a wavelength conversion section configured as in the above embodiment. For example, The effect is good when the wavelength conversion unit 3 shown in Fig. 46 is used, etc. The above "this embodiment shows the light-emitting device 51 and the lighting fixture using the same", but the lighting fixture shown in the sixth embodiment uses the 2148 of this embodiment. -6713-PF 28 200524186 The same result can be obtained for the light-emitting device 51 of 200524186. The present invention includes a body having a reflection of a wavelength conversion portion provided with a short-wavelength light emission conversion light using an LED element in a recess ... LED substrate support plate, standing in the basket The central part of the bottom surface of the recessed portion; because the mounting groups are mounted on both sides of the substrate support plate, the assembly substrate of the ㈣ component is used. The use of a plurality of LED elements will not reduce the luminous efficiency, X, excellent heat dissipation, and light extraction efficiency from the luminous surface. The light-emitting device and lighting device with high life can be obtained. [Brief description of the drawings] FIG. 1 is a cross-sectional view showing a light-emitting device according to Embodiment i of the present invention. FIG. 2 is a top view of FIG. 1. FIG. The top view of the assembly substrate of the light emitting device of the embodiment i of the invention. Fig. 4 is a sectional view showing the assembly substrate of the light emitting device of the embodiment i of the invention. Fig. 5 shows the light emitting device of the embodiment of the invention. The structure explanatory diagram of the wavelength conversion material. Fig. 6 is a cross-sectional view showing a light-emitting device according to an embodiment of the present invention. Fig. 7 is a cross-sectional view showing a light-emitting device according to an embodiment of the present invention. Sectional view of the light-emitting device of Embodiment 2. Fig. 9 is a top view of Fig. 8. 214 8-6713 -PF 29 200524186 Fig. 10 is a top view of a light-emitting farm according to Embodiment 2 of the present invention. A cross-sectional view of a light-emitting device according to Embodiment 2 of the present invention. Fig. 12 is a top view of Fig. 11. Fig. 13 is a cross-sectional view of a light-emitting vibration apparatus according to Embodiment 3 of the present invention. Fig. 14 is a top view of Fig. 13 A cross-sectional view of a light-emitting device. Fig. 15 shows a third embodiment of the present invention. Fig. 16 is a top view of Fig. 15. Fig. II is a cross-sectional view of a light-emitting device according to a third embodiment of the present invention. Fig. 17 is a top view. Fig. 19 is a cross-sectional view showing a light emitting device according to a fourth embodiment of the present invention. Fig. 20 is a top view of Fig. 19. Fig. 21 is a cross-sectional view showing a light emitting device according to the fourth embodiment of the present invention. Fig. 22 is a sectional view showing a light emitting device according to a fifth embodiment of the present invention. Fig. 23 is a sectional view showing a light emitting device according to a fifth embodiment of the present invention. Fig. 24 is a sectional view showing a light emitting device according to a fifth embodiment of the present invention. Fig. 25 is a sectional view showing a light emitting device according to a fifth embodiment of the present invention. Fig. 26 is a sectional view of a lighting fixture according to a sixth embodiment of the present invention. FIG. 27 is a top view of FIG. 26. Fig. 28 is a sectional view of a lighting fixture according to a sixth embodiment of the present invention. Fig. 29 is a sectional view showing a lighting fixture according to a sixth embodiment of the present invention. Fig. 30 is a sectional view showing a lighting fixture according to a sixth embodiment of the present invention. Fig. 31 is a cross-sectional view showing a structural example of a substrate supporting plate of a light emitting device according to the first embodiment of the present invention. Fig. 3 2 is a cross-sectional view showing a structural example of a substrate support 2148-6713-PF 30 200524186 board of the light emitting device according to the first embodiment of the present invention. Fig. 33 is a diagram showing an example of the structure of a wavelength conversion unit according to the first embodiment of the present invention. Fig. 34 is a sectional view showing a light emitting device according to the first embodiment of the present invention. Fig. 35 is a sectional view showing a light emitting device according to the first embodiment of the present invention. Fig. 36 is a sectional view showing a light emitting device according to a second embodiment of the present invention. Fig. 37 is a sectional view showing a light emitting device according to a third embodiment of the present invention. Fig. 38 is a sectional view showing a light emitting device according to a seventh embodiment of the present invention. Fig. 39 is a top view showing a light emitting device according to a seventh embodiment of the present invention. _ FIG. 40 is a sectional view showing a light emitting device according to a seventh embodiment of the present invention. Fig. 41 is a sectional view showing a light emitting device according to a seventh embodiment of the present invention. Fig. 42 is a sectional view showing a light emitting device according to a seventh embodiment of the present invention. Fig. 43 is a sectional view showing a light emitting device according to a seventh embodiment of the present invention. Fig. 44 is a top view showing a light emitting device according to a seventh embodiment of the present invention. Fig. 45 is a sectional view showing a light emitting device according to a seventh embodiment of the present invention. Fig. 46 is a cross-sectional view showing a light emitting device according to a seventh embodiment of the present invention. FIG. Is a cross-sectional view of a lighting fixture using the light-emitting device of Embodiment 7 of the present invention. Fig. 48 is a sectional view of a lighting fixture using the light-emitting device of Embodiment 7 of the present invention. Fig. 49 is a sectional view showing a light emitting device according to a seventh embodiment of the present invention. : 50 is a sectional view showing a light emitting device according to a seventh embodiment of the present invention. 51 (a) to (c) are plan views of Fig. 49 and Fig. 50.

2148-6713-PF 31 200524186 [Description of main component symbols] 1 Translucent plate, 2 Housing, 2a, 2a2 Reflective surface, 2a 1 Edge line portion, 2a3, 2a4 side, 3 Wavelength conversion portion, 4 LED assembly substrate, 5 substrate support plate, _ 12 LED elements, 24 heat sinks, 40 high thermal conductivity members, 50 lighting fixture housings, 51 light emitting devices, 60 fluorescent materials, 61 adhesives, 62 light reflection masks, _ 63 diffuse transmission plates .

2148-6713-PF 32

Claims (1)

200524186 10. Scope of patent application: 1. A light-emitting device comprising: a plurality of LED assembly substrates to assemble LED elements that emit short-wavelength light; a casing having a wavelength conversion that uses a short-wavelength light emission conversion light of the LED element to be arranged in a recess A reflective surface of the LED substrate; and a thermally conductive LED substrate supporting plate erected at the central portion of the bottom surface of the recessed portion of the housing; characterized in that: the reflective surface is formed on both sides of the standing portion of the LED substrate supporting plate The formed parabolic surface structure; the LED assembly substrate is mounted on both sides of the LED substrate supporting plate so that the light emitting surfaces of the LED elements face the reflecting surface respectively. 2. A light emitting device comprising: a plurality of LED assembling substrates for assembling a LED device that emits short-wavelength light; a casing having a reflecting surface provided with a wavelength conversion section for converting light using the short-wavelength light emission of the LED element in a recess; and The LED substrate support plate is disposed on the inner side of the opening edge portion of the casing with the inner side facing the bottom surface of the recess; and is characterized in that: the far LED substrate support plate has the light emitting surface of the LED element facing the bottom surface of the recess on the reflective surface; The LED assembly substrate is mounted. 3. A light-emitting device comprising: a plurality of LED assembling substrates, assembling a LED element that emits short-wavelength light; 2148-6713-PF 33 200524186 The casing 'has a recessed portion that uses the short-wavelength light emitted by the LED element to convert the wavelength of light The reflecting surface of the transforming part; It is characterized in that: / The reflecting surface is composed of a ridgeline part in the central part and a parabolic surface having a valley shape on both sides along the ridgeline part; ^ 在 # " The LED assembly substrate is mounted on both sides of the casing so that the light emitting surface of the LED element faces the reflecting surface. 4. A light-emitting device comprising: a plurality of LED assembling substrates for assembling a led element emitting short-wavelength light; and a reflector having a reflecting surface, and a recessed portion is provided with a wavelength conversion portion utilizing the short-wavelength light emission conversion light of the LED element, It is composed of a convex part in the central part and a substantially circular paraboloid formed along the outer periphery of the ° convex part. It is characterized in that the light emitting surfaces of the LED elements are respectively directed toward the reflection on the side of the casing surrounding the convex part. This LED assembly substrate is mounted on the surface. 5. The light emitting device according to item 3 of the scope of patent application, wherein the apex of the ridge line portion or the convex portion of the reflecting surface is located closer to the opening surface side of the body than the optical axis of the LED element. 6. The light-emitting device according to item 4 of the scope of patent application, wherein the apex of the ridgeline portion or the convex portion of the reflecting surface is located closer to the opening surface side of the housing than the optical axis of the LED element. 7 · —A kind of light-emitting device, including a plurality of LED assembling substrates for assembling LED elements emitting short-wavelength light; 2148-6713-PF 34 200524186 and a housing having a recessed portion provided with the use of] LED elements for short-wavelength light emission conversion The reflecting surface of the wavelength conversion portion of light; characterized in that: the reflecting surface is composed of a complex ridgeline portion and a tube-shaped complex parabolic surface with valley portions on both sides along the ridgeline portion; The LED assembly substrate is mounted on the side of the casing such that the light emitting surfaces of the LED elements face the reflecting surfaces. 8. A light emitting device comprising: a plurality of LED assembling substrates for assembling a component that emits short-wavelength light; and a casing having a reflecting surface provided with a wavelength conversion portion for converting light using the short-wavelength light emission of the LED element in the recess; It is characterized in that: the reflecting surface is formed by a parabolic surface formed opposite to the LED assembly substrate, and an inclined member provided on one side surface in the recessed portion of the casing or one side of the opening edge portion of the recessed portion of the casing makes the LED element emit light The LED assembly substrate is mounted with its surface facing the reflective surface. 9. The light-emitting device according to any one of claims 1, 3 to 7, wherein the parabolic surface constituting at least a part of the parabolic surface of the reflecting surface is replaced with a plane similar to the parabolic surface. 10. The light-emitting device according to any one of claims 1 to 8, wherein at least a portion of the housing on which the LED assembly substrate is mounted is set as a thermally conductive material. 2148-6713-PF 35 200524186 1 1 The light-emitting device according to any one of claims 1 to 8, wherein a heat sink is installed on the back of the housing on which the LED assembly substrate is mounted. 1 2 The light-emitting device according to any one of claims 1 to 8, wherein the light distribution angle of the emitted light from the LED element is the angle that the emitted light illuminates as if the emitted light enters the opposite reflecting surface. 1 3. The light-emitting device according to any one of claims 1 to 8 in which a wavelength conversion material is provided only on a part of the reflecting surface illuminated by the emitted light from the LED element, and the reflecting surface is not illuminated by the emitted light A part is provided with a reflective material. g 1 4 · The light-emitting device according to any one of claims 1 to 8 in the scope of patent application, which includes an LED light-emitting light reflecting portion, and reflects at least one side of the light-transmitting plate to reflect part or all of the wavelength of the short-wavelength light. The light is transmitted and taken out, and the converted light converted by the wavelength conversion unit includes part or all of the wavelength light. 15. The light-emitting device according to any one of claims 1 to 8 in the scope of patent application, wherein at least the surface of the reflecting surface on which the wavelength conversion portion is provided is used for short-wavelength light and wavelength-converted light emitted from the LED element. Material with high reflectivity. 1 6. The light-emitting device according to any one of Shenqiao's patent scope Nos. 丨 8, wherein at least the wavelength conversion part of the reflecting surface is provided with a surface at least for short-wavelength light emitted by the LED element and Light reflecting sheet with high reflectivity after wavelength conversion. 1 7 · The light-emitting device according to any of claims 1 to 8 in the declaration of patent scope, wherein the constituent material of the wavelength conversion part is transparent and has a soft shape 2148-6713-PF 36 200524186. Light sheet material. 18. The light emitting device according to any one of items 1 to 8 in the female patent claim, wherein the surface of the wavelength conversion portion is formed in a concave-convex shape. 19. The light-emitting device according to any one of claims 1 to 8 in claiming the patent scope, in which the surface of the LED assembly board is used for the short-wavelength light emitted by the LED element and the use wavelength辔; ^ e ^ α is formed by exchanging a material with high reflectance after 4 wavelength conversion. 20. As stated in the patent, the light-emitting device of any one of the eighth to eighth items, wherein the '忒 LED assembly substrate is made of a highly thermally conductive material. 21. The light-emitting device according to any one of the scope of the patent application, wherein the short-wavelength light is purple or blue-violet. 22. A lighting fixture, characterized in that a lighting device in any one of items 1 to 8 of the scope of patent application is used in the lighting fixture. The lighting device, wherein the lighting causes the guide of the housing of the light-emitting device to contact the housing. 23 · If the case of the appliance in the scope of the patent application No. 22 is composed of a thermally conductive material, at least a part of the thermal member and the lighting 24 · If the appliance is in the scope of the patent application 帛 23, the housing of the lighting trap is formed A box shape having a front opening portion on the front side, and an opening portion on the light emitting surface side of the 'X-ray centered cymbal body' is inserted at the bottom. The bottom surface is made of a highly reflective material, and the front surface is covered with a diffuse transmission plate Openings. 2148-6713-PF