SU1641849A1 - Conducting cement compound - Google Patents

Abstract

The invention relates to the production of electrically conductive adhesive compositions and can be used in tribor-and aggregation engineering to remove residual charge, etc. The invention improves electrical conductivity, strength and heat resistance by using as a epoxy resin a mixture of 1,2-epoxy - Aminobenzoic acid propyl ester and a condensation product of 1,1-di (hydroxymethyl) -3-cyclohexene with epichlorohydrin. The adhesive composition contains, in wt.h .: 1,2-ethoxypropyl ether of aminobenzoic acid 100, condensation product 1, T-di xymethyl-O-3-cyclohexene with epichlorohydrin 10-50; low molecular weight polyamide 60-120; diacetone alcohol 10-40; carbonyl nickel 450-800. 1 tab. EZ

Description

The present invention relates to the preparation of electrically conductive adhesive compositions used in instrument making and assembly to remove residual charge, etc.

The purpose of the invention is to increase the conductivity, strength and heat resistance.

The proposed composition contains the following components, wt%:

1,2-Epoxypropyl

aminobenzoic ester

acids (4P682) 100

Condensation product

1,1-pi- (hydroxymethyl) -3

cyclohexene with

epichlorohydrin

(UP-650D) 10-50

Low molecular weight

polyamide (D-20) diacetone alcohol 2,4,6-Tris (dimethyl-aminomethyl) -phenol 6J36, 2

(UE-)

70-120 20-60

8-20

Carbonyl nickel (PNK)

450-800

The electrically conductive composition is made up of the individual components at the place of consumption by their mixing.

Electrical resistivity is determined as follows.

In a fluoroplast-4 cuvette with a size of 3x5x20 mm, the test specimens were cured at 80 ° C for 3 hours, while prior to curing in the cuvette

Brass electrodes are fixed. The calculation of the electrical resistivity Oy produced by

formula

PV

Rjj 1

R

1 and 5

- measured resistance determined by the resistance

- accordingly length

and the sample area,

Strength properties were determined in accordance with samples from aluminum D16.

The compositions and properties of specific compositions are given in the table.

The table shows that the proposed compositions have significantly higher electrical conductivity (more than 10 times) and adhesive strength than is known.

Violation of the quantitative ratios of the starting components impairs the properties of the compositions (examples 4-5).

When using ED-20 epoxy-diane resin as epoxy resin (examples 6-8),

0

five

Claims (1)

significant deterioration in performance. Invention Formula An electrically conductive adhesive composition comprising an epoxy component, a low molecular weight polyamide, diacetone alcohol and carbonyl nickel, characterized in that, in order to increase conductivity, strength and heat resistance, it contains as a epoxy component a mixture of 1,2-epoxypropyl ether aminobenzoic acid and condensation product of 1,1 di {hydroxymethyl) -3-cyclohexene with epichlorohydrin in the following ratio of components, wt. Aminobenzoic acid 1,2-epoxypropyl ester100 The condensation product of 1,1-di- (hydroxymethyl) -3 cyclohexene with epichlorohydrin 10-50 Low molecular weight polyamide 60-120 Diacetone alcohol 10-40 Carbonyl nickel 450-800 1,2-Epoxypropyl-aminobenzoic acid ester (UP-682) 100 100 100 100 100 Condensation product 1, (hydroxymethyl) -3-cyclohexene with epichlorohydrin (UP-650D) 10 25 50 Low molecular weight polyamide L-20 60 90 120 Diacetone alcohol Carbon nickel PNA Epoxidiane 100 100 100 10 20 40 7 80 20 55 80 20 10 50 25 60 90 120 10 20 40 60 10 90 120 20. 40 50 50 ED-20 resin Electrical resistivity Ohm-m 450 600 800 600 600 450 600 800 450 600 800 400 ----- 100 100 100 - - - 100 7 6.7 17 20 75 70 66 44 35 32 50 100 100 100 10 50 25 60 90 120 10 20 40 60 10 90 120 20. 40 50 50 Adhesive strength at 20 ° C, kgf / cm2 Adhesive strength at 80 ° C, kgf / cm2 137 130 110 60 50 40 48 30 40 29 27 50 58 50 48 35 30 33 35 23 38 24 21 thirty Table continuation thirty -hg