SG11202103563XA - Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same - Google Patents
Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the sameInfo
- Publication number
- SG11202103563XA SG11202103563XA SG11202103563XA SG11202103563XA SG11202103563XA SG 11202103563X A SG11202103563X A SG 11202103563XA SG 11202103563X A SG11202103563X A SG 11202103563XA SG 11202103563X A SG11202103563X A SG 11202103563XA SG 11202103563X A SG11202103563X A SG 11202103563XA
- Authority
- SG
- Singapore
- Prior art keywords
- methods
- same
- laser
- operating
- processing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
- B23K26/0861—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane in at least in three axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/704—Beam dispersers, e.g. beam wells
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962799218P | 2019-01-31 | 2019-01-31 | |
US201962832064P | 2019-04-10 | 2019-04-10 | |
US201962854579P | 2019-05-30 | 2019-05-30 | |
PCT/US2020/012219 WO2020159666A1 (en) | 2019-01-31 | 2020-01-03 | Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202103563XA true SG11202103563XA (en) | 2021-05-28 |
Family
ID=71842451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202103563XA SG11202103563XA (en) | 2019-01-31 | 2020-01-03 | Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US20220048135A1 (en) |
EP (1) | EP3917717A4 (en) |
JP (1) | JP7573535B2 (en) |
KR (1) | KR20210111246A (en) |
CN (1) | CN112867578A (en) |
SG (1) | SG11202103563XA (en) |
TW (1) | TWI843784B (en) |
WO (1) | WO2020159666A1 (en) |
Families Citing this family (14)
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US12103110B2 (en) * | 2019-03-22 | 2024-10-01 | Via Mechanics, Ltd. | Laser processing apparatus and laser processing method |
CN112059422A (en) * | 2020-09-12 | 2020-12-11 | 北京航空航天大学 | Laser processing equipment for grinding semiconductor wafer |
US12070898B2 (en) * | 2020-11-12 | 2024-08-27 | Eagle Technology, Llc | Additive manufacturing device with acousto-optic deflector and related methods |
JP7538016B2 (en) * | 2020-11-30 | 2024-08-21 | 株式会社Screenホールディングス | Optical device and three-dimensional modeling device |
US20220176495A1 (en) * | 2020-12-04 | 2022-06-09 | Lawrence Livermore National Security, Llc | System and method for radius of curvature modification of optical plates and lenses by irradiation with optical energy |
US12092581B2 (en) * | 2020-12-17 | 2024-09-17 | The Boeing Company | Laser bond inspection system and method |
KR20240023512A (en) * | 2021-06-21 | 2024-02-22 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Laser processing device including beam analysis system and method for measuring and controlling beam characteristics |
CN113478097B (en) * | 2021-07-05 | 2022-11-29 | 上海维宏智能技术有限公司 | Method, device and processor for realizing circular hole surrounding sorting processing in laser cutting numerical control system and computer readable storage medium thereof |
US20230155341A1 (en) * | 2021-11-16 | 2023-05-18 | Taiwan Semiconductor Manufacturing Company Limited | Laser device and method of using the same |
US11874163B2 (en) | 2022-01-14 | 2024-01-16 | Ophir Optronics Solutions, Ltd. | Laser measurement apparatus having a removable and replaceable beam dump |
KR20240144166A (en) * | 2022-01-28 | 2024-10-02 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Germanium AOD system with parallel and perpendicular orientations |
TW202337606A (en) * | 2022-02-27 | 2023-10-01 | 美商伊雷克托科學工業股份有限公司 | Method and apparatus for thermally stable operation of aods |
TW202411000A (en) * | 2022-06-02 | 2024-03-16 | 美商伊雷克托科學工業股份有限公司 | Laser processing apparatus including laser sensor system and methods of measurement of beam characteristics |
WO2024211097A1 (en) * | 2023-04-07 | 2024-10-10 | Electro Scientific Industries, Inc. | System and method for thermally-stable operation of acousto-optic deflector with reduced acoustic transients |
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JP6826427B2 (en) * | 2016-12-22 | 2021-02-03 | 株式会社村田製作所 | Laser machining equipment and laser machining method |
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-
2019
- 2019-12-25 TW TW108147621A patent/TWI843784B/en active
-
2020
- 2020-01-03 SG SG11202103563XA patent/SG11202103563XA/en unknown
- 2020-01-03 CN CN202080005766.2A patent/CN112867578A/en active Pending
- 2020-01-03 EP EP20748524.4A patent/EP3917717A4/en active Pending
- 2020-01-03 KR KR1020217016628A patent/KR20210111246A/en not_active Application Discontinuation
- 2020-01-03 JP JP2021542372A patent/JP7573535B2/en active Active
- 2020-01-03 US US17/276,736 patent/US20220048135A1/en active Pending
- 2020-01-03 WO PCT/US2020/012219 patent/WO2020159666A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN112867578A (en) | 2021-05-28 |
JP7573535B2 (en) | 2024-10-25 |
TWI843784B (en) | 2024-06-01 |
WO2020159666A1 (en) | 2020-08-06 |
EP3917717A1 (en) | 2021-12-08 |
JP2022518898A (en) | 2022-03-17 |
KR20210111246A (en) | 2021-09-10 |
US20220048135A1 (en) | 2022-02-17 |
EP3917717A4 (en) | 2022-11-30 |
TW202042946A (en) | 2020-12-01 |
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