JP6826427B2 - Laser machining equipment and laser machining method - Google Patents

Description

The present invention relates to a laser processing apparatus and a laser processing method for processing a workpiece using a laser beam.

A laser processing device that performs processing such as drilling a hole in a work piece using a laser is widely used. For example, a laser hole puncher is provided with a processing head (also referred to as a galvano head) having a plurality of galvano scanners and Fθ lenses for one workpiece (hereinafter, also referred to as a workpiece), and one for a plurality of processing heads. The laser emitted from the single laser oscillator is branched and used.

Machining conditions may differ, such as machining a different number of holes in each machining head. If the machining conditions are different, the machining end timing may be different. In that case, the laser continues to oscillate in accordance with the machining head having the latest machining end timing among the machining heads, so that the machining head that has finished machining earlier receives the laser light when the machining is completed. It is necessary to block the laser beam so that the work) is not irradiated. Since the processing using the processing head is very high speed, it is necessary to block the laser beam at high speed. Generally, the optical path is switched at high speed by using an optical path switching device such as AOM (acousto-optic element) or EOM (electro-optical element) to prevent the laser beam from reaching the processing head itself (for example). Patent Documents 1 and 2).

Japanese Unexamined Patent Publication No. 2012-115883 Japanese Unexamined Patent Publication No. 2013-126688

However, the conventional laser processing apparatus requires a separate optical path switching apparatus such as AOM or EOM, which causes a problem that the optical system becomes complicated and a problem that the equipment price becomes expensive.

Therefore, an object of the present invention is to solve the above-mentioned problems and to provide a laser machining apparatus and a laser machining method capable of high-speed laser machining without using an optical path switching device such as AOM or EOM.

In order to solve the above problems, the laser processing apparatus according to the first aspect of the present invention branches the laser light emitted from the laser oscillator into a plurality of processing heads including the first processing head and the second processing head. , A laser processing device that processes a workpiece having a plurality of processing regions by branched laser light, which is attached to each processing head of the plurality of processing heads and scans the laser light from each processing head. Control of switching between the deflector, one or more light-shielding members arranged in a part of the optical path of the laser beam from each of the processing heads, and each processing head of the plurality of processing heads in a processing mode or a discard mode. In the processing mode, the irradiation position of the laser light from the first processing head is set to the processing position in the processing region, while in the discarding mode, the second processing head is said to have the same. It is characterized by having a control unit that scans the laser beam and sets the irradiation position of the laser light from the first machining head from which the machining mode is finished to the light-shielding member until the machining mode is finished. And.

According to the first aspect described above, the laser beam from the processing head can be scanned by the deflector to switch to the discard mode at high speed. As a result, the laser beam can be blocked without using an optical path switching device such as AOM or EOM, so that high-speed laser processing can be performed with a simplified optical system.

Further, in the laser machining apparatus according to the embodiment of the present invention, the light-shielding member is suspended and fixed from the machining head via a mounting member.

According to the above embodiment, the light shielding member can be easily attached to the processing head.

Further, in the second aspect of the present invention, the laser light emitted from the laser oscillator is branched into m processing heads, and n (n ≧ m) processing regions are formed by the branched laser light from the processing heads. A laser processing method in which laser processing is performed on a work piece to be included in each work area by moving the m work heads and / or the work piece to m pieces in the n work areas. A processing head arrangement process in which the m processing heads are arranged corresponding to the processing areas of the above, a laser processing process in which laser processing is performed on the processing areas by the correspondingly arranged processing heads, and a corresponding processing area. The processing head is characterized by including a laser light discarding step of scanning and discarding the emitted laser beam until the machining head that has not been processed finishes the processing step. To do.

In the second aspect described above, the laser beam from the processed processing head is scanned and discarded, so that the laser beam can be blocked at high speed without using an optical path switching device such as AOM or EOM. Therefore, high-speed laser machining can be performed with a simplified optical system.

Further, in one embodiment of the laser machining method according to the second aspect, after all the laser machining in the m machining regions is completed, the m machining heads and / or the workpieces are moved. The moving step of arranging the m machining heads corresponding to the m machining regions different from the m machining regions, the laser machining step, the laser light discarding step, and the moving step are repeated. It further includes a repetitive step.

According to the above embodiment, it is possible to efficiently perform laser machining on a plurality of machining regions.

Further, in one embodiment of the laser processing method according to the second aspect, in the first selective laser processing step, one or more laser processing heads are arranged in a part of the optical path of the laser light from each processing head. By irradiating the light-shielding member with a laser beam, the light-shielding member is thrown away.

According to the above embodiment, damage to the work piece (work) can be prevented by throwing it away at the light-shielding member.

Further, in one embodiment of the laser processing method according to the second aspect, in the first selective laser processing step, laser light from each processing head is applied to at least one or more processing regions of the workpiece. By irradiating the discarding area of the above, discarding is performed.

According to the above embodiment, a new member for discarding while preventing damage to the required machining position by discarding in the discarding area provided in the processing area of the workpiece (work). It is possible to process at high speed without using.

Further, in the third aspect of the present invention, the laser light emitted from the laser oscillator is branched into m processing heads, and n (n ≧ m) processing regions are formed by the branched laser light from the processing heads. This is a laser processing method in which laser processing is performed on a work piece to be included in each work area by moving the m work heads and / or the work piece to m pieces in the n work areas. The processing head arrangement process in which the m processing heads are arranged corresponding to the processing regions of the above, and the processing in which the laser beam of the selected first processing condition is emitted to the laser oscillator and arranged correspondingly. The head laser-processes at least one of the processing regions under the first processing condition, and a processing head that does not perform processing under the first processing condition is emitted until the processing under the first processing condition is completed. It is characterized by including a first selective laser processing step of scanning a laser beam and discarding it.

In the third aspect described above, an optical path switching device such as AOM or EOM is used by scanning and discarding the laser beam from the processing head corresponding to the processing conditions different from the selected first processing conditions. The laser beam can be blocked at high speed without it. As a result, high-speed laser machining can be performed with a simplified optical system.

Further, in one embodiment of the laser processing method according to the third aspect, the first selective laser processing step is followed by a second selective laser processing step, and the second selective laser processing step is performed. The laser beam is emitted from the laser oscillator under the second processing condition, and the correspondingly arranged processing heads perform laser processing on at least one of the processing regions under the second processing condition, and the second processing condition. This includes scanning and discarding the laser beam emitted by the processing head that does not perform processing under the second processing condition until the processing according to the above second processing condition is completed.

According to the above embodiment, different machining conditions can be set, so that various machining patterns can be supported.

Further, in one embodiment of the laser machining method according to the third aspect, the machining conditions of the first selective laser machining step are different from the machining conditions of the second selective laser machining step.

According to the above embodiment, different machining conditions can be set for the new machining area.

Further, in one embodiment of the laser processing method according to the third aspect, in the first selective laser processing step, one or more laser processing heads are arranged in a part of the optical path of the laser light from each processing head. Irradiate the light-shielding member with laser light.

According to the above embodiment, damage to the work piece (work) can be prevented by throwing it away at the light-shielding member.

Further, in one embodiment of the laser processing method according to the third aspect, in the first selective laser processing step, laser light from each processing head is applied to at least one or more processing regions of the workpiece. Irradiate the abandoned area.

According to the above embodiment, a new member for discarding while preventing damage to the required machining position by discarding in the discarding area provided in the processing area of the workpiece (work). It is possible to process at high speed without using.

According to the present invention, it is possible to block laser light that is not used for processing without using an optical path switching device such as AOM or EOM, and laser processing can be performed at high speed. Further, since the optical system can be simplified, it is possible to provide a laser processing apparatus and a laser processing method having excellent cost performance.

It is a schematic perspective view which shows an example of the structure of the laser processing apparatus of this invention. It is a partially enlarged schematic perspective view of FIG. It is a schematic perspective view which shows an example of the laser processing method of this invention. It is a schematic perspective view which shows an example of the laser processing method of this invention. It is a schematic perspective view which shows an example of the laser processing method of this invention. It is a schematic diagram which shows an example of the laser processing method of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings and the like.

Embodiment 1
In the laser processing apparatus according to the present embodiment, the laser light emitted from the laser oscillator is branched into a plurality of processing heads including the first processing head and the second processing head, and the branched laser light is used to branch a plurality of processing regions. It is a laser processing apparatus for processing a workpiece having the above, and is attached to each processing head of the plurality of processing heads and scans laser light from each processing head from a plurality of deflectors and from each of the processing heads. A control unit that switches between one or more light-shielding members arranged in a part of the optical path of the laser beam of the laser beam and each processing head of the plurality of processing heads into a processing mode or a discarding mode. While the irradiation position of the laser beam from the first processing head is set to the processing position in the processing region, in the discarding mode, the processing mode is completed until the processing mode of the second processing head is completed. It is characterized by having a control unit that scans the laser beam and sets the irradiation position of the laser beam from the first processing head to the light-shielding member.

FIG. 1 is a schematic perspective view showing an example of the structure of the laser processing apparatus A according to the present embodiment. FIG. 2 is a partially enlarged view of FIG. 1, and the laser processing apparatus A showing the structure of the processing head branches the laser oscillator 1 that oscillates the laser light and the laser light from the laser oscillator 1 into a plurality of optical paths. The branching mechanism 2 to be used, the plurality of processing heads 3 and 4 for irradiating the workpiece W with the laser beam from the branching mechanism 2, and the processing heads 3 and 4 so as to be located in the processable region below the plurality of processing heads 3 and 4. A movable stage 10 that mounts a plurality of light-shielding members 11 and 12 attached to each of the processing heads 3 and 4 and the workpiece W and moves the workpiece W in the X-axis direction and the Y-axis direction. have. The number of processing heads 3 and 4 is not limited to two, and may be three or more. The movable stage 10 is composed of a first stage 10a and a second stage 10b. Further, the processing head 3 has a deflector 5 for deflecting the optical path of the laser light from the branching mechanism 2 and a condensing unit 7 for condensing the laser light from the deflector 5, and the deflector 5 has an X-axis. It is composed of a deflector 5a and a deflector 5b for the Y-axis. Further, the processing head 4 also has a deflector 6 for deflecting the optical path of the laser light from the branching mechanism 2 and a concentrator 8 for condensing the laser light from the deflector 6. It is composed of an X-axis deflector 6a and a Y-axis deflector 6b. Further, a control unit 20 for switching the machining head between the machining mode and the discarding mode is connected to the machining heads 3 and 4. In FIG. 2, 15 indicates a processable area and 16 indicates a galvano area, which will be described later.

The laser oscillator 1 can use a CO ₂ laser or the like, and emits laser light by a drive signal from a built-in laser light source drive circuit (not shown). A control unit 20 is connected to the laser oscillator 1, and the control unit 20 controls the energy and pulse frequency of the oscillated laser beam. The laser oscillator 1 may oscillate another laser such as a YAG laser or a YVO ₄ laser.

As the branching mechanism 2, a known laser light branching device such as a beam splitter, a half mirror, and an acoustic optical deflector (AOD) can be used.

The processing head 3 includes a deflector 5 and a condenser 7, and irradiates the workpiece W with laser light. A galvano scanner can be used as the deflector 5. The galvano scanner is composed of an X-axis galvano scanner and a Y-axis galvano scanner. Further, the X-axis galvano scanner is composed of an X-axis galvanometer and a deflection mirror rotatably attached to the tip thereof. Further, the Y-axis galvanometer scanner is composed of a Y-axis galvanometer and a deflection mirror rotatably attached to the tip thereof. By rotating these two deflection mirrors, the laser beam can be scanned at an arbitrary irradiation position. Further, the condenser 7 converges the laser beam from the deflector 5, and for example, an Fθ lens can be used. The Fθ lens can collect the laser light that is oscillated by the deflector and is incident at a position displaced from the center of the workpiece W in proportion to the angle of incidence thereof. Although the processing head 3 has been described above, the processing head 4 also has the same configuration and function as the processing head 3.

As the light-shielding member, a metal plate that absorbs laser light, a beam diffuser, a beam damper, or the like can be used. As the metal plate, a stainless steel plate, an iron plate, a copper plate or the like can be used. The light-shielding member is preferably black or a color close to black. Further, it is preferable that the heat energy absorbed by the light-shielding member is absorbed by a cooling means such as cooling water. In that case, it is preferable to use a metal having a high thermal conductivity as the light-shielding member. The light-shielding member can be arranged so as to be located in a part of the optical path of the laser beam from the processing head. For example, the light-shielding member may be suspended and fixed from the processing head via the mounting member. FIG. 2 is an example of the mounting member, and shows an example using an L-shaped mounting member 13 in which one end is fixed to the processing head 7 and the light-shielding member 11 is fixed to the other end. In this embodiment, one light-shielding member is attached to each processing head, but a plurality of light-shielding members may be attached. By attaching a plurality of members, damage to the light-shielding member can be suppressed as compared with the case of one.

The control unit controls the movable stage to position and arrange the plurality of machining heads corresponding to the respective machining regions of the plurality of machining regions. This positioning is performed, for example, by matching the origin position set in the processing region of the workpiece with the optical axis of the laser beam from the processing head. Further, as described above, the control unit controls the deflector and the condensing unit attached to each processing head to scan the laser beam within the processing region of the workpiece to determine the irradiation position of the laser beam. It has a function to switch between the processing position in the processing area and the light-shielding member that becomes the discarding area.

According to the present embodiment, by scanning the laser beam from the processing head with a deflector, it is possible to switch to the discard mode at high speed. As a result, the laser beam can be blocked without using an optical path switching device such as AOM or EOM, so that high-speed laser processing can be performed with a simplified optical system.

Embodiment 2
In the present embodiment, the laser light emitted from the laser oscillator is branched into m processing heads, and n (n ≧ m, n> m in the present embodiment) due to the branched laser light from the processing head. This is an example of a laser processing method in which laser processing is performed for each processing area on a work piece including the processing area of. Hereinafter, description will be made with reference to FIGS. 1 and 3 to 6.

First, m machining heads and / or workpieces (workpieces) are moved, and m machining heads are arranged corresponding to m machining regions in n machining regions (machining head arrangement). Process). The processing heads are arranged, for example, by aligning the origin position set in the processing region of the workpiece with the optical axis of the laser beam from the processing head. This arrangement may be performed by moving the movable stage 10 in the X-axis direction and the Y-axis direction, or the machining head may be moved by a drive mechanism (not shown). Next, laser machining is performed on each machining area by the correspondingly arranged machining heads (laser machining step). The processing conditions (the number of holes to be drilled in this embodiment) are different for each of the plurality of processing areas. Therefore, the time required for processing differs depending on the processing area. In the laser processing process, when the processing of one processing head is completed, the processing by the processing head that has not been processed is continued, while the processing of the processing head that has completed the processing of the corresponding processing area is performed. The laser beam emitted by the head is scanned and discarded (laser light discarding process). Next, after all the laser machining in the m machining regions is completed, the m machining heads and / or the workpieces are moved so as to correspond to the m machining regions different from the m machining regions. Arrange m processing heads (movement process). Further, when each machining head is machined with a new machining area, the laser machining step, the laser light discarding step, and the moving step are repeated (repetition step).

FIG. 4 is a schematic perspective view showing a state of the laser processing process, in which the laser processing apparatus of the first embodiment is used, and the two processing heads 3 and 4 are each in the galvano area 16 in the processable region 15. It shows the case where a hole is drilled at the machining position. FIG. 5 shows a case where the processing is completed by the processing head 4 shown in FIG. 4 and the laser light from the processing head 4 is discarded by the light-shielding member 12. Here, in the present invention, the processable area means an area where laser light can be scanned by a condenser and a deflector when the processing head is in a predetermined position, and the galvano area is defined as a galvano area. , Means the area where processing is actually performed. In the present embodiment, the galvano area is represented by a square shape inscribed in the processable area. This is because by making the processing area square, the workpiece can be easily partitioned into the processing area, and the processing area can be easily managed. The positions of the light-shielding members 11 and 12 are not particularly limited as long as they are a part of the optical path of the laser beam L from the processing head, but are located in the optical path outside the galvano area and reaching the inside of the processable area. Is preferable. This is because when the blocking members 11 and 12 are provided in the galvano area 16, the size of the galvano area 16 that can be substantially used becomes smaller, which causes the movable stage 10 to move, which is necessary when processing the entire surface of the workpiece 10. This is because it means that the number of times increases, that is, the processing tact increases.

Although FIG. 4 shows an example in which the two galvano areas 16 and 16 corresponding to the two processing heads 3 and 4 are separated by a certain interval, they may be adjacent to each other. Further, the number of processing heads is not limited to two, and may be three or more.

Further, instead of the above-mentioned light-shielding member, a discarding region may be provided at at least one place in the processing region of the workpiece, and the laser beam from the processed head may be discarded in the discarding region. it can. FIG. 6 is a schematic perspective view showing an example thereof. The laser beam L from the processing head 3 that has been processed is discarded in the discarding region 17. Further, from the viewpoint of suppressing damage to the workpiece W, it is preferable to have a plurality of discarding points. It is preferable that the discarding area is basically provided in a portion of the work piece that is not used as a product.

Next, the moving process and the repeating process will be described with reference to FIGS. 1 and 6. The workpiece W shown in FIG. 1 is divided into 64 processing regions arranged in a grid pattern of 8 columns in the X direction and 8 rows in the Y direction. FIG. 6 is a schematic top view showing a method of moving the machining head during laser machining, which is an enlarged view of a part of FIG. 1, and shows a case where the machining head is moved for easy explanation. As shown in FIG. 6, the workpiece W has a grid pattern of the eighth row on the uppermost side in the X direction with the lowermost column as the first column and the eighth row on the rightmost wing in the Y direction with the leftmost wing as the first row. It is divided into a plurality of arranged processing areas. The machining head 3 located in the first row of the second column is moved in the Y direction (row direction) one section at a time to align with the machining area of the section to be laser-machined, and laser machining of the machined area of the aligned section. When is completed, the process of moving to the machining area of the adjacent section is repeated to perform laser machining of three machining areas (second row to fourth row in the second column) adjacent to the Y direction (row direction). Do. Further, with respect to the machining head 4 located in the 5th row, as in the case of the machining head 3, 3 machining regions adjacent to the Y direction (row direction) (5th row to 8th row in the second column). Line) laser machining is performed. When the laser machining of the second row is completed, the machining head 3 and the machining head 4 are moved by one section in the X direction (row direction) in the direct upward direction, so that the machining head 3 and the machining head 4 are moved to the third row, respectively. It is arranged in the processing area of the 4th line and the 8th line of. After that, while moving the machining head 3 in the direction from the fourth row to the first row, laser machining of the machining region of the fourth row to the first row is performed. Further, while moving the machining head 4 in the direction from the 8th row to the 5th row, laser machining of the machining region of the 8th to 5th rows is performed. When the laser machining of the third row is completed, the machining head 3 and the machining head 4 are moved by one section in the X direction (row direction) in the direct upward direction, so that the machining head 3 and the machining head 4 are moved to the fourth row, respectively. It is arranged in the processing area of the 1st line and the 5th line of. By repeating this movement in the row direction and the column direction, that is, meandering movement or zigzag movement in the left-right direction, laser machining of a plurality of machining regions arranged in a grid pattern can be performed. Here, the directions of movement in the row direction of the second column and the third column are reversed. As a result, waste of movement of the machining head can be reduced, and more efficient laser machining can be performed.

In the above description, regarding the movement of the machining head, the case where the movement in the row direction is performed first and then the movement in the column direction is described, but the movement in the column direction is performed first and the movement in the row direction is performed later. You may move. Further, the machining head 3 and the machining head 4 are moved separately to the machining area of a predetermined section in the row direction and the column direction (random movement), and laser machining is performed on the machining area of the predetermined section. The laser processing of the workpiece may be performed by repeating. The above description was given for the case where the number of machining heads is two, but even if the number of machining heads is three or more, the above-mentioned jagged movement is repeated, or the above-mentioned random movement is repeated. Laser machining of the workpiece can be performed. Further, although the case where the machining head is moved has been described, the laser machining of the workpiece may be performed by fixing the position of the machining head and moving the movable stage in a zigzag manner or randomly. Further, laser machining of the workpiece may be performed by linearly moving a plurality of machining heads or movable stages in one direction of the X direction or the Y direction instead of the zigzag movement or the random movement. Especially, it is preferable in the case of a long workpiece.

According to the present embodiment, by scanning the laser beam from the processed processing head and discarding it, the laser beam can be blocked without using an optical path switching device such as AOM or EOM. High-speed laser processing can be performed with a simplified optical system.

Embodiment 3
In the present embodiment, the laser light emitted from the laser oscillator is branched into m processing heads, and n (n ≧ m, n> m in the present embodiment) due to the branched laser light from the processing head. This is another example of a laser machining method in which laser machining is performed for each machining area on a work piece including the machining area of. Regarding the parts that overlap with the second embodiment, the description will be omitted or simplified, and the parts different from the second embodiment will be mainly described.

In the second embodiment, laser machining is performed by a plurality of machining heads using the same machining conditions, and machining by unfinished machining heads is continued, while machining of the corresponding machining area is performed from the finished machining head. In contrast to discarding the laser beam, in the present embodiment, the laser oscillator emits the laser beam of the selected first processing condition, and the processing heads arranged correspondingly emit the laser light of the first processing condition. A point having a first selective laser machining step in which laser machining is performed on at least one of the machining regions and the laser beam emitted by a machining head that is not machined under the machining conditions according to the first machining condition is scanned and discarded. Is different. Here, the processing conditions are conditions common to a plurality of processing heads, and examples thereof include energy and pulse frequency of oscillating laser light. According to the present embodiment, not only the same effect as that of the second embodiment can be obtained, but also the machining conditions can be changed for each machining head while the laser beam is emitted, so that the machining time is increased. It is also possible to suppress. It should be noted that machining in a plurality of machining regions is first performed under the same conditions, and then machining under the machining conditions is performed at a timing when machining conditions such as energy of oscillating laser light and pulse frequency fluctuate in one or more machining regions. The processing head that does not perform the above may be discarded. In this case, efficient processing becomes possible.

Further, after the first selective laser machining step, the laser oscillator emits the laser beam of the second machining condition, and the correspondingly arranged machining heads provide a laser to at least one machining area under the second machining condition. A second selective laser machining step may be included in which the laser beam emitted by the machining head that is machined and not machined under the machining conditions according to the second machining condition is scanned and discarded. As a result, it is possible to correspond to various processing patterns by setting different processing conditions.

Further, the machining conditions of the first selective laser machining step in the repeating step may be different from the machining conditions of the second selective laser machining step. This makes it possible to set different machining conditions for the new machining area.

Further, in the first selective laser processing step and the second selective laser processing step, one or more light-shielding members arranged in a part of the optical path of the laser light from each processing head may be irradiated with the laser light. .. It is possible to prevent damage to the work piece (workpiece) by throwing it away at the light-shielding member.

Further, in the first selective laser machining step and the second selective laser machining step, laser light from each machining head may be applied to at least one or more discarding regions of the machining region of the workpiece. By discarding in the discarding area provided in the machining area of the work piece (work), damage to the required machining position can be prevented, and at high speed without using a new discarding member. Processing becomes possible.

1 Laser oscillator 2 Branch mechanism 3,4 Machining head 5,6 Deflection 5a, 6a X-axis deflector 5b, 6b Y-axis deflector 7,8 Condenser 10 Movable stage 10a 1st stage 10b 2nd stage 11 , 12 Light-shielding member 13, 14 Mounting member 15 Machinable area 16 Galvano area L Laser light W Work piece (workpiece)

Claims (12)

Laser processing in which the laser light emitted from the laser oscillator is branched into a plurality of processing heads including a first processing head and a second processing head, and a workpiece having a plurality of processing regions is processed by the branched laser light. It ’s a device,
A plurality of deflectors attached to each processing head of the plurality of processing heads and scanning the laser beam from each processing head, and
A condensing unit that collects laser light from the plurality of deflectors of each processing head,
Wherein and one or more shielding members that are arranged to be positioned on a part of the optical path of the laser beam from the condensing section of the processing head, the whole of the shielding member, the condensing section in a plan view With one or more light-shielding members that overlap and are located outside the galvano area ,
A control unit that switches each machining head of the plurality of machining heads to a machining mode or a discarding mode. In the machining mode, the irradiation position of the laser beam from the first machining head is set in the machining region. On the other hand, in the discarding mode, the laser beam is set to the irradiation position of the laser beam from the first machining head from which the machining mode has ended until the machining mode of the second machining head ends. A laser processing apparatus having the control unit that scans and sets the light-shielding member. The laser processing apparatus according to claim 1, wherein the light-shielding member is suspended and fixed from the processing head via an attachment member. The light-shielding member is located in the processing region of the laser processing apparatus and is located on an optical path reaching the outside of the galvano area for processing the member to be processed, which is a part of the region in the processing region. Item 1. The laser processing apparatus according to item 1. The laser light emitted from the laser oscillator is branched into m machining heads, and the branched laser light from the machining heads is used for each machining region for the workpiece including n (n ≧ m) machining regions. It is a laser processing method that performs laser processing.
A machining head arrangement step of moving the m machining heads and / or the workpiece and arranging the m machining heads corresponding to the m machining regions in the n machining regions. ,
A laser machining process in which laser machining is performed on each of the machining regions by the corresponding machining heads
In the machining head that has finished machining the corresponding machining area, the laser beam emitted is scanned until the machining head that has not finished machining finishes the machining step, and after passing through the condensing portion of the machining head, Including the laser light throwing-out process of throwing away the light-shielding part,
The light-shielding portion is composed of one or more light-shielding members arranged so as to be located in a part of an optical path of a laser beam from the light-collecting portion of the processing head, and the entire light-shielding member is viewed in a plan view. A laser processing method that overlaps the light collecting portion and is located outside the galvano area . After all the laser machining in the m machining regions is completed, the m machining heads and / or the workpieces are moved to correspond to m machining regions different from the m machining regions. The moving process of arranging the m processing heads
The laser processing method according to claim 4, further comprising a repeating step of repeating the laser processing step, the laser light discarding step, and the moving step. In the laser light discarding step, the discarding is performed by irradiating one or more light-shielding members arranged in a part of the optical path of the laser beam from each processing head with the laser beam. The laser processing method described in. The light-shielding member reaches the outside of the galvano area in which the laser beam is scanned by the machining head and which processes the member to be machined, which is a part of the region in the machining region. The laser processing method according to claim 4, which is located on an optical path. The laser light emitted from the laser oscillator is branched into m machining heads, and the branched laser light from the machining heads is used for each machining region for the workpiece including n (n ≧ m) machining regions. It is a laser processing method that performs laser processing.
A processing head arrangement step of moving the m processing heads and / or the workpiece and arranging the m processing heads corresponding to the m processing regions in the n processing regions. ,
The laser oscillator emits a laser beam of the selected first processing condition, and the correspondingly arranged processing heads perform laser processing on at least one of the processing regions under the first processing condition, and the first processing region. Until the processing under the processing condition of 1 is completed, the laser beam emitted by the processing head that does not perform the processing under the first processing condition is scanned, passed through the condensing portion of the processing head, and then discarded in the light-shielding portion. Including the first selective laser machining step and
The light-shielding portion is composed of one or more light-shielding members arranged so as to be located in a part of an optical path of a laser beam from the light-collecting portion of the processing head, and the entire light-shielding member is viewed in a plan view. A laser processing method that overlaps the light collecting portion and is located outside the galvano area . A second selective laser machining step is included after the first selective laser machining step, and the second selective laser machining step causes the laser oscillator to emit a laser beam of a second machining condition, correspondingly. Laser machining is performed on at least one of the machining regions under the second machining condition by the arranged machining head, and machining under the second machining condition is not performed until the machining under the second machining condition is completed. The laser processing method according to claim 8 , wherein the laser beam emitted from the head is scanned and discarded. The laser processing method according to claim 9 , wherein the processing conditions of the first selective laser processing step are different from the processing conditions of the second selective laser processing step. In the first selective laser machining step, the beating discarded by irradiating a laser beam to one or more light blocking member disposed on a portion of the optical path of the laser beam from the respective processing head, claims 8 The laser processing method according to any one of 10 . The light-shielding member reaches the outside of the galvano area in which the laser beam is scanned by the machining head and which processes the member to be machined, which is a part of the region in the machining region. The laser processing method according to claim 8 , which is located on an optical path.

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