[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

SG11201908278RA - Method for cleaning semiconductor wafer - Google Patents

Method for cleaning semiconductor wafer

Info

Publication number
SG11201908278RA
SG11201908278RA SG11201908278RA SG11201908278RA SG 11201908278R A SG11201908278R A SG 11201908278RA SG 11201908278R A SG11201908278R A SG 11201908278RA SG 11201908278R A SG11201908278R A SG 11201908278RA
Authority
SG
Singapore
Prior art keywords
semiconductor wafer
cleaning semiconductor
cleaning
wafer
semiconductor
Prior art date
Application number
Other languages
English (en)
Inventor
Kensaku Igarashi
Tatsuo Abe
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of SG11201908278RA publication Critical patent/SG11201908278RA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02057Cleaning during device manufacture
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02Inorganic compounds
    • C11D7/04Water-soluble compounds
    • C11D7/08Acids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01009Fluorine [F]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG11201908278R 2017-03-29 2018-03-05 Method for cleaning semiconductor wafer SG11201908278RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017065628A JP6686955B2 (ja) 2017-03-29 2017-03-29 半導体ウェーハの洗浄方法
PCT/JP2018/008197 WO2018180224A1 (ja) 2017-03-29 2018-03-05 半導体ウェーハの洗浄方法

Publications (1)

Publication Number Publication Date
SG11201908278RA true SG11201908278RA (en) 2019-10-30

Family

ID=63675389

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201908278R SG11201908278RA (en) 2017-03-29 2018-03-05 Method for cleaning semiconductor wafer

Country Status (8)

Country Link
US (1) US11177125B2 (zh)
JP (1) JP6686955B2 (zh)
KR (1) KR102466269B1 (zh)
CN (1) CN110447088B (zh)
DE (1) DE112018001115T5 (zh)
SG (1) SG11201908278RA (zh)
TW (1) TWI755496B (zh)
WO (1) WO2018180224A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021025092A (ja) * 2019-08-06 2021-02-22 株式会社荏原製作所 基板処理装置
CN119188437A (zh) * 2024-11-26 2024-12-27 山东有研艾斯半导体材料有限公司 一种解决晶圆抛光边缘颗粒聚集的方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2839615B2 (ja) * 1990-01-24 1998-12-16 株式会社東芝 半導体基板の洗浄液及び半導体装置の製造方法
US5415698A (en) * 1992-06-29 1995-05-16 Matsushita Electric Industrial Co., Ltd. Method for cleaning semiconductor wafers
JPH0677201A (ja) 1992-06-29 1994-03-18 Matsushita Electric Ind Co Ltd 基板洗浄方法
JP3146841B2 (ja) * 1994-03-28 2001-03-19 信越半導体株式会社 ウエーハのリンス装置
JP2893676B2 (ja) * 1994-05-19 1999-05-24 信越半導体株式会社 シリコンウェーハのhf洗浄方法
JP2914555B2 (ja) * 1994-08-30 1999-07-05 信越半導体株式会社 半導体シリコンウェーハの洗浄方法
JP3202508B2 (ja) * 1994-11-29 2001-08-27 株式会社東芝 半導体ウェハの洗浄方法
JPH09283483A (ja) 1996-04-08 1997-10-31 Nkk Corp 洗浄装置および洗浄方法
JPH10256211A (ja) * 1997-03-11 1998-09-25 Sony Corp 半導体基板の洗浄方法
US5837662A (en) 1997-12-12 1998-11-17 Memc Electronic Materials, Inc. Post-lapping cleaning process for silicon wafers
TW426874B (en) * 1998-10-14 2001-03-21 United Microelectronics Corp Method for cleaning a semiconductor wafer
US6199564B1 (en) * 1998-11-03 2001-03-13 Tokyo Electron Limited Substrate processing method and apparatus
JP4844912B2 (ja) * 2001-08-01 2011-12-28 野村マイクロ・サイエンス株式会社 フォトレジストの除去方法及び除去装置
JP4020810B2 (ja) * 2002-03-29 2007-12-12 株式会社神戸製鋼所 半導体キャリアの寿命測定装置,その方法
US20050208774A1 (en) * 2004-01-08 2005-09-22 Akira Fukunaga Wet processing method and processing apparatus of substrate
JP6347232B2 (ja) * 2015-06-18 2018-06-27 信越半導体株式会社 シリコンウェーハの洗浄方法
KR101755826B1 (ko) * 2015-08-13 2017-07-10 주식회사 엘지실트론 웨이퍼 세정장치 및 웨이퍼 세정방법

Also Published As

Publication number Publication date
TW201841244A (zh) 2018-11-16
KR20190129876A (ko) 2019-11-20
WO2018180224A1 (ja) 2018-10-04
KR102466269B1 (ko) 2022-11-11
DE112018001115T5 (de) 2019-11-21
US11177125B2 (en) 2021-11-16
TWI755496B (zh) 2022-02-21
US20200027721A1 (en) 2020-01-23
JP2018170366A (ja) 2018-11-01
JP6686955B2 (ja) 2020-04-22
CN110447088B (zh) 2023-03-28
CN110447088A (zh) 2019-11-12

Similar Documents

Publication Publication Date Title
SG11201702033VA (en) Apparatus and method for cleaning semiconductor wafer
EP3245668A4 (en) Cleaning composition and method for cleaning semiconductor wafers after cmp
SG10201701086SA (en) Wafer processing method
SG10201700915XA (en) Wafer processing method
SG10201905294RA (en) Wafer processing method
SG11201704360UA (en) Method for polishing silicon wafer
SG11201709206WA (en) Method for evaluating semiconductor wafer
SG10201904699RA (en) Wafer processing method
SG10201700072UA (en) Wafer processing method
SG11201909787SA (en) Method for polishing silicon wafer
SG11202001663XA (en) Method and apparatus for cleaning semiconductor wafer
IL258223B1 (en) Local semiconductor foil thinning
SG11201808637XA (en) Methods and apparatus for cleaning semiconductor wafers
SG10201700215TA (en) Package wafer processing method
SG10201703264YA (en) Wafer processing method
SG11201807140QA (en) Method for cleaning semiconductor wafer
SG10201911116YA (en) Wafer processing method
SG11202001374SA (en) Method for cleaning silicon wafer
SG10201906678TA (en) Wafer processing method
SG10201905935VA (en) Wafer processing method
SG10201904719TA (en) Wafer processing method
SG10201910165QA (en) Wafer processing method
SG10201909522RA (en) Wafer processing method
SG11201800460YA (en) Method for manufacturing semiconductor wafer
EP3375914A4 (en) METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER