SG11201806774XA - Silazane-siloxane random copolymers, their production and use - Google Patents
Silazane-siloxane random copolymers, their production and useInfo
- Publication number
- SG11201806774XA SG11201806774XA SG11201806774XA SG11201806774XA SG11201806774XA SG 11201806774X A SG11201806774X A SG 11201806774XA SG 11201806774X A SG11201806774X A SG 11201806774XA SG 11201806774X A SG11201806774X A SG 11201806774XA SG 11201806774X A SG11201806774X A SG 11201806774XA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- silazane
- wiesbaden
- pct
- production
- Prior art date
Links
- 229920005604 random copolymer Polymers 0.000 title abstract 3
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- AAOVKJBEBIDNHE-UHFFFAOYSA-N diazepam Chemical compound N=1CC(=O)N(C)C2=CC=C(Cl)C=C2C=1C1=CC=CC=C1 AAOVKJBEBIDNHE-UHFFFAOYSA-N 0.000 abstract 1
- 239000012776 electronic material Substances 0.000 abstract 1
- 230000008520 organization Effects 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/54—Nitrogen-containing linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 24 August 2017 (24.08.2017) WIPO I PCT (10) International Publication Number WO 2017/140407 Al 111111111111110111011111111111010111110111010111111111111111111111111111111111110111111 (51) International Patent Classification: CO8G 77/54 (2006.01) (21) International Application Number: PCT/EP2017/000059 (22) International Filing Date: 19 January 2017 (19.01.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 16000371.1 15 February 2016 (15.02.2016) EP (71) Applicant: AZ ELECTRONIC MATERIALS (LUX- EMBOURG) S.A.R.L. [LU/LU]; Societe a responsabilite limitee, 46 Place Guillaume II, 1648 Luxembourg (LU). (72) Inventors: GROTTENMUELLER, Ralf; Schoen- bergstrasse 35, 65199 Wiesbaden (DE). CASAS GAR- CIA-MINGUILLAN, Abraham; Alte Dorfstrasse 64, 65207 Wiesbaden (DE). KITA, Fumio; Rheinstrasse 105, 65185 Wiesbaden (DE). (74) Agent: B2B PATENTS; Merck Patent GmbH, 64271 Darmstadt (DE). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) W O 20 17 / 140 407 Al (54) Title: SILAZANE-SILOXANE RANDOM COPOLYMERS, THEIR PRODUCTION AND USE (57) : The present invention relates to silazane-siloxane random copolymers as well as their production and their uses, par- ticularly in LEDs.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP16000371 | 2016-02-15 | ||
PCT/EP2017/000059 WO2017140407A1 (en) | 2016-02-15 | 2017-01-19 | Silazane-siloxane random copolymers, their production and use |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201806774XA true SG11201806774XA (en) | 2018-09-27 |
Family
ID=55404558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201806774XA SG11201806774XA (en) | 2016-02-15 | 2017-01-19 | Silazane-siloxane random copolymers, their production and use |
Country Status (9)
Country | Link |
---|---|
US (1) | US10927220B2 (en) |
EP (1) | EP3417002B1 (en) |
JP (1) | JP6843875B2 (en) |
KR (1) | KR20180113579A (en) |
CN (1) | CN108699248B (en) |
MY (1) | MY190543A (en) |
SG (1) | SG11201806774XA (en) |
TW (1) | TWI713694B (en) |
WO (1) | WO2017140407A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11888095B2 (en) | 2017-10-13 | 2024-01-30 | Merck Patent Gmbh | Manufacturing process for an optoelectronic device |
WO2019233945A1 (en) * | 2018-06-05 | 2019-12-12 | Merck Patent Gmbh | Method and polymer composition for preparing optoelectronic devices |
JP7103245B2 (en) * | 2019-01-29 | 2022-07-20 | 信越化学工業株式会社 | Polysiloxazan compounds and methods for producing them, and compositions and cured products containing them. |
JP7371592B2 (en) | 2019-09-27 | 2023-10-31 | 信越化学工業株式会社 | Polysiloxasan compound having an alkoxysilyl group, method for producing the same, and composition and cured product containing the same |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60145815A (en) | 1984-01-10 | 1985-08-01 | Shin Etsu Chem Co Ltd | Releasing agent composition |
US4678688A (en) * | 1983-12-28 | 1987-07-07 | Shin-Etsu Chemical Co., Ltd. | Method for forming a surface film of cured organosilicon polymer on a substrate surface |
JPH04136278A (en) * | 1990-09-20 | 1992-05-11 | Shin Etsu Chem Co Ltd | Base cloth-treating agent composition and canopy material for paraglider using the same |
WO1998029475A1 (en) * | 1996-12-27 | 1998-07-09 | Tonen Corporation | Polyorganosiloxazanes and process for the preparation thereof |
US6274924B1 (en) | 1998-11-05 | 2001-08-14 | Lumileds Lighting, U.S. Llc | Surface mountable LED package |
US6204523B1 (en) | 1998-11-06 | 2001-03-20 | Lumileds Lighting, U.S., Llc | High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range |
US6534184B2 (en) * | 2001-02-26 | 2003-03-18 | Kion Corporation | Polysilazane/polysiloxane block copolymers |
JP2004077874A (en) * | 2002-08-20 | 2004-03-11 | Clariant (Japan) Kk | Forming method of photosensitive composition for interlayer insulating film and patternizing interlayer insulating film |
KR20100071650A (en) | 2008-12-19 | 2010-06-29 | 삼성전자주식회사 | Gas barrier thin film, electronic device comprising the same, and method for preparing the same |
KR101387740B1 (en) | 2011-01-07 | 2014-04-21 | 제일모직주식회사 | Composition for forming silica based insulating layer, method for manufacturing composition for forming silica based insulating layer, silica based insulating layer and method for manufacturing silica based insulating layer |
US9567488B2 (en) | 2012-07-03 | 2017-02-14 | Burning Bush Group, Llc | High performance silicon based coating compositions |
US9935246B2 (en) * | 2013-12-30 | 2018-04-03 | Cree, Inc. | Silazane-containing materials for light emitting diodes |
WO2017071788A1 (en) * | 2015-10-30 | 2017-05-04 | Az Electronic Materials (Luxembourg) S.A.R.L. | Method for producing silazane-siloxane copolymers and the use of such copolymers |
-
2017
- 2017-01-19 EP EP17700597.2A patent/EP3417002B1/en active Active
- 2017-01-19 MY MYPI2018702820A patent/MY190543A/en unknown
- 2017-01-19 WO PCT/EP2017/000059 patent/WO2017140407A1/en active Application Filing
- 2017-01-19 JP JP2018544039A patent/JP6843875B2/en active Active
- 2017-01-19 KR KR1020187026545A patent/KR20180113579A/en not_active Application Discontinuation
- 2017-01-19 CN CN201780010344.2A patent/CN108699248B/en active Active
- 2017-01-19 SG SG11201806774XA patent/SG11201806774XA/en unknown
- 2017-01-19 US US16/077,870 patent/US10927220B2/en active Active
- 2017-02-14 TW TW106104685A patent/TWI713694B/en active
Also Published As
Publication number | Publication date |
---|---|
CN108699248B (en) | 2021-03-26 |
US10927220B2 (en) | 2021-02-23 |
EP3417002A1 (en) | 2018-12-26 |
TW201731921A (en) | 2017-09-16 |
WO2017140407A1 (en) | 2017-08-24 |
CN108699248A (en) | 2018-10-23 |
US20200255599A1 (en) | 2020-08-13 |
MY190543A (en) | 2022-04-27 |
TWI713694B (en) | 2020-12-21 |
JP6843875B2 (en) | 2021-03-17 |
KR20180113579A (en) | 2018-10-16 |
EP3417002B1 (en) | 2019-11-13 |
JP2019505645A (en) | 2019-02-28 |
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