SE363190B - - Google Patents

Info

Publication number: SE363190B
Authority: SE; Sweden

Application number

SE1774769A

Inventor

D E Piccone

D B Rosser

Original Assignee

Gen Electric

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1968-12-23

Filing date

1969-12-22

Publication date

1974-01-07

1969-12-22 Application filed by Gen Electric filed Critical Gen Electric

1974-01-07 Publication of SE363190B publication Critical patent/SE363190B/xx

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01043—Technetium [Tc]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Die Bonding (AREA)

SE1774769A 1968-12-23 1969-12-22 SE363190B (xx)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US78625168A	1968-12-23	1968-12-23

Publications (1)

Publication Number	Publication Date
SE363190B true SE363190B (xx)	1974-01-07

Family

ID=25138058

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SE1774769A SE363190B (xx)	1968-12-23	1969-12-22

Country Status (7)

Country	Link
US (1)	US3581160A (xx)
BR (1)	BR6915542D0 (xx)
CH (1)	CH507587A (xx)
DE (2)	DE6948923U (xx)
ES (1)	ES374813A1 (xx)
GB (1)	GB1293915A (xx)
SE (1)	SE363190B (xx)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3686540A (en) *	1970-08-03	1972-08-22	Gen Motors Corp	Cold welded-ceramic semiconductor package
US3751800A (en) *	1970-08-04	1973-08-14	Gen Motors Corp	Method of fabricating a semiconductor enclosure
US3688163A (en) *	1970-08-04	1972-08-29	Gen Motors Corp	Cold welded semiconductor package having integral cold welding oil
CH601917A5 (xx) *	1976-10-27	1978-07-14	Bbc Brown Boveri & Cie
JPS5354971A (en) *	1976-10-28	1978-05-18	Mitsubishi Electric Corp	Semiconductor device
US4099201A (en) *	1977-04-11	1978-07-04	General Electric Company	Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc
JPS5635443A (en) *	1979-08-31	1981-04-08	Toshiba Corp	Semiconductor device
JPH0693468B2 (ja) *	1988-08-09	1994-11-16	株式会社東芝	圧接平型半導体装置
JPH0760893B2 (ja) *	1989-11-06	1995-06-28	三菱電機株式会社	半導体装置およびその製造方法
JPH04352457A (ja) *	1991-05-30	1992-12-07	Mitsubishi Electric Corp	圧接型半導体装置及びその製造方法
DE4214794B4 (de) *	1992-05-04	2005-03-24	Marquardt Gmbh	Elektrische Schalteranordnung
JP3347888B2 (ja) *	1994-08-11	2002-11-20	アルプス電気株式会社	プリント基板保持構造
GB2341579B (en)	1998-09-16	2003-04-16	Agra Vadeko Inc	Apparatus and method of marking polymer-based laminates
DE10055177B4 (de) *	2000-11-08	2009-06-10	Infineon Technologies Ag	Elektronisches Bauelement mit einem Halbleiter, insbesondere einem Leistungshalbleiter, mit Trennwänden zwischen den Anschlussstiften
US7143500B2 (en) *	2001-06-25	2006-12-05	Micron Technology, Inc.	Method to prevent damage to probe card
US7132698B2 (en) *	2002-01-25	2006-11-07	International Rectifier Corporation	Compression assembled electronic package having a plastic molded insulation ring
DE10306767A1 (de) *	2003-02-18	2004-08-26	eupec Europäische Gesellschaft für Leistungshalbleiter mbH	Halbleitermodul
KR20110068420A (ko) *	2009-12-16	2011-06-22	(주)디티알	폴리머 핀 애자 및 폴리머 핀 애자의 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1489791A1 (de) *	1964-12-22	1969-06-12	Ckd Praha Narodni Podnik	Halbleiterbauelement mit einer Flaechenhalbleiteranordnung zwischen durch Federdruck angepressten Elektrodenkontaktplatten
US3437887A (en) *	1966-06-03	1969-04-08	Westinghouse Electric Corp	Flat package encapsulation of electrical devices
GB1191887A (en) *	1966-09-02	1970-05-13	Gen Electric	Semiconductor Rectifier Assemblies
US3457472A (en) *	1966-10-10	1969-07-22	Gen Electric	Semiconductor devices adapted for pressure mounting

1968
- 1968-12-23 US US3581160D patent/US3581160A/en not_active Expired - Lifetime
1969
- 1969-12-16 GB GB6131469A patent/GB1293915A/en not_active Expired
- 1969-12-18 DE DE6948923U patent/DE6948923U/de not_active Expired
- 1969-12-18 DE DE19691963478 patent/DE1963478A1/de active Pending
- 1969-12-18 CH CH1896769A patent/CH507587A/de not_active IP Right Cessation
- 1969-12-22 ES ES374813A patent/ES374813A1/es not_active Expired
- 1969-12-22 SE SE1774769A patent/SE363190B/xx unknown
- 1969-12-23 BR BR21554269A patent/BR6915542D0/pt unknown

Also Published As

Publication number	Publication date
BR6915542D0 (pt)	1973-01-02
US3581160A (en)	1971-05-25
GB1293915A (en)	1972-10-25
DE1963478A1 (de)	1971-02-11
DE6948923U (de)	1972-09-14
CH507587A (de)	1971-05-15
ES374813A1 (es)	1972-01-16

Publication	Publication Date	Title
AU1946070A (xx)	1972-05-09
AU428130B2 (xx)	1972-09-14
AU2374870A (xx)	1972-06-29
AU5184069A (xx)	1970-07-17
AU6168869A (xx)	1971-04-08
AU6171569A (xx)	1971-04-08
AU429879B2 (xx)	1972-11-09
AU416157B2 (xx)	1971-08-23
AU2581067A (xx)	1970-02-19
AU4811568A (xx)	1974-08-01
AU421558B1 (xx)	1970-01-29
AU4744468A (xx)	1970-06-18
AU3789668A (xx)	1968-06-20
AU3224368A (xx)	1969-07-17
AU2580267A (xx)	1970-02-05
AU479393A (xx)	1974-02-07
BE642636A (xx)
AU4558658A (xx)	1970-05-07
AU463027A (xx)	1971-03-04
AU4464266A (xx)	1970-04-16
SE363190B (xx)	1974-01-07
AU479894A (xx)	1973-08-30
AU4270368A (xx)	1970-03-05
AU4224469A (xx)	1970-02-26
AU3083868A (xx)	1969-10-30