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RU97105182A - METHOD FOR PRODUCING A MICROCircuit CARD MODULE FOR CONTACTLESS MICROCircuit Cards - Google Patents

METHOD FOR PRODUCING A MICROCircuit CARD MODULE FOR CONTACTLESS MICROCircuit Cards

Info

Publication number
RU97105182A
RU97105182A RU97105182/09A RU97105182A RU97105182A RU 97105182 A RU97105182 A RU 97105182A RU 97105182/09 A RU97105182/09 A RU 97105182/09A RU 97105182 A RU97105182 A RU 97105182A RU 97105182 A RU97105182 A RU 97105182A
Authority
RU
Russia
Prior art keywords
microcircuit
wire
card module
producing
contactless
Prior art date
Application number
RU97105182/09A
Other languages
Russian (ru)
Other versions
RU2155379C2 (en
Inventor
Мундигл Йозеф
Удо Детлеф
Original Assignee
Сименс АГ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE4431605A external-priority patent/DE4431605C2/en
Application filed by Сименс АГ filed Critical Сименс АГ
Publication of RU97105182A publication Critical patent/RU97105182A/en
Application granted granted Critical
Publication of RU2155379C2 publication Critical patent/RU2155379C2/en

Links

Claims (2)

1. Способ изготовления модуля микросхемной карты со следующими операциями способа: конец тонкой проволоки присоединяют к первой контактной площадке (4) полупроводниковой микросхемы (3), укладывают проволоку посредством термокомпрессионной сварочной головки в несколько витков (5), присоединяют проволоку ко второй контактной площадке (4) полупроводниковой микросхемы (3), образующие антенную катушку (5) витки проволоки и полупроводниковую микросхему устанавливают на носителе (1).1. A method of manufacturing a microcircuit card module with the following method steps: the end of a thin wire is attached to the first contact pad (4) of the semiconductor chip (3), the wire is laid using a thermocompression welding head in several turns (5), the wire is connected to the second contact pad (4 ) semiconductor microcircuit (3), forming the antenna coil (5) the coils of wire and the semiconductor microcircuit are installed on the carrier (1). 2. Способ по п. 1, отличающийся тем, что образующие антенную катушку (5) витки проволоки располагают на носителе (1) так, что полупроводниковая микросхема (3) удерживается в выемке (2) носителя (1) в подвешенном состоянии термокомпрессионными соединениями концов проволоки (6). 2. The method according to p. 1, characterized in that the turns of wire forming the antenna coil (5) are placed on the carrier (1) so that the semiconductor chip (3) is held in the recess (2) of the carrier (1) in suspension by the thermocompressed ends wire (6).
RU97105182/09A 1994-09-05 1995-09-05 Method for production of microchip card unit for contactless reading cards RU2155379C2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4431605A DE4431605C2 (en) 1994-09-05 1994-09-05 Method for producing a chip card module for contactless chip cards
DEP4431605.4 1994-09-05

Publications (2)

Publication Number Publication Date
RU97105182A true RU97105182A (en) 1999-04-20
RU2155379C2 RU2155379C2 (en) 2000-08-27

Family

ID=6527470

Family Applications (1)

Application Number Title Priority Date Filing Date
RU97105182/09A RU2155379C2 (en) 1994-09-05 1995-09-05 Method for production of microchip card unit for contactless reading cards

Country Status (12)

Country Link
US (1) US5809633A (en)
EP (1) EP0780006B1 (en)
JP (1) JPH10505023A (en)
KR (1) KR100358785B1 (en)
CN (1) CN1105988C (en)
AT (1) ATE173553T1 (en)
DE (2) DE4431605C2 (en)
ES (1) ES2125650T3 (en)
FI (1) FI970924A0 (en)
RU (1) RU2155379C2 (en)
UA (1) UA54374C2 (en)
WO (1) WO1996007984A1 (en)

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