WO2002099743A1 - Ic connected to a winded isolated wire coil by flip-chip technology - Google Patents
Ic connected to a winded isolated wire coil by flip-chip technology Download PDFInfo
- Publication number
- WO2002099743A1 WO2002099743A1 PCT/CH2001/000355 CH0100355W WO02099743A1 WO 2002099743 A1 WO2002099743 A1 WO 2002099743A1 CH 0100355 W CH0100355 W CH 0100355W WO 02099743 A1 WO02099743 A1 WO 02099743A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flip
- winded
- wire coil
- chip technology
- isolated wire
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V15/00—Tags attached to, or associated with, an object, in order to enable detection of the object
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
Definitions
- the present invention relates to an assembly, in particular a RFID (Radio- Frequency Identification) transponder, made essentially of an antenna circuit connected to an integrated circuit (IC).
- the invention also relates to a process for manufacturing the assembly.
- RFID transponder circuits are used for the business field of radio-frequency identification.
- a passive RFID transponder is made by connecting an application specified integrated circuit (ASIC) to an antenna circuit.
- An external reader supplies energy and optionally information by means of this antenna circuit to the IC.
- the IC sends information back to the reader, using the same antenna.
- ASIC application specified integrated circuit
- RFID transponders are needed and used in high quantity with strong growing demand. This results in high price pressure and the need for cost effective and reliable production processes.
- thermo compression bonding is an inter-metallic connection between antenna and the bumps (connecting gold surfaces on the IC, also called pads). This approach is mainly used for 125 KHz transponders to contact isolated wire coils to the IC in using special bond pads (called Megapads or Megabumps).
- Megapads or Megabumps special bond pads
- the thermo compression technology which is used on the present market, needs a surface bigger than typical pad size (90 ⁇ m x 90 ⁇ m) used for flip-chip technology or wire bonding. The corresponding technology is disclosed in EP-B-756736.
- the flip-chip connection generally consists of one of two approaches - solder bonding (including Pb-Sn, Pb-ln, ...) and conductive adhesive bonding. This connection is mainly used for 13,56 MHz and GHz transponders to contact planar antennas (inductive and capacitive) to the IC. The corresponding technology is described in US-A-5'528'222.
- the fully functioning but not yet packaged products formed by an IC connected to an antenna are called electronic-unit (e-unit) or transponder inlay.
- the present invention provides a very cost effective assembly in using winded isolated wire coil technology and the flip-chip connection technology.
- a transponder manufactured as briefly described above assembles the most cost effective technologies.
- standard isolated winded wire coils are inexpensive and have high performance and the flip chip connection technology does not request any larger surface for connection which allows to drastically decrease the ICs size compared to ICs with Megapads (larger bumps compared to flip-chip or die bonding designed for thermo compression).
- the prior art does not disclose winded isolated wire coils connected by flip-chip technology to ICs. This is due to the fact that the flip chip technology has been developed to connect IC on flat non-isolated surface.
- winded isolated coils are typically cylinder and are isolated in case of conventional winding.
- Figure 1 shows a prior art transponder.
- Figure 2a illustrates a transponder in an upper view according to the present invention.
- Figure 2b shows a side view of the transponder of fig. 2a.
- FIG. 1 shows a prior art transponder manufactured according to a thermo compression connection process.
- the transponder comprises a winded isolated wire antenna circuit 1 connected to an IC 2 by means of bumps 3 called Megapads or Megabumps, which have been designed in such a dimension that a thermo compression process can be conducted.
- the typical dimensions of bumps designed for thermo compression connection process are 200 ⁇ m x 400 ⁇ m.
- FIGS 2a and 2b illustrate a transponder according to the present invention.
- the transponder comprises a winded isolated wire antenna circuit 1 connected to an IC 2 by means of flip-chip technology 5.
- the isolated wire has been flatten to have a flat surface 6 allowing flip-chip technology connection.
- the connection can be done by any flip-chip solution as for example solder bumps, polymer bumps, conductive adhesive.
- the isolation on the flattened wire has to be removed or the IC connecting surface (solder bumps for example) has to go through the wire isolation to contact the IC to the antenna circuit.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geophysics (AREA)
- Details Of Aerials (AREA)
Abstract
The present invention provides a very cost effective transponder by using winded isolated wire coil technology and the flip-chip bonding technology which is usually used to contact planar antennas to the IC.
Description
IC connected to a winded isolated wire coil by Flip-Chip technology
Field of the invention
The present invention relates to an assembly, in particular a RFID (Radio- Frequency Identification) transponder, made essentially of an antenna circuit connected to an integrated circuit (IC). The invention also relates to a process for manufacturing the assembly.
State of the art
RFID transponder circuits are used for the business field of radio-frequency identification. A passive RFID transponder is made by connecting an application specified integrated circuit (ASIC) to an antenna circuit. An external reader supplies energy and optionally information by means of this antenna circuit to the IC. The IC sends information back to the reader, using the same antenna.
RFID transponders are needed and used in high quantity with strong growing demand. This results in high price pressure and the need for cost effective and reliable production processes.
In order to decrease the manufacturing and product costs, while increasing the reliability, during the last years more and more components from the resonant circuit (mainly capacitors) became integrated to the IC. This results in a minimum of 2 components, used to manufacture modern passive RFID transponders. On the one hand the IC with integrated components for the resonant circuit and on the other hand the antenna circuit itself. The way to manufacture these transponders efficiently with a minimum of components is disclosed e.g. in US-A-5'572'410.
Further difficulties are the interconnection process from the antenna circuit to the IC using a minimum of steps and material. Here two major approaches are used, i.e. the thermo compression bonding and the flip-chip connection.
The thermo compression bonding is an inter-metallic connection between antenna and the bumps (connecting gold surfaces on the IC, also called pads). This approach is mainly used for 125 KHz transponders to contact isolated wire coils to the IC in using special bond pads (called Megapads or Megabumps). The thermo compression technology, which is used on the present market, needs a surface bigger than typical pad size (90 μm x 90 μm) used for flip-chip technology or wire bonding. The corresponding technology is disclosed in EP-B-756736.
The flip-chip connection generally consists of one of two approaches - solder bonding (including Pb-Sn, Pb-ln, ...) and conductive adhesive bonding. This connection is mainly used for 13,56 MHz and GHz transponders to contact planar antennas (inductive and capacitive) to the IC. The corresponding technology is described in US-A-5'528'222.
The fully functioning but not yet packaged products formed by an IC connected to an antenna are called electronic-unit (e-unit) or transponder inlay.
Summary of the invention
The present invention provides a very cost effective assembly in using winded isolated wire coil technology and the flip-chip connection technology.
A transponder manufactured as briefly described above assembles the most cost effective technologies. In fact standard isolated winded wire coils are inexpensive and have high performance and the flip chip connection technology does not request any larger surface for connection which allows to drastically decrease the ICs size compared to ICs with Megapads (larger bumps compared to flip-chip or die bonding designed for thermo compression).
It should be noted that the prior art does not disclose winded isolated wire coils connected by flip-chip technology to ICs. This is due to the fact that the flip chip technology has been developed to connect IC on flat non-isolated surface. However winded isolated coils are typically cylinder and are isolated in case of conventional winding.
As it will be seen further in the text the invention offers at least one solution to this problem.
Brief description of the drawings
Figure 1 shows a prior art transponder.
Figure 2a illustrates a transponder in an upper view according to the present invention. Figure 2b shows a side view of the transponder of fig. 2a.
Detailed description of the invention
Figure 1 shows a prior art transponder manufactured according to a thermo compression connection process. The transponder comprises a winded isolated wire antenna circuit 1 connected to an IC 2 by means of bumps 3 called Megapads or Megabumps, which have been designed in such a dimension that a thermo compression process can be conducted. The typical dimensions of bumps designed for thermo compression connection process are 200 μm x 400 μm.
Figures 2a and 2b illustrate a transponder according to the present invention. The transponder comprises a winded isolated wire antenna circuit 1 connected to an IC 2 by means of flip-chip technology 5. In this case the isolated wire has been flatten to have a flat surface 6 allowing flip-chip technology connection. The connection can be done by any flip-chip solution as for example solder bumps, polymer bumps, conductive adhesive. The isolation on the flattened wire has to be removed or the IC connecting surface (solder bumps for example) has to go through the wire isolation to contact the IC to the antenna circuit.
Claims
1. Assembly, in particular a RFID transponder, comprising an IC (2) connected to a winded isolated wire coil (1), characterized by the fact that the connection is made by flip-chip technology.
2. Assembly according to claim 1 wherein the wire of said winded isolated wire coil (1 ) is flattened on both ends to create a flat surface to allow flip- chip connection.
3. Process for manufacturing the assembly of claim 1 or 2, characterized by the fact that it is made according a flip-chip technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CH2001/000355 WO2002099743A1 (en) | 2001-06-07 | 2001-06-07 | Ic connected to a winded isolated wire coil by flip-chip technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CH2001/000355 WO2002099743A1 (en) | 2001-06-07 | 2001-06-07 | Ic connected to a winded isolated wire coil by flip-chip technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2002099743A1 true WO2002099743A1 (en) | 2002-12-12 |
Family
ID=4358211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CH2001/000355 WO2002099743A1 (en) | 2001-06-07 | 2001-06-07 | Ic connected to a winded isolated wire coil by flip-chip technology |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2002099743A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005107403A2 (en) * | 2004-04-30 | 2005-11-17 | Hewlett-Packard Development Company L.P. | Method of fabricating a rat's nest rfid antenna |
| EP2175400A1 (en) * | 2008-10-08 | 2010-04-14 | NagralD | Method of manufacturing an RF communication device made up of an antenna cable connected to an electronic unit |
| CN102208045A (en) * | 2011-06-03 | 2011-10-05 | 上海铭源数码股份有限公司 | Split-type passive electronic tag and printed circuit board using same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
| US5572410A (en) * | 1991-02-25 | 1996-11-05 | Gustafson; Ake | Integrated circuit device having a winding connected to an integrated circuit solely by a wire |
| EP0756736A1 (en) * | 1992-03-03 | 1997-02-05 | N.V. Nederlandsche Apparatenfabriek NEDAP | Method of making a radio-frequency detection label with a minimum number of electronic components |
| JPH1187556A (en) * | 1997-09-08 | 1999-03-30 | Hitachi Ltd | Semiconductor device |
| EP0913711A1 (en) * | 1997-10-29 | 1999-05-06 | Meto International GmbH | Identification element and method for its manufacture |
-
2001
- 2001-06-07 WO PCT/CH2001/000355 patent/WO2002099743A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5572410A (en) * | 1991-02-25 | 1996-11-05 | Gustafson; Ake | Integrated circuit device having a winding connected to an integrated circuit solely by a wire |
| EP0756736A1 (en) * | 1992-03-03 | 1997-02-05 | N.V. Nederlandsche Apparatenfabriek NEDAP | Method of making a radio-frequency detection label with a minimum number of electronic components |
| US5528222A (en) * | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
| JPH1187556A (en) * | 1997-09-08 | 1999-03-30 | Hitachi Ltd | Semiconductor device |
| EP0913711A1 (en) * | 1997-10-29 | 1999-05-06 | Meto International GmbH | Identification element and method for its manufacture |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 1999, no. 08 30 June 1999 (1999-06-30) * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005107403A2 (en) * | 2004-04-30 | 2005-11-17 | Hewlett-Packard Development Company L.P. | Method of fabricating a rat's nest rfid antenna |
| WO2005107403A3 (en) * | 2004-04-30 | 2006-05-18 | Hewlett Packard Development Co | Method of fabricating a rat's nest rfid antenna |
| US7302751B2 (en) | 2004-04-30 | 2007-12-04 | Hewlett-Packard Development Company, L.P. | Method of fabricating a rat's nest RFID antenna |
| EP2175400A1 (en) * | 2008-10-08 | 2010-04-14 | NagralD | Method of manufacturing an RF communication device made up of an antenna cable connected to an electronic unit |
| CN102208045A (en) * | 2011-06-03 | 2011-10-05 | 上海铭源数码股份有限公司 | Split-type passive electronic tag and printed circuit board using same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5705852A (en) | Non-contact IC card and process for its production | |
| US8102021B2 (en) | RF devices | |
| US11024936B1 (en) | RFID tag assembly methods | |
| AU742212B2 (en) | Card mounted with circuit chip and circuit chip module | |
| US7768407B2 (en) | Foldable RFID device interposer and method | |
| US7374105B2 (en) | RFID tag with improved range | |
| EP1010543A1 (en) | Card mounted with circuit chip and circuit chip module | |
| US20110011939A1 (en) | Contact-less and dual interface inlays and methods for producing the same | |
| US20020190132A1 (en) | Contactless smart card with an antenna support and a chip support made of fibrous material | |
| WO2002013135A2 (en) | Structures and assembly methods for radio-frequency-identification modules | |
| JP2002519866A (en) | Integrated electronic micromodule and method of manufacturing the same | |
| US20160275391A1 (en) | Miniature rfid tag with coil on ic package | |
| US20210303813A1 (en) | Sensor device, method for forming a sensor device, carrier tape, chip card and method for forming a chip card | |
| EP1091398B1 (en) | IC-package bonding method with bonding wire inductor | |
| US7312528B2 (en) | Semiconductor device having antenna connection electrodes | |
| WO2002099743A1 (en) | Ic connected to a winded isolated wire coil by flip-chip technology | |
| CN108370087B (en) | Single-sided antenna module with CMS device | |
| US20070132595A1 (en) | Transponder device with mega pads | |
| WO2003007232A1 (en) | Lead frame antenna | |
| EP1440418B1 (en) | Transponder ic with optimized dimensions | |
| EP1970840A1 (en) | RFID tag with improved range | |
| JP2002304608A (en) | Non-contact ic card | |
| JP2000132653A (en) | Manufacture of noncontact ic card | |
| KR101091908B1 (en) | RFID tag and method of manufacturing the same | |
| KR20050111174A (en) | Rfid tag and manufacturing methode the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 200205799 Country of ref document: ZA |
|
| AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
| AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
| 122 | Ep: pct application non-entry in european phase | ||
| NENP | Non-entry into the national phase |
Ref country code: JP |