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PL2465150T3 - Metoda hermetyzacji układu elektronicznego - Google Patents

Metoda hermetyzacji układu elektronicznego

Info

Publication number
PL2465150T3
PL2465150T3 PL10739598T PL10739598T PL2465150T3 PL 2465150 T3 PL2465150 T3 PL 2465150T3 PL 10739598 T PL10739598 T PL 10739598T PL 10739598 T PL10739598 T PL 10739598T PL 2465150 T3 PL2465150 T3 PL 2465150T3
Authority
PL
Poland
Prior art keywords
encapsulating
electronic arrangement
electronic
arrangement
Prior art date
Application number
PL10739598T
Other languages
English (en)
Inventor
Alexander Steen
Thorsten Krawinkel
KLAUS KEITE-TELGENBüSCHER
Jan Ellinger
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of PL2465150T3 publication Critical patent/PL2465150T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
PL10739598T 2009-08-12 2010-07-30 Metoda hermetyzacji układu elektronicznego PL2465150T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009036968A DE102009036968A1 (de) 2009-08-12 2009-08-12 Verfahren zur Kapselung einer elektronischen Anordnung
PCT/EP2010/061090 WO2011018356A1 (de) 2009-08-12 2010-07-30 Verfahren zur kapselung einer elektronischen anordnung
EP10739598.0A EP2465150B1 (de) 2009-08-12 2010-07-30 Verfahren zur kapselung einer elektronischen anordnung

Publications (1)

Publication Number Publication Date
PL2465150T3 true PL2465150T3 (pl) 2015-02-27

Family

ID=42937679

Family Applications (1)

Application Number Title Priority Date Filing Date
PL10739598T PL2465150T3 (pl) 2009-08-12 2010-07-30 Metoda hermetyzacji układu elektronicznego

Country Status (9)

Country Link
US (1) US8557084B2 (pl)
EP (1) EP2465150B1 (pl)
JP (1) JP5725671B2 (pl)
KR (1) KR101769930B1 (pl)
CN (1) CN102576821B (pl)
DE (1) DE102009036968A1 (pl)
PL (1) PL2465150T3 (pl)
TW (1) TWI482831B (pl)
WO (1) WO2011018356A1 (pl)

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DE102010043871A1 (de) * 2010-11-12 2012-05-16 Tesa Se Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung
DE102010043866A1 (de) 2010-11-12 2012-05-16 Tesa Se Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung
DE102011084276B4 (de) * 2011-10-11 2019-10-10 Osram Oled Gmbh Verkapselung für ein organisches elektronisches bauelement, ein organisches elektronisches bauelement mit der verkapselung und ein verfahren zur herstellung eines organischen elektronischen bauelements mit der verkapselung
DE102011089565A1 (de) 2011-12-22 2013-06-27 Tesa Se Liner zum Schutz von Klebemassen
DE102011089566A1 (de) 2011-12-22 2013-06-27 Tesa Se Liner zum Schutz von Klebemassen
JP2015513478A (ja) * 2012-02-10 2015-05-14 アーケマ・インコーポレイテッド フレキシブルな薄膜光起電力デバイスおよび発光ダイオードデバイスのための耐候性複合材
JP5949054B2 (ja) * 2012-03-30 2016-07-06 大日本印刷株式会社 有機エレクトロルミネッセンス素子形成用フレキシブル基板ロール
DE102012206273A1 (de) 2012-04-17 2013-10-17 Tesa Se Vernetzbare Klebmasse mit Hart- und Weichblöcken als Permeantenbarriere
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DE102012211335A1 (de) 2012-06-29 2014-01-02 Tesa Se Klebeband für die Kapselung einer organischen elektronischen Anordnung
JP5895762B2 (ja) * 2012-07-27 2016-03-30 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子および有機エレクトロルミネッセンスパネルの封止方法
DE102013202473A1 (de) 2013-02-15 2014-08-21 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
TW201436855A (zh) 2012-12-21 2014-10-01 Tesa Se 從平面結構物移除滲透物的方法
DE102012224319A1 (de) 2012-12-21 2014-06-26 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
US10971277B2 (en) * 2013-02-15 2021-04-06 Cambrios Film Solutions Corporation Methods to incorporate silver nanowire-based transparent conductors in electronic devices
EP3001476B1 (en) * 2013-05-21 2021-12-22 LG Chem, Ltd. Encapsulation film and method for encapsulating organic electronic device using same
KR101816332B1 (ko) * 2013-06-28 2018-01-08 주식회사 엘지화학 광학용 점착 필름, 광학용 점착 필름의 제조 방법 및 이를 포함하는 터치 스크린 패널
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DE102013223451A1 (de) 2013-11-18 2015-05-21 Tesa Se Verfahren zur Trocknung von Klebemassen
DE102014200948A1 (de) 2014-01-20 2015-07-23 Tesa Se Verfahren zum Entfernen von Permeaten aus Flächengebilden
DE102014207792A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zum Lagern einer Dünnglasfolie
JP6474489B2 (ja) 2014-10-29 2019-02-27 テーザ・ソシエタス・ヨーロピア 活性化可能なゲッター材料を含む接着剤
EP3034548A1 (en) * 2014-12-18 2016-06-22 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Barrier film laminate comprising submicron getter particles and electronic device comprising such a laminate
JP6446280B2 (ja) * 2015-01-28 2018-12-26 日立オートモティブシステムズ株式会社 電子装置
CN106463647B (zh) * 2015-02-04 2018-08-10 株式会社Lg化学 封装膜
DE102016213911A1 (de) 2016-07-28 2018-02-01 Tesa Se OLED kompatible Klebemassen mit cyclischen Azasilanwasserfängern
DK3516710T3 (da) 2016-09-20 2023-07-24 Inuru Gmbh Diffusionsbegrænsende elektroaktivt barrierelag til en optoelektronisk komponent
WO2018060256A1 (de) 2016-09-27 2018-04-05 Inuru Gmbh Destruktionslose integration von elektronik
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
JP6817145B2 (ja) * 2017-05-29 2021-01-20 エルジー ディスプレイ カンパニー リミテッド 有機電界発光装置および有機電界発光装置の製造方法
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DE102018208168A1 (de) 2018-05-24 2019-11-28 Tesa Se Kombination einer transparenten vollflächigen Verkapselung mit einer (intransparenten) Randverkapselung mit hohem Gettergehalt
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Also Published As

Publication number Publication date
KR20120062766A (ko) 2012-06-14
TW201132727A (en) 2011-10-01
TWI482831B (zh) 2015-05-01
JP5725671B2 (ja) 2015-05-27
US20110036496A1 (en) 2011-02-17
CN102576821A (zh) 2012-07-11
EP2465150B1 (de) 2014-10-22
WO2011018356A1 (de) 2011-02-17
KR101769930B1 (ko) 2017-08-21
DE102009036968A1 (de) 2011-02-17
CN102576821B (zh) 2015-06-10
US8557084B2 (en) 2013-10-15
EP2465150A1 (de) 2012-06-20
JP2013502027A (ja) 2013-01-17

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