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KR970053345A - 캐리어(carrier) 이송 장치 - Google Patents

캐리어(carrier) 이송 장치 Download PDF

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Publication number
KR970053345A
KR970053345A KR1019950068175A KR19950068175A KR970053345A KR 970053345 A KR970053345 A KR 970053345A KR 1019950068175 A KR1019950068175 A KR 1019950068175A KR 19950068175 A KR19950068175 A KR 19950068175A KR 970053345 A KR970053345 A KR 970053345A
Authority
KR
South Korea
Prior art keywords
carrier
base
latch
substrate
conveyed
Prior art date
Application number
KR1019950068175A
Other languages
English (en)
Inventor
강주일
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950068175A priority Critical patent/KR970053345A/ko
Priority to US08/770,117 priority patent/US6142723A/en
Priority to CN96123433A priority patent/CN1132510C/zh
Priority to KR1019960077187A priority patent/KR100222297B1/ko
Priority to TW085116298A priority patent/TW359659B/zh
Priority to JP9000382A priority patent/JP2732829B2/ja
Publication of KR970053345A publication Critical patent/KR970053345A/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Specific Conveyance Elements (AREA)
  • Die Bonding (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Automatic Assembly (AREA)
  • Warehouses Or Storage Devices (AREA)
  • De-Stacking Of Articles (AREA)

Abstract

본 발명은 패키지 테스트용 기판이 적재된 캐리어를 이송하는 데 사용되는 장치에 관한 것으로, 상기 기판에 패키지를 언로딩/로딩하는 장치에 부설되어 그 패키지가 언로딩/로딩된 기판이 적재된 캐리어 단위로 이송되도록 함으로써, 상기 패키지 테스트 공정이 자동화되어 패키지 제조 단가를 낮추는 동시에 패키지의 검사를 위한 안전한 운반이 확보되는 특징을 갖는다.

Description

캐리어(carrier) 이송 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 캐리어 이송 장치를 개략적으로 나타내는 정면도.

Claims (10)

  1. 패키지 검사용 기판이 적재된 캐리어가 탑재되는 제1베이스와, 그 제1베이스에 탑재되는 캐리어를 이송하는 제1이송 수단을 포함하는 입력부와; 그 제1이송 수단에 의해 이송되는 캐리어가 탑재되는 제2베이스와, 그 제2베이스와 체결된 제2이송 수단과, 상기 캐리어에 적재된 기판을 개별로 언더로/로더가 부설된 장치에 언로딩하는 수단을 포함하는 엘리베이터부와; 상기 엘리베이터부를 상승시키는 모터와; 그 모터에 의해 상승되는 엘리베이터부의 캐리어를 일정한 간격으로 상승되도록 제어하는 센서와; 상기 엘리베이터부의 제2이송 수단에 의해 이송되는 캐리어가 탑재되는 제3베이스를 포함하는 출력부를 포함하는 것을 특징으로 하는 캐리어
    (carrier) 이송 장치.
  2. 제1항에 있어서, 상기 패키지 검사용 기판이 번인 테스트 기판인 것을 특징으로 하는 캐리어 이송 장치.
  3. 제1항에 있어서, 상기 제1베이스의 양단에 실린더와 그 실린더와 체결된 걸림쇠를 설치하여 탑재되는 캐리어를 고정하기 위해 개폐하는 것을 특징으로 하는 캐리어 이송 장치.
  4. 제1항에 있어서, 상기 걸림쇠가 캐리어가 공급되는 방향과 그 캐리어가 이송되는 방향의 말단에 설치된 것을 특징으로 하는 캐리어 이송 장치.
  5. 제1항에 있어서, 상기 제2베이스의 일단에 실린더와 그 실린더와 체결된 걸림쇠를 설치하여 탑재되는 캐리어를 고정하기 위해 개폐하는 것을 특징으로 하는 캐리어 이송 장치.
  6. 제5항에 있어서, 상기 걸림쇠가 캐리어가 이송되는 방향의 말단에 설치된 인 것을 특징으로 하는 캐리어 이송 장치.
  7. 제1항에 있어서, 상기 센서가 적외선 센서인 것을 특징으로 하는 캐리어 이송 장치.
  8. 제1항에 있어서, 상기 센서에 의해 제어되는 간격이 상기 캐리어에 적재된 기판이 배치된 간격과 동일한 것을 특징으로 하는 캐리어 이송 장치.
  9. 제1항에 있어서, 상기 제3베이스의 일단에 걸림쇠가 설치된 것을 특징으로 하는 캐리어 이송 장치.
  10. 제1항에 있어서, 상기 제1,2 및 3베이스의 상부면 상에 볼 베어링이 설치된 것을 특징으로 하는 캐리어 이송 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950068175A 1995-12-30 1995-12-30 캐리어(carrier) 이송 장치 KR970053345A (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1019950068175A KR970053345A (ko) 1995-12-30 1995-12-30 캐리어(carrier) 이송 장치
US08/770,117 US6142723A (en) 1995-12-30 1996-12-20 Transfer apparatus
CN96123433A CN1132510C (zh) 1995-12-30 1996-12-30 传输装置
KR1019960077187A KR100222297B1 (ko) 1995-12-30 1996-12-30 캐리어 이송 장치
TW085116298A TW359659B (en) 1995-12-30 1996-12-30 Transfer apparatus
JP9000382A JP2732829B2 (ja) 1995-12-30 1997-01-06 キャリア移送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950068175A KR970053345A (ko) 1995-12-30 1995-12-30 캐리어(carrier) 이송 장치

Publications (1)

Publication Number Publication Date
KR970053345A true KR970053345A (ko) 1997-07-31

Family

ID=19447959

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019950068175A KR970053345A (ko) 1995-12-30 1995-12-30 캐리어(carrier) 이송 장치
KR1019960077187A KR100222297B1 (ko) 1995-12-30 1996-12-30 캐리어 이송 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1019960077187A KR100222297B1 (ko) 1995-12-30 1996-12-30 캐리어 이송 장치

Country Status (5)

Country Link
US (1) US6142723A (ko)
JP (1) JP2732829B2 (ko)
KR (2) KR970053345A (ko)
CN (1) CN1132510C (ko)
TW (1) TW359659B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100599956B1 (ko) * 1999-12-24 2006-07-12 비오이 하이디스 테크놀로지 주식회사 액정표시소자의 유리 기판 반입/반출 장치

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US6942738B1 (en) * 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
DE19805624A1 (de) * 1998-02-12 1999-09-23 Acr Automation In Cleanroom Schleuse zum Öffnen und Schließen von Reinraumtransport-Boxen
WO2002005313A2 (en) * 2000-07-07 2002-01-17 Semitool, Inc. Automated processing system
US6977515B2 (en) * 2001-09-20 2005-12-20 Wentworth Laboratories, Inc. Method for forming photo-defined micro electrical contacts
US6906540B2 (en) * 2001-09-20 2005-06-14 Wentworth Laboratories, Inc. Method for chemically etching photo-defined micro electrical contacts
US20040042789A1 (en) * 2002-08-30 2004-03-04 Celanese Ventures Gmbh Method and apparatus for transferring thin films from a source position to a target position
US20040080852A1 (en) * 2002-10-18 2004-04-29 Seagate Technology Llc Disc caddy feeder system with caddy gripper for data storage devices
US7165303B2 (en) * 2002-12-16 2007-01-23 Seagate Technology Llc Disc cassette delidder and feeder system for data storage devices
US7195236B2 (en) * 2003-03-28 2007-03-27 Northrop Grumman Corporation Automated induction systems and methods for mail and/or other objects
US20050077217A1 (en) * 2003-03-28 2005-04-14 Hillerich Thomas A. Carrier for mail and/or the like thin objects
US20060000752A1 (en) * 2003-03-28 2006-01-05 Northrop Grumman Corporation Stack correction system and method
CA2525627A1 (en) * 2003-05-13 2004-11-25 Northrop Grumman Corporation Enhanced object-feeder pre-processing system
US7282936B2 (en) * 2003-11-14 2007-10-16 Wentworth Laboratories, Inc. Die design with integrated assembly aid
KR101002326B1 (ko) 2003-12-30 2010-12-17 엘지디스플레이 주식회사 캐리어
US20060099065A1 (en) * 2004-08-27 2006-05-11 Northrop Grumman Corporation Preparation operator flex-station for carrier preparation
WO2006036701A2 (en) * 2004-09-24 2006-04-06 Northrop Grumman Corporation Anti-toppling device for mail and/or the like
KR100941674B1 (ko) 2008-01-29 2010-02-12 (주)테크윙 전자부품 검사 지원을 위한 핸들러용 캐리어보드이송시스템 및 전자부품 검사 지원을 위한 핸들러의 챔버내에서의 캐리어보드 이송방법
US7766171B2 (en) * 2008-02-28 2010-08-03 Northrop Grumman Systems Corporation Rigid storage tray for flat and letter mail
KR20110092891A (ko) 2010-02-10 2011-08-18 삼성전자주식회사 유도가열조리기
CN105252892A (zh) * 2015-09-15 2016-01-20 深圳市和田古德自动化设备有限公司 一种z轴倒三角伺服丝杆直联升降机构装置
CN105357943A (zh) * 2015-11-27 2016-02-24 苏州康贝尔电子设备有限公司 板件运输升降装置
CN106328562B (zh) * 2016-09-25 2018-11-16 泉州市泉港区玛纳利华工业科技有限公司 一种集成电路封装线缓冲下落装置

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US4808057A (en) * 1986-09-11 1989-02-28 Sardee Corporation Workload regulator for automated production
JP3147451B2 (ja) * 1991-12-04 2001-03-19 株式会社石井工作研究所 Ｉｃストッカ、ｉｃ取出位置決め装置及びｉｃ供給システム
JPH0753009A (ja) * 1993-08-12 1995-02-28 Shinkawa Ltd マガジン搬送装置
JP3344850B2 (ja) * 1993-12-28 2002-11-18 株式会社リコー 部品供給装置
DE4409532C2 (de) * 1994-03-21 1996-09-26 Felsomat Gmbh & Co Kg Handhabungssystem

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100599956B1 (ko) * 1999-12-24 2006-07-12 비오이 하이디스 테크놀로지 주식회사 액정표시소자의 유리 기판 반입/반출 장치

Also Published As

Publication number Publication date
JPH09199889A (ja) 1997-07-31
US6142723A (en) 2000-11-07
CN1161632A (zh) 1997-10-08
TW359659B (en) 1999-06-01
CN1132510C (zh) 2003-12-24
JP2732829B2 (ja) 1998-03-30
KR970053359A (ko) 1997-07-31
KR100222297B1 (ko) 1999-10-01

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