KR960038721U - 반도체 몰드 다이 - Google Patents
반도체 몰드 다이Info
- Publication number
- KR960038721U KR960038721U KR2019950010800U KR19950010800U KR960038721U KR 960038721 U KR960038721 U KR 960038721U KR 2019950010800 U KR2019950010800 U KR 2019950010800U KR 19950010800 U KR19950010800 U KR 19950010800U KR 960038721 U KR960038721 U KR 960038721U
- Authority
- KR
- South Korea
- Prior art keywords
- mold die
- semiconductor mold
- semiconductor
- die
- mold
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950010800U KR200189300Y1 (ko) | 1995-05-20 | 1995-05-20 | 반도체 몰드 다이 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950010800U KR200189300Y1 (ko) | 1995-05-20 | 1995-05-20 | 반도체 몰드 다이 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960038721U true KR960038721U (ko) | 1996-12-18 |
KR200189300Y1 KR200189300Y1 (ko) | 2000-09-01 |
Family
ID=19413629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950010800U KR200189300Y1 (ko) | 1995-05-20 | 1995-05-20 | 반도체 몰드 다이 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200189300Y1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100423131B1 (ko) * | 1999-11-01 | 2004-03-18 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 제조용 부재 |
KR100714884B1 (ko) | 2005-06-02 | 2007-05-07 | 주식회사 티에스피 | 반도체 장치 제조용 금형 |
-
1995
- 1995-05-20 KR KR2019950010800U patent/KR200189300Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR200189300Y1 (ko) | 2000-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69610132D1 (de) | Druckgussverfahren | |
DE69611471D1 (de) | Drahtziehmatrize | |
DE69607435D1 (de) | Druckgiessmaschine | |
KR960038721U (ko) | 반도체 몰드 다이 | |
KR950028670U (ko) | 반도체 몰드 다이 | |
KR960003105U (ko) | 반도체금형의 펀치 | |
KR970011222U (ko) | 몰딩다이 크리닝 장치 | |
KR960009277U (ko) | 몰딩다이 | |
KR980005394U (ko) | 몰드 다이 | |
KR960035607U (ko) | 패키지 성형용 금형 | |
KR970046769U (ko) | 반도체 제조장비의 몰딩 및 성형장치 | |
KR970003227U (ko) | 반도체 몰드 프레스 기 | |
KR930023182U (ko) | 압출기용 다이스 | |
KR970003235U (ko) | 다이본딩 장치 | |
KR980005393U (ko) | 몰딩용 다이 | |
KR970027535U (ko) | 다이 분할식 분말 성형 장치 | |
KR960035632U (ko) | 프래쉬 방지 몰드 베이스 다이 | |
KR960038739U (ko) | 반도체 몰드 다이용 리드프레임 위치 결정 장치 | |
KR970038858U (ko) | 부품 이송 다이 | |
KR970011220U (ko) | 몰딩 다이 크리닝 장치 | |
KR960025461U (ko) | 반도체 몰드용 플런저 | |
KR970021072U (ko) | 금형 체결 고정구 | |
TR199501466A2 (tr) | Kalip takimi | |
KR950026876U (ko) | 홈가공용 다이 | |
KR960028052U (ko) | 두부제조용 성형 압착기 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
LAPS | Lapse due to unpaid annual fee |