KR960009277U - 몰딩다이 - Google Patents
몰딩다이Info
- Publication number
- KR960009277U KR960009277U KR2019940021630U KR19940021630U KR960009277U KR 960009277 U KR960009277 U KR 960009277U KR 2019940021630 U KR2019940021630 U KR 2019940021630U KR 19940021630 U KR19940021630 U KR 19940021630U KR 960009277 U KR960009277 U KR 960009277U
- Authority
- KR
- South Korea
- Prior art keywords
- molding die
- die
- molding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940021630U KR0119734Y1 (ko) | 1994-08-25 | 1994-08-25 | 몰딩다이 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940021630U KR0119734Y1 (ko) | 1994-08-25 | 1994-08-25 | 몰딩다이 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960009277U true KR960009277U (ko) | 1996-03-16 |
KR0119734Y1 KR0119734Y1 (ko) | 1998-08-01 |
Family
ID=19391554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940021630U KR0119734Y1 (ko) | 1994-08-25 | 1994-08-25 | 몰딩다이 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0119734Y1 (ko) |
-
1994
- 1994-08-25 KR KR2019940021630U patent/KR0119734Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0119734Y1 (ko) | 1998-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20090223 Year of fee payment: 12 |
|
EXPY | Expiration of term |