KR950032543A - Si-O 함유 피막을 형성시키는 방법 - Google Patents
Si-O 함유 피막을 형성시키는 방법 Download PDFInfo
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- KR950032543A KR950032543A KR1019950008228A KR19950008228A KR950032543A KR 950032543 A KR950032543 A KR 950032543A KR 1019950008228 A KR1019950008228 A KR 1019950008228A KR 19950008228 A KR19950008228 A KR 19950008228A KR 950032543 A KR950032543 A KR 950032543A
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- South Korea
- Prior art keywords
- coating
- hydrogen silsesquioxane
- silsesquioxane resin
- support
- heating
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract 6
- 229910018557 Si O Inorganic materials 0.000 title claims abstract 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 title claims abstract 3
- 238000000576 coating method Methods 0.000 claims abstract 8
- 229920003209 poly(hydridosilsesquioxane) Polymers 0.000 claims abstract 7
- 239000011347 resin Substances 0.000 claims abstract 7
- 229920005989 resin Polymers 0.000 claims abstract 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract 5
- 238000010438 heat treatment Methods 0.000 claims abstract 4
- 229910021529 ammonia Inorganic materials 0.000 claims abstract 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052760 oxygen Inorganic materials 0.000 claims abstract 2
- 239000001301 oxygen Substances 0.000 claims abstract 2
- 239000011248 coating agent Substances 0.000 claims 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 229910052703 rhodium Inorganic materials 0.000 claims 2
- 239000010948 rhodium Substances 0.000 claims 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- 125000004423 acyloxy group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 229910052758 niobium Inorganic materials 0.000 claims 1
- 239000010955 niobium Substances 0.000 claims 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 229910052720 vanadium Inorganic materials 0.000 claims 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract 1
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- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/02134—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material comprising hydrogen silsesquioxane, e.g. HSQ
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- H01L21/02107—Forming insulating materials on a substrate
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- H01L21/314—Inorganic layers
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- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
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- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
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Abstract
본 발명은 Si-O 함유 피막을 전자 지지체 의에 형성하는 방법에 관한 것이다. 이 방법은 수소 실세스퀴옥산수지를 습윤 암모니아, 무수 암모니아 및 산소하에서 연속적으로 가열하는 단계를 포함한다. 생성된 피막은 개선된 화학적, 전기적 및 기계적 특성을 갖는다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (4)
- 수소 실세스퀴옥산 수지를 포함하는 도료를 전자 지지체 위에 피복하는 단계(a),피복된 지지체를 암모니아와 습기를 함유하는 대기하에 75내지 400°C의 온도에서 15분 이상 가열하는 단계(b), 단계(b)로부터 수득된 피복된 지지체를 거의 무수 암모니아만을 함유하는 대기하에 75내지 400°C의 온도에서 15분 이상 동안 가열하는 단계(c) 및 단계(c)로부터 수득된 피복된 지지체를 산소 함유 대기하에서 피막을 어닐시키기에 충분하게 15분 이상 동안 150°C이상의 온도로 가열하는 단계(d)를 포함함을 특징으로 하여, Si-O함유 피막을 전자 지지체 위에 형성시키는 방법.
- 제1항에 있어서, 수소 실세스퀴옥산 수지가, 지지체를 용매와 수소 실세스퀴옥산 수지를 포함하는 용액으로 피복한 다음, 용매를 증발시키는 공정에 의해 지지체에 피복되는 방법.
- 제1항에 있어서, 수소 실세스퀴옥산 수지를 포함하는 피막이 또한 티타늄, 지르코늄, 알루미늄, 탄탈륨, 바나듐, 니오븀, 붕소 및 인 중에서 선택된 원소를 함유하고 알콕시 또는 아실옥시 중에서 선택된 하나 이상의 가수분해성 치환체를 함유하며 피막이 개질된 세라믹 산화물을 0.1내지 30 중량% 함유하는 양으로 존재하는 화합물을 포함하는 개질된 세라믹 산화물 전구체를 함유하는 방법.
- 제1항에 있어서, 수소 실세스퀴옥산 수지를 포함하는 피막이 또한, 수소 실세스퀴옥산 수지의 중량을 기준으로 하여, 백금, 로듐 또는 구리가 5 내지 500ppm의 양으로 존재하는 백금, 로듐 또는 구리 촉매를 함유하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8/225,688 | 1994-04-11 | ||
US08/225,688 US5547703A (en) | 1994-04-11 | 1994-04-11 | Method of forming si-o containing coatings |
Publications (1)
Publication Number | Publication Date |
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KR950032543A true KR950032543A (ko) | 1995-12-22 |
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ID=22845846
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019950008228A KR950032543A (ko) | 1994-04-11 | 1995-04-10 | Si-O 함유 피막을 형성시키는 방법 |
Country Status (5)
Country | Link |
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US (1) | US5547703A (ko) |
EP (1) | EP0677872A1 (ko) |
JP (1) | JPH07283212A (ko) |
KR (1) | KR950032543A (ko) |
TW (1) | TW282563B (ko) |
Cited By (1)
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KR100719188B1 (ko) * | 1999-08-31 | 2007-05-16 | 동경 엘렉트론 주식회사 | 기판처리방법 |
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US6015457A (en) * | 1997-04-21 | 2000-01-18 | Alliedsignal Inc. | Stable inorganic polymers |
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US5906859A (en) * | 1998-07-10 | 1999-05-25 | Dow Corning Corporation | Method for producing low dielectric coatings from hydrogen silsequioxane resin |
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US6472076B1 (en) | 1999-10-18 | 2002-10-29 | Honeywell International Inc. | Deposition of organosilsesquioxane films |
US6440550B1 (en) * | 1999-10-18 | 2002-08-27 | Honeywell International Inc. | Deposition of fluorosilsesquioxane films |
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US6558755B2 (en) | 2000-03-20 | 2003-05-06 | Dow Corning Corporation | Plasma curing process for porous silica thin film |
WO2001086707A1 (fr) * | 2000-05-08 | 2001-11-15 | Denki Kagaku Kogyo Kabushiki Kaisha | Film siox de faible permittivite relative, procede de production, dispositif semi-conducteur contenant ledit film |
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US5436029A (en) * | 1992-07-13 | 1995-07-25 | Dow Corning Corporation | Curing silicon hydride containing materials by exposure to nitrous oxide |
-
1994
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-
1995
- 1995-03-17 TW TW084102599A patent/TW282563B/zh active
- 1995-04-04 JP JP7078745A patent/JPH07283212A/ja active Pending
- 1995-04-05 EP EP95302281A patent/EP0677872A1/en not_active Withdrawn
- 1995-04-10 KR KR1019950008228A patent/KR950032543A/ko active IP Right Grant
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KR100719188B1 (ko) * | 1999-08-31 | 2007-05-16 | 동경 엘렉트론 주식회사 | 기판처리방법 |
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JPH07283212A (ja) | 1995-10-27 |
US5547703A (en) | 1996-08-20 |
EP0677872A1 (en) | 1995-10-18 |
TW282563B (ko) | 1996-08-01 |
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