[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

KR20240147476A - 워크 가공용 보호 시트 및 워크 개편화물의 제조 방법 - Google Patents

워크 가공용 보호 시트 및 워크 개편화물의 제조 방법 Download PDF

Info

Publication number
KR20240147476A
KR20240147476A KR1020240033481A KR20240033481A KR20240147476A KR 20240147476 A KR20240147476 A KR 20240147476A KR 1020240033481 A KR1020240033481 A KR 1020240033481A KR 20240033481 A KR20240033481 A KR 20240033481A KR 20240147476 A KR20240147476 A KR 20240147476A
Authority
KR
South Korea
Prior art keywords
protective sheet
work
workpiece
meth
buffer layer
Prior art date
Application number
KR1020240033481A
Other languages
English (en)
Korean (ko)
Inventor
유야 하세가와
잇세이 아다치
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20240147476A publication Critical patent/KR20240147476A/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
KR1020240033481A 2023-03-30 2024-03-08 워크 가공용 보호 시트 및 워크 개편화물의 제조 방법 KR20240147476A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023055968A JP2024143342A (ja) 2023-03-30 2023-03-30 ワーク加工用保護シートおよびワーク個片化物の製造方法
JPJP-P-2023-055968 2023-03-30

Publications (1)

Publication Number Publication Date
KR20240147476A true KR20240147476A (ko) 2024-10-08

Family

ID=92857093

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020240033481A KR20240147476A (ko) 2023-03-30 2024-03-08 워크 가공용 보호 시트 및 워크 개편화물의 제조 방법

Country Status (3)

Country Link
JP (1) JP2024143342A (ja)
KR (1) KR20240147476A (ja)
CN (1) CN118721016A (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015183008A (ja) 2014-03-20 2015-10-22 リンテック株式会社 粘着シート

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015183008A (ja) 2014-03-20 2015-10-22 リンテック株式会社 粘着シート

Also Published As

Publication number Publication date
JP2024143342A (ja) 2024-10-11
CN118721016A (zh) 2024-10-01

Similar Documents

Publication Publication Date Title
CN109743877B (zh) 半导体加工用粘着胶带以及半导体装置的制造方法
JP7149487B2 (ja) 半導体加工用粘着テープ、及び半導体装置の製造方法
US11842916B2 (en) Semiconductor processing adhesive tape and method of manufacturing semiconductor device
CN112334558B (zh) 半导体加工用粘着胶带及半导体装置的制造方法
JP7488678B2 (ja) 半導体加工用保護シートおよび半導体装置の製造方法
JP7566480B2 (ja) 半導体加工用保護シートおよび半導体装置の製造方法
KR20240147476A (ko) 워크 가공용 보호 시트 및 워크 개편화물의 제조 방법
WO2023281861A1 (ja) 半導体加工用保護シートおよび半導体装置の製造方法
TW202438308A (zh) 工件加工用保護片及工件個片化物的製造方法
WO2023281859A1 (ja) 半導体加工用保護シートおよび半導体装置の製造方法
WO2023281858A1 (ja) 半導体加工用保護シートおよび半導体装置の製造方法
WO2022201790A1 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法
WO2023281860A1 (ja) 半導体加工用保護シートおよび半導体装置の製造方法
WO2022201789A1 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法
WO2022201788A1 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法
WO2022209118A1 (ja) 半導体加工用粘着テープおよび半導体装置の製造方法
JP2023148645A (ja) ワーク加工用保護シートおよびワーク個片化物の製造方法
JP2024125817A (ja) ワーク加工用保護シートおよび樹脂シート付きワーク個片化物の製造方法
JP2024143347A (ja) ワーク加工用保護シートおよびワーク個片化物の製造方法
KR20230134093A (ko) 워크 가공용 보호 시트 및 워크 개편화물의 제조 방법
JP2024141897A (ja) ワーク加工用テープおよびワークの裏面研削方法