KR20220160837A - Camera device and optical instrument including the same - Google Patents

Abstract

An embodiment includes: a fixing part; a first magnet disposed on the fixing part; a first moving part including a first coil and moving in an optical axis direction by an interaction between the first magnet and the first coil; a second moving part including a first substrate part disposed apart from the fixing part, a second coil facing the first magnet in the optical axis direction, and an image sensor disposed on the first substrate part; and a first yoke disposed on the fixing part and disposed facing the first magnet in the optical axis direction. Due to the interaction between the first magnet and the second coil, the second moving part moves in a direction perpendicular to the optical axis direction. Therefore, it is possible to improve the electromagnetic force for AF driving and the electromagnetic force for OIS driving.

Description

Camera device and optical device {CAMERA DEVICE AND OPTICAL INSTRUMENT INCLUDING THE SAME}

The embodiment relates to a camera device and an optical device including the camera device.

It is difficult to apply the technology of a voice coil motor (VCM) used in a conventional camera device to a camera device for ultra-small size and low power consumption, and related research has been actively conducted.

BACKGROUND OF THE INVENTION Demand and production of electronic products such as smartphones and camera-equipped mobile phones are increasing. Cameras for mobile phones tend to be high-resolution and miniaturized, and accordingly, actuators are becoming miniaturized, large-diameter, and multi-functional. In order to implement a camera for a high-pixel mobile phone, additional functions such as performance improvement, auto focusing, shutter shake improvement, and zoom function of the mobile phone camera are required.

Embodiments provide a camera device capable of improving electromagnetic force for AF driving and electromagnetic force for OIS driving, and an optical device including the same.

A camera device according to an embodiment includes a fixing unit; a first magnet disposed on the fixing part; a first moving unit including a first coil and moving in an optical axis direction by an interaction between the first magnet and the first coil; a second moving part including a first substrate part disposed apart from the fixing part, a second coil facing the first magnet in the optical axis direction, and an image sensor disposed on the first substrate part; and a first yoke disposed on the fixing unit and disposed to face the first magnet in the optical axis direction, wherein the second moving unit is coupled to the optical axis direction by an interaction between the first magnet and the second coil. move in a vertical direction

The first magnet may be disposed above the second coil, and the first yoke may be disposed below the second coil.

The first magnet includes a first magnet part including a first N pole and a first S pole; and a second magnet part including a second N pole and a second S pole and disposed below the first magnet part.

A barrier rib disposed between the first magnet unit and the second magnet unit may be included, and the barrier rib may be in a neutral zone. The first magnet part and the second magnet part may be spaced apart from each other.

The first N pole may contact the second S pole, and the first S pole may contact the second N pole.

The camera device may include a second yoke disposed between the first magnet part and the second magnet part. The camera device may include a third yoke disposed on a side surface of the first magnet. The camera device may include a fourth yoke disposed on an upper surface of the second magnet. The first yoke may be a magnetic material. The camera device may include a fifth yoke disposed on a side surface of at least one of the first magnet unit and the second magnet unit. In the optical axis direction, the first yoke may overlap at least a portion of the first magnet.

A separation distance between the first magnet and the second coil in the optical axis direction may be smaller than a separation distance between the first magnet and the first yoke in the optical axis direction.

The fixing unit may include a second substrate portion disposed to be spaced apart from the first substrate portion; and a support substrate electrically connecting the first substrate portion and the second substrate portion.

The first yoke may be disposed between the second coil and the second substrate unit.

The first yoke may be disposed on an upper surface of the second substrate unit.

A camera device according to another embodiment includes a fixing unit; a first magnet and a yoke disposed spaced apart from each other in the fixing part; a first moving unit including a first coil facing the first magnet in a direction perpendicular to the optical axis; And a second moving part including a first substrate part disposed apart from the fixing part, an image sensor disposed on the first substrate part, and a second coil facing the first magnet in the optical axis direction, The second coil is disposed between the first magnet and the yoke and moves the second moving unit in a direction perpendicular to the optical axis direction by interaction with the first magnet.

The embodiment can improve the electromagnetic force due to the interaction between the first magnet and the second coil by using a yoke disposed under the second coil, improve the OIS driving force or the electromagnetic force for driving the OIS, and reduce power consumption. growth can be prevented.

In addition, the embodiment may improve the electromagnetic force due to the interaction between the first magnet and the first coil and the electromagnetic force due to the interaction between the first magnet and the second coil by having a yoke disposed on the first magnet.

In addition, the embodiment can improve the OIS electromagnetic force by providing the first magnet in the form of bipolar magnetization.

Also, according to the embodiment, the length of the first magnet part of the first magnet is greater than the length of the second magnet part, so that the electromagnetic force for AF driving can be improved and the increase in power consumption can be prevented.

Also, according to the embodiment, the linearity of the correlation between the displacement of the bobbin and the output of the first position sensor may be improved by making the length of the first magnet part of the first magnet greater than the length of the second magnet part.

1 is a perspective view of a camera device according to an embodiment.
2 is a perspective view of the camera device with the cover member removed.
3 is an exploded perspective view of the camera device of FIG. 1;
FIG. 4A is a cross-sectional view of the camera device in the direction AB of FIG. 1 .
Fig. 4b is a cross-sectional view of the camera device in the CD direction of Fig. 1;
4C is a cross-sectional view of the camera device in the EF direction of FIG. 1 .
5 is an exploded perspective view of the AF moving unit of FIG. 3 .
6 is a perspective view of a bobbin, a sensing magnet, a balancing magnet, a first coil, a circuit board, a first position sensor, and a capacitor.
7 is a perspective view of a bobbin, a housing, a circuit board, an upper elastic member, a sensing magnet, and a balancing magnet.
8 is a bottom perspective view of a housing, a bobbin, a lower elastic member, a magnet, and a circuit board.
9 is a perspective view of an image sensor unit.
FIG. 10A is a first exploded perspective view of the image sensor unit of FIG. 9 .
FIG. 10B is a second exploded perspective view of the image sensor unit of FIG. 9 .
11 is a perspective view of the holder, the second coil, the image sensor, the OIS position sensor, and the first substrate of FIG. 10A.
12 is a first perspective view of the first circuit board and the second circuit board of the first board part.
13 is a second perspective view of the first circuit board and the second circuit board of the first board unit.
14A is a bottom perspective view of the holder.
14B shows the holder, the first substrate portion and the supporting substrate.
15 is a perspective view of a holder, a second coil, a first substrate portion, an image sensor, and a support substrate.
16 shows embodiments of the elastic part of the supporting substrate.
17 is a bottom perspective view of the first circuit board and the supporting substrate.
18A is a first perspective view of a support substrate coupled to a holder and a base.
18B is a second perspective view of the support substrate coupled to the holder and the base.
19 is a bottom view of the first substrate portion, the holder, the support substrate, and the elastic member.
20A is a perspective view of a first coil, a first magnet, a second coil, a yoke, and first and second substrate portions.
20B is an enlarged view of a portion of the camera device.
20C shows the distance between the first magnet and the second coil, the distance between the first magnet and the yoke, and the distance between the second coil and the yoke.
21A shows an example of a first magnet, a first coil, a second coil, and a yoke.
21B shows another embodiment of the first magnet.
21C shows another embodiment of the first magnet.
21D shows another embodiment of the first magnet.
21E is a modified example of FIG. 21B.
22A shows another embodiment of the first magnet.
22B shows an example of lengths of long sides of the first magnet, the second coil, and the yoke.
FIG. 22C shows another embodiment of the length of the long side of the second magnet part of FIG. 22B.
23A shows another embodiment of FIG. 21E.
Figure 23b shows another embodiment of Figure 21c.
23c shows another embodiment of FIG. 23b.
24 shows the arrangement of third magnets according to an embodiment.
25 is a perspective view of a cover member, a first magnet, a first coil, a second coil, and a second position sensor according to an embodiment.
26 shows a perspective view of an optical device according to an embodiment.
Fig. 27 shows a configuration diagram of the optical device shown in Fig. 26;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical spirit of the present invention is not limited to some of the described embodiments, but may be implemented in a variety of different forms, and if it is within the scope of the technical spirit of the present invention, one or more of the components among the embodiments can be selectively implemented. can be used by combining and substituting.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless specifically defined and described, have meaning that can be generally understood by those skilled in the art to which the present invention belongs. , and commonly used terms, such as terms defined in a dictionary, can be interpreted in consideration of contextual meanings of related technologies.

In addition, terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In this specification, the singular form may also include the plural form unless otherwise specified in the phrase, and when described as "at least one (or more than one) of A and (and) B and C", A, B, and C can be combined. may include one or more of all possible combinations.

Also, terms such as first, second, A, B, (a), and (b) may be used to describe components of an embodiment of the present invention. These terms are only used to distinguish the component from other components, and the term is not limited to the nature, order, or order of the corresponding component.

And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected to, combined with, or connected to the other component, but also with that component. It may also include the case of being 'connected', 'combined', or 'connected' due to another component between the other components. In addition, when it is described as being formed or disposed on the "top (above) or bottom (bottom)" of each component, the top (top) or bottom (bottom) is not only a case where two components are in direct contact with each other, but also one A case in which another component above is formed or disposed between two components is also included. In addition, when expressed as "up (up) or down (down)", it may include the meaning of not only the upward direction but also the downward direction based on one component.

Hereinafter, the AF moving unit may be referred to as a lens driving unit, a lens driving unit, a voice coil motor (VCM), an actuator, or a lens moving device, and the term "coil" is referred to as a coil unit ( coil unit), and the term “elastic member” may be replaced with an elastic unit or a spring.

In addition, in the following description, “terminal” may be replaced with a pad, an electrode, a conductive layer, or a bonding portion.

For convenience of explanation, the camera device according to the embodiment is described using a Cartesian coordinate system (x, y, z), but it may be described using another coordinate system, and the embodiment is not limited thereto. In each figure, the x-axis and the y-axis mean directions perpendicular to the z-axis, which is the optical axis direction, and the z-axis direction, which is the optical axis (OA) direction, is referred to as a 'first direction', and the x-axis direction is referred to as a 'second direction'. , and the y-axis direction may be referred to as a 'third direction'. For example, the first direction may be a direction perpendicular to the imaging area of the image sensor.

A camera device according to an embodiment may perform an 'auto focusing function'. Here, the auto-focusing function refers to automatically focusing an image of a subject on the image sensor surface.

Hereinafter, the camera device may be expressed as a “camera module”, “camera”, “imaging device”, or “lens moving device”.

Also, the camera device according to the embodiment may perform 'hand shake correction function'. Here, the hand shake correction function refers to preventing the outline of a captured image from being clearly formed due to vibration caused by a user's hand shake when capturing a still image.

1 is a perspective view of a camera device 10 according to an embodiment, FIG. 2 is a perspective view of the camera device 10 from which the cover member 300 is removed, and FIG. 3 is an exploded perspective view of the camera device 10 of FIG. 1 , FIG. 4A is a cross-sectional view of the camera device 10 in the AB direction of FIG. 1 , FIG. 4B is a cross-sectional view of the camera device 10 in the CD direction of FIG. 1 , and FIG. A cross-sectional view in the EF direction, FIG. 5 is an exploded perspective view of the AF moving unit 100 of FIG. 3, and FIG. 6 is a bobbin 110, a sensing magnet 180, a balancing magnet 185, a first coil 120, A perspective view of the circuit board 190, the first position sensor 170, and the capacitor 195, and FIG. 7 shows the bobbin 110, the housing 140, the circuit board 190, the upper elastic member 150, and the sensing It is a perspective view of the magnet 180 and the balancing magnet 185, and FIG. 8 is a bottom perspective view of the housing 140, the bobbin 110, the lower elastic member 160, the magnet 130, and the circuit board 190.

1 to 8 , the camera device 10 may include an AF moving unit 100 and an image sensor unit 350.

The camera device 10 may further include at least one of the cover member 300 and the lens module 400 . The cover member 300 and the base 210 to be described later may constitute a case.

The AF moving unit 100 is coupled to the lens module 400, moves the lens module in the direction of the optical axis (OA) or in a direction parallel to the optical axis, and auto-focusing of the camera device 10 by the AF moving unit 100 function can be performed.

The image sensor unit 350 may include an image sensor 810 . The image sensor unit 350 may move the image sensor 810 in a direction perpendicular to the optical axis. In addition, the image sensor unit 350 may tilt or rotate the image sensor 810 based on the optical axis or using the optical axis as a rotational axis. A hand shake correction function of the camera device 10 may be performed by the image sensor unit 350 .

For example, the image sensor 810 may include an imaging area for detecting light passing through the lens module 400 . Here, the imaging area may be expressed as an effective area, a light-receiving area, or an active area. For example, the imaging area of the image sensor 810 is a region where light passing through the filter 610 is incident and an image including the light is formed, and may include at least one pixel.

The AF moving unit 100 may be referred to as a "lens moving unit" or a "lens driving device". Alternatively, the AF moving unit 100 may be expressed as “first moving unit (or second moving unit)”, “first actuator (or second actuator)” or “AF driving unit”.

In addition, the image sensor unit 350 may be expressed as an “image sensor moving unit” or an “image sensor shift unit”, a “sensor moving unit”, or a “sensor shift unit”. Alternatively, the image sensor unit 350 may be expressed as a second moving unit (or first moving unit), “second actuator (or first actuator)” or “OIS driving unit”.

Referring to FIG. 5 , the AF moving unit 100 may include a bobbin 110, a first coil 120, a magnet 130, and a housing 140.

The AF moving unit 100 may further include an upper elastic member 150 and a lower elastic member 160 .

In addition, the AF moving unit 100 may further include a first position sensor 170, a circuit board 190, and a sensing magnet 180 for AF feedback driving. Also, the AF moving unit 100 may further include at least one of a balancing magnet 185 and a capacitor 195.

The bobbin 110 is disposed inside the housing 140 and moves in the optical axis OA direction or a first direction (eg, Z-axis direction) by electromagnetic interaction between the first coil 120 and the magnet 130. It can be.

The bobbin 110 may be combined with the lens module 400 or may have an opening for mounting the lens module 400 thereon. For example, the opening of the bobbin 110 may be a through hole penetrating the bobbin 110 in the optical axis direction, and the shape of the opening of the bobbin 110 may be circular, elliptical, or polygonal, but is not limited thereto. .

The lens module 400 may include at least one lens or/and a lens barrel.

For example, the lens module 400 may include one or more lenses and a lens barrel accommodating the one or more lenses. However, one configuration of the lens module is not limited to the lens barrel, and any holder structure capable of supporting one or more lenses may be used.

For example, the lens module 400 may be screwed to the bobbin 110 as an example. Alternatively, for example, the lens module 400 may be coupled to the bobbin 110 by an adhesive (not shown). Meanwhile, light passing through the lens module 400 may pass through the filter 610 and be irradiated to the image sensor 810 .

The bobbin 110 may have a protrusion 111 provided on an outer surface. For example, the protrusion 111 may protrude in a direction parallel to a straight line perpendicular to the optical axis OA, but is not limited thereto.

The protruding part 111 of the bobbin 110 corresponds to the groove part 25a of the housing 140, and may be inserted or disposed in the groove part 25a of the housing 140, and the bobbin 110 is constant around the optical axis. Rotation beyond the range can be suppressed or prevented. In addition, the protrusion 111 may act as a stopper to allow the bobbin 110 to move within a prescribed range in the direction of the optical axis (eg, from the upper elastic member 150 to the lower elastic member 160) by external impact. have.

A first escape groove 112a for avoiding spatial interference with the first frame connecting portion 153 of the upper elastic member 150 may be provided on the upper surface of the bobbin 110 . In addition, a second escape groove 112b may be provided on the lower surface of the bobbin 110 to avoid spatial interference with the second frame connecting portion 163 of the lower elastic member 160 .

The bobbin 110 may include a first coupling portion 116a for coupling and fixing to the upper elastic member 150 . For example, the first coupling portion of the bobbin 110 may have a protruding shape, but is not limited thereto, and may be flat or grooved in other embodiments.

In addition, the bobbin 110 may include a second coupling portion 116b for coupling and fixing to the lower elastic member 160 . For example, the second coupling portion 116b may have a protruding shape, but is not limited thereto, and may have a flat or grooved shape in other embodiments.

Referring to FIG. 6 , a groove in which the first coil 120 is seated, inserted, or placed may be provided on an outer surface of the bobbin 110 . The groove of the bobbin 110 may have a shape matching the shape of the first coil 120 or a closed curve shape (eg, a ring shape).

In addition, the bobbin 110 may be provided with a first seating groove 26a in which the sensing magnet 180 is seated, inserted, fixed, or disposed. In addition, the outer surface of the bobbin 110 may be provided with a second seating groove 26b in which the balancing magnet 185 is seated, inserted, fixed, or disposed. For example, the first and second seating grooves 26a and 26b of the bobbin 110 may be formed on outer surfaces of the bobbin 110 facing each other.

Referring to Figures 5 and 7, the bobbin 110 may be formed with a protrusion 104 protruding from the upper surface corresponding to the first frame connecting portion 153 of the upper elastic member 150. For example, the protrusion 104 may protrude from the bottom surface of the first escape groove of the bobbin 110 .

A damper 48 may be disposed between the protrusion 104 and the first frame connecting portion 153 of the upper elastic member 150 . The damper 48 may contact and be attached to the protrusion 104 of the bobbin 110 and the first frame connecting portion 153, and may serve to buffer or absorb vibration of the bobbin 110. For example, the damper 48 may be formed of a damping member (eg, silicon). The protrusion 104 may serve to guide the damper 48 .

Grooves 119 or grooves may be formed on the upper surface of the bobbin 110 at positions corresponding to, opposite to, or overlapping the protrusions 305 of the cover member 300 in the first direction (or optical axis direction). For example, the groove 119 may be formed to be depressed from the bottom surface of the first escape groove 112a. In another embodiment, the groove 119 may be formed to be depressed from the upper surface of the bobbin 110.

The first coil 120 is disposed on the bobbin 110 or coupled with the bobbin 110 . For example, the first coil 120 may be disposed on an outer surface of the bobbin 110 . For example, the first coil 120 may wrap the outer surface of the bobbin 110 in a rotational direction about the optical axis OA, but is not limited thereto.

The first coil 120 may be directly wound on the outer surface of the bobbin 110, but is not limited thereto. According to another embodiment, the first coil 120 is wound on the bobbin 110 using a coil ring. It may be wound or provided as an angular ring-shaped coil block.

Power or a driving signal may be provided to the first coil 120 . The power or driving signal provided to the first coil 120 may be a DC signal or an AC signal, or may include a DC signal and an AC signal, and may be in the form of voltage or current.

The first coil 120 may form electromagnetic force through electromagnetic interaction with the magnet 130 when a driving signal (eg, driving current) is supplied, and the bobbin 110 moves in the direction of the optical axis OA by the formed electromagnetic force. can be moved

At the initial position of the AF movable unit, the bobbin 110 may be moved in an upward or downward direction, which is referred to as bi-directional driving of the AF movable unit. Alternatively, in the initial position of the AF movable unit, the bobbin 110 may be moved upward, which is referred to as unidirectional driving of the AF movable unit.

For example, the maximum stroke of the bobbin 110 in the upward direction from the initial position may be 400 micrometers to 500 micrometers, and the maximum stroke of the bobbin 110 in the downward direction from the initial position may be 100 micrometers to 200 micrometers. can be

At the initial position of the AF movable unit, the first coil 120 may be disposed to correspond to or overlap the magnet 130 disposed on the housing 140 in a direction perpendicular to the optical axis OA and parallel to a straight line passing through the optical axis. have.

For example, the AF moving unit may include a bobbin 110 and elements coupled to the bobbin 110 (eg, the first coil 120, the sensing magnet 180, and the balancing magnets 180 and 185). In addition, Af The movable unit may further include a lens module 400 .

Also, the initial position of the AF movable unit is the initial position of the AF movable unit in a state in which power is not applied to the first coil 120, or the upper and lower elastic members 150 and 160 are elastically deformed only by the weight of the AF movable unit. It may be a position where the movable part is placed. In addition, the initial position of the bobbin 110 is the position where the AF movable part is placed when gravity acts in the direction from the bobbin 110 to the base 210 or, conversely, when gravity acts in the direction from the base 210 to the bobbin 110. can be

The sensing magnet 180 may provide a magnetic field for the first position sensor 170 to sense, and the balancing magnet 185 cancels the influence of the magnetic field of the sensing magnet 180, and the sensing magnet 180 and can play a role in balancing the weight.

The sensing magnet 180 may be alternatively expressed as a “sensor magnet” or a “second magnet”. The sensing magnet 180 may be disposed on the bobbin 110 or coupled to the bobbin 110 . The sensing magnet 180 may be disposed to face the first position sensor 170 . The balancing magnet 185 may be disposed on the bobbin 110 or coupled to the bobbin 110 . For example, the balancing magnet 185 may be disposed on the opposite side of the sensing magnet 180 .

For example, each of the sensing and balancing magnets 180 and 185 may be a unipolar magnetized magnet having one N pole and one S pole, but is not limited thereto. In another embodiment, each of the sensing and balancing magnets 180 and 185 may be a bipolar magnet or a 4-pole magnet including two N poles and two S poles.

The sensing magnet 180 may move in the optical axis direction together with the bobbin 110, and the first position sensor 170 may detect the strength or magnetic force of the magnetic field of the sensing magnet 180 moving in the optical axis direction. An output signal according to the results obtained can be output.

For example, the strength or magnetic force of the magnetic field detected by the first position sensor 170 may change according to the displacement of the bobbin 110 in the direction of the optical axis, and the first position sensor 170 is proportional to the strength of the detected magnetic field. The displacement of the bobbin 110 in the optical axis direction can be detected using the output signal of the first position sensor 170.

The housing 140 is disposed inside the cover member 300 . The housing 140 may accommodate the bobbin 110 therein and support the magnet 130 , the first position sensor 170 , and the circuit board 190 .

Referring to FIGS. 5, 7, and 8 , the housing 140 may have a hollow column shape as a whole. For example, the housing 140 may have a polygonal (eg, quadrangular or octagonal) or circular opening, and the opening of the housing 140 may be in the form of a through hole penetrating the housing 140 in the optical axis direction.

The housing 140 may include side portions corresponding to or opposite to the side plate 302 of the cover member 300 and corners corresponding to or opposite to corners of the cover member 300 .

In order to prevent the cover member 300 from directly colliding with the inner surface of the top plate 301, the housing 140 may include a stopper 145 provided on the top, top, or top of the cover member 300.

Referring to FIG. 5 , the housing 140 may include a mounting groove 14a (or a seating groove) for accommodating the circuit board 190 . The mounting groove 14a may have a shape identical to that of the circuit board 190 .

Referring to FIG. 7 , the housing 140 may include an opening for exposing the terminals B1 to B4 of the terminal unit 95 of the circuit board 190, and the opening is formed on a side of the housing 140. It can be.

At least one first coupling portion coupled to the first outer frame 152 of the upper elastic member 150 may be provided on the top, top, or top surface of the housing 140 . A second coupling part coupled to and fixed to the second outer frame 162 of the lower elastic member 160 may be provided at the bottom, bottom, or lower surface of the housing 140 . For example, each of the first and second coupling parts of the housing 140 may have a flat surface, a protrusion shape, or a groove shape.

The magnet 130 may be disposed on the housing 140 . For example, the magnet 130 may be disposed on the side of the housing 140 . The magnet 130 may be a driving magnet for AF driving.

For example, the magnet 130 may include a plurality of magnet units. For example, the magnet 130 may include first to fourth magnet units 130 - 1 to 130 - 4 disposed in the housing 140 . In another embodiment, the magnet 130 may include two or more magnet units.

The magnet 130 may be disposed on at least one of a side or a corner of the housing 140 . For example, at least a portion of the magnet 130 may be disposed on a side or corner of the housing 140 .

For example, each of the magnet units 130-1 to 130-4 may include a first part disposed at a corresponding one of the four corners of the housing 130. In addition, each of the magnet units 130-1 to 130-4 may include a second part disposed on one side of the housing 140 adjacent to the one corner of the housing 140.

At the initial position of the AF movable unit, the magnet 130 may be disposed on the housing 140 such that at least a portion of the magnet 130 overlaps the first coil 120 in a direction perpendicular to the optical axis OA and parallel to a straight line passing through the optical axis OA. can

The magnet 130 may be a monopole magnetized magnet. In another embodiment, the magnet 130 may be a positively magnetized magnet or a four-pole magnet including two N poles and two S poles.

For example, the magnet 130 may be a common magnet for performing an AF operation and an OIS operation, which will be described later.

The circuit board 190 may be disposed on the housing 140 , and the first position sensor 170 may be disposed or mounted on the circuit board 190 and may be electrically connected to the circuit board 190 . For example, the circuit board 190 may be disposed in the mounting groove 14a of the housing 140, and the terminals 95 of the circuit board 190 may be exposed to the outside of the housing 140.

The circuit board 190 may include a terminal unit 95 (or terminal unit) including a plurality of terminals B1 to B4 to be electrically connected to external terminals or external devices. The plurality of terminals B1 to B4 of the circuit board 1900 may be electrically connected to the first position sensor 170 .

The first position sensor 170 may be disposed on the first surface of the circuit board 190 , and the plurality of terminals B1 to B4 may be disposed on the second surface of the circuit board 190 . Here, the second surface of the circuit board 190 may be a surface opposite to the first surface of the circuit board 190 . For example, the first surface of the circuit board 190 may be one surface of the circuit board 190 facing the bobbin 110 or the sensing magnet 180 .

For example, the circuit board 190 may be a printed circuit board or FPCB.

The circuit board 190 may include circuit patterns or wires (not shown) for electrically connecting the first to fourth terminals B1 to B4 and the first position sensor 170 .

For example, at the initial position of the AF movable unit, the first position sensor 170 is perpendicular to the optical axis OA and at least partially faces or overlaps the sensing magnet 180 in a direction parallel to a straight line passing through the optical axis OA. can In another embodiment, the first position sensor may not face or overlap the sensing magnet at the initial position of the AF movable unit.

The first position sensor 170 may detect the magnetic field or strength of the magnetic field of the sensing magnet 180 mounted on the bobbin 110 according to the movement of the bobbin 110, and output an output signal according to the detected result. can

The first position sensor 170 may be a driver IC including a Hall sensor and a driver. The first position sensor 170 sends a driving signal to the first to fourth terminals and the first coil 120 for transmitting and receiving data with the outside using data communication using a protocol, for example, I2C communication. It may include fifth and sixth terminals for direct provision.

The first position sensor 170 may be electrically connected to the first to fourth terminals B1 to B4 of the circuit board 190 . For example, each of the first to fourth terminals of the first position sensor 170 may be electrically connected to a corresponding one of the first to fourth terminals of the circuit board 190 .

The fifth and sixth terminals of the first position sensor 170 may be electrically connected to the first coil 120 through at least one of the upper elastic member 150 and the lower elastic member 160, and the first coil ( 120) may be provided with a driving signal. For example, a part of the first lower elastic member 160-1 may be connected to one end of the first coil 120, and another part of the first lower elastic member 160-1 may be electrically connected to the circuit board 190. can be connected A part of the second lower elastic member 160-2 may be connected to the other end of the first coil 120, and another part of the second lower elastic member 160-2 may be electrically connected to the circuit board 190. have. In another embodiment, the first coil may be electrically connected to the fifth and sixth terminals of the circuit board 190 and the first position sensor 170 by two upper elastic members.

For example, in an embodiment in which the first position sensor 170 is a driver IC, the first and second terminals B1 and B2 of the circuit board 190 may be power supply terminals for supplying power, and the third terminal may be It may be a terminal for transmitting and receiving a clock signal, and the fourth terminal may be a terminal for transmitting and receiving a data signal.

In another embodiment, the first position sensor 170 may be a Hall sensor. The first position sensor 170 may include two input terminals to which driving signals or power are provided and two output terminals to output sensing voltages (or output voltages). For example, a driving signal may be provided to the first position sensor 170 through the first and second terminals B1 and B2 of the circuit board 190, and the output of the first position sensor 170 may output a third and may be output to the outside through the fourth terminals B3 and B4. In addition, it may be electrically connected to the circuit board 190 of the first coil 120, and a driving signal may be provided to the first coil 120 from the outside through the circuit board 190. At this time, the circuit board 190 may further include two separate terminals for receiving a driving signal to be provided to the first coil 120 .

For example, a ground terminal among power terminals of the first position sensor 170 may be electrically connected to the cover member 300 .

The capacitor 195 may be disposed or mounted on the first surface of the circuit board 190 . The capacitor 195 may be in the form of a chip. In this case, the chip may include a first terminal corresponding to one end of the capacitor 195 and a second terminal corresponding to the other end of the capacitor 195 . Capacitor 195 may alternatively be referred to as a "capacitive element" or a condenser.

The capacitor 195 may be electrically connected in parallel to the first and second terminals B1 and B2 of the circuit board 190 for providing power (or a driving signal) to the first position sensor 170 from the outside. . Alternatively, the capacitor 195 may be electrically connected in parallel to terminals of the first position sensor 170 that are electrically connected to the first and second terminals B1 and B2 of the circuit board 190 .

The capacitor 195 is electrically connected in parallel to the first and second terminals B1 and B2 of the circuit board 190 to include power signals GND and VDD provided to the first position sensor 170 from the outside. It can serve as a smoothing circuit that removes the ripple component that has been generated, and thereby provides a stable and constant power signal to the first position sensor 170 .

The upper elastic member 150 may be coupled to the upper, upper, or upper surface of the bobbin 110 and the upper, upper, or upper surface of the housing 140, and the lower elastic member 160 may be coupled to the lower part of the bobbin 110, The bottom, or lower surface, and the lower, lower, or lower surface of the housing 140 may be coupled.

The upper elastic member 150 and the lower elastic member 160 may elastically support the bobbin 110 with respect to the housing 140 .

The upper elastic member 150 may include a plurality of upper elastic units (eg, 150-1 and 150-2) that are electrically isolated from each other or spaced apart from each other, and the lower elastic member 160 is electrically separated from each other. or a plurality of lower elastic units (eg, 160-1 and 160-2) spaced apart from each other.

Although it includes two elastic units, in another embodiment, at least one of the upper elastic member and the lower elastic member may be implemented as a single unit or a single configuration.

The upper elastic member 150 includes a first inner frame 151 coupled to or fixed to the top, top surface, or top of the bobbin 110, and a second inner frame 151 coupled to or fixed to the top, top surface, or top of the housing 140. The frame 152 and the first frame connecting portion 153 connecting the first inner frame 151 and the first outer frame 152 may be further included.

The lower elastic member 160 includes a second inner frame 161 coupled to or fixed to the bottom, bottom, or bottom of the bobbin 110, and a second outer frame 161 coupled to or fixed to the bottom, bottom, or bottom of the housing 140. A frame 162 and a second frame connecting portion 163 connecting the second inner frame 161 and the second outer frame 162 to each other may be included. The inner frame may be expressed by replacing the inner part, the outer frame may be expressed by replacing the outer part, and the frame connecting part may be expressed by replacing the connecting part.

Each of the first and second frame connectors 153 and 163 may be bent or curved (or curved) at least once to form a pattern having a predetermined shape.

Each of the upper elastic member 150 and the lower elastic member 160 may be made of a conductive material.

Referring to FIG. 8 , two pads 5a and 5b may be formed on the circuit board 190, and the two pads 5a and 5b may be electrically connected to the first position sensor 170. . Also, the first pad 5a of the circuit board 190 may be electrically connected to the first lower elastic unit 160-1, and the second pad 5b of the circuit board 190 may be connected to the second lower elastic unit ( 160-2) and electrically connected.

For example, the second outer frame 162 of the first lower elastic unit 160-1 includes a first bonding portion 4a coupled to or electrically connected to the first pad 5a of the circuit board 190. The second outer frame 162 of the second lower elastic unit 160-2 may include a second bonding portion 4b electrically connected to the second pad 5b of the circuit board 190. can

In another embodiment, at least one of the upper elastic member 150 or the lower elastic member 160 may include two elastic members. For example, each of the two elastic members of any one of the upper elastic member 150 and the lower elastic member 160 may be coupled or electrically connected to a corresponding one of the first and second pads of the circuit board 190. and the first coil 120 may be electrically connected to the two elastic members.

9 is a perspective view of the image sensor unit 350, FIG. 10A is a first disassembled perspective view of the image sensor unit 350 of FIG. 9, and FIG. 10B is a second disassembled perspective view of the image sensor unit 350 of FIG. 11 is a perspective view of the holder 270, the second coil 230, the image sensor 810, the OIS position sensor 240, and the first substrate 255 of FIG. 10A, and FIG. 12 is the first substrate A first perspective view of the first circuit board 250 and the second circuit board 260 of the unit 255, and FIG. 13 is the first circuit board 250 and the second circuit board of the first substrate unit 255 ( 260), FIG. 14A is a bottom perspective view of the holder 270, FIG. 14B shows the holder 270, the first substrate portion 255 and the support substrate 310, and FIG. 15 shows the holder 270 ), a perspective view of the second coil 230, the first substrate unit 255, the image sensor 810, and the support substrate 310, FIG. 16 shows exemplary embodiments of the support substrate, and FIG. 17 shows the first It is a bottom perspective view of the circuit board 250 and the support substrate 310, Figure 18a is a first perspective view of the support substrate 310 coupled to the holder 270 and the base 210, Figure 18b is a holder 270 and A second perspective view of the support substrate 310 coupled to the base 210, and FIG. 19 is a bottom view of the first substrate portion 255, the holder 270, the support substrate 310, and the elastic member 315 .

Referring to FIGS. 9 to 19 , the image sensor unit 350 may include a fixed unit and an OIS moving unit spaced apart from the fixed unit. The image sensor unit 350 may include a support substrate 310 connecting the fixed unit and the OIS moving unit. The image sensor unit 350 may further include an elastic member 315 for elastically supporting the OIS moving unit with respect to the fixed unit.

The support substrate 310 may support the moving OIS unit with respect to the fixed unit so that the moving OIS unit moves in a direction perpendicular to the optical axis, or tilts or rotates along the optical axis within a predetermined range.

The OIS moving unit includes a first substrate 255, an image sensor 810 disposed on the first substrate 255, a second coil 230 disposed to face the magnet 130 in the optical axis direction, and a first substrate. A second position sensor 240 disposed on the unit 255 may be included.

The OIS moving unit may further include a holder 270 disposed between the second coil 230 and the first substrate unit 255 and accommodating the first substrate unit 255 . The holder 270 may also be expressed as a "spacing member" instead.

The OIS moving unit may further include a filter 610 . The OIS moving unit may further include a filter holder 600 for accommodating the filter 610 .

The fixing unit may include a second substrate portion 800 spaced apart from the first substrate portion 255 and electrically connected to the first substrate portion 255 . The fixing unit may further include a base 210 coupled to the second substrate unit 800 . Also, the fixing unit may include a cover member 300 coupled to the base 210 . Also, the fixing unit may include a housing 140 of the AF moving unit and a magnet 130 disposed in the housing 140 .

The fixing unit may further include a base 210 accommodating the second substrate unit 800 and coupled to the cover member 300 . A yoke 410 disposed on the second substrate may be further included.

The holder 270 may be disposed below the AF moving unit. For example, the holder 270 may be made of a non-conductive member. For example, the holder 270 may be made of an injection material that can be easily shaped by an injection process. Also, the holder 27 may be formed of an insulating material. Also, for example, the holder 270 may be made of a resin or plastic material.

11, 14a, 14b, and 15, the holder 270 has an upper surface 42A, a lower surface 42B that is opposite to the upper surface 42A, and an upper surface 42A and a lower surface 42B. A connecting side surface 42C may be included. For example, the lower surface 42B of the holder 270 may face or face the second substrate portion 800 .

The holder 270 may support the first substrate portion 255 and may be coupled with the first substrate portion 266 . For example, the first substrate portion 266 may be disposed below the holder 270 . For example, the bottom, bottom, or bottom of the holder 270 may be combined with the top, top, or top of the first substrate portion 255 .

Referring to FIG. 14A , the lower surface 42B of the holder 270 may include a first surface 36A and a second surface 36B. The second surface 36B may have a step in the optical axis direction from the first surface 36A. For example, the second surface 36B may be positioned above (or higher than) the first surface 36A. For example, the second surface 36B may be located closer to the upper surface 42A of the holder 270 than the first surface 36A. For example, the distance between the upper surface 42A of the holder 270 and the second surface 36B may be smaller than the distance between the upper surface 42A and the first surface 36A of the holder 270 .

The holder 270 may include a third surface 36C connecting the first surface 36A and the second surface 36B. For example, the first surface 36A and the second surface 36B may be parallel, and the third surface 36C may be perpendicular to the first surface 36A or/and the second surface 36B. It is not limited. In another embodiment, the interior angle formed by the third surface 36C and the first surface 36A (or the second surface 36B) may be an acute angle or an obtuse angle. For example, the first surface 36A and the second surface 36B may be located at the edge of the lower surface 42B of the holder 270 .

The holder 270 may accommodate or support the second coil 230 . The holder 270 may support the second coil 230 so that the second coil 230 is spaced apart from the first substrate portion 255 .

The holder 270 may include an opening 70 corresponding to one region of the first substrate portion 255 . For example, the opening 70 of the holder 270 may be a through hole penetrating the holder 270 in the optical axis direction. For example, the opening 70 of the holder 270 may correspond to, face, or overlap the image sensor 810 in the optical axis direction.

The shape of the opening 70 of the holder 270 viewed from above may be a polygonal shape, for example, a rectangular shape, a circular shape, or an elliptical shape, but is not limited thereto, and may be implemented in various shapes.

For example, the opening 70 of the holder 270 is shaped to expose the image sensor 810, a part of the upper surface of the first circuit board 250, a part of the upper surface of the second circuit board 260, and elements; can have a size. For example, the area of the opening 70 of the holder 270 may be larger than the area of the image sensor 810 and may be smaller than the area of the first surface of the first circuit board 250 . For example, the opening 70 may be formed on the second surface 36B of the lower surface 42B of the holder 270 .

The holder 270 may have holes 41A, 41B, and 41C corresponding to the second position sensor 240 . For example, the holder 270 may include holes 41A, 41B, and 41C formed at positions corresponding to the first to third sensors 240a, 240b, and 240c of the second position sensor 240, respectively. .

For example, holes 41A, 41B, and 41C may be disposed adjacent corners of holder 270 . The holder 270 does not correspond to the second position sensor 240, but may include a dummy hole 41D formed adjacent to a corner of the holder 270 that does not correspond to the second position sensor 240. The dummy hole 41D may be formed to balance the weight of the OIS moving unit when the OIS is driven. In another embodiment, the dummy hole 41D may not be formed.

The holes 41A, 41B, and 41C may be through holes passing through the holder 270 in the optical axis direction. For example, the holes 41A, 41B, and 41C may be formed on the second surface 36B of the lower surface 42B of the holder 270, but are not limited thereto, and in another embodiment, the lower surface of the holder 270 It may be formed on the first surface. In other embodiments, the holes 41A, 41B, and 41C of the holder 270 may be omitted.

At least one coupling protrusion 51 to be coupled with the second coil 230 may be formed on the upper surface 42A of the holder 270 . The coupling protrusion 51 may protrude from the upper surface 42A of the holder 270 toward the AF moving unit. For example, the coupling protrusion 51 may be formed adjacent to each of the holes 41A to 41D of the holder 270 .

For example, two coupling protrusions 51A and 51B may be disposed or arranged to correspond to one hole 41A, 41B, 41C, and 41D of the holder 270 . For example, the holes 41A, 41B, 41C, and 41D of the holder 270 may be positioned between the two coupling protrusions 51A and 51B.

The first substrate unit 255 may include a first circuit board 250 and a second circuit board 260 electrically connected to each other. The second circuit board 260 may be referred to as a “sensor board” instead.

The first substrate portion 255 may be disposed on the lower surface 42B of the holder 260 . For example, the first substrate portion 255 may be disposed on the second surface 36B of the lower surface 42B of the holder 260 . For example, the first circuit board 250 may be disposed on the second surface 36B of the lower surface 42B of the holder 270 . For example, the first surface 60A of the first circuit board 250 (see FIG. 12 ) may be coupled or attached to the second surface 36B of the lower surface 42B of the holder 270 by an adhesive member.

In this case, the first surface 60A of the first circuit board 250 faces the AF moving part and may be a surface on which the second position sensor 240 is disposed. Also, the second surface 60B of the first circuit board 250 may be a surface opposite to the first surface 60A of the first circuit board 250 .

The first circuit board 250 may be expressed as a sensor board, a main board, a main circuit board, a sensor circuit board, or a moving circuit board. In all embodiments, the first circuit board 250 may be expressed by replacing the “second board” or “second circuit board”, and the second circuit board 260 may be referred to as the “first board” or “first board”. It can also be expressed by replacing it with "circuit board".

Position sensors 240A, 240B, and 240C may be disposed on the first circuit board 250 . In addition, the controller 830 or/and a small element (eg, capacitor) may be disposed on the first circuit board 250 . An image sensor 810 may be disposed on the second circuit board 260 .

The first circuit board 250 may include first terminals E1 to E8 electrically connected to the second coil 230 . Here, the first terminals E1 to E8 may be replaced with “first pads” or “first bonding parts”. The first terminals E1 to E8 of the first circuit board 250 may be disposed or arranged on the first surface 60A of the first circuit board 250 . For example, the first circuit board 250 may be a printed circuit board or a flexible printed circuit board (FPCB).

The first circuit board 250 may include an opening 250A corresponding to or opposite to the openings of the lens module 400 and the bobbin 110 . For example, the opening 250A of the first circuit board 250 may be a through hole penetrating the first circuit board 250 in the optical axis direction, and may be formed at the center of the first circuit board 250 .

When viewed from above, the shape of the first circuit board 250, eg, the outer circumferential shape, may match or correspond to the shape of the holder 270, eg, a rectangular shape. Also, when viewed from above, the shape of the opening 501 of the first circuit board 250 may be a polygonal shape, eg, a rectangular shape, a circular shape, or an elliptical shape.

Also, the first circuit board 250 may include at least one second terminal 251 electrically connected to the second circuit board 260 . Here, the second terminal 251 may be expressed as a "second pad" or a "second bonding part". The second terminal 251 of the first circuit board 250 may be disposed or arranged on the second surface 60B of the first circuit board 250 .

For example, the number of at least one second terminal 251 may be plural, and the plurality of second terminals 251 may be located in a region between the opening 250A of the first circuit board 250 and any one side. It may be arranged or arranged in a direction parallel to. For example, the plurality of second terminals 251 may be arranged to surround the opening 250A.

The second circuit board 260 may be disposed below the first circuit board 250 .

When viewed from above, the second circuit board 260 may be polygonal (eg, square, square, or rectangular), but is not limited thereto, and may be circular or elliptical in other embodiments.

For example, the area of the front surface of the quadrangular second circuit board 260 may be greater than the area of the opening 250A of the first circuit board 250 . For example, the lower side of the opening 250A of the first circuit board 250 may be shielded or blocked by the second circuit board 260 .

For example, when viewed from the top or bottom, the outer surface (or side) of the second circuit board 260 is the outer surface (or side) of the second circuit board 260 and the opening (or side) of the second circuit board 260 ( 250A) can be located between.

The image sensor 810 may be disposed or coupled to the first surface 260A (eg, upper surface) of the second circuit board 260 . 12 and 13 , the second circuit board 260 may include at least one terminal 261 electrically connected to the at least one second terminal 251 of the first circuit board 250. have. For example, the number of terminals 261 of the second circuit board 260 may be plural.

For example, at least one terminal 261 of the second circuit board 260 connects the first surface 260A and the second surface 260B of the second circuit board 260. It can be formed on the side or the outer side. The first surface 260A may be a surface facing the first circuit board 250, and the second surface 260B may be a surface opposite to the first surface 260A. For example, the terminal 261 may be recessed from the side of the second circuit board 260 . Alternatively, for example, the terminal 261 may be a semicircular or semielliptical via formed on a side surface of the second circuit board 260 . In another embodiment, at least one terminal of the second circuit board 260 electrically connected to the second terminal 251 of the first circuit board 250 is on the first surface 260A of the second circuit board 260. may be formed in

For example, the terminal 261 of the second circuit board 260 may be coupled to the terminal 251 of the first circuit board 250 by soldering or a conductive adhesive member. The first and second circuit boards 250 and 260 may be printed circuit boards or FPCBs.

The second coil 230 may be disposed on the holder 270 . The second coil 230 may be disposed on the upper surface 42A of the holder 270 . The second coil 230 may be disposed below the first magnet 130 .

The second coil 230 may be coupled to the holder 270 . For example, the second coil 230 may be coupled to the upper surface 42A of the holder 270 . For example, the second coil 230 may be coupled to the coupling protrusion 51 of the holder 270 .

For example, the second coil 230 may correspond to, face, or overlap the first magnet 130 disposed in the fixing part in the direction of the optical axis OA. In another embodiment, the fixing unit may include an OIS-only magnet separate from the magnet of the AF moving unit, and the second coil may correspond to, face, or overlap the OIS-only magnet. In this case, the number of magnets for OIS may be the same as the number of coil units included in the second coil 230 .

For example, the second coil 230 may include a plurality of coil units 230-1 to 230-4. For example, the second coil 230 may include four coil units 230 - 1 to 230 - 4 disposed at four corners of the holder 270 .

Each of the coil units 230-1 to 230-4 may have a coil block shape having a closed curve or a ring shape. For example, each coil unit may have a hollow or hole. For example, the coil units may be formed of FP (Fine Pattern) coils.

In another embodiment, the second coil 230 may be disposed on the first circuit board 250 and may be coupled with the first circuit board 250 .

The second coil 230 may be electrically connected to the first circuit board 250 . For example, the first coil unit 230-1 may be electrically connected to the two first terminals E1 and E2 of the first circuit board 250, and the second coil unit 230-2 may be connected to the first coil unit 230-2. It may be electrically connected to the other two first terminals E3 and E4 of the circuit board 250, and the third coil unit 230-3 may be electrically connected to the other two first terminals of the first circuit board 250. E5 and E6, and the fourth coil unit 230-4 can be electrically connected to the other two first terminals E7 and E8 of the first circuit board 250. .

Power or driving signals may be provided to the first to fourth coil units 230 - 1 to 230 - 4 through the first circuit board 250 . The power or driving signal provided to the second coil 230 may be a DC signal or an AC signal, or may include a DC signal and an AC signal, and may be in the form of current or voltage.

For example, current may be independently applied to at least three coil units among the four coil units 230-1 to 230-4.

The second position sensor 240 may be disposed, coupled, or mounted on the first surface 60A (eg, upper surface) of the first circuit board 250 . The second position sensor 240 may detect displacement of the OIS moving unit in a direction perpendicular to the optical axis OA, eg, shift or movement of the OIS moving unit in a direction perpendicular to the optical axis. In addition, the second position sensor 240 may detect rotation, rolling, or tilting of the OIS movable unit within a predetermined range based on the optical axis or along the optical axis. The first position sensor 170 may be substituted with an “AF position sensor” and the second position sensor 240 may be substituted with an “OIS position sensor”.

For example, the second position sensor 240 may be disposed below the second coil 230 .

For example, the second position sensor 240 may not overlap the second coil 230 in a direction perpendicular to the optical axis. For example, a sensing element of the second position sensor 240 may not overlap the second coil 230 in a direction perpendicular to the optical axis. The sensing element may be a part that senses a magnetic field.

For example, the center of the second position sensor 240 in a direction perpendicular to the optical axis may not overlap with the second coil 230 . For example, the center of the second position sensor 240 may be a spatial center in the x-axis and y-axis directions in the xy coordinate plane perpendicular to the optical axis. Alternatively, the center of the second position sensor 240 may be the spatial center in the x-axis, y-axis, and z-axis directions.

In another embodiment, at least a part of the second position sensor 240 may overlap the second coil 230 in a direction perpendicular to the optical axis.

For example, the second position sensor 240 may overlap the holes 41A to 41C of the holder 270 in the optical axis direction. Also, for example, the second position sensor 240 may overlap the hollow of the second coil 230 in the optical axis direction. Also, for example, the holes 41A to 41C of the holder 270 may at least partially overlap the hollow of the second coil 230 in the optical axis direction.

For example, the second position sensor 240 may include a first sensor 240A, a second sensor 240B, and a third sensor 240C that are spaced apart from each other.

For example, each of the first to third sensors 240A to 240C may be a hall sensor. In another embodiment, each of the first to third sensors 240A to 240C may be a driver IC including a Hall sensor and a driver. The description of the first position sensor 170 may be applied or inferred to the first to third sensors 240A to 240C.

In another embodiment, each of the first and second sensors 240A and 240B may be a Hall sensor or a driver IC including a Hall sensor, and the third sensor 240C may be the first sensor 240A and/or the third sensor 240C. It may be a sensor different from the two sensors 240C or a different type of sensor. For example, each of the first sensor 240A and the second sensor 240C may be a displacement sensor, and the third sensor 240C may be an angle sensor for detecting rotation, tilting, or rolling. For example, the third sensor 240C may be a rotation (rolling) sensor for detecting rotation, tilting, or rolling of the OIS moving unit about an optical axis. For example, the third sensor 240C may be a magnetic angle sensor. For example, the third sensor 240C may be a Tunnel Magneto Resistance (TMR) sensor. For example, the TMR sensor may be a TMR magnetic angle sensor.

In another embodiment, each of the first to third sensors 240A to 240C may be a magnetic sensor. For example, each of the first to third sensors 240A to 240C may be a Tunnel Magneto Resistance (TMR) sensor.

Each of the first to third sensors 240A, 240B, and 240C may be electrically connected to the first circuit board 250 .

For example, each of the first to third sensors 240A, 240B, and 240C may be disposed below the hollow of the corresponding coil unit 230-1 to 230-3. For example, each of the first to third sensors 240A, 240B, and 240C may be disposed in a corresponding one of holes 41A to 41C of the holder 270 .

For example, each of the first to third sensors 240A, 240B, and 240C may not overlap the corresponding coil units 230-1 to 230-3 in a direction perpendicular to the optical axis. The first to third sensors 240A, 240B, and 240C may overlap the holder 270 in a direction perpendicular to the optical axis.

By arranging the first to third sensors 240A, 240B, and 240C in a direction perpendicular to the optical axis so as not to overlap with the OIS coil 230, the output of the OIS position sensor 240 is affected by the magnetic field of the OIS coil 230. It is possible to reduce the influence of the OIS operation, thereby performing accurate OIS feedback driving and securing the reliability of OIS operation.

In the optical axis direction, the OIS position sensor 240 may face, correspond to, or overlap the first magnet 130 .

For example, at least a portion of the first sensor 240A may overlap at least one of the first magnet unit 130-1 and the yoke 410 of the first magnet 130 in the optical axis direction, and the first magnet unit ( 130-1) may output a first output signal (eg, a first output voltage) according to a result of sensing the magnetic field.

For example, at least a portion of the second sensor 240B may overlap at least one of the second magnet unit 130-2 and the yoke 410 of the first magnet 130 in the optical axis direction, and the second magnet unit ( A second output signal (eg, a second output voltage) according to a result of sensing the magnetic field of 130-2) may be output.

Also, for example, at least a part of the third sensor 240C may overlap at least one of the third magnet unit 130-3 and the yoke 410 of the first magnet 130 in the optical axis direction, and the third magnet unit A third output signal (eg, a third output voltage) according to a result of sensing the magnetic field of (130-3) may be output.

For example, in the initial position of the OIS moving unit, the center of the first sensor 240A may correspond to, face, or overlap the center of the first magnet unit 130-1 in the optical axis direction, and may overlap the center of the second sensor 240B. may correspond to, face, or overlap with the center of the second magnet unit 130-2 in the optical axis direction, and the center of the third sensor 240C may correspond to the center of the third magnet unit 130-3 in the optical axis direction. They may correspond, oppose, or overlap.

For example, the center of each of the first to third sensors 240A to 240C may be the center of the self-sensing area of each of the first to third sensors 240A to 240C. Alternatively, for example, the center of each of the first to third magnet units 130-1 to 130-4 may be the center of a boundary region between the N pole and the S pole. In another embodiment, the center of the third sensor 240C may not overlap with the center of the third magnet unit 130-3 in the optical axis direction.

The base 210 may be disposed below the first substrate portion 255 . The base 210 may have a polygonal shape that matches or corresponds to the cover member 300 or the first substrate portion 255, for example, a quadrangular shape.

For example, the base 210 may include a lower plate 21A and a side plate 21B protruding from an edge of the lower plate 21A. The lower plate 21A may correspond to or face the first region 801 of the second substrate portion 800, and the side plate 21B may extend from the lower plate 21A toward the side plate 302 of the cover member 300. It may protrude or elongate. For example, the base 210 may include an opening 210A formed in the lower plate 21B. The opening 210A of the base 210 may be a through hole penetrating the base 210 in the optical axis direction. In other embodiments, the base may not have an opening.

For example, the side plate 21B of the base 210 may be combined with the side plate 302 of the cover member 300 . When the base 210 is bonded to the side plate 302 of the cover member 300, it may include a step 211 (see FIG. 18A) to which an adhesive can be applied. At this time, the step 211 may guide the side plate 302 of the cover member 300 coupled to the upper side. The step 211 of the base 210 and the lower end of the side plate 302 of the cover member 300 may be bonded or fixed by an adhesive or the like.

The base 210 may include at least one protrusion 216A to 216D protruding from the lower plate 21A. For example, at least one of the protrusions 216A to 216D may protrude from the side plate 21B of the base 210 .

For example, the side plate 21B of the base 210 may include four side plates, and protrusions 216A to 216D may be formed on each of the four side plates. For example, the protrusions 216A to 216D may include four It may be disposed or positioned at the center of each of the side plates.

The second substrate portion 800 may be disposed below the base 210 . For example, the second substrate unit 800 may be disposed below the lower plate 21A of the base 210 . The second substrate unit 800 may be coupled to the base 210 . For example, the second substrate unit 800 may be coupled to the lower plate 21A of the base 210 . For example, the second substrate unit 800 may be coupled to the lower surface of the lower plate 21A of the base 210 .

The second substrate unit 800 may serve to provide a signal from the outside to the image sensor unit 350 or output a signal from the image sensor unit 350 to the outside.

The second substrate 800 includes a first area 801 (or a first substrate) corresponding to the AF moving unit 100 or the image sensor 810 and a second area 802 where the connector 804 is disposed. or a second substrate), and a third region 803 (or a third substrate) connecting the first region 801 and the second region 802 . The connector 804 is electrically connected to the second area 802 of the second substrate 800 and may include a port for electrical connection with an external device (eg, the optical device 200A). have. The opening 210A of the base 210 is closed or may be closed by the first region 801 of the second substrate portion 800 .

Each of the first region 801 and the second region 802 of the second substrate unit 800 may include a rigid substrate, and the third region 803 may include a flexible substrate. can do. Also, each of the first region 801 and the third region 802 may further include a flexible substrate.

In another embodiment, at least one of the first to third regions 801 to 803 of the circuit board 800 may include at least one of a rigid substrate and a flexible substrate.

The second substrate portion 800 may be disposed behind the first substrate portion 255 . For example, the first substrate unit 255 may be disposed between the AF moving unit 100 and the second substrate unit 800 .

When viewed from above, the first region 801 of the second substrate portion 800 may have a polygonal (eg, square, square, or rectangular) shape, but is not limited thereto, and in other embodiments has a shape such as a circle. It could be.

The second substrate portion 800 may include a plurality of pads 800B corresponding to the terminals 311 of the support substrate 220 . Here, the pad 800B may be expressed as a "terminal" instead.

Referring to FIG. 10A , a plurality of pads 800B may be formed in the first region 801 of the second substrate portion 800 . For example, the second substrate unit 800 includes first pads disposed or arranged spaced apart in a third direction (eg, y-axis direction) on one side of the first region 801 and on the other side of the first region 801. It may include second pads arranged or spaced apart from each other in a third direction (eg, the y-axis direction).

For example, the plurality of pads 800B may be formed on a first surface of the second substrate portion 800 (eg, the first region 801 ) facing the first substrate portion 255 .

The second substrate portion 800 may include at least one coupling hole 800C for coupling with the coupling protrusion 45B of the base 210 . The coupling hole 800C may be a through hole penetrating the second substrate 800 in the optical axis direction. In another embodiment, the coupling hole may have a groove shape.

For example, the coupling protrusion 45B may protrude from the lower surface of the base 210 and may be formed at corners of the lower surface of the base 210 facing each other diagonally. Also, coupling holes 800C may be formed at corners of the second substrate portion 800 that face diagonally. In another embodiment, the coupling hole of the second substrate portion 800 may be disposed adjacent to at least one of a side or a corner of the first region 801 .

The support substrate 310 may electrically connect the first substrate portion 255 and the second substrate portion 800 . The support substrate 310 may be expressed as a "support member", a "connection substrate", or a "connection unit".

The support substrate 310 may include or be a flexible substrate. For example, the support substrate 310 may include a Flexible Printed Circuit Board (FPCB). The supporting substrate 310 may be flexible in at least a part. The first circuit board 250 and the support substrate 310 may be connected to each other.

For example, the support substrate 310 may include a connection portion 320 connected to the first circuit board 250 . For example, the first circuit board 250 and the support substrate 310 may be integrally formed. In another embodiment, the first circuit board 250 and the support substrate 310 may not be integrated, but may be separately configured, and may be connected to each other and electrically connected by the connection unit 320 .

Also, the support substrate 310 may be electrically connected to the first circuit board 250 . The support substrate 310 may be electrically connected to the second substrate portion 800 .

The support substrate 310 may guide the movement of the OIS moving unit. The support substrate 310 may guide the OIS moving unit to move in a direction perpendicular to the optical axis direction. The support substrate 310 may guide the OIS moving unit to rotate about an optical axis. The support substrate 310 may limit movement of the OIS moving unit in the optical axis direction.

A part of the support substrate 310 may be connected to the first circuit board 250 as an OIS movable part, and another part of the support substrate 310 may be coupled to the base 210 as a fixed part. For example, the connection portion 320 of the support substrate 310 may be coupled to the first circuit board 250 . In addition, the bodies 86 and 87 of the support substrate 310 may be coupled to the protrusions of the base 210, and the terminal portions 7A, 7B, 8A, and 8B of the support substrate 310 may be connected to the second substrate portion 800. can be combined with

Referring to FIGS. 15 to 18B , the support substrate 310 may include an elastic part 310A and a circuit member 310B. The elastic part 310A is for elastically supporting the OIS moving part and may be implemented as an elastic body, for example, a spring. The elastic part 310A may include metal or be made of an elastic material.

16 shows examples of the elastic part 310A.

The elastic part 310A1 of FIG. 16 (a) may include a flat part 371A and a concave-convex part 371B. The number of flat portions 371A may be plural, and a concavo-convex portion 371B may be formed between the two flat portions. For example, the uneven portion 371B may include at least one of a first uneven portion 371B1 and a second uneven portion 371B2. For example, the first unevenness 371B1 and the second unevenness 371B2 may be formed symmetrically with each other in a vertical direction.

The elastic part 310A2 of FIG. 16(b) may include a flat part 372A and a concave-convex part 372B. The number of flat portions 372A may be plural, and a concavo-convex portion 372B may be formed between the two flat portions 372A. For example, the concave-convex portion 372B may have an oblique curve shape, a sawtooth shape, or a zigzag shape.

The elastic part 310A3 of FIG. 16(c) may include a first flat part 373A and a second flat part 373B. A length of the first flat portion 373A in the first direction (or optical axis direction) may be different from a length of the second flat portion 373B in the first direction (or optical axis direction). For example, the former may be greater than the latter. The number of first flat parts 373A may be plural, and the number of second flat parts 273B may be plural. For example, the first planar portion 273A and the second planar portion 373B may have concavo-convex shapes.

The elastic part 310A4 of FIG. 16(d) includes a first flat part 373A, a second flat part 373B, and a protruding part (or an extension part) protruding or extending from the first flat part 373A. can do.

In another embodiment, only the corner portion of the elastic part may be included in FIGS. 16(a) to 16(d).

The elastic part 310A may include at least one of the elastic parts 310A1 to 310A4 shown in FIGS. 16(a) to 16(b).

The circuit member 310B is for electrically connecting the first circuit board 250 and the second board portion 800, and may include a flexible board or at least one of a flexible board and a rigid board. For example, the circuit member 310B may be an FPCB.

The elastic part 310A may be coupled to the circuit member 310B and serve to reinforce the strength of the circuit member 310B. 15 and 17, the elastic part 310A may be disposed outside the circuit member 310B, and the outer surface of the circuit member 310B may be coupled to the inner surface of the elastic part 310A. . In another embodiment, the circuit member may be disposed outside the elastic part.

The support substrate 310 is connected to the first substrate portion 255 (eg, the first circuit board 250) and electrically connected to the first substrate portion 255 (eg, the first circuit board 250). It may include at least one connection portion (320A, 320B) to be. In addition, the supporting substrate 310 may include at least one terminal portion 7A, 7B, 8A, and 8B connected to the second substrate portion 800 and electrically connected to the second substrate portion 800, and at least one terminal portion 7A, 7B, 8A, and 8B. The terminal portions 7A, 7B, 8A, and 8B of may include a plurality of terminals 311 .

Referring to FIGS. 15 and 17 , the support substrate 310 may include a first support substrate 310-1 and a second support substrate 310-2 spaced apart from each other. The first and second support substrates 310-1 and 310-2 may be formed symmetrically. In another embodiment, the first support substrate 310-1 and the second support substrate 310-2 may be a single substrate integrally formed.

As shown in FIG. 17 , the first and second support substrates 310 - 1 and 310 - 2 may be disposed on both sides of the first circuit board 250 . For example, the first support substrate 310 - 1 may include a first body 86 and at least one terminal part 7A or 7B extending from the first body 86 . At least one of the terminal units 7A and 7B of the first support substrate 310 - 1 may include a plurality of terminals 311 .

The second support substrate 310 - 2 may include a second body 87 and at least one terminal part 8A or 8B extending from the second body 87 . At least one of the terminal units 8A and 8B of the second support substrate 310 - 2 may include a plurality of terminals 311 .

The first circuit board 250 includes a first side part 33A and a second side part 33B positioned opposite each other and a third part positioned opposite each other between the first side part 33A and the second side part 33B. It may include a side part 33C and a fourth side part 33C.

The first body 86 includes a first portion 6A corresponding to or opposite to the first side portion 33A of the first circuit board 250, a portion of the third side portion 33C of the first circuit board 250 ( or one side) and a third portion 6C corresponding to a portion (or one side) of the fourth side portion 44C of the first circuit board 250 . In addition, the first body 86 connects the first portion 6A and the second portion 6B, and includes a first bent portion 6D and a first portion 6A bent from one end of the first portion 6A. and a second bent portion 6E connecting the third portion 6C and bent from the other end of the first portion 6A.

The first support substrate 310-1 includes a first terminal portion 7A extending or protruding from the second portion 6B of the first body 86 toward the second substrate portion 800 and the first body 86. A second terminal portion 7B extending or protruding from the third portion 6C toward the second substrate portion 800 may be included. The first terminal unit 7B may be positioned on the opposite side of the first terminal unit 7A.

The first support substrate 310-1 may include a first connection portion 320A connecting the first portion 6A of the first body 86 and the first side portion 33A of the first circuit board 250. can The first connection portion 320A may include a bent portion.

The second body 87 is a first portion 9A corresponding to or opposite to the second side portion 33B of the first circuit board 250 and another portion of the third side portion 33C of the first circuit board 250. (or the other side) corresponding to the second portion 9B, and the third portion 9C corresponding to the other portion (or the other side) of the fourth side portion 44C of the first circuit board 250. . In addition, the second body 87 connects the first portion 9A and the second portion 9B, and includes a first bent portion 9D and a first portion 9A bent from one end of the first portion 9A. and a second bent portion 9E connecting the third portion 9C and bent from the other end of the first portion 9A.

The second support substrate 310-2 includes a third terminal portion 8A extending or protruding from the second portion 9B of the second body 87 toward the second substrate portion 800 and the second body 87. A fourth terminal portion 8B extending or protruding from the third portion 9C toward the second substrate portion 800 may be included. The fourth terminal unit 8B may be located on the opposite side of the third terminal unit 8A.

The second support substrate 310-2 may include a second connection portion 320B connecting the first portion 9A of the second body 87 and the second side portion 33B of the first circuit board 250. can The second connection portion 320B may include a bent portion.

In addition, the first support substrate 310-1 includes a first flexible substrate 31A electrically connecting the first substrate portion 255 (eg, the first circuit board 250) and the second substrate portion 800, and A first elastic member 30A coupled to the first flexible substrate 31A may be included.

The second supporting substrate 310-2 includes a second flexible substrate 31B electrically connecting the first substrate unit 255 (eg, the first circuit board 250) and the second substrate unit 800, and A second elastic member 30B coupled to the second flexible substrate 31B may be included.

Terminals P1 to P4 electrically connected to terminals B1 to B4 of the terminal unit 95 of the circuit board 190 of the AF moving unit 100 are included in the terminal unit (eg, 8B) of the support substrate 310. ) can be formed. The terminals B1 to B4 of the terminal unit 95 of the circuit board 190 and the terminals P1 to P4 of the terminal unit 8B of the support substrate 310 may be electrically connected by solder or conductive adhesive. That is, the circuit board 190 of the AF moving unit 100 may be electrically connected to the second substrate unit 800 through the support substrate 310 .

Referring to FIG. 17 , the circuit member 310B of the support substrate 310 includes a first insulating layer 29A, a second insulating layer 29B, and the first insulating layer 29A and the second insulating layer 29B. A conductive layer 29C formed therebetween may be included. The conductive layer 29C may be a wiring layer for transmitting electrical signals. For example, the second layer 29B may be positioned outside the first layer 29A.

Each of the first and second insulating layers 29A and 29B may be formed of an insulating material such as polyimide, and the conductive layer 29C may be formed of a conductive material such as copper, gold, or aluminum, or may be formed of copper, It may be formed of gold or an alloy containing aluminum.

The elastic part 310A may be disposed on the second layer 29B. The elastic part 310A may be formed of an alloy including at least one of copper, titanium, and nickel or at least one of copper, titanium, and nickel to serve as a spring. For example, the elastic part 310A may be formed of an alloy of copper and titanium or an alloy of copper and nickel.

The elastic part 310A may be electrically connected to the ground of the first substrate part 255 or the second substrate part 800, and the elastic part 310A may be connected to the transmission line ( or wiring) and can be used for impedance matching, and through impedance matching, the loss of the transmission signal can be reduced to reduce the effect on noise.

The support substrate 310 may further include a protective material or insulating material surrounding or covering the elastic part 310A.

For example, the thickness T11 of the conductive layer 29C between the first layer 29A and the second layer 29C may be 7 micrometers to 50 micrometers. In other embodiments, T11 may be 15 micrometers to 30 micrometers.

Also, for example, the thickness T12 of the elastic part 310A may be 20 micrometers to 150 micrometers. In other embodiments, T12 may be between 30 micrometers and 100 micrometers. For example, the thickness T11 of the elastic part 310A may be greater than the thickness T12 of the conductive layer 29C. In another embodiment, T11 may be equal to or smaller than T12.

Referring to FIGS. 14B, 15, 17, 18A, and 18B , the holder 270 includes first to fourth side portions 33A to 33D of the first circuit board 250. It may contain 4 sides. At least one connection part 320A or 320B of the support substrate 310 may be coupled to at least one of the first to fourth side parts of the holder 270 by an adhesive. For example, the first connection part 320A may be coupled to the first side of the holder 270 by adhesive, and the second connection part 320B may be coupled to the second side of the holder 270 .

Protrusions 4A to 4D may be formed on the first to fourth side portions of the holder 270 . For example, the first connection portion 320A and the first protrusion 4A formed on the first side of the holder 270 may form a first coupling area ( 38A in FIG. 18A ) coupled to each other. The second connection portion 320A and the second protrusion 4B formed on the second side of the holder 270 may form a second coupling region ( 38B in FIG. 18A ) coupled to each other.

Also, the base 210 may include first to fourth side parts corresponding to the first to fourth side parts 33A to 33D of the first circuit board 250 . For example, the side plate 21B of the base 210 may include first to fourth side parts of the base 210 . Protrusions 216A to 216D may be formed on the first to fourth side portions of the base 210 .

At least a portion of the support substrate 310 may be coupled to the base 210 . For example, the bodies 86 and 87 of the support substrate 310 may be coupled to the base 210 by an adhesive. For example, portions of the bodies 86 and 87 of the support substrate 310 connected to the terminal units 7A, 7B, 8A, and 8B may be coupled to the base 210 .

For example, the first terminal portion 7A or/and the second portion 6B of the first support substrate 310-1 is coupled to one region of the third side portion (or third protrusion portion 216C) of the base 210. The second terminal portion 7B or/and the third portion 6C of the first support substrate 310-1 may be a region of the fourth side portion (or fourth protrusion portion 216D) of the base 210. can be coupled to

For example, the third terminal portion 8A and the second portion 9B of the second support substrate 310-2 may be coupled to another area of the third side portion (or third protrusion portion 216C) of the base 210. The fourth terminal portion 8B and the third portion 9C of the second support substrate 310-2 are coupled to another area of the fourth side portion (or fourth protrusion portion 216D) of the base 210. It can be.

A third coupling region (39A in FIG. 18A) is formed between the first and third terminal portions 7A and 8A of the support substrate 310 and the third side portion (or third protrusion 216C) of the base 210. A fourth coupling region ( 39B in FIG. 18A ) may be formed between the second and fourth terminal portions 7B and 8B and the fourth side portion (or fourth protrusion 216D) of the base 210 . By the support substrate 310 and the first to fourth coupling regions 38A, 38B, 39a, and 39B, the OIS movable unit can be elastically supported with respect to the fixed unit. The terminals 311 of ) may be coupled to the terminals of the second substrate portion 800 and may be electrically connected.

For example, in another embodiment, the support member may be an elastic member that does not include a substrate, such as a spring, wire, shape memory alloy, or ball member.

The elastic member 315 may elastically support the first substrate unit 255 with respect to the base 210 . For example, one end of the elastic member 315 may be coupled to the first substrate portion 255 and the other end of the elastic member 315 may be coupled to the base 210 .

Referring to FIGS. 18A, 18B, and 19 , for example, the elastic member 315 is coupled to the first circuit board 250 of the first board unit 255, the first coupling portion 315A, and the base 210 ) and coupled to the second coupling portion 315B, and a connection portion 315C connecting the first coupling portion 315A and the second coupling portion 315B.

For example, the first coupling portion 315A may be coupled to at least a portion of the lower surface of the first circuit board 250 . Alternatively, for example, the first coupling part 315A may be coupled to at least a part of the lower surface of the holder 270 . For example, the first coupling part 315A may be coupled to at least one of the lower surface of the first circuit board 250 or the lower surface of the holder 270 by an adhesive.

For example, the second coupling portion 315B may be coupled to at least a portion of the upper surface of the base 210 . For example, at least one protrusion 210-1 may be formed on the upper surface of the base 210, and a hole coupled to the at least one protrusion 210-1 of the base 210 may be formed in the second coupling part 315B. (315-1) may be formed. The protrusion 210-1 may be formed at a corner of the upper surface of the base 210, and the hole 315-1 may be formed at a corner of the second coupling portion 315B.

For example, when looking in the first direction or looking down, each of the first coupling portion 315A and the second coupling portion 315B may have a polygonal shape, for example, a quadrangle or a closed curve shape. For example, when looking in the first direction or looking down, the shape of the first coupling part 315A may be a rectangular ring shape.

For example, when looking in the first direction or looking down, the first coupling part 315A may be disposed inside the second coupling part 315B. Each of the first coupling portion 315A and the second coupling portion 315B may have a plate shape.

The connecting portion 315C may include at least one of at least one straight portion and at least one bent portion. For example, the connection part 315C may be in the form of a wire. In another embodiment, the connecting portion 315C may be in the form of a plate.

The connection part 316C may include a plurality of connection parts or connection lines spaced apart from each other. Each of the plurality of connection parts (or connection lines) may include at least one of at least one straight part and at least one bent part. For example, the connecting portion 316C may extend in a direction perpendicular to the optical axis.

The image sensor unit 350 may include at least one of a motion sensor 820 , a controller 830 , a memory 512 , and a capacitor 514 .

The motion sensor 820 , the controller 830 , and the memory 512 may be disposed on any one of the first substrate 255 and the second substrate 800 . The capacitor 514 may be disposed on at least one of the first substrate portion 255 and the second substrate portion 800 .

For example, the motion sensor 820 and the memory 512 may be disposed on the second substrate portion 800 (eg, the first region 801). For example, the controller 830 may be disposed or mounted on the first circuit board 250 of the first board unit 255 .

In another embodiment, the control unit 830 may be disposed on the second substrate unit 800 . This is to separate the controller 830 far from the image sensor 810 since malfunction or error of the controller 830 may occur due to heat generated from the image sensor 810 .

The motion sensor 820 may be electrically connected to the controller 830 through wires or circuit patterns formed on the first substrate 255 and the second substrate 800 . The motion sensor 820 may output rotational angular velocity information due to movement of the camera device 10 . The motion sensor 820 may be implemented as a 2-axis or 3-axis gyro sensor or an angular velocity sensor. For example, the motion sensor 820 may output information about a movement amount in an X-axis direction, a movement amount in a y-axis direction, and a rotation amount due to movement of the camera device 10 .

In another embodiment, the motion sensor 820 may be omitted from the camera device 10 or may be disposed in another area of the second substrate 800 . When the motion sensor 820 is omitted from the camera module, the camera device 10 may receive positional information due to the movement of the camera device 10 from the motion sensor provided in the optical device 200A.

The memory 512 stores first data corresponding to the output of the second position sensor 240 according to the displacement (or stroke) of the OIS moving unit in a second direction perpendicular to the optical axis (eg, the X-axis direction) for OIS feedback driving. A value (or code value) can be stored.

In addition, the memory 512 corresponds to the output of the first position sensor 170 according to the displacement (or stroke) of the bobbin 110 in the first direction (eg, the optical axis direction or the Z-axis direction) for AF feedback driving. A second data value (or code value) may be stored.

For example, each of the first and second data values may be stored in the memory 512 in the form of a lookup table. Alternatively, each of the first and second data values may be stored in the memory 512 in the form of a mathematical formula or algorithm. In addition, the memory 512 may store algorithms or programs during mathematics for the operation of the control unit 830 . For example, the memory 512 may be a non-volatile memory, such as Electrically Erasable Programmable Read-Only Memory (EEPROM).

The controller 830 may be electrically connected to the first position sensor 170 and the second position sensor 240 .

The controller 830 may control the driving signal provided to the second coil 230 using the output signal provided from the second position sensor 240 and the first data value stored in the memory 512, and feedback OIS. action can be performed.

In addition, the control unit 830 may control the driving signal provided to the first coil 120 by using the output signal of the first position sensor 170 and the second data value stored in the memory 512, thereby providing feedback. An auto focusing operation may be performed.

The control unit 830 may be implemented in the form of a driver IC, but is not limited thereto. For example, the control unit 830 may be electrically connected to terminals 251 of the first circuit board 250 of the first board unit 255 .

The image sensor unit 350 may further include a filter 610 . In addition, the image sensor unit 350 may further include a filter holder 600 for arranging, seating or accommodating the filter 610 . The filter holder 600 may alternatively be referred to as a "sensor base".

The filter 610 may block or pass light of a specific frequency band from light passing through the lens barrel 400 to the image sensor 810 .

For example, the filter 610 may be an infrared cut filter. For example, the filter 610 may be disposed parallel to an x-y plane perpendicular to the optical axis OA. Filter 610 may be disposed below lens module 400 .

The filter holder 600 may be disposed under the AF moving unit 100 . For example, the filter holder 600 may be disposed on the first substrate portion 255 . For example, the filter holder 600 may be disposed on the first surface 260A of the second circuit board 260 of the first substrate portion 255 .

The filter holder 600 may be coupled to a region of the second circuit board 260 around the image sensor 810 by an adhesive and may be exposed through the opening 250A of the first circuit board 250. . For example, the filter holder 600 may be seen through the opening 250A of the first circuit board 250 of the first board portion 255 . For example, the opening 250A of the first circuit board 250 may expose the filter holder 600 disposed on the second circuit board 260 and the filter 610 disposed on the filter holder 600 . In another embodiment, the filter holder may be coupled to the holder 270 or to the AF moving unit 100 .

In the filter holder 600 , an opening 61A may be formed at a portion where the filter 610 is mounted or disposed so that light passing through the filter 610 may be incident to the image sensor 810 . The opening 61A of the filter holder 600 may be in the form of a through hole penetrating the filter holder 600 in the optical axis direction. For example, the opening 61A of the filter holder 600 may pass through the center of the filter holder 600 and may be disposed to correspond to or face the image sensor 810 .

The filter holder 600 may include a seating portion 500 that is recessed from the upper surface and on which the filter 610 is seated, and the filter 610 may be placed, seated, or mounted on the seating portion 500 . The seating portion 500 may be formed to surround the opening 61A. In another embodiment, the seating portion of the filter holder may be in the form of a protruding portion protruding from the upper surface of the filter.

The image sensor unit 350 may further include an adhesive disposed between the filter 610 and the mounting unit 500, and the filter 610 may be coupled or attached to the filter holder 600 by the adhesive.

The cover member 300 may have a box shape with an open bottom and a top plate 301 and side plates 302, and the lower part of the side plate 302 of the cover member 300 is coupled to the base 210. can The top plate 301 of the cover member 300 may have a polygonal shape, for example, a quadrangle or an octagon. The cover member 300 may have an opening 303 in the upper plate 301 for exposing the lens of the lens module 400 coupled to the bobbin 110 to external light.

Referring to FIGS. 1 and 3 , a groove portion ( 304) may be formed.

The cover member 300 may include a protrusion 305 extending from the top plate 301 toward the groove 119 of the bobbin 110 . The protrusion 305 may alternatively be expressed as an “extension”. For example, the cover member 300 may include at least one protrusion 305 extending from an area adjacent to the hollow 303 formed in the top plate 301 toward the upper surface of the bobbin 110 . The protrusion 305 may be integrally formed with the top plate 301 and the side plate 302, and may be formed of the same material.

For example, the cover member 300 may include four protrusions corresponding to the four corners of the top plate 301 . In another embodiment, the number of protrusions 305 may be one or two or more.

For example, the protrusion 305 may have a polygonal shape, for example, a rectangular plate shape. For example, at least a portion of the protruding portion 305 may include a curved portion.

At least a portion of the protrusion 305 of the cover member 300 may be disposed or inserted into the groove 119 of the bobbin 110 . For example, one end or end of protrusion 305 may be disposed within groove 119 of bobbin 110 . For example, at the initial position of the bobbin 110, the projection 305 and the bottom surface of the groove 119 of the bobbin 110 may be spaced apart from each other.

As the bobbin 110 is moved in the optical axis direction by the AF drive, the protruding part 305 of the cover member 300 may come into contact with the bottom surface of the groove 119 of the bobbin 110, and thereby the protruding part 305 may serve as a stopper to limit the upward movement of the bobbin 110 within a predetermined range. In addition, since at least a portion of the protrusion 305 is disposed in the groove 119 of the bobbin 110, it is possible to suppress or prevent the bobbin 110 from rotating beyond a certain range around the optical axis due to impact.

For example, the cover member 300 may be formed of an injection-molded material, for example, plastic or resin material. Also, the cover member 300 may be made of an insulating material or a material that blocks electromagnetic waves.

The cover member 300 and the base 210 can accommodate the AF moving unit 100 and the image sensor unit 350 and protect the AF moving unit 100 and the image sensor unit 350 from external impact. It can prevent the inflow of foreign substances from the outside.

The OIS moving unit may move in a direction perpendicular to the optical axis OA based on the fixing unit. The OIS moving unit is placed at a position spaced apart from the fixed unit by a predetermined interval. That is, the OIS movable part may be suspended (flyed) from the fixed part by the support substrate 310, and the OIS movable part may be in a first electromagnetic force generated by the first magnet 130 and the second coil 230. It can move relative to the fixed part by the electromagnetic force generated by

For example, in the initial position of the OIS moving unit, the outer surface of the holder 270 may be spaced apart from the inner surface of the base 210 by a predetermined distance. Also, for example, in the initial position of the OIS moving unit, the lower surface of the holder 270 and the first substrate unit 255 may be spaced apart from the base 210 by a predetermined distance.

The initial position of the OIS movable part is the initial position of the OIS movable part in a state in which power is not applied to the second coil 230, or a position where the OIS movable part is placed as it is elastically deformed by the support substrate only by the weight of the OIS movable part. have.

In addition, the initial position of the OIS moving unit may be a position where the OIS moving unit is placed when gravity acts in the direction from the first substrate unit 255 to the second substrate unit 800 or when gravity acts in the opposite direction.

For example, the first to fourth coil units 230-1 to 230-4 of the second coil 230 may be controlled by four channels, and in this case, the four coil units 230-1 to 230-4 230-4) may be electrically separated from each other and controlled. For example, either forward current or reverse current may be selectively applied to each of the coil units 230-1 to 230-4. At this time, a total of 8 lead wires of 4 pairs may come out from the second coil 230 .

In another embodiment, the first to fourth coil units 230-1 to 230-4 of the second coil 230 may be controlled by three channels for OIS driving. For example, only the first to third coil units 230-1 to 230-4 may be electrically separated, and the fourth coil unit 230-4 may be electrically separated from any one of the first to third coil units. can be connected in series. At this time, a total of 6 lead wires of 3 pairs may come out from the second coil 230 .

For example, the second coil unit 230-2 and the fourth coil unit 230-4 may be connected in series. The magnetization direction of the second magnet unit 130-2 corresponding to or opposite to the second coil unit 230-2 and the fourth magnet unit 120-4 corresponding to or opposite to the fourth coil unit 230-4 The magnetization directions of may be in the same direction as each other. For example, the magnetization direction of the first magnet unit 130-1 and the magnetization direction of the third magnet unit 130-2 may be the same. Also, for example, the magnetization direction of the second magnet unit 130-2 may be different from that of the first magnet unit 130-1. For example, the magnetization direction of the second magnet unit 130-2 may be perpendicular to the magnetization direction of the first magnet unit 130-1.

The controller 830 may supply at least one driving signal to at least one of the first to fourth coil units 230-1 to 230-4, and controls the at least one driving signal to move the OIS moving unit in the X-axis direction. Alternatively, the OIS moving unit may be moved in the Y-axis direction, or the OIS moving unit may be rotated within a predetermined angular range around the optical axis.

20A is a perspective view of a first coil 120, a first magnet 130, a second coil 230, a yoke 410, and first and second substrate parts 255 and 800, and FIG. 20B is a camera An enlarged view of a portion of the device 10, FIG. 20C shows the distance D11 between the first magnet 130 and the second coil 230, and the distance between the first magnet 130 and the yoke 410 ( D13) and a distance D14 between the second coil 230 and the yoke 410.

Referring to FIGS. 10A, 10B, and 20A to 20C , the first magnet 130 may be disposed above the first substrate 255 (eg, the first circuit board 250). The first magnet 130 may affect most of the electromagnetic force for AF driving and the electromagnetic force for OIS driving.

In an embodiment, the electromagnetic force for moving the OIS moving unit may be electromagnetic force due to interaction between the second coil 230 and the first magnet 130 disposed on the second coil 230 .

The embodiment may include a yoke 410 for increasing electromagnetic force due to an interaction between the first magnet 130 and the second coil 230 .

The yoke 410 may be disposed on the second substrate portion 800 . The yoke 410 may be disposed on the upper surface of the first region 801 of the second substrate portion 800 . For example, the yoke 410 may be disposed between the second substrate 800 and the second coil 230 . For example, the yoke 410 may be disposed between the second substrate 800 and the first circuit board 250 of the first substrate 255 . In another embodiment, the yoke may be disposed below the second substrate portion 800 . For example, in another embodiment, the yoke may be disposed on the lower surface of the first region 801 .

For example, the yoke 410 may be formed of a metal material or a magnetic material.

For example, the yoke 410 may include a SUS (Steel Use Stainless) material. For example, the yoke 410 may include iron (Fe). For example, the yoke 410 may be a magnetic material.

For example, the yoke 410 may face or overlap the first magnet 130 in a first direction (or optical axis direction). For example, the yoke 410 may have a plate shape, may be hollow, and may be a single object. In another embodiment, the yoke 410 may include a plurality of yokes corresponding to the magnet units 130-1 to 130-4 of the first magnet 130.

For example, the yoke 410 may be disposed at an edge of the upper surface of the first region 801 of the second substrate portion 800 . For example, the yoke 410 may be disposed at an edge of the upper surface of the first region 801 of the second substrate portion 800 to have a predetermined width.

For example, the yoke 410 may contact the upper surface of the second substrate unit 800 .

The yoke 410 may serve to increase electromagnetic force between the second coil 230 and the first magnet 130 . Also, the yoke 410 may perform a heat dissipation function of dissipating heat from the second substrate portion 800 . For example, the yoke 410 may suppress an increase in temperature of the image sensor 810 by dissipating heat generated from the image sensor 810 .

21A shows an embodiment of the first magnet 130, the first coil 120, the second coil 230, and the yoke 410. In FIG. 21A, one magnet unit of the first magnet 130 and one coil unit of the second coil 230 are described, and the description of FIG. 21A describes the remaining magnet units of the first magnet 130, and The same may be applied or inferred to the remaining coil units of the second coil 230 .

Referring to FIG. 21A , the first magnet 130 includes a first magnet part 71A, a second magnet part 71B, and a barrier rib disposed between the first magnet part 71A and the second magnet part 71B. (71C). For example, the first magnet part 71A and the second magnet part 71B may be spaced apart from each other in a first direction (or optical axis direction).

The first magnet part 71A may include a first N pole and a first S pole. A first interface may be formed between the first N pole and the first S pole. The second magnet part 71B may include a second N pole and a second S pole. A second interface may be formed between the second N pole and the second S pole. For example, the first N pole and the first S pole may face each other in a direction perpendicular to the first direction, and the second N pole and the second S pole may face each other in a direction perpendicular to the first direction.

Each of the first boundary surface and the second boundary surface may include a section having almost no polarity as a portion having substantially no magnetism, and may be a naturally occurring portion to form a magnet consisting of one N pole and one S pole. can For example, in the first direction (or optical axis direction), the first N-pole may face or overlap the second S-pole, and the first S-pole may face or overlap the second N-pole.

The barrier rib 71C separates or isolates the first magnet portion 71A and the second magnet portion 71B, and may be a portion having substantially no polarity as a portion having substantially no magnetism. For example, the barrier rib 71C may be a non-magnetic material or air. The barrier rib 71C may be expressed as a “neutral zone” or a “neutral area”. For example, the width of the barrier rib 71C may be greater than that of the first boundary surface (or the second boundary surface). The width of the barrier rib 71C may be the length of the barrier rib in the first direction (or the optical axis direction), and the width of the first boundary surface (or the second boundary surface) may be between the first N pole (or the second N pole) and the first S pole. It may be the length of the first interface between the poles (or the second S pole). Since the first magnet 130 is positively magnetized, in an embodiment, AF electromagnetic force and OIS electromagnetic force can be improved.

At the initial position of the AF moving unit, the first coil 120 may face or overlap the first magnet unit 71A in a direction perpendicular to the first direction (or optical axis direction). In FIG. 21A , the first S pole of the first magnet part 71A is arranged to face the first coil 120, or the first S pole of the first magnet part 71A is disposed higher than the first N pole of the first coil ( 120), but may be placed opposite to this in other embodiments.

For example, at least a portion of the first magnet 130 may overlap at least a portion of the second coil 230 in the first direction (or optical axis direction) from the initial position of the OIS moving unit. For example, at least a portion of the first magnet 130 may overlap at least a portion of the yoke 410 in the first direction (or optical axis direction) from the initial position of the OIS moving unit. In the first direction (or optical axis direction), the first magnet 130 and the yoke 410 may face each other.

When viewed from the first direction or from above, the length L1 of the short side of the first magnet portion 71A of the first magnet 130 and the length L2 of the short side of the second magnet portion 71B may be equal to each other. can When L1 and L2 are the same, the length of the short side of the first magnet 130 is referred to as L1.

A short side length L1 of the first magnet 130 may be smaller than a short side length L2 of the second coil 230 . In another embodiment, the length L1 of the short side of the first magnet 130 may be greater than or equal to the length L3 of the short side of the second coil 230 .

For example, when viewed from the first direction or from above, the length L5 of the yoke 410 in the longitudinal direction of the short side of the first magnet 130 may be greater than L1, L3, and L4. In another embodiment, L5 may be smaller than at least one of L1, L3, and L4 or equal to at least one of L1, L3, and L4.

For example, when viewed from the first direction or from above, the length L6 of the first coil 120 in the longitudinal direction of the short side of the first magnet 130 is greater than the length L1 of the short side of the first magnet 130. can be small

For example, the length M1 of the first magnet part 71A in the first direction (or the optical axis direction) may be greater than the length M2 of the second magnet part 71B in the first direction (or the optical axis direction) ( M1>M2).

For example, the length d1 of the barrier rib 71C in the first direction (or the optical axis direction) may be smaller than M1 and M2.

For example, the length d1 of the first coil 120 in the first direction (or the optical axis direction) may be smaller than the length M1 of the first magnet part 71A in the first direction (or the optical axis direction).

In a stroke section in which the bobbin 110 moves in the optical axis direction, the first coil 120 may at least partially overlap the first magnet 130 in a direction perpendicular to the optical axis direction.

For example, in a stroke section in which the bobbin 110 moves in the optical axis direction, at least a part or all of the first coil 120 may overlap the first magnet part 71A in a direction perpendicular to the optical axis direction. For example, at least a part or all of the first coil 120 may overlap the first magnet part 71A in a direction perpendicular to the optical axis direction at the maximum stroke position in the upward direction of the bobbin 110 . Also, for example, at least a part or all of the first coil 120 may overlap the first magnet part 71A in a direction perpendicular to the optical axis direction at the maximum stroke position in the downward direction of the bobbin 110 . Accordingly, the linearity of the mutual relationship between the displacement (or stroke) of the bobbin 110 and the output of the first position sensor 170 may be maintained or improved.

A length M3 of the second coil 230 in the first direction (or optical axis direction) may be smaller than a length M2 of the second magnet part 71B in the first direction (or optical axis direction). In another embodiment, M3 may be equal to or greater than M2.

Most of the electromagnetic force for AF driving may be generated by electromagnetic force due to interaction between the first coil 120 and the first magnet 130 .

The electromagnetic force for driving the OIS may be generated by electromagnetic force due to interaction between the second coil 230 and the first magnet 130, and the yoke 410 disposed below the second coil 230 may generate the electromagnetic force. The electromagnetic force may increase, and in an embodiment, the electromagnetic force for driving the OIS may be improved.

As the distance D11 in the optical axis direction between the first magnet 130 and the second coil decreases, the electromagnetic force between the first magnet 130 and the second coil 230 may increase. In addition, the smaller the distance D13 between the first magnet 130 and the yoke 410 is, the greater the effect of improving the electromagnetic force can be. However, a space for disposing at least one of the second coil 230, the second position sensor 240, and the first substrate unit 255 must be secured between the first magnet 130 and the yoke 410. Therefore, D13 may be greater than D11.

For example, D11 may be 0.05 [mm] to 0.2 [mm]. Or, for example, D11 may be 0.05 [mm] to 0.15 [mm]. Alternatively, for example, D11 may be 0.09 [mm] to 0.12 [mm].

When D11 is less than 0.05 [mm], the margin for avoiding spatial interference between the first magnet 130 and the second coil 230 is too small, so even with a small impact, the space between the first magnet 130 and the second coil 230 Interference may occur and it may be difficult to perform normal OIS driving. Also, when D11 is greater than 0.2 [mm], the electromagnetic force between the first magnet 130 and the second coil 230 may be reduced, and the size of the camera module in the optical axis direction may be increased.

For example, the separation distance D13 between the first magnet 130 and the yoke 410 in the optical axis direction may be greater than D11 (D13>D11). Also, for example, the separation distance D14 between the second coil 230 and the yoke 410 in the optical axis direction may be greater than D11 (D14>D11). Also, for example, D13 may be greater than D14 (D13 > D14).

For example, D13 may be 1.5 [mm] to 2.5 [mm]. Or, for example, D13 may be 1.6 [mm] to 2 [mm]. Or, for example, D13 may be 1.5 [mm] to 1.8 [mm].

Or, for example, D14 may be 1.2 [mm] to 2 [mm]. Or, for example, D14 may be 1.2 [mm] to 1.55 [mm]. Or, for example, D14 may be 1.3 [mm] to 1.5 [mm].

A value obtained by dividing D13 by D11 (D13/D11) may be 7.5 to 50. Alternatively, for example, the divided value (D13/D11) may be 15 to 25. In another embodiment, the divided value (D13/D11) may be 17 to 22.

When the divided value (D13/D11) is less than 7.5, D13 is too small to secure enough space for disposing the second coil 230, the second position sensor 240, and the first substrate 255. . In addition, when the divided value (D13/D11) exceeds 50, D13 is too large, and the effect of increasing the electromagnetic force of the yoke 410 is insignificant, so that the effect of improving the OIS driving force cannot be obtained, and the size of the camera module in the optical axis direction can be increased. have.

In addition, when the divided value (D13/D11) is 15 to 25, a sufficient space for disposing the second position sensor 240 and the first substrate 255 can be secured and the OIS driving force can be improved.

Also, for example, a value (D14/D11) obtained by dividing D14 by D11 may be 6 to 40. Alternatively, for example, the divided value D14/D11 may be 10 to 20. Alternatively, for example, the divided value (D14/D11) may be 14 to 18.

When the divided value (D14/D11) is less than 6, D14 is too small to secure a sufficient space for disposing the second coil 230, the second position sensor 240, and the first substrate part 255. . In addition, when the divided value (D14/D11) is greater than 40, D14 is too large, and the effect of increasing the electromagnetic force of the yoke 410 is insignificant, so that the effect of improving the OIS driving force cannot be obtained, and the size of the camera module in the optical axis direction can be increased. have.

In addition, when the divided value (D14/D11) is 14 to 18, a sufficient space for disposing the second position sensor 240 and the first substrate 255 can be secured and the OIS driving force can be improved.

Descriptions of D11, D12, D13, D14 and the divided values (D13/D11 or D14/D11) apply to or apply to FIGS. 21B to 21E, 22A to 22C, and 23A to 23C to be described later. It can be. In addition, the description of the divided values (D13/D11 and D14/D11) described in FIG. 21A may be applied to FIG. 24 or may be applied mutatis mutandis.

21B shows another embodiment 130A of the first magnet 130. In FIG. 21B, the same reference numerals as those in FIG. 21A denote the same configurations, and descriptions of the same configurations are omitted.

Referring to FIG. 21B, in the first magnet 130A of FIG. 21B, the partition 71C is omitted from the first magnet 130 of FIG. 21A, and the first magnet part 71A and the second magnet part 71B are mutually connected. It may be in a spaced form. For example, a part of the housing 140 may be interposed, disposed, or inserted between the first magnet part 71A and the second magnet part 71B. That is, the first magnet part 71A and the second magnet part 71B may be separated from each other by a part of the housing 140 . In this case, a neutral zone may be formed between the first magnet part 71A and the second magnet part 71B. In another embodiment, a neutral zone may not be formed between the first magnet part 71A and the second magnet part 71B.

21C shows another embodiment 130B of the first magnet 130.

Referring to FIG. 21C, in the first magnet 130B of FIG. 21C, the partition 71C is omitted from the first magnet 130 of FIG. 21A, and the first magnet part 71A and the second magnet part 71B are provided. It may have a form in contact with each other.

For example, the first N pole of the first magnet part 71A may contact the second S pole of the second magnet part 71B, and the first S pole of the first magnet part 71A may contact the second magnet part. It can contact the second N pole of 71B.

21D shows another embodiment 130C of the first magnet 130.

Referring to FIG. 21D , the first magnet 130 may be a unipolar magnetized magnet having one N pole and one S pole.

For example, the length M7 of the first magnet 130 in the first direction (or the optical axis direction) may be the sum of M1 and M2 of FIG. 21A. Alternatively, for example, M7 may be the sum of M1, M2, and d1 of FIG. 21A.

21E is a modified example of FIG. 21B.

Referring to FIG. 21E , a yoke 420A may be disposed between the first magnet part 71A and the second magnet part 71B. The yoke 420A may correspond to, face, or overlap each of the first magnet part 71A and the second magnet part 71B in a first direction (or optical axis direction).

The yoke 420A can improve the electromagnetic force due to the interaction between the first magnet part 71A and the first coil 120, thereby improving the electromagnetic force for AF driving. In addition, the yoke 420A can improve the electromagnetic force due to the interaction between the second magnet part 71B and the second coil 230, thereby improving the electromagnetic force for driving the OIS.

22A shows another embodiment 130D of the first magnet 130. The embodiment of FIG. 22A shows a modified example of the first magnet in FIG. 21B. In another embodiment, the first magnet 130D shown in FIG. 22A may be applied or inferred to all of FIGS. 21A and 21C to 21E.

Referring to FIG. 22A , the length L11 of the short side of the first magnet part 71A1 may be greater than the length L2 of the short side of the second magnet part 71B1 (L11>L2). This is to improve the AF electromagnetic force due to interaction with the first coil 120 by increasing the size of the first magnet part 71A1. In another embodiment, in order to improve the OIS electromagnetic force, the length of the short side of the second magnet part may be greater than the length of the short side of the first magnet part.

For example, the length L11 of the short side of the first magnet part 71A1 may be greater than at least one of L3, L4, and L5.

21A to 22A may be cross-sectional views in a direction parallel to the short side of the first magnet 130 .

22B shows an example of lengths of long sides of the first magnet 130, the first coil 120, the second coil 230, and the yoke 410, respectively.

Referring to FIG. 22B, when viewed from the first direction or above, the length K1 of the long side of the first magnet portion 71A of the first magnet 130 and the length of the long side of the second magnet portion 71B ( K2) may be different from each other. For example, the length K1 of the long side of the first magnet portion 71A of the first magnet 130 may be greater than the length K2 of the long side of the second magnet portion 71B. By making K1 greater than K2, the electromagnetic force due to the interaction between the first coil 120 and the first magnet part 71A can be improved, and thereby the AF driving force can be improved.

The length K2 of the long side of the second magnet part 71B may be different from the length K3 of the long side of the second coil 230 . For example, the length K2 of the long side of the second magnet part 71B may be greater than the length K3 of the long side of the second coil 230 . In another embodiment, the length of the long side of the second magnet part 71B may be equal to or smaller than the length of the long side of the second coil 230 .

For example, one end of each of the first magnet part 71A or the second magnet part 71B may be located inside the second coil 230, and the first magnet part 71A or the second magnet part 71B Each other end may be located outside the second coil 230 . In another embodiment, one end and the other end of each of the first magnet part 71A or the second magnet part 71B may be positioned outside the second coil 230 .

Each of the first magnet part 71A or the second magnet part 71B may include a first part overlapping the second coil 230 in the first direction or the optical axis direction. Also, each of the first magnet part 71A or the second magnet part 71B may include a second part that does not overlap with the second coil 230 in the first direction or the optical axis direction.

When viewed from the first direction or from above, the length of the long side of the first magnet 130 may be different from the length K5 of the yoke 410 in the longitudinal direction of the long side of the first magnet 130 .

For example, the length K5 of the yoke in the longitudinal direction of the long side of the first magnet 130 may be greater than the length K2 of the long side of the second magnet portion 71B of the first magnet 130 (K5>K2 ). In another embodiment, the length of the yoke 410 in the longitudinal direction of the long side of the first magnet 130 may be equal to or smaller than the length of the long side of the second magnet part 71B.

Alternatively, for example, the length K5 of the yoke in the longitudinal direction of the long side of the first magnet 130 may be smaller than the length K1 of the long side of the first magnet portion 71A of the first magnet 130 (K5< K1). In another embodiment, the length of the yoke 410 in the longitudinal direction of the long side of the first magnet 130 may be equal to or greater than K1.

In addition, when viewed from the first direction or from above, the length K5 of the yoke 410 in the longitudinal direction of the long side of the first magnet 130 may be different from the length K3 of the long side of the second coil 230. . For example, when viewed from the first direction or from above, the length K5 of the yoke 410 in the longitudinal direction of the long side of the first magnet 130 may be greater than the length K3 of the long side of the second coil 230. have. In another embodiment, the length of the yoke 410 in the longitudinal direction of the long side of the first magnet 130 may be equal to or smaller than the length of the long side of the second coil 230 .

For example, when viewed in the first direction or from above, one end and the other end of the second magnet portion 71B of the first magnet 130 positioned opposite to each other in the longitudinal direction of the long side of the first magnet 130 are yokes 410 may be located on the inside of In another embodiment, at least one of one end and the other end of the second magnet part 71B of the first magnet 130 positioned opposite to each other in the longitudinal direction of the long side of the first magnet 130 when viewed in the first direction or from above. may be disposed on the outside of the yoke 410.

Alternatively, for example, when viewed in the first direction or from above, one end of the first magnet portion 71A of the first magnet 130 positioned opposite to each other in the longitudinal direction of the long side of the first magnet 130 is of the yoke 410. Located inside, the other end of the first magnet part 71A may be located outside the yoke 410 . In another embodiment, when viewed in the first direction or from above, one end and the other end of the first magnet portion 71A of the first magnet 130 positioned opposite to each other in the longitudinal direction of the long side of the first magnet 130 are yokes ( 410) may be located inside or outside.

For example, when viewed in a first direction or from above, the yoke 410 may include a first portion overlapping the first magnet 130 . Also, when viewed in the first direction or from above, the yoke 410 may include a second portion that does not overlap with the first magnet 130 .

For example, when viewed in a first direction or from above, the yoke 410 may include a first portion overlapping the second coil 230 . Also, when viewed in the first direction or from above, the yoke 410 may include a second portion that does not overlap with the second coil 230 .

FIG. 22C shows another embodiment of the length of the long side of the second magnet part 71B of FIG. 22B.

Referring to FIG. 22C , the length K21 of the long side of the second magnet part 71B may be smaller than the length K3 of the long side of the second coil 230 . For example, when viewed from the first direction or from above, one end and the other end of the second magnet part 71B may be located inside the second coil 230 .

In another embodiment, the length of the long side of the first magnet part 71A may be shorter than the length of the long side of the second coil 230 . Also, when viewed from the first direction or from above, one end and the other end of the first magnet part 71A may be located inside the second coil 230 .

22A and 22B may be cross-sectional views in a direction parallel to the long side of the first magnet 130 . Descriptions of FIGS. 22B and 22C may be applied or inferred to all of FIGS. 21A to 21E and 22A.

The camera device 10 may further include a yoke disposed on the first magnet 130 separately from the yoke 410 to increase or improve the electromagnetic force for AF driving and the electromagnetic force for OIS driving.

23A shows another embodiment of FIG. 21E.

Referring to FIG. 23A , the camera device 10 may include a yoke 420B disposed on at least one side surface of the second magnet unit 71B.

For example, the yoke 420B may be disposed on at least one of a long side surface and a short side surface of the second magnet unit 71B. For example, the yoke 420B may contact at least one of a long side surface and a short side surface of the second magnet unit 71B.

The yoke 420B may be in contact with the yoke 420A described in FIG. 21E. In another embodiment, the yoke 420B may be spaced apart from the yoke 420A described in FIG. 21E.

For example, the yoke 420B may be disposed on the long side of the second magnet part 71B. For example, the yoke 420B may be disposed on a second long side surface among the first long side surface and the second long side surface. In this case, the first long side surface may be closer to the first coil 120 than the second long side surface, and the first long side surface and the second long side surface may be positioned opposite each other.

At the initial position of the bobbin 110, the yoke 420B may not overlap the first coil 120 in a direction perpendicular to the optical axis direction. Alternatively, for example, at least a portion of the yoke 420B may overlap the first coil 120 in a direction perpendicular to the optical axis direction by the movement of the bobbin 110 .

At least one of the electromagnetic force due to the interaction between the first magnet 130 and the first coil 120 and the electromagnetic force due to the interaction between the first magnet 130 and the second coil 230 are increased by the yoke 420B. or can be improved.

The yoke 420B of FIG. 23A may be applied or inferred to all of the embodiments of FIGS. 21A to 21D and 22A to 22C.

Figure 23b shows another embodiment of Figure 21c.

Referring to FIG. 23B , the camera device 10 may include a yoke 420C disposed on an upper surface of the first magnet unit 71A. For example, the yoke 420C may be disposed on the upper surfaces of the N pole and the S pole of the first magnet part 71A. For example, the yoke 420C may contact the upper surface of the first magnet part 71A.

At least a portion of the yoke 420C may correspond to, face, or overlap the first magnet 130 and the second coil 230 in the optical axis direction.

At least one of the electromagnetic force due to the interaction between the first magnet 130 and the first coil and the electromagnetic force due to the interaction between the first magnet 130 and the second coil 230 is increased or improved by the yoke 420C. can

23c shows another embodiment of FIG. 23b.

Referring to FIG. 23C , the camera device 10 may include a yoke 420B1 disposed on a side surface of at least one of the first magnet unit 71A and the second magnet unit 71B.

At least a portion of the yoke 420B1 may correspond to, face, or overlap the first coil 120 in a direction perpendicular to the optical axis direction.

For example, the yoke 420B1 may be disposed on the side of the N pole or S pole of the first magnet unit 71A. Also, the yoke 420B1 may be disposed on the side of the N pole or S pole of the second magnet unit 72A.

For example, the yoke 420B1 may be disposed on at least one of a long side surface and a short side surface of the first magnet unit 71A, and may come into contact with at least one of the long side surface and the short side surface of the first magnet unit 71A. . Also, for example, the yoke 420B1 may be disposed on at least one of a long side surface and a short side surface of the second magnet unit 71B, and may come into contact with at least one of the long side surface and the short side surface of the second magnet unit 71B. have.

For example, the yoke 420B1 may be disposed on the long side surface of the first magnet part 71A and the long side surface of the second magnet part 71B. For example, the yoke 420B1 may be disposed on the second long side of the first long side and the second long side of the first magnet unit 71A, and may be disposed on the third long side and the fourth long side of the second magnet unit 71B. It may be disposed on the fourth long side of the long side. In this case, the first long side surface may be closer to the first coil 120 than the second long side surface, and the first long side surface and the second long side surface may be positioned opposite each other. Also, the third long side surface may be closer to the first coil 120 than the fourth long side surface, and the third long side surface and the fourth long side surface may be positioned opposite each other.

At least one of the electromagnetic force due to the interaction between the first magnet 130 and the first coil and the electromagnetic force due to the interaction between the first magnet 130 and the second coil 230 is increased or improved by the yoke 420B1. can

The yoke 420B1 may be in contact with the yoke 420A described in FIG. 23B. In another embodiment, the yoke 420B1 may be spaced apart from the yoke 420A described in FIG. 23B.

The yokes 420C and 420B1 of FIGS. 23B and 23C may be applied or inferred to the embodiments of FIGS. 21A to 21E, 22A to 22C, and 23A.

The camera device according to another embodiment may further include a second magnet disposed on the yoke 410 and corresponding to, facing, or overlapping the second coil 230 .

24 shows the arrangement of the third magnet 72 according to the embodiment.

Referring to FIG. 24 , the camera device 10 may further include a third magnet 72 disposed between the first magnet 130 and the second coil 230 to increase OIS driving force.

The third magnet 72 may be disposed on the fixing part. For example, the third magnet 72 may be disposed in the housing 140 and may be disposed below the first magnet 130 . For example, the third magnet 72 may be spaced apart from the first magnet.

In another embodiment, the third magnet 72 may contact the first magnet 130 . For example, the upper surface of the third magnet 72 may contact the lower surface of the first magnet 130 .

The third magnet 72 may include magnet units corresponding to the magnet units 130 - 1 to 130 - 4 of the first magnet 130 . Each of the magnet units of the third magnet 72 corresponds to, faces, or corresponds to any one of the magnet units 130-1 to 130-4 of the first magnet 130 in the first direction (or optical axis direction). may overlap.

For example, the third magnet 72 may be a unipolar magnetized magnet including one N pole and one S pole. In another embodiment, the third magnet 72 may be a positively magnetized magnet including two N poles and two S poles.

The N pole of the third magnet 72 may face the S pole of the first magnet 130 (eg, the second magnet part 71B) in the first direction (or the optical axis direction), and the third magnet 72 The S pole of ) may face the N pole of the first magnet 130 (eg, the second magnet part 71B).

When viewed in the first direction or from above, the length L7 of the short side of the third magnet 72 may be smaller than the length L3 of the short side of the second coil 230 . In another embodiment, the length L7 of the short side of the third magnet 72 may be greater than or equal to the length L3 of the short side of the second coil 230 .

When viewed from the first direction or from above, the length L7 of the short side of the third magnet 72 may be smaller than the length L1 of the short side of the first magnet 130 . In another embodiment, the length L7 of the short side of the third magnet 72 may be greater than or equal to the length L1 of the short side of the first magnet 130 .

For example, the length L7 of the short side of the third magnet 72 may be smaller than or equal to the length L1 of the short side of the first magnet 130 . In another embodiment, the length L7 of the short side of the third magnet 72 may be greater than the length of the short side of the first magnet 130 .

Also, the length M8 of the third magnet 72 in the first direction (or the optical axis direction) may be smaller than or equal to the length of the first magnet portion 71B of the first magnet 130 in the first direction. In another embodiment, the length M8 of the third magnet 72 in the first direction (or the optical axis direction) may be greater than the length of the first magnet portion 71B of the first magnet 130 in the first direction.

When viewed from the first direction or from above, the length of the long side of the third magnet 72 may be greater than or equal to the length of the long side of the second magnet portion 71B of the first magnet 130 . In another embodiment, the length of the long side of the third magnet 72 may be shorter than the length of the long side of the second magnet part 71B of the first magnet 130 .

When viewed from the first direction or from above, the length of the long side of the third magnet 72 may be smaller than the length of the long side of the first magnet portion 71A of the first magnet 130 . In another embodiment, the length of the long side of the third magnet 72 may be greater than or equal to the length of the long side of the first magnet part 71A of the first magnet 130 .

The third magnet 72 of FIG. 24 may be applied or inferred to all of FIGS. 21A to 23C.

In FIG. 24 , the OIS driving force for moving the OIS moving unit may include electromagnetic force due to interaction between the first and third magnets 130 and 72 and the second coil 230 . Therefore, the embodiment of FIG. 24 can increase the electromagnetic force for driving the OIS.

25 is a perspective view of the cover member 300, the first magnet 130, the first coil 120, the second coil 230, and the second position sensor 240 according to an embodiment.

Referring to FIG. 25 , the cover member 300A includes a top plate 301A and a side plate 302A and may have a box shape with an open bottom, and the lower part of the side plate 302A of the cover member 300A is a base 210 ) can be combined with An opening 303 exposing at least a portion of the lens module 400 may be formed in the upper plate 301 of the cover member 300A. Description of the structure of the cover member 300 of FIGS. 1 and 3 may be applied or inferred to the cover member 300A of FIG. 25 .

The cover member 300A may include a protrusion 305A extending from the top plate 301A toward the groove 119 of the bobbin 110 . The structure of the protrusion 305 of the cover member 300 of FIGS. 1 and 3 and the function of the stopper may be applied or inferred to the protrusion 305A of the cover member 300A of FIG. 25 .

The cover member 300A of FIG. 25 may be formed of a metal material. For example, the cover member 300A may be formed of SUS (Steel Use Stainless) (eg, SUS 4 series). In addition, the cover member 300 may be formed of a cold rolled steel plate (Steel Plate Cold Commercial, SPC). For example, the cover member 300A may be formed of a SUS material containing 50 percent (%) or more of Fe.

Also, for example, an anti-oxidation metal such as nickel may be plated on the surface of the cover member 300A to prevent oxidation.

Also, for example, in another embodiment, the cover member 300A may be formed of a magnetic material or a metal material having magnetism.

The protrusion 305A may be formed of the same metal material or/and magnetic material as the cover member 300A, and may serve to concentrate the magnetic field of the first magnet 130 to the first coil 120 . At least a portion of the protrusion 305A may overlap the first magnet 130 in a direction perpendicular to the first direction (or optical axis direction).

The protrusion 305A may include a plurality of protrusions corresponding to the plurality of magnet units 130 - 1 to 130 - 4 of the first magnet 130 . For example, at least a portion of each of the plurality of protrusions of the cover member 300 is aligned with a corresponding one of the plurality of magnet units 130-1 to 130-4 in a direction perpendicular to the first direction (or optical axis direction). may overlap.

For example, the protruding portion 305A may overlap the first magnet portion 71A of the first magnet 130 in a direction perpendicular to the first direction (or optical axis direction).

At least a portion of the first magnet portion 71A may overlap the protruding portion 305A in a direction perpendicular to the first direction (or optical axis direction).

The length of the portion of the first magnet portion 71A overlapping the protruding portion 305A in the first direction may be 20 to 100 percent of the length M1 of the first magnet portion 71A in the first direction. Alternatively, for example, the length of the portion of the first magnet portion 71A overlapping with the protruding portion 305A in the first direction is 50 to 100 percent of the length M1 of the first magnet portion 71A in the first direction. can When the overlapping portion is less than 20 percent of M1, the improvement of the electromagnetic force with the first coil 120 by the yoke function may be insignificant. When the overlapping portion is 100% of M1, the maximum increase in electromagnetic force due to interaction with the first coil 120 can be obtained.

In another embodiment, the length of the portion of the first magnet 130 overlapping the protrusion 305A in the first direction may be 20% to 100% of the length of the first magnet 130 in the first direction. Alternatively, for example, the length of the first magnet 130 overlapping the protrusion 305A in the first direction may be 50% to 100% of the length of the first magnet 130 in the first direction.

When viewed in the first direction or from above, as shown in FIG. 25 , the protrusion 305A may be located inside the first coil 120 . For example, at least a portion of the first coil 120 may be disposed between the first magnet 130 and the protrusion 305A. This is to focus the magnetic field of the first magnet 130 to the first coil 120 by making the magnetic field of the first magnet 130 pass through the first coil 120 in a direction perpendicular to the optical axis. That is, the protrusion 305A may function as an inner yoke. The protrusion 305A may be expressed as an inner yoke or a yoke instead.

A length of the protrusion 305A in the first direction (or optical axis direction) may be greater than the entire stroke of the bobbin 110 . This is to prevent the protruding part 305A from being separated from the groove 119 of the bobbin 110 and to maximize the electromagnetic force due to the interaction between the first magnet 130 and the first coil 120.

For example, at the initial position of the bobbin 110, the length of the protrusion 305A inserted into the groove 119 of the bobbin 110 may be greater than or equal to the entire stroke of the bobbin 110. Also, for example, at the initial position of the bobbin 110, the length of the protrusion 305A inserted into the groove 119 of the bobbin 110 may be greater than the stroke in the downward direction of the bobbin at the initial position of the bobbin 110.

Compared to the case without the protrusion 305A, the yoke function of the protrusion 305A increases the electromagnetic force due to the interaction between the first magnet 130 and the first coil 120 by about 20%. can

The yoke 410 may face, correspond to, or overlap the first magnet 130 in a first direction (or optical axis direction). For example, at least a portion of the yoke 410 may overlap the first magnet 130 in the first direction (or optical axis direction). For example, at least a portion of the yoke 410 may overlap the second magnet portion 71B of the first magnet 130 in the first direction (or optical axis direction).

For example, when viewed in the first direction or from above, the area of the portion where the first magnet 130 overlaps the yoke 410 may be greater than 50% and less than 100% of the area of the first magnet 130 . When the area of the overlapping portion is less than 50 percent, the effect of increasing the electromagnetic force according to the yoke function may be insignificant. Also, when the area of the overlapping portion is 100% of the area of the first magnet 130, the maximum electromagnetic force can be obtained.

When the area of the overlapping portion is 50% or more of the total area of the first magnet 130, an effect of 90% or more of the maximum electromagnetic force at 100% can be obtained.

In a camera module that performs OIS operation by moving a lens module coupled to a housing and a bobbin disposed in the housing in a direction perpendicular to an optical axis, when a cover member is formed of a metal material, the cover member is attached to the housing by a magnet disposed on the housing. It can be. Due to this, OIS driving cannot be normally operated. On the other hand, in the embodiment, since the housing 140 belongs to a fixed part and the first substrate 255 is moved in a direction perpendicular to the optical axis for OIS driving, the cover member 300A is made of metal having a yoke function. A normal OIS operation can be performed even with the material, and the electromagnetic force for AF driving can be improved by the protruding portion 305A of the cover member 300A.

As the size of the image sensor and the lens of the lens module increases, greater AF driving force and OIS driving force are required, and thus power consumption may increase. In order to prevent an increase in power consumption, it is required to improve electromagnetic force for AF driving and OIS driving.

In the embodiment, the electromagnetic force due to the interaction between the first magnet 130 and the second coil 230 can be improved by using the yoke 410, and the OIS driving force or the electromagnetic force for OIS driving can be improved and consumed. An increase in power can be prevented.

In addition, in the embodiment, the electromagnetic force for AF driving can be improved by the cover member 300A made of metal having the protrusion 305A serving as a yoke, thereby preventing an increase in power consumption.

In addition, as shown in FIGS. 21E and 23A to 23C , the first coil 120 and the first magnet 130 are formed by various types of yokes 420A, 420B, 420C, and 420B1 disposed on the first magnet 130. ) can improve the electromagnetic force for AF driving by the interaction between them. In addition, the electromagnetic force for driving the OIS by the interaction between the second coil 120 and the first magnet 130 can be improved by the yokes 420A, 420B, 420C, and 420B1.

In addition, the camera device according to the embodiment forms an image of an object in space using reflection, refraction, absorption, interference, diffraction, etc., which are characteristics of light, and aims to increase the visual acuity of the eye or record the image by a lens. and optical instruments for the purpose of reproduction, optical measurement, propagation or transmission of images, etc. For example, the optical device according to the embodiment includes a mobile phone, a mobile phone, a smart phone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a personal digital assistant (PDA), and a portable multimedia player (PMP). ), navigation, etc., but is not limited thereto, and any device for capturing images or photos is possible.

26 shows a perspective view of an optical device 200A according to an embodiment, and FIG. 27 shows a configuration diagram of the optical device 200A shown in FIG. 26 .

26 and 27, the optical device 200A includes a body 850, a wireless communication unit 710, an A/V input unit 720, a sensing unit 740, an input/output unit 750, and a memory unit. 760, an interface unit 770, a control unit 780, and a power supply unit 790 may be included.

The body 850 shown in FIG. 26 has a bar shape, but is not limited thereto, and is a slide type, folder type, or swing type in which two or more sub-bodies are coupled to be relatively movable. , and may have various structures such as a swivel type.

The body 850 may include a case (casing, housing, cover, etc.) constituting an external appearance. For example, the body 850 may be divided into a front case 851 and a rear case 852 . Various electronic components of the terminal may be embedded in the space formed between the front case 851 and the rear case 852 .

The wireless communication unit 710 may include one or more modules enabling wireless communication between the optical device 200A and a wireless communication system or between the optical device 200A and a network in which the optical device 200A is located. For example, the wireless communication unit 710 may include a broadcast reception module 711, a mobile communication module 712, a wireless Internet module 713, a short-distance communication module 714, and a location information module 715. have.

An audio/video (A/V) input unit 720 is for inputting an audio signal or a video signal, and may include a camera 721 and a microphone 722.

The camera 721 may include a camera device according to an embodiment.

The sensing unit 740 controls the optical device 200A, such as the opening/closing state of the optical device 200A, the position of the optical device 200A, whether or not there is a user contact, the direction of the optical device 200A, and the acceleration/deceleration of the optical device 200A. ) may sense the current state to generate a sensing signal for controlling the operation of the optical device 200A. For example, if the optical device 200A is in the form of a slide phone, it may sense whether the slide phone is opened or closed. In addition, it is responsible for sensing functions related to whether or not the power supply unit 790 supplies power and whether or not the interface unit 770 is connected to an external device.

The input/output unit 750 is for generating input or output related to sight, hearing, or touch. The input/output unit 750 may generate input data for operation control of the optical device 200A, and may also display information processed by the optical device 200A.

The input/output unit 750 may include a keypad unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keypad unit 730 may generate input data by keypad input.

The display module 751 may include a plurality of pixels whose colors change according to electrical signals. For example, the display module 751 may be a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, a 3D At least one of 3D displays may be included.

The audio output module 752 outputs audio data received from the wireless communication unit 710 in a call signal reception mode, a call mode, a recording mode, a voice recognition mode, or a broadcast reception mode, or stored in the memory unit 760. Audio data can be output.

The touch screen panel 753 may convert a change in capacitance caused by a user's touch to a specific area of the touch screen into an electrical input signal.

The memory unit 760 may store programs for processing and control of the control unit 780, and may store input/output data (eg, phone book, messages, audio, still images, photos, videos, etc.) can be temporarily stored. For example, the memory unit 760 may store an image captured by the camera 721, for example, a photo or video.

The interface unit 770 serves as a passage through which an external device connected to the optical device 200A is connected. The interface unit 770 receives data from an external device or receives power and transmits it to each component inside the optical device 200A, or transmits data inside the optical device 200A to an external device. For example, the interface unit 770 may include a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, a port connecting a device having an identification module, an audio I/O (Input/ Output) port, video I/O (Input/Output) port, and earphone port.

The controller 780 may control the overall operation of the optical device 200A. For example, the controller 780 may perform related control and processing for voice calls, data communications, video calls, and the like.

The controller 780 may include a multimedia module 781 for playing multimedia. The multimedia module 781 may be implemented within the control unit 180 or may be implemented separately from the control unit 780.

The controller 780 may perform a pattern recognition process capable of recognizing handwriting input or drawing input performed on the touch screen as characters and images, respectively.

The power supply unit 790 may receive external power or internal power under the control of the control unit 780 to supply power necessary for the operation of each component.

Features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified with respect to other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to these combinations and variations should be construed as being included in the scope of the present invention.

Claims (17)

fixing part;
a first magnet disposed on the fixing part;
a first moving unit including a first coil and moving in an optical axis direction by an interaction between the first magnet and the first coil;
a second moving part including a first substrate part disposed apart from the fixing part, a second coil facing the first magnet in the optical axis direction, and an image sensor disposed on the first substrate part; and
A first yoke disposed on the fixing unit and disposed facing the first magnet in the optical axis direction;
The second moving unit moves in a direction perpendicular to the optical axis direction by an interaction between the first magnet and the second coil. According to claim 1,
The first magnet is disposed above the second coil, and the first yoke is disposed below the second coil. According to claim 1,
The first magnet,
a first magnet unit including a first N pole and a first S pole; and
A camera device including a second magnet part including a second N pole and a second S pole and disposed under the first magnet part. According to claim 3,
and a barrier rib disposed between the first magnet unit and the second magnet unit, wherein the barrier rib is a neutral zone. According to claim 3,
The camera device of claim 1 , wherein the first magnet part and the second magnet part are spaced apart from each other. According to claim 3,
The first N pole is in contact with the second S pole, and the first S pole is in contact with the second N pole. According to claim 3,
A camera device comprising a second yoke disposed between the first magnet part and the second magnet part. According to claim 1,
A camera device including a third yoke disposed on a side of the first magnet. According to claim 1,
A camera device comprising a fourth yoke disposed on an upper surface of the second magnet. According to claim 1,
The first yoke is a camera device of a magnetic material. According to claim 3,
and a fifth yoke disposed on a side surface of at least one of the first magnet unit and the second magnet unit. According to claim 1,
The camera device of claim 1 , wherein the first yoke overlaps at least a portion of the first magnet in the optical axis direction. According to claim 1,
A separation distance between the first magnet and the second coil in the optical axis direction is smaller than a separation distance between the first magnet and the first yoke in the optical axis direction. According to claim 1,
The fixing part,
a second substrate portion disposed spaced apart from the first substrate portion; and
A camera device comprising a support substrate electrically connecting the first substrate and the second substrate. According to claim 14,
The first yoke is disposed between the second coil and the second substrate unit. According to claim 14,
The first yoke is disposed on an upper surface of the second substrate unit. fixing part;
a first magnet and a yoke disposed spaced apart from each other in the fixing part;
a first moving unit including a first coil facing the first magnet in a direction perpendicular to the optical axis; and
A second moving part including a first substrate part disposed apart from the fixing part, an image sensor disposed on the first substrate part, and a second coil facing the first magnet in the optical axis direction;
The second coil is disposed between the first magnet and the yoke and moves the second moving part in a direction perpendicular to the optical axis direction by interaction with the first magnet.

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