KR20200112830A - Winding body of long laminated sheet - Google Patents

Abstract

(Task) Having an approximately rectangular support sheet and an approximately rectangular resin film forming layer formed on the support sheet, and maintaining an approximately rectangular ring frame to hold the ring frame in the area surrounding the resin film forming layer in plan view A support sheet with a resin film forming layer having a means and a long release sheet are included, and long auxiliary sheets are successively stacked on both ends of the release sheet in the width direction on the release treatment surface, and the release sheet is peeled off On the inner side of the surface in the width direction, in the resin film forming layer in the winding body formed by winding up in a roll form a long laminated sheet formed by independently attaching a plurality of support sheets with a resin film forming layer along the longitudinal direction of the release sheet to be peelable Prevention of winding.
(Solution means) In the above-described long laminated sheet, the distance between the resin film forming layer and the outer end of the auxiliary sheet as viewed from the side of the resin film forming layer after removal of the release sheet is W1, and the auxiliary sheet is the widest. When the width of the auxiliary sheet in the portion is set to W2, W2/W1≦1.6.

Description

Winding body of long laminated sheet

In the present invention, a resin layer such as an adhesive layer or a protective film is formed on a semiconductor package in which a plurality of semiconductor chips are resin-sealed, and a support sheet with a resin film forming layer used for dicing a semiconductor package is wound in a roll shape. It is about one volume body (卷收体). In particular, the present invention relates to a technique for reducing winding marks that may occur in a resin film forming layer due to winding pressure of a winding body.

2. Description of the Related Art In recent years, miniaturization, weight reduction, and higher functionality of electronic devices are in progress, and with this, miniaturization, thickness reduction, and higher density are required for semiconductor devices mounted in electronic devices. The semiconductor chip may be mounted in a package close to its size. Such a package may be referred to as a CSP (Chip Scale Package). Examples of the CSP include a wafer level package (WLP) that processes and completes a package final process with a wafer size, and a panel level package (PLP) that processes and completes a final package process with a panel size larger than the wafer size.

WLP and PLP are classified into a fan-in type and a fan-out type. In the fan-out type WLP and PLP, the semiconductor chip is covered with an encapsulant so as to have a larger area than the chip size to form an encapsulant of the semiconductor chip, and the rewiring layer and the external electrode are formed of the encapsulant as well as the circuit surface of the semiconductor chip. It is also formed in the surface area.

For example, in Patent Literature 1, a plurality of semiconductor chips separated from a semiconductor wafer are left with their circuit formation surfaces, and an expansion wafer is formed around the periphery using a mold member, and a rewiring pattern is formed in a region other than the semiconductor chip. A method of manufacturing a semiconductor package formed by extending the pattern is described. In the manufacturing method described in Patent Literature 1, a dicing step in which a semiconductor wafer is separated into pieces is performed while a semiconductor wafer is adhered to an adhesive tape for dicing (hereinafter, also referred to as "dicing sheet"). The resin encapsulation body including such a plurality of semiconductor chips may be referred to as "chip group package" below. Further, the process of dicing this to obtain individual CSPs is sometimes referred to as "package dicing".

In general, in the package dicing method, a plurality of semiconductor chips are placed on a rectangular substrate, resin-sealed collectively, external terminals are formed, and a rectangular package consisting of a group of chips sealed with resin (chip group package). Get This is because it is preferable to have a square shape from the viewpoint of efficiency in arranging chips, and subsequent transport and storage of the package.

Subsequently, this chip group package is diced to obtain a semiconductor device such as CSP. In the process of dicing the chip group package, a rectangular dicing sheet corresponding to the shape of the package is elongated on a frame for dicing, the chip group package is affixed to the dicing sheet, and the package is diced ( Patent Document 2, Patent Document 3).

Various methods of manufacturing a chip group package have been proposed. For example, a semiconductor chip is temporarily attached onto a holding tool such as a resin tape. At this time, the circuit surface or bump surface of the semiconductor chip faces upward, and the back surface side of the chip is fixed on the resin tape. Next, a lead is attached to the circuit surface or the bump surface for external connection, and resin sealing is performed collectively. Thereafter, by peeling the resin tape, a chip group package is obtained. The chip group package obtained through such a process is obtained in a structure in which the back surface of the chip is exposed. After that, dicing is performed using the above dicing sheet, and a divided semiconductor device is obtained.

When the back surface of the chip is exposed, the durability and reliability of the semiconductor device may be impaired. Therefore, normally, a protective film is formed on the exposed surface of the chip. This protective film increases the transverse strength and also functions effectively when printing a product number or the like on a semiconductor device. In addition, when the semiconductor device obtained by cutting is mounted on another member, an adhesive layer is attached to the exposed surface of the chip of the semiconductor device and adhered to the other member.

It is cumbersome to separately form a protective film or attach an adhesive layer to a divided semiconductor device. In addition, when implemented individually, the thickness of the protective film or the adhesive layer is not constant, so there may be variations in product quality. Therefore, for a chip group package having a structure in which the back surface of the chip is exposed, it is considered that the process of forming a protective film or an adhesive layer collectively and dicing thereafter is advantageous in the process. Hereinafter, a layer for forming a resin film, such as a protective film or an adhesive layer, may be described as a "resin film forming layer".

Various methods are known for forming a resin film forming layer on a semiconductor chip. That is, a semiconductor chip having a resin film forming layer on one surface is obtained by attaching a resin film forming layer such as a precursor layer of a protective film or an adhesive layer on one surface of the semiconductor wafer, and then dicing the semiconductor wafer and the resin film forming layer at the same time. . In order to carry out this process continuously, sheets for wafer processing, such as a dicing die-bonding sheet and a dicing sheet with a protective film forming layer (Patent Document 4), are known. Since these wafer processing sheets are premised on being affixed to a substantially circular silicon wafer, a circular resin film-forming layer is laminated on a circular dicing sheet so that peeling is possible.

However, the chip group package is formed in a square shape as described above. This is because it is preferable to have a square shape from the viewpoint of efficiency in arranging chips, and subsequent transport and storage of the package.

When a conventional dicing sheet with a circular resin film forming layer is applied to such a rectangular chip group package, only the largest square portion of the circular resin film forming layer can be used, and the surrounding portions are discarded unused. Specifically, for example, when the resin film forming layer is a circular shape with a radius of 10 cm (area about 314 cm2), the maximum area of the square is 200 cm2 (2 ^1/2 × 10 cm square) and the effective area of the resin film forming layer The rate is only 63.7%.

Therefore, it is considered to increase the effective area ratio of the resin film forming layer by using a support sheet with a square resin film forming layer in which a square resin film forming layer is formed on a support sheet such as the square dicing sheet described above.

In a support sheet with a resin film forming layer, a resin film forming layer slightly smaller than this may be laminated on a support sheet having a relatively large area. A viscous ring frame holding means for adhering to the ring frame is provided so as to surround the use area of the resin film forming layer. This supporting sheet with a resin film forming layer is laminated on a long release sheet. This long laminated sheet is released as a winding body wound up in a roll shape. In the long laminated sheet, there are a portion in which the supporting sheet with a resin film forming layer is laminated and a portion not laminated, and a portion having a different thickness is inevitably generated. When a long laminated sheet having an uneven thickness is wound up in a roll shape, winding collapse may occur. Further, due to the difference in thickness, a gap is generated on the side of the roll, and dust or the like enters from the gap, thereby contaminating the resin film forming layer.

In order to solve such a problem, it is considered to remain at both ends of the elongate laminated sheet in the width direction along the length direction. By forming the auxiliary sheet, the thickness of the long laminated sheet becomes uniform, the winding collapse of the winding body is prevented, and the running stability at the time of unwinding is also improved. In addition, since the auxiliary sheet is present in the gap on the side of the roll, it is possible to prevent penetration of the dust.

However, if the width of the auxiliary sheet is constant, a difference in thickness occurs between the supporting sheet with the resin film forming layer and the supporting sheet with another adjacent resin film forming layer. That is, in the portion where the supporting sheet with the resin film forming layer is formed, the thickness becomes uniform by the auxiliary sheet present on the side thereof. However, there is no auxiliary sheet between the supporting sheet with the resin film forming layer and the supporting sheet with the other adjacent resin film forming layer, and there is only a release sheet, so that the difference in thickness is not resolved.

Moreover, the supporting sheet with the resin film forming layer and the auxiliary sheet are made of substantially the same material, and when the supporting sheet with the resin film forming layer is cut into a square shape, the auxiliary sheet is left in the vicinity of the side of the supporting sheet with the resin film forming layer. That is, the support sheet with the resin film-forming layer and the auxiliary sheet are molded into a predetermined shape, and the excess portion (debris portion) between the support sheet with the resin film-forming layer and the auxiliary sheet is removed, thereby forming a predetermined shape on the release sheet. A supporting sheet with a resin film forming layer is obtained, and auxiliary sheets remain at both ends of the release sheet 14 in the width direction. Cutting at this time is carried out continuously with a roll-shaped cutting edge, and removal of the excess portion is carried out by continuously pulling up the excess portion (debris removal).

If the width of the auxiliary sheet is constant, the area of the surplus portion changes sharply at the point where the support sheet with the resin film formation layer is transferred to the portion where the sheet does not exist, and as a result, the excess portion is peeled off. Power also changes. If the peeling force of the excess portion is rapidly increased, the excess portion is cut off during the removal of the residue, and continuous removal of the residue cannot be performed.

In order to solve the problem caused by the difference in thickness and to gradually change the peeling force of the excess part, an auxiliary sheet is provided in a portion where there is no sheet between the supporting sheet with the resin film forming layer and the supporting sheet with another adjacent resin film forming layer. It extends in the inner direction to form a relatively wide part. Thereby, the difference in thickness between the portion where the supporting sheet with the resin film formation layer exists and the portion where the sheet does not exist is also alleviated, and the area of the excess portion gradually changes, so that the peeling force of the excess portion at the time of debris removal The abrupt change also disappears, and the debris removal can be performed stably.

Therefore, as shown in Fig. 5, also in the supporting sheet with a resin film forming layer having a rectangular resin film forming layer on the rectangular supporting sheet, an auxiliary sheet is formed in the vicinity of the side of the supporting sheet with the resin film forming layer. Between the supporting sheet with the forming layer and the supporting sheet with the other adjacent resin film forming layer, a light width portion having an auxiliary sheet extending in the inner direction is formed.

In order to mitigate the difference in thickness between the supporting sheet with the resin film forming layer and the portion where the sheet does not exist, and to prevent a sudden change in the area of the excess portion, it is considered that the larger the width of the auxiliary sheet is, the more preferable.

International publication WO2010/058646 Japanese Patent Application Publication No. 2002-3798 Japanese Unexamined Patent Publication No. 2010-83921 International publication WO2013/047674

In the supporting sheet with a resin film forming layer, a plurality of supporting sheets with a resin film forming layer are independently adhered so as to be peelable along the longitudinal direction of a long release sheet, and a long auxiliary sheet is provided at both ends of the release sheet in the width direction. It is released as a winding body wound up in a roll shape and the elongate laminated sheet laminated|stacked continuously.

However, when the width|variety part of an auxiliary sheet|seat is too large, winding may generate|occur|produce in the resin film formation layer. When the long laminated sheet is wound in a roll shape, the radius increases with the progress of the winding, and thus the width portion may overlap on the upper surface side or the lower surface side of the resin film forming layer. When winding is continued in this state, the width light portion is pressed against the resin film forming layer by the winding pressure, and a convex portion or a concave portion corresponding to the shape of the light width portion is generated in the resin film forming layer (see Fig. 5). Such a convex or concave portion is called a winding.

When windings occur in the resin film forming layer, the thickness accuracy of the resin film forming layer decreases, air mixing occurs when the resin film forming layer is affixed to the chip group package, and the adhesion of the package becomes insufficient. Further, in a method of manufacturing a semiconductor device, when a divided package is adhered to a mounting portion of the package via a resin film forming layer, it causes a decrease in adhesion and generation of voids. As a result, it becomes difficult to obtain a semiconductor device having excellent reliability. In addition, when a resin film is used as a protective film, the wound on the resin film forming layer causes appearance defects.

Accordingly, an object of the present invention is to prevent the occurrence of winding marks at a point where a resin film forming layer, particularly a chip group package, is affixed even when a winding body is formed in a long laminated sheet having the above structure.

The present invention to solve the above problems provides a winding body of the following long laminated sheet.

It has a substantially rectangular support sheet, a substantially rectangular resin film forming layer formed on the support sheet, and has a substantially rectangular ring frame holding means for holding the ring frame in a region surrounding the resin film forming layer in plan view. A supporting sheet with a resin film forming layer,

Including a long release sheet,

Long auxiliary sheets are successively stacked on both ends of the release sheet in the width direction on the release treatment surface,

A winding body formed by winding up a long laminated sheet formed by independently adhering a plurality of support sheets with a resin film forming layer along the longitudinal direction of the release sheet so as to be peelable, inside the width direction on the release treatment surface of the release sheet,

The distance between the resin film forming layer and the outer end of the auxiliary sheet as viewed in plan from the resin film forming layer side after removal of the release sheet is W1,

A winding body of a long laminated sheet of W2/W1≦1.6 when the width of the auxiliary sheet in the widest portion of the auxiliary sheet as viewed from the plane is W2.

According to the winding body of the long laminated sheet of the present invention, since the width portion of the auxiliary sheet does not overlap at the point (area of use) where the chip group package of the resin film forming layer is affixed, windings do not occur in the use region of the resin film forming layer. . For this reason, the chip group package can be stably affixed, and the thickness of the obtained resin film also becomes uniform.

Fig. 1A shows a state in which a part of the long laminated sheet of the first embodiment is sent out from the winding body.
1B is a cross-sectional view taken along line AA in FIG. 1A.
1C is a cross-sectional view taken along line BB in FIG. 1A.
Fig. 2A shows a state in which a part of the long laminated sheet of the second embodiment is sent out from the winding body.
Fig. 2B is a cross-sectional view taken along line AA in Fig. 2A.
Fig. 2C is a cross-sectional view taken along line BB in Fig. 2A.
Fig. 3A shows a state in which a part of the elongated laminated sheet of the third embodiment is sent out from the winding body.
3B is a cross-sectional view taken along line AA in FIG. 3A.
3C is a cross-sectional view taken along line BB in FIG. 3A.
4 shows explanatory diagrams of W1 and W2.
5 shows a state of occurrence of a wound.
6A shows a state in which a supporting sheet with a resin film forming layer is transferred from a long laminated sheet to an adherend.
6B shows a perspective view of FIG. 6A.

Hereinafter, the winding body of the long laminated sheet of the present invention will be described in detail.

In the present invention, "approximately square" includes not only a strictly square or rectangular shape, but also a slightly deformed shape similar to this. For example, each side of a square shape or a rectangle shape may be curved or bent, and the corner portion may be a rounded curve, or may be formed to be rounded by a short straight line whose direction continuously changes.

In addition, the "support sheet" is a sheet-like member capable of supporting the resin film forming layer so that it can be peeled off, and may be a release sheet, or an adhesive sheet such as a so-called dicing sheet.

The "resin film forming layer" is used in a sense including both a precursor layer and an adhesive layer for forming a protective film. The precursor layer for forming the protective film is cured by a predetermined operation to form a protective film.

The "support sheet with a resin film forming layer" means a laminate of a support sheet and a resin film forming layer. It also includes an approximately square ring frame holding means for holding the ring frame.

The "release sheet" is a sheet in which the peeling force of the surface is controlled, and may be made of resin, or may be made of paper or fabric. The peeling force of the surface is controlled by a release agent or the like, but is not limited thereto.

"Long" means a shape having a square shape and a length direction sufficiently longer than a width direction.

"Auxiliary sheet" means a layered body formed on both ends of a long release sheet in the width direction.

The ``long laminated sheet'' includes a long release sheet, a long auxiliary sheet successively laminated on both ends of the release sheet in the width direction, and a support sheet with a resin film formation layer that is detachably attached to the inside of the release sheet in the width direction. Include.

The "winding body" refers to the thing which wound up the said long laminated sheet and made it into a roll shape.

Hereinafter, a supporting sheet with a resin film forming layer, a long laminated sheet including the same, and a winding body thereof will be described with reference to the drawings.

The support sheet with a resin film formation layer has a substantially square support sheet and a substantially square resin film formation layer formed on the support sheet so as to be peelable, and surrounds the resin film formation layer in a plan view from the side of the resin film formation layer. Has an approximately square ring frame holding means for holding the ring frame in the area.

This supporting sheet with a resin film forming layer is attached to the inside in the width direction on the peeling treatment surface of the long release sheet along the lengthwise direction of the release sheet so as to be peelable. Moreover, a long auxiliary sheet is continuously laminated|stacked on both ends of the width direction on the peeling-processed surface of a long release sheet, and a long laminated sheet is comprised.

Hereinafter, although the specific form of a long laminated sheet is demonstrated, it is not limited to these.

[Long-Lamination Sheet: First Form]

1 shows a first aspect of a long laminated sheet. Fig. 1A shows a state in which the long laminated sheet 2 is delivered from the winding body 1, Fig. 1B is a sectional view taken along line A-A in Fig. 1A, and Fig. 1C is a sectional view taken along line B-B in Fig. 1A.

As shown in FIG. 1B, the support sheet 10 with a resin film forming layer includes a support sheet 11, a resin film forming layer 12 laminated on the entire surface of the support sheet 11, and an outer peripheral portion of one surface of the resin film forming layer 12. It has a ring frame holding means 13 formed in. The support sheet 11 and the resin film forming layer 12 are laminated so as to be peelable. When the support sheet 11 is a release sheet, the resin film forming layer 12 is formed on the release treatment surface. When the support sheet 11 is an adhesive sheet such as a dicing sheet, the resin film forming layer 12 is formed on the adhesive layer. When the support sheet 11 is an adhesive sheet, the specific aspect of the adhesive sheet is the same as the adhesive sheet of the second aspect described later.

Along the lengthwise direction of the elongated release sheet 14, a plurality of supporting sheets 10 with a resin film forming layer are independently attached to each other so as to be peelable inside the width direction.

Along the length direction of the elongate release sheet 14, the elongate auxiliary sheet 15 is laminated|stacked on both ends of the width direction. The auxiliary sheet 15 has the same lamination structure as the outer peripheral portion of the supporting sheet 10 with a resin film forming layer. That is, the auxiliary sheet 15 is made of the same material as the support sheet 11, the resin film forming layer 12, and the ring frame holding means 13.

The release sheet 14 is exposed between the support sheets with the resin film forming layer, and the auxiliary sheet 15 extends toward the inside in the width direction between them. That is, the width of the auxiliary sheet is uneven, and the auxiliary sheet is formed so as to widen the width in the portion between the supporting sheets with the resin film forming layer (hereinafter, referred to as "a widening portion" in some cases). A cross-sectional view of the light width portion is shown in Fig. 1C.

Such a long laminated sheet 2 can be manufactured as follows, for example.

On the long release sheet 14, an adhesive layer (a double-sided adhesive tape may be used) serving as the ring frame holding means 13 is affixed. The pressure-sensitive adhesive layer is molded into a square shape. At this time, the pressure-sensitive adhesive layer is completely cut, and the cutting edge is cut in the release sheet to such an extent that a shallow cut is generated. Subsequently, the molded pressure-sensitive adhesive layer is removed, and the pressure-sensitive adhesive layer having a rectangular opening is left on the release sheet 14.

Separately, a laminate of the support sheet and the resin film forming layer is prepared, and this is laminated on the side of the release sheet 14 having the pressure-sensitive adhesive layer.

Next, the laminate is cut in accordance with the shape of the ring frame. At this time, the cutout is formed so that the square opening of the pressure-sensitive adhesive layer is located at approximately the center of the mold shape. At the same time, incisions are made according to the predetermined shape of the auxiliary sheet 15. Also in this case, the laminate is completely cut in the same manner as above, and the cutting edge is cut in the release sheet to such an extent that a shallow cut occurs. Thereafter, by removing the excess portion (debris portion) between the supporting sheet with the resin film forming layer and the auxiliary sheet, on the release sheet 14, the supporting sheet 10 with a resin film forming layer having a predetermined shape is obtained, and the release sheet The auxiliary sheet 15 remains at both ends in the width direction of (14), and the elongated laminated sheet 2 of the above structure is obtained.

[Long-Lamination Sheet: Second Form]

In FIG. 2, the 2nd form of a long laminated sheet is shown. Fig. 2A shows a state in which the long laminated sheet 4 is delivered from the winding body 3, Fig. 2B is a sectional view taken along line A-A in Fig. 2A, and Fig. 2C is a sectional view taken along line B-B in Fig. 2A.

As shown in FIG. 2B, the support sheet 20 with a resin film forming layer has a support sheet 21 and a resin film forming layer 22 laminated on an inner circumferential portion of one side thereof. The support sheet 21 and the resin film forming layer 22 are laminated so as to be peelable. Moreover, the support sheet 21 in 2nd aspect is an adhesive sheet, such as a dicing sheet. The adhesive sheet has a base material 21A and an adhesive layer 21B. When the release sheet 24 is removed, the pressure-sensitive adhesive layer 21B is exposed on the outer periphery of the resin film forming layer 22 and functions as the ring frame holding means 23.

Along the lengthwise direction of the elongate release sheet 24, a plurality of support sheets 20 with a resin film forming layer are attached to each of the support sheets 20 with a plurality of resin film forming layers independently of each other in the width direction.

Along the length direction of the elongate release sheet 24, the elongate auxiliary sheet 25 is laminated|stacked on both ends of the width direction. The auxiliary sheet 25 has the same lamination structure as the outer peripheral portion of the support sheet 20 with a resin film forming layer. That is, the auxiliary sheet 25 is made of the same material as the base 21A and the pressure-sensitive adhesive layer 22B.

The release sheet 24 is exposed between the support sheets with the resin film forming layer, and the auxiliary sheet 25 extends toward the inside in the width direction between them. That is, the width of the auxiliary sheet is uneven, and the auxiliary sheet is formed so as to widen the width in the portion between the supporting sheets with the resin film forming layer (hereinafter, referred to as "a widening portion" in some cases). A cross-sectional view of the light width portion is shown in Fig. 2C.

Such a long laminated sheet 4 can be manufactured as follows, for example.

On the long release sheet 24, a resin layer constituting the resin film forming layer is formed on the entire surface, and this resin layer is molded into a square shape. At this time, the resin film forming layer is completely cut, and a cutting edge is cut in the release sheet to such an extent that a shallow cut is generated. Subsequently, the outer periphery of the molded resin film forming layer is removed, and the rectangular resin film forming layer 22 remains on the release sheet 24.

Separately, a pressure-sensitive adhesive sheet having the base material 21A and the pressure-sensitive adhesive layer 21B is prepared, and this is laminated on the side of the release sheet 24 having the resin film forming layer 22.

Next, the pressure-sensitive adhesive sheet is cut in accordance with the shape of the ring frame. At this time, the resin film forming layer 22 is cut after being positioned so that it may be positioned substantially at the center of the cut shape. At the same time, incisions are made in the pressure-sensitive adhesive sheet according to the predetermined shape of the auxiliary sheet 25. At this time, the pressure-sensitive adhesive sheet is completely cut, and a cutting edge is cut in the release sheet to such an extent that a shallow cut is formed. Thereafter, by removing the excess portion (debris portion) between the supporting sheet with the resin film forming layer and the auxiliary sheet, on the release sheet 24, a supporting sheet 20 with a resin film forming layer having a predetermined shape is obtained, and the release sheet The auxiliary sheet 25 remains at both ends of (24) in the width direction, and the elongate laminated sheet 4 having the above structure is obtained.

[Long-Lamination Sheet: 3rd Form]

In FIG. 3, a 3rd form of a long laminated sheet is shown. Fig. 3A shows a state in which the long laminated sheet 6 is delivered from the winding body 5, Fig. 3B is a sectional view taken along line A-A in Fig. 3A, and Fig. 3C is a sectional view taken along line B-B in Fig. 3A.

As shown in FIG. 3B, the support sheet 30 with a resin film forming layer is formed on the support sheet 31, the resin film forming layer 32 laminated on the inner circumferential portion of one side thereof, and the outer circumferential portion of the resin film forming layer 32. It has a ring frame holding means (33) formed. The support sheet 31 and the resin film forming layer 32 are laminated so as to be peelable. When the support sheet 31 is a release sheet, the resin film forming layer 32 is formed on the release treatment surface. When the support sheet 31 is an adhesive sheet such as a dicing sheet, the resin film forming layer 32 is formed on the adhesive layer. When the support sheet 31 is an adhesive sheet, the specific aspect of the adhesive sheet is the same as the adhesive sheet of the second aspect described above.

Along the lengthwise direction of the elongated release sheet 34, a plurality of support sheets 30 with a resin film forming layer are each independently attached to each other so as to be peelable.

Along the longitudinal direction of the elongate release sheet 34, the elongate auxiliary sheet 35 is laminated at both ends in the width direction. The auxiliary sheet 35 has the same lamination structure as the outer peripheral portion of the supporting sheet 30 with a resin film forming layer. That is, the auxiliary sheet 35 is made of the same material as the support sheet 31 and the ring frame holding means 33.

The release sheet 34 is exposed between the support sheets with the resin film forming layer, and the auxiliary sheet 35 extends toward the inside in the width direction between them. That is, the width of the auxiliary sheet is uneven, and the auxiliary sheet is formed so as to widen the width in the portion between the supporting sheets with the resin film forming layer (hereinafter, referred to as "a widening portion" in some cases). A cross-sectional view of the light width portion is shown in Fig. 3C.

Such a long laminated sheet 6 can be manufactured as follows, for example.

On the long release sheet 34, a resin layer constituting the resin film forming layer is formed on the entire surface, and this resin layer is molded into a square shape. At this time, the resin film forming layer is completely cut, and a cutting edge is cut in the release sheet to such an extent that a shallow cut is generated. Subsequently, the outer periphery of the molded resin film forming layer is removed, and the rectangular resin film forming layer 32 is left on the release sheet 34.

Separately, an adhesive layer (a double-sided adhesive tape may be used) serving as the ring frame holding means 33 is affixed on the long support sheet. The pressure-sensitive adhesive layer is molded into a square shape. At this time, the pressure-sensitive adhesive layer is completely cut, and the cutting edge is cut into the support sheet to such an extent that a shallow cut is made. Subsequently, the molded pressure-sensitive adhesive layer is removed, and the pressure-sensitive adhesive layer having a rectangular opening is left on the long support sheet.

Next, the long release sheet 34 having the resin film forming layer 32 and the long support sheet in which the adhesive layer having a rectangular opening is laminated are positioned so that the resin film forming layer 32 coincides with the square opening. And attach both.

Next, this laminated body is cut out according to the shape of the ring frame from the support sheet side. At this time, the resin film forming layer 32 is cut after being positioned so that it may be positioned substantially at the center of the cut shape. At the same time, incisions are made in the laminate according to the predetermined shape of the auxiliary sheet 35. At this time, the laminate is completely cut, and a cutting edge is cut in the release sheet to such an extent that shallow cuts occur. Thereafter, by removing the excess portion (debris portion) between the supporting sheet with the resin film forming layer and the auxiliary sheet, on the release sheet 34, a supporting sheet 30 with a resin film forming layer having a predetermined shape is obtained, and the release sheet The auxiliary sheet 35 remains at both ends in the width direction of (34), and the elongate laminated sheet 6 of the above structure is obtained.

[Explosive part]

In the present invention, when forming the auxiliary sheets 15, 25, 35, the auxiliary sheet is extended in the inward direction between the supporting sheet with the resin film forming layer and the supporting sheet with the adjacent resin film forming layer, A part (a wide light part) is formed (see Fig. 4). Thereby, the difference in thickness between the supporting sheet with the resin film forming layer and the supporting sheet with the other adjacent resin film forming layer is also alleviated, and since the area of the surplus portion gradually changes, there is also a sudden change in the peeling force of the excess portion at the time of debris removal. It disappears, and the debris removal can be performed stably.

When it is set as a winding body, the light width part is formed so that it may not overlap with the use area|region of a resin film formation layer. The resin film forming layer is not used in a case where the entire surface is used, and is formed on the periphery with some margin. The size of the resin film forming layer is set slightly larger than that of the chip group package, and even if the chip group package is adhered, there are spots that are not used for adhesion at the periphery of the resin film forming layer. At this point where it is not used, the resin film forming layer and the light width portion may overlap. In addition, even if a wound is formed by overlapping a portion of the area where the resin film forming layer is used, the wound is allowed to be in the present invention when the wound is small and does not affect adhesion.

In the first to third embodiments, a plan view from the side of the resin film forming layer after removing the release sheet from the laminated sheet is shown in FIG. 4. In Fig. 4, a portion enclosed by a dotted line indicates a use area of the resin film forming layer. In addition, although the 1st embodiment is shown as an example in FIG. 4, the planar view from the side of a resin film formation layer after removing a release sheet becomes the same in 1st-3rd modes. Therefore, description is made according to the reference numerals used in the first aspect.

In either case, there are ring frame holding means 13 for the exposed resin film forming layer 12, and auxiliary sheets 15 are provided at both ends of the width direction.

Here, in the plan view shown in Fig. 4, the distance between the resin film forming layer 12 and the outer end of the auxiliary sheet 14 is W1, and the auxiliary sheet in the widest portion of the auxiliary sheet as viewed from the plane. When the width of is W2, the auxiliary sheet is formed so that W1 and W2 satisfy W2/W1≦1.6. Preferably, W2/W1≦1.4 and W2/W1≦1.2 are satisfied. Further, the lower limit of W2/W1 is 0.2, and preferably 0.4≦W2/W1 is satisfied.

Moreover, W1 in 1st aspect was shown to FIG. 1B, and W2 was shown to FIG. 1C. W1 in the second aspect is shown in Fig. 2B, and W2 is shown in Fig. 2C. W1 in the third aspect was shown in FIG. 3B, and W2 was shown in FIG. 3C.

According to the winding body of the long laminated sheet of the present invention, since the width portion of the auxiliary sheet does not overlap at the point (area of use) where the chip group package of the resin film forming layer is affixed, windings do not occur in the use region of the resin film forming layer. . Moreover, even if the width|variety part and the resin film formation layer are overlapped, the wound generated in the resin film formation layer is small, and adhesiveness is not affected. For this reason, the chip group package can be stably affixed, and the thickness of the obtained resin film also becomes uniform.

Next, although a support sheet, a resin film forming layer, a ring frame holding means, and a long release sheet are demonstrated, all are non-limiting examples.

[Support sheet]

As the support sheets 11 and 31, a release sheet may be mentioned, and an adhesive sheet such as a dicing sheet described later may be used. Moreover, an adhesive sheet is used as the support sheet 21 in 2nd aspect.

As a release sheet, for example, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a polymethylpentene film, a polyvinyl chloride film, a vinyl chloride copolymer film, a polyethylene terephthalate film, a polyethylene naphthalate film, Polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene/(meth)acrylic acid copolymer film, ethylene/(meth)acrylic acid ester copolymer film, polystyrene film, polycarbonate film , A polyimide film, a fluororesin film, and the like are used. Moreover, these crosslinked films are also used. Moreover, these laminated films may be sufficient.

The surface tension of the surface of the release sheet in contact with the resin film forming layer is preferably 40 mN/m or less, more preferably 37 mN/m or less, and particularly preferably 35 mN/m or less. The lower limit is usually about 25 mN/m. However, it is preferable to set it as a medium peeling type rather than the "long peeling sheet" mentioned later. Such a release sheet having a relatively low surface tension can be obtained by appropriately selecting a material, and can also be obtained by applying a release agent to the surface of the release sheet to perform a release treatment.

As the release agent used for the peeling treatment, alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based, wax-based, and the like are used, but particularly, alkyd-based, silicone-based, and fluorine-based release agents are preferred because they have heat resistance.

In order to peel the surface of the film, etc., which is the base of the release sheet using the above release agent, the release agent is used as it is as a solvent-free agent, or by diluting or emulsifying a solvent, and the like, The release sheet coated with the release agent and applied thereto is provided under room temperature or under heating, or cured by an electron beam to form a release agent layer.

Further, the surface tension of the release sheet may be adjusted by laminating the films by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion, or the like. That is, a film in which the surface tension of at least one surface is within a preferable range as the surface in contact with the resin film forming layer of the above-described release sheet is laminated with another film so that the surface is in contact with the resin film forming layer. A sieve may be produced and a release sheet may be used.

As the supporting sheet, an adhesive sheet such as a dicing sheet in which an adhesive layer is formed on a base film may be used. In this aspect, the resin film forming layer is laminated on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet. As a base material of an adhesive sheet, the said film illustrated as a release sheet is mentioned. As the pressure-sensitive adhesive layer, a weakly-adhesive one having an adhesive force capable of peeling the resin film forming layer may be used, or an energy-ray-curable one whose adhesive strength is lowered by irradiation with energy rays may be used. The pressure-sensitive adhesive layer is applied to various known pressure-sensitive adhesives (for example, general-purpose pressure-sensitive adhesives such as rubber-based, acrylic-based, silicone-based, urethane-based, and vinyl ether-based, pressure-sensitive adhesives with irregularities on the surface, energy ray-curable pressure-sensitive adhesives, adhesives containing thermal expansion components, etc. Can be formed by

The thickness of the support sheet is usually 10 to 500 µm, preferably 15 to 300 µm, and particularly preferably 20 to 250 µm. When the support sheet is an adhesive sheet having an adhesive layer formed on a substrate, 3 to 50 µm in the support sheet is the thickness of the adhesive layer.

[Resin film formation layer]

The resin film forming layers 12, 22, 32 are precursor layers for forming a protective film, or consist of an adhesive layer. The functions required at least for the resin film forming layer are (1) sheet shape retention, (2) initial adhesiveness, and (3) curability.

(1) sheet shape retention and (3) curability can be imparted to the resin film forming layer by addition of a binder component, and as a binder component, a first binder containing a polymer component (A) and a curable component (B) A second binder component containing a component or a curable polymer component (AB) having both the properties of the component (A) and the component (B) can be used.

In addition, the (2) initial adhesiveness, which is a function for temporarily adhering to the package until the resin film forming layer is cured, may be a pressure-sensitive adhesive property or a property of softening by heat and bonding. (2) Initial adhesion is usually controlled by various properties of the binder component, adjustment of the blending amount of the inorganic filler (C) described later, or the like.

(First binder component)

By containing the polymer component (A) and the curable component (B), the first binder component imparts sheet shape retention and curability to the resin film forming layer. In addition, the first binder component does not contain a curable polymer component (AB) for convenience of distinguishing from the second binder component.

(A) polymer component

The polymer component (A) is added to the resin film forming layer for the purpose of imparting sheet shape retention to the resin film forming layer.

In order to achieve the above object, the weight average molecular weight (Mw) of the polymer component (A) is usually 20,000 or more, and is preferably 20,000 to 3,000,000. The value of the weight average molecular weight (Mw) is a value in the case of measuring by a gel permeation chromatography (GPC) method (polystyrene standard). Measurement by such a method is performed, for example, in a high-speed GPC device "HLC-8120GPC" manufactured by Tosoh Corporation, and a high-speed column "TSK gurd column H _XL -H", "TSK Gel GMH _XL ", and "TSK Gel G2000 H. _XL " (above, all manufactured by Tosoh Corporation) in this order was used, and the detector was performed as a differential refractometer under conditions of a column temperature: 40°C and a liquid feed rate: 1.0 mL/min.

In addition, for the convenience of distinguishing from the curable polymer (AB) described later, the polymer component (A) does not have a curing function functional group described later.

As the polymer component (A), an acrylic polymer, a polyester, a phenoxy resin (for convenience to distinguish from the curable polymer (AB) described later, limited to those having no epoxy group), polycarbonate, polyether, polyurethane, polysiloxane , Rubber-based polymers, etc. can be used. In addition, two or more of these may be bonded, for example, an acrylic urethane resin obtained by reacting an acrylic polyol which is an acrylic polymer having a hydroxyl group with a urethane prepolymer having an isocyanate group at the molecular terminal. Moreover, you may use in combination of 2 or more types of these, including a polymer in which 2 or more types are bonded.

(A1) acrylic polymer

As the polymer component (A), an acrylic polymer (A1) is preferably used. The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably in the range of -60 to 50°C, more preferably -50 to 40°C, still more preferably -40 to 30°C. When the glass transition temperature of the acrylic polymer (A1) is high, the adhesiveness of the resin film forming layer decreases, making it impossible to transfer to the work, or the resin film obtained by curing the resin film forming layer or the resin film forming layer from the work after transfer, etc. There are cases that cause problems. In addition, when the glass transition temperature of the acrylic polymer (A1) is low, the peeling force between the resin film forming layer and the supporting sheet increases, and a defective transfer of the resin film forming layer may occur.

It is preferable that the weight average molecular weight of the acrylic polymer (A1) is 100,000 to 1,500,000. When the weight average molecular weight of the acrylic polymer (A1) is high, the adhesiveness of the resin film forming layer decreases, making it impossible to transfer to the work, or problems such as peeling of the resin film forming layer or the resin film from the work after transfer may occur. have. In addition, when the weight average molecular weight of the acrylic polymer (A1) is low, the adhesiveness between the resin film forming layer and the supporting sheet is increased, and poor transfer of the resin film forming layer may occur.

The acrylic polymer (A1) contains a (meth)acrylic acid ester in at least a constituting monomer.

Examples of (meth)acrylic acid esters include alkyl (meth)acrylates having 1 to 18 carbon atoms in the alkyl group, specifically methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and butyl (meth)acrylate. ) Acrylate, 2-ethylhexyl (meth)acrylate, etc.; (Meth)acrylate having a cyclic skeleton, specifically cycloalkyl (meth)acrylate, benzyl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclophene Tenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, imide (meth)acrylate, etc. are mentioned. In addition, among those exemplified as a monomer having a hydroxyl group, a monomer having a carboxyl group, and a monomer having an amino group described later, a (meth)acrylic acid ester can be illustrated.

In addition, in this specification, (meth)acrylic may be used in a meaning including both acrylic and methacrylic.

As the monomer constituting the acrylic polymer (A1), a monomer having a hydroxyl group may be used. By using such a monomer, when a hydroxyl group is introduced into the acrylic polymer (A1) and the resin film forming layer separately contains the energy ray-curable component (B2), the compatibility between this and the acrylic polymer (A1) is improved. Examples of the monomer having a hydroxyl group include (meth)acrylic acid ester having a hydroxyl group such as 2-hydroxyethyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate; N-methylol (meth)acrylamide, etc. are mentioned.

As the monomer constituting the acrylic polymer (A1), a monomer having a carboxyl group may be used. By using such a monomer, when a carboxyl group is introduced into the acrylic polymer (A1) and the resin film forming layer separately contains the energy ray-curable component (B2), the compatibility between this and the acrylic polymer (A1) is improved. Examples of the monomer having a carboxyl group include (meth)acrylic acid esters having a carboxyl group such as 2-(meth)acryloyloxyethylphthalate and 2-(meth)acryloyloxypropylphthalate; (Meth)acrylic acid, maleic acid, fumaric acid, itaconic acid, etc. are mentioned. When an epoxy-based thermosetting component is used as the curable component (B) described later, since the carboxyl group and the epoxy group in the epoxy-based thermosetting component react, the amount of the monomer having a carboxyl group is preferably small.

As the monomer constituting the acrylic polymer (A1), a monomer having an amino group may be used. Examples of such a monomer include (meth)acrylic acid esters having an amino group such as monoethylamino (meth)acrylate.

As a monomer constituting the acrylic polymer (A1), vinyl acetate, styrene, ethylene, α-olefin, etc. may be used in addition.

The acrylic polymer (A1) may be crosslinked. Crosslinking is carried out by the acrylic polymer (A1) before crosslinking has a crosslinkable functional group such as a hydroxyl group, and by adding a crosslinking agent to the composition for forming the resin film forming layer, the crosslinkable functional group and the functional group possessed by the crosslinking agent react. By crosslinking the acrylic polymer (A1), it becomes possible to adjust the cohesive force of the resin film forming layer.

As a crosslinking agent, an organic polyvalent isocyanate compound, an organic polyvalent imine compound, etc. are mentioned.

As the organic polyvalent isocyanate compound, an aromatic polyvalent isocyanate compound, an aliphatic polyvalent isocyanate compound, an alicyclic polyvalent isocyanate compound, and a trimer of these organic polyvalent isocyanate compounds, and a terminal isocyanate urethane prepolymer obtained by reacting these organic polyvalent isocyanate compounds with polyol compounds, Can be mentioned.

Specifically as an organic polyvalent isocyanate compound, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4' -Diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclo And hexylmethane-2,4'-diisocyanate, lysine diisocyanate, and polyhydric alcohol adducts thereof.

Specific examples of the organic polyimine compound include N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxyamide), trimethylolpropane-tri-β-aziridinylpropionate, tetramethyl Olmethane-tri-β-aziridinylpropionate and N,N'-toluene-2,4-bis(1-aziridinecarboxyamide)triethylene melamine.

The crosslinking agent is used in a ratio of usually 0.01 to 20 parts by mass, preferably 0.1 to 10 parts by mass, more preferably 0.5 to 5 parts by mass, based on 100 parts by mass of the acrylic polymer (A1) before crosslinking.

When the content of the component constituting the resin film forming layer is determined based on the content of the polymer component (A), and when the polymer component (A) is a crosslinked acrylic polymer, the content as the reference is the acrylic polymer before crosslinking. It is the content of the polymer.

(A2) Non-acrylic resin

In addition, as the polymer component (A), polyester, phenoxy resin (limited to those having no epoxy group for convenience of distinguishing from the curable polymer (AB) described later), polycarbonate, polyether, polyurethane, polysiloxane, rubber-based One type alone or a combination of two or more types of non-acrylic resins (A2) selected from polymers or two or more of them bonded may be used. As such a resin, it is preferable that the weight average molecular weight is 20,000 to 100,000, and it is more preferable that it is 20,000 to 80,000.

The glass transition temperature of the non-acrylic resin (A2) is preferably -30 to 150°C, more preferably -20 to 120°C.

When the non-acrylic resin (A2) is used in combination with the above-described acrylic polymer (A1), when transferring the resin film forming layer to the package, delamination between the supporting sheet and the resin film forming layer can be easily performed, and further The resin film-forming layer follows the transfer surface, and the generation of voids and the like can be suppressed.

When using the non-acrylic resin (A2) in combination with the above-described acrylic polymer (A1), the content of the non-acrylic resin (A2) is the mass ratio of the non-acrylic resin (A2) and the acrylic polymer (A1) (A2:A1) ), it is usually in the range of 1:99 to 60:40, and preferably 1:99 to 30:70. When the content of the non-acrylic resin (A2) is in this range, the above effect can be obtained.

(B) curable component

The curable component (B) is added for the purpose of imparting curability to the resin film forming layer. As the curable component (B), a thermosetting component (B1) or an energy ray curable component (B2) can be used. Moreover, you may use them in combination. The thermosetting component (B1) contains at least a compound having a functional group reacting by heating. Moreover, the energy ray-curable component (B2) contains a compound (B21) having a functional group reacting by irradiation with energy rays, and is polymerized and cured when irradiated with energy rays such as ultraviolet rays and electron rays. The functional groups of these curable components react with each other to form a three-dimensional network structure, whereby curing is realized. Since the curable component (B) is used in combination with the polymer component (A), it is usually its weight average molecular weight from the viewpoint of suppressing the viscosity of the coating composition for forming the resin film forming layer and improving handling properties. (Mw) is 10,000 or less, and it is preferable that it is 100 to 10,000.

(B1) thermosetting component

As the thermosetting component, for example, an epoxy thermosetting component is preferred.

The epoxy-based thermosetting component contains a compound (B11) having an epoxy group, and a combination of the compound (B11) having an epoxy group and a thermal curing agent (B12) is preferably used.

(B11) compound having an epoxy group

As the compound (B11) having an epoxy group (hereinafter, it may be referred to as "epoxy compound (B11)"), a conventionally known compound can be used. Specifically, polyfunctional epoxy resin, bisphenol A diglycidyl ether or hydrogenated product thereof, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, Epoxy compounds having two or more functionalities in a molecule, such as a bisphenol F type epoxy resin and a phenylene skeleton type epoxy resin, are mentioned. These can be used alone or in combination of two or more.

In the case of using the epoxy compound (B11), the epoxy compound (B11) is preferably contained in an amount of 1 to 1500 parts by mass, and more preferably 3 parts by mass per 100 parts by mass of the polymer component (A) in the resin film forming layer. It contains-1200 parts by mass. When there are few epoxy compounds (B11), there exists a tendency for the adhesiveness after hardening of a resin film forming layer to fall. Moreover, when there is a large amount of the epoxy compound (B11), the peeling force between the resin film forming layer and the supporting sheet is increased, and a defective transfer of the resin film forming layer may occur.

(B12) thermal curing agent

The thermal curing agent (B12) functions as a curing agent for the epoxy compound (B11). Preferred thermal curing agents include compounds having two or more functional groups capable of reacting with an epoxy group per molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, and an acid anhydride. Among these, a phenolic hydroxyl group, an amino group, an acid anhydride, etc. are preferable, and a phenolic hydroxyl group and an amino group are more preferable.

Specific examples of the phenolic curing agent include polyfunctional phenolic resins, biphenols, novolac phenolic resins, dicyclopentadiene phenolic resins, xyloxy phenolic resins, and aralkylphenolic resins.

DICY (dicyandiamide) is mentioned as a specific example of an amine type hardening agent.

These can be used alone or in combination of two or more.

The content of the thermal curing agent (B12) is preferably 0.1 to 500 parts by mass, more preferably 1 to 200 parts by mass, based on 100 parts by mass of the epoxy compound (B11). When the content of the thermal curing agent is small, the adhesiveness after curing tends to decrease.

(B13) hardening accelerator

A curing accelerator (B13) may be used in order to adjust the speed of thermal curing of the resin film forming layer. The curing accelerator (B13) is particularly preferably used when an epoxy-based thermosetting component is used as the thermosetting component (B1).

Preferred curing accelerators include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5 -Imidazoles such as hydroxymethylimidazole; Organic phosphines such as tributylphosphine, diphenylphosphine, and triphenylphosphine; And tetraphenyl boron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine tetraphenylborate. These may be used alone or in combination of two or more.

The curing accelerator (B13) is contained in an amount of preferably 0.01 to 10 parts by mass, more preferably 0.1 to 1 part by mass, based on 100 parts by mass of the total amount of the epoxy compound (B11) and the thermal curing agent (B12). By containing the curing accelerator (B13) in an amount within the above range, it has excellent adhesion even when exposed to high temperature and high humidity, and high reliability can be achieved even when exposed to severe reflow conditions. By adding the curing accelerator (B13), the adhesiveness of the resin film forming layer after curing can be improved. Such an action becomes stronger as the content of the curing accelerator (B13) increases.

(B2) Energy ray-curable component

When the resin film forming layer contains an energy ray-curable component, it is possible to cure the resin film forming layer without performing a thermal curing step that requires a large amount of energy and a long time. Thereby, reduction in manufacturing cost can be achieved.

As the energy ray-curable component, a compound (B21) having a functional group reacting by irradiation with energy rays may be used alone, but a compound (B21) having a functional group reacting by irradiation with an energy ray and a photopolymerization initiator (B22) are combined It is desirable to use one.

(B21) Compound having a functional group reacting by irradiation with energy rays

Specific examples of the compound (B21) having a functional group reacting by irradiation with energy rays (hereinafter, referred to as "energy ray reactive compound (B21)") are specifically trimethylolpropane triacrylate and pentaerythritol triacrylate. Rate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, etc. Acrylate compounds, and as acrylate compounds having a polymerization structure such as acrylate compounds such as oligoester acrylate, urethane acrylate oligomer, epoxy acrylate, polyether acrylate and itaconic acid oligomer. , And relatively low molecular weight ones. Such a compound has at least one polymerizable double bond in the molecule.

In the case of using the energy ray-reactive compound (B21), the resin film-forming layer contains the energy ray-reactive compound (B21), preferably 1 to 1500 parts by mass, more preferably with respect to 100 parts by mass of the polymer component (A). It contains 3 to 1200 parts by mass.

(B22) photoinitiator

By combining the photopolymerization initiator (B22) with the energy ray-reactive compound (B21), the polymerization and curing time can be shortened and the amount of light irradiation can be reduced.

As such a photoinitiator (B22), specifically, benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin Methyl benzoate, benzoin dimethyl ketal, 2,4-diethyl thioxanthone, α-hydroxycyclohexylphenyl ketone, benzyl diphenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, benzyl, Dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone, 2,4,6-trimethylbenzoyldiphenylphos And pin oxide and β-chloranthraquinone. Photoinitiator (B22) can be used individually by 1 type or in combination of 2 or more types.

The blending ratio of the photoinitiator (B22) is preferably 0.1 to 10 parts by mass, and more preferably 1 to 5 parts by mass based on 100 parts by mass of the energy ray-reactive compound (B21).

If the blending ratio of the photopolymerization initiator (B22) is less than 0.1 parts by mass, satisfactory curability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, a residue that does not contribute to photopolymerization is generated, causing a problem. There may be a cause.

(Second binder component)

By containing the curable polymer component (AB), the second binder component imparts sheet shape retention and curability to the resin film forming layer.

(AB) Curable polymer component

The curable polymer component is a polymer having a curable functional group. The curing functional functional group is a functional group that can react with each other to form a three-dimensional network structure, and includes a functional group that reacts by heating and a functional group that reacts with energy rays.

The curable functional group may be added to the unit of the continuous structure serving as the skeleton of the curable polymer (AB), or may be added to the terminal. When the curable functional group is added to the unit of the continuous structure serving as the skeleton of the curable polymer component (AB), the curable functional group may be added to the side chain or may be added directly to the main chain. The weight average molecular weight (Mw) of the curable polymer component (AB) is usually 20,000 or more from the viewpoint of achieving the purpose of imparting sheet shape retention to the resin film forming layer.

An epoxy group is mentioned as a functional group which reacts by heating. Examples of the curable polymer component (AB) having an epoxy group include a high molecular weight epoxy group-containing compound and a phenoxy resin having an epoxy group. A high molecular weight epoxy group-containing compound is disclosed in, for example, Japanese Laid-Open Patent Publication 2001-261789.

Moreover, as a polymer similar to the above-mentioned acrylic polymer (A1), what was superposed|polymerized using a monomer which has an epoxy group as a monomer (epoxy group-containing acrylic polymer) may be sufficient. As a monomer which has an epoxy group, (meth)acrylic acid ester which has a glycidyl group, such as glycidyl (meth)acrylate, is mentioned, for example.

In the case of using an epoxy group-containing acrylic polymer, its preferable aspect is the same as that of the acrylic polymer (A1) other than the epoxy group.

When using the curable polymer component (AB) having an epoxy group, a thermal curing agent (B12) or a curing accelerator (B13) may be used in combination as in the case of using an epoxy-based thermal curing component as the curable component (B). .

As a functional group reacting by an energy ray, a (meth)acryloyl group is mentioned. As the curable polymer component (AB) having a functional group reacting with energy rays, a high molecular weight one can be used as an acrylate compound having a polymerized structure such as polyether acrylate.

In addition, for example, in a raw material polymer having a functional group X such as a hydroxyl group in the side chain, a functional group Y capable of reacting with the functional group X (for example, when the functional group X is a hydroxyl group, an isocyanate group, etc.) and energy ray irradiation You may use a polymer prepared by reacting a low molecular compound having a reactive functional group.

In this case, when the raw material polymer corresponds to the above-described acrylic polymer (A1), a preferred aspect of the raw material polymer is the same as that of the acrylic polymer (A1).

In the case of using the curable polymer component (AB) having a functional group reacting with energy rays, a photoinitiator (B22) may be used in combination as in the case of using the energy ray curable component (B2).

The second binder component may contain the polymer component (A) or the curable component (B) described above in addition to the curable polymer component (AB).

In addition to the binder component, the following components may be contained in the resin film forming layer.

(C) inorganic filler

The resin film formation layer may contain an inorganic filler (C). By blending the inorganic filler (C) in the resin film forming layer, it becomes possible to adjust the coefficient of thermal expansion in the resin film after curing, and improve the reliability of the semiconductor device by optimizing the coefficient of thermal expansion of the resin film after curing for the package. I can. Moreover, it becomes possible to reduce the hygroscopicity of the resin film after curing.

In addition, when the resin film obtained by curing the resin film forming layer in the present invention functions as a protective film, the inorganic filler (C) is exposed to the portion cut by the laser light by performing laser marking on the protective film, and the reflected light is Because it diffuses, it shows a color close to white. Therefore, when the resin film forming layer contains the colorant (D) described later, there is an effect that a difference in contrast is obtained in a portion different from that of the laser marking portion, and printing becomes clear.

Preferred inorganic fillers include powders such as silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide and boron nitride, beads obtained by spheroidizing them, single crystal fibers and glass fibers. Among these, a silica filler and an alumina filler are preferable. The inorganic filler (C) can be used alone or in combination of two or more.

In order to obtain the above-described effect more reliably, in the range of the content of the inorganic filler (C), with respect to 100 parts by mass of the total solids constituting the resin film forming layer, preferably 1 to 80 parts by mass, more preferably It is 20 to 75 parts by mass, particularly preferably 40 to 70 parts by mass.

(D) colorant

The resin film forming layer may be transparent. Moreover, you may mix|blend and color the coloring agent (D) in the resin film formation layer. By blending the colorant, there is an effect that marks such as letters and symbols are easily recognized when the resin film is imprinted by means such as laser marking. That is, in the package in which the resin film is formed, an article number or the like is usually printed on the surface of the resin film by a laser marking method (a method of cutting the surface of the protective film with laser light and performing printing), but the resin film contains the colorant (D), By the laser light of the film, a difference in contrast between the cut-off portion and the non-cut portion is sufficiently obtained, and visibility is improved.

As the colorant, organic or inorganic pigments and dyes are used. Among these, a black pigment is preferable from the viewpoint of shielding electromagnetic waves and infrared rays. As the black pigment, carbon black, iron oxide, manganese dioxide, aniline black, activated carbon and the like are used, but are not limited thereto. From the viewpoint of enhancing the reliability of the semiconductor device, carbon black is particularly preferred. The coloring agent (D) may be used individually by 1 type, and may be used in combination of 2 or more types. In addition, when the inspection of the semiconductor device is performed by infrared rays, an infrared transmissive colorant may be used.

The blending amount of the coloring agent (D) is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, particularly preferably 1 to 15 parts by mass, based on 100 parts by mass of the total solids constituting the resin film forming layer. to be.

(E) coupling agent

A coupling agent (E) having a functional group reacting with an inorganic substance and a functional group reacting with an organic functional group may be used in order to improve the adhesion of the resin film forming layer to the package, adhesion, and/or cohesiveness of the resin film. Further, by using the coupling agent (E), the water resistance can be improved without impairing the heat resistance of the resin film obtained by curing the resin film forming layer. Examples of such a coupling agent include a titanate coupling agent, an aluminate coupling agent, and a silane coupling agent. Among these, a silane coupling agent is preferable.

As the silane coupling agent, a functional group that reacts with the organic functional group is a group that reacts with a functional group possessed by the polymer component (A), the curable component (B) or the curable polymer component (AB), and a silane coupling agent is preferably used.

Such silane coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and γ-(metha Acryloxypropyl)trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-aminopropylmethyl Diethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis(3 -Triethoxysilylpropyl)tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazolesilane, and the like. These may be used alone or in combination of two or more.

The silane coupling agent is usually 0.1 to 20 parts by mass, preferably 0.2 to 10 parts by mass, more preferably based on 100 parts by mass of the total of the polymer component (A), the curable component (B) and the curable polymer component (AB). Is contained in a ratio of 0.3 to 5 parts by mass. If the content of the silane coupling agent is less than 0.1 parts by mass, the above effect may not be obtained, and if the content of the silane coupling agent exceeds 20 parts by mass, it may cause outgassing.

(F) general purpose additive

In addition to the above, various additives may be blended in the resin film forming layer as necessary. As various additives, a leveling agent, a plasticizer, an antistatic agent, an antioxidant, an ion scavenger, a gettering agent, a chain transfer agent, a peeling agent, etc. are mentioned.

The resin film forming layer is obtained using, for example, a composition obtained by mixing each of the components in an appropriate ratio (resin film forming composition). The composition for forming a resin film may be diluted in advance with a solvent, or may be added to the solvent at the time of mixing. Moreover, when using the composition for resin film formation, you may dilute with a solvent.

Examples of such a solvent include ethyl acetate, methyl acetate, diethyl ether, dimethyl ether, acetone, methyl ethyl ketone, acetonitrile, hexane, cyclohexane, toluene, heptane, and the like.

The resin film forming layer has initial adhesiveness and curability, and in an uncured state, it is easily adhered by pressing the chip group package at room temperature or under heating. Moreover, you may heat the resin film formation layer when pressing. And finally, after curing, a resin film having high impact resistance can be provided, the adhesive strength is excellent, and sufficient reliability can be maintained even under severe high temperature and high humidity conditions. In addition, the resin film forming layer may have a single layer structure or a multilayer structure.

The thickness of the resin film forming layer is preferably 1 to 100 µm, more preferably 2 to 90 µm, and particularly preferably 3 to 80 µm. By setting the thickness of the resin film forming layer in the above range, the resin film forming layer functions as a highly reliable protective film or adhesive.

[Ring frame holding means]

In the support sheet with a resin film forming layer of the second aspect, the support sheet 21 is made of an adhesive sheet, and the adhesive layer 21B exposed to the outer peripheral portion of the resin film forming layer 22 functions as a ring frame holding means.

In the first aspect, the ring frame holding means 13 is formed on the outer periphery of the surface of the resin film forming layer, and in the third aspect, the ring frame holding means 33 is formed so as to rotate the resin film forming layer. As the ring frame holding means, an adhesive member composed of an adhesive layer alone, an adhesive member composed of a base material and an adhesive layer, or a double-sided adhesive member having a core material can be used.

The ring frame holding means 13 and 33 have a substantially rectangular outer circumferential shape, and have a rectangular cavity (inner opening) in the inner circumferential portion. Outwardly, it has a size that can be fixed to the ring frame. The inner opening is made larger than that of the chip group package. In addition, the ring frame is usually a metal or plastic molded body.

When the pressure-sensitive adhesive member composed of the pressure-sensitive adhesive layer alone is used as the ring frame holding means, it is not particularly limited, but is preferably made of an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, or a silicone pressure-sensitive adhesive. Among these, acrylic pressure-sensitive adhesives are preferred in consideration of re-peelability from the ring frame. Moreover, the said adhesive may be used individually, and 2 or more types may be mixed and used for it.

The thickness of the pressure-sensitive adhesive layer constituting the ring frame holding means is preferably 2 to 20 µm, more preferably 3 to 15 µm, and still more preferably 4 to 10 µm. When the thickness of the pressure-sensitive adhesive layer is less than 2 µm, sufficient adhesiveness may not be expressed. When the thickness of the pressure-sensitive adhesive layer exceeds 20 µm, when peeling from the ring frame, residues of the pressure-sensitive adhesive remain on the ring frame and contaminate the ring frame.

When the pressure-sensitive adhesive member composed of the base material and the pressure-sensitive adhesive layer is used as the ring frame holding means, the ring frame is attached to the pressure-sensitive adhesive layer constituting the pressure-sensitive adhesive member.

The pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer is the same as the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer in the pressure-sensitive adhesive member composed of the pressure-sensitive adhesive layer alone. Moreover, the thickness of the pressure-sensitive adhesive layer is also the same.

The base material constituting the ring frame holding means is not particularly limited, but for example, a polyethylene film, a polypropylene film, an ethylene-vinyl acetate copolymer film, an ethylene-(meth)acrylic acid copolymer film, and an ethylene-(meth)acrylic acid And polyolefin films such as ester copolymer films and ionomer resin films, polyvinyl chloride films, and polyethylene terephthalate films. Among these, in consideration of expandability, a polyethylene film and a polyvinyl chloride film are preferable, and a polyvinyl chloride film is more preferable.

The thickness of the substrate constituting the ring frame holding means is preferably 5 to 200 µm, more preferably 10 to 150 µm, and still more preferably 20 to 100 µm.

In addition, when the double-sided adhesive member having a core material is used as the ring frame holding means, the double-sided adhesive member includes a core material, a laminating adhesive layer formed on one side of the core material, and a fixing adhesive layer formed on the other surface. Consists of The pressure-sensitive adhesive layer for lamination is the pressure-sensitive adhesive layer on the side to be affixed to the resin film forming layer, and the pressure-sensitive adhesive layer for fixing is the pressure-sensitive adhesive layer on the side to be affixed to the ring frame.

As the core material of the double-sided adhesive member, the same as the base material of the adhesive member can be mentioned. Among these, a polyolefin film and a plasticized polyvinyl chloride film are preferable in consideration of expandability.

The thickness of the core material is usually 5 to 200 µm, preferably 10 to 150 µm, and more preferably 20 to 100 µm.

The pressure-sensitive adhesive layer for lamination and the pressure-sensitive adhesive layer for fixing of the double-sided adhesive member may be a layer made of the same pressure-sensitive adhesive or a layer made of different pressure-sensitive adhesives. It is appropriately selected so that the adhesive force between the fixed pressure-sensitive adhesive layer and the ring frame is smaller than that of the resin film forming layer and the laminating pressure-sensitive adhesive layer. As such an adhesive, an acrylic adhesive, a rubber adhesive, and a silicone adhesive are mentioned, for example. Among these, acrylic pressure-sensitive adhesives are preferred in consideration of re-peelability from the ring frame. The pressure-sensitive adhesive that forms the pressure-sensitive adhesive layer for fixing may be used alone or in combination of two or more. The same applies to the laminated pressure-sensitive adhesive layer.

The thickness of the pressure-sensitive adhesive layer for lamination and the pressure-sensitive adhesive layer for fixing is the same as the thickness of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive member.

By providing the ring frame holding means, it becomes easy to adhere the supporting sheet with the resin film forming layer to a jig such as a ring frame.

[Long peeling sheet]

The elongate release sheets 14, 24, and 34 serve as a carrier film at the time of use of the sheet for forming a resin film, and a release sheet exemplified as the support sheet described above can be used.

The surface tension of the surface of the elongate release sheet in contact with the resin film forming layer is preferably 40 mN/m or less, more preferably 37 mN/m or less, and particularly preferably 35 mN/m or less. The lower limit is usually about 25 mN/m. However, in the case of using a release sheet as a support sheet, it is preferable to use the long release sheet side as a light release type.

The specific examples of the long release sheet, the release agent, the release treatment method, and the like are the same as the release sheet described as an example of the support sheet described above.

The thickness of the elongate release sheet is not particularly limited, but is preferably 30 µm or more, and more preferably 50 to 200 µm. When the release film is less than 30 µm, when the sheet for forming a resin film is wound in a roll shape, a wound may occur in the resin film forming layer.

The use of the winding body of such a long laminated sheet will be briefly described with reference to Figs. 6A and 6B, taking the long laminated sheet according to the first embodiment as an example.

First, the elongate laminated sheet 2 is sent out from the winding body 1, and the supporting sheet 10 with the resin film forming layer is peeled from the elongated release sheet 14 while being bent at a sharp angle by the fill plate 40. , The support sheet 10 with a resin film forming layer is affixed to the chip group package 44. At the same time, the ring frame 45 is fixed to the ring frame holding means 13. The excess sheets (the peeling sheet 14 and the auxiliary sheet 15) are wound up via guide rollers 42 and 43, and are recovered as the waste tape 46. In addition, in Fig. 6A, the auxiliary sheet 15 is omitted. Subsequently, the resin film forming layer 12 and the chip group package 44 are completely cut, and the support sheet 11 is diced so as not to cut completely. After dicing, the divided package is peeled off from the support sheet 11 together with the resin film forming layer 12 to obtain a package to which the resin film forming layer has been transferred. When using the resin film forming layer as a protective film, the resin film forming layer may be cured prior to dicing to form a protective film, or may be cured after dicing. In addition, when the resin film forming layer is used as the adhesive layer, the package is affixed on a predetermined adherend through the resin film forming layer, and the resin film forming layer is cured if necessary.

Such a process is carried out according to the method described in WO2015/146254 relating to the formation of a protective film on a semiconductor wafer or chip or transfer of an adhesive layer.

According to the winding body of the long laminated sheet of the present invention, since the width portion of the auxiliary sheet does not overlap at the point (area of use) where the chip group package of the resin film forming layer is affixed, windings do not occur in the use region of the resin film forming layer. . Moreover, even if the width|variety part and the resin film formation layer are overlapped, the wound generated in the resin film formation layer is small, and adhesiveness is not affected. For this reason, the chip group package can be stably affixed, and the thickness of the obtained resin film also becomes uniform.

1, 3, 5: winding body
2, 4, 6: long laminated sheet
10: Support sheet with resin film forming layer according to the first aspect
11: support sheet
12: resin film forming layer
13: ring frame holding means
14: long peeling sheet
15: auxiliary sheet
20: Support sheet with resin film forming layer according to the second aspect
21: support sheet
21A: description
21B: adhesive layer
22: resin film forming layer
23: ring frame holding means
24: long peeling sheet
25: auxiliary sheet
30: Support sheet with resin film forming layer according to the third aspect
31: support sheet
32: resin film forming layer
33: ring frame holding means
34: long peeling sheet
35: auxiliary sheet
40: fill plate
41, 42, 43: guide roller
44: chip group package
45: ring frame
46: waste tape

Claims (1)

Having a substantially rectangular support sheet, a substantially rectangular resin film forming layer formed on the support sheet, and having a substantially rectangular ring frame holding means for holding the ring frame in a region surrounding the resin film forming layer in plan view. A supporting sheet with a resin film forming layer,
Including a long release sheet,
Long auxiliary sheets are successively stacked at both ends of the release sheet in the width direction on the release treatment surface,
A winding body formed by winding up a long laminated sheet formed by independently attaching a plurality of support sheets with a resin film forming layer along the longitudinal direction of the release sheet so as to be peelable, inside the width direction on the release treatment surface of the release sheet,
The distance between the resin film forming layer and the outer end of the auxiliary sheet as viewed in plan from the resin film forming layer side after removal of the release sheet is W1,
When the width of the auxiliary sheet in the widest portion of the auxiliary sheet viewed from the above plane is set to W2, the winding body of the long laminated sheet is W2/W1≦1.6.

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