JP6574787B2 - Sheet laminate for resin film formation - Google Patents

Description

  The present invention relates to a resin film forming sheet laminate in which a resin film forming sheet can be easily attached to an adherend.

  2. Description of the Related Art In recent years, semiconductor devices have been manufactured using a so-called “face down” mounting method. In the face-down method, a semiconductor chip (hereinafter simply referred to as “chip”) having electrodes such as bumps on a circuit surface is used, and the electrodes are bonded to a substrate. For this reason, the surface (chip back surface) opposite to the circuit surface of the chip may be exposed.

  The exposed back surface of the chip may be protected by an organic film. Conventionally, a chip having a protective film made of an organic film is obtained by applying a liquid resin to the back surface of a wafer by spin coating, drying and curing, and cutting the protective film together with the wafer. However, since the thickness accuracy of the protective film formed in this way is not sufficient, the product yield may be lowered.

  In order to solve such a problem, a protective film forming sheet in which a film for forming a semiconductor back surface protective film is laminated on an adhesive layer of an adhesive sheet having an adhesive layer may be used.

  In addition, a semiconductor wafer manufactured in a large diameter state may be cut and separated (diced) into element pieces (semiconductor chips) and then transferred to a bonding process which is the next process. At this time, the semiconductor wafer is subjected to dicing, cleaning, drying, expanding, and pick-up processes in a state of being adhered to the adhesive sheet in advance, and then transferred to the next bonding process.

  Among these processes, various dicing / die bonding adhesive sheets having both a wafer fixing function and a die bonding function have been proposed in order to simplify the processes of the pickup process and the bonding process. For example, by using the adhesive sheet, it is possible to obtain a semiconductor chip having an adhesive layer attached to the back surface, and direct die bonding such as between an organic substrate and a chip, between a lead frame and a chip, or between a chip and a chip is possible. It becomes.

  Patent Document 1 (Japanese Patent No. 46777758) includes a release substrate, a substrate film, and an adhesive layer disposed between the release substrate and the substrate film. Discloses a die bond dicing sheet in which a cut portion having a predetermined depth is formed from the surface on the adhesive layer side along the outer periphery of the adhesive layer.

  Further, in Patent Document 2 (Japanese Patent No. 5546985), a dicing tape with an adhesive layer in which an adhesive layer is laminated on a dicing tape is used with the adhesive layer as a bonding surface, with a predetermined interval. A film for manufacturing a semiconductor device is disclosed, which is laminated on a separator, and in which a notch of a predetermined depth is formed along the outer periphery of the dicing tape.

Japanese Patent No. 46777758 Patent No. 5546985

  In the manufacturing process of a semiconductor device, a resin film forming sheet having a resin film forming layer such as an adhesive layer or an adhesive layer is attached to an adherend such as a semiconductor wafer. However, in the process of applying the resin film forming sheet to the adherend, the resin film forming sheet becomes unusable when the resin film forming layer is not smoothly fed out from the release substrate (separator). was there. That is, the resin film forming layer is in close contact with the release sheet, and the resin film forming sheet may not be attached to the adherend.

  The present invention aims to solve the above problems. That is, an object of the present invention is to provide a resin film-forming sheet laminate in which the resin film-forming sheet can be easily fed out from the release sheet and can be stably attached to the adherend. To do.

  As a result of diligent research to achieve the above object, the inventors of the present invention formed a slit in the outer peripheral portion of the resin film-forming layer formed when producing a resin film-forming sheet laminate. It has been found that this is a cause of hindering the feeding of the resin film forming layer from the sheet. In other words, in the manufacturing process of the resin film forming sheet laminate, when the release sheet is cut when the resin film forming layer is die-cut, the resin film forming layer bites into the cut portion of the release sheet, and the release sheet It was found that peeling did not occur smoothly at the interface between the resin layer and the resin film forming layer. Based on this knowledge, it discovered that the said subject could be solved by using the sheet | seat laminated body for resin film formation which has a specific structure, and came to complete this invention.

The present invention includes the following gist.
[1] A release sheet is laminated on the resin film forming layer side of the resin film forming sheet including the support sheet and the resin film forming layer,
The release sheet is a sheet laminate for resin film formation that does not have a cut portion along the outer peripheral portion of the resin film formation layer from the surface on the resin film formation layer side.

[2] The support sheet has a cut portion along the outer peripheral portion of the resin film forming layer from the surface on the resin film forming layer side,
The sheet laminate for forming a resin film according to [1], wherein the cut depth of the cut portion is 0 μm or more and 2/3 or less of the thickness of the support sheet.

[3] The resin film-forming sheet laminate according to [1] or [2], wherein the breaking elongation of the resin film-forming layer is 1000% or less and the breaking strength is 10 N / mm ² or less.

[4] A step of punching the first release sheet of the laminate including the support sheet and the first release sheet,
Removing the stamped first release sheet to obtain a first laminate having an opening;
A process of attaching the resin film forming layer to the opening side of the first laminate, cleaving the resin film forming layer along the shape of the opening, and leaving the resin film forming layer in the shape of the opening on the support sheet ,
A step of obtaining a second laminate by laminating a second release sheet on the resin film forming layer side in the shape of the opening; and
The manufacturing method of the sheet | seat laminated body for resin film formation including the process of die-cutting a 2nd laminated body from the support sheet side.

  According to the resin film forming sheet laminate of the present invention, when the resin film forming sheet is fed out from the release sheet, the resin film forming sheet is smoothly fed out.

FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 a to a semiconductor wafer 32. FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 a to a semiconductor wafer 32. FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 a to a semiconductor wafer 32. FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 a to a semiconductor wafer 32. The top view of the sheet | seat laminated body for resin film formation which concerns on this invention is shown. The schematic cross section (sheet | seat laminated body for resin film formation of a 1st aspect) at the time of cut | disconnecting the sheet laminated body for resin film formation shown in FIG. 2 along an AA line is shown. The schematic cross section of the sheet | seat laminated body for resin film formation of a 2nd aspect is shown. The manufacturing process of the sheet | seat laminated body for resin film formation of a 1st aspect is shown. The manufacturing process of the sheet | seat laminated body for resin film formation of a 1st aspect is shown. The manufacturing process of the sheet | seat laminated body for resin film formation of a 1st aspect is shown. The manufacturing process of the sheet | seat laminated body for resin film formation of a 1st aspect is shown. The manufacturing process of the sheet | seat laminated body for resin film formation of a 1st aspect is shown. The manufacturing process of the sheet | seat laminated body for resin film formation of a 1st aspect is shown. The manufacturing process of the sheet | seat laminated body for resin film formation of a 1st aspect is shown.

Hereinafter, the detail of the sheet | seat laminated body for resin film formation which concerns on this invention is demonstrated.
The resin film-forming sheet laminate according to the present invention is formed by laminating a release sheet on the resin film-forming layer side of a resin film-forming sheet including a support sheet and a resin film-forming layer. And a peeling sheet does not have a notch part along the outer peripheral part of a resin film formation layer from the surface by the side of the resin film formation layer. In the manufacturing process of the resin film forming sheet laminate, when a cut portion is formed in the release sheet along the outer peripheral portion of the resin film forming layer from the surface on the resin film forming layer side, the resin film forming layer is moved to the outer peripheral portion. And bite into the release sheet. As a result, the step of applying the resin film forming sheet 10 of the resin film forming sheet laminate 100 shown in FIGS. 1 a to 1 d to the adherend 32 (hereinafter referred to as “adherent attachment step”). In other words, it is difficult to feed out the resin film forming layer sheet 10 from the release sheet 13. This problem arises when the resin film forming sheet of the resin film forming sheet laminate is applied to the adherend without using the adherend attaching process shown in FIGS. This also occurs when the release sheet of the film-forming sheet laminate is removed and the resin film-forming sheet is attached to an adherend).

  According to the resin film forming sheet laminate of the present invention, in the manufacturing process of the resin film forming sheet laminate, the resin film forming layer side is cut into the release sheet from the surface on the resin film forming layer side along the outer periphery of the resin film forming layer. Since the part is not formed, the resin film forming layer does not bite into the cut portion of the release sheet, and in the adherend pasting step shown in FIGS. 1a to 1d, for example, in the pasting step to the adherend by manual work, It becomes easy to pay out the resin film forming sheet 10 from the release sheet 13. As a result, the resin film forming layer 12a can be stably attached to the adherend 32. In addition, the method of confirming that a peeling sheet does not have a notch part is performed by the method as described in the Example mentioned later.

Further, as shown in FIGS. 2 to 4, in the resin film forming sheet laminate 100, the support sheet 11 has a cut portion D <b> 1 along the outer periphery of the resin film forming layer from the surface on the resin film forming layer side. The depth of cut d1 of the cut portion D1 is 0 μm or more and preferably 2/3 or less of the thickness of the support sheet, more preferably 0 μm or more and 1/2 or less of the thickness of the support sheet. Preferably, it is 0 μm or more and 1/3 or less of the thickness of the support sheet, more preferably 0 μm or more and 1/4 or less of the thickness of the support sheet. In addition, when the cutting depth d1 of the cutting part D1 is 0 micrometer, it means that the support sheet 11 does not have the cutting part D1. Moreover, in FIGS. 2-4, the adhesive sheet which consists of the base material 11a and the adhesive layer 11b is used as the support sheet 11. FIG.
When the adhesive sheet is used as the support sheet 11 by providing the cut portion D1 having a predetermined depth, the adhesive layer 11b of the support sheet 11 is bitten into the base material 11a, thereby causing a resin film forming sheet. In the manufacturing process of the laminated body 100 and the manufacturing process of the semiconductor device, delamination between the base material 11a and the pressure-sensitive adhesive layer 11b can be prevented. In addition, the depth of cut of the cut portion in the present invention is obtained by observing the cross section of the cut portion with an optical microscope at a magnification of 300 times, and measuring the depth of cut of any four cut portions. The average value.

  As shown in FIGS. 2 to 4, in the resin film forming sheet laminate 100, the release sheet 13 has a cutting depth d <b> 2 along the outer periphery of the support sheet 11 from the surface on the resin film forming layer side. You may have the notch part D2.

  When using an adhesive sheet as the support sheet 11, the adhesive layer 11 b may bite into the release sheet 13 when the cut portion D <b> 2 is formed in the manufacturing process of the resin film forming sheet laminate 100. As a result, it may be difficult to feed out the resin film forming sheet 10 from the release sheet 13 in the attaching process to the adherend. However, since the pressure-sensitive adhesive layer 11b generally has a lower pressure-sensitive adhesive force (adhesive force) than the resin film-forming layer 12a, the pressure-sensitive adhesive layer 11b is difficult to bite into the release sheet 13. Therefore, if the cutting depth d2 is 2/3 or less of the thickness of the release sheet 13, the biting of the pressure-sensitive adhesive layer 11b into the release sheet 13 is minimized, and in the step of attaching to the adherend The feeding of the resin film forming sheet 10 from the release sheet 13 does not become difficult. In addition, when using the support sheet which consists only of a base material, the said problem of biting does not arise.

  Moreover, by providing the cut portion D2 having a cut depth of 1/10 or more of the thickness of the release sheet 13, it is easy to create a release start point at the interface between the resin film forming sheet 10 and the release sheet 13. Become. As a result, the feeding property of the resin film forming sheet is improved.

  In addition, by setting the cut portion D2 to a predetermined depth, the release sheet 13 is prevented from being broken due to stress applied in the longitudinal direction (flow direction) of the release sheet 13 during the step of attaching to the adherend 32. it can.

  Moreover, the resin film forming sheet 10 can be reliably cut into a predetermined shape in the manufacturing process of the resin film forming sheet laminate 100 by forming the cut portion D2.

  Moreover, in the sticking process to the adherend 32 shown in FIGS. 1a to 1d, the release sheet 13 is stressed in the longitudinal direction (flow direction). If the cut portion D2 is not formed in the release sheet 13, the stress may propagate to the resin film forming layer 12a and the resin film forming layer 12a may extend in the flow direction. The deformation (elongation) of the resin film forming layer 12a reduces the thickness accuracy. As a result, the reliability of the semiconductor device obtained using the resin film forming layer 12a may be reduced. By forming the cut portion D2 having a predetermined depth in the release sheet 13, the stress applied to the resin film forming layer 12a is relieved, and the deformation of the resin film forming layer 12a can be suppressed.

  From such a viewpoint, the depth of cut d2 of the cut portion D2 is preferably 1/10 or more and 2/3 or less of the thickness of the release sheet 13, more preferably 1/5 or more and 3/5 or less, More preferably, it is 1/2 or more and 3/5 or less, particularly preferably more than 1/2 and 3/5 or less.

  The support sheet 11 and the resin film forming layer 12 a are cut into a desired planar shape and are partially laminated on the release sheet 13. Here, the desired planar shape in the support sheet 11 and the resin film forming layer 12a is a state in which the support sheet 11 and the resin film forming layer 12a are partially laminated on the release sheet 13, for example, as shown in FIG. If it becomes the shape used as it, it will not specifically limit.

  The planar shape of the support sheet 11 is preferably a shape that can be easily attached to a jig such as a ring frame used in the semiconductor device manufacturing process described later. For example, the support sheet 11 is circular, substantially circular, quadrangular, pentagonal, Examples thereof include a rectangular shape, an octagonal shape, and a wafer shape (a shape in which a part of the outer periphery of the circle is a straight line). Among these, in order to reduce useless parts other than the part attached to the ring frame, a circular shape or a wafer shape is preferable.

  The planar shape of the resin film forming layer 12a is preferably a shape that matches the planar shape of an adherend such as a semiconductor wafer. For example, a circular shape, a substantially circular shape, a quadrangular shape, a pentagonal shape, a hexagonal shape, an octagonal shape, A shape that is easy to be attached to the adherend, such as a wafer shape (a shape in which a part of the outer periphery of the circle is a straight line), is preferable. Among these, a circular shape or a wafer shape is preferable in order to reduce useless portions other than the portion attached to the adherend.

  Hereinafter, specific embodiments of the resin film-forming sheet laminate will be described.

(First aspect)
FIG. 2 is a plan view showing a first aspect of the resin film-forming sheet laminate 100 according to the present invention, and FIG. 3 shows the resin film-forming sheet laminate 100 shown in FIG. It is a schematic sectional drawing at the time of cutting along.

  As shown in FIGS. 2 and 3, in the resin film forming sheet laminate 100 according to the first aspect, the diameter of the support sheet 11 is larger than the diameter of the resin film forming layer 12a. The support sheet 11 is a pressure-sensitive adhesive sheet composed of a base material 11a and a pressure-sensitive adhesive layer 11b. As will be described later, only the substrate 11a can be used as a support sheet.

(Second aspect)
FIG. 4 is a schematic cross-sectional view of the resin film forming sheet laminate 100 of the second embodiment. In the resin film-forming sheet laminate 100 according to the second aspect, the diameter of the support sheet 11 is larger than the diameter of the resin film-forming layer 12a in plan view. An annular jig adhesive layer 14 is provided between the release sheet 13 and the support sheet 11 on the outer peripheral portion of the resin film forming sheet 10. Further, the release sheet 13 may have a cut portion D3 along the inner periphery of the annular jig adhesive layer 14.

The cut depth d3 of the cut portion D3 is not particularly limited, and may be the same as the cut depth d2 of the cut portion D2, or may be larger or smaller, but 1/10 or more of the thickness of the release sheet It is preferably 2/3 or less, more preferably 1/10 or more and 3/5 or less of the thickness of the release sheet, and further preferably 1/10 or more and 1/2 or less of the thickness of the release sheet. preferable.
By providing the cut portion D3 having a predetermined depth, it is easier to suppress deformation of the resin film forming layer 12a due to stress applied in the longitudinal direction (flow direction) of the release sheet 13 during the adherend pasting step. become.

  Next, each layer constituting the resin film forming sheet laminate 100 will be described.

(Support sheet 11)
Examples of the support sheet include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, Polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, fluorine A resin film or the like is used. These crosslinked films are also used. Furthermore, these laminated films may be sufficient.

  A release agent may be applied to the surface of the film to perform a release treatment. As the release agent, alkyd type, silicone type, fluorine type, unsaturated polyester type, polyolefin type, wax type and the like are used, and alkyd type, silicone type and fluorine type release agents are particularly preferable since they have heat resistance. In order to release the surface of the film using such a release agent, the release agent can be applied directly with a gravure coater, Meyer bar coater, air knife coater, roll coater, etc. without solvent, or by solvent dilution or emulsion. Then, the release agent layer may be formed by subjecting the film coated with the release agent to room temperature or heating, or curing it with an electron beam.

  The surface of the film may be subjected to an easy adhesion treatment. Although there is no restriction | limiting in particular as an easily bonding process, For example, a corona discharge process etc. are mentioned.

  The thickness of the film is usually about 30 to 300 μm, preferably about 50 to 200 μm.

  Moreover, as shown in FIGS. 2-4, the support sheet 11 can also use the adhesive sheet which consists of the base material 11a and the adhesive layer 11b.

  When an adhesive sheet is used as the support sheet 11, it becomes easy to perform a required process such as dicing on the adherend on the resin film forming sheet 10. In this embodiment, the resin film forming layer 12a is laminated on the pressure-sensitive adhesive layer 11b provided on the base material 11a. Examples of the base material 11a include the above-described films exemplified as a support sheet.

  Further, as will be described later, when the pressure-sensitive adhesive layer 11b is formed of an ultraviolet curable pressure-sensitive adhesive and ultraviolet rays are used as energy rays to be irradiated to cure the pressure-sensitive adhesive, the substrate 11a is transparent to the ultraviolet rays. The base material which is is preferable. In addition, when using an electron beam as an energy beam, the base material 11a does not need to be transparent. In addition to the above film, a transparent film or an opaque film colored with these can be used.

The pressure-sensitive adhesive layer 11b is not particularly limited as long as the resin film forming layer 12a formed thereon can be peeled off, and can be formed of various conventionally known pressure-sensitive adhesives. Such an adhesive is not limited at all, but for example, a releasable adhesive such as rubber, acrylic, silicone or polyvinyl ether is used. In order to facilitate interfacial peeling between the pressure-sensitive adhesive layer 11b and the resin film forming layer 12a, an energy ray curable adhesive, a heat-foaming adhesive, or a water swelling adhesive can also be used. Since the adhesive strength of these adhesives is reduced by a predetermined operation, it becomes easy to peel the resin film forming layer 12a from the adhesive layer 11b. As the energy ray curable (UV curable, electron beam curable, etc.) type adhesive, it is particularly preferable to use an ultraviolet curable adhesive. The thickness of the pressure-sensitive adhesive layer 11b is usually 1 to 100 μm, preferably about 2 to 80 μm. In the case of using the ultraviolet-curable pressure-sensitive adhesive as an adhesive for forming the pressure-sensitive adhesive layer 11b can be irradiated with ultraviolet rays to the adhesive layer 11b before laminating the resin film layer 12a on the adhesive layer 11b Alternatively, the pressure-sensitive adhesive layer 11b may be irradiated with ultraviolet rays after the resin film forming layer 12a is laminated on the pressure-sensitive adhesive layer 11b.

  Moreover, when using an adhesive sheet as a support sheet, the ratio of the thickness of a base material and the thickness of an adhesive layer is (the thickness of a base material) from a viewpoint of ensuring the effect resulting from the notch part D1 mentioned above. ): (Thickness of the pressure-sensitive adhesive layer), preferably 1: 1 to 200: 1, more preferably 2: 1 to 150: 1.

(Resin film forming layer 12a)
On the support sheet 11, a resin film forming layer 12a is detachably laminated.
The breaking elongation of the resin film forming layer is preferably 1000% or less, and the breaking strength of the resin film forming layer is preferably 10 N / mm ² or less. By setting the breaking elongation and breaking strength of the resin film forming layer within the above ranges, the resin film forming layer can be easily cleaved in the manufacturing process of the resin film forming sheet laminate described below. From such a viewpoint, the breaking elongation of the resin film-forming layer is more preferably 0.5 to 1000%, still more preferably 0.5 to 800%, and the breaking strength is more preferably 0.1 to 10N. / Mm ² , more preferably 0.1 to 5 N / mm ² . The elongation at break and the breaking strength of the resin film-forming layer are, for example, the content of the polymer component (A) described later, its weight average molecular weight, and the weight average molecular weight of the curable component (B) (specifically, epoxy compound) The weight average molecular weight of (B11) and the weight average molecular weight of the thermosetting agent (B12) can be controlled. The breaking elongation and breaking strength of the resin film forming layer are measured by the methods described in the examples described later.

  At least the functions required for the resin film-forming layer are (1) sheet shape maintenance, (2) initial adhesiveness, and (3) curability.

The resin film forming layer can be provided with (1) sheet shape maintaining property and (3) curability by adding a binder component. As the binder component, the polymer component (A) and the curable component (B). Or a second binder component containing a curable polymer component (AB) having the properties of the component (A) and the component (B).
In addition, it is a function for temporarily adhering the resin film forming layer to the adherend until it is cured. (2) The initial adhesiveness may be pressure-sensitive adhesiveness, and is softened and bonded by heat. It may be a property to do. (2) The initial adhesiveness is usually controlled by adjusting various properties of the binder component and adjusting the blending amount of the inorganic filler (C) described later.

(First binder component)
A 1st binder component provides a sheet | seat shape maintenance property and sclerosis | hardenability to a resin film formation layer by containing a polymer component (A) and a sclerosing | hardenable component (B). In addition, the 1st binder component does not contain a curable polymer component (AB) for the convenience of distinguishing from a 2nd binder component.

(A) Polymer component The polymer component (A) is added to the resin film forming layer mainly for the purpose of imparting sheet shape maintenance to the resin film forming layer.
In order to achieve the above object, the polymer component (A) has a weight average molecular weight (Mw) of usually 20,000 or more, preferably 20,000 to 3,000,000. The value of the weight average molecular weight (Mw) is a value when measured by a gel permeation chromatography method (GPC) method (polystyrene standard). The measurement by such a method is carried out by, for example, using a high-speed GPC device “HLC-8120GPC” manufactured by Tosoh Corporation, a high-speed column “TSK gold column H _XL- H”, “TSK Gel GMH _XL ”, “TSK Gel G2000 H _XL ”. (All the above, manufactured by Tosoh Corporation) are connected in this order, and the detector is used as a differential refractometer at a column temperature of 40 ° C. and a liquid feed rate of 1.0 mL / min (hereinafter referred to as a differential refractometer) the same).
In addition, for convenience to distinguish from the curable polymer component (AB) described later, the polymer component (A) does not have a curing functional functional group described later.

  As the polymer component (A), an acrylic polymer, polyester, phenoxy resin (for the sake of convenience to distinguish from the curable polymer component (AB) described later, limited to those having no epoxy group), polycarbonate, polyether, Polyurethane, polysiloxane, rubber polymer and the like can be used. Further, it is an acrylic urethane resin obtained by reacting a urethane prepolymer having an isocyanate group at a molecular terminal with an acrylic polyol which is an acrylic polymer having a hydroxyl group, which is a combination of two or more of these. May be. Furthermore, two or more of these may be used in combination, including a polymer in which two or more are bonded.

(A1) As the acrylic polymer polymer component (A), acrylic polymer (A1) is preferably used. The glass transition temperature (Tg) of the acrylic polymer (A1) is preferably in the range of −60 to 50 ° C., more preferably −50 to 40 ° C., and further preferably −40 to 30 ° C. If the glass transition temperature of the acrylic polymer (A1) is high, the adhesiveness of the resin film forming layer is lowered, so that it cannot be transferred to the adherend, or the resin film forming layer or the resin film forming layer from the adherend after the transfer. May cause problems such as peeling of the resin film obtained by curing. In addition, when the glass transition temperature of the acrylic polymer (A1) is low, the peeling force between the resin film forming layer and the support sheet is increased, and transfer failure of the resin film forming layer may occur.

  The weight average molecular weight of the acrylic polymer (A1) is preferably 100,000 to 2,000,000, more preferably 300,000 to 1,500,000. If the weight average molecular weight of the acrylic polymer (A1) is high, the adhesiveness of the resin film forming layer is reduced, and transfer to the adherend becomes impossible, or the resin film forming layer or the resin film peels off from the adherend after transfer. May cause problems such as Further, when the weight average molecular weight of the acrylic polymer (A1) is low, the adhesiveness between the resin film forming layer and the support sheet is increased, and transfer failure of the resin film forming layer may occur. By making the weight average molecular weight of an acrylic polymer (A1) into the said range, it becomes easy to make the breaking elongation and breaking strength of a resin film formation layer into a predetermined range.

The acrylic polymer (A1) contains (meth) acrylic acid ester in at least a constituent monomer.
As the (meth) acrylic acid ester, an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms, specifically, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl ( (Meth) acrylate, 2-ethylhexyl (meth) acrylate, etc .; (meth) acrylate having a cyclic skeleton, specifically cycloalkyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl ( Examples include meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, and imide (meth) acrylate. Moreover, what is (meth) acrylic acid ester can be illustrated among what is illustrated as a monomer which has a hydroxyl group mentioned later, a monomer which has a carboxyl group, and a monomer which has an amino group.

  In the present specification, (meth) acryl may be used to include both acrylic and methacrylic.

  A monomer having a hydroxyl group may be used as the monomer constituting the acrylic polymer (A1). When such a monomer is used, when a hydroxyl group is introduced into the acrylic polymer (A1) and the resin film forming layer additionally contains an energy ray-curable component (B2), this and the acrylic polymer Compatibility with (A1) is improved. Examples of the monomer having a hydroxyl group include (meth) acrylic acid ester having a hydroxyl group such as 2-hydroxylethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate; N-methylol (meth) acrylamide and the like.

  As the monomer constituting the acrylic polymer (A1), a monomer having a carboxyl group may be used. When such a monomer is used, a carboxyl group is introduced into the acrylic polymer (A1), and the resin film forming layer additionally contains an energy ray curable component (B2). Compatibility with the polymer (A1) is improved. As the monomer having a carboxyl group, (meth) acrylic acid ester having a carboxyl group such as 2- (meth) acryloyloxyethyl phthalate, 2- (meth) acryloyloxypropyl phthalate, etc .; (meth) acrylic acid, Maleic acid, fumaric acid, itaconic acid and the like can be mentioned. When using an epoxy-based thermosetting component as the curable component (B) described below, the carboxyl group and the epoxy group in the epoxy-based thermosetting component react with each other. The amount used is preferably small.

  As a monomer constituting the acrylic polymer (A1), a monomer having an amino group may be used. Examples of such a monomer include (meth) acrylic acid esters having an amino group such as monoethylamino (meth) acrylate.

  In addition, vinyl acetate, styrene, ethylene, α-olefin, or the like may be used as a monomer constituting the acrylic polymer (A1).

  In the resin film forming layer, the acrylic polymer (A1) is preferably 1 to 95 parts by mass, more preferably 5 to 80 parts by mass with respect to 100 parts by mass of the total solid content constituting the resin film forming layer. More preferably, it is 10-60 mass parts, Most preferably, 10-50 mass parts is contained. By making content of an acrylic polymer (A1) into the said range, it becomes easy to make the breaking elongation and breaking strength of a resin film formation layer into a predetermined range.

  The acrylic polymer (A1) may be cross-linked. Crosslinking is performed by adding a crosslinking agent to the composition for forming the resin film-forming layer in which the acrylic polymer (A1) before being crosslinked has a crosslinkable functional group such as a hydroxyl group. This is carried out by the reaction of the functional group with the functional group of the crosslinking agent. By crosslinking the acrylic polymer (A1), the cohesive force of the resin film forming layer can be adjusted.

  Examples of the crosslinking agent include organic polyvalent isocyanate compounds and organic polyvalent imine compounds.

  Examples of organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds. Examples thereof include terminal isocyanate urethane prepolymers obtained by reacting with a polyol compound.

  Specifically, as the organic polyvalent isocyanate compound, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4′- Diisocyanate, diphenylmethane-2,4′-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4′-diisocyanate, dicyclohexylmethane-2,4′-diisocyanate, and lysine isocyanates thereof Examples thereof include polyhydric alcohol adducts.

  Specific examples of organic polyvalent imine compounds include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinylpropionate, tetramethylol. Mention may be made of methane-tri-β-aziridinylpropionate and N, N′-toluene-2,4-bis (1-aziridinecarboxamide) triethylenemelamine.

  A crosslinking agent is 0.01-20 mass parts normally with respect to 100 mass parts of acrylic polymers (A1) before bridge | crosslinking, Preferably it is 0.1-10 mass parts, More preferably, it is 0.5-5 mass parts. Used in ratio.

  In the present invention, when the content of the component constituting the resin film forming layer is determined based on the content of the polymer component (A), the polymer component (A) is a crosslinked acrylic polymer. In some cases, the reference content is the content of the acrylic polymer before being crosslinked.

(A2) Non-acrylic resin In addition, as the polymer component (A), polyester, phenoxy resin (for the purpose of distinguishing from the curable polymer component (AB) described later, limited to those having no epoxy group), polycarbonate, One type of non-acrylic resin (A2) selected from polyether, polyurethane, polysiloxane, rubber polymer, or a combination of two or more of these may be used, or a combination of two or more types. Such a resin preferably has a weight average molecular weight of 20,000 to 100,000, and more preferably 20,000 to 80,000.

  The glass transition temperature of the non-acrylic resin (A2) is preferably -30 to 150 ° C, more preferably -20 to 120 ° C.

  When the non-acrylic resin (A2) is used in combination with the above-mentioned acrylic polymer (A1), when the resin film forming layer is transferred to the adherend using the resin film forming sheet, The delamination from the resin film forming layer can be performed more easily, and the resin film forming layer can follow the transfer surface and the generation of voids can be suppressed.

  When the non-acrylic resin (A2) is used in combination with the above-mentioned acrylic polymer (A1), the content of the non-acrylic resin (A2) is such that the non-acrylic resin (A2) and the acrylic polymer ( The mass ratio (A2: A1) to A1) is usually in the range of 1:99 to 80:20, preferably 1:99 to 60:40, more preferably 1:99 to 55:45. When the content of the non-acrylic resin (A2) is in this range, the above effect can be obtained.

(B) Curable component The curable component (B) is added to the resin film forming layer mainly for the purpose of imparting curability to the resin film forming layer. As the curable component (B), a thermosetting component (B1) or an energy beam curable component (B2) can be used. Moreover, you may use combining these. The thermosetting component (B1) contains at least a compound having a functional group that reacts by heating. The energy ray-curable component (B2) contains a compound (B21) having a functional group that reacts by irradiation with energy rays, and is polymerized and cured when irradiated with energy rays such as ultraviolet rays and electron beams. Curing is realized by the functional groups of these curable components reacting to form a three-dimensional network structure. Since the curable component (B) is used in combination with the polymer component (A), from the viewpoint of suppressing the viscosity of the coating composition for forming the resin film-forming layer and improving the handleability, etc. Usually, the weight average molecular weight (Mw) is 10,000 or less, and preferably 100 to 10,000.

(B1) Thermosetting component As the thermosetting component, for example, an epoxy thermosetting component is preferable.
The epoxy thermosetting component preferably contains a compound (B11) having an epoxy group and a combination of a compound (B11) having an epoxy group and a thermosetting agent (B12).

(B11) Compound having an epoxy group As the compound (B11) having an epoxy group (hereinafter sometimes referred to as “epoxy compound (B11)”), a conventionally known compound can be used. Specifically, polyfunctional epoxy resin, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type Examples thereof include epoxy compounds having two or more functional groups in the molecule, such as epoxy resins and phenylene skeleton type epoxy resins. These can be used individually by 1 type or in combination of 2 or more types.

  When the epoxy compound (B11) is used, the resin film forming layer preferably contains 1 to 1500 parts by mass of the epoxy compound (B11) with respect to 100 parts by mass of the polymer component (A), more preferably. 3 to 1200 parts by mass are included. When there are few epoxy compounds (B11), there exists a tendency for the adhesiveness after hardening of a resin film formation layer to fall. Moreover, when there are many epoxy compounds (B11), the peeling force of a resin film formation layer and a support sheet will become high, and the transfer defect of a resin film formation layer may arise.

  Moreover, the weight average molecular weight (Mw) of an epoxy compound (B11) becomes like this. Preferably it is 100-2,000, More preferably, it is 200-1,500. By making the weight average molecular weight of an epoxy compound (B11) into the said range, it becomes easy to make the breaking elongation and breaking strength of a resin film formation layer into a predetermined range.

(B12) Thermosetting agent The thermosetting agent (B12) functions as a curing agent for the epoxy compound (B11). A preferable thermosetting agent includes a compound having two or more functional groups capable of reacting with an epoxy group in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, and an acid anhydride. Of these, phenolic hydroxyl groups, amino groups, acid anhydrides and the like are preferable, and phenolic hydroxyl groups and amino groups are more preferable.

Specific examples of the phenolic curing agent include polyfunctional phenolic resins, biphenols, biphenylphenolic resins, novolac type phenolic resins, dicyclopentadiene type phenolic resins, zylock type phenolic resins, and aralkylphenolic resins.
A specific example of the amine curing agent is DICY (dicyandiamide).
These can be used individually by 1 type or in mixture of 2 or more types.

  Although the weight average molecular weight (Mw) of a thermosetting agent (B12) is not specifically limited, Preferably it is 100-20,000, More preferably, it is 200-20,000. The thermosetting agent (B12) is preferably in a liquid state at 180 ° C. or lower, more preferably in a liquid state at 160 ° C. or lower, and particularly preferably in a liquid state at around normal temperature (23 ° C.). By setting the weight average molecular weight of the thermosetting agent (B12) in the above range, or using the thermosetting agent (B12) having the above properties (softening point), the elongation at break and the breaking strength of the resin film forming layer are within a predetermined range. It becomes easy to do. In addition, a softening point can be measured by the method based on the ring and ball method of JISK7234: 1986, for example.

  It is preferable that it is 0.1-500 mass parts with respect to 100 mass parts of epoxy compounds (B11), and, as for content of a thermosetting agent (B12), it is more preferable that it is 1-200 mass parts. When there is little content of a thermosetting agent, there exists a tendency for the adhesiveness after hardening to fall.

(B13) Curing accelerator A curing accelerator (B13) may be used to adjust the thermosetting speed of the resin film-forming layer. The curing accelerator (B13) is particularly preferably used when an epoxy thermosetting component is used as the thermosetting component (B1).

  Preferred curing accelerators include tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole, 2-phenyl- Imidazoles such as 4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole; Organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine; And tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate and triphenylphosphinetetraphenylborate. These can be used individually by 1 type or in mixture of 2 or more types.

  The curing accelerator (B13) is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 1 part by mass with respect to 100 parts by mass of the total amount of the epoxy compound (B11) and the thermosetting agent (B12). Included in the amount of. By containing the curing accelerator (B13) in an amount within the above range, it has excellent adhesiveness even when exposed to high temperatures and high humidity, and has high reliability even when exposed to severe reflow conditions. Can be achieved. By adding the curing accelerator (B13), the adhesiveness of the resin film forming layer after curing can be improved. Such an action becomes stronger as the content of the curing accelerator (B13) increases.

(B2) Energy ray-curable component The resin film-forming layer contains the energy-ray-curable component, so that the resin film-forming layer can be cured without performing a heat curing step that requires a large amount of energy and a long time. . Thereby, the manufacturing cost can be reduced.
As the energy ray-curable component, the compound (B21) having a functional group that reacts by irradiation with energy rays may be used alone, but the compound (B21) having a functional group that reacts by irradiation with energy rays and a photopolymerization initiator ( It is preferable to use a combination of B22).

(B21) Compound having a functional group that reacts upon irradiation with energy rays Compound (B21) having a functional group that reacts upon irradiation with energy rays (hereinafter sometimes referred to as “energy ray-reactive compound (B21)”) Specifically, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate Examples include acrylate compounds such as acrylates, oligoester acrylates, urethane acrylate oligomers, epoxy acrylates, polyether acrylates, and esters. A acrylate compound having a polymerizable structure acrylate compounds such as Con acid oligomer include those of relatively low molecular weight. Such a compound has at least one polymerizable double bond in the molecule.

  When the energy ray reactive compound (B21) is used, the resin film forming layer preferably contains 1 to 1500 parts by mass of the energy ray reactive compound (B21) with respect to 100 parts by mass of the polymer component (A). More preferably, it is contained in 3 to 1200 parts by mass.

(B22) By combining the photopolymerization initiator energy beam reactive compound (B21) with the photopolymerization initiator (B22), the polymerization curing time can be shortened and the amount of light irradiation can be reduced.

  Specific examples of such a photopolymerization initiator (B22) include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, and benzoin dimethyl ketal. 2,4-diethylthioxanthone, α-hydroxycyclohexyl phenyl ketone, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl, 1,2-diphenylmethane, 2-hydroxy- 2-methyl-1- [4- (1-methylvinyl) phenyl] propanone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide and β -Chloranthraquinone and the like. A photoinitiator (B22) can be used individually by 1 type or in combination of 2 or more types.

The blending ratio of the photopolymerization initiator (B22) is preferably 0.1 to 10 parts by mass, more preferably 1 to 5 parts by mass with respect to 100 parts by mass of the energy ray reactive compound (B21). .
If the blending ratio of the photopolymerization initiator (B22) is less than 0.1 parts by mass, sufficient curability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, the residue does not contribute to photopolymerization. May cause a malfunction.

(Second binder component)
A 2nd binder component provides sheet shape maintenance property and curability to a resin film formation layer by containing a curable polymer component (AB).

(AB) Curable polymer component The curable polymer component is a polymer having a functional functional group. The curing functional group is a functional group that can react with each other to form a three-dimensional network structure, and examples thereof include a functional group that reacts by heating and a functional group that reacts by energy rays.
The functional functional group may be added to the unit of the continuous structure that becomes the skeleton of the curable polymer component (AB) or may be added to the terminal. When the functional functional group is added in the unit of the continuous structure that becomes the skeleton of the curable polymer component (AB), the functional functional group may be added to the side chain or directly to the main chain. You may do it. The weight average molecular weight (Mw) of the curable polymer component (AB) is usually 20,000 or more from the viewpoint of achieving the purpose of imparting sheet shape maintainability to the resin film-forming layer.

An example of a functional group that reacts by heating is an epoxy group. Examples of the curable polymer component (AB) having an epoxy group include a high molecular weight epoxy group-containing compound and a phenoxy resin having an epoxy group. High molecular weight epoxy group-containing compounds are disclosed, for example, in JP-A-2001-261789.
Moreover, it is a polymer similar to the above-mentioned acrylic polymer (A1), which is polymerized using a monomer having an epoxy group as a monomer (epoxy group-containing acrylic polymer). Also good. Examples of the monomer having an epoxy group include (meth) acrylic acid esters having a glycidyl group such as glycidyl (meth) acrylate.
When an epoxy group-containing acrylic polymer is used, its preferred embodiment is the same as that of the acrylic polymer (A1) except for the epoxy group.

  When the curable polymer component (AB) having an epoxy group is used, the thermosetting agent (B12) or the curing accelerator (B13) is used as in the case of using an epoxy thermosetting component as the curable component (B). ) May be used in combination.

Examples of the functional group that reacts with energy rays include a (meth) acryloyl group. As the curable polymer component (AB) having a functional group that reacts with energy rays, an acrylate compound having a polymer structure such as polyether acrylate, and the like having a high molecular weight can be used.
In addition, for example, a raw material polymer having a functional group X such as a hydroxyl group in a side chain, a functional group Y that can react with the functional group X (for example, an isocyanate group when the functional group X is a hydroxyl group) and energy beam irradiation Alternatively, a polymer prepared by reacting a low molecular compound having a functional group that reacts with the above may be used.
In this case, when the raw material polymer corresponds to the above-mentioned acrylic polymer (A1), the preferred mode of the raw material polymer is the same as that of the acrylic polymer (A1).

  When the curable polymer component (AB) having a functional group that reacts with energy rays is used, the photopolymerization initiator (B22) may be used in the same manner as when the energy ray curable component (B2) is used. .

  The second binder component may contain the above-described polymer component (A) and curable component (B) in combination with the curable polymer component (AB).

  In addition to the binder component, the resin film forming layer may contain the following components.

(C) The inorganic filler resin film forming layer may contain an inorganic filler (C). By blending the inorganic filler (C) in the resin film forming layer, it becomes possible to adjust the thermal expansion coefficient of the cured resin film, and the optimal thermal expansion coefficient of the cured resin film for the adherend. Therefore, the reliability of the semiconductor device can be improved. It is also possible to reduce the hygroscopicity of the cured resin film.
In addition, when the resin film obtained by curing the resin film-forming layer in the present invention functions as a protective film for an adherend or a chip in which the adherend is separated, a laser marking is applied to the protective film. As a result, the inorganic filler (C) is exposed at the portion scraped off by the laser beam, and the reflected light diffuses to exhibit a color close to white. Therefore, when the resin film forming layer contains a colorant (D) described later, there is an effect that a contrast difference is obtained between the laser marking portion and other portions, and the printing becomes clear.

Preferred inorganic fillers include powders of silica, alumina, talc, calcium carbonate, titanium oxide, iron oxide, silicon carbide, boron nitride, and the like, beads formed by spheroidizing these, single crystal fibers, glass fibers, and the like. Among these, silica filler and alumina filler are preferable. Further, the surface of these inorganic fillers can be modified with a functional group such as an epoxy group or a (meth) acryloyl group. The said inorganic filler (C) can be used individually or in mixture of 2 or more types.
The range of the content of the inorganic filler (C) for obtaining the above-described effect more reliably is preferably 1 to 80 parts by mass with respect to 100 parts by mass of the total solid content constituting the resin film forming layer. Preferably it is 5-75 mass parts, Most preferably, it is 10-70 mass parts.

(D) Colorant (D) can be mix | blended with a colorant resin film formation layer. By blending the colorant, malfunction of the semiconductor device due to infrared rays or the like generated from surrounding devices when the semiconductor device is incorporated into equipment can be prevented. Further, when the resin film is engraved by means such as laser marking, there is an effect that marks such as characters and symbols can be easily recognized. That is, in a semiconductor device or semiconductor chip on which a resin film is formed, the product number or the like is usually printed on the surface of the resin film by a laser marking method (a method in which the surface of the protective film is scraped off and printed). By containing the colorant (D), a sufficient difference in contrast between the portion of the resin film scraped by the laser beam and the portion not removed is obtained, and the visibility is improved.

As the colorant, organic or inorganic pigments and dyes are used. Among these, black pigments are preferable from the viewpoint of electromagnetic wave and infrared shielding properties. Examples of the black pigment include carbon black, iron oxide, manganese dioxide, aniline black, activated carbon, and the like, but are not limited thereto. Carbon black is particularly preferable from the viewpoint of increasing the reliability of the semiconductor device. A coloring agent (D) may be used individually by 1 type, and may be used in combination of 2 or more type.
The blending amount of the colorant (D) is preferably 0.1 to 35 parts by mass, more preferably 0.5 to 25 parts by mass, particularly preferably 100 parts by mass of the total solid content constituting the resin film forming layer. Is 1-15 parts by mass.

(E) Coupling agent A bonding agent (E) having a functional group that reacts with an inorganic substance and a functional group that reacts with an organic functional group can be applied to an adherend of a resin film-forming layer, adhesion, and / or resin film. You may use in order to improve the cohesion of. Moreover, the water resistance can be improved by using a coupling agent (E), without impairing the heat resistance of the resin film obtained by hardening | curing a resin film formation layer. Examples of such coupling agents include titanate coupling agents, aluminate coupling agents, silane coupling agents, and the like. Of these, silane coupling agents are preferred.

As the silane coupling agent, the functional group that reacts with the organic functional group is a group that reacts with the functional group of the polymer component (A), the curable component (B), the curable polymer component (AB), and the like. Some silane coupling agents are preferably used.
Examples of such silane coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ- (methacryloxy). Propyl) trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropyltrimethoxysilane, N-6- (aminoethyl) -γ-aminopropylmethyldiethoxysilane, N -Phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfane, methyltri Methoxysilane , Methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, and imidazolesilane. These can be used individually by 1 type or in mixture of 2 or more types.

  A silane coupling agent is 0.1-20 mass parts normally with respect to a total of 100 mass parts of a polymer component (A), a curable component (B), and a curable polymer component (AB), Preferably it is 0.00. 2 to 10 parts by mass, more preferably 0.3 to 5 parts by mass. If the content of the silane coupling agent is less than 0.1 parts by mass, the above effect may not be obtained, and if it exceeds 20 parts by mass, it may cause outgassing.

(F) In addition to the above, various additives may be blended in the general-purpose additive resin film forming layer as necessary. Examples of various additives include leveling agents, plasticizers, antistatic agents, antioxidants, ion scavengers, gettering agents, chain transfer agents, release agents, and the like.

The resin film-forming layer is obtained, for example, using a composition (composition for forming a resin film) obtained by mixing the above-described components at an appropriate ratio. The resin film forming composition may be diluted with a solvent in advance, or may be added to the solvent during mixing. Moreover, you may dilute with a solvent at the time of use of the composition for resin film formation.
Examples of such a solvent include ethyl acetate, methyl acetate, diethyl ether, dimethyl ether, acetone, methyl ethyl ketone, acetonitrile, hexane, cyclohexane, toluene, heptane and the like.

  The resin film-forming layer has initial adhesiveness and curability, and in an uncured state, it is easily bonded by pressing the adherend at room temperature or under heating. Moreover, you may heat a resin film formation layer, when pressing. Then, after curing, a resin film having high impact resistance can be provided, the adhesive strength is excellent, and sufficient reliability can be maintained even under severe high temperature and high humidity conditions. The resin film forming layer may have a single layer structure or a multilayer structure.

  The thickness of the resin film forming layer is preferably 1 to 100 μm, more preferably 2 to 90 μm, and particularly preferably 3 to 80 μm. By setting the thickness of the resin film forming layer within the above range, the resin film forming layer protects the adhesive for bonding the adherend to the substrate or other chips, or the back surface of the adherend. Excellent function as a protective film.

(Peeling sheet 13)
The release sheet 13 is laminated on the resin film forming layer 12a side. The release sheet 13 serves as a carrier film when the resin film forming sheet 10 is used, and the film exemplified as the support sheet 11 described above can be used.

  The surface tension of the surface of the release sheet in contact with the resin film forming layer is preferably 40 mN / m or less, more preferably 37 mN / m or less, and particularly preferably 35 mN / m or less. The lower limit is usually about 25 mN / m. Such a release sheet having a relatively low surface tension can be obtained by appropriately selecting the material, and can also be obtained by applying a release agent to the surface of the release sheet and performing a release treatment. .

  As the release agent used for the release treatment, alkyd, silicone, fluorine, unsaturated polyester, polyolefin, wax, and the like are used. In particular, alkyd, silicone, and fluorine release agents are heat resistant. This is preferable.

  In order to release the surface of a film or the like as a substrate of a release sheet using the above release agent, the release agent can be used without any solvent, or can be diluted or emulsified in a solvent to obtain a gravure coater, Mayer bar coater, air knife coater. The release sheet coated with a release coater may be applied at room temperature or under heating, or may be cured with an electron beam to form a release agent layer.

  Further, the surface tension of the release sheet may be adjusted by laminating films by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like. That is, a film in which the surface tension of at least one surface is in a preferable range as the surface in contact with the resin film forming layer of the release sheet described above is set so that the surface is in contact with the resin film forming layer. It is good also as a peeling sheet by manufacturing the laminated body laminated | stacked with this film.

  Although the thickness of a peeling sheet is not specifically limited, Preferably it is 10-200 micrometers, More preferably, it is 30-150 micrometers.

(Jig adhesive layer)
As a jig | tool adhesion layer, the adhesive member which consists of an adhesive layer single-piece | unit, the adhesive member comprised from a base material and an adhesive layer, and the double-sided adhesive member which has a core material are employable. The jig adhesive layer is, for example, an annular shape (ring shape), has a hollow portion (internal opening), and has a size that can be fixed to a jig such as a ring frame. Specifically, the inner diameter of the ring frame is smaller than the outer diameter of the jig adhesive layer. Further, the inner diameter of the ring frame is slightly larger than the inner diameter of the jig adhesive layer. The ring frame is usually a molded body of metal or plastic.

  When a pressure-sensitive adhesive member made of a single pressure-sensitive adhesive layer is used as a jig bonding layer, the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is not particularly limited, but for example, it is made of an acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, or a silicone pressure-sensitive adhesive. Is preferred. Among these, the acrylic polymer (A1) described above is included in consideration of the peel strength of the release sheet, the adhesive strength to the ring frame, and the removability from the ring frame at the outer peripheral portion of the resin film forming sheet. Acrylic adhesive is preferred. In addition, the said adhesive may be used independently or may be used in mixture of 2 or more types.

  The thickness of the pressure-sensitive adhesive layer constituting the jig adhesion layer is preferably 2 to 20 μm, more preferably 3 to 15 μm, and further preferably 4 to 10 μm. When the thickness of the pressure-sensitive adhesive layer is less than 2 μm, sufficient peeling force or adhesive force may not be exhibited. When the thickness of the pressure-sensitive adhesive layer exceeds 20 μm, the peeling force and the pressure-sensitive adhesive force are increased, and the effect of the present invention cannot be exhibited, or a residue of the pressure-sensitive adhesive remains on the ring frame when peeling from the ring frame, May contaminate the ring frame.

When the adhesive member composed of the base material and the adhesive layer is used as the jig adhesive layer, the adhesive layer and the release sheet constituting the adhesive member are laminated.
The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is the same as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer in the pressure-sensitive adhesive member composed of the above pressure-sensitive adhesive layer alone. The same applies to the thickness of the pressure-sensitive adhesive layer.

  Although it does not restrict | limit especially as a base material which comprises a jig | tool adhesion layer, For example, a polyethylene film, a polypropylene film, an ethylene-vinyl acetate copolymer film, an ethylene- (meth) acrylic acid copolymer film, ethylene- (meth) Examples thereof include polyolefin films such as acrylate copolymer films and ionomer resin films, polyvinyl chloride films, and polyethylene terephthalate films. Among these, in consideration of expandability, a polyethylene film and a polyvinyl chloride film are preferable, and a polyvinyl chloride film is more preferable.

  The thickness of the base material constituting the jig adhesion layer is preferably 15 to 200 μm, more preferably 30 to 150 μm, and still more preferably 40 to 100 μm.

  When a double-sided pressure-sensitive adhesive member having a core material is used as a jig adhesive layer, the double-sided pressure-sensitive adhesive member is formed on the core material, a laminating pressure-sensitive adhesive layer formed on one surface thereof, and the other surface. It consists of an adhesive layer for fixing. The pressure-sensitive adhesive layer for lamination is a pressure-sensitive adhesive layer on the side attached to the support sheet 11. The fixing pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer on the side attached to the release sheet 13 and is used for fixing the jig after the release sheet 13 is removed.

  Examples of the core material of the double-sided pressure-sensitive adhesive member include the same materials as the base material of the pressure-sensitive adhesive member. Of these, polyolefin film and plasticized polyvinyl chloride film are preferred in view of expandability.

  The thickness of the core material is usually 15 to 200 μm, preferably 30 to 150 μm, more preferably 40 to 100 μm.

  The laminating pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive member may be a layer made of the same pressure-sensitive adhesive or a layer made of different pressure-sensitive adhesives.

  The pressure-sensitive adhesive constituting the fixing pressure-sensitive adhesive layer is formed so that the peeling force of the release sheet and the pressure-sensitive adhesive force on the ring frame are within an appropriate range at the outer peripheral portion of the resin film-forming sheet, and The adhesive strength with the ring frame is appropriately selected so as to be smaller than the adhesive strength between the support sheet and the laminating pressure-sensitive adhesive layer. Examples of such pressure-sensitive adhesives include acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, and silicone pressure-sensitive adhesives. In view of removability from the frame, an acrylic pressure-sensitive adhesive containing the above-mentioned acrylic polymer (A1) is preferable. Moreover, the pressure-sensitive adhesive forming the fixing pressure-sensitive adhesive layer may be used alone or in combination of two or more.

  The pressure-sensitive adhesive constituting the laminating pressure-sensitive adhesive layer is not particularly limited, and examples thereof include acrylic pressure-sensitive adhesives, rubber pressure-sensitive adhesives, and silicone pressure-sensitive adhesives. Among these, an acrylic pressure-sensitive adhesive containing the above-described acrylic polymer (A1) is preferable from the viewpoint of easy control of the adhesive force with the support sheet. Moreover, the adhesive which forms the adhesive layer for lamination | stacking may be used independently, or 2 or more types may be mixed and used for it.

  The thickness of the adhesive layer for lamination and the adhesive layer for fixing is the same as the thickness of the adhesive layer of the adhesive member.

  By providing the jig bonding layer, it becomes easy to bond the resin film forming sheet to a jig such as a ring frame.

  The resin film-forming sheet laminate 100 including the above layers is obtained by removing the release sheet 13 and then applying the resin film-forming layer 12a to the adherend 32. Necessary processing such as dicing is performed. Then, the support film 11 is peeled off while the resin film forming layer 12a remains fixed to the adherend 32. That is, the resin film forming layer 12 a is used in a process including a step of transferring the resin film forming layer 12 a from the support sheet 11 to the adherend 32.

  The adherend that can be applied in the present invention is not limited to its material. For example, various articles such as semiconductor materials such as semiconductor wafers, glass substrates, ceramic substrates, organic material substrates such as FPC, or metal materials such as precision parts, and the like. The chip | tip etc. which separated the article | item of this into pieces can be mentioned.

  The shape of the resin film-forming sheet laminate can be a belt-like shape in which a resin film-forming sheet including a support sheet and a resin film-forming layer is laminated on a long release sheet, which can be rolled up. In particular, as shown in FIG. 2, a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 a cut out in accordance with a desired shape can be peeled on a long release sheet 13 at regular intervals. The form laminated with is preferable. Moreover, the shape of the resin film-forming sheet laminate can also be a single wafer.

  When a sheet for forming a resin film including a support sheet and a resin film forming layer cut out in accordance with a desired shape is laminated on a long release sheet so as to be peeled at regular intervals, a resin film is formed. The thickness of the sheet laminate for resin film formation becomes nonuniform between the portion where the sheet for application is laminated and the portion where the sheet for resin film formation is not laminated. When such a laminated sheet for forming a resin film having a non-uniform thickness is wound up in a roll shape, the thickness becomes non-uniform, the non-uniform winding pressure may occur, and the roll may collapse. Therefore, it is preferable to make the thickness uniform in the sheet laminate for forming a resin film in such a form. For this reason, on the outside of the resin film forming sheet cut out in accordance with a desired shape, as shown in FIG. 2, there is a little space along the both edges 17 in the short direction of the long release sheet 13. Thus, it is preferable that the peripheral tape 14 having the same thickness as the resin film forming sheet 10 is bonded. Here, the interval between the resin film forming sheet 10 and the peripheral tape 14 is preferably about 1 to 20 mm, and particularly preferably about 2 to 10 mm. The peripheral tape 14 makes it easier to avoid the above problems by eliminating the uneven thickness.

Production of resin film-forming sheet laminate Next, a resin film-forming sheet laminate in which a resin film-forming sheet cut out in accordance with a desired shape is laminated on a long release sheet so as to be peeled at regular intervals. The method for producing the body will be described by taking the resin film-forming sheet laminate of the first embodiment shown in FIG. 3 as an example. The resin film-forming sheet laminate of the present invention is obtained by such a production method. It is not limited to.

  First, as shown in FIG. 5a, a laminate is prepared in which a first release sheet 15 is laminated on an adhesive layer 11b of an adhesive sheet (support sheet 11) composed of a base material 11a and an adhesive layer 11b. Then, as shown in FIG. 5b, the first release sheet 15 is half-cut into a desired shape.

  Specifically, a long adhesive sheet (hereinafter sometimes referred to as “long adhesive sheet 11”) and a long first release sheet 15 (hereinafter “first long release sheet 15”). Is prepared.) Is prepared. In addition, the 1st elongate peeling sheet 15 is laminated | stacked on the adhesive layer 11b of the elongate adhesive sheet 11. FIG.

  Next, as shown in FIG. 5b, the first long release sheet 15 is completely cut into a desired shape, and the long adhesive sheet 11 is die cut (half cut) so as not to be cut completely. Die cutting is performed by a general-purpose apparatus (rotary blade or flat blade) and method such as die cutting. The cutting depth at this time is not particularly limited as long as the first long release sheet 15 can be cut completely. When the long adhesive sheet 11 is also cut, as shown in FIGS. 3 and 5b, a cut portion D1 having a cut depth d1 is formed. The cut depth d1 of the cut portion D1 formed in this way and the effect thereof are as described above.

  Next, a peeling adhesive tape (not shown) is stuck in the longitudinal direction of the first long release sheet 15. And by removing the adhesive tape for peeling, as shown in FIG. 5c, the release sheet 15b die-cut to a desired shape is removed, and the remaining portion 15a of the first long release sheet 15 is replaced with the long adhesive sheet. 11 to obtain a laminated body (hereinafter sometimes referred to as “first laminated body”) in which openings 15c having a desired shape are formed. The first laminate is a laminate of the remaining portion 15 a of the first long release sheet 15 and the long adhesive sheet 11.

  Subsequently, the laminated body which has the resin film formation layer 12 on the elongate peeling sheet 16 (henceforth "the resin film formation layer transfer sheet 16" may be described.) Is prepared. As a method for producing the laminate, the resin film forming layer 12 previously formed into a film shape may be laminated on the resin film forming layer transfer sheet 16, and the resin for forming the resin film forming layer 12 may be used. The film forming composition may be applied to the resin film forming layer transfer sheet 16 and dried.

  Then, as shown in FIG. 5d, the resin film forming layer 12 of the laminate including the resin film forming layer transfer sheet 16 and the resin film forming layer 12 is attached to the opening 15c side of the first laminate. Through this step, a part of the resin film forming layer 12 is fitted into the opening 15c.

  Next, as shown in FIG. 5e, when the separation start point of the interface between the remaining portion 15a of the first long release sheet 15 and the long adhesive sheet 11 is peeled off, the resin film forming layer 12 is cleaved into a shape fitted into the opening 15c. Then, the resin film forming layer 12 a having a desired shape remains on the pressure-sensitive adhesive layer 11 b of the long pressure-sensitive adhesive sheet 11. Since the laminate of the resin film forming layer transfer sheet 16, the remaining portion 12b of the resin film forming layer 12 and the remaining portion 15a of the first long release sheet 15 is continuous in the longitudinal direction, the removal of the laminate Thus, a laminate (resin film forming sheet 10 continuous in the longitudinal direction) in which the resin film forming layer 12a having a desired shape is aligned on the adhesive layer 11b of the long adhesive sheet 11 is obtained. By setting the rupture elongation and rupture strength of the resin film-forming layer within a predetermined range, the cleaving property of the resin film-forming layer can be further improved.

  Then, as shown in FIG. 5f, a long second release sheet 13 (hereinafter referred to as “second long release sheet 13”) may be described on the surface of the laminate having the resin film forming layer 12a. .) Is pasted to obtain a laminate (hereinafter sometimes referred to as “second laminate”) having a resin film-forming layer 12a between the second long release sheet 13 and the long adhesive sheet 11. . And the long adhesive sheet 11 of a 2nd laminated body is die-cut from the long adhesive sheet 11 side to the desired shape of the magnitude | size which is more than the internal diameter of a ring frame and below an outer diameter. At this time, the die is cut so that the center point of the resin film forming layer 12a coincides with the center point of the long adhesive sheet 11 after die cutting. The cutting depth in this case will not be specifically limited if the long adhesive sheet 11 can be cut completely. When the second long release sheet 13 is also cut, a cut portion D2 having a cut depth d2 is formed as shown in FIGS. 3 and 5g. The cut depth d2 of the cut portion D2 formed in this way and the effect thereof are as described above.

  And the adhesive sheet 11 of a desired shape is made to remain on the 2nd elongate peeling sheet 13, and the remaining elongate adhesive sheet is removed. As a result, the resin film forming sheet 10 according to the present invention, in which the resin film forming sheet 10 including the resin film forming layer 12 a having a desired shape and the adhesive sheet (support sheet 11) is laminated on the second long release sheet 13. A sheet laminate 100 is obtained.

  In addition, in the above, when performing the die cutting of the long pressure-sensitive adhesive sheet, the long pressure-sensitive adhesive sheet is cut into a desired shape, and a small gap is provided from the pressure-sensitive adhesive sheet outside the long pressure-sensitive adhesive sheet 11 having the shape. 2 It is preferable to perform die cutting so that the adhesive sheet as the peripheral tape 14 remains along both edges 17 in the short direction of the long release sheet 13. Thereafter, the adhesive sheet 11 and the peripheral tape 14 having a desired shape are left on the second long release sheet 13 and the remaining adhesive sheet is removed, whereby the resin including the adhesive sheet 11 and the resin film forming layer 12a. The sheet | seat laminated body 100 for resin film formation of the form by which the sheet | seat 10 for film formation and the peripheral tape 14 were continuously bonded on the elongate peeling sheet 13 is obtained.

Method for Manufacturing Semiconductor Device Next, as for the method of using the resin film forming sheet laminate according to the present invention, the resin film forming sheet laminate of the first embodiment shown in FIGS. 2 and 3 is applied to the semiconductor device manufacturing method. This will be described as an example.

  According to a first method for manufacturing a semiconductor device, a resin film forming layer of a resin film forming sheet laminate is attached to an adherend, and the adherend is diced into a chip, on any surface of the chip. It is preferable to include a step of fixing and remaining the resin film forming layer and peeling it from the support sheet, and placing the chip on the substrate or another chip via the resin film forming layer. The resin film forming layer is an adhesive film between the chip and the substrate or another chip.

  Hereinafter, an example using a silicon wafer as an adherend will be described.

  Formation of a circuit on the wafer surface can be performed by various methods including conventionally used methods such as an etching method and a lift-off method. Next, the opposite surface (back surface) of the circuit surface of the wafer is ground. The grinding method is not particularly limited, and grinding may be performed by a known means using a grinder or the like. At the time of back surface grinding, an adhesive sheet called a surface protection sheet is attached to the circuit surface in order to protect the circuit on the surface. In the back surface grinding, the circuit surface side (that is, the surface protection sheet side) of the wafer is fixed by a chuck table or the like, and the back surface side on which no circuit is formed is ground by a grinder. The thickness of the wafer after grinding is not particularly limited, but is usually about 50 to 500 μm.

  Thereafter, if necessary, the crushed layer generated during back grinding is removed. The crushed layer is removed by chemical etching, plasma etching, or the like.

  Subsequent to circuit formation and back surface grinding, the resin film forming layer of the resin film forming sheet laminate is affixed to the back surface of the wafer. The attaching method is not particularly limited. For example, the resin film forming layer is attached to the semiconductor wafer in the steps shown in FIGS. 1a to 1d.

  FIGS. 1 a to 1 d are a series of process diagrams for performing an operation of attaching the resin film forming sheet 10 to a semiconductor wafer as the adherend 32. As shown in FIG. 1a, in the resin film-forming sheet laminate 100, the release sheet 13 serves as a carrier film, and is supported by two rolls 62 and 66 and a peel plate 64, while one end of the sheet laminate 100 is circular. The first roll 42 is formed while being connected to the columnar core 44, and the second roll 52 is formed by being wound with the other end connected to the columnar core 54. Yes. Then, a core driving motor (not shown) for rotating the core 54 is connected to the core 54 of the second roll 52, and the resin film forming sheet 10 is peeled off. The release sheet 13 is wound at a predetermined speed.

First, when the core driving motor rotates, the core 54 of the second roll 52 rotates, and the resin film is formed from the resin film forming sheet laminate 100 wound around the core 44 of the first roll 42. The forming sheet 10 is pulled out of the first roll 42. The drawn resin film forming sheet 10 is guided onto a disk-shaped semiconductor wafer 32 disposed on a movable stage 36 and a ring frame 34 disposed so as to surround the disk-shaped semiconductor wafer 32.

Next, the resin film forming sheet 10 is peeled from the release sheet 13. At this time, as shown in FIG. 1 a, a peel plate 64 may be applied from the release sheet 13 side of the resin film forming sheet 10.
As shown in FIG. 1b, when the cut portion D2 is formed, the release sheet 13 is bent toward the peel plate 64 from the cut portion D2, and the release sheet 13 and the resin film forming sheet are formed. The separation starting point can be easily created between 10 and 10. Furthermore, air may be blown to the boundary surface between the release sheet 13 and the resin film forming sheet 10 so that the release start point is more efficiently created. As a result, the feeding of the resin film forming sheet 10 is further facilitated.

  Next, as shown in FIG. 1 c, the resin film forming sheet 10 is attached so that the resin film forming sheet 10 is in close contact with the ring frame 34 and the semiconductor wafer 32. At this time, the resin film forming sheet 10 is pressed against the semiconductor wafer 32 by the roll 68. Then, as shown in FIG. 1d, the attachment of the resin film forming sheet 10 onto the semiconductor wafer 32 is completed, and a semiconductor wafer with a resin film forming sheet is obtained.

  By the procedure as described above, the resin film forming sheet 10 can be attached to the semiconductor wafer 32 continuously in an automated process. An example of an apparatus for performing the operation of attaching the resin film forming sheet 10 to the semiconductor wafer 32 is RAD-2500 (trade name) manufactured by Lintec Corporation.

  When the resin film forming sheet 10 is attached to the semiconductor wafer 32 by such a process, the resin film forming sheet 10 is separated from the release sheet 13 by using the resin film forming sheet laminate 100 according to the present invention. Can be extended easily.

  When the resin film forming layer does not have tackiness at room temperature, it may be heated appropriately (although it is not limited, 40 to 80 ° C. is preferable).

  When the resin film forming layer is blended with the energy ray reactive compound (B21) or the curable polymer component (AB) having a functional group that reacts with energy rays, the resin film forming layer has a support sheet side. The resin film forming layer may be preliminarily cured by irradiating with an energy beam, increasing the cohesive force of the resin film forming layer, and decreasing the adhesive force between the resin film forming layer and the support sheet.

Thereafter, the semiconductor wafer is cut using a cutting means such as a dicing saw to obtain a semiconductor chip. The cutting depth at this time is a depth that takes into account the sum of the thickness of the semiconductor wafer and the thickness of the resin film forming layer and the amount of wear of the dicing saw. Laser light can also be used as the cutting means.
The energy beam irradiation may be performed at any stage after the semiconductor wafer is pasted and before the semiconductor chip is peeled off (pickup). For example, the irradiation may be performed after dicing or after the following expanding step. Although it is good, it is preferably performed after the semiconductor wafer is attached and before dicing. Further, the energy beam irradiation may be performed in a plurality of times.

  Next, when the resin film forming sheet is expanded as necessary, the interval between the semiconductor chips is expanded, and the semiconductor chips can be picked up more easily. At this time, a deviation occurs between the resin film forming layer and the support sheet, the adhesive force between the resin film forming layer and the support sheet is reduced, and the pick-up property of the semiconductor chip is improved. When the semiconductor chip is picked up in this manner, the cut resin film forming layer can be adhered to the back surface of the semiconductor chip and peeled off from the support sheet.

  In addition, a so-called tip dicing method can be used as a method for cutting a semiconductor wafer to obtain a semiconductor chip. Specifically, a groove having a depth of cut shallower than the wafer thickness is formed from the surface of the semiconductor wafer on which the circuit is formed, and the resin of the sheet laminate for resin film formation according to the present invention is formed on the circuit forming surface. A film forming sheet is attached as a surface protective sheet. Thereafter, by grinding the back surface of the semiconductor wafer, the thickness of the wafer is reduced, and finally, the wafer is divided into individual chips. A method for cutting the resin film forming layer into a chip size is not particularly limited, and for example, a laser dicing method can be applied.

  Next, the semiconductor chip is placed on the substrate or the surface of another semiconductor chip (lower chip) via the resin film forming layer (hereinafter, the substrate on which the chip is mounted or the lower chip surface is referred to as “chip mounting portion”). ).

  The pressure at the time of mounting is usually 1 kPa to 200 MPa. Further, the chip mounting portion may be heated before mounting the semiconductor chip or heated immediately after mounting. The heating temperature is usually 80 to 200 ° C, preferably 100 to 180 ° C, and the heating time is usually 0.1 seconds to 5 minutes, preferably 0.5 seconds to 3 minutes.

  After placing the semiconductor chip on the chip mounting portion, further heating may be performed as necessary. The heating conditions at this time are in the above heating temperature range, and the heating time is usually 1 to 180 minutes, preferably 10 to 120 minutes.

  Alternatively, the resin film forming layer may be cured by using heat in resin sealing that is normally performed in package manufacturing, without temporarily performing the heat treatment after placement. By passing through such a process, the resin film formation layer hardens | cures and the semiconductor device with which the semiconductor chip and the chip mounting part were adhere | attached firmly can be obtained. Since the resin film forming layer is fluidized under die bonding conditions, the resin film forming layer is sufficiently embedded in the unevenness of the chip mounting portion, and generation of voids can be prevented and the reliability of the semiconductor device is improved.

In addition, the second method for manufacturing a semiconductor device includes attaching a resin film forming layer of a resin film forming sheet to the back surface of a semiconductor wafer having a circuit formed on the front surface, and then attaching a semiconductor chip having the resin film on the back surface. It is preferable to obtain. The resin film is a protective film for a semiconductor chip. The second method for manufacturing a semiconductor device preferably further includes the following steps (1) to (3), and the steps (1) to (3) are performed in an arbitrary order.
Step (1): The resin film forming layer is cured to obtain a resin film.
Step (2): peeling the resin film forming layer or resin film and the support sheet,
Step (3): dicing the semiconductor wafer and the resin film forming layer or resin film.

  First, the resin film forming layer of the resin film forming sheet is attached to the back surface of the semiconductor wafer. This step is the same as the attaching step in the first method for manufacturing a semiconductor device.

  Thereafter, steps (1) to (3) are performed in an arbitrary order. For example, the steps (1) to (3) are performed in the order of steps (2), (1), (3), the steps (1), (2), (3), the steps (1), (3), It is performed in the order of (2), the order of steps (3), (1), (2), or the order of steps (3), (2), (1). Details of this process are described in detail in JP-A-2002-280329. As an example, a case where the steps (2), (1), and (3) are performed in this order will be described.

First, a resin film forming layer of a resin film forming sheet is attached to the back surface of a semiconductor wafer having a circuit formed on the front surface. Next, the support sheet is peeled from the resin film forming layer to obtain a laminate of the semiconductor wafer and the resin film forming layer.
Next, the resin film forming layer is cured to form a resin film on the entire surface of the wafer. When the resin film forming layer contains an epoxy compound (B11) or a curable polymer component (AB) having an epoxy group, the resin film forming layer is cured by thermal curing. When the resin film forming layer is blended with the energy ray reactive compound (B21) or the curable polymer component (AB) having a functional group that reacts with energy rays, the resin film forming layer is cured with energy. It can be performed by irradiation with a beam. Moreover, the curable polymer component (AB) which has an epoxy compound (B11) and an epoxy group, and the curable polymer component (AB) which has a functional group which reacts with an energy ray reactive compound (B21) or an energy ray. When used in combination, curing by heating and energy beam irradiation may be performed simultaneously or sequentially. Examples of the energy rays to be irradiated include ultraviolet rays (UV) and electron beams (EB), and preferably ultraviolet rays are used. As a result, a resin film made of a cured resin is formed on the back surface of the wafer, and the strength is improved as compared with the case of the wafer alone, so that damage during handling of the thinned wafer can be reduced. Further, compared with a coating method in which a coating solution for a resin film is directly applied to the back surface of a wafer or chip, the thickness of the resin film is excellent.

  Thereafter, the laminated body of the semiconductor wafer and the resin film is diced for each circuit formed on the wafer surface. Dicing is performed so as to cut both the wafer and the resin film. The wafer is diced by a conventional method using a dicing sheet. As a result, a semiconductor chip having a resin film on the back surface is obtained.

  Next, laser printing can be performed on the resin film. Laser printing is performed by a laser marking method, and the surface of the protective film is scraped off by laser light irradiation to mark a product number or the like on the protective film. Laser printing can also be performed before the resin film forming layer is cured.

  Finally, the diced chip is picked up by a general-purpose means such as a collet to obtain a semiconductor chip having a resin film on the back surface. Then, the semiconductor device can be manufactured by mounting the semiconductor chip on a predetermined base by the face-down method. In addition, a semiconductor device can be manufactured by bonding a semiconductor chip having a resin film on the back surface to another member (on a chip mounting portion) such as a substrate or another semiconductor chip. According to such a method for manufacturing a semiconductor device using a resin film forming sheet laminate according to the present invention, a highly uniform resin film can be easily formed on the back surface of a chip. Later cracks are less likely to occur.

  In addition, after sticking the resin film formation layer of the resin film formation sheet to the back surface of the semiconductor wafer, when performing the step (3) before the process (2), the resin film formation sheet serves as a dicing sheet. Can fulfill. That is, it can be used as a sheet for supporting the semiconductor wafer during the dicing process. In this case, the semiconductor wafer is bonded to the inner peripheral portion of the resin film forming sheet via the resin film forming layer, and the outer peripheral portion of the resin film forming sheet is bonded to another jig such as a ring frame, A resin film forming sheet affixed to the semiconductor wafer is fixed to the apparatus, and dicing is performed.

  Further, when the steps (3), (2), and (1) are performed in this order, a semiconductor chip having a resin film forming layer on the back surface is mounted on a predetermined chip mounting portion by a face-down method, and then package manufacturing is performed. The resin film forming layer can also be cured using heating in resin sealing that is usually performed.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples. The measurement and evaluation methods employed in the present invention are as follows.

<Confirmation of notch>
In the release sheet of the resin film forming sheet laminate, the confirmation that there is no notch along the outer periphery of the resin film forming layer from the surface on the resin film forming layer side is the outer periphery of the resin film forming layer. About arbitrary 4 points | pieces along, it performed by observing the peeling sheet surface with 300 times of magnification with an optical microscope.

<Elongation at break of resin film forming layer>
The elongation at break of the resin film forming layer was 23 ° C. in accordance with JIS K 7161: 1994 (ISO 527-1: 1993) using a universal tensile tester (Tensilon RTA-T-2M manufactured by Orientec Co., Ltd.). The measurement was performed at a tensile speed of 200 mm / min in an environment with a humidity of 50%.

<Breaking strength of resin film forming layer>
The breaking strength of the resin film forming layer was measured according to JIS K7127: 1999.

<Transferability of resin film-forming layer to adhesive layer>
The case where the resin film forming layer was cleaved into a desired shape along the outer periphery of the opening and transferred to the pressure-sensitive adhesive layer was evaluated as “A”. Moreover, although it was transcribe | transferred to an adhesive layer, the case where the chip | tip etc. resulting from cleaving at the edge part (outer peripheral part) of the resin film formation layer were visually recognized was evaluated as "B". On the other hand, the case where it was not able to transfer to an adhesive layer was evaluated as "C".

Preparation of Resin Film Forming Composition The following components were blended in the amounts shown in Table 1 to prepare resin film forming compositions 1-5.
(AB) Acrylic polymer: 55 parts by mass of butyl acrylate, 10 parts by mass of methyl acrylate, 20 parts by mass of glycidyl methacrylate, and 15 parts by mass of 2-hydroxyethyl acrylate (weight average molecular weight: 800,000, (Glass transition temperature: -28 ° C)
(A1) Acrylic polymer: acrylic polymer consisting of 95 parts by mass of methyl acrylate and 5 parts by mass of 2-hydroxyethyl acrylate (weight average molecular weight: 1,200,000, glass transition temperature: 8 ° C., manufactured by Toyochem)
(A2) Non-acrylic resin: polyester resin (Byron 220 manufactured by Toyobo Co., Ltd.)
(B11-1) Epoxy compound: Epoxy resin (EPICLON EXA-4850-150 manufactured by DIC)
(B11-2) Epoxy compound: Epoxy resin (EPPN-502H manufactured by Nippon Kayaku Co., Ltd.)
(B11-3) Epoxy compound: Epoxy resin (CNA-147 manufactured by Nippon Kayaku Co., Ltd.)
(B12-1) Thermosetting agent: phenol resin (MEH-7851-4H manufactured by Meiwa Kasei Co., Ltd.)
(B12-2) Thermosetting agent: Phenol resin (Mirex XLC-4L manufactured by Mitsui Chemicals)
(B13) Curing accelerator: 2PHZ-PW manufactured by Shikoku Kasei Kogyo Co., Ltd.
(C-1) Inorganic filler: Silica filler (manufactured by Admatechs SC2050-MA, particle size: 500 nm)
(C-2) Inorganic filler: Silica filler (manufactured by Admatechs, YA050C-MJA)
(E-1) Coupling agent: Silane coupling agent (KBM403 manufactured by Shin-Etsu Chemical Co., Ltd.)
(E-2) Coupling agent: Silane coupling agent (KBE403 manufactured by Shin-Etsu Chemical Co., Ltd.)
(E-3) Coupling agent: Silane coupling agent (X-41-1056 manufactured by Shin-Etsu Chemical Co., Ltd.)
(E-4) Coupling agent: Silane coupling agent (MKC silicate MSEP2 manufactured by Mitsubishi Chemical Corporation)
Crosslinking agent: Aromatic polyvalent isocyanate compound (Coronate L manufactured by Nippon Polyurethane Industry Co., Ltd.)

Example 1
The obtained methyl ethyl ketone solution (solid content concentration: 61% by weight) of the resin film-forming composition 1 was applied onto the release-treated surface of the release-treated resin film-forming layer transfer sheet (SPPET 381031 manufactured by Lintec Corporation) and dried ( Drying conditions: 100 ° C. for 1 minute in an oven, and a resin film forming layer having a thickness of 7 μm was formed on the resin film forming layer transfer sheet.

  Next, an adhesive sheet (D-175 manufactured by Lintec, adhesive layer thickness: 10 μm, substrate thickness: 80 μm) is prepared as a support sheet, and a first release sheet (SPPET 381031, thickness: 38 μm) is prepared on the adhesive layer. It laminated | stacked and the laminated body of the support sheet and the 1st peeling sheet was obtained. Subsequently, the laminated body was die-cut into a circular shape having a cutting depth of 60 μm and a diameter of 330 mm from the first release sheet side. As a result, a cut portion D1 having a cut depth d1 of about 20 μm was formed in the support sheet.

  Subsequently, the peeling adhesive tape was stuck on the peeling sheet side of the said laminated body, and the peeling adhesive tape was removed after that. Thereby, the circular 1st peeling sheet with a diameter of 330 mm was removed, the remaining part of the 1st peeling sheet was laminated | stacked on the adhesive sheet, and the 1st laminated body which has an opening part was obtained.

  Next, the resin film forming layer of the laminate of the resin film forming layer transfer sheet obtained above and the resin film forming layer is pasted on the opening side of the first laminate, and the resin film forming layer is fitted into the opening. Combined.

  Thereafter, when the interface between the remaining part of the first release sheet and the pressure-sensitive adhesive sheet is peeled off, the resin film forming layer is cleaved into a shape fitted into the opening, and a circle having a diameter of 330 mm is formed on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet. A resin film-forming layer having a shape remained. And the transfer property to the adhesive layer of a resin film formation layer was evaluated. The results are shown in Table 2.

  Then, a second release sheet (SPPET 381031, thickness: 38 μm) is attached to the surface of the adhesive sheet having the resin film forming layer, and the second laminate having the resin film forming layer between the second release sheet and the adhesive sheet. Got.

Next, from the pressure-sensitive adhesive sheet side of the second laminate, die cutting was performed in a circular shape having a cutting depth of 110 μm and a diameter of 370 mm so as to coincide with the center point of the resin film forming layer. As a result, a cut portion D2 having a cut depth d2 of about 20 μm was formed in the second release sheet. Finally, a circular pressure-sensitive adhesive sheet having a diameter of 370 mm was left on the second release sheet, and the remaining pressure-sensitive adhesive sheet was removed to obtain a resin film-forming sheet laminate of the embodiment in FIG.
It was confirmed that the release sheet (second release sheet) of the resin film-forming sheet laminate of Example 1 did not have a cut portion along the outer periphery of the resin film-forming layer from the surface on the resin film-forming layer side. .

(Examples 2 to 5)
A resin film-forming sheet laminate was obtained in the same manner as in Example 1 except that the resin film-forming compositions 2 to 5 were used instead of the resin film-forming composition 1 used in Example 1. .
It was confirmed that the release sheets of the resin film-forming sheet laminates of Examples 2 to 5 did not have cut portions along the outer periphery of the resin film-forming layer from the surface on the resin film-forming layer side.

  In the resin film-forming sheet laminates of Examples 4 and 5, the evaluation of transferability of the resin film-forming layer to the pressure-sensitive adhesive layer was “B”. When chipping or the like is visually observed at the end portion (outer peripheral portion) of the resin film forming layer, the adhesiveness of the resin film forming layer at the end portion to the adherend is lowered, and therefore the productivity of the semiconductor device is inferior. Sometimes.

100: Resin film forming sheet laminate 10: Resin film forming sheet 11: Support sheet 12 (12a): Resin film forming layer 13: Release sheet (second release sheet)
D1: Cut part D2: Cut part

Claims (4)

A release sheet is laminated on the resin film forming layer side of the resin film forming sheet including the support sheet and the resin film forming layer,
Release sheet, not to have a cut portion from the surface of the resin film layer side along the outer periphery of the resin film layer,
The support sheet has a notch along the outer periphery of the resin film forming layer from the surface on the resin film forming layer side,
A sheet laminate for forming a resin film , wherein the cut depth of the cut portion is 0 μm or more (excluding 0 μm) and is 2/3 or less of the thickness of the support sheet . A release sheet is laminated on the resin film forming layer side of the resin film forming sheet including the support sheet and the resin film forming layer,
The release sheet does not have a notch along the outer periphery of the resin film forming layer from the surface on the resin film forming layer side,
A resin film-forming sheet laminate in which the breaking elongation of the resin film-forming layer is 1000% or less and the breaking strength is 10 N / mm ² or less . The support sheet has a notch along the outer periphery of the resin film forming layer from the surface on the resin film forming layer side,
The sheet laminate for forming a resin film according to claim 2 , wherein the cut depth of the cut portion is 0 µm or more and 2/3 or less of the thickness of the support sheet. A step of die cutting the first release sheet of the laminate including the support sheet and the first release sheet;
Removing the stamped first release sheet to obtain a first laminate having an opening;
A process of attaching the resin film forming layer to the opening side of the first laminate, cleaving the resin film forming layer along the shape of the opening, and leaving the resin film forming layer in the shape of the opening on the support sheet ,
A step of obtaining a second laminate by laminating a second release sheet on the resin film forming layer side in the shape of the opening; and
The manufacturing method of the sheet | seat laminated body for resin film formation including the process of die-cutting a 2nd laminated body from the support sheet side.

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