KR20200045247A - Sterilizing unit and sterilizing apparatus - Google Patents

Abstract

A sterilization unit disclosed in one embodiment of the present invention comprises: a first cover comprising a first receiving part and a first opening part; a second cover comprising a second receiving part, a sub receiving part, and a heat dissipation part between the second receiving part and the sub receiving part; a circuit board disposed in the second receiving part; an ultraviolet ray emitting element disposed on the circuit board; and a waterproof member disposed between the circuit board and the first cover. The first cover is disposed on the ultraviolet ray emitting element and the waterproof member. The first opening part overlaps the ultraviolet ray emitting element in a vertical direction. The heat dissipation part may comprise a penetration hole for connecting the second receiving part and the sub receiving part. According to the present invention, a waterproof sterilization unit in a product which is applied for a high moisture environment can be provided.

Description

Sterilizing unit and sterilizing device having the same {STERILIZING UNIT AND STERILIZING APPARATUS}

An embodiment of the invention relates to a light source unit or a sterilization unit.

An embodiment of the present invention provides a light source unit having a waterproof member or a sterilizing device having a sterilizing unit.

A light emitting diode (LED) may constitute a light emitting source using a compound semiconductor material such as GaAs series, AlGaAs series, GaN series, InGaN series, and InGaAlP series.

These light-emitting diodes are packaged and used as light-emitting elements that emit various colors, and light-emitting elements are used as light sources in various fields such as a lighting indicator, a character indicator, and an image indicator for displaying colors.

Particularly, in the case of an ultraviolet light emitting diode (UV LED), in the case of a short wavelength, it is used for sterilization and purification, and in the case of a long wavelength, it can be used in an exposure machine or a curing machine. However, most environments in which a short wavelength ultraviolet light emitting diode is applied are often in high humidity or in water, resulting in device defects due to deterioration of moisture resistance and waterproof function, and operation reliability may be deteriorated.

An embodiment of the present invention provides a light source unit or a sterilization unit having a new waterproof and moisture proof structure.

An embodiment of the present invention provides a light source unit or a sterilizing unit having a fastening structure on outer circumferential surfaces of upper and lower portions of a cover on which a light source module is disposed.

An embodiment of the invention provides a light source unit or a sterilization unit in which a heat dissipation unit is disposed in a cover on which a light source module is disposed.

An embodiment of the present invention provides a light source unit that combines the first and second covers to protect the light source module in a fastening structure.

An embodiment of the present invention provides a light source unit or a sterilizing unit having a member for protecting a cover protecting a light emitting device from ultraviolet light.

An embodiment of the invention has a packing groove around the opening of the second cover, and provides a light source unit or a sterilizing unit in which a part of the light transmitting member disposed on the light source module is disposed in the packing groove.

An embodiment of the invention provides a light source unit having a waterproof member around the outside of the light emitting element.

An embodiment of the invention provides a light source unit having a double gasket structure on the outer periphery of the light emitting element.

An embodiment of the present invention provides a light source unit or a sterilizing unit in which a gasket is in close contact with a light transmitting element covering a light emitting element.

Embodiments of the invention may improve the reliability of the light source unit or sterilization unit having an ultraviolet light source.

An embodiment of the invention provides a sterilizing device having the light source unit or the sterilizing unit.

The sterilizing unit according to an embodiment of the present invention includes a first cover including a first receiving portion and a first opening portion; A second cover including a second accommodating part, a sub accommodating part, and a heat radiating part between the second accommodating part and the sub accommodating part; A circuit board disposed on the second receiving portion; An ultraviolet light emitting element disposed on the circuit board; And a waterproof member disposed between the circuit board and the first cover, wherein the first cover is disposed on the ultraviolet light emitting element and the waterproof member, and the first opening is perpendicular to the ultraviolet light emitting element. Overlapping, the heat dissipation portion may include a through hole communicating with the second receiving portion and the sub receiving portion.

According to an embodiment of the present invention, the first cover includes a second side wall having the first receiving portion open in a direction facing the second receiving portion, and the second cover includes a second having the second receiving portion. A side wall may be included, and the second side wall may be disposed in the first accommodation portion.

According to an embodiment of the invention, the thickness of the heat dissipation portion is greater than the depth of the second receiving portion, the volume of the sub-receiving portion may be larger than the volume of the second receiving portion.

According to an embodiment of the invention, the lower end of the first side wall may be disposed lower than the upper surface of the heat dissipation unit, and the upper surface of the heat dissipation unit may be disposed higher than the outer lower surface of the first cover.

According to an embodiment of the invention, the second side wall may include a second fastening structure on the outer circumferential surface, and the first side wall may include a first fastening structure fastened to the second fastening structure on the inner circumferential surface.

According to an embodiment of the invention, the second cover includes an outer sidewall having a third fastening structure on the lower outer circumferential surface, and the sub-receiving portion may be disposed in the outer sidewall.

According to an embodiment of the invention, the depth of the second receiving portion may be smaller than the depth of the first receiving portion and the depth of the sub-receiving portion.

According to an embodiment of the invention, the circuit board includes a hole corresponding to the through hole of the heat dissipation portion, the width of the hole of the circuit board may be smaller than the width of the through hole.

According to an embodiment of the invention, the second cover includes a body portion, the body portion protrudes outward than the second side wall from the heat dissipation portion, the thickness of the body portion may be smaller than the thickness of the heat dissipation portion.

According to an embodiment of the invention, the second cover may be formed of a metal material.

According to an embodiment of the invention, the first ring groove concave to the lower outer peripheral surface of the second side wall; A second ring groove at the bottom of the inner circumferential surface of the first side wall; And a first waterproof ring between the first ring groove and the second ring groove.

According to an embodiment of the invention, the waterproof member is disposed in the first receiving portion,

The waterproof member may include a first gasket surrounding the circumference of the light emitting device on an upper surface of the circuit board; A light transmissive member on the first gasket and the ultraviolet light emitting element; And a second gasket around the upper surface of the translucent member.

According to an embodiment of the invention, the first cover includes a recess recessed in the upper surface direction of the first cover around the first opening, the second gasket is disposed in the recess, and the first opening Is overlapped with the light emitting element in the vertical direction, and the first and second gaskets include a ring shape and may overlap the recess in the vertical direction.

According to an embodiment of the invention, the sub-receiving portion may include at least two or more of a sub-board, a power supply and a button module.

According to an embodiment of the invention, the ultraviolet light emitting device emits a wavelength band of 100nm to 280nm, and the translucent member, the first gasket and the second gasket may include a fluororesin material.

Sterilization device according to an embodiment of the invention, the member having a fastening structure on the outer peripheral surface; And the sterilizing unit fastened to the fastening structure of the member, the outer sidewall of the first cover of the sterilizing unit being fastened with the member, and the member may include a water tank or a water reservoir.

An embodiment of the invention may be provided with a waterproof sterilizing unit in a product that is applied to a high humidity or water environment.

Since the sterilizing unit according to the embodiment of the present invention covers the light emitting element with a light-transmitting member and closes the light-transmitting member with a double gasket, waterproof or moisture-proof properties may be improved.

The sterilization unit of the embodiment of the present invention can be arranged on the outer circumferential surface of the lower cover to protect the light emitting element and fastened with the outer circumferential surface of the upper cover, thereby blocking moisture penetrating in the lateral direction.

The sterilization unit according to an embodiment of the present invention may improve the heat dissipation efficiency by bringing the internal circuit board into contact with the heat dissipation portion of the cover.

The sterilization unit according to an embodiment of the present invention may be provided as a sterilization device in a high-humidity environment and water.

1 is an exploded perspective view of a light source unit according to an embodiment of the invention.
2 is an example of a plan view in which the light source module is coupled to the second cover of FIG. 1.
3 is a view showing an example in which the second gasket is aligned on the second cover and the circuit board in FIG. 2.
4 is a side cross-sectional view of the second gasket of FIG. 1.
5 is a side cross-sectional view showing an example in which the light source module and the waterproof member are disposed on the second cover in FIG. 1.
6 is a combined side view of the light source unit of FIG. 1.
7 is a view showing the recess on the first cover of FIG.
8 is a side cross-sectional view of the light source unit of FIG. 6.
9 is a partially enlarged view of the light source unit of FIG. 7.
10 is an example in which the light source unit of FIG. 6 is coupled to a sterilization apparatus according to an embodiment of the present invention.
11 is a modified example of the second cover as another example of the light source unit of the present invention.
12 is an exploded perspective view of the light source unit of FIG. 11 and the lid member.
13 is an example of a water bottle having the light source unit of FIG. 12.
14 is a partial side sectional view of the water bottle of FIG. 13.
15 is another example of a light source unit according to an embodiment of the present invention, and another example of the second cover and the reflective member.
16 is a view showing an example of a light emitting device of a light source unit according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical spirit of the present invention is not limited to some embodiments described, but may be implemented in various different forms, and within the scope of the technical spirit of the present invention, one or more of its components between embodiments may be selectively selected. It can be used by bonding and substitution. In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless specifically defined and described, can be generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as a meaning, and terms that are commonly used, such as predefined terms, may be interpreted by considering the contextual meaning of the related technology. In addition, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In the present specification, a singular form may also include a plural form unless specifically stated in the phrase, and is combined as A, B, C when described as "at least one (or more than one) of A and B, C". It can contain one or more of all possible combinations. In addition, in describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the component from other components, and the term does not determine the essence, order, or order of the component. And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also to the component It may also include a case of 'connected', 'coupled' or 'connected' due to another component between the other components. Further, when described as being formed or disposed in the "top (top) or bottom (bottom)" of each component, the top (top) or bottom (bottom) is one as well as when the two components are in direct contact with each other It also includes a case in which another component described above is formed or disposed between two components. In addition, when expressed as "up (up) or down (down)", it may include the meaning of the downward direction as well as the upward direction based on one component.

<First Example>

1 is an exploded perspective view of a sterilization unit or a light source unit according to an embodiment of the present invention, FIG. 2 is an example of a plan view in which the light source module is coupled to the second cover of FIG. 1, and FIG. 3 is a second cover and circuit in FIG. 2 2 is a view showing an example in which the second gasket is aligned on the substrate, FIG. 4 is a side sectional view of the second gasket in FIG. 1, and FIG. 5 is an example in which the light source module and the waterproof member are disposed on the second cover in FIG. 6 is a side sectional view of the light source unit of FIG. 1, FIG. 7 is a view showing a recess on the first cover of FIG. 6, FIG. 8 is a side sectional view of the light source unit of FIG. 6, and FIG. 9 Is a partially enlarged view of the light source unit of FIG. 7.

1 to 9, the sterilizing unit or the light source unit 300 according to an embodiment of the present invention includes a second cover 410, a light source module 200, a waterproof member 250 and a first cover 310. Includes.

The second cover 410 and the first cover 310 block the light source module 200 from being exposed and block external moisture or water from penetrating into the inside. The first cover 310 provides an emission path of light emitted from the inside, and the second cover 410 dissipates heat generated from the light source module 200 and provides a path connected to the outside. . The light source module 200 includes at least one light emitting device 100.

The light source module 200 is disposed between the first and second covers 310 and 410. The light source module 200 is disposed in the first cover 310, the second cover 410 is disposed under the light source module 200 and can be coupled to the outside of the first cover 310. have. The light emitting device 100 emits ultraviolet light, and may sterilize or purify an area irradiated with light through the sterilizing unit or the light source unit 300.

The waterproof member 250 may be disposed between the first and second covers 310 and 410. The waterproof member 250 waterproofs the boundary between the second cover 410, the light source module 200, and the first cover 310. The second cover 410 is fastened to other devices, and the sterilization unit or the light source unit 300 can be applied to a member such as a product for water purification or sterilization.

The sterilizing unit or the light source unit 300 is used as a sterilizing device for indoor units, evaporators, and condensate of refrigerators, or sterilizing devices in devices such as air washers, sterilization of water storage tanks and discharge water of water purifiers It can be used as a sterilization or purification function in sterilization devices in devices, various water bottles, and toilets.

<Second cover 410>

The second cover 410 includes a second side wall 411, a body portion 413 and an outer side wall 415.

The second cover 410 may protect the lower portion of the light source module 200 and provide a coupling structure with the first cover 310.

The second side wall 411 may protrude from the body portion 413 toward the first cover 310. The second side wall 411 may have a top view shape in a circular shape or a polygonal shape. The outer peripheral surface of the second side wall 411 includes a second fastening structure 27. The second fastening structure 27 may include a screw thread or a spiral groove.

The top view shape of the second side wall 411 may be the same as the bottom view shape of the first side wall 311 of the first cover 310. The second fastening structure 27 may be provided on the entire outer peripheral surface of the second side wall 411. Accordingly, the first cover 310 may be fastened through the upper end of the second side wall 411.

The second side wall 411 includes a second accommodating portion 401 therein, and the second accommodating portion 401 may be a region in which an upper surface is opened. A lower portion of the light source module 200 may be inserted into the second receiving portion 401. A circuit board 201 of the light source module 200 may be disposed on the second receiving part 401.

The body part 413 may include a heat dissipation part 420. The heat dissipation unit 420 may be disposed inside the second side wall 411 and the outer side wall 415. The heat dissipation unit 420 may be disposed at the center of the second cover 410.

The heat dissipation unit 420 may be provided at a predetermined thickness on the bottom of the second accommodation unit 401. The circuit board 201 may be disposed on the heat dissipation unit 420. The heat dissipation unit 420 may conduct heat or radiate heat generated from the circuit board 201 of the light source module 200. The heat dissipation unit 420 is connected to the second side wall 411 and the outer side wall 415 and may be provided with a thickness greater than the thickness of the circuit board 201 (eg, D8 in FIG. 5). The circuit board 201 may overlap the first opening 305 and the recess 390 in the vertical direction. An upper portion of the heat dissipation portion 420 may be disposed in the first accommodation portion 321. The top surface of the heat dissipation unit 420 may be disposed above the bottom of the second side wall of the first cover 310.

The depth D8 of the second accommodation portion 401 may be a depth from the top surface of the second cover 410 or the top surface of the second side wall 411 to the bottom of the heat dissipation portion 420. The depth D8 of the second accommodating portion 401 may be the same as the thickness of the circuit board 201. That is, the upper surface of the second side wall 411 and the upper surface of the circuit board 201 may be disposed on the same horizontal surface. Here, when considering a process error, the difference between the depth D8 of the second receiving portion 401 and the thickness of the circuit board 201 may be 0.05 mm or less.

Here, the height of the outer peripheral surface of the second side wall 411 may be greater than the depth D8 of the second receiving portion 401. Accordingly, since the second fastening structure 27 of the second side wall 411 is disposed to a lower region than the second receiving part 401, the lower end and the second receiving part of the second fastening structure 27 ( The distance from the 401) (that is, the moisture penetration distance) may be increased, and the binding force of the second fastening structure 27 may be strengthened. The height of the second side wall 411 is provided to be 1.5 times or more of the depth D8 of the second accommodating portion 401, thereby increasing the moisture penetration distance and strengthening the bonding force with the first cover 310. You can.

The heat dissipation unit 420 may include a through hole 405 vertically penetrated. Various signal cables (not shown) may be withdrawn from the through hole 405. One or two or more of the through holes 405 may be disposed in the heat dissipation unit 420. A part of the molding member may be injected into the through hole 405.

The body part 413 is disposed between the second side wall 411 and the outer side wall 415, and may protrude in an outer direction than the outer circumferential surfaces of the second side wall 411 and the outer side wall 415. The body portion 413 may include a circular shape or a polygonal bolt shape. Here, the body portion 413 may extend in a horizontal direction from the heat dissipation portion 420. The thickness of the body portion 413 is disposed smaller than the thickness of the heat dissipation portion 420, so that the fastening space of the second side wall 411 and the outer side wall 415 is not reduced. The other part may be a member such as a water storage tank or a lid member. The second cover 410 may be made of a metal or non-metal material, and the heat dissipation part 420 may be formed of a different metal material from the second cover 410 and combined with the second cover 410. .

The outer sidewall 415 extends in the lower direction and includes a third fastening structure 37 on the outer circumferential surface. The third fastening structure 37 may include a screw or spiral groove structure. The outer side wall 415 protrudes from the body portion 413 in a direction opposite to the second side wall 411, and may be provided in a circular shape or a polygonal shape.

The outer sidewall 415 may be provided at a height that can protrude or be fastened through other instruments based on the body portion 413. The third fastening structure 37 may be provided on the entire outer peripheral surface of the outer side wall 415. Accordingly, it can be fastened to other appliances through the lower end of the outer side wall 415.

The second side wall 411 and the outer side wall 415 may be disposed in a vertical direction with respect to the horizontal plane of the body portion 413. The second side wall 411 and the outer side wall 415 may overlap in a vertical direction.

1, 5, and 9, a first ring groove 42 is disposed in an area between a lower end of the outer circumferential surface of the second side wall 411 and the body portion 413, and the first ring groove 42 ) May have a ring-shaped first waterproof ring 431. The first waterproof ring 431 may include a rubber material, and may seal between the bottom of the second side wall 411 and the bottom of the first cover 310. Here, a second ring groove 41 is disposed at the lower end of the inner circumferential surface of the first cover 310 to compress the first waterproof ring 431. The second ring groove 41 and the first ring groove 42 may be disposed to face each other.

A third ring groove 43 is disposed in an area between the upper outer circumferential surface of the outer sidewall 415 and the body portion 413, and a second waterproof ring 433 in a ring shape is disposed in the third ring groove 43. It can be combined with. The second waterproof ring 433 may include a rubber material, and may seal between an external device fastened with an upper end of the outer side wall 415.

The bottom view shape of the outer sidewall 415 includes a circular shape, and as another example, a polygonal shape.

The outer sidewall 415 may include a sub-receiving portion 450 with a lower surface open. The sub-receiving portion 450 may be in communication with or connected to the second receiving portion 401 through the through hole 405 of the heat dissipation portion 420. As another example, the sub-receiving portion 450 may include a fastening structure or a stepped structure therein.

The sub-receiving portion 450 may be formed to a predetermined depth from the lower surface of the second cover 410. The sub-receiving portion 450 may be disposed inside the outer sidewall 415 having a predetermined height from the lower surface of the heat dissipation portion 420. The second accommodating part 401 and the sub accommodating part 450 may overlap in a vertical direction. The second receiving portion 401 and the sub-receiving portion 450 may overlap the first opening portion 305 in the vertical direction. The second accommodating portion 401 is concave in the lower surface direction from the upper surface of the second cover 410, and the sub-receiving portion 450 may be concave in the upper surface direction from the lower surface of the second cover 410. have.

The depth of the sub-receiving portion 450 may be greater than the depth of the second receiving portion 401. The depth of the sub-receiving portion 450 is disposed at least 1.5 times the depth of the second receiving portion 401, thereby providing an outer fastening space and an inner receiving space of the outer sidewall 415. As another example, the second receiving portion 401 may be provided with a fastening structure or a stepped structure on the inner circumferential surface to facilitate fastening or insertion with other members. The volume of the sub-receiving portion 450 may be larger than the volume of the second receiving portion 401. Accordingly, various parts or modules may be mounted through the sub-receiving unit 450.

When the second side wall 411 has a circular shape, the inner diameter of the second side wall 411 (B0 in FIG. 3) and the inner diameter of the outer side wall 415 may be the same. As another example, the inner diameter of the second side wall 411 may vary depending on the size of the circuit board 201 inserted into the second receiving portion 401. The inner diameter of the outer sidewall 415 may vary depending on the size of the sub-substrate 220 inserted into the sub-receiving portion 450. The outer diameter of the outer side wall 415 is the same as or smaller than the outer diameter of the second side wall 411, thereby reducing a waterproof area due to coupling with other devices.

The second cover 410 may include a metal material or a plastic material. The metal material may include at least one of chromium (Cr), molybdenum (Mo), nickel (Ni), aluminum (Al), and stainless steel. The plastic material is glass (glass), plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), PBT (Polybutylene Terephthalate), POM (Poly Oxy Methylene, Polyacetal), PPO (Polyphenylene Oxide) resin, Or it may be made of at least one of a modified PPO (Modified PPO) resin. Here, the modified PPO (Modified PPO) resin includes a resin in which PPO is mixed with a resin such as PS (Polystyrene) or polyamide (PA), has heat resistance and is characterized by stably maintaining physical properties even at low temperatures.

<First cover 310>

Referring to FIG. 5, the first cover 310 may include a first side wall 311 having a first opening 305 and an outer circumferential surface 13 on the upper surface 11. The first cover 310 includes a first receiving portion 321 with a lower surface open. The first accommodation portion 321 may be connected to the first opening portion 305.

The upper surface 11 of the first cover 310 is provided in a flat plane, and may be connected to the first receiving part 321 through the first opening 305. An upper recess 302 having an inclined surface inclined in the direction of the first opening 305 from the flat plane may be provided around the first opening 305. The first opening 305 is disposed at the center of the first cover 310 and may be provided in a shape penetrated in a vertical direction.

An inner circumferential surface of the first side wall 311 includes a first fastening structure 17, and the first fastening structure 17 may include a screw thread or a spiral groove. Since the first fastening structure 17 is provided around the first receiving portion 321, the light source module 200 and the waterproof member 250 can be compressed in the first cover 310.

5, the depth of the first receiving portion 321 may be greater than the depth of the outer peripheral surface of the second side wall 411. The depth of the first accommodating portion 321 may be greater than the sum of the thicknesses of the light source module 200 and the waterproof member 250 inside, so that the fastening between the second side wall 411 and the first cover 410 It can be provided as a space. The width D3 of the first accommodating portion 321 may be equal to or larger than the diameter or width of the waterproof member 250. The first accommodation part 321 may be provided to guide the insertion of the waterproof member 250 and to have a difference in minimum width to maintain airtightness.

In the horizontal direction, the width of the first receiving portion 321 may be greater than the width of the second receiving portion 401. The lower surface area of the first receiving portion 321 may be larger than the upper surface area of the second receiving portion 401. The lower surface area of the first receiving portion 321 may be larger than the upper surface area of the circuit board 201. Accordingly, the second side wall 411 and the first side wall 311 may be disposed in the circumference of the circuit board 201.

The first opening 305 has an area smaller than the lower surface area of the first accommodating part 321, and is an area where light emitted from the light source module 200 is emitted. Light may be reflected on the inclined surface around the first opening 305 to improve light extraction efficiency.

The top view shape of the first opening 305 may include a circular shape, and may be a polygonal shape as another example. The first opening 305 may have the same shape as the light emitting device 100 of the light source module 200. The width D1 of the first opening 305 in the horizontal direction may be provided larger than the width of the light emitting device 100. The width D1 of the first opening 305 may be smaller than the width D2 of the upper recess 302.

A plurality of grooves may be arranged in the vertical direction on the outer peripheral surface of the first side wall 311 of the first cover 310. Since the plurality of grooves are arranged at regular intervals, when the first cover 310 is used as a handle, the second cover 410 may be fastened or loosened from the second cover 410.

The first cover 310 may include a recess 390. The recess 390 may be disposed on the first receiving portion 321. The recess 390 may be formed in a ring shape. The recess 390 may be provided in a concave structure in the direction of the upper surface 11 of the first cover 310 in the first receiving portion 321. The recess 390 may be disposed above a horizontal straight line on the bottom or bottom surface of the first opening 305. The recess 390 may be recessed or recessed in a vertical direction with respect to a straight line extending horizontally from the bottom or bottom surface of the first opening 305. The recess 390 may be disposed closer to the first side wall 311 than the first opening 305.

The first cover 310 may include a metal material or a plastic material. The metal material may include at least one of chromium (Cr), molybdenum (Mo), nickel (Ni), aluminum (Al), and stainless steel. The plastic material is glass (glass), plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), PBT (Polybutylene Terephthalate), POM (Poly Oxy Methylene, Polyacetal), PPO (Polyphenylene Oxide) resin, Or it may be made of at least one of a modified PPO (Modified PPO) resin. Here, the modified PPO (Modified PPO) resin includes a resin in which PPO is mixed with a resin such as PS (Polystyrene) or polyamide (PA), has heat resistance and is characterized by stably maintaining physical properties even at low temperatures.

The second cover 410 and the first cover 310 may be the same material or different materials. For example, the first and second covers 310 and 410 may be the same metal material or plastic material. The second cover 410 may be a metal material, and the first cover 310 may be a non-metal material. The second cover 410 may be a non-metal material, and the first cover 310 may be a metal material. When the first cover 310 is made of a metal, it is possible to prevent a problem that the first cover 310 is discolored, deteriorated, or cracked by ultraviolet light emitted from the light emitting device 100.

Light emitted from the light emitting device 100 through the first opening 305 of the first cover 310 may be emitted. When the first cover 310 is made of a non-metallic material such as plastic, ultraviolet light emitted from the light emitting device 100 may be irradiated to the first cover 310. The first cover 310 irradiated with the ultraviolet light may be discolored or deteriorated or cracked over time. When the first cover 310 is discolored, deteriorated or cracked, it causes a contamination of the place where the light source unit 300 is installed. This may be a problem that deteriorates the reliability of the light source unit 300 and the device employing it. As another example, a plating layer or a metal is disposed on the surface of the first opening 305 of the first cover 310 to protect the material of the first cover 310 from ultraviolet light.

<Light source module 200>

The light source module 200 may include a circuit board 201 and a light emitting device 100 disposed on the circuit board 201. The light emitting device 100 may include one or a plurality.

The circuit board 201 may be disposed in an inner space between the second cover 410 and the first cover 310. The circuit board 201 is inserted into the second accommodating portion 401 of the second cover 410, and a side surface of the circuit board 201 faces an inner surface of the second side wall 411. The top view shape of the circuit board 201 may be provided in the same shape as the top view shape of the second receiving portion 401. Accordingly, the space between the circuit board 201 and the second receiving portion 401 can be minimized, and a problem that an area or area to be waterproof is unnecessarily increased can be prevented.

The circuit board 201 may be disposed on the heat dissipation unit 420. The circuit board 201 may contact the top surface of the heat dissipation unit 420. Accordingly, a lower surface of the circuit board 201 may be provided without a circuit pattern. A metal layer may be disposed on the lower surface of the circuit board 201 to contact the upper surface of the heat dissipation unit 420.

2 and 3, the circuit board 201 includes regions in which circuit patterns 23 disposed thereon are disposed, and may include first and second electrode patterns. The circuit board 201 may include a connector or component 25 on the top. The circuit board 201 may include an edge region or a non-pattern region 26 in which a circuit pattern is removed on an outer portion of the upper surface of the circuit board 201, and the non-pattern region 26 is formed in a ring shape on the circuit board 201. Can be. The non-patterned area 26 may block electrical interference on the upper surface of the circuit board 201, and may support the inner portion of the waterproof member 250. The non-pattern region 26 may be disposed around the region where the circuit pattern is disposed.

As shown in FIG. 5, the thickness of the circuit board 201 may be the same as the depth D8 of the second receiving portion 401. The upper surface of the circuit board 201 may be the same height as the upper surface of the second side wall 411. The light emitting device 100 may overlap the first opening 305 in a vertical direction.

The circuit board 201 may include a hole 205 for drawing out a signal cable connected to the connector or component 25. The hole 205 of the circuit board 201 may be arranged in alignment with the through hole 405 of the heat dissipation unit 420. The hole 205 of the circuit board 201 may be equal to or smaller than the through hole 405 of the heat dissipation unit 420.

The circuit board 201 may include a circuit pattern 25 on the top. The circuit board 201 is made of a resin printed circuit board (PCB), a metal core PCB (MCPCB, Metal Core PCB), a non-flexible PCB, a flexible PCB (FPCB, Flexible PCB), or a ceramic material. It may include at least one. The circuit board 201 may include a layer of a resin material or a ceramic-based layer, and the resin material is a heat-curable resin including silicone, epoxy resin, or plastic material, or a high heat resistance and high light resistance material. Can be formed. The ceramic material includes low temperature co-fired ceramic (LTCC) or high temperature co-fired ceramic (HTCC), which are simultaneously fired. When the circuit board 201 is an MCPCB material in which a metal layer is disposed below, heat dissipation efficiency through the heat dissipation unit 420 may be improved.

The light emitting device 100 may emit a selective wavelength within the range of ultraviolet light to visible light. The light emitting device 100 may emit ultraviolet light, for example. The ultraviolet light may include a UV-C wavelength. The ultraviolet wavelength may include light having a maximum intensity in a wavelength band of 400 nm or less, for example, 200 nm to 280 nm. The ultraviolet wavelength may have a sterilizing function and may be changed according to a target microorganism. One or a plurality of light emitting chips 131 may be disposed in the light emitting device 100. The light emitting device 100 may be implemented with one or a plurality of LED chips. The waterproof member 250 may be disposed around the one or a plurality of LED chips. When the light emitting device 100 is one or a plurality of LED chips, a body or a translucent member disposed on the LED chip may be removed.

6 and 10, the light emitting device 100 emits light L1 in an upper direction of the second cover 310. The light L1 of the light emitting device 100 may be emitted with a predetermined directivity distribution, thereby purifying or sterilizing water.

<Waterproof member 250>

The waterproof member 250 may be disposed between the circuit board 201 and the first cover 310. The waterproof member 250 seals the circumference and the upper portion of the light source module 200. The waterproof member 250 may include a plurality of gaskets or a plurality of packing members. The waterproof member 250 may include a double gasket stacked in the vertical direction.

The waterproof member 250 may include a plurality of gaskets 260 and 275 and a translucent member 271. For example, the waterproof member 250 is a light-transmitting member 271 disposed on an upper portion of the light emitting device 100, a second gasket 260 disposed between the circuit board 201 and the light-transmitting member 271 ), And at least one or more of the first gasket 275 disposed between the translucent member 271 and the first cover 310.

The second gasket 260 may be disposed on the circuit board 201 to surround the light emitting device 100. The second gasket 260 may have a second opening 261 through which the light emitting device 100 passes, and may be disposed between the circuit board 201 and the translucent member 271. The second gasket 260 may be provided in a ring shape. The maximum width or diameter in the horizontal direction of the second gasket 260 may be greater than the width or diameter of the circuit board 201.

The first gasket 275 has a third opening 276 that opens an upper surface of the light emitting device 100 and is disposed between the translucent member 271 and the recess 390 of the first cover 310. Can be. The second gasket 260 is disposed between the lower surface of the translucent member 271 and the upper surface of the circuit board 201, and seals the circumference of the light emitting device 100.

The first gasket 275 may be disposed between the outer surface of the light-transmitting member 271 and the upper surface of the recess 390. The first gasket 275 may seal the circumference of the upper surface of the translucent member 271. The thickness of the first gasket 275 in the vertical direction may be greater than the depth in the vertical direction of the recess 390. Accordingly, when squeezing the first gasket 275 in the vertical direction, an elastic repulsive force according to the squeezing of the first gasket 275 may be provided in the direction of the translucent member 271.

The recess 390 may overlap the waterproof member 250 in a vertical direction. The recess 390 may overlap the at least one or both of the second gasket 260, the transmissive member 271, and the first gasket 275 in the vertical direction.

The light emitting device 100 may be inserted into the second opening 261 of the second gasket 260. The second opening 261 may be opened vertically in the thickness direction of the second gasket 260 in the vertical direction, and an upper surface of the circuit board 201 may be exposed. The top-view shape of the second opening 261 may be a circular shape or a polygonal shape, or the same shape as the outer shape of the light emitting device 100.

The thickness D7 of the second gasket 260 is the thickness before compression and may be disposed thicker than the thickness of the light emitting device 100. The thickness D7 of the second gasket 260 may be 2 mm or less, for example, in the range of 1.3 mm to 2 mm or in the range of 1.2 mm to 1.7 mm. If the thickness D7 of the second gasket 260 is larger than the above range, improvement in waterproof efficiency may be insignificant, and if it is smaller than the above range, elastic repulsion force may deteriorate and compression force between the translucent members 271 may deteriorate. have. The second gasket 260 may include a resin material having elasticity. The material of the second gasket 260 may be a resin material such as NBR (Nitrile Butadiene Rubber), EPDM (Ethylene Propylene), silicone, and the like. As another example, the second gasket 260 may be formed of a fluorine-based rubber material. The second gasket 260 may be used as at least one of Polychlorotrifluoroethylene (PCTFE), Ethylene + Tetrafluoroethylene (ETFE), Fluorinated ethylene propylene copoly-mer (FEP), and Perfluoroalkoxy (PFA). The second gasket 260 made of the fluorine material may have improved heat resistance, chemical resistance, and abrasion resistance.

3 and 4, the second gasket 260 along the circumference of the second opening 261, a plurality of upper projections (61,62) and the first between the upper projections (61,62) A recessed area 63 and a plurality of lower protrusions 64 and 65 and a second concave area 66 between the lower protrusions 64 and 65 may be included. The plurality of upper protrusions 61 and 62 may be formed in a ring shape having different diameters from the center of the second gasket 260. The plurality of lower protrusions 64 and 65 may be formed in a ring shape having different diameters from the center of the second gasket 260. The upper protrusions 61 and 62 and the lower protrusions 64 and 65 may be arranged to overlap in a vertical direction. When the upper protrusions 61 and 62 and the lower protrusions 64 and 65 overlap in the vertical direction, the compression ratio of the second gasket 260 may be higher.

The first concave region 63 may be recessed in the lower surface direction of the second gasket 260, and the second concave region 66 may be recessed in the upper surface direction of the second gasket 260. The first concave region 63 and the second concave region 66 may include a groove shape.

In the second gasket 260, the upper protrusions 61 and 62 and the lower protrusions 64 and 65 may be compressed in the vertical direction and spread in the horizontal direction during compression. The upper and lower surfaces of the compressed second gasket 260 may have an increased adhesive area. The upper protrusions 61 and 62 and the lower protrusions 64 and 65 of the second gasket 260 may be arranged to overlap in the vertical direction. The upper projections 61 and 62 and the lower projections 64 and 65 of the second gasket 260 may be compressed or compressed in the vertical direction by external force. When the second gasket 260 is compressed in the vertical direction, the upper protrusions 61 and 62 and the lower protrusions 64 and 65 may be spread and compressed more widely in the horizontal direction.

In the second gasket 260, the protrusions 61, 62, 64, and 65 have a ring shape and may be disposed along the circumference of the second opening 261. In the second gasket 260, the ring-shaped protrusions 61, 62, 64, and 64 have a side cross-section protruding in an X shape, and thus can provide a double compression effect on the upper and lower surfaces of the second gasket 260, and are waterproof. It can improve efficiency.

3, 8, and 9, the lower surface of the second gasket 260 may face the upper surface of the circuit board 201 and the upper surface of the second side wall 411 of the second cover 410. have. The lower protrusions 64 and 65 of the second gasket 260 may overlap the upper surface of the circuit board 201 and the upper surface of the second side wall 411 in the vertical direction. For example, among the lower protrusions 64 and 65 of the second gasket 260, the inner protrusion 65 faces the circuit board 201, and the outer protrusion 65 has the second cover 410. It can face the upper surface of the second side wall (411). The inner protrusion 65 among the lower protrusions of the second gasket 260 may be disposed on the non-patterned area 26 of the circuit board 201. Accordingly, since the inner protrusion 65 and the non-pattern region 26 are in close contact, the circuit pattern (23 in FIG. 3) on the circuit board 201 can be protected. The inner protrusion 65 may be in contact with the circuit pattern 23 and the non-pattern region 26, but is not limited thereto.

2 and 3, the distance between the inner end of the non-patterned region 26 and the outer circumferential surface of the second side wall 411 is equal to the width B1 between the inner circumferential surface and the outer circumferential surface of the second gasket 260, or It may be 90% or more of the width B1. The diameter of the region where the circuit pattern of the circuit board 201 is disposed may be the same as the diameter B2 of the inner circumferential surface of the second gasket 260 or 90% or more of the diameter B2.

Since the lower surface of the second gasket 260 is disposed on the upper surface of the circuit board 201 and the second cover 410, and the upper surface is disposed on the lower surface of the translucent member 271, the second cover 410 is When fastened to the first cover 310, the second gasket 260 may be compressed. The second gasket 260 may be compressed between the light-transmitting member 271 and the circuit board 201 / second side wall 411 and seal the outer region of the light emitting device 100. Accordingly, the second gasket 260 may block moisture or water penetrating through the circumference of the light emitting device 100.

Here, in order to improve the waterproof efficiency, the through hole 405 of the heat dissipation unit 420 and the hole 205 of the circuit board 201 may be molded together with a signal cable into a molding unit. A molding part may be disposed on a side surface of the light emitting device 100. The surface or component of the circuit pattern 23 may be molded into a molding part.

5 and 8, the translucent member 271 protects the top surface of the light emitting device 100. The translucent member 271 may be spaced apart from the top surface of the light emitting device 200 or may be in contact with the top surface of the light emitting device 200. The translucent member 271 may seal the circumference of the light emitting device 100 together with the first and second gaskets 275 and 260 without lowering the transmittance of light emitted through the light emitting device 100.

The translucent member 271 may be disposed between the first cover 310 and the light source module 200. The translucent member 271 may be spaced apart from the upper surface of the circuit board 201. The translucent member 271 may be disposed between the first gasket 275 and the second gasket 260. The transmissive member 271 may face the transparent window 161 of the light emitting device 100 and transmit light. The outer portion of the light-transmitting member 271 extends outwardly than the region of the light emitting device 100 and may be disposed between the first and second gaskets 275 and 260. The top surface area of the light-transmitting member 271 may be larger than the top surface area of the light emitting device 100 and the bottom surface area of the first opening 305. The width of the translucent member 271 in the horizontal direction may be greater than the width of the light emitting device 100. The width of the translucent member 271 in the horizontal direction may be greater than the width of the second receiving portion 401. The width or the lower surface area of the translucent member 271 may be 80% or more of the width or the lower surface area of the first receiving portion 323. The outer portion of the translucent member 271 may face the upper protrusions 61 and 62 of the second gasket 260. The light-transmitting member 271 may have an area larger than the bottom area of the second receiving portion 401 and may be disposed on the light emitting device 100 and the circuit board 201.

The translucent member 271 may include fluorine. The fluorine has a strong chemical bond with carbon, and the destruction of bonds between molecules by ultraviolet rays does not occur. The light-transmitting member 271 may be defined as a fluororesin-based layer, and the molecular chain of the light-transmitting member 271 is a helical structure, and the structure of the molecular chain is a three-dimensional helical structure, around the carbon-carbon bond. The fluorine atom is blocked without gaps, thereby protecting the destruction of molecular chains due to invasion of ultraviolet rays and oxygen. In addition, the light-transmitting member 271 can protect the material because moisture such as oxygen, water, or oil blocks penetration to the surface of the material as much as possible. The light-transmitting member 271 transmits light emitted from the light emitting device 100 and may improve waterproof and moisture-proof problems.

The translucent member 271 may be a waterproof film or an optical film. The thickness of the translucent member 271 may be 1 mm or less, for example, 0.1 mm or less, or 0.05 mm to 0.1 mm or less, and if it is thicker than the above range, the light transmittance is low and if it is smaller than the above range, stiffness or waterproof efficiency may decrease. A transmittance of 70% or more, for example, 70% to 95%, for a wavelength emitted from the light emitting chip 131 of the translucent member 271 may be provided. If the transmittance is less than 70%, optical reliability due to deterioration of function may be deteriorated. The light-transmitting member 271 can transmit the light emitted from the light-emitting chip 131 without damage.

The light-transmitting member 271 may include at least one of polychlorotrifluoroethylene (PCTFE), ethene + tetrafluoroethylene (ETFE), fluorinated ethylene propylene copoly-mer (FEP), and perfluoroalkoxy (PFA). Here, the transmittance at the ultraviolet wavelength is high in the order of PCTFE, ETFE, FEP, PFA, and when looking at the moisture absorption at the ultraviolet wavelength, it is high in the order of PCTFE, FEP, PFA. The light-transmitting member according to an embodiment of the present invention may use at least one of PCTFE, FEP, and PFA.

5 and 8, the first gasket 275 may be disposed between the top surface of the translucent member 271 and the top surface of the recess 390. The first gasket 275 may be disposed in the recess 390. The first gasket 275 includes a third opening 276, and the width of the third opening 276 may be greater than the width D1 of the first opening 305. The maximum distance D2 between the recesses 390 is equal to or smaller than the diameter of the third opening 276 of the first gasket 275, so that the first gasket 275 is the recess 390 Can be put on.

The thickness D6 of the first gasket 275 is disposed larger than the depth D5 of the recess 390, and the first gasket 275 has an elastic repulsive force when compressed and is attached to the recess 390. Can be compressed. Since the first gasket 275 is compressed to the recess 390, the position of the light emitting device 100 moves closer to the first opening 305, and is emitted from the light emitting device 100. The emitted light may be emitted to the first opening 305 and optical interference with the first gasket 275 may be reduced.

5 and 7, the inner wall portion 319 between the recess 390 and the first opening 305 may block light from traveling in the direction of the recess 390. The inner wall portion 319 may be spaced apart from the translucent member 271 in a vertical direction. The lower surface of the inner wall portion 319 may be spaced apart in a vertical direction from the upper surface of the translucent member 271. The lower surface width C1 of the inner wall portion 319 is disposed larger than the width of the inclined upper recess 302, so that the recess 390 can be spaced apart from the inclined surface. That is, the inner wall portion 319 can prevent the stiffness of the region where the recess 390 is formed from deteriorating.

In addition, by storing the first gasket 275 inside the recess 390, the thickness of the waterproof member 250 can be reduced, and between the light emitting device 100 and the first opening 305 The spacing of can be reduced. Since the first gasket 275 is disposed on the recess 390, the translucent member 271 and the light emitting device 100 may be disposed closer to the first opening 305 and reduce light loss. The light extraction efficiency can be improved.

Since the first gasket 275 is compressed to the recess 390, the path of moisture or water penetrating through the first opening 305 can be lengthened and the waterproof effect can be increased. The second gasket 260 may block moisture or water penetrating through the interface with the upper surface of the circuit board 201. Since the upper surface of the second gasket 260 is in close contact with the light-transmitting member 271, and the lower surface is in close contact with the upper surface of the circuit board 201, a waterproof effect in the lateral direction of the second gasket 260 can be provided.

The thickness D6 of the first gasket 275 has a thickness greater than that of the light-transmitting member 271, and may be, for example, twice or more than the thickness of the light-transmitting member 271. The thickness D6 of the first gasket 275 may be 0.5 mm or less, for example, in the range of 0.1 mm to 0.5 mm. When the thickness D6 of the first gasket 275 is thicker than the above range, between the first gasket 275 and the translucent member 271, between the first gasket 275 and the first cover 310 The adhesive strength may be lowered or the waterproof efficiency may be lowered, and if it is thinner than the above range, rigidity may be lowered. By setting the thickness D6 of the first gasket 275 to 0.5 mm or less, the airtightness between the first gasket 275 and the upper surfaces of the light-transmitting member 271 and the first receiving portion 321 can be maximized.

The first gasket 275 may include a resin material having elasticity. The first gasket 275 may be made of a resin material such as NBR (Nitrile Butadiene Rubber), EPDM (Ethylene Propylene), silicone, or the like. The first gasket 275 may be formed of a fluorine-based rubber material. The first gasket 275 may be used as at least one of polychlorotrifluoroethylene (PCTFE), ethene + tetrafluoroethylene (ETFE), fluorinated ethylene propylene copolymer (FEP), and perfluoroalkoxy (PFA). The first gasket 275 made of the fluorine material may have improved heat resistance, chemical resistance, and abrasion resistance. The second gasket 260 and the first gasket 275 may be different materials or the same material. At least one or both of the second gasket 260, the first gasket 275, and the translucent member 271 may be formed of a fluorine material, thereby reducing damage caused by ultraviolet light and maximizing waterproof properties.

The light-transmitting member 271, the second gasket 260, and the first gasket 275 are formed of a fluorine resin-based material, thereby reducing the influence by ultraviolet wavelengths and reducing light loss.

Meanwhile, as shown in FIGS. 1, 6, and 8, a sub-substrate 220 may be disposed on the sub-receiving portion 450 of the first cover 310, and the sub-substrate 220 may have a cable hole 225. ) And can be connected to a signal cable. A connector may be disposed on the sub-board 220. This eliminates the problem caused by height limitation on the circuit board 201 by placing a product having a relatively large thickness or height among the components mounted on the circuit board 201 and the sub board 220 under the sub board 220. can do. Accordingly, an interval between the circuit board 201 and the first cover 310 may be reduced. For example, an external connection connector 455 may be disposed on the sub-board 220.

1 and 5, the coupling process of the light source unit will be described.

A circuit board 201 on which the light emitting device 100 is mounted is accommodated in the second receiving portion 401 of the second cover 410. The light emitting device 100 may be disposed on the upper surface of the circuit board 201 and emit light having an ultraviolet wavelength. The circuit board 201 is disposed on the heat dissipation unit 420 of the second cover 410. At this time, the through hole 405 of the heat dissipation unit 420 and the hole 205 of the circuit board 201 may be aligned on the same straight line, and the signal cable may be drawn out.

A second gasket 260 is disposed on an outer portion of the circuit board 201 and an upper surface of the second cover 410. The protrusions 64 and 65 disposed on the lower surface of the second gasket 260 may be disposed on the upper surface of the second side wall 411 and the outer portion of the circuit board 201. Here, the light emitting device 100 may be disposed in the second opening 261 of the second gasket 260.

The light transmitting member 271 is disposed on the second gasket 260. The translucent member 271 may cover the second gasket 260 and the top surface of the light emitting device 100.

A first gasket 275 is disposed around the upper surface of the translucent member 271. The first gasket 275 may be disposed to overlap the second gasket 260 in a vertical direction. The first gasket 275 includes a third opening 276, and the third opening 276 may overlap the second opening 261 in a vertical direction. The first and second gaskets 275 and 260 have a ring shape and surround the lower and upper surfaces of the translucent member 271. The second gasket 260, the translucent member 271 and the second gasket 275 may be defined as a waterproof member 250.

Thereafter, a second cover 410 in which the waterproof member 250 is disposed is arranged inside the first receiving portion 321 of the first cover 310. At this time, the fastening structure 27 disposed on the outer circumferential surface of the second side wall 411 of the second cover 410 may be fastened along the fastening structure 17 disposed on the inner circumferential surface of the first cover 310. When the fastening is completed by the fastening structures 17 and 27, the second cover 410 may be moved in the vertical upward direction, or the first cover 310 may be moved in the vertical downward direction. The waterproof member 250 is compressed by the movement of the second cover 410 in the vertical direction, and the light emitting device 100 faces the first opening 305 of the first cover 310. . In addition, the first gasket 275 may be disposed in a compressed state in the recess 390 of the first cover 310. The translucent member 271 may be exposed to the first opening 305.

In addition, the first waterproof ring 321 disposed around the lower end of the second side wall 411 of the second cover 410 may be in close contact with the lower end of the first side wall 311 of the first cover 310. have. The first waterproof ring 321 is waterproofed between the second cover 410 and the first cover 310. As another example, the first waterproof ring 321 may be removed when the first and second covers 310 and 410 are made of plastic and fused to each other.

When the first and second covers 310 and 410 are combined, the body portion 413 of the second cover 410 may be provided as a handle. That is, when the sterilizing unit or the light source unit 300 is coupled or disassembled to other instruments, it can be used as a handle.

Here, when another sub-substrate 220 is disposed in the sub-receiving unit 450, the sub-substrate 220 may be connected to a signal cable.

Referring to FIGS. 6 and 10, a second waterproof ring 433 is provided around an upper end of the outer side wall 415 of the second cover 410, and the second waterproof ring 433 is an example of FIG. 10. As described above, when coupled to the bottom of the water storage tank 720, the outer side wall 415 may protrude through the coupling hole 727 of the water storage tank 720. The water tank 720 and the body portion 413 of the light source unit 300 are waterproof. The reservoir 720 may be a space in which a liquid such as water is filled in the interior 725 or a liquid flows.

The outer side wall 415 of the second cover 410 may fasten the nut 470 through the fastening structure of the outer circumferential surface, thereby closely contacting and fixing the reservoir 750 and the light source unit 300.

11 is another example of the light source unit of FIG. 1. In describing FIG. 11, configurations identical to those described above will be referred to the description above, and configurations different from those of FIG. 1 will be described.

Referring to FIG. 11, the sterilizing unit or the light source unit 300A may include a second cover 410, a first cover 310, a light source module 200, and a waterproof member 250. The first cover 310, the light source module 200 and the waterproof member 250 will be applied with reference to the description disclosed above.

The second cover 410 includes a sub-receiving portion 450 whose lower surface is open, and the sub-receiving portion 450 exposes the lower surface of the circuit board 201. Here, the sub-receiving portion 450 may be connected to the sub-receiving portion 401. The inner circumferential surface of the sub-accommodating portion 401 may have a stepped structure 402 and may be connected to the inner circumferential surface of the sub-accommodating portion 450. A perimeter of the lower surface of the circuit board 201 may be disposed on the stepped structure 402.

The sub-accommodating part 450 of the second cover 410 may include a power supply part 480. The power supply unit 480 may be disposed on the sub-receiving unit 450 and contact the circuit board 201. The front Wooner supply unit 480 may be, for example, a battery pack, or may include a circuit module that supplies power to the battery pack. The power supply unit 480 may be electrically connected to the circuit board 201 and supply power.

A button module 490 may be disposed under the power supply unit 480 in the sub accommodation unit 450. The button module 490 may be electrically connected to the power supply 480 and may control on / off operation of the power supply 480. The button module 490 may include at least one of a touch type, pressure type, or electrostatic type module.

A fastening structure 47 may be disposed below the inner circumferential surface of the sub-receiving portion 450, and the fastening structure 47 may be fastened with a fastening structure 57 disposed on the outer peripheral surface of the button module 490. . The button module 490 includes an indicator 493 and may display an operation state of the light source module 200.

A hooking jaw 492 protrudes around the lower end of the button module 490, and when the hooking jaw 492 is coupled to another object, insertion may be restricted and may be combined with a hooking structure. The sub-receiving portion 450 may be the second receiving portion.

12, the sterilization unit or light source unit 300A may include a button module 490 and a power supply unit 480. The light source unit 300A emits ultraviolet light in a downward direction or a second cover 410 direction. The outer side wall 415 of the light source unit 300A may be coupled to the lid member 750. The lid member 750 includes lids of various containers, an engaging hole 755 is disposed inside, and a fastening structure 67 may be disposed on an inner circumferential surface of the engaging hole 755. The outer side wall 415 of the second cover 410 of the sterilization unit or the light source units 300 and 300A may be fastened to the fastening structure 67 of the coupling hole 755. Here, the container may be a water tank, a water tank, or a tank containing water, or may include a flow path through which water flows. The container may include a space filled with air or various kinds of food.

When the sterilizing unit or the light source units 300 and 300A are fastened to the lid member 750, they may be exposed on the upper surface of the lid member 750.

13, when the lid member 750 is coupled to the container 790, the light source units 300 and 300A coupled to the lid member 750 irradiate light inside the container 750 to sterilize. You can. The lid member 750 and the container 750 may be a part of the water bottle 700.

14, the pressing of the button member 490 may be repeated to control on / off of the battery module 480. The battery module 480 may be powered or cut off by pressing the button member 490. Additionally, in order to protect the user from the danger of the ultraviolet light, a safety switch capable of switching the battery module 480 into an operational standby mode when the lid member 750 is fastened on the entrance of the water bottle 700 (759) may be further included. The safety switch 759 may be disposed on the inner circumferential surface of the lid member 750 so that the lid member 750 can be operated when it is fully engaged with the fastening structure of the container. The lid member 750 may be connected to the button module 490, the battery module 480, and the light source module 200 inside.

15 is another example of the first cover in FIG. 1. When the first cover 310 is made of a plastic material, discoloration, deterioration or cracking by ultraviolet light may occur in the first cover 310. To this end, the reflective member 280 may be disposed on the inner circumferential surface and the outer bottom surface of the first opening 305.

Referring to FIG. 15 with reference to FIG. 8, the reflective member 280 is a member that blocks light emitted from the light emitting device 100 from being irradiated to the first cover 310, and the first opening ( 305) and the first cover 310. The reflective member 280 may be a metal material or include a reflective material. The reflective member 280 includes a metal material, and may be, for example, stainless steel or at least one of gold (Au), silver (Ag), titanium (Ti), nickel (Ni), and aluminum (Al).

The reflective member 280 may include a through hole 285, a support portion 281, and a reflection portion 283. The support part 281 is disposed outside the first opening part 305 of the first cover 310 and can prevent the reflective member 280 from coming off. The lower surface of the support part 281 may be disposed to face the upper surface of the circuit board 201 of the light source module 200. The support part 281 may be disposed between the circuit board 201 and the upper portion of the first cover 310. The reflective portion 283 is bent from the support portion 281 and may be disposed around the first opening portion 305. The reflection part 283 may be disposed perpendicular to or inclined to the support part 281. The reflection part 283 may include a through hole 285 therein. The through hole 285 is disposed in the first opening 305 and may be disposed to face the light emitting element. In the case of a metal frame, the reflective member 280 may be disposed in a range of 1 mm or less, for example, 0.3 mm to 1 mm. When the reflective member 280 is smaller than the above range, ultraviolet light can be transmitted, and when it is larger than the above range, the improvement of the UV blocking effect is minimal and the size of the through hole 285 is reduced or the thickness of the light source unit is increased. It can be done.

The upper end of the reflective member 280 may be the same as or different from the upper surface of the first cover 310. The difference between the upper end of the reflective member 280 and the upper surface of the first cover 310 may be 0.05 mm or less. When the upper end of the reflective member 280 protrudes larger than the difference than the upper surface of the first cover 310, the gap difference with the structure in which the first cover 310 is installed increases, resulting in light loss. Can occur.

16 is an example of a light emitting device of a light source unit according to an embodiment of the present invention.

Referring to FIG. 16, the light emitting device 100 includes a body 110 having a recess 111; A plurality of electrodes (121, 123, 125) disposed on the recess (111); A light emitting chip 131 disposed on at least one of the plurality of electrodes 121, 123, and 125; And a transparent window 161 disposed on the recess 111.

The light emitting chip 131 may include an optional peak wavelength within a range of ultraviolet wavelengths to visible light wavelengths. The light emitting chip 131 may emit, for example, a UV-C wavelength, that is, an ultraviolet wavelength in the range of 100 nm-280 nm. The light emitting chip 131 is an ultraviolet light emitting diode, and may be an ultraviolet light emitting diode having a wavelength in a range of 100 nm to 280 nm. That is, it can emit short wavelength ultraviolet rays of 280 nm or less. The ultraviolet wavelength has an effect of reducing various biological contaminants such as bacteria, bacteria, and viruses.

The body 110 includes an insulating material, for example, a ceramic material. The ceramic material includes a low temperature co-fired ceramic (LTCC) or a high temperature co-fired ceramic (HTCC) that is simultaneously fired. The material of the body 110 may be, for example, AlN, and may be formed of a metal nitride having a thermal conductivity of 140 W / mK or more.

A connection pattern 117 may be disposed in the body 110, and the connection pattern 117 may provide an electrical connection path between the recess 111 and the bottom surface of the body 110. .

The upper circumference of the body 110 includes a stepped structure 115. The stepped structure 115 is an area lower than the upper surface of the body 110 and is disposed around the upper portion of the recess 111. The depth of the stepped structure 115 is a depth from the upper surface of the body 110, and may be formed deeper than the thickness of the transparent window 161, but is not limited thereto.

The side wall 116 of the recess 111 may be formed vertically or inclined with respect to an extension line of a bottom surface of the recess 111.

The light emitting chip 131 may be disposed on a plurality of electrodes of the first to third electrodes 121, 123, and 125, but is not limited thereto. Here, when the first electrode 121 is not electrically connected to the light emitting chip 131, it may be used as a non-polar metal layer or a heat radiation plate. In addition, each of the electrodes 121, 123, 125, 127, and 129 may be defined as a metal layer, but is not limited thereto.

For example, the connection pattern 117 may connect the first electrode 121 and the first pad 141 to each other, and connect the second and third electrodes 123 and 125 and the second pad 145 to each other. And is not limited to this.

A plurality of pads 141 and 145 are disposed on the lower surface of the body 110. The plurality of pads 141 and 145 include, for example, a first pad 141 and a second pad 145, and the first and second pads 141 and 145 are spaced apart from each other on the lower surface of the body 110. Can be deployed. At least one of the first and second pads 141 and 145 may be arranged in a plurality to disperse the current path, but is not limited thereto.

The light emitting chip 131 may be formed of a compound semiconductor of a group II and VI element, or a compound semiconductor of a group III and V element. For example, a semiconductor light emitting device manufactured using a compound semiconductor of a series of AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AllnGaP, InP, InGaAs may be selectively included. The light emitting chip 131 may include an n-type semiconductor layer, a p-type semiconductor layer, and an active layer, and the active layer is InGaN / GaN, InGaN / AlGaN, InGaN / InGaN, GaN / AlGaN, InAlGaN / InAlGaN, AlGaAs / It may be implemented as a pair of GaAs, InGaAs / GaAs, InGaP / GaP, AlInGaP / InGaP, InP / GaAs.

The transparent window 161 is disposed on the recess 111. The transparent window 161 includes a glass material, for example, quartz glass. Accordingly, the transparent window 161 may be defined as a material that can transmit light emitted from the light emitting chip 131 without damage, such as destruction of bonds between molecules, by ultraviolet wavelength.

The transparent window 161 has an outer circumference coupled to the stepped structure 115 of the body 110. An adhesive layer 163 is disposed between the transparent window 161 and the stepped structure 115 of the body 110, and the adhesive layer 163 includes a resin material such as silicone or epoxy.

The transparent window 161 may be spaced apart from the light emitting chip 131. Since the transparent window 161 is separated from the light emitting chip 131, it can be prevented from being expanded by heat generated by the light emitting chip 131. The space under the transparent window 161 may be an empty space or may be filled with a non-metal or metal chemical element, but is not limited thereto. A lens may be coupled on the transparent window 161, but is not limited thereto. In addition, a molding member is further disposed on the side surface of the body 110 to perform moisture-proof and device protection.

The light emitting device according to an embodiment of the present invention and the light source unit having the same may be used as a sterilizing device for indoor units, evaporators, and condensed water in refrigerators, and also sterilization devices in devices such as air washers and water reservoirs for water purifiers It can be used as a sterilization device for water storage tanks and discharge water, and a sterilization device in a toilet. The sterilizing device may optionally include the light transmitting member and the waterproof member disclosed above.

Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, features, structures, effects, and the like exemplified in each embodiment may be combined or modified for other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

17,27,37,47,57: fastening structure
100: light emitting element
201: circuit board
200: light source module
205,405: hole
250: waterproof member
260: second gasket
271: light transmitting member
275: first gasket
310: first cover
390: recess
410: second cover
401: first accommodation unit
450: second receiving unit

Claims (16)

A first cover including a first accommodation portion and a first opening portion;
A second cover including a second accommodating part, a sub accommodating part, and a heat radiating part between the second accommodating part and the sub accommodating part;
A circuit board disposed on the second receiving portion;
An ultraviolet light emitting element disposed on the circuit board; And
It includes a waterproof member disposed between the circuit board and the first cover,
The first cover is disposed on the ultraviolet light emitting element and the waterproof member,
The first opening overlaps the ultraviolet light emitting element in the vertical direction,
The heat dissipation unit is a sterilization unit including a through hole communicating with the second receiving portion and the sub-receiving portion. According to claim 1,
The first cover includes a second side wall having the first receiving portion open in a direction facing the second receiving portion,
The second cover includes a second side wall having the second receiving portion,
A sterilization unit in which the second side wall is disposed in the first receiving portion. According to claim 2,
The thickness of the heat dissipation portion is greater than the depth of the second receiving portion,
The volume of the sub-receiving portion is larger than the volume of the second receiving portion sterilizing unit. According to claim 2,
The lower end of the first side wall is disposed lower than the upper surface of the heat dissipation unit,
The top surface of the heat dissipation unit is disposed higher than the outer bottom surface of the first cover. The method according to any one of claims 2 to 4,
The second side wall includes a second fastening structure on the outer peripheral surface,
The first side wall is a sterilizing unit comprising a first fastening structure fastened to the second fastening structure on the inner peripheral surface. The method of claim 5,
The second cover includes an outer sidewall having a third fastening structure on the lower outer peripheral surface,
The sub-receiving unit is a sterilization unit disposed in the outer sidewall. The method of claim 6,
The depth of the second receiving portion is smaller than the depth of the first receiving portion and the depth of the sub-receiving portion sterilization unit. The method of claim 5,
The circuit board includes a hole corresponding to the through hole of the heat dissipation unit,
The width of the hole of the circuit board is a sterilization unit smaller than the width of the through hole. The method according to any one of claims 2 to 4,
The second cover includes a body portion,
The body portion protrudes outward from the heat dissipation portion than the second side wall,
The thickness of the body portion is a sterilization unit smaller than the thickness of the heat dissipation portion. The method according to any one of claims 1 to 4,
The second cover is a sterilizing unit formed of a metal material. The method according to any one of claims 2 to 4,
A first ring groove concave at the bottom of the outer circumferential surface of the second side wall;
A second ring groove at the bottom of the inner circumferential surface of the first side wall; And
A sterilization unit including a first waterproof ring between the first ring groove and the second ring groove. The method according to any one of claims 2 to 4,
The waterproof member is disposed in the first receiving portion,
The waterproof member,
A first gasket surrounding a circumference of the light emitting element on an upper surface of the circuit board;
A light transmissive member on the first gasket and the ultraviolet light emitting element; And
A sterilization unit comprising a second gasket around the upper surface of the translucent member. The method of claim 12,
The first cover includes a recess recessed in the upper surface direction of the first cover around the first opening,
The second gasket is disposed in the recess,
The first opening overlaps the light emitting element in the vertical direction,
The first and second gaskets include a ring shape and a sterilization unit overlapping the recess in a vertical direction. The method according to any one of claims 2 to 4,
The sub-receiving unit is a sterilization unit including at least two or more of a sub-board, a power supply and a button module. The method of claim 13,
The ultraviolet light emitting device emits a wavelength band of 100nm to 280nm,
The light transmitting member, the first gasket and the second gasket is a sterilizing unit comprising a fluorine resin-based material. A member having a fastening structure on the outer peripheral surface; And
It includes a sterilizing unit fastened to the fastening structure of the member,
The sterilizing unit is the sterilizing unit of claim 6,
The outer side wall of the first cover of the sterilization unit is fastened to the member,
The member is a sterilization device comprising a water tank or a water storage tank.

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