KR20190072090A - Differential via structure, circuit substrate having the same and method of manufacturing the substrate - Google Patents

Abstract

A differential via structure, a circuit board having the same, and a manufacturing method thereof are disclosed. The differential via structure comprises: a flat plate via having a pair of first and second flat plates passing through an insulator while being separated by a first separation distance to face each other; a connection pad having a first contact accessing the first flat plate and a second contact accessing the second flat plate and separated from the first contact; and an access line having first and second connection lines extended for each contact. The access line interconnects a differential signal line composed of a transmission signal line and a complementary signal line. A characteristic impedance variation between the differential signal line and the differential via structure can be minimized.

Description

[0001] The present invention relates to a differential via structure, a circuit board having the same, and a method of manufacturing the same.

The present invention relates to a differential via structure, a circuit board having the differential via structure, and a method of manufacturing the same. More particularly, the present invention relates to a differential via structure vertically connecting a differential signal line having a transmission signal line and a complementary signal line, Circuit board and a method of manufacturing the same.

2. Description of the Related Art In recent years, the use of differential signal lines has been increasing as an effort to increase the signal integrity of semiconductor devices while increasing the integration, speed, and performance of semiconductor devices. Particularly, a circuit board for electrically connecting a semiconductor device and an external system tends to be manufactured in a multi-layered structure so as to respond to various transmission signals due to high integration of semiconductor devices, and differential signal lines are widely used.

A multilayer circuit board is manufactured such that a plurality of signal lines, which are stacked in multiple layers with an insulating layer interposed therebetween, and signal lines arranged in different layers are electrically connected by a via structure.

The differential signal line simultaneously transmits a signal to be transmitted and a complementary signal thereof using a pair of adjacent signal lines. Accordingly, there is an advantage that the signal integrity can be enhanced by canceling the normal mode noise generated from the surrounding environment. Differential signal lines located in different layers are connected to each other through the differential via structure.

Signal integrity is corrupted by the discontinuity of the signal line from the transmitter to the receiver, and signal integrity can be quantitatively analyzed by the characteristic impedance of the signal line discontinuity. In particular, since the signal distortion in the differential signal line is mainly generated by the differential via structure, the signal integrity of the differential signal line is greatly influenced by the characteristic impedance of the differential via structure.

The conventional differential via structure has a complicated shape so that it can not control the characteristic impedance only by the shape parameter. Therefore, the characteristic impedance of the differential via structure conforming to the characteristic impedance of the differential signal line at the design stage of the circuit board is determined There is a limit.

Accordingly, there is a need for an improved differential via structure that can easily adjust the characteristic impedance by simply changing the shape factor.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a differential amplifier which is provided in a pair of plates facing each other and which can obtain a desired characteristic impedance simply by adjusting a separation distance and a width To provide a via structure.

Another object of the present invention is to provide a circuit board having a differential via structure as described above.

It is still another object of the present invention to provide a method of manufacturing a circuit board as described above.

According to an aspect of the present invention, there is provided a differential via structure, comprising: a flat via having a pair of first and second flat plates spaced apart from each other by a first spacing distance and passing through an insulator, A first contact connected to the first flat plate and a second contact connected to the second flat plate and separated from the first contact, provided on the upper and lower surfaces of the flat plate, A first connection line disposed on the top and bottom surfaces of the insulator and extending from the first contact and a second connection line extending from the second contact and spaced apart from the first connection line by a second spacing distance, . The connection line is connected to a differential signal line including a transmission signal line for transmitting an input signal and a complementary signal line for transmitting a complementary signal of the input signal, and connects the differential signal line located on the top and bottom surfaces of the insulator .

According to another aspect of the present invention, there is provided a circuit board including a pair of planar portions passing through a first surface and a second surface symmetrically positioned to face each other and facing each other, and a pair of curved portions At least one of which is disposed on the first and second surfaces and has a transmission signal line for transmitting an input signal and a reference signal line for transmitting a reference signal for the input signal, And a pair of first and second signal lines which are disposed on the plane portion of the through hole and electrically connect the transmission signal line and the reference signal line, respectively, so as to face each other with a first separation distance, Lt; RTI ID = 0.0 > 2 < / RTI > flat plate.

According to another aspect of the present invention, there is provided a method of manufacturing a circuit board, comprising the steps of: forming a pair of transmission signal lines and a reference signal line, Thereby forming a seed film covering the surface of the body having the coupled signal lines. Then, the first through-hole process and the linear transfer process are successively performed successively to form a first through-hole having a pair of planar portions and a pair of preliminary curved portions facing each other through the body, A conductive film covering the side surfaces of the first through holes and covering the first and second surfaces is formed so as to be spaced apart. A pair of cylindrical second through holes having diameters larger than the first spacing distance and spaced apart from each other by a center distance are formed by a second through process performed on both ends of the first through hole, And the first and second flat plates are separated from each other by the first spacing distance to form flat plate vias that electrically connect the coupled signal lines through the body. Then, the conductive film is partially removed from the first surface and the second surface to form a first contact connected to the first flat plate and a second contact connected to the second flat plate and separated from the first contact A connection pad and a first connection line extending from the first contact and a second connection line extending from the second contact and spaced apart from the first connection line by a second spacing distance.

The width w and the height h of the flat plate via 100 and the first spacing d1 and the length b of the connection pad 200 and the length The characteristic impedance of the coupling via structure 800 such as the differential via structure is approximated to the characteristic impedance of the coupled signal line 700 such as the differential signal line by adjusting the shape of the connecting line 300 and the second spacing distance d2 . Therefore, by minimizing the impedance deviation between the coupled signal line 700 and the coupled via structure 800 on the circuit board 1000, distortion of the signal transmitted along the circuit board 1000 can be minimized.

The planar vias 100, the connection pads 200 and the connection lines 300 constituting the coupling via structure 800 may be formed as a simple flat plate structure capable of adjusting the separation distance, The characteristic impedance determining factor can be simplified. Accordingly, by extending the variation range of the characteristic impedance for the coupling-via structure 800, the coupling-via structure 800 having the impedance deviation minimized with respect to the coupling signal line 700 having a variety of characteristic impedances can be obtained It can be easily manufactured.

1 is a perspective view illustrating a differential via structure according to an embodiment of the present invention.
FIG. 2A is a cross-sectional view of the differential via structure of FIG. 1 cut along the II 'direction. FIG.
Figure 2b is a top view of the differential via structure of Figure 1;
3A and 3B are views showing a first modification of the differential via structure shown in FIG.
4A and 4B are views showing a second modification of the differential via structure shown in FIG.
5 is a perspective view illustrating a circuit board having the differential via structure shown in FIG. 1 according to an embodiment of the present invention.
6A is a cross-sectional view of the circuit board shown in FIG. 5 taken along a direction II '.
6B is a plan view of the circuit board shown in Fig.
Figure 7 is a flow diagram illustrating a method of fabricating the circuit board shown in Figure 5 in accordance with one embodiment of the present invention.
8A to 8F are process drawings showing steps of manufacturing the circuit board shown in Fig.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a differential via structure according to an embodiment of the present invention. FIG. 2A is a cross-sectional view of the differential via structure of FIG. 1 taken along the line I-I ', and FIG. 2B is a plan view of the differential via structure of FIG.

1, 2A, and 2B, a differential via structure 500 according to an embodiment of the present invention includes a pair of first through-holes (not shown) spaced apart by a first spacing distance d1 and passing through an insulator B, And a second flat plate 110 and 120. The first flat plate 100 and the second flat plate 100 are integrally provided on the upper surface B1 and the lower surface B2 of the insulator B, (200) having a first contact (210) connected to the first plate (110) and a second contact (220) connected to the second plate (120) and separated from the first contact (210) A first connection line 310 extending from the first contact 210 and extending from the second contact 220 and disposed on the upper surface B1 and the lower surface B2 of the insulator B, And a connection line 300 having a second connection line 320 spaced apart from the line 310 by a second spacing distance d2.

The connection line 300 is connected to a differential signal line L having a transmission signal line L1 for transmitting an input signal and a complementary signal line L2 for transmitting a complementary signal of the input signal, The differential signal lines L located on the upper face B1 and the lower face B2 of the insulator B are connected to each other by the differential via structure 500. [

In one embodiment, the insulator B may be provided in various forms as long as the insulator B has a three-dimensional shape including an upper face B1 and a lower face B2 which are electrically separated from each other. Accordingly, the conductive lines arranged on the upper surface B1 and the lower surface B2 are electrically insulated from each other by the insulator B. For example, the insulator B may be composed of a single insulating cube or may be provided as a multi-layer structure in which a plurality of wiring lines are stacked with a dielectric film interposed therebetween as described later.

(Not shown) that penetrates the insulator (B), and a flat plate via (100) covering the side wall of the through hole is disposed.

For example, the through hole passing through the insulator (B) includes at least a pair of planar side surfaces, and the flat plate via 100 is provided with a conductive film formed to have a first thickness t1 on the side wall do. The flat plate vias 100 function as differential via structures 500 arranged to penetrate the insulator B and to electrically connect the differential signal lines L1 and L2 disposed on the upper face B1 and the lower face B2 to each other electrically . In one embodiment, the conductive film may be composed of a low-resistance metal material such as copper.

The planar vias 100 formed on the pair of side surfaces are composed of first and second flat plates 110 and 120 spaced apart by a first distance d1 and arranged to face each other. For example, the first flat plate 110 may be disposed on the left side wall of the through hole, and the second flat plate 120 may be disposed on the right side wall of the through hole.

The first and second flat plates 110 and 120 have a rectangular parallelepiped shape having a constant height h and a via width w and having a first thickness t1. As described later, the height h corresponds to the depth of the through hole passing through the body B, and the via width w is determined according to the degree of removing the conductive film covering the side wall of the through hole.

The characteristic impedance of the differential via structure 500 is determined by the characteristic impedance of the planar via 100 because the planar via 100 serving as the differential via structure 500 is composed of a pair of planar plates 110, Is determined by the width (w) and height (h) and the first separation distance (d1).

The connection pad 200 is disposed on the upper surface B1 and the lower surface B2 of the insulator B so as to have a second thickness t2 and is connected to cover the first and second flat plates 110 and 120, 1 and second contacts 210 and 220, respectively. The connection pads 200 may be provided separately from the flat plate vias 100, but are integrally provided through a single process in this embodiment.

The first and second contacts 210 and 220 may be provided in a rectangular shape corresponding to the width w of the flat plate via 100 corresponding to the rectangular shape of the flat plate via 100 and having a constant length b. do. The connection pad 200 is provided in a rectangular shape having a width equal to the width w of the flat plate via 100 and having a constant length b.

In particular, the first and second contacts 210 and 220 are symmetrically disposed on the upper surface and the lower surface of the insulator B, respectively. For example, when the first contact 210 extends from the first flat plate 110 to the left side of the body 100, the second contact 220 contacts the second flat plate 110 to the right Extend.

Accordingly, the connection pad 200 functions as a landing pad for connecting the planar via 100 to the differential signal line L. [ Therefore, the connection pad 200 has a large area as wide as possible without hindering the characteristic impedance of the differential via structure 500, thereby increasing the connection stability between the planar via 100 and the differential signal line L, Thereby ensuring a sufficient process margin.

The first contact 210 disposed on the upper surface B1 of the body B is connected to the upper transmission signal line UL1 disposed on the upper surface B1 and the first contact 210 disposed on the lower surface B2, And connected to the lower transmission signal line LL1 disposed on the lower surface B2. The second contact 220 disposed on the upper surface B1 of the body B is connected to the upper complementary signal line UL2 disposed on the upper surface B1 and the second contact 220 Is connected to the lower complementary signal line LL2 disposed on the lower surface B2.

The transmission signal lines L1 disposed at the upper and lower portions of the body B are electrically connected to each other through the first contact 210 and the first flat plate 110, The complementary signal lines L2 are electrically connected to each other through the second contact 220 and the second flat plate 120. [

In the case of this embodiment, the connection pad 200 and the plate via 100 are provided as an integral structure made of the same conductive material by the same process. For example, the connection pad 200 may be made of a low-resistance conductive material such as copper. The thickness t2 of the connection pad 200 may be equal to or different from the thickness t1 of the flat plate via 100 according to the configuration of the insulator B. [

The connection line 300 is provided as a buffer line for connecting the differential signal line L and the connection pad 200.

For example, the connection line 300 is disposed on the upper surface B1 and the lower surface B2 of the body B and is connected to the first and second contacts 210 and 220, d2 of the first connection line 310 and the second connection line 320. [ At this time, the second spacing distance d2 may be equal to or greater than the first spacing distance d1.

The third spacing distance d3 is specified as a characteristic of the differential signal line L connected to the body B. The third spacing distance d3 is specified as a characteristic of the differential signal line L connected to the body B, 1 spacing d1 and the length b of the connection pad 200 are determined so that the difference between the characteristic impedance of the differential via structure 500 and the characteristic impedance of the differential signal line L is within the allowable range.

Accordingly, the connection line 300 includes the flat vias 100 and the connection pads 200 arranged to be spaced apart by the first spacing distance d1 so as to meet the characteristic impedance condition, and the differential signal having the third spacing distance d3. And the lines L are connected to each other so as to have a minimum impedance change amount. Accordingly, characteristic impedance deviation between the differential signal line (L) and the differential via structure (500) can be minimized.

Accordingly, the first and second connection lines 310 and 320 include pad connection lines 311 and 321 connected to the connection pads and signal connection lines 312 and 322 connected to the differential signal line L, respectively.

The pad connection lines 311 and 321 are formed such that the deviation between the impedance of the differential via structure 500 obtained by the shapes of the planar vias 100 and the connection pads 200 and the characteristic impedance of the differential signal line L is minimized Respectively.

The width w and the height h and the first distance d1 and the length b are set so as to have an impedance closest to the characteristic impedance of the differential signal line L having the third spacing distance d3 The shapes of the flat plate vias 100 and the connection pads 200 are determined so that the deviation between the approximate impedance and the characteristic impedance of the differential signal line L is minimized. ) Is determined. Accordingly, a second distance d2 between the first and second connection lines 310 and 320 is determined.

The signal connection lines 312 and 322 are intermediate lines for connecting the pad connection lines 311 and 321 to the differential signal line L and may have different shapes depending on the positions of the pad connection lines 311 and 321.

The signal connection lines 312 and 322 are composed of linear conductive lines extending from the ends of the pad connection lines 311 and 321 to the ends of the differential signal line L at a constant inclination? The inclination? May vary depending on the connection positions of the pad connection lines 311 and 321 and the connection pad 200. Particularly, since the position of the differential signal line L is fixed and the second spacing distance d2 varies depending on the connection position of the pad connection lines 311 and 321 and the connection pad 200, Depends on the second spacing distance d2.

The upper transmission signal line UL1 is connected to the upper end of the first flat plate 110 through the first connection line 310 and the first contact 210 disposed on the upper surface B1 of the body, The signal line LL1 is connected to the lower end of the first flat plate 110 through the first connection line 310 and the first contact 210 disposed on the lower surface B2 of the body. That is, the transmission signal line L1 is electrically connected to the body B by the plate vias 100 through the body B.

Similarly, the upper complementary signal line UL2 is connected to the upper end of the second flat plate 120 through the second connection line 320 and the second contact 220 disposed on the upper surface B1 of the body, The line LL2 is connected to the lower end of the second plate 120 through the second connection line 320 and the second contact 220 disposed on the lower surface B2 of the body. That is, the complementary signal line (L2) is electrically connected to the body (B) through the plate vias (100).

The width w and the height h of the planar via 100 and the height h of the planar via 100 are set to be different from each other with respect to the differential signal line L provided to have the third spacing distance d3, The length of the connection pad 200 and the shape of the connection line 300 and the second spacing d2 are adjusted to connect the differential signal line L in the vertical direction The characteristic impedance of the differential via structure 500 may be set to have a minimum deviation from the characteristic impedance of the differential signal line L. [ The characteristic impedance of the differential via structure 500 composed of the planar via 100, the connection pad 200 and the connection line 300 is set to be equal to the characteristic impedance of the differential signal line L having the third spacing distance d3 It can be set to the closest to the characteristic impedance.

Particularly, by adjusting the via width w, the height h of the flat plate via 100, the length b of the connection pad 200, and the spacing distance between the connection lines, the differential via structure 500 and the differential signal The characteristic impedance deviation of the line L can be minimized, so that the differential signal line including the differential via structure can be precisely designed.

In addition, the variation range of the characteristic impedance can be extended by simplifying the characteristic impedance determining parameter of the differential via structure 500 to a linear factor such as a length and a width height. Accordingly, the differential via structure 500 can be easily designed for the differential signal line L having a wide range of characteristic impedances.

The present embodiment discloses a differential via structure connecting the upper surface of the body B and the differential signal line L disposed on the lower surface of the body B. It is also possible to connect a differential signal line as well as a pair of vertically spaced signal lines It is apparent that the present invention can be applied to various via structures to be used for forming a via structure.

The above-described differential via structure 500 may be variously modified depending on the structure of the insulator.

3A and 3B are views showing a first modification of the differential via structure shown in FIG. FIG. 3A is a cross-sectional view corresponding to FIG. 2A, and FIG. 3B is a plan view corresponding to FIG. 2B.

3A and 3B, the width of the connection pad 200 is equal to the width w of the flat plate via 100 and the thickness t2 of the connection pad 200 is greater than the thickness t1 of the flat plate via 100, Pad.

For example, the insulator B includes a plurality of wires C separated by a dielectric film I and stacked in a vertical direction, and the connection pad 200 and the flat plate 100 are connected to the circuit wiring The thickness t2 of the connection pad 200 on the upper surface B1 and the lower surface B2 of the insulator B is the same as the thickness t2 of the uppermost surface And the thickness of the lowermost circuit wiring (C), and can be provided to be larger than the thickness (t1) of the flat plate via (100).

At this time, the thickness of the connection line 300 is formed to be the same as that of the connection pad 200, thereby minimizing the impedance deviation due to the shape difference in the boundary region between the connection line and the connection pad.

It is preferable to minimize the characteristic impedance deviation of the differential signal line L and the differential via structure 500 by forming the thickness of the differential signal line L and the thickness of the connection line 300 and the connection pad 200 to be equal to each other can do.

Particularly, the widths of the connection lines 300, the connection pads 200 and the flat plate vias 100 are formed to be equal to the width of the differential signal line L so that the shape distortion along the transmission path of the transmission signal and the complementary signal Can be minimized. Thus, the characteristic impedance deviation between the differential via structure 500 and the differential signal line L can be further reduced.

The amount of impedance change due to the difference in thickness between the planar via 100 and the connection pad 200 may be minimized by adjusting the connection positions of the connection pad 200 and the pad connection lines 311 and 321. That is, the impedance variation due to the difference in thickness between the planar via 100 and the connection pad 200 can be minimized by adjusting the second spacing distance d2.

4A and 4B are views showing a second modification of the differential via structure shown in FIG. FIG. 4A is a cross-sectional view corresponding to FIG. 2A, and FIG. 4B is a plan view corresponding to FIG. 2B.

4A and 4B, the connection pad 200 is provided as a flat pad whose width and thickness are the same as the width and thickness of the flat via 100.

For example, the insulator B includes a plurality of wires C separated by a dielectric film I and stacked in a vertical direction, and the connection pads 200 and the flat vias 100 are connected to the uppermost and lowermost The connection pad 200 and the flat plate via 100 are all formed on the dielectric film so that they have the same thickness t. That is, the second thickness t2 of the connection pad 200 and the first thickness t1 of the flat plate via 100 are equal to each other and have a single thickness t.

At this time, the thickness of the connection line 300 is formed to be the same as that of the connection pad 200, thereby minimizing the impedance deviation due to the shape difference in the boundary region between the connection line and the connection pad.

It is preferable to minimize the characteristic impedance deviation of the differential signal line L and the differential via structure 500 by forming the thickness of the differential signal line L and the thickness of the connection line 300 and the connection pad 200 to be equal to each other can do.

Particularly, the width and thickness of the connection line 300, the connection pad 200, and the flat plate via 100 are made equal to the width and the thickness of the differential signal line L so that the transmission path of the transmission signal and the complementary signal is It is possible to minimize the deformation of the shape. Thus, the characteristic impedance deviation between the differential via structure 500 and the differential signal line L can be remarkably reduced.

In this case, since the planar via 100, the connection pad 200, the connection line 300 and the differential signal line L are arranged to have the same width and thickness, the first to third spacings d1, d2, d3 are arranged so as to be equal to each other so that the differential distance between the differential signal line L and the differential via structure 500 can be made equal to the differential distance d. Accordingly, characteristic impedance deviation between the differential signal line (L) and the differential via structure (500) can be minimized.

5 is a perspective view illustrating a circuit board having the differential via structure shown in FIG. 1 according to an embodiment of the present invention. FIG. 6A is a cross-sectional view of the circuit board shown in FIG. 5 taken along a line I-I ', and FIG. 6B is a plan view of the circuit board shown in FIG.

5, 6A, and 6B, a circuit board 1000 according to an embodiment of the present invention includes a first surface 610 and a second surface 620 that are symmetrically positioned with respect to each other, An insulative body 600 having a rectangular through-hole H having a pair of planar portions LS and a pair of curved portions CS; and an insulating body 600 disposed on the first and second surfaces 610 and 620, respectively, At least one coupled signal line 700 having a transmission signal line 710 for transmitting a signal and a reference signal line 720 for transmitting a reference signal for the input signal, And a pair of electrodes electrically connected to the transmission signal line 710 and the reference signal line 720 at a plane portion LS of the through hole H so as to be spaced apart from each other by a distance d1, And a planar via 100 formed of first and second flat plates 110 and 120 of a pair of first and second flat plates 110 and 120, respectively.

In one embodiment, the insulating body 600 is composed of an insulating material such as tempered glass fiber, epoxy resin, and photosensitive polymer, and is provided with a thin circuit pattern on the top surface 610 and / or the bottom surface 620. The circuit pattern includes a data transfer pattern for exchanging electrical data with a semiconductor chip (not shown) connected to the circuit board 1000, a drive pattern for transferring driving power to the semiconductor chip, and a ground for electrically grounding the semiconductor chip Patterns, and the like.

In this embodiment, the circuit board 1000 includes a printed circuit board (PCB) having a plurality of chip mounting areas such that the surface on which various circuit patterns are printed has a lattice shape. A plurality of connection pads to which the semiconductor chips are bonded are disposed in each chip mounting region. However, the present invention can be applied to various circuit boards as long as it is not only a printed circuit board but also a substrate for signal transmission between electronic elements having circuit patterns and connected thereto. For example, the circuit board 1000 may include a silicon-on-insulator (SOI) substrate on which a plurality of wirings, each separated by a dielectric layer, are disposed on the top and bottom surfaces of the body 600.

Particularly, the circuit pattern may be formed as a single layer or a multilayer on the upper surface 610 or the lower surface 620 of the body 600, and may be different from the signal lines extending in various shapes along the surface of the body 600 And a via structure for connecting the signal lines disposed in the layer to each other.

At least a portion of the signal lines may include a pair of coupled signal lines 700 including a transmission signal line 710 for transmitting an input signal and a reference signal line 720 for transmitting a reference signal for the input signal. . The reference signal may include any of a complementary signal having a phase complementary to the phase of the input signal, a drive signal for an electronic device connected to the insulative body, such as a semiconductor input, and a ground signal for the electronic device .

In particular, when a complementary signal complementary to the input signal is transmitted to the reference signal line 720, the complementary signal line 700 functions as a complementary signal line to the reference signal line 720, and the coupled signal line 700 functions as a differential signal line . Accordingly, when the input signal and its complementary signal proceed at the same time, the signal integrity can be increased by canceling the normal mode noise generated by the surrounding environment by the phase difference opposite to each other.

The coupled signal line 700 includes an upper coupling line UCL disposed on an upper surface of the body 600 and a lower coupling line LCL disposed on a lower surface 620. The coupling signal line 700 includes upper and lower coupling lines UCL, LCL) are connected to each other by the coupling-via structure 800.

The upper coupling line UCL is composed of an upper transmission signal line 711 and an upper reference signal line 721 spaced by a third separation distance d3 and the lower coupling line LCL is composed of the third separation distance and a lower transmission signal line 721 and a lower reference signal line 722 spaced apart from each other by a distance d3. The coupled signal line 700 includes a pair of transmission signal lines 710 and a reference signal line 720 spaced apart from each other by a third distance d 3 from the surface of the body 600.

The upper and lower coupled signal lines UCL and LCL are disposed adjacent to the through holes H to which the upper and lower surfaces of the body 600 are connected and are disposed through the through holes H, Respectively.

The upper transmission signal line 711 is connected to the lower transmission signal line 721 through the first flat plate 110 of the coupling via structure 800 and the upper reference signal line 721 is connected to the lower transmission signal line 721 through the coupling And is connected to the lower reference signal line 722 through the second flat plate 120 of the via structure 800.

And a through hole (H) penetrating the body (600) is provided in an area adjacent to an end of the upper and lower coupling lines (UCL, LCL).

In one embodiment, the through-holes H are provided with a pair of flat surfaces LS facing each other and a pair of curved surfaces CS so that the side portions are curved in a rectangular cylinder shape. The through hole H penetrates the body 600 to connect the upper surface 610 on which the upper differential line UDL is disposed and the lower surface 620 on which the lower differential line LDL is disposed.

The through hole H has a depth corresponding to the vertical distance between the upper and lower differential lines UDL and LDL to be connected to each other and the plane portion LS and the curved portion CS also penetrate through the through- And a height h corresponding to the depth of the hole.

The planar portion LS has a height h corresponding to the depth of the through hole H and a width w corresponding to the characteristic impedance condition of the coupling via structure 500. In this case, And the curved surface portion CS is provided as a semicircular wall having a diameter D equal to a distance between a pair of planar portions LS facing each other.

It is obvious that the curved surface portion CS may have a larger diameter D than the separation distance between the planar portions LS. As will be described later, the curved surface portion CS is formed by a pair of second contact holes H2 penetrating both ends of the plane portion LS, and the curved surface portion CS is formed between the pair of second contact holes H2. The center distance determines the via width w of the flat plate via 100. Therefore, when the diameter D of the curved surface portion CS is larger than the separation distance between the pair of planar portions LS, the center distance can be adjusted to set the appropriate via width w.

Therefore, the through-holes H are defined by a pair of semicircular walls disposed at both ends along the width direction of the plane portion LS and a pair of planar walls disposed at both ends along the diameter of the semicircular wall And a rounded open rectangle.

The coupling via structure 800 includes a pair of via structures that penetrate the through hole H having a round opening hexahedron shape and are individually disposed on the upper surface 610 and the lower surface 620 of the body 600 And connects the transmission signal line 710 and the reference signal line 720 to each other.

In the case of this embodiment, the coupling via structure 800 has substantially the same configuration as the differential via structure 500 shown in Figs. 1 to 4B. Hereinafter, the same components as those of the differential via structure 500 and the coupling via structure 800 are denoted by the same reference numerals.

For example, the coupling via structure 800 includes a planar via 100 provided on a planar portion LS of the contact hole H facing the planar portion LS and a planar via 100 formed on the planar via 100, And a connection pad 300 and a connection pad 300 disposed on the upper surface 610 and the lower surface 620, respectively.

The planar vias 100 are disposed on the planar portion LS of the through hole H so as to have a flat plate shape and to be spaced apart from each other by the first spacing d1 and to face the transmission signal line 710 and the reference signal And a pair of first and second flat plates 110 and 120 for electrically connecting lines 720, respectively.

Particularly, the planar portion LS of the contact hole H facing each other is spaced apart by a distance corresponding to the diameter D of the high-surface portion CS, and the first and second flat plates 110, LS to have a first thickness t1. The sum of the thickness t1 of the first and second flat plates 110 and 120 and the first spacing distance d1 is substantially equal to the diameter D of the curved surface portion CS.

The connection pad 200 is integrally provided on the upper and lower surfaces 610 and 620 and is connected to the first flat plate 110. The first contact 210 and the second flat plate 120, And a second contact 210 connected to the first contact 110 and separated from the first contact 110.

The first and second contacts 210 and 220 are disposed to cover the upper and lower ends of the first and second flat plates 110 and 210 with a second thickness t2 from the upper and lower surfaces, respectively. The second thickness t2 may be the same as or different from the first thickness t1.

The connection line 300 includes a first connection line 310 disposed on the top and bottom surfaces 610 and 620 and extending from the first contact 210 and a second connection line 310 extending from the second contact 220, 310 and a second connection line 320 spaced apart by a second spacing distance d2. The connection line 300 may be formed integrally with the connection pad 200 or may be separately formed and connected to each other.

The transmission signal line 710 is connected to the first connection line 310 and the reference signal line 720 is connected to the second connection line 320. Accordingly, the transmission signal line 710 and the reference signal line 720 pass through the body 600 through the coupling via structure 800, respectively.

Particularly, a circuit pattern may be formed on the upper surface 610 or the lower surface 620 of the body 600, and the signal lines extending in various shapes along the surface of the body 600 may be disposed on different layers And connecting the signal lines to each other.

In particular, when the body 600 includes a multilayer interconnection pattern separated by a dielectric layer, the contact pad 200 and the plate via 100 may have different thicknesses.

3A and 3B, when the connection pad 200 is disposed so as to cover the uppermost wiring and the lowermost wiring of the body 600 having the multilayer wiring, May have a greater thickness than the flattened via (100).

At this time, the connection line 300 may have the same thickness as the connection pad 200 and be integrally disposed. In addition, the connection line 300 is connected with the same width and thickness as the coupled signal line 700. Accordingly, the first contact may have the same width as the signal line, and the second contact may be arranged to have the same width as the reference line.

Therefore, by configuring the width of the coupled via structure 800 to be equal to the width of the coupled signal line 700, the characteristic impedance deviation can be minimized.

In addition, as shown in FIGS. 4A and 4B, the connection pad 200 may have the same thickness as the plate vias 100.

When the connection line 300 and the connection pad 200 are provided to have the same thickness and width and the connection line 300 is provided to have the same thickness and width as the coupled signal line 700, The lines 700, the connection lines 300, the connection pads 200, and the flat vias 100 may have the same width and thickness.

Particularly, when the coupled signal line 700 and the coupled via structure 800 have the same thickness and width, the third spacing distance d3 between the transmission signal line and the reference signal line and the connection line 300 The connection line 300 and the connection line 300 can be maintained while keeping the first spacing distance d1 that is the interval between the first signal line 700 and the second signal line 700 and the second spacing distance d2, The flat plate vias 100 may be arranged in a line.

The shape distortion of the coupling via structure 800 connecting the upper and lower coupled signal lines UCL and LCL is most approximated to the shape characteristics of the coupled signal line 700, It is possible to minimize the signal distortion in the transmission process.

The width w of the flat vias 100 and the height h and the first spacing d1 of the flat vias 100 and the length b of the connection pads 200 and the length The characteristic impedance of the coupled via structure 800 can be approximated to the characteristic impedance of the coupled signal line 700 by adjusting the shape of the coupled signal line 300 and the second spacing distance d2. Therefore, by minimizing the impedance mismatch between the coupled signal line 700 and the coupled via structure 800 in the circuit board 1000, it is possible to minimize distortion of signals transmitted along the circuit board 1000.

In addition, the variation range of the characteristic impedance can be extended by simplifying the characteristic impedance determining parameter of the coupling via structure 800 to a linear factor such as a length and a width height. Accordingly, it is possible to easily design the coupling-via structure 800 in which the impedance deviation is minimized with respect to the coupled signal line 700 having a wide range of characteristic impedances.

The circuit board 1000 as described above can be manufactured by two high throughput plating processes.

Figure 7 is a flow diagram illustrating a method of fabricating the circuit board shown in Figure 5 in accordance with one embodiment of the present invention. 8A to 8F are process drawings showing steps of manufacturing the circuit board shown in Fig. 8A to 8F, <a> is a plan view, and <b> is a cross-sectional view taken along the A-A 'direction of the corresponding <a> drawing.

5 and 7, a body (not shown) having a coupled signal line 700 disposed on the upper surface 610 and the lower surface 620 and composed of a transmission signal line 710 and a reference signal line 720, 600) (step S100).

For example, the body 600 includes a circuit pattern C, which is conductive wiring disposed on the top and bottom surfaces of a bulk type insulator BI made of an insulating material, and an insulating film I ) Are provided in a multi-layer structure alternately stacked along the vertical direction.

Although not shown, the circuit pattern C may be additionally disposed on the insulating film I, and the additional disposed circuit pattern may be configured to be covered by another insulating film so as to be insulated by a multilayer insulating film. Respectively.

The circuit patterns C arranged on the same layer are patterned according to the purpose of use of the circuit board and formed into a plurality of wiring lines.

Particularly, at least a part of the wiring lines is a pair of coupled signal lines 700 composed of a transmission signal line 710 for transmitting an input signal and a reference signal line 720 for transmitting a reference signal for the input signal . The reference signal may include any of a complementary signal having a phase complementary to the phase of the input signal, a drive signal for an electronic device connected to the insulative body, such as a semiconductor input, and a ground signal for the electronic device .

The coupled signal line 700 may be provided as a differential signal line capable of improving signal integrity according to characteristics of the transmission signal and the reference signal.

8A, a body 600 having the coupled signal line 700 is loaded into a via processing chamber (not shown) and a seed film 601 is formed to cover the surface of the body 600 . For example, the seed film 601 may be formed by depositing or growing a low-resistance metal material such as copper to cover the surface of the body 600. The seed layer 601 is formed to cover both the upper surface 610 and the lower surface 620 of the body 600.

In the present embodiment, the body 600 discloses forming the seed film 601 because the insulating film I covers the circuit pattern C, but a via structure is formed on the circuit pattern C It is obvious that the via process can be performed without forming the seed film.

The shape factor of the coupling-via structure 800 is determined so as to have a characteristic impedance close to the characteristic impedance of the coupled signal line (step S200).

For example, the via processing apparatus includes a control unit (not shown) provided separately from the process chamber (not shown), and based on the characteristic impedance of the coupled signal line 700 input to the control unit, The shape model of the structure 800 is automatically determined.

The control unit automatically combines the shape parameters of the flat plate via 100, the connection pad 200 and the connection line 300 constituting the coupling via structure 800 to automatically connect the coupling signal line 700, And the optimum shape factor having the minimum deviation is detected.

Accordingly, the width w, height h, first thickness t1 and first spacing distance d1, which are the shape characteristic factors of the flat plate via 100, and the length, which is a shape factor of the connection pad 200, (b) and the second thickness (t2). Further, the optimal shape factor for the thickness of the connection line 300 and the second separation distance d2 is determined.

In particular, by forming the coupling signal line 700 and the coupling via structure 800 to have the same thickness, it is possible to eliminate the impedance variation due to the thickness variation.

 Then, a first penetration process and a linear transfer process are successively performed successively on the body 600 on which the seed film 601 is formed, and the pair of planar portions LS and the planar portions LS, which penetrate the body 600 and face each other, A first through hole H1 having a preliminary curved surface portion PCS is formed (Step S300).

As shown in FIG. 8B, the first penetration process 10 is performed on the body 600 using a penetration device P such as a laser drilling device or a laser milling device. For example, a laser drilling apparatus is passed downward from an upper surface 610 of the body to form a first preliminary through hole PH1 having a certain diameter PD.

Next, as shown in FIG. 8C, the linear transporting process 20 for linearly transporting the penetrating device P passing through the body 600 in a predetermined direction is performed to form the first through hole H1 do.

The second preliminary through hole PH2 having the same shape as that of the first preliminary through hole PH1 is formed at the end point of the linear transfer process 20 and the second preliminary through hole PH2 having the same shape as the first preliminary through hole PH1 is formed, The body 600 between the two preliminary through holes PH1 and PH2 is linearly removed.

Accordingly, the curved side walls of the first and second preliminary through holes PH1 and PH2 are disposed to face each other at both ends of the first through hole H1 to form a pre-curved surface portion PCS, In the region where the process is performed, planar side walls face each other to form a planar portion LS.

The planar portion LS is spaced apart from the first and second preliminary through holes PH1 and PH2 by the diameter PD of the first and second preliminary through holes PH1 and PH2, Is spaced apart by the sum of the length L and the diameter PD of the first and second preliminary through holes PH1 and PH2.

Subsequently, a conductive film CL covering the upper surface of the body 600 and the lower surfaces 610 and 620 is formed by covering the side surfaces of the first through hole H1 (step S400).

The preliminary curved surface portion PCS and the planar portion LS of the upper and lower surfaces 610 and 620 and the first through hole H1 are formed by the plating process using the seed film 601 as a seed, A conductive film CL is formed to cover the side wall of the semiconductor device.

In the present embodiment, the conductive film CL is formed of a low resistance metal film such as copper.

The conductive layer CL is formed to have a first thickness t1 and the conductive layer CL covering the planar portion LS is spaced apart by a first distance d1.

The interval of the conductive film CL is set to be equal to the diameter PD of the first preliminary through hole PH1 because the plane portion LS has an interval corresponding to the diameter PD of the first preliminary through hole PH1. And the first thickness t1.

Accordingly, the control unit may adjust the diameter PD of the first and second preliminary through holes PH1 and PH2 so that the impedance difference with the coupled signal line 700 becomes the minimum first distance d1, The first thickness t1 of the conductive film CL is determined. Accordingly, the conductive film CL is formed inside the first through hole H1 so as to have an optimal first distance d1 with minimized impedance deviation.

Then, the first through hole H1 has a diameter D larger than the first distance d1 by a second penetrating process 30 performed at both ends of the first through hole H1, And a second spacing distance d2 that is smaller than the center distance CD and is spaced apart from the first spacing distance d1 by a distance d2, And the first and second flat plates 110 and 120 and electrically connects the coupled signal lines 700 through the body 600 at step S500.

As shown in FIG. 8E, the second penetration process 30 is performed on the body 600 using a pair of penetration devices P spaced apart by the center distance. A pair of cylindrical second through holes H2 having a diameter D larger than the first spacing distance d1 are formed at both ends of the first through hole H having a rectangular shape. Accordingly, the body 600 is provided with the first through-hole H1 and the second through-hole H1 and the rectangular through-hole H1 having the pair of planar portions LS and the pair of curved portions CS facing each other. A through hole H is formed.

At this time, the second through hole H2 is formed to have a diameter D that is equal to or greater than the diameter PD of the first and second preliminary through holes PH1 and PH2. Thus, the conductive film CL formed on the preliminary curved surface portion PCS of the first through hole H1 is removed.

Both side portions of the conductive film CL covering the planar portion LS of the first through hole H1 are partially removed by the second through hole H2 to have a first thickness t1, And a pair of first and second conductive flat plates 110 and 120 having a through-hole curved surface 100p.

At this time, both side portions of the first and second flat plates 110 and 120 are formed to have a via width w smaller than the center distance CD by being partially removed by the second through hole H2. Accordingly, the via width w can be changed by adjusting the center distance CD and the diameter D of the second through hole H2.

When the diameter D of the pair of second through holes H2 is sufficiently larger than the diameter PD of the first and second preliminary through holes PH, The optimum via width w can be set even if the diameter D of the second through hole H2 is equal to the diameter PD of the first and second preliminary through holes PH. The width w is formed to be shorter than the center distance CD of the second through hole H2 by the length of the orthogonal projection of the through-curve 100p.

The conductive film CL formed on the plane portion LS of the first through hole H1 is partially removed by the second through hole H2 and is spaced apart by the first distance d1, And a pair of first and second flat plates 110 and 120 having a via width w and a height h corresponding to the depth of the through hole H1.

That is, the first thickness t1 is provided in the through hole H having the pair of curved surface portions CS and the pair of flat surface portions LS facing each other and the first thickness t1 is equal to the first distance d1 Thereby forming a flat plate 100 composed of a pair of spaced flat plates.

The first distance d1 is determined by the diameter PD of the first and second preliminary through holes PH and the via width w is determined by the first thickness t1 of the conductive film CL And the diameter D and the center distance CD of the pair of second through holes H2.

The optimum first spacing distance d1 and the via width w are determined as shape parameters of the coupling via structure 800 that is close to the characteristic impedance of the second coupled signal line 700, The control unit controls the diameter PD of the first and second preliminary through holes PH and the diameter D and the center distance CD of the pair of second through holes H2 so as to form the through- And performs the first and second penetration processes 10, 30.

The conductive layer CL is partially removed from the upper and lower surfaces 610 and 620 of the body 600 to form a first contact 210 connecting to the first flat plate 110, (200) having a first contact (210) and a second contact (220) separated from the first contact (210), a first connection line (310) extending from the first contact (210) A connecting line 330 extending from the contact 220 and having a second connecting line 320 spaced apart from the first connecting line 310 by a second distance d2 is formed at step S600.

The connection contact 200 connecting the planar via 100 by patterning the conductive film CL covering the upper surface and the lower surfaces 610 and 620 of the body and extending from the connection contact 200, The connecting line 300 is formed.

First, the conductive film CL is patterned from the upper surface 610 and the lower surface 620 to form the first and second contacts 210 and 200 having the same width as the predetermined length b and the width w of the via . At this time, since the conductive film CL is formed integrally with the flat plate vias 100, the first and second contacts 210 and 220 are formed to cover the upper surfaces of the first and second flat plates 110 and 120.

At this time, the thickness t2 of the connection pad 200 may be equal to or greater than the thickness t1 of the flat plate via 100. The first and second thicknesses t1 and t2 may be different from each other by the thickness of the seed layer 601. In the case of performing the deposition process without the seed layer, May have substantially the same thickness.

Alternatively, when the circuit wiring C is used as a seed film, the circuit wiring C may be simultaneously removed in the patterning process for forming the connection pad 200 to be used as the connection contact 200. In this case, the second thickness t2 may be larger than the first thickness t1 by the thickness of the circuit wiring C.

Accordingly, the connection pad 200 is formed of a rectangular conductive plate having a constant thickness and a via width w and a length b.

Subsequently, a patterning process for the conductive line CL is continuously performed to form a connection line 300 extending from the connection pad 200.

A first connection line 310 having a pad connection line 311 extending from the first contact 210 and a signal connection line 312 connecting the pad connection line 311 and the transmission signal line 710, A second connection line 320 having a pad connection line 312 extending from the second contact 220 and a signal connection line 322 connecting the pad connection line 312 and the reference signal line 720 is formed do.

The contact position of each of the pad connection lines 311 and 321 and the connection contact 200 may be adjusted by the controller to a position where the characteristic impedance deviation of the coupled via structure 800 and the coupled signal line 700 is minimized . That is, the second spacing distance d2, which is the distance between the connection lines 300, is determined by the control section to minimize the characteristic impedance deviation between the coupled signal line 700 and the coupled via structure 800, The patterning process for forming the connection lines 300 forms the connection line 300 so as to have an interval equal to the second spacing distance d2.

The transmission signal line 710 having the third spacing distance d3 at the top and bottom surfaces 610 and 620 of the body 600 and the coupled signal line 700 composed of the reference signal line 720 are connected to each other The coupling via structure 800 may be formed in a shape that automatically minimizes the characteristic impedance deviation.

The width of the planar via 100, the connection pad 200 and the connection line 300 may be the same as the width of the coupled signal line 700 according to the shape of the coupling via structure 800. [ In addition, by forming the second spacing distance d2, which is the interval of the connecting line 300, equal to the first spacing distance d1, which is the spacing of the flat plate vias 100, The lines LCL can be connected to each other between the upper surface of the body 600 and the lower surfaces 610 and 620 without substantial shape change.

According to the method of manufacturing a circuit board as described above, the flat vias 100, the connection pads 200, and the connection lines 300 constituting the coupling via structure 800 are formed into a flat structure capable of adjusting the separation distance Thereby simplifying the characteristic impedance determining factor of the coupling via structure 800. [ Accordingly, by extending the variation range of the characteristic impedance for the coupling-via structure 800, the coupling-via structure 800 having the impedance deviation minimized with respect to the coupling signal line 700 having a variety of characteristic impedances can be obtained It can be easily manufactured.

The circuit board of the present invention can be used as a package substrate, a substrate for a multichip module, a general mother board or the like. In particular, it can be used for a high-speed memory module substrate, a CPU main board, and a system board for network equipment such as a high-speed system board, thereby remarkably preventing the signal distortion of the system.

The width w and the height h of the flat plate via 100 and the first spacing d1, the length b of the connection pad 200, The characteristic impedance of the coupling via structure 800 such as the differential via structure is approximated to the characteristic impedance of the coupled signal line 700 such as the differential signal line by adjusting the shape of the connecting line 300 and the second spacing distance d2 . Therefore, by minimizing the impedance deviation between the coupled signal line 700 and the coupled via structure 800 on the circuit board 1000, distortion of the signal transmitted along the circuit board 1000 can be minimized.

The planar vias 100, the connection pads 200 and the connection lines 300 constituting the coupling via structure 800 may be formed as a simple flat plate structure capable of adjusting the separation distance, The characteristic impedance determining factor can be simplified. Accordingly, by extending the variation range of the characteristic impedance for the coupling-via structure 800, the coupling-via structure 800 having the impedance deviation minimized with respect to the coupling signal line 700 having a variety of characteristic impedances can be obtained It can be easily manufactured.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

Claims (20)

A flat vias having a pair of first and second flat plates spaced apart from each other by a first spacing distance and passing through the insulator;
A connection pad provided on an upper surface and a lower surface of the insulator integrally with the flat plate via and having a first contact connected to the first flat plate and a second contact connected to the second flat plate and separated from the first contact; And
A first connection line disposed on the top and bottom surfaces of the insulator and extending from the first contact and a second connection line extending from the second contact and spaced apart from the first connection line by a second spacing distance, Wherein the connection line is connected to a differential signal line having a transmission signal line for transmitting an input signal and a complementary signal line for transmitting a complementary signal of the input signal, Differential via structure that connects the lines. 2. The differential via structure of claim 1, wherein the contact pad comprises a planar pad having a width equal to the planar via and a thickness greater than the planar via. 3. The differential via structure of claim 2, wherein the connection line is integrally provided with the same thickness as the connection pad. The differential via structure according to claim 3, wherein the first connection lines are connected to each other with the same width and thickness as the signal lines, and the second connection lines are connected to each other with the same width and thickness as the complementary lines. 2. The differential via structure of claim 1, wherein the connection pad comprises a flat pad having the same width and thickness as the flat via, and the connection line is integrally provided with the same thickness as the connection pad. 6. The semiconductor memory according to claim 5, wherein the first connection lines are connected to each other with the same width and thickness as the signal lines, and the second connection lines are connected to each other with the same width and thickness as the complementary lines, The connection line, the connection pad, and the flat vias have the same width and thickness. A body having a first surface positioned symmetrically with respect to the first surface and a through hole having a pair of planar portions and a pair of curved surfaces facing each other through the second surface;
At least one coupled signal line disposed on the first and second surfaces, the signal signal line having a transmission signal line for transmitting an input signal and a reference signal line for transmitting a reference signal for the input signal; And
And a pair of first and second flat plates which are arranged on a plane portion of the through hole so as to face each other with a first separation distance and which electrically connect the transmission signal line and the reference signal line, A circuit board comprising a via structure having a via. 8. The connector according to claim 7, wherein the coupling-
And a second contact provided on the first and second surfaces integrally with the flat plate via, the first contact being connected to the first flat plate and the second contact being connected to the second flat plate and being separated from the first contact, ; And
A first connection line disposed on the first and second surfaces and extending from the first contact and a second connection line extending from the second contact and spaced apart from the first connection line by a second spacing distance Lt; / RTI &gt; further comprising a line. 9. The circuit board of claim 8, wherein the connection pad comprises a flat pad disposed on the wire and having the same width as the flat via and having a greater thickness than the flat via. 10. The circuit board of claim 9, wherein the connection line is provided integrally with the same thickness as the connection pad. 11. The method of claim 10, wherein the connection line and the coupled signal line are connected to each other with the same width and thickness, the first contact has the same width as the signal line and the second contact has the same width as the reference line Having a circuit board. 9. The circuit board of claim 8, wherein the connection pad comprises a flat pad having the same width and thickness as the flat via. 13. The integrated circuit of claim 12, wherein the connection lines are connected to each other with the same width and thickness as the coupled signal lines so that the coupled signal lines, the connection lines, the connection pads, Board. 13. The method of claim 12, wherein the transmission signal line and the reference signal line are spaced apart by the first spacing distance and the second spacing distance is equal to the first spacing distance, Are arranged in a line. 8. The apparatus of claim 7, wherein the planar portion includes a planar wall having a height and a constant width corresponding to a depth of the through-hole, and the curved portion includes a semicircular wall having a diameter larger than a separation distance between the pair of planar portions Circuit board. The electronic device according to claim 7, wherein the reference signal includes any one of a complementary signal having a phase complementary to the phase of the input signal, a driving signal for an electronic device connected to the insulating body, and a ground signal for the electronic device Circuit board. Forming a seed film covering the surface of the body, which is disposed on the symmetrical first and second surfaces and has a coupled signal line composed of a pair of transmission signal lines and a reference signal line;
A first through-hole process and a linear-transfer process are sequentially performed to form a first through-hole having a pair of planar portions and a pair of pre-curved surfaces facing each other through the body;
Forming a conductive film covering the side surfaces of the first through holes and covering the first and second surfaces so as to be spaced apart from each other by a first distance; And
A pair of cylindrical second through holes having diameters larger than the first spacing distance and spaced apart from each other by a center distance are formed by a second through process performed on both ends of the first through hole, Wherein the flat plate vias are divided into first and second flat plates having a smaller via width and spaced apart from each other by the first spacing distance so as to pass through the body to electrically connect the coupled signal lines. 18. The method of claim 17, wherein the first and second penetration processes pass through the body using a penetrating device, and the linear transfer process includes a step of moving the penetrating device through the body linearly along one direction Gt; 18. The method of claim 17, wherein after forming the pair of flat vias,
A first contact connected to the first flat plate and a second contact connected to the second flat plate and separated from the first contact, the conductive film being partially removed from the first surface and the second surface, A first connection line extending from the first contact, and a second connection line extending from the second contact and spaced apart from the first connection line by a second spacing distance. Way. 20. The method according to claim 19, wherein before forming the first through hole,
Thereby automatically obtaining an optimal shape factor of the flat vias, the connection pads, and the connection lines that minimizes a deviation of the characteristic impedance of the flat vias and the characteristic impedance of the coupled signal lines.

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