KR20190027137A - Connector and connector assembly - Google Patents

Abstract

A connector and a connector assembly are disclosed. The connector comprises: a plurality of insulating substrates provided in a multi-layered form; a housing for receiving the insulating substrates; a plurality of signal traces respectively installed on first side surfaces of the insulating substrates; and ground pads respectively installed on second side surfaces of the insulating substrates and reducing a signal interference between the signal traces.

Description

≪ Desc / Clms Page number 1 > Connector and connector assembly &

Embodiments of the present invention relate to connectors and connector assemblies. And more particularly, to a connector assembly comprising a first connector and a second connector for connecting between printed circuit boards.

Generally, electrical connections between printed circuit boards can be connected to one another using signal cables or connector assemblies using a plurality of signal traces. As an example, a test board used for burn-in testing for semiconductor packages and a burn-in board may be connected to each other using a first connector and a second connector having a plurality of signal traces.

The first and second connectors may include a plurality of insulating substrates on which the signal traces are mounted, and a housing in which the insulating substrates are stacked. However, loss due to signal interference between the signal traces may occur, which may cause reliability of the burn-in test on the semiconductor packages to deteriorate.

Korean Registered Patent No. 10-1425637 (registered on July 25, 2014)

Embodiments of the present invention are directed to providing a connector and connector assembly that can reduce signal interference between signal traces.

According to an aspect of the present invention, there is provided a connector comprising: a plurality of insulating substrates provided in a stacked form; a housing for accommodating the insulating substrates; And ground pads respectively mounted on the second sides of the insulating substrates and for reducing signal interference between the signal traces.

According to embodiments of the present invention, the housing and the insulating substrates and the ground pad may be aligned by an alignment shaft passing through the housing and the insulating substrates and the ground pad.

According to embodiments of the present invention, the first side of each of the insulating substrates may include first grooves into which the plurality of signal traces are inserted.

According to embodiments of the present invention, one side of each of the insulating substrates is provided with a plurality of plugs protruding from the housing for connection with another connector, and the plurality of signal traces are connected to plugs Respectively.

According to embodiments of the present invention, a plurality of socket grooves for connecting to other connectors are provided on one side of each of the insulating substrates, and the plurality of signal traces are connected to a socket terminal disposed on the inner side of the socket grooves Respectively.

According to embodiments of the present invention, the plurality of signal traces may each include a connection terminal for connection with a printed circuit board.

According to embodiments of the present invention, the first side of each of the insulating substrates may be provided with a first recess into which the ground pad is inserted.

According to embodiments of the present invention, the ground pads may each include a ground terminal for connection with a printed circuit board.

According to embodiments of the present invention, the printed circuit board may be provided with a common ground region connecting the ground pads to each other.

According to embodiments of the present invention, each of the insulating substrates may include a spacer for maintaining a predetermined gap with the adjacent insulating substrate.

According to another aspect of the present invention, there is provided a connector including a first connector mounted on a first printed circuit board and a second connector mounted on a second printed circuit board to connect between printed circuit boards, The first connector may include a plurality of first insulating substrates provided in a stacked form, a first housing for accommodating the first insulating substrates, and a second housing on the first side of the first insulating substrates, A plurality of first signal traces, each mounted for transmission of signals between the first printed circuit board and the second connector, and a plurality of second signal traces mounted on the second sides of the first insulating substrates, And the second connector may include a plurality of second insulating substrates provided in a stacked form, and a plurality of second insulating substrates, A plurality of second signal traces respectively mounted on the first side surfaces of the second insulating substrates for signal transmission between the second printed circuit board and the first connector, And first ground pads respectively mounted on the second sides of the second insulating substrates for reducing signal interference between the second signal traces.

According to embodiments of the present invention, the first housing, the first insulating substrates, and the first ground pad are connected to the first housing, the first insulating substrates, and the first grounding pad Wherein the second housing and the second insulating substrates and the second ground pad are aligned by a shaft and a second alignment shaft passing through the second housing and the second insulating substrates and the second ground pad .

According to embodiments of the present invention, a plurality of plugs protruding from the first housing are provided on one side of each of the first insulating substrates, and the plurality of first signal traces are connected to plug terminals Respectively. The plurality of second signal traces may include a socket terminal disposed on the inner side of the socket grooves, respectively. The plurality of second signal traces may include a plurality of socket grooves for inserting the plugs, .

According to embodiments of the present invention, the plurality of first signal traces each have a first connection terminal for connection to the first printed circuit board, and the plurality of second signal traces are connected to the second printed circuit board And a second connection terminal for connection with the substrate.

According to embodiments of the present invention, the first ground pads each have a first ground terminal for connection with the first printed circuit board, and the second ground pads are connected to the second printed circuit board And a second ground terminal for the ground terminal.

According to embodiments of the present invention, the first printed circuit board includes a first common ground region connecting the first ground pads to each other, and the second printed circuit board includes a second ground pad 2 common ground region may be provided.

According to embodiments of the present invention, the first housing is provided with a first contact pad, which is in contact with a first ground pad mounted on the outermost first insulating substrate of the first insulating substrates and is electrically connected to the second ground pads And a second connecting member that is in contact with the second ground pad mounted on the outermost second insulating substrate of the second insulating substrates and is coupled to the first connecting member, .

According to embodiments of the present invention, one of the first and second connecting members has a socket or pogo pin, and the other has a plug corresponding to the socket or a contact terminal corresponding to the pogo pin .

According to embodiments of the present invention as described above, the first connector has first signal traces mounted on first side surfaces of the first insulating substrates, and the second connector has first side surfaces of the second insulating substrates, Lt; RTI ID = 0.0 > signal traces < / RTI > A first ground pad may be respectively mounted on the second side surfaces of the first insulating substrates and a second ground pad may be mounted on the second side surfaces of the second insulating substrates. Thus, signal interference between the first signal traces may be reduced by the first ground pads, and signal interference between the second signal traces may be reduced by the second ground pads .

In addition, the first ground pads may be connected to a first common ground region of the first printed circuit board, and the second ground pads may be connected to a second common ground region of the second printed circuit board. Also, the outermost first ground pad among the first ground pads may be connected to the outermost second ground pad among the second ground pads by connecting members. As a result, both the first ground pads and the second ground pads can be connected to each other, so that the grounding capacity of the connector assembly can be greatly increased, so that the signal interference of the connector assembly can be further reduced.

1 is a schematic perspective view for explaining a connector assembly according to an embodiment of the present invention.
2 is a schematic cross-sectional view illustrating the connector assembly shown in Fig.
3 is a schematic perspective view for illustrating first signal traces and first ground pads of the first connector;
4 is a schematic perspective view illustrating a method of mounting first signal traces and a first ground pad on a first insulating substrate;
5 is a schematic side view illustrating first signal traces mounted on a first side of a first insulating substrate;
6 is a schematic side view for illustrating a first ground pad mounted on a second side of the first insulating substrate;
7 is a schematic side view illustrating second signal traces mounted on a first side of a second insulating substrate;
8 is a schematic side view for illustrating a second ground pad mounted on the second side of the second insulating substrate.
9 is a schematic perspective view for explaining a method of mounting first insulating substrates on the first housing shown in FIG.
10 is a schematic view for explaining a method of electrically connecting the first ground pads and the second ground pads to each other.
11 is a schematic perspective view for explaining the first connecting member shown in Fig.
12 is a schematic perspective view for explaining a third linking member;
13 is a schematic structural view for explaining another example of the first linking member and the second linking member shown in Fig.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

In the embodiments of the present invention, when one element is described as being placed on or connected to another element, the element may be disposed or connected directly to the other element, . Alternatively, if one element is described as being placed directly on another element or connected, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used in the embodiments of the present invention is used for the purpose of describing specific embodiments only, and is not intended to be limiting of the present invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the regions described in the drawings, but include deviations in the shapes, and the elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements and is not intended to limit the scope of the invention.

FIG. 1 is a schematic perspective view for explaining a connector assembly according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view for explaining a connector assembly shown in FIG.

1 and 2, a connector assembly 2 according to an embodiment of the present invention connects between printed circuit boards 10, 20 and includes a signal (not shown) between the printed circuit boards 10, Can be used for delivery. The connector assembly 2 may include a first connector 100 mounted on the first printed circuit board 10 and a second connector 200 mounted on the second printed circuit board 20. For example, the connector assembly 2 may be used for signal transmission between a test board and a burn-in board for burn-in testing of semiconductor packages.

The first connector 100 may include a plurality of first insulating substrates 110 provided in a stacked form and a first housing 140 receiving the first insulating substrates 110, Although not shown, a plurality of first signal traces 120 for signal transmission are respectively mounted on the first side surfaces 110A (see FIG. 5) of the first insulating substrates 110, First ground pads 130 for reducing signal interference between the first signal traces 120 may be mounted on the second sides 110B (see FIG. 6) of the first signal traces 110, respectively.

The second connector 200 may include a plurality of second insulating substrates 210 provided in a stacked form and a second housing 240 receiving the second insulating substrates 210, Although not shown, a plurality of second signal traces 220 for signal transmission are respectively mounted on the first side surfaces 210A (see FIG. 7) of the second insulating substrates 210, Second ground pads 230 for reducing signal interference between the second signal traces 220 may be mounted on the second sides 210B (see FIG. 8) of the first signal traces 210, respectively.

Figure 3 is a schematic perspective view illustrating first signal traces and first ground pads of the first connector and Figure 4 illustrates a method of mounting first signal traces and a first ground pad on a first insulating substrate Fig. Figure 5 is a schematic side view for describing first signal traces mounted on a first side of a first insulating substrate, Figure 6 is a side view of a first ground pad mounted on a second side of a first insulating substrate, Fig. Figure 7 is a schematic side view for describing second signal traces mounted on the first side of the second insulating substrate and Figure 8 is a side view illustrating a second ground pad mounted on the second side of the second insulating substrate Fig.

3 to 8, a plurality of first signal traces 120 may be mounted on the first side 110A of the first insulating substrate 110, A first ground pad 130 may be mounted on the second side surface 110B. The first insulating substrate 110 and the first ground pad 130 may be aligned by the first alignment shaft 150. The first aligning shaft 150 is formed to penetrate the first housing 140 and the first insulating substrates 110 and the first ground pads 130 in the longitudinal direction of the first connector 100 For this purpose, the first insulating substrates 110 and the first ground pads 130 may be provided with alignment holes into which the first alignment shaft 150 is inserted. Although not shown in detail, the second insulating substrates 210 and the second ground pads 230 may be aligned by the second alignment shaft 250. The second alignment shaft 250 is configured to penetrate the second housing 240, the second insulating substrates 210, and the second ground pads 230 in the longitudinal direction of the second connector 200 For this purpose, the second insulating substrates 210 and the second ground pads 230 may be provided with alignment holes into which the second alignment shaft 250 is inserted, respectively.

5 and 6, the first side 110A of the first insulating substrate 110 may be provided with first grooves 112 through which the first signal traces 120 are inserted. And a first recess 114 into which the first ground pad 130 is inserted may be provided on a second side surface 110B of the first insulating substrate 110. [ The first ground pins 130 may be provided with first fixing pins 132 for fixing the first ground pins 130. The first fixing pins 132 may be formed in the first recess 114, First fixing grooves (not shown) may be provided.

It is preferable that the first grooves 112 and the first recess 114 have a sufficient depth so that the adjacent first signal traces 120 and the first ground pads 130 do not contact with each other. Although not shown, each of the first insulating substrates 110 may include a first insulating substrate (not shown) adjacent to the first signal traces 120 to prevent contact between the first signal traces 120 and the first ground pads 130 (Not shown) for maintaining a predetermined gap between the first and second spacers 110 and 110.

7 and 8, second grooves 212 may be formed in the first side 210A of the second insulating substrate 210 to receive the second signal traces 220 And a second recess 214 through which the second ground pad 230 is inserted may be formed on a second side surface 210B of the second insulating substrate 210. [ The second ground pins 230 may be provided with second fixing pins 232 for fixing the second ground pins 230. The second fixing pins 232 may be formed in the second recess 214, And second fixing grooves (not shown) may be provided.

It is preferable that the second grooves 212 and the second recesses 214 have a sufficient depth so that the adjacent second signal traces 220 and the second ground pads 230 do not contact with each other Do. Although not shown, each of the second insulating substrates 210 may include a second insulating substrate (not shown) adjacent to the second signal traces 220 to prevent contact between the second signal traces 220 and the second ground pads 230 (Not shown) for maintaining a predetermined gap between the first and second spacers 210 and 210.

3, the first signal traces 120 include first connection terminals 122 for connection with the first printed circuit board 10 and second signal traces 220, And plug terminals 124 for connection with the plug terminals. As shown, the first signal traces 120 may extend in diagonal directions, and the first connection terminals 122 and the plug terminals 124 may extend in mutually perpendicular directions, for example, , And extend downward and laterally as shown, respectively. As shown in FIGS. 5 and 6, a plurality of plugs 116 for connecting to the second insulating substrate 210 may be provided on one side of the first insulating substrate 110, The plugs 116 may be disposed at the top and bottom of the plugs 116, respectively.

The second signal traces 220 may include second connection terminals 222 for connection to the second printed circuit board 20 and socket terminals 220 for connection to the first signal traces 120. [ (224). 7 and 8, the second signal traces 220 may extend in a diagonal direction, respectively, and the second connection terminals 222 and the socket terminals 224 may extend perpendicularly to each other Directions, e.g., downward and lateral, respectively, as shown. The socket terminals 224 may be provided at one side of the second insulating substrate 210 and corresponding to a plurality of the plugs 116, that is, the socket grooves 216 into which the plugs 116 are inserted. May be arranged to correspond to the plug terminals (124) on the inner surfaces of the socket recesses (216). That is, the socket terminals 224 may be disposed on the inner upper surface and the inner lower surface of the socket grooves 216, respectively.

3, the lower portion of the first ground pad 130 mounted on the second side surface 110B of the first insulating substrate 110 is electrically connected to the first side surface 110B of the first insulating substrate 110, The first ground pad 130 may be bent toward the first ground pad 110A and the first ground pad 130 may have a first ground terminal 134 extending downward from the curved portion. The bent portion of the lower portion of the first ground pad 130 is connected to the first ground terminal 134 and the first connection terminals 122 of the first signal traces 120 mounted on the first side 110A For aligning each other.

Although not shown, a lower portion of the second ground pad 230 mounted on the second side surface 210B of the second insulating substrate 210 is formed in the same manner as the first ground pad 130, The second ground pad 230 may be folded toward the first side 210A of the substrate 210 and the second ground pad 230 may have a second ground terminal 234 extending downward from the folded portion.

Referring again to FIG. 2, the first connection terminals 122 and the first ground terminals 134 of the first connector 100 may be mounted on the first printed circuit board 10, The second connection terminals 222 and the second ground terminals 234 of the second connector 200 may be mounted on the second printed circuit board 20. Although not shown in detail, the first printed circuit board 10 includes a first common ground region 12 connecting the first ground terminals 134 mounted on the first insulating substrates 110 to each other, And a second common ground line 234 connecting the second ground terminals 234 mounted on the second insulating substrates 210 may be provided on the second printed circuit board 20, A region 22 or a second common ground wiring may be provided.

9 is a schematic perspective view for explaining a method of mounting first insulating substrates on the first housing shown in FIG.

Referring to FIG. 9, the first housing 140 may have a substantially rectangular box shape extending in a long direction. As shown in FIG. 9, two adjacent side faces for opening the first insulating substrates 110 are opened . In particular, first alignment slots 142 for aligning the positions of the first insulating substrates 110 may be formed on the inner surfaces of the first housing 140.

In addition, although not shown, the second housing 240 may have a substantially rectangular box shape that extends long, and two side faces may be opened for mounting the second insulating substrates 210 . In addition, second alignment slots (not shown) for aligning the second insulating substrates 210 may be formed on the inner surfaces of the second housing 240.

The first ground pads 130 of the first connector 100 and the second ground pads 230 of the second connector 200 may be electrically connected to each other.

10 is a schematic view for explaining a method of electrically connecting the first ground pads and the second ground pads to each other. Fig. 11 is a schematic perspective view for explaining the first connecting member shown in Fig. 10, and Fig. 12 is a schematic perspective view for explaining a third connecting member.

Referring to FIGS. 10 and 11, the first connector 100 and the second connector 200 are connected to each other to electrically connect the first ground pads 130 and the second ground pads 230 to each other. Respectively.

For example, as shown in FIG. 9, one of the inner side surfaces on both sides in the longitudinal direction of the first housing 140 may be provided with a first insulating substrate 110, A first connecting member 160 which is in contact with a first ground pad 130 mounted on two side surfaces 110B may be mounted on one of the inner side surfaces of the second housing 240, The first connection member 160 contacts the second ground pad 230 mounted on the second side surface 210B of the outermost second insulation substrate 210 of the second insulation substrates 210, 2 connecting member 260 can be mounted. The first connection member 160 and the second connection member 260 may have a socket and a plug shape and may be connected to each other when the first connector 100 and the second connector 200 are coupled.

The first connection member 160 may include contact protrusions 162 for contacting the adjacent first ground pad 130. Although not shown in detail, in the case of the second connection member 260 And contact protrusions 262 for contact with the second ground pad 260 adjacent to the second ground pad 260.

9 and 12, the other one of the inner side surfaces on both sides in the longitudinal direction of the first housing 140 may be provided with the other first outer insulating substrate 110 And a third connecting member 170 that is in contact with the first ground pad 130 mounted on the second side surface 110B. The third connection member 170 may include a contact terminal 172 for contacting the first ground pad 130. Although not shown in the drawing, A through hole through which the contact terminal 172 of the third linking member 170 passes may be provided.

Although not shown, a fourth connecting member (not shown) corresponding to the third connecting member 170 may be mounted on the other of the inner side surfaces on both sides in the longitudinal direction of the second housing 240 . The fourth connecting member may be in contact with the second ground pad 230 mounted on the second side surface 210B of the outermost second insulating substrate 210 of the second insulating substrates 210. [ The fourth connection member may be in contact with the second ground pad 230 in a manner similar to the third connection member 170, And the other outermost second insulating substrate 210 may be provided with a through hole through which the contact terminal of the fourth connecting member passes.

13 is a schematic structural view for explaining another example of the first linking member and the second linking member shown in Fig.

13, the first connecting member 164 may have a pogo pin 166 to allow elastic contact with the second connecting member 264 as shown, and the second connecting member 264 May have a contact terminal 266 corresponding to the pogo pin 166. In this case, the durability of the first and second connecting members 164 and 264 can be greatly improved as compared with the shapes of the plug and the socket as shown in FIG. However, since the shapes of the first linking member 164 and the second linking member 264 can be variously changed, the scope of the present invention is not limited by the illustrated detailed structures.

According to embodiments of the present invention as described above, the first connector 100 has first signal traces 120 mounted on the first sides 110A of the first insulating substrates 110 The second connector 200 may include second signal traces 220 mounted on the first sides 210A of the second insulating substrates 210. [ A first ground pad 130 may be mounted on the second side surfaces 110B of the first insulating substrates 110 and a second ground side surface may be formed on the second side surfaces 210B of the second insulating substrates 210. [ And a second ground pad 230 may be respectively mounted. Thus, signal interference between the first signal traces 120 may be reduced by the first ground pads 130 and signal interference between the second signal traces 120 may be reduced by the second May be reduced by the ground pads 230. [

The first ground pads 130 may be connected to the first common ground region 12 of the first printed circuit board 10 and the second ground pads 230 may be connected to the second printed circuit board 20 of the second common ground region 22. The outermost first ground pad 130 of the first ground pads 130 may be connected to the outermost second ground pad 230 of the second ground pads 230 by connecting members . As a result, since both the first ground pads 130 and the second ground pads 230 can be connected to each other, the grounding capacity of the connector assembly 2 can be greatly increased, 2 can be further reduced.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It will be understood.

2: connector assembly 10: first printed circuit board
12: first common ground region 20: second printed circuit board
22: second common ground region 100: first connector
110: first insulating substrate 120: first signal trace
130: first ground pad 140: first housing
150: first alignment shaft 160: first connection member
200: second connector 210: second insulating substrate
220: second signal trace 230: second ground pad
240: second housing 250: second alignment shaft
260: second connecting member

Claims (18)

A plurality of insulating substrates provided in a stacked form;
A housing for receiving the insulating substrates;
A plurality of signal traces respectively mounted on the first side surfaces of the insulating substrates; And
And ground pads respectively mounted on the second sides of the insulating substrates for reducing signal interference between the signal traces. 2. The connector of claim 1, wherein the housing and the insulating substrates and the ground pad are aligned by an alignment shaft passing through the housing and the insulating substrates and the ground pad. 2. The connector of claim 1, wherein the first side of each of the insulating substrates is provided with first grooves into which the plurality of signal traces are inserted. The connector according to claim 1, wherein a plurality of plugs protruding from the housing are provided on one side of each of the insulating substrates,
Said plurality of signal traces each having plug terminals disposed on said plugs. The connector according to claim 1, wherein a plurality of socket grooves for connecting with other connectors are provided on one side of each of the insulating substrates,
Wherein the plurality of signal traces each comprise a socket terminal disposed on the inner side of the socket grooves. The connector of claim 1, wherein the plurality of signal traces each include a connection terminal for connection to a printed circuit board. 2. The connector according to claim 1, wherein a first recess is formed in a second side surface of each of the insulating substrates, the ground pad being inserted into the first recess. 2. The connector of claim 1, wherein the ground pads each comprise a ground terminal for connection to a printed circuit board. 9. The connector of claim 8, wherein the printed circuit board is provided with a common ground region connecting the ground pads to one another. 2. The connector according to claim 1, wherein each of the insulating substrates has a spacer for maintaining a predetermined gap with an adjacent insulating substrate. A connector assembly comprising a first connector mounted to a first printed circuit board and a second connector mounted to a second printed circuit board for connecting between printed circuit boards,
The first connector includes:
A plurality of first insulating substrates provided in a stacked form;
A first housing for receiving the first insulating substrates;
A plurality of first signal traces respectively mounted on the first sides of the first insulating substrates for signal transfer between the first printed circuit board and the second connector; And
First ground pads mounted on respective second sides of the first insulating substrates for reducing signal interference between the first signal traces,
The second connector includes:
A plurality of second insulating substrates provided in a stacked form;
A second housing for receiving the second insulating substrates;
A plurality of second signal traces respectively mounted on the first side surfaces of the second insulating substrates for signal transmission between the second printed circuit board and the first connector; And
And first ground pads respectively mounted on the second sides of the second insulating substrates for reducing signal interference between the second signal traces. 12. The method of claim 11 wherein the first housing and the first insulating substrates and the first ground pad are connected by a first alignment shaft passing through the first housing and the first insulating substrates and the first ground pad ≪ / RTI &
And the second housing and the second insulating substrates and the second grounding pad are aligned by a second alignment shaft passing through the second housing and the second insulating substrates and the second grounding pad. Connector assembly. 12. The semiconductor device according to claim 11, wherein a plurality of plugs protruding from the first housing are provided on one side of each of the first insulating substrates,
The plurality of first signal traces each having a plug terminal disposed on the plugs,
A plurality of socket grooves into which the plugs are inserted are provided on one side of each of the second insulating substrates,
Said plurality of second signal traces each having a socket terminal disposed on the inner side of said socket grooves. 12. The method of claim 11, wherein the plurality of first signal traces each have a first connection terminal for connection to the first printed circuit board,
Wherein the plurality of second signal traces each comprise a second connection terminal for connection to the second printed circuit board. 12. The apparatus of claim 11, wherein the first ground pads each have a first ground terminal for connection to the first printed circuit board,
Said second ground pads each having a second ground terminal for connection to said second printed circuit board. 16. The method of claim 15, wherein the first printed circuit board is provided with a first common grounding region for connecting the first grounding pads to each other,
And the second printed circuit board is provided with a second common grounding region for connecting the second grounding pads to each other. 17. The method according to claim 16, wherein the first housing is provided with a first connection pad, which is in contact with a first ground pad mounted on an outermost first insulating substrate of the first insulating substrates and has a first connection for electrical connection with the second ground pads And,
Wherein the second housing is provided with a second connecting member which is in contact with a second ground pad mounted on an outermost second insulating substrate of the second insulating substrates and is engaged with the first connecting member. 18. The connector according to claim 17, wherein one of the first and second connecting members has a socket or pogo pin, and the other has a plug corresponding to the socket or a contact terminal corresponding to the pogo pin Respectively.

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