KR20180009450A - Nanofilm transfer method and apparatus - Google Patents

Abstract

The present invention relates to a method for transferring a nano thin film. A nano thin film formed on a catalyst metal is transferred on a target substrate, and a sacrificial layer adhering as a polysiloxane-based material is applied or coated on the nano thin film to transfer the nano thin film can be physically and easily removed using an adhesive tape. Accordingly, impurities on the surface of the transferred nano thin film can be minimized.

Description

[0001] Nanofilm transfer method and apparatus [0002]

The present invention relates to a method and apparatus for transferring a nano thin film formed on a catalytic metal onto a target substrate to be subjected to a chemical treatment, And more particularly, to a method and apparatus for transferring a nano thin film.

Graphene is a term made by combining graphite, which is used as a pencil lead, with graphite, and a suffix, -ene, which means a molecule with carbon double bonds.

Graphite consists of a structure in which carbon is stacked in a hexagonal honeycomb structure. Graphene is the thinnest layer of graphite. Graphene, a carbon isotope, is a nanomaterial composed of carbon, carbon number 6, like carbon nanotubes and fullerene. One layer of graphene has a two-dimensional planar shape, and its thickness is as thin as 0.335 nm and its physical and chemical stability is high. In addition, electrons can move more than 100 times faster than monocrystalline silicon, which is 100 times more electricity than copper and is mainly used as a semiconductor. In addition, the strength is more than 200 times stronger than steel, more than twice the thermal conductivity of diamond with the highest thermal conductivity, and is characterized by excellent transparency. Also, it is excellent in flexibility and does not lose its electrical properties even when stretched or bent. Because of these properties, graphene is regarded as a material that goes beyond carbon nanotubes, which are regarded as the next generation of new materials, and is called 'dream nanomaterial'. Thus, graphene is attracting attention as a future-oriented new material in the electronic information industry that can produce bendable displays, electronic paper, wearable computers, and ultra-high-speed transistors.

Generally, such graphene is formed on a metal catalyst. In order to transfer the graphene onto a target substrate to be transferred, a sacrificial layer is coated with a polymer or coated on the graphene to form a sacrifice layer, And the graphene is brought into close contact with the target substrate, and then the sacrificial layer is etched and removed to transfer the graphene to a desired target substrate.

However, since the polymer layer (sacrificial layer) is contacted with and removed from the graphene, the polymer layer is removed, leaving a polymer residue on the surface of the transferred graphene.

Figure 1 is a graphical representation of Yung-Chang Lin et al. "Graphene Annealing: How Clean Can It Be?", Nano Lett, vol. 12, p.6563-6570 (2012), which is a TEM photograph of the surface of the graphene having been transferred. In FIG. 1A and FIG. 1B which are monochrome photographs, dark black portions are impurities, and dark colored portions in FIG. 1C are polymer impurities. And the remaining gray part is graphene. Likewise, in the lower part of FIG. 1B and the lower part of FIG. 1C, yellow is copper, which is an impurity, and the part indicated by red and blue is a polymer impurity.

Thus, conventionally, when a nano thin film is transferred, a polymer layer is contacted with the nano thin film, and then the polymer layer is removed by etching. Therefore, polymer impurities remain on the surface of the transferred nano thin film, There is a problem that it is difficult to be utilized as a state having inherent physical properties and inherent physical properties.

KR 10-1156478 B1 (May 22, 2012)

SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems described above, and it is an object of the present invention to provide a nanostructured film on a catalyst metal, which is transferred onto a target substrate to be targeted, A carrier film can be easily removed physically, and impurities can be minimized on the surface of the transferred nano thin film.

According to another aspect of the present invention, there is provided a method of transferring a nano thin film comprising: applying or coating a precursor solution in which a polysiloxane-based material is dissolved in a solvent on a top surface of a nano thin film formed on a metal catalyst; Forming a carrier film by curing the coated or coated precursor solution (S200); Removing the metal catalyst by etching (S300); A step (S400) of bringing the nano thin film into contact with the upper surface of the target substrate so as to be in close contact with each other; Attaching an adhesive tape to an upper surface of the carrier film (S500); And peeling the adhesive tape so that the carrier film is removed from the target substrate with the carrier film adhered to the adhesive tape, thereby transferring the nano thin film to the target substrate (S600); And a control unit.

In addition, in step S100, the precursor solution is coated on the upper surface of the nano thin film by spin coating.

Further, the solvent is characterized by being n-butanol (C ₄ H ₁₀ O).

In the step S200, the precursor solution is coated or coated, and is then cured by heat treatment at a temperature of 150 ° C or higher and 200 ° C or lower.

In addition, in step S500, the adhesive tape is formed to be wider than the carrier film, and is attached so that the carrier film is positioned within the range of the adhesive tape.

In addition, in steps S500 and S600, the adhesive tape may be formed in a roller shape so that the roller-shaped adhesive tape is adhered to one end of the carrier film, and then the adhesive tape in a roller shape is pressed and rotated to the other end, Is removed.

The method for transferring a nano thin film according to the present invention comprises the steps of applying or coating a precursor solution obtained by dissolving a polysiloxane-based material in a solvent on a top surface of a nano thin film while supplying a metal catalyst having a nano thin film formed on its upper surface; Curing the coated or coated precursor solution to form a carrier film (SA200); A step (SA300) of passing the metal catalyst having the carrier film attached to the nano thin film through an etching apparatus to remove the metal catalyst; (SA400) such that the target substrate is disposed on the lower side of the nano thin film, and the carrier film with the nano thin film and the target substrate are supplied and closely contacted while passing between the second rollers; And an adhesive film is disposed on the upper side of the carrier film so that the target substrate and the adhesive film which are laminated and adhered to the carrier film and the nano thin film are supplied and adhered to each other while passing between the third rollers, A step (SA500) of transferring the nano thin film to the target substrate by removing the carrier film from the nano thin film with the film attached; And a control unit.

Further, the steps from step SA100 to step SA500 may be continuously performed by a roll-to-roll process.

Further, between step SA100 and step SA200, the step of adjusting the thickness of the precursor solution coated or coated on the upper surface of the nano thin film (SA150) is further performed.

Further, the solvent is characterized by being n-butanol (C ₄ H ₁₀ O).

The precursor solution is characterized in that the precursor solution is cured by heat treatment at a temperature of 150 ° C or more and 200 ° C or less.

In addition, in step SA500, the adhesive tape is formed to be wider than the width of the carrier film, and is adhered so that the carrier film is positioned within the adhesive tape.

The nano thin film transfer apparatus of the present invention comprises: a pair of first rollers for supplying a metal catalyst having a nanotubes formed on its top surface to one side while passing; A solution applying device for applying a precursor solution for forming a carrier film on an upper surface of the nano thin film after passing through the first roller; A curing device for curing the applied precursor solution to form a carrier film after applying the precursor solution; An etching apparatus for etching the metal catalyst while the metal catalyst having the carrier film adhered to the nano thin film after the carrier film is formed is removed; A pair of second rollers for allowing the nano thin film to adhere to the nano thin film while the carrier film and the target substrate having the nano thin film pass through in a state that the target substrate is disposed below the nano thin film after passing through the etching apparatus; A pair of third rollers which laminate the carrier film and the nano thin film and make the target substrate closely contact with the target substrate while passing the adhesive film in a state that the adhesive film is disposed on the carrier film after passing through the second roller; And a pressure-sensitive adhesive tape and a carrier film recovery device for removing the carrier film from the nano-thin film with the carrier film attached to the pressure-sensitive adhesive film after passing through the third roller; And a control unit.

A target substrate supply roll for supplying a target substrate to the second roller side; An adhesive tape supply roll for supplying the adhesive tape to the third roller side; And a pressure-sensitive adhesive tape and a carrier film recovery roll for recovering the pressure-sensitive adhesive tape and the carrier film with the carrier film adhered to the pressure-sensitive adhesive tape; And further comprising:

The nano thin film may further include a blade disposed between the solution applying device and the curing device and disposed near the top surface of the nano thin film to control a thickness of the precursor solution applied on the top surface of the nano thin film.

In addition, the curing apparatus is a radiant heater disposed on the upper side of the nano thin film.

The nano thin film transfer method of the present invention is advantageous in that the surface of the transferred nano thin film can be transferred without polymer impurities.

In addition, there is an advantage that the carrier film for transferring the nano thin film can be physically removed easily.

Further, since there is no polymer impurity on the surface of the nano thin film, there is an advantage that it can be applied to a state having inherent physical properties of the transferred nano thin film.

FIG. 1 is a TEM image of a surface of a nano thin film manufactured by a conventional transfer method. FIG.
2 to 4 are perspective views illustrating a method of transferring a nano thin film according to an embodiment of the present invention.
FIGS. 5 and 6 are cross-sectional views illustrating a method of transferring a nano thin film according to an embodiment of the present invention.
7 is a perspective view showing a method of removing a carrier film using a roller type adhesive tape according to the present invention.
8 to 11 are optical microscope (OM) photographs showing the surface of the finally transferred nanotubes according to the heat treatment temperature according to the present invention.
12 is a schematic view showing a method and apparatus for transferring a nano thin film according to an embodiment using the roll-to-roll process of the present invention.
13 is a partially enlarged view of Fig.

Hereinafter, the method and apparatus for transferring a nano thin film of the present invention will be described in detail with reference to the accompanying drawings.

FIGS. 2 to 4 are perspective views illustrating a method of transferring a nano thin film according to an embodiment of the present invention, and FIGS. 5 and 6 are cross-sectional views illustrating a method of transferring a nano thin film according to an embodiment of the present invention.

[Example 1]

As shown in the figure, the nano thin film transfer method of the present invention includes a step of applying or coating a precursor solution in which a polysiloxane-based material is dissolved in a solvent on a top surface of a nano thin film 200 formed on a metal catalyst 100 S100); Forming a carrier film (300) by curing the applied or coated precursor solution (S200); Etching and removing the metal catalyst 100 (S300); A step (S400) of bringing the nano thin film (200) into contact with the upper surface of the target substrate (400) so as to be in contact therewith; Attaching an adhesive tape (500) to an upper surface of the carrier film (300); The carrier film 300 is removed from the target substrate 400 in a state where the carrier film 300 is attached to the adhesive tape 500 so that the nano- A step S600 of transferring the thin film 200; . ≪ / RTI >

First, the metal catalyst 100 may be formed of a metal foil such as copper (Cu), and the nano thin film 200 may be formed on at least one of the upper surface and the lower surface of the metal catalyst 100. At this time, the nano thin film 200 may be formed on the metal catalyst 100 by chemical vapor deposition (CVD) or the like, and the nano thin film 200 may be a graphene.

In step S100, the precursor solution for forming the carrier film 300 is coated or coated on the upper surface of the nanofilm 200 formed on the metal catalyst 100, so that the precursor solution spreads thinly and evenly on the upper surface of the nanofilm 200 So as to be brought into contact with each other. At this time, the precursor solution may be a solution in which a polysiloxane-based material is dissolved in a solvent, and the polysiloxane-based material is a material used in a spin-on-glass (SOG) O- "-like bonding structure may be used.

In operation S200, the precursor solution coated or coated on the upper surface of the nano thin film 200 is cured to form the carrier film 300. That is, since the precursor solution can not maintain its shape when it is applied or coated on the upper surface of the nano thin film 200, the coated or coated precursor solution can be cured to form a solid carrier film 300. The carrier film 300 may be in a state of being in close contact with the upper surface of the nano thin film 200 and the carrier film 300 may be formed on the upper surface of the nano thin film 200 formed on the upper surface of the metal catalyst 100 300 may be in close contact with each other. At this time, the coated or coated precursor solution may be formed into a flexible and solid state carrier film 300 which can be bent after being cured.

In operation S300, the metal catalyst 100 is removed by etching to remove the metal catalyst 100 from the nano thin film 200. As shown in FIG. That is, the metal catalyst 100 may be removed by immersing the stacked body in an etchant to etch the metal catalyst 100, and the metal catalyst 100 may be removed to form the nanotubes 200 on the lower surface of the carrier film 300 .

In step S400, the nano thin film 200 is brought into contact with the upper surface of the target substrate 400, which is prepared in advance. The target substrate 400 may be used for transferring the nano thin film 200. The target substrate 400 may be any of various types of substrates but the target substrate 400 and the nano thin film 200 A substrate having a bonding force greater than that of the carrier film 300 and the nano thin film 200 may be used. The carrier film 300 on which the nano thin film 200 is disposed is placed on the upper surface of the target substrate 400 and the lower side of the target substrate 400 and the carrier film 300 So that the nano thin film 200 can be brought into close contact with the target substrate 400. Thus, the nano thin film 200 may be in close contact with the upper surface of the target substrate 400, and the carrier film 300 may be attached to the upper surface of the nano thin film 200.

In step S500, the adhesive tape 500 is attached to the upper surface of the carrier film 300. The adhesive tape 500 is pressed on the carrier film 300 by hand or by using a mechanical device, The adhesive tape 500 may be attached to the upper surface of the adhesive tape 300. At this time, the adhesive tape 500 may be a general adhesive tape such as a scotch tape, and the adhesive force between the adhesive tape 500 and the carrier film 300 is higher than the adhesive force between the carrier film 300 and the nano- A large adhesive tape can be used. The nano thin film 200 is adhered to the upper surface of the target substrate 400 and the carrier film 300 is attached to the upper surface of the nano thin film 200. The adhesive tape 500 is formed on the upper surface of the carrier film 300 It can be in an attached state. The adhesive tape 500 may be a heat peeling tape, a UV peeling tape, a pressure sensitive adhesive (PSA) tape, or the like. In order to generate a vertical strain of 0.03 level relative to the thickness of the adhesive layer formed on the adhesive tape, It is preferable to press on the upper surface of the carrier film.

In operation S600, the adhesive tape 500 is peeled off and peeled together with the carrier film 300 attached to the adhesive tape 500. The peeling can be performed manually or by using a mechanical device. When the adhesive tape 500 is peeled off, the adhesive force between the adhesive tape 500 and the carrier substrate 300 is greater than the adhesive force between the nanofilm 200 and the carrier substrate 300, The nanostructured film 200 may be removed together with the target substrate 400, and the nanostructured film 200 may be adhered to and adhered to the target substrate 400. The carrier film 300 and the nano thin film 200 are separated while the adhesive tape 500 is detached and the carrier film 300 is maintained in a state in which the nano thin film 200 is closely attached to the target substrate 400, Can be removed.

Thus, the carrier film 300 is removed by separating the nano thin film 200 and the carrier film 300 without using a chemical method such as etching, using a carrier film and a pressure-sensitive adhesive tape which are cured using a polysiloxane- The carrier film and the nano thin film can be separated by a physical method and the nano thin film can be transferred to the target substrate so that there is no polymer residue as an adhesive substance on the top surface of the nano thin film finally transferred to the target substrate. Since the carrier film is formed using a polysiloxane-based material, the carrier film is adhered to the nanofiltration film relatively weaker than other adhesive or polymer materials, and when the carrier film is removed by a physical method, It may not remain on the upper surface.

Therefore, the nanofiltration method of the present invention can transfer the nanofiltration film without transferring the polymer impurity to the surface of the transferred nanofiltration film, physically remove the carrier film for transferring the nanofiltration film, The inherent properties of the transferred nano thin film can be accurately measured.

[Example 2]

Further, in step S100, the precursor solution may be coated on the upper surface of the nano thin film 200 by spin coating.

That is, when the precursor solution is dropped on the upper surface of the nano thin film 200 and then the metal catalyst 100 is rotated at a high speed, the precursor solution spreads on the upper surface of the nano thin film 200 widely and uniformly, The thickness can be made thin. In addition, even if fine irregularities are present on the surface of the nano thin film 200, the precursor solution may adhere to the irregular surface, and the upper surface of the precursor solution may be formed in a flat state. . In addition, air bubbles may not be trapped between the nano thin film 200 and the coated precursor solution. Thus, when the metal catalyst 100 is etched and removed, the nano thin film 200 can be prevented from being damaged or wrinkled. The precursor solution in which the polysiloxane-based material is dissolved in the solvent is applied or coated by various coating methods such as dip coating, printing, screen printing, spray coating, spin coating, roll coating, roll- And may be applied by a casting method or the like.

Also, the solvent may be n-butanol (C ₄ H ₁₀ O).

That is, the precursor solution may be formed by dissolving the polysiloxane-based material in n-butanol, which is a solvent. When the precursor solution is applied or coated on the upper surface of the nano thin film 200 and then cured to form the carrier film 300, The volatile components are all removed and formed into silanol (SiOH), and the carrier film 300 having a flexible nature in which a slight carbon component remains and the carbon component is contained in the silanol may be formed.

At this time, in step S200, the precursor solution may be coated or coated and then cured by heat treatment in a range of 150 ° C to 200 ° C.

That is, the precursor solution applied or coated on the upper surface of the nano thin film 200 can be cured by heat treatment. As described above, the cured carrier film 300 is heat treated for a specific time in the range of 150 ° C to 200 ° C, The adhesion of the nano thin film 200 with the target substrate 400 is weaker than the adhesion between the target substrate 400 and the nano thin film 200. As shown in the figure, And the residue of the carrier film 300 may not be adhered to the nano thin film 200. That is, when the carrier film 300 is formed by curing at room temperature or by heat treatment at 100 ° C as shown in FIGS. 8 and 9, if the carrier film 300 is removed using the adhesive tape 500, May be adhered to the carrier film 300 and adhered to the target substrate 400 or may be torn and damaged. As shown in FIG. 10, the carrier film 300 is formed by heat treatment at 300 ° C. When the carrier film 300 is removed using the adhesive tape 500, a part of the carrier film 300 is not removed but remains on the upper surface of the nanofiltration film 200, 300) are left behind. 11, when the carrier film 300 is formed by heat treatment in a temperature range of 150 ° C. to 200 ° C., the carrier film 300 is removed using the adhesive tape 500, and the damage of the nanofilm 200 The carrier film 300 is completely removed and the remnants of the carrier film 300 are not left on the upper surface of the nano thin film 200 so that the upper surface of the nano thin film 200 finally transferred to the target substrate 400 is free of impurities And can be formed in a clean state.

Further, in the S400 step, the target substrate 400 is a silicon oxide (SiO ₂₎ and the substrate layer is formed, the nano-film 200 on the upper surface of the layer of silicon (Si) may be brought into close contact with the silicon oxide layer .

That is, although the target substrate 400 may be formed of a substrate formed of only a silicon layer, a silicon oxide (SiO ₂ ; silicon dioxide (SiO ₂ ) ) Layer (SiO ₂ / Si substrate) can be used, and the nano thin film 200 can be adhered to the upper surface of the silicon oxide (SiO ₂ ) layer. At this time, a layer of various materials such as SiNx and PET may be formed instead of the silicon oxide (SiO ₂ ) layer.

The adhesive tape 500 may be formed to be wider than the carrier film 300 so that the carrier film 300 is positioned within the adhesive tape 500 in step S500.

That is, the adhesive tape 500 may be formed to be wider than the carrier film 300 and may be formed in a planar shape. After the carrier film 300 is disposed inside the width of the adhesive tape 500, The carrier film 300 may be removed together with the carrier 500. At this time, the adhesive tape 500 may be attached to the carrier film 300 in such a manner that the carrier film 300 is overlapped by the adhesive tape 500, at least one end of the adhesive tape 500 is disposed outside the width direction or the longitudinal direction end of the carrier film 300 have. Thus, the carrier film 300 can be removed from the nano thin film 200 neatly by using the adhesive tape 500, and the adhesive tape 500 can be easily peeled off.

[Example 3]

In step S500 and step S600, the adhesive tape 500 is formed in a roller shape so that the roller-shaped adhesive tape 500 is adhered to one end of the carrier film 300, The adhesive tape 500 may be pressed and rotated to remove the carrier film 300.

7, the adhesive tape 500 is formed in the shape of a roller so that the adhesive tape 500 in the form of a roller is fixed to the top surface of the carrier film 300, while the lower side of the target substrate 400 is firmly supported. The adhesive tape 500 is pressed against the carrier film 300 by pressing the adhesive tape 500 in a downward direction so that the adhesive tape 500 is in line contact with one end of the top surface of the carrier film 300, The carrier film 300 can be separated from the nano thin film 200 while being adhered to the adhesive tape 500 in the form of a roller. The process of attaching the adhesive tape 500 to the upper surface of the carrier film 300 and the process of peeling the adhesive tape 500 and separating the carrier film 300 from the nanofilm 200 can be performed at the same time . At this time, at least one of the roller type adhesive tape 500 and the target substrate 400 can be moved and relatively moved.

[Example 4]

FIG. 12 is a schematic view showing a method and apparatus for transferring a nano thin film according to an embodiment using the roll-to-roll process of the present invention, and FIG. 13 is a partially enlarged view of FIG.

As shown in the figure, a method of transferring a nano thin film according to the present invention includes applying a precursor solution in which a polysiloxane-based material is dissolved in a solvent on a top surface of a nano thin film 200 while supplying a metal catalyst 100 on which a nano thin film 200 is formed, Or coating (SA100); A step (SA200) of curing the coated or coated precursor solution to form a carrier film (300); A step (SA300) of passing the metal catalyst having the carrier film attached to the nano thin film through an etching apparatus to remove the metal catalyst; The target substrate 400 is disposed below the nano thin film 200 so that the carrier film 300 and the target substrate 400 to which the nano thin film 200 is attached are supplied to the first and second rollers 30, (SA400); And the adhesive film 500 is disposed on the carrier film 300 so that the carrier substrate 300 and the nano thin film 200 are laminated and adhered to the target substrate 400 and the adhesive film 500, The carrier film 300 is removed from the nano thin film 200 in a state that the carrier film 300 is attached to the adhesive film 500 after passing through the third rollers 40, (SA500) for transferring the nano thin film (200) to the substrate (400); . ≪ / RTI >

First, the metal catalyst 100 may be formed of a metal foil such as copper (Cu), and the nano thin film 200 may be formed on at least one of the upper surface and the lower surface of the metal catalyst 100. At this time, the nano thin film 200 may be formed on the metal catalyst 100 by chemical vapor deposition (CVD) or the like, and the nano thin film 200 may be a graphene.

In step SA100, the metal catalyst 100 on which the nano thin film 200 is formed and the carrier film 300 pass through the first roller 10 while passing through the first roller 10, A precursor solution in which a polysiloxane-based material is dissolved in a solvent is coated or coated on the upper surface of the nano thin film 200.

In step S200, the coated or coated precursor solution is cured to form a carrier film 300, and the cured carrier film 300 may be adhered to the upper surface of the nanofiber 200. Thus, the carrier film 300, the nano thin film 200, and the metal catalyst 100 may be stacked in this order from the top.

Step SA300 is a step of separating and removing the metal catalyst 100 from the nano thin film 200 by etching and removing the metal catalyst 100. [ That is, the metal catalyst 100 can be etched and removed by the etching liquid 22 while the laminate after the carrier film 300 is formed passes through the etching apparatus 20, and the etchant 22 And the direction changing roller 23 is immersed in the etching liquid 22 so that the metal catalyst 100 can be effectively etched and removed while changing the moving direction of the laminate. Thus, the stacked body moved to the upper side after passing through the etching apparatus 20 may be a laminated body in which only the nanofilm 200 is closely adhered to the carrier film 300.

Step SA400 is a step of bringing the nano thin film 200 into close contact with the target substrate 400 prepared in advance and supplying a stacked body in which the nano thin film 200 is closely adhered to the carrier film 300 after passing through the etching apparatus 20 The target substrate 400 may be adhered to the nano thin film 200 while passing between the second rollers 30 by supplying the target substrate 400 to the lower side. At this time, the nano thin film 200 is supplied to the lower side of the carrier film 300 from the front side of the second roller 30 and passes between the second rollers 30, The target substrate 400 is supplied to the lower side of the nano thin film 200 on the front side of the nano thin film 200 and the target substrate 400 is brought into close contact with the lower surface of the nano thin film 200 by the second rollers 30, 30 to the rear side. Thus, the carrier film 300, the nano thin film 200, and the target substrate 400 may be stacked. The target substrate 400 is a target substrate for transferring the nano thin film 200. The target substrate 400 may be formed of various types of substrates but the adhesive force between the target substrate 400 and the nano thin film 200 A substrate having a larger adhesion force between the carrier film 300 and the nano thin film 200 may be used.

In step SA500, the adhesive tape 500 is attached to the upper surface of the carrier film 300, and the carrier film 300 is removed together with the adhesive tape 500 to separate the carrier film 300 from the nanofilm 200 So that the nano thin film 200 is transferred to the target substrate 400. That is, as shown in the drawing, a laminate in which the carrier film 300, the nano thin film 200, and the target substrate 400 are laminated is fed from the front side of the third roller 40 to pass between the third rollers 40 At this time, the adhesive tape 500 is supplied to the upper side of the carrier film 300 from the front side of the third roller 40 and passes between the third rollers 40 so that the adhesive tape 500 contacts the carrier film 300 As shown in Fig. After passing through the third roller 40, the adhesive tape 500 is collected in a state in which the carrier film 300 is attached to the adhesive tape 500 so that the carrier film 300 is separated from the nano thin film 200 So that the nano thin film 200 can be finally transferred to the upper surface of the target substrate 400 in a state in which the nano thin film 200 is in close contact with the target substrate 400. The adhesive tape 500 may be a general adhesive tape such as a scotch tape and may have a larger adhesion force between the adhesive tape 500 and the carrier film 300 than the adhesive force between the carrier film 300 and the nano- Adhesive tapes can be used. As the adhesive tape 500, a heat peeling tape, a UV peeling tape, a pressure sensitive adhesive (PSA) tape, or the like can be used. Also, in the process of pressing the adhesive tape on the carrier film, the nip force, which is the line contact pressure between the rollers, is applied in consideration of the strain of the adhesive layer, and the adhesive layer has a thickness of 0.03 It is preferable that the adhesive tape is pressed onto the upper surface of the carrier film so that the vertical strain is generated.

In addition, steps SA100 to SA500 may be continuously performed by a roll-to-roll process.

That is, the metal catalyst 100 on which the nano thin film 200 is formed may be formed in a roll shape, or may be continuously connected to the front process line and from the front side of the first roller 10. The target substrate 400 and the adhesive tape 500 may be removed from the target substrate supply roll 200. The target substrate 400 and the adhesive tape 500 may be removed by etching the metal catalyst while the etch apparatus 20 is continuously passed through the wet- (31) and the adhesive tape supply roll (41). Further, the carrier tape 300 and the carrier film recovery roll 42 can be used to continuously recover the carrier tape 300 with the carrier tape 300 adhered to the adhesive tape 500. In addition, the target substrate 400 to which the nano thin film 200 is transferred may be wound and collected in a separate roll, or may be connected to a process line in the back and continuously recovered.

Thus, the nano thin film transfer method of the present invention is very easy to transfer nano thin films with a large area of several cm < 2 > or more. Since the carrier film can be removed by using a roll-type adhesive tape, The nano thin film can be easily transferred and the productivity can be improved.

Further, between step SA100 and step SA200, a step (SA150) of adjusting the thickness of the precursor solution coated or coated on the upper surface of the nano thin film may be further performed.

That is, after the precursor solution is coated on the upper surface of the nano thin film 200, the thickness of the applied precursor solution can be adjusted by using the blade 13 disposed close to the upper surface of the nano thin film 200. Thus, the carrier film 300 can be formed to a desired thickness in a subsequent process.

 Here, the precursor solution may be a solution in which a polysiloxane-based material is dissolved in a solvent, and the polysiloxane-based material is a material used in a spin-on-glass (SOG) O- "-like bonding structure may be used.

Also, as in Examples 1 and 2, the solvent may be n-butanol (C ₄ H ₁₀ O), and the precursor solution may be heat-treated at a temperature of 150 ° C or higher and 200 ° C or lower, In step SA500, the adhesive tape 500 may be formed to be wider than the width of the carrier film 300, so that the carrier film 300 is positioned within the adhesive tape 500.

[Example 5]

The nano thin film transfer apparatus of the present invention includes a pair of first rollers 10 for supplying a metal catalyst 100 having a nanotubes 200 formed on its top surface to one side while passing through the metal catalyst 100; A solution applying device 12 for applying a precursor solution for forming the carrier film 300 on the upper surface of the nano thin film 200 after passing through the first roller 10; A curing device (14) for curing the applied precursor solution to form a carrier film (300) after application of the precursor solution; An etching apparatus 20 for etching and removing the metal catalyst 100 while passing the metal catalyst 100 having the carrier film 300 attached to the nano thin film 200 after the carrier film 300 is formed; The carrier film 300 and the target substrate 400 to which the nanofiltration film 200 is attached are placed in a state where the target substrate 400 is disposed below the nanofiltration film 200 after passing through the etching apparatus 20, A pair of second rollers (30) which are brought into close contact with each other; The carrier film 300 and the nano thin film 200 are laminated and adhered to the target substrate 300 in a state that the adhesive film 500 is disposed on the carrier film 300 after passing through the second roller 30. [ 400 and a pressure-sensitive adhesive film (500); And an adhesive tape and a carrier film recovery device for removing the carrier film 300 from the nano thin film 200 in a state where the carrier film 300 is attached to the adhesive film 500 after passing through the third roller 40. [ ; . ≪ / RTI >

That is, as described above, a pair of first rollers 10, a solution applying device 12, a hardening device 14, an etching device 20, a pair of second rollers 30, The carrier film 300 is formed on the nano thin film 200 of the metal catalyst 100 in which the nano thin film 200 is formed on the upper surface of the nano thin film transfer device using the roller 40, the adhesive tape, The carrier film 300 is formed and the metal catalyst 100 is removed after the carrier film 300 is formed and then the target substrate 400 is formed on the lower surface of the nano- After the adhesion, the carrier film 300 is removed by the adhesive tape 500 and a continuous process is performed so that the nano thin film 200 is transferred to the upper side of the target substrate 400.

A target substrate supply roll 31 for supplying the target substrate 400 to the second roller 30 side; An adhesive tape supply roll 41 for supplying the adhesive tape 500 to the third roller 40 side; And an adhesive tape and a carrier film recovery roll (42) for recovering the adhesive tape and the carrier film with the carrier film (300) attached to the adhesive tape (500); As shown in FIG.

The supply of the target substrate 400, the supply of the adhesive tape 500, and the recovery of the adhesive tape 500 to which the carrier tape 300 is attached are performed by supplying the metal catalyst 100 on which the nano thin film 200 is formed, The nano thin film 200 may be continuously transferred to the target substrate 400 while being continuously transferred. At this time, the adhesive tape and the carrier film recovery roll 42 may be the adhesive tape and the carrier film recovery device.

The thickness of the precursor solution applied to the upper surface of the nano thin film 200 may be adjusted by controlling the thickness of the precursor solution applied to the upper surface of the nano thin film 200, which is disposed between the solution application device 12 and the curing device 14, And may further comprise a blade (13).

That is, as shown in the figure, the carrier 13, which is formed by placing the blade 13 close to the upper surface of the nano thin film 200 so that the carrier film can be formed to have a thickness thinner than the thickness of the precursor solution applied by the solution applying device 12, The thickness of the film 300 can be adjusted. At this time, the thickness of the precursor solution after passing through the blade 13 by the blade 13 can be uniformly formed. A pedestal 15 may be provided under the solution applicator 12 and the blade 13 to support the lower surface of the metal catalyst 100.

The curing device 14 may be a radiant heater disposed on the upper side of the nano thin film 200. That is, the precursor solution can be heat-treated and hardened without being in contact with the applied precursor solution using a radiant heater. At this time, various heating methods other than the radiant heater may be used, and the precursor solution may be cured by using a heating roller, which is a roller type heater, or by heat treatment using hot air.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It goes without saying that various modifications can be made.

100: metal catalyst
200: Nano thin film
300: carrier film
400: target substrate
500: Adhesive tape
10: First roller
12: Solution applying device 13: Blade
14: Curing device
20: etching apparatus 21: etching vessel
22: etching solution 23: direction changing roller
30: second roller 31: target substrate feed roll
40: Third roller 41: Adhesive tape supply roll
42: Adhesive tape and carrier film recovery roll

Claims (16)

A step (S100) of applying or coating a precursor solution in which a polysiloxane-based material is dissolved in a solvent on a top surface of a nanotubes formed on a metal catalyst;
Forming a carrier film by curing the coated or coated precursor solution (S200);
Removing the metal catalyst by etching (S300);
A step (S400) of bringing the nano thin film into contact with the upper surface of the target substrate so as to be in close contact with each other;
Attaching an adhesive tape to an upper surface of the carrier film (S500); And
Peeling the adhesive tape to remove the carrier film from the target substrate with the carrier film adhered to the adhesive tape so that the nano thin film is transferred to the target substrate (S600);
And transferring the nano thin film to the nano thin film.
The method according to claim 1,
In step S100,
Wherein the precursor solution is coated on the upper surface of the nano thin film by spin coating.
The method according to claim 1,
Wherein the solvent is n-butanol (C ₄ H ₁₀ O).
The method according to claim 1,
In step S200,
Wherein the precursor solution is applied or coated and then cured by heat treatment at a temperature of 150 ° C or more and 200 ° C or less.
The method according to claim 1,
In step S500,
Wherein the adhesive tape is formed in a plane shape wider than the carrier film and is attached so that the carrier film is positioned within the range of the adhesive tape.
The method according to claim 1,
In steps S500 and S600,
Wherein the adhesive tape is formed in a roller shape so that the roller type adhesive tape adheres to one end of the carrier film and then the adhesive tape in a roller shape is pressed and rotated to the other end to remove the carrier film. Way.
(SA100) applying or coating a precursor solution in which a polysiloxane-based material is dissolved in a solvent on an upper surface of the nano thin film while supplying a metal catalyst having a nano thin film formed on the upper surface thereof;
Curing the coated or coated precursor solution to form a carrier film (SA200);
A step (SA300) of passing the metal catalyst having the carrier film attached to the nano thin film through an etching apparatus to remove the metal catalyst;
(SA400) such that the target substrate is disposed on the lower side of the nano thin film, and the carrier film with the nano thin film and the target substrate are supplied and closely contacted while passing between the second rollers; And
A target substrate on which the carrier film and the nano thin film are laminated and adhered and an adhesive film are supplied and adhered to each other while passing between the third rollers so that the adhesive film is adhered to the carrier film, A step (SA500) of transferring the nano thin film to the target substrate by removing the carrier film from the nano thin film in the attached state;
And transferring the nano thin film to the nano thin film.
8. The method of claim 7,
Wherein the steps SA100 to SA500 are continuously performed by a roll-to-roll process.
8. The method of claim 7,
Between steps SA100 and SA200,
(SA150) of adjusting the thickness of the precursor solution applied or coated on the upper surface of the nano thin film.
8. The method of claim 7,
Wherein the solvent is n-butanol (C ₄ H ₁₀ O).
8. The method of claim 7,
Wherein the precursor solution is cured by heat treatment at a temperature of 150 ° C or more and 200 ° C or less.
8. The method of claim 7,
In step SA500,
Wherein the adhesive tape is formed so as to be wider than the width of the carrier film and attached so that the carrier film is positioned within the range of the adhesive tape.
A pair of first rollers for supplying a metal catalyst having a nanotubes formed on its upper surface to one side while passing through the metal catalyst;
A solution applying device for applying a precursor solution for forming a carrier film on an upper surface of the nano thin film after passing through the first roller;
A curing device for curing the applied precursor solution to form a carrier film after applying the precursor solution;
An etching apparatus for etching the metal catalyst while the metal catalyst having the carrier film adhered to the nano thin film after the carrier film is formed is removed;
A pair of second rollers for allowing the nano thin film to adhere to the nano thin film while the carrier film and the target substrate having the nano thin film pass through in a state that the target substrate is disposed below the nano thin film after passing through the etching apparatus;
A pair of third rollers which laminate the carrier film and the nano thin film and make the adhered target substrate and the pressure sensitive adhesive film come in close contact while the pressure sensitive adhesive film is disposed on the upper side of the carrier film after passing through the second roller; And
An adhesive tape and a carrier film recovery device for removing the carrier film from the nano thin film in the state that the carrier film is attached to the adhesive film after passing through the third roller;
Wherein the nano thin film transfer device comprises:
14. The method of claim 13,
A target substrate supply roll for supplying a target substrate to the second roller side;
An adhesive tape supply roll for supplying the adhesive tape to the third roller side; And
An adhesive tape and a carrier film recovery roll for recovering the adhesive tape and the carrier film with the carrier film adhered to the adhesive tape;
Wherein the nano thin film transfer device further comprises:
14. The method of claim 13,
And a blade disposed between the solution application device and the curing device and disposed adjacent to the upper surface of the nano thin film to control the thickness of the precursor solution applied on the upper surface of the nano thin film. .
14. The method of claim 13,
The curing apparatus includes:
Wherein the nano thin film is a radiant heater disposed on an upper side of the nano thin film.

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