KR20170135721A - 시트 부착 장치 및 부착 방법 - Google Patents
시트 부착 장치 및 부착 방법 Download PDFInfo
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- KR20170135721A KR20170135721A KR1020170065453A KR20170065453A KR20170135721A KR 20170135721 A KR20170135721 A KR 20170135721A KR 1020170065453 A KR1020170065453 A KR 1020170065453A KR 20170065453 A KR20170065453 A KR 20170065453A KR 20170135721 A KR20170135721 A KR 20170135721A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Textile Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
도 2는, 시트 부착 장치의 동작 설명도.
Claims (5)
- 피착체를 지지하는 지지 수단과,
상기 지지 수단으로 지지된 피착체에 접착 시트를 가압하여 부착하는 가압 수단과,
상기 피착체에 접착 시트 부분이 남도록 당해 피착체에 부착된 접착 시트를 소정 형상으로 절단하는 절단 수단과,
상기 접착 시트에 있어서의 상기 접착 시트 부분 이외의 불필요 시트를 회수하는 회수 수단을 구비하고,
상기 지지 수단은, 상기 회수 수단에 의한 상기 불필요 시트의 회수 중에, 상기 지지 수단으로의 피착체의 반입 및 상기 지지 수단으로부터의 피착체의 반출 의 적어도 한쪽이 허용 가능하게 설치되어 있는 것을 특징으로 하는 시트 부착 장치. - 제1항에 있어서, 상기 지지 수단은, 상기 피착체를 지지하는 피착체 지지 수단과, 당해 피착체 지지 수단의 외측에 위치해 상기 불필요 시트를 지지하는 불필요 시트 지지 수단과, 상기 피착체 지지 수단 및 상기 불필요 시트 지지 수단을 상대적으로 이동시키는 이동 수단을 구비하고 있는 것을 특징으로 하는 시트 부착 장치.
- 제2항에 있어서, 상기 불필요 시트 지지 수단은, 상기 피착체를 출입 가능한 개구를 구비하고 있는 것을 특징으로 하는 시트 부착 장치.
- 제2항 또는 제3항에 있어서, 상기 피착체 지지 수단 및 당해 피착체 지지 수단에 지지된 지지 대상물의 적어도 한쪽의 표면을 청소하는 청소 수단을 구비하고 있는 것을 특징으로 하는 시트 부착 장치.
- 피착체를 지지 수단으로 지지하는 지지 공정과,
상기 지지 수단으로 지지된 피착체에 접착 시트를 가압하여 부착되는 가압 공정과,
상기 피착체에 접착 시트 부분이 남도록 당해 피착체에 부착된 접착 시트를 소정 형상으로 절단하는 절단 공정과,
상기 접착 시트에 있어서의 상기 접착 시트 부분 이외의 불필요 시트를 회수하는 회수 공정을 구비하고,
상기 회수 공정에 의한 상기 불필요 시트의 회수 중에, 상기 지지 수단에의 피착체의 반입 및 상기 지지 수단으로부터의 피착체의 반출의 적어도 한쪽을 실시하는 것을 특징으로 하는 시트 부착 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2016-108817 | 2016-05-31 | ||
JP2016108817A JP6678516B2 (ja) | 2016-05-31 | 2016-05-31 | シート貼付装置および貼付方法 |
Publications (2)
Publication Number | Publication Date |
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KR20170135721A true KR20170135721A (ko) | 2017-12-08 |
KR102329907B1 KR102329907B1 (ko) | 2021-11-22 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020170065453A Active KR102329907B1 (ko) | 2016-05-31 | 2017-05-26 | 시트 부착 장치 및 부착 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6678516B2 (ko) |
KR (1) | KR102329907B1 (ko) |
CN (1) | CN107452667B (ko) |
TW (1) | TWI735578B (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US11127595B2 (en) * | 2019-09-19 | 2021-09-21 | Microsoft Technology Licensing, Llc | Method for bonding a semiconductor substrate to a carrier |
JP7490517B2 (ja) * | 2020-09-29 | 2024-05-27 | リンテック株式会社 | 貼付装置および貼付方法 |
TWI815066B (zh) * | 2020-12-14 | 2023-09-11 | 萬潤科技股份有限公司 | 待濺鍍物件定位方法、裝置及施作設備 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002057208A (ja) * | 2000-08-08 | 2002-02-22 | Nitto Denko Corp | 保護テープ貼付け方法および保護テープ貼付け装置 |
JP2007208172A (ja) * | 2006-02-06 | 2007-08-16 | Lintec Corp | シート貼付装置及び貼付方法 |
JP2011199159A (ja) * | 2010-03-23 | 2011-10-06 | Nitto Denko Corp | 半導体ウエハマウント方法および半導体ウエハマウント装置 |
JP2011210856A (ja) * | 2010-03-29 | 2011-10-20 | Lintec Corp | 押圧ローラ、ならびにシート貼付装置および貼付方法 |
Family Cites Families (6)
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CN100547752C (zh) * | 2005-05-19 | 2009-10-07 | 琳得科株式会社 | 粘附装置 |
JP5113599B2 (ja) * | 2008-04-08 | 2013-01-09 | リンテック株式会社 | シート貼付装置及び貼付方法 |
KR101760543B1 (ko) * | 2010-08-10 | 2017-07-21 | 린텍 가부시키가이샤 | 시트 박리 장치 및 박리 방법 및 시트 부착 장치 및 부착 방법 |
JP6078233B2 (ja) * | 2012-01-31 | 2017-02-08 | リンテック株式会社 | シート貼付装置 |
JP6328874B2 (ja) * | 2012-07-18 | 2018-05-23 | リンテック株式会社 | シート貼付装置および装置の大型化防止方法 |
JP6100600B2 (ja) * | 2013-04-26 | 2017-03-22 | リンテック株式会社 | シート貼付装置および貼付方法 |
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2016
- 2016-05-31 JP JP2016108817A patent/JP6678516B2/ja active Active
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2017
- 2017-05-23 TW TW106117053A patent/TWI735578B/zh active
- 2017-05-26 CN CN201710383516.2A patent/CN107452667B/zh active Active
- 2017-05-26 KR KR1020170065453A patent/KR102329907B1/ko active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002057208A (ja) * | 2000-08-08 | 2002-02-22 | Nitto Denko Corp | 保護テープ貼付け方法および保護テープ貼付け装置 |
JP2007208172A (ja) * | 2006-02-06 | 2007-08-16 | Lintec Corp | シート貼付装置及び貼付方法 |
JP2011199159A (ja) * | 2010-03-23 | 2011-10-06 | Nitto Denko Corp | 半導体ウエハマウント方法および半導体ウエハマウント装置 |
JP2011210856A (ja) * | 2010-03-29 | 2011-10-20 | Lintec Corp | 押圧ローラ、ならびにシート貼付装置および貼付方法 |
Also Published As
Publication number | Publication date |
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JP6678516B2 (ja) | 2020-04-08 |
TW201810409A (zh) | 2018-03-16 |
JP2017216345A (ja) | 2017-12-07 |
TWI735578B (zh) | 2021-08-11 |
KR102329907B1 (ko) | 2021-11-22 |
CN107452667B (zh) | 2022-10-21 |
CN107452667A (zh) | 2017-12-08 |
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