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KR20170001902A - RF interposer unit and assembling method thereof - Google Patents

RF interposer unit and assembling method thereof Download PDF

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Publication number
KR20170001902A
KR20170001902A KR1020150091461A KR20150091461A KR20170001902A KR 20170001902 A KR20170001902 A KR 20170001902A KR 1020150091461 A KR1020150091461 A KR 1020150091461A KR 20150091461 A KR20150091461 A KR 20150091461A KR 20170001902 A KR20170001902 A KR 20170001902A
Authority
KR
South Korea
Prior art keywords
housing
lower housing
upper housing
seating
mounting holes
Prior art date
Application number
KR1020150091461A
Other languages
Korean (ko)
Other versions
KR101738619B1 (en
Inventor
전진국
박성규
남상진
이준호
Original Assignee
주식회사 오킨스전자
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 오킨스전자 filed Critical 주식회사 오킨스전자
Priority to KR1020150091461A priority Critical patent/KR101738619B1/en
Publication of KR20170001902A publication Critical patent/KR20170001902A/en
Application granted granted Critical
Publication of KR101738619B1 publication Critical patent/KR101738619B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The present invention relates to a board integrated RF interposer unit and a mounting method thereof, and more particularly, to a board integrated RF interposer unit and a mounting method thereof, An upper housing positioned on the upper housing, a plurality of contact pins positioned in the mounting holes of the upper housing and the lower housing, a seating member for seating the contact pins between the lower housing and the upper housing, And a fixing member for fixing the lower housing and the upper housing in which the contact pin is located, wherein a lower end of the contact pin is attached to be connected to a socket of a test board, As shown in Fig.
According to the present invention, since the RF module is stably fixed to the test board, it is possible to test a plurality of RF modules, thereby improving the test precision.

Description

Technical Field [0001] The present invention relates to an RF interposer unit and an assembling method thereof,

The present invention relates to an interposer unit, and more particularly, to an RF interposer unit and a method of assembling the same, which can improve test accuracy by stably connecting a test board and a plurality of RF modules to be tested.

Generally, a module for wireless communication includes an RF (Radio Frequency) transceiver to perform wireless communication using airwaves.

The conventional RF interposer unit is made of an antenna connector and an RF cable connector, and is detachably mountable, as disclosed in Japanese Patent Laid-open No. 10-0762002.

The antenna connector and the RF cable connector are configured in a rigid coupling structure to prevent easy separation after coupling.

However, since the RF interposer unit is manufactured through a test process, the unit for testing has the same or similar configuration as the actual product, and after the test, the separation operation is difficult and the operation time is increased.

Particularly, when the RF module is forcibly separated, the RF module is tilted and the defect rate is increased.

Accordingly, there is an urgent need to develop a technology capable of stably combining a test board and an RF module to be tested, thereby improving test accuracy and preventing defects caused by conventional testing.

Accordingly, it is an object of the present invention to provide a lower housing having a plurality of mounting holes and a plurality of mounting holes corresponding to mounting holes of the lower housing, A plurality of contact pins positioned in the mounting holes of the lower housing and the mounting holes of the upper housing, a seating member for seating the contact pins between the lower housing and the upper housing, and a lower housing and an upper housing, And the lower end of the contact pin is attached to be connected to the socket of the test board so that the socket of the RF module to be tested is detachably attached to the upper end of the contact pin, , It is possible to perform tests on a large number of RF modules, It is an object to provide an interposer unit and its assembling method.

According to an aspect of the present invention, there is provided a portable terminal including a lower housing having a plurality of mounting holes, an upper housing having a plurality of mounting holes corresponding to the mounting holes of the lower housing, A plurality of contact pins positioned in the mounting holes of the upper housing, a seating member for seating the contact pins between the lower housing and the upper housing, and a lower housing and an upper housing, And a lower end of the contact pin is attached to be connected to a socket of a test board, and a socket of an RF module to be tested is detachably attached to an upper end of the contact pin.

Preferably, the seating member is formed at a lower end of a mounting hole of the upper housing, a first seating groove formed at a mounting hole upper end of the lower housing and having a larger diameter than a lower end of the mounting hole, A second seating groove formed to be larger in diameter than an upper end portion thereof, a first seating projection formed along an outer periphery of the contact pin to be seated in the first seating groove, and a second seating groove formed along the periphery of the contact pin to be seated in the second seating groove And a second seating projection.

The upper and lower ends of the guide posts protrude upward and downward from the respective housings and guide grooves are formed in the corresponding socket so as to correspond to the upper and lower ends of the guide posts, .

The upper housing has a lower housing having a plurality of mounting holes and a plurality of mounting holes corresponding to the mounting holes of the lower housing. The upper housing is located on the upper side of the lower housing. The mounting hole of the lower housing, A seating member for seating the contact pins between the lower housing and the upper housing and a fixing member for fixing the lower housing and the upper housing in which the plurality of contact pins are located, A contact pin mounting step of mounting the contact pins on the lower housing respective mounting holes of the RF interposer unit including the contact pins, respectively; mounting the upper housing to the upper side of the lower housing mounted with the contact pins, A contact pin mounting step in which a corresponding contact pin is mounted on the mounting hole; The bottom of the housing and includes a contact pin fixing step, to secure the upper housing.

As described above, according to the RF interposer unit and the method of assembling the RF interposer unit according to the present invention, since they are stably fixed to a test board, it is possible to perform a test on a plurality of RF modules, And is an effective invention.

1 is a view showing an RF interposer unit according to the present invention,
2 is an exploded view of an RF interposer unit according to the present invention,
3 is a cross-sectional view of an RF interposer unit according to the present invention,
4 is an exploded cross-sectional view of an RF interposer unit according to the present invention,
5 is a flowchart illustrating a method of assembling the RF interposer unit according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

It should be noted that the present invention is not limited to the scope of the present invention but is only illustrative and various modifications are possible within the scope of the present invention.

FIG. 1 is a view showing an RF interposer unit according to the present invention, FIG. 2 is an exploded view of an RF interposer unit according to the present invention, and FIG. 3 is a sectional view of an RF interposer unit according to the present invention FIG. 4 is an exploded cross-sectional view of an RF interposer unit according to the present invention, and FIG. 5 is a flowchart illustrating a method of assembling the RF interposer unit according to the present invention.

The RF interposer unit 10 includes a lower housing 100 and an upper housing 200, a contact pin 300, a seating member 400, and a fixing member 500.

The lower housing 100 is formed with a plurality of mounting holes 110.

The upper housing 200 has a plurality of mounting holes 210 corresponding to the mounting holes 110 of the lower housing 100 and is positioned on the upper side of the lower housing 100.

A plurality of contact pins 300 are disposed on the mounting hole 110 of the lower housing 100 and the mounting hole 210 of the upper housing 200.

The seating member 400 is also provided to seat each contact pin 300 between the lower housing 100 and the upper housing 200.

The fixing member 500 is provided for fixing the lower housing 100 and the upper housing 200 in which the plurality of contact pins 300 are located.

The fixing member 500 is preferably composed of a bolt 510 and a nut 520. When the lower housing 100 and the upper housing 200 are fixed to each other,

The RF interposer unit 10 is connected to the socket 30 of the RF module to be tested through the contact pin 300 while the lower end of the contact pin 300 is attached to the socket 20 of the test board. As shown in Fig.

3 to 4, the seating member 400 includes a first seating groove 410 and a second seating groove 420, a first seating projection 430 and a second seating projection 440, .

The first seating groove 410 is formed at the upper end of the mounting hole 110 of the lower housing 100 and has a larger diameter than the lower end of the mounting hole 110.

The second seating groove 420 is formed at a lower end of the installation hole 210 of the upper housing 200 and has a larger diameter than the upper end of the installation hole 210.

The first seating protrusion 430 is formed along the periphery of the contact pin 300 so as to be seated in the first seating groove 410.

The second seating protrusion 440 is formed along the outer periphery of the contact pin 300 to be seated in the second seating groove 420.

A guide post 600 is further provided between the lower housing 100 and the upper housing 200 so that the upper and lower ends of the guide posts 600 protrude above and below the housings 100 and 200.

Guide grooves 610 are formed in the sockets 20 and 30 so as to correspond to the upper and lower ends of the guide posts 600.

As shown in FIG. 5, the assembling method of the RF interposer unit 10 includes a contact pin mounting step S10, a contact pin mounting step S20, and a contact pin fixing step S30 .

The contact pin mounting step S10 is to mount the contact pins 300 to the respective mounting holes 110 of the lower housing 100 of the RF interposer unit 10, respectively.

In the contact pin installation step S20, the upper housing 200 is installed on the upper side of the lower housing 100 on which the contact pins 300 are mounted, and the mounting hole 110 of the lower housing 100 and the upper housing 200 The contact pins 300 are installed on the mounting holes 210 of the base plate 210.

The contact pin fixing step S30 fixes the lower housing 100 and the upper housing 200 in which the plurality of contact pins 300 are located using the fixing member 500. [

10: interposer unit 20: socket of test board
30: Socket 100 of the RF module: Lower housing
110: mounting hole 200: upper housing
210: installation ball 300: contact pin
400: mounting member 500: fixing member
600: guide post

Claims (4)

A lower housing having a plurality of mounting holes formed therein;
An upper housing having a plurality of mounting holes corresponding to the mounting holes of the lower housing, the upper housing positioned above the lower housing;
A plurality of contact pins positioned in the mounting holes of the lower housing and the mounting holes of the upper housing;
A seating member for seating each of the contact pins between the lower housing and the upper housing; And
And a fixing member for fixing the lower housing and the upper housing in which the plurality of contact pins are located,
And a lower end of the contact pin is attached to be connected to a socket of a test board, and the socket of the RF module to be tested is detachably attached to the upper end of the contact pin to test the RF module.
The apparatus according to claim 1,
A first seating groove formed at the upper end of the mounting hole of the lower housing and having a larger diameter than a lower end of the mounting hole;
A second seating groove formed at a lower end of the installation hole of the upper housing and having a diameter larger than an upper end of the installation hole;
A first seating protrusion formed along an outer periphery of the contact pin to be seated in the first seating groove; And
And a second seating projection formed along an outer periphery of the contact pin to be seated in the second seating groove.
The method according to claim 1,
Wherein a guide post is further provided between the lower housing and the upper housing, wherein an upper end portion and a lower end portion of the guide post protrude above and below the respective housings,
And a guide groove is formed in the socket so as to correspond to an upper end portion and a lower end portion of the guide post.
A lower housing having a plurality of mounting holes and a plurality of mounting holes formed corresponding to the mounting holes of the lower housing; an upper housing positioned above the lower housing; a mounting hole of the lower housing and a mounting hole of the upper housing; A seating member for seating the contact pins between the lower housing and the upper housing and a fixing member for fixing the lower housing and the upper housing in which the plurality of contact pins are located, A contact pin mounting step for mounting the contact pins to the respective mounting holes of the lower housing of the RF interposer unit, respectively;
A contact pin mounting step in which the upper housing is installed on an upper side of a lower housing on which the contact pins are mounted and a corresponding contact pin is installed in a mounting hole of the lower housing and an installation hole of the upper housing; And
And fixing the lower housing and the upper housing in which the plurality of contact pins are located using the fixing member.
KR1020150091461A 2015-06-26 2015-06-26 RF interposer unit and assembling method thereof KR101738619B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150091461A KR101738619B1 (en) 2015-06-26 2015-06-26 RF interposer unit and assembling method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150091461A KR101738619B1 (en) 2015-06-26 2015-06-26 RF interposer unit and assembling method thereof

Publications (2)

Publication Number Publication Date
KR20170001902A true KR20170001902A (en) 2017-01-05
KR101738619B1 KR101738619B1 (en) 2017-05-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113612084A (en) * 2021-07-29 2021-11-05 深圳市通茂电子有限公司 High-density radio frequency coaxial connection module

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101262268B1 (en) * 2011-12-15 2013-05-08 주식회사 유니세트 Interposer socket

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113612084A (en) * 2021-07-29 2021-11-05 深圳市通茂电子有限公司 High-density radio frequency coaxial connection module

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KR101738619B1 (en) 2017-05-23

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