CN113612084A - High-density radio frequency coaxial connection module - Google Patents
High-density radio frequency coaxial connection module Download PDFInfo
- Publication number
- CN113612084A CN113612084A CN202110864433.1A CN202110864433A CN113612084A CN 113612084 A CN113612084 A CN 113612084A CN 202110864433 A CN202110864433 A CN 202110864433A CN 113612084 A CN113612084 A CN 113612084A
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- Prior art keywords
- radio frequency
- interface
- coaxial connection
- connection module
- connector
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- 239000004020 conductor Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 13
- 210000000078 claw Anatomy 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims 3
- 230000010354 integration Effects 0.000 abstract description 5
- 238000011161 development Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009509 drug development Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R27/00—Coupling parts adapted for co-operation with two or more dissimilar counterparts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
- H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
本发明实施例公开了一种高密度射频同轴连接模块，包括相互插接配合的插座板和插头组件，所述插座板朝向所述插头组件的板面上设置有多个相互独立的第一接口模块，每一所述第一接口模块包括多个排布形成阵列的射频接口，所述插头组件包括多个相互独立且与所述第一接口模块对应的第二接口模块，每一所述第二接口模块包括多个排布形成阵列的安装孔，每一所述安装孔内设置有与所述射频接口插接的连接头，所述连接头与对应的所述射频接口电连接。本发明可实现多芯数接口快速插拔，满足高密度、集成化、高频率的要求。
The embodiment of the present invention discloses a high-density radio frequency coaxial connection module, comprising a socket board and a plug assembly that are plugged and matched with each other, and a plurality of mutually independent first an interface module, each of the first interface modules includes a plurality of radio frequency interfaces arranged to form an array, the plug assembly includes a plurality of second interface modules independent of each other and corresponding to the first interface module, each of the The second interface module includes a plurality of mounting holes arranged to form an array, each of the mounting holes is provided with a connector plugged with the radio frequency interface, and the connector is electrically connected to the corresponding radio frequency interface. The invention can realize fast plugging and unplugging of multi-core interfaces, and meet the requirements of high density, integration and high frequency.
Description
Technical Field
The invention belongs to the technical field of quantum computers, and particularly relates to a high-density radio frequency coaxial connection module.
Background
In recent years, with the rapid development of quantum computing technology, the research of quantum computers opens up a new way for the development of information technology, the performance of quantum computers far exceeds that of current classical supercomputers, and almost all basic problems are theoretically solved. Once the general quantum computer is realized, the fields of artificial intelligence, drug development, logistics and the like can be greatly enabled, and great revolution of national security and social and economic development is brought. The high-density radio frequency coaxial connection module is an important component in a quantum computer and mainly plays a role in transmitting chip signals. The high-density radio frequency coaxial connection module in the prior art has a larger structure and a small number of interfaces, and along with the research and development of a high-bit quantum computer, the high-density radio frequency coaxial connection module in the prior art cannot meet the requirement of high-bit data transmission.
Disclosure of Invention
The technical problem to be solved by the embodiments of the present invention is to provide a high-density rf coaxial connection module, which can realize fast plugging and unplugging of a multi-core interface, and meet the requirements of high density, integration, and high frequency.
The embodiment of the invention is realized in such a way that a high-density radio frequency coaxial connection module comprises a socket board and a plug assembly which are mutually inserted and matched, wherein the surface of the socket board facing the plug assembly is provided with a plurality of mutually independent first interface modules, each first interface module comprises a plurality of radio frequency interfaces which are arranged to form an array, the plug assembly comprises a plurality of mutually independent second interface modules which correspond to the first interface modules, each second interface module comprises a plurality of mounting holes which are arranged to form an array, a connector inserted with the radio frequency interface is arranged in each mounting hole, and the connector is electrically connected with the corresponding radio frequency interface.
Furthermore, the socket board comprises a first board body, a printed board and a second board body which are sequentially stacked, a plurality of through holes are formed in the second board body to form a plurality of radio frequency interfaces, inner conductors are arranged in the through holes and electrically connected with the printed board, and insulators are clamped between the inner conductors and the hole walls of the through holes.
Further, the connector is including enclosing the bullet claw of establishing a formation inner chamber, the intracavity is provided with the connector inner conductor, the connector inserts during the radio frequency interface the bullet claw with the inner wall electricity of through-hole is connected just the inner conductor inserts in the connector inner conductor.
Further, the high-density radio frequency coaxial connection module further comprises a first locking screw, and the socket board and the second interface module are fixed through the first locking screw when the connector is inserted into the radio frequency interface.
Further, the second interface module comprises a substrate, the mounting holes are arranged on the surface of the substrate, and holding parts extending towards the direction vertical to the side wall of the substrate are arranged on two sides of the substrate.
Furthermore, a guide post for guiding is arranged on the surface of the socket board facing the plug assembly, and a guide hole matched with the guide post is arranged on the base board.
Further, the high-density radio frequency coaxial connection module still includes the cable subassembly, the cable subassembly include with the cable that the connector electricity is connected and connect keeping away from of cable the SMA of connector one end connects.
Furthermore, the outer surface of the cable is coated with a heat shrink tube, the surface of the cable is further provided with a label, and the label is used for marking the position of the mounting hole where the connector connected with the cable is located.
Further, the high-density radio frequency coaxial connection module further comprises a second locking screw, and the first board body, the printed board and the second board body are fixed through the second locking screw.
Furthermore, the number of the first interface module and the second interface module is eight, wherein, four of the first interface module is provided with 34 radio frequency interfaces, four of the first interface module is provided with 30 radio frequency interfaces, four of the second interface module is provided with 34 mounting holes, and four of the second interface module is provided with 30 mounting holes.
Compared with the prior art, the embodiment of the invention has the advantages that: the socket assembly and the plug assembly are respectively provided with a plurality of first interface modules and second interface modules which correspond to each other, and the first interface modules and the second interface modules are distributed with radio frequency interfaces forming an array and are connected with each other, so that more radio frequency interfaces are integrated into a smaller space, the multi-core interface is quickly plugged and pulled out, the requirements of high density, integration and high frequency are met, and the operation of a high-bit quantum computer can be realized.
Drawings
Fig. 1 is a schematic structural diagram of a high-density rf coaxial connection module according to an embodiment of the present invention;
fig. 2 is a schematic view of another perspective of a high-density rf coaxial connection module provided by an embodiment of the present invention;
FIG. 3 is a schematic view cut along the direction A-A of FIG. 2;
FIG. 4 is an enlarged schematic view of portion B of FIG. 3;
FIG. 5 is a schematic structural view of the socket board of FIG. 1;
FIG. 6 is a schematic structural view of the plug assembly provided by the embodiment of the present invention when the cable assembly is not connected;
fig. 7 is a schematic diagram of a plug assembly and a cable assembly according to an embodiment of the present invention.
In the drawings, each reference numeral denotes:
10. a socket board; 20. a plug assembly; 11. a first interface module; 111. a guide post; 12. a radio frequency interface; 21. a second interface module; 211. a substrate; 2111. a grip portion; 22. mounting holes; 13. a first plate body; 14. printing a board; 15. a second plate body; 16. an inner conductor; 17. an insulating member; 18. a lower cover plate; 23. a connector; 231. a spring claw; 232. a connector inner conductor; 30. a first locking screw; 41. a cable; 42. an SMA joint; 43. heat shrink tubing; 44. a label; 45. binding a belt; 50. and a second locking screw.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1 to 7, a high-density radio frequency coaxial connection module according to an embodiment of the present invention includes a socket board 10 and a plug assembly 20 that are inserted into each other, a plurality of mutually independent first interface modules 11 are disposed on a surface of the socket board 10 facing the plug assembly 20, each first interface module 11 includes a plurality of radio frequency interfaces 12 arranged to form an array, the plug assembly 20 includes a plurality of mutually independent second interface modules 21 corresponding to the first interface modules 11, each second interface module 21 includes a plurality of mounting holes 22 arranged to form an array, a connector 23 inserted into the radio frequency interface 12 is disposed in each mounting hole 22, and the connector 23 is electrically connected to the corresponding radio frequency interface 12.
According to the invention, the first interface module 11 and the second interface module 21 which correspond to each other are respectively arranged on the socket board 10 and the plug assembly 20, and the first interface module 11 and the second interface module 21 are provided with the radio frequency interfaces and the connectors which form an array and are connected with each other, so that more radio frequency interfaces are integrated into a smaller space, the multi-core interface is rapidly plugged and unplugged, the requirements of high density, integration and high frequency are met, and the operation of a high-bit quantum computer can be realized.
The shapes of the plurality of first interface modules 11 on the socket board 10 may be the same or different, and the rf interfaces 12 on different first interface modules 11 may form the same array or different arrays. As shown in fig. 5, the radio frequency interfaces 12 on the first interface module 11 are arranged to form a rectangular array, in other possible embodiments, the radio frequency interfaces 12 on the first interface module 11 may also be arranged to form a triangular array, a pentagonal array, or a hexagonal array, and the like, which is not limited in this embodiment.
In this embodiment, as shown in fig. 6. The second interface module 21 includes a substrate 211, the mounting holes 22 are arranged on the surface of the substrate 211, the two sides of the substrate 211 are provided with holding portions 2111 extending in a direction perpendicular to the sidewall of the substrate 211, and the holding portions 2111 are convenient for an operator to hold the substrate 211 and insert and separate the second interface module 21 and the socket board 10. The number of the first interface modules 11 and the number of the second interface modules 21 are eight, the socket board 10 is of a rectangular structure, the eight first interface modules 11 surround the periphery of the board surface of the socket board 10, each side edge of the socket board 10 is provided with three first interface modules 11, wherein 34 radio frequency interfaces 12 are distributed on four first interface modules 11, 30 radio frequency interfaces 12 are distributed on four first interface modules 11, the first interface modules 11 on which the 34 radio frequency interfaces 12 are distributed are located at four corners of the board surface of the socket board 10, 34 mounting holes 22 are distributed on four second interface modules 21, and 30 mounting holes 22 are distributed on four second interface modules 21. In other possible embodiments, the number of the radio frequency interfaces 12 on each first interface module 11 and the number of the mounting holes 22 on each second interface module 21 may also be 20, 30, 40, and the like, and the number of the radio frequency interfaces 12 and the mounting holes 22 is not limited in this embodiment.
In order to prevent the grip portions 2111 of the plurality of second interface modules 21 which are mated with the socket board 10, the grip portions 2111 of the second interface modules 21 which are mated with the first interface modules 11 located at the four corners of the socket board 10 extend in the diagonal direction of the board 211, and the grip portions 2111 of the second interface modules 21 which are mated with the remaining first interface modules 11 located in the socket board 10 are disposed on the opposite sides of the board 211.
Preferably, as shown in fig. 3 and 4, the socket board 10 includes a first board 13, a printed board 14, and a second board 15 stacked in sequence, the second board 15 is provided with a plurality of through holes to form a plurality of radio frequency interfaces 12, an inner conductor 16 is disposed in the through holes, the inner conductor 16 is electrically connected to the printed board 14, and an insulating member 17 is interposed between the inner conductor 16 and a wall of the through hole. Compare in prior art need process socket shell body and single public end connector alone, and in proper order with the outer conductor of every public end connector alone with the welding of printing board 14, this application is directly seted up through-hole and built-in inner conductor 16 on second plate body 15, be equivalent to the outer conductor with public end connector and second plate body 15 combine together, and do not have individual independent public end connector, the fixed mode of radio frequency interface has been improved, thereby the parts machining cost has been reduced, the weight of high density radio frequency coaxial coupling module has been alleviateed, the assembly degree of difficulty of public end connector has been reduced and the holistic assembly efficiency of product has been improved, and this kind of fixed mode has strengthened the fixed steadiness of radio frequency interface 12, the risk that radio frequency interface 12 drops has been reduced.
Specifically, the connector 23 includes a spring claw 231 surrounding to form an inner cavity, a connector inner conductor 232 is disposed in the inner cavity, when the connector 23 is inserted into the radio frequency interface 12, the spring claw 231 is electrically connected to the inner wall of the through hole, and the inner conductor 16 is inserted into the connector inner conductor 232, so that the connector 23 is electrically connected to the radio frequency interface 12. The high-density radio frequency coaxial connection module of this embodiment further includes a cable assembly, the cable assembly includes a cable 41 electrically connected to the connector 23 and an SMA connector 42 connected to an end of the cable 41 far from the connector 23, and the cable assembly is used for inputting and outputting signals. The outer surface of the cable 41 is covered with a heat shrink tube 43, the surface of the cable 41 is further provided with a label 44, the label 44 is used for marking the position of the mounting hole 22 where the connector 23 connected with the cable 41 is located, for example, the label of a certain mounting hole 22 on the plug assembly 20 is "23", then for the cable 41 connected with the connector 23 on the mounting hole 22, the label 44 on the insulating outer layer 43 can be marked with "23", so as to prevent a misconnection interface. The heat shrinkable tube 43 has excellent flame retardant and insulating properties, is very flexible and elastic, has a low shrinkage temperature and is shrunk quickly, and can better protect the cable 41. In addition, all the cables 41 connected to each second interface module 21 of the plug assembly 20 can be fastened by the cable ties 45, which is not only beautiful, but also can prevent the cables 41 of different second interface modules 21 from interfering with each other.
The high-density radio frequency coaxial connection module further comprises a first locking screw 30, when the connector 23 is inserted into the radio frequency interface 12, the socket board 10 and the second interface module 21 are fixed through the first locking screw 30, so that signal interruption caused by falling off of the second interface module 21 from the socket board 10 due to the fact that the cable 41 has a large bundling weight is prevented, and the working stability of the high-density radio frequency coaxial connection module is enhanced. In addition, high density radio frequency coaxial coupling module still includes second locking screw 50, and first plate body 13, printed board 14 and second plate body 15 pass through second locking screw 50 fixed alright realize the socket 10 function, compare in prior art with every public end connector alone with printed board 14 welding, greatly reduced the production degree of difficulty, improved production efficiency. The socket board 10 of the present embodiment further includes a lower cover 18, and after the chip is bonded to the printed board 14, the lower cover 18 may be used for packaging.
Further, the guide post 111 is disposed on the surface of the socket board 10 facing the plug assembly 20, the guide hole adapted to the guide post 111 is disposed on the substrate 211, and the guide post 111 and the guide hole have a guiding function, so that the second interface module 21 can be prevented from being inserted into the socket board 10 obliquely when being plugged into the socket board 10, the second interface module 21 or the socket board 10 can be prevented from being damaged, and the second interface module 21 and the socket board 10 can be conveniently and quickly inserted into each other.
In summary, in the present invention, the socket board 10 and the plug assembly 20 are respectively provided with the first interface module 11 and the second interface module 21 corresponding to each other, and the first interface module 11 and the second interface module 21 are arranged with the radio frequency interfaces and the connectors forming an array and connected to each other, so that more radio frequency interfaces are integrated into a smaller space, the multi-core interfaces are quickly plugged and unplugged, the requirements of high density, integration and high frequency are met, and the operation of a high-bit quantum computer can be realized.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110864433.1A CN113612084B (en) | 2021-07-29 | 2021-07-29 | A high-density radio frequency coaxial connection module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110864433.1A CN113612084B (en) | 2021-07-29 | 2021-07-29 | A high-density radio frequency coaxial connection module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113612084A true CN113612084A (en) | 2021-11-05 |
| CN113612084B CN113612084B (en) | 2024-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110864433.1A Active CN113612084B (en) | 2021-07-29 | 2021-07-29 | A high-density radio frequency coaxial connection module |
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| CN (1) | CN113612084B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201450195U (en) * | 2009-08-04 | 2010-05-05 | 西安富士达科技股份有限公司 | Radiofrequency coaxial connector suitable for blind mating and floating connection |
| CN102570216A (en) * | 2010-11-04 | 2012-07-11 | 泰科电子公司 | An RF module |
| CN104332736A (en) * | 2014-11-11 | 2015-02-04 | 上海航天科工电器研究院有限公司 | Multi-channel radio frequency signal transmission printed board connector |
| KR20170001902A (en) * | 2015-06-26 | 2017-01-05 | 주식회사 오킨스전자 | RF interposer unit and assembling method thereof |
| CN107482346A (en) * | 2017-07-27 | 2017-12-15 | 四川华丰企业集团有限公司 | High-speed module connector |
| CN211404930U (en) * | 2020-03-12 | 2020-09-01 | 宁波吉品科技有限公司 | Integrated radio frequency plug assembly |
| CN111969376A (en) * | 2020-07-06 | 2020-11-20 | 中航光电科技股份有限公司 | LRM photoelectric radio frequency integrated connector compatible with VPX standard |
| CN212874987U (en) * | 2020-09-03 | 2021-04-02 | 沈阳兴华航空电器有限责任公司 | Multimode multi-frequency comprehensive communication cable |
-
2021
- 2021-07-29 CN CN202110864433.1A patent/CN113612084B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201450195U (en) * | 2009-08-04 | 2010-05-05 | 西安富士达科技股份有限公司 | Radiofrequency coaxial connector suitable for blind mating and floating connection |
| CN102570216A (en) * | 2010-11-04 | 2012-07-11 | 泰科电子公司 | An RF module |
| CN104332736A (en) * | 2014-11-11 | 2015-02-04 | 上海航天科工电器研究院有限公司 | Multi-channel radio frequency signal transmission printed board connector |
| KR20170001902A (en) * | 2015-06-26 | 2017-01-05 | 주식회사 오킨스전자 | RF interposer unit and assembling method thereof |
| CN107482346A (en) * | 2017-07-27 | 2017-12-15 | 四川华丰企业集团有限公司 | High-speed module connector |
| CN211404930U (en) * | 2020-03-12 | 2020-09-01 | 宁波吉品科技有限公司 | Integrated radio frequency plug assembly |
| CN111969376A (en) * | 2020-07-06 | 2020-11-20 | 中航光电科技股份有限公司 | LRM photoelectric radio frequency integrated connector compatible with VPX standard |
| CN212874987U (en) * | 2020-09-03 | 2021-04-02 | 沈阳兴华航空电器有限责任公司 | Multimode multi-frequency comprehensive communication cable |
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| Publication number | Publication date |
|---|---|
| CN113612084B (en) | 2024-12-31 |
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