KR20160122698A - Resin composition - Google Patents

Abstract

(A)성분: 하기 식(1)로 표시되는 구조단위를 가지며, 또한, 하기 식(2) 또는 식(3)으로 표시되는 구조단위를 갖는 공중합체 (B)성분: 열산발생제(식 중, R⁰은 각각 독립적으로 수소원자 또는 메틸기를 나타내고, R¹은 단결합 또는 탄소원자수 1 내지 5의 알킬렌기를 나타내고, 해당 알킬렌기는 그 중에 에테르결합을 가질 수도 있고, R²는 에폭시기, 또는 에폭시환을 갖는 탄소원자수 5 내지 12의 유기기를 나타내고, R³은 탄소원자수 1 내지 3의 알킬렌기를 나타내고, n은 0 내지 5의 정수를 나타낸다.)[PROBLEMS] To provide a resin composition for a thermosetting flattening film or a micro lens.
[MEANS FOR SOLVING PROBLEMS] A resin composition for a planarizing film or a micro lens, which comprises a component (A), a component (B) and a solvent.

(A): a copolymer (B) having a structural unit represented by the following formula (1) and having a structural unit represented by the following formula (2) or (3): a thermal acid generator , R ⁰ independently represents a hydrogen atom or a methyl group, R ¹ represents a single bond or an alkylene group having 1 to 5 carbon atoms, the alkylene group may have an ether bond therein, R ² represents an epoxy group, R ³ is an alkylene group having 1 to 3 carbon atoms and n is an integer of 0 to 5.)

Description

Resin composition {RESIN COMPOSITION}

The present invention relates to a resin composition for a thermosetting flattening film or a micro lens, and a flattening film and a microlens formed from the resin composition.

In the process of manufacturing a CCD / CMOS image sensor, an immersion process is performed using a chemical such as a solvent or an alkali solution. In order to prevent the device from being deteriorated or damaged by such process, a protective film Is provided on the surface of the element. Such a protective film is required to have transparency, high heat resistance and high light resistance, no deterioration such as coloration for a long period of time, excellent solvent resistance, and high alkali resistance (Patent Document 1). In addition, in recent years, it has become necessary to improve the sensitivity of the sensor according to the fixed definition of the CCD / CMOS image sensor. When the protective film is formed on a color filter or the like in order to efficiently focus the light from the microlens on the light receiving portion, The protective film is also required to be able to planarize a step formed on the base substrate (Patent Document 2 and Patent Document 3). On the other hand, in a color filter for a CCD / CMOS image sensor, it is difficult to further improve the resolution in the conventional pigment dispersion system, and there is a problem that color unevenness occurs due to coarse particles of pigment, It was not suitable for applications requiring a fine pattern like a device. Accordingly, a technique of using a dye instead of a pigment dispersion system has been proposed (Patent Document 4). However, since the conventional thermosetting protective film is baked at a temperature of 180 ° C or higher, it is difficult to apply it to a color filter using a dye which decomposes at about 180 ° C in general (Patent Document 5).

Japanese Patent No. 2921770 Japanese Patent Application Laid-Open No. 2008-208235 International Publication No. 2013/005619 Japanese Patent Application Laid-Open No. H6-75375 Japanese Patent Application Laid-Open No. 2010-237374

The present invention provides a thermosetting resin composition which is excellent in transparency, solvent resistance, and flatness and can be cured at a desired temperature higher than 100 캜.

Means for Solving the Problems The present inventors have conducted intensive studies in order to solve the above problems, and have completed the present invention.

That is, as a first aspect,

(A), a component (B), and a solvent.

(A): a copolymer having a structural unit represented by the following formula (1) and having a structural unit represented by the following formula (2) or (3)

Component (B): Thermal acid generator

[Chemical Formula 1]

(Wherein, R ⁰ each independently represents a hydrogen atom or a methyl group, R ¹ represents a single bond or a carbon source represents 1 to 5 alkylene group of atoms, alkylene groups are the alkyl and optionally having an ether bond therein, R ² is An epoxy group or an organic group having 5 to 12 carbon atoms and having an epoxy ring, R ³ represents an alkylene group having 1 to 3 carbon atoms, and n represents an integer of 0 to 5.)

As a second aspect, the resin composition for planarizing film or micro lens according to the first aspect, wherein the structural unit represented by the formula (1) is a structural unit represented by the following formula (1-1).

(2)

(Wherein R ⁰ represents a hydrogen atom or a methyl group, and R ¹ represents a single bond or an alkylene group having 1 to 5 carbon atoms.)

As a third aspect, the resin composition for a planarizing film or a micro lens according to the first aspect or the second aspect, wherein the copolymer further has a structural unit represented by the following formula (4).

(3)

(Wherein X represents a cyclohexyl group or a phenyl group).

As a fourth aspect, the resin composition for planarizing film or micro lens according to any one of the first to third aspects, wherein the copolymer has a weight average molecular weight of 1,000 to 50,000.

In a fifth aspect, the thermal acid generator is one of the planarizing film according to any one of the first to fourth aspects, which is contained in the resin composition in an amount of 0.1% by mass to 20% by mass based on the content in the solid content excluding the solvent Resin composition for microlenses.

As a sixth aspect, a planarizing film made of the resin composition according to any one of the first to fifth aspects.

As a seventh aspect, a microlens manufactured from the resin composition according to any one of the first to fifth aspects.

The resin composition of the present invention is excellent in curability at a desired temperature higher than 100 deg. C and storage stability because it contains a thermal acid generator as the component (B). Furthermore, the resin film formed from the resin composition of the present invention has excellent transparency, solvent resistance, and flatness. From the above, the step formed on the base substrate can be planarized by the resin film formed from the resin composition of the present invention. When the resist is applied after forming the resin film with the resin composition of the present invention and when the electrode / wiring formation process is performed after the formation of the planarization film or the microlens, the resin film may be formed by mixing with a resist, The problems such as deformation and peeling of the planarizing film or the microlens can be remarkably reduced. Therefore, the resin composition of the present invention is favorable as a material for forming a planarizing film and a microlens.

1 is a schematic view showing a resin film formed by applying the resin composition of the present invention on a stepped substrate and baking.

Hereinafter, each component of the present invention will be described in detail. In the resin composition of the present invention, the solid content excluding the solvent is usually 1% by mass to 50% by mass.

≪ Component (A) >

The component (A) of the present invention is a copolymer having a structural unit represented by the following formula (1) and having a structural unit represented by the formula (2) or (3).

[Chemical Formula 4]

(Wherein, R ⁰ each independently represents a hydrogen atom or a methyl group, R ¹ represents a single bond or a carbon source represents 1 to 5 alkylene group of atoms, alkylene groups are the alkyl and optionally having an ether bond therein, R ² is An epoxy group or an organic group having 5 to 12 carbon atoms and having an epoxy ring, R ³ represents an alkylene group having 1 to 3 carbon atoms, and n represents an integer of 0 to 5.)

Examples of the formula (1) include a structural unit represented by the following formula (1-1).

[Chemical Formula 5]

(Wherein R ⁰ represents a hydrogen atom or a methyl group, and R ¹ represents a single bond or an alkylene group having 1 to 5 carbon atoms.)

Specific examples of the compound (monomer) forming the structural unit represented by the formula (2) include 4-biphenyl (meth) acrylate, 2- (4-biphenyloxy) ethyl (meth) (Meth) acrylate, 2- (4-biphenyloxy) -2'-ethoxyethyl (meth) acrylate, 2- Ethoxyethyl (meth) acrylate, and NK Ester [registered trademark] A-LEN-10 (manufactured by Shin Nakamura Chemical Co., Ltd.). On the other hand, these compounds may be used alone or in combination of two or more.

Specific examples of the compound (monomer) forming the structural unit represented by the formula (3) include 3-vinylbiphenyl and 4-vinylbiphenyl. On the other hand, these compounds may be used alone or in combination of two.

Specific examples of the compound (monomer) forming the structural unit represented by the formula (4) include N-cyclohexylmaleimide and N-phenylmaleimide. On the other hand, these compounds may be used alone or in combination of two or more.

In the copolymer, the content of the structural unit represented by the formula (1) in the copolymer of the component (A) is 10 mol% to 90 mol%, preferably 20 mol% to 70 mol%.

The weight average molecular weight of the copolymer is usually 1,000 to 50,000, preferably 3,000 to 30,000. On the other hand, the weight average molecular weight is a value obtained by gel permeation chromatography (GPC) using polystyrene as a standard sample.

The content of the copolymer in the resin composition of the present invention is usually 1% by mass to 99% by mass, and preferably 5% by mass to 95% by mass, based on the content in the solid content of the resin composition.

In the present invention, the method for obtaining the component (A) is not particularly limited. In general, the monomer mixture containing the monomer species used for obtaining the above-mentioned copolymer is dissolved in a polymerization solvent at a temperature of usually 50 to 120 ° C Lt; 0 > C. The copolymer thus obtained is usually in a solution state dissolved in a solvent and may be used in the resin composition of the present invention without being isolated in this state.

Further, the solution of the copolymer thus obtained is added to a poor solvent such as hexane, diethyl ether, methanol, water or the like to reprecipitate the copolymer, and the resulting precipitate is filtered and washed, The copolymer can be made into a powder by heating at room temperature or under a reduced pressure. Through such operations, the polymerization initiator coexisting with the copolymer and the unreacted compound can be removed. In the present invention, the powder of the copolymer may be used as it is, or the powder may be used as a solution state by re-dissolving it in, for example, a solvent described later.

≪ Component (B) >

The thermal acid generator which is the component (B) of the present invention is a catalyst which generates acid by heating and cationically polymerizes the epoxy group in the component (A) by the action of an acid. As the thermal acid generator, an organic onium salt compound in which a cation component and an anion component are paired is generally used.

Examples of the cationic component include organic cations such as organic sulfonium, organic oxonium, organic ammonium, organic phosphonium, and organic iodonium. Examples of the anion component include B (C ₆ F ₅ ) ₄ ^- , SbF ₆ ^- , AsF ₆ ^- , PF ₆ ^- , BF ₄ ^- and CF ₃ SO ₃ ^- .

Examples of the thermal acid generators include TA100, TA120, TA160 (manufactured by San-Apro Ltd.), K-PURE TM2689, K-PURE TAG2690, K-PURE CXC1614, K- (Manufactured by King Industries Inc.), San-Aid SI-100L and San-Aid SI-180L (manufactured by Sanshin Chemical Industry Co., Ltd.). These thermal acid generators may be used alone or in combination of two or more.

The content of the component (B) in the resin composition of the present invention is usually 0.1% by mass to 20% by mass based on the content in the solid content of the resin composition.

The method for preparing the resin composition of the present invention is not particularly limited. For example, a method of dissolving a copolymer (A) in a solvent, mixing the solution (B) with a thermal acid generator at a predetermined ratio , And a method of making a homogeneous solution. Further, in a suitable step of the preparation method, if necessary, other additives may be further added and mixed.

The solvent is not particularly limited as long as it dissolves the components (A) and (B). Such solvents include, for example, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, propylene glycol, Propylene glycol monomethyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, propylene glycol monobutyl ether, propylene glycol monobutyl ether acetate, toluene, xylene, methyl ethyl ketone, cyclopentanone, cyclohexanone, Hydroxypropionate, ethyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxyacetate, Ethyl propionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl pyruvate, Heritage butyl, 2-heptanone, sets acid ethyl acetate, butyl acetate, ethyl lactate, can be given as γ- lactone butynyl. These solvents may be used alone or in combination of two or more.

Of these solvents, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 2-heptanone, ethyl lactate, butyl lactate and butyl lactate are preferable from the viewpoint of improving the leveling property of a coating film formed by applying the resin composition of the present invention on a substrate. Cyclohexanone is preferred.

The resin composition of the present invention may contain a surfactant for the purpose of improving the coating property. Examples of the surfactant include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, polyoxyethylene oleyl ether and the like, polyoxyethylene octylphenyl Polyoxyethylene alkylaryl ethers such as ether, polyoxyethylene nonylphenyl ether and the like, polyoxyethylene / polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan Sorbitan fatty acid esters such as monooleate, sorbitan trioleate and sorbitan tristearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan monostearate, Polyoxyethylene sorbitan trioleate such as polyoxyethylene sorbitan trioleate and polyoxyethylene sorbitan tristearate, EFTOP EF301, EFTOP EF303, EFTOP EF352 (manufactured by Mitsubishi Materials Electronic Chemicals Co., Ltd.), MEGAFAC [registered trademark] F-171, and MEGAFAC F (Manufactured by DIC CORPORATION), FLUORAD FC430, FLUORAD FC 431 (manufactured by Sumitomo 3M Ltd.), ASAHI GUARD [registered trademark] AG710, MEGAFAC R-40, MEGAFAC R- SURFLON SC101, SURFLON SC103, SURFLON SC104, SURFLON SC104, SURFLON SC105, SURFLON SC106 (manufactured by Asahi Glass Co., Ltd.), FTX-206D, FTX-212D, FTX-218, FTX Fluorosurfactant such as FTERGENT series (manufactured by Neos Co., Ltd.) such as FTX-230D, FTX-230D, FTX-240D, FTX-212P, FTX-220P, FTX- Shin-Etsu Chemical Co., Ltd.). These surfactants may be used alone or in combination of two or more.

When the surfactant is used, the content of the surfactant in the resin composition of the present invention is 3% by mass or less, preferably 1% by mass or less, more preferably 1% by mass or less based on the content in the solid content of the resin composition Is 0.5 mass% or less.

The resin composition of the present invention may contain additives such as a cross-linking agent, a curing assistant, an ultraviolet absorber, a sensitizer, a plasticizer, an antioxidant, and an adhesion aid, if necessary, as long as the effect of the present invention is not impaired.

Hereinafter, use examples of the resin composition of the present invention will be described.

(For example, a semiconductor substrate such as silicon covered with a silicon oxide film, a semiconductor substrate such as silicon covered with a silicon nitride film or a silicon oxynitride film, a semiconductor substrate such as silicon formed with a color filter, a silicon nitride substrate, a quartz substrate, The resin composition of the present invention is coated on a substrate (including a glass substrate on which an alkali-free glass, a low-alkali glass, a crystallized glass is formed) and an ITO film by a suitable coating method such as a spinner or a coater, Baked and cured by means of a photolithography method to form a planarizing film or a resin film for a micro lens.

The bake conditions are suitably selected within a range of from 80 to 300 DEG C for the bake temperature and from 0.3 to 60 minutes for the bake time. It is also possible to perform two or more steps at different baking temperatures within the above temperature range. In the case of the resin composition of the present invention, a desired resin film can be formed at a baking temperature of less than 200 캜.

The film thickness of the resin film formed from the resin composition of the present invention is 0.005 μm to 5.0 μm, preferably 0.01 μm to 3.0 μm.

Thereafter, a resist solution is applied onto the resin film for a microlens formed from the resin composition of the present invention, exposed through a predetermined mask, subjected to post exposure baking (PEB) if necessary, and subjected to alkali development, rinsing and drying , A predetermined resist pattern is formed. For exposure, g-line, i-line, KrF excimer laser, or ArF excimer laser can be used, for example.

Subsequently, the resist pattern is reflowed by a heat treatment (usually at a temperature not exceeding 200 占 폚) to form a lens pattern. Using this lens pattern as an etching mask, the resin film for the lower layer of the micro lens is etched back, and the lens pattern shape is transferred to the resin film for the micro lens to manufacture the microlens.

Example

Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.

[Measurement of the weight average molecular weight of the copolymer obtained in the following synthesis example]

Device: JASCO Corporation GPC system

Column: Shodex [registered trademark] KF-804L and KF-803L

Column oven: 40 ℃

Flow rate: 1 mL / min

Eluent: Tetrahydrofuran

[Synthesis of Copolymer]

≪ Synthesis Example 1 &

, 19.7 g of 3,4-epoxycyclohexylmethyl methacrylate (CYCLOMER 占 M100 (manufactured by Daicel Corporation), 19.7 g of ethoxylated orthophenyl phenol acrylate (NK Ester 占 A-LEN-10 Co., Ltd.) and 1.6 g of 2,2'-azobisisobutyronitrile were dissolved in 114.0 g of propylene glycol monomethyl ether acetate, and this solution was mixed with propylene glycol monomethyl ether acetate 70.2 g was added dropwise to the flask maintained at 70 占 폚 over 3 hours. After completion of the dropwise addition, the solution was allowed to react for 15 hours to obtain a solution (solid content concentration: 25% by mass) of the copolymer having the structural unit represented by the formula (1) and the structural unit represented by the formula (2). The weight average molecular weight Mw of the obtained copolymer was 32,000 (in terms of polystyrene).

≪ Synthesis Example 2 &

20.0 g of 3,4-epoxycyclohexylmethyl methacrylate, 11.0 g of 4-vinylbiphenyl and 0.64 g of 2,2'-azobisisobutyronitrile were dissolved in 43.9 g of propylene glycol monomethyl ether acetate, This solution was added dropwise over 3 hours to a flask maintained at 70 占 폚 in 27.0 g of propylene glycol monomethyl ether acetate. After completion of the dropwise addition, the solution was allowed to react for 15 hours to obtain a solution (solid content concentration of 25% by mass) of the copolymer having the structural unit represented by the formula (1) and the structural unit represented by the formula (3). The weight average molecular weight Mw of the obtained copolymer was 17,000 (in terms of polystyrene).

≪ Synthesis Example 3 &

6.5 g of glycidyl methacrylate, 8.5 g of 1-n-butoxyethyl methacrylate, 38.0 g of styrene, and 2.3 g of 2,2'-azobisisobutyronitrile were added to 103.0 g of propylene glycol monomethyl ether acetate After dissolving, 26.0 g of propylene glycol monomethyl ether acetate was added dropwise to the flask maintained at 75 캜 over 4 hours. After completion of the dropwise addition, the solution was reacted for 18 hours to obtain a solution (solid content concentration: 30% by mass) of the copolymer having neither the structural unit represented by the formula (2) nor the structural unit represented by the formula (3). The weight average molecular weight Mw of the obtained copolymer was 14,000 (in terms of polystyrene).

[Preparation of resin composition]

≪ Example 1 >

(Manufactured by King Industries, Inc.) as a thermal acid generator serving as a component (B), 10.0 g of a solution of the copolymer (A) obtained in Synthesis Example 1 (containing 2.5 g of a solid component) And 0.003 g of MEGAFAC [registered trademark] R-30 (manufactured by DIC CORPORATION) as a surfactant were dissolved in 7.5 g of propylene glycol monomethyl ether acetate to prepare a solution. Thereafter, the solution was filtered using a microfilter made of polyethylene having a pore diameter of 0.10 mu m to prepare a resin composition.

≪ Example 2 >

10.0 g of a solution of the copolymer (component A) obtained in Synthesis Example 2 (containing 2.5 g of a solid component) and 0.04 g of K-PURE [registered trademark] TAG 268 (manufactured by King Industries Inc.) And 0.003 g of MEGAFAC [registered trademark] R-30 (manufactured by DIC CORPORATION) as a surfactant were dissolved in 7.5 g of propylene glycol monomethyl ether acetate to prepare a solution. Thereafter, the solution was filtered using a microfilter made of polyethylene having a pore diameter of 0.10 mu m to prepare a resin composition.

≪ Comparative Example 1 &

10.0 g of a solution of the copolymer (component (A)) obtained in Synthesis Example 1 (containing 2.5 g of solid content) and 0.003 g of MEGAFAC TM R-30 (manufactured by DIC CORPORATION) as a surfactant were dissolved in 100 ml of propylene glycol monomethyl ether Acetate (7.5 g) to obtain a solution. Thereafter, the solution was filtered using a microfilter made of polyethylene having a pore diameter of 0.10 mu m to prepare a resin composition.

≪ Comparative Example 2 &

0.003 g of MEGAFAC 占 R-30 (manufactured by DIC CORPORATION) as a surfactant and 10.0 g of a solution of the copolymer (component A) obtained in Synthesis Example 3 (containing 3.0 g of a solid component) were mixed with propylene glycol monomethyl ether Acetate in 11.0 g to obtain a solution. Thereafter, the solution was filtered using a microfilter made of polyethylene having a pore diameter of 0.10 mu m to prepare a resin composition.

[Solubility test]

Each of the resin compositions prepared in Example 1, Example 2, and Comparative Example 1 and Comparative Example 2 was applied onto a silicon wafer using a spin coater. The resin composition was applied onto a hot plate at 100 占 폚 for 1 minute, Minute baking was performed to form a resin film having a film thickness of 0.6 mu m. To these resin films, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, cyclohexanone, ethyl lactate, butyl acetate, acetone,? -Butyrolactone, methyl ethyl ketone, 2-heptanone, And an aqueous solution of tetramethylammonium hydroxide (TMAH) having a concentration of 2.38 mass% were each immersed for 5 minutes at a temperature of 23 占 폚. The change in film thickness before and after immersion was measured, and when any of the above-mentioned immersion treatments was "x" when the film thickness was increased by 5% or more with respect to the film thickness before immersion, and when the change in film thickness was less than 5% Was evaluated as "?&Quot;. The evaluation results are shown in Table 1.

[Measurement of transmittance]

Each of the resin compositions prepared in Example 1 and Example 2 was coated on a quartz substrate using a spin coater and baked on a hot plate at 100 占 폚 for 1 minute and again at 140 占 폚 for 10 minutes to obtain a film having a thickness of 0.6 mu m. These resin films were measured for transmittance at a wavelength of 400 nm using an ultraviolet visible spectrophotometer UV-2550 (manufactured by Shimadzu Corporation). The evaluation results are shown in Table 1.

[Storage stability]

Each of the resin compositions immediately after preparation in Examples 1 and 2 was coated on a silicon wafer using a spin coater and baked on a hot plate at 100 占 폚 for 1 minute and again at 140 占 폚 for 10 minutes to obtain a resin And the film thickness of these resin films was measured using an optical interferometric film thickness measuring apparatus Lambda Ace VM-2110 (manufactured by Dainippon Screen Mfg. Co., Ltd.). Further, the same resin composition was stored at 35 캜 (acceleration test) for one month, and the film thickness of the resin film formed by the same method from the resin composition after storage was measured. &Quot; Good " indicates that the film thickness change is less than 10%, and " Good " indicates that the film thickness change is 10% or more when compared with the film thickness of the resin film formed immediately after the preparation. The evaluation results are shown in Table 1.

[Plane leveling]

The resin compositions prepared in Examples 1 and 2 were applied on a stepped substrate (height: 0.3 m, line width 10 m, laminar space 10 m) each having a height of 0.3 m by using a spin coater, Baked at 100 占 폚 for 1 minute and again at 140 占 폚 for 10 minutes to form a resin film having a film thickness of 0.6 占 퐉. (1- (h2 / h1)) from the h1 (the step of the stepped substrate 1) shown in Fig. 1 and h2 (the step difference of the resin film 2, that is, the difference in height of the resin film on the line, X 100 ".< / RTI > The evaluation results are shown in Table 1.

[Table 1]

From the results shown in Table 1, the resin film formed from the resin composition of the present invention had high transparency as well as high-content formability. It is also understood that the resin composition of the present invention has excellent storage stability. Further, all of the resin films formed from the resin composition of the present invention have step planarization properties with a planarization ratio of 50% or more, and in particular, resin films formed from the resin composition prepared in Example 1 have an excellent step planarization property with a planarization rate of 80% . On the other hand, since the resin film formed from the resin composition prepared in Comparative Example 1 contains no thermal acid generator, the resin film formed from the resin composition prepared in Comparative Example 2 was formed at a baking temperature of less than 200 DEG C, And the result is that the resin film for a planarizing film and the micro lens is not suitable either.

[Description of Symbols]

One Stepped substrate

2 Resin film

3 Line width

4 La humanspace

h1 Step difference of stepped substrate

h2 Step difference of resin film

Claims (7)

(A), a component (B), and a solvent.
(A): a copolymer having a structural unit represented by the following formula (1) and having a structural unit represented by the following formula (2) or (3)
Component (B): Thermal acid generator
[Chemical Formula 1]

(Wherein, R ⁰ each independently represents a hydrogen atom or a methyl group, R ¹ represents a single bond or a carbon source represents 1 to 5 alkylene group of atoms, alkylene groups are the alkyl and optionally having an ether bond therein, R ² is An epoxy group or an organic group having 5 to 12 carbon atoms and having an epoxy ring, R ³ represents an alkylene group having 1 to 3 carbon atoms, and n represents an integer of 0 to 5.) The method according to claim 1,
Wherein the structural unit represented by the formula (1) is a structural unit represented by the following formula (1-1).
(2)

(Wherein R ⁰ represents a hydrogen atom or a methyl group, and R ¹ represents a single bond or an alkylene group having 1 to 5 carbon atoms.) 3. The method according to claim 1 or 2,
Wherein the copolymer further has a structural unit represented by the following formula (4).
(3)

(Wherein X represents a cyclohexyl group or a phenyl group). 4. The method according to any one of claims 1 to 3,
Wherein the weight average molecular weight of the copolymer is 1,000 to 50,000. 5. The method according to any one of claims 1 to 4,
Wherein the thermal acid generator comprises from 0.1% by mass to 20% by mass, based on the solid content excluding the solvent, in the resin composition. A planarizing film produced from the resin composition according to any one of claims 1 to 5. A microlens manufactured from the resin composition according to any one of claims 1 to 5.

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