KR20150074463A - Light emitting device package - Google Patents

Abstract

A light emitting device package of an embodiment comprises a package body; a light emitting device arranged on the package body; a fixing part separated from the light emitting device, and arranged on the package body to surround the light emitting device; a wavelength conversion part filling up a space between the light emitting device and the fixing part, and converting wavelength of a light emitted from the light emitting device; a lens part arranged on an upper surface of the fixing part and an upper surface of the wavelength conversion part; and a reflection sidewall arranged on the package body to surround around the fixing part, wherein height of the fixing part is the same or higher than height of the wavelength conversion part.

Description

[0001] LIGHT EMITTING DEVICE PACKAGE [0002]

An embodiment relates to a light emitting device package.

BACKGROUND ART Light emitting devices such as a light emitting diode (LED) or a laser diode (LD) using a semiconductor material of Group 3-5 or 2-6 group semiconductors have been developed with thin film growth technology and device materials, Green, blue, and ultraviolet rays. By using fluorescent materials or combining colors, it is possible to realize a white light beam having high efficiency. In addition, the light emitting device has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps.

A light emitting device package having a structure in which a light emitting device is mounted on a package body and electrically connected to the package body is widely used as a light source of a display device and is often used as a light emitting device array in which light emitting devices are arranged on a substrate.

Embodiments provide a light emitting device package capable of improving light efficiency.

A light emitting device package according to an embodiment includes a package body; A light emitting element disposed on the package body; A fixing unit spaced apart from the light emitting device and disposed on the package body so as to surround the periphery of the light emitting device; A wavelength converting unit that is filled in a space between the light emitting device and the fixing unit and converts a wavelength of light emitted from the light emitting device; A lens portion disposed on the upper surface of the fixing portion and on the upper surface of the wavelength conversion portion; And a reflective sidewall disposed on the package body so as to surround the fixed portion, wherein a height of the fixed portion is higher than or equal to a height of the wavelength conversion portion.

The lower surface of the lens portion may be in contact with the upper surface of the fixing portion and the upper surface of the wavelength conversion portion.

The lens portion may be spaced apart from the reflective sidewall, and the lower surface of the lens portion may be positioned higher than the upper surface of the reflective sidewall.

At least a part of the lower surface of the lens portion may contact at least a part of the upper surface of the package body.

At least a part of the lower surface of the lens part is in contact with at least a part of the upper surface of the package body and at least a part of the outer surface of the lens part is in contact with the reflection sidewall.

The embodiment can improve the light efficiency.

1A is a plan view of a light emitting device package according to an embodiment.
1B is a cross-sectional view along the ab direction of the light emitting device package shown in FIG. 1A.
2A is a plan view of a light emitting device package according to another embodiment.
2B is a cross-sectional view of the light emitting device package shown in FIG.
3 is a plan view of a light emitting device package according to another embodiment.
4 is a cross-sectional view of the light emitting device package shown in Fig. 3 in the AB direction.
5 is a plan view of a light emitting device package according to another embodiment.
6 is a sectional view of the light emitting device package shown in Fig. 5 in the CD direction.
7 shows a lighting device including a light emitting device according to an embodiment.
8 shows a display device including the light emitting device package according to the embodiment.
9 shows a head lamp including a light emitting device package according to an embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure may be referred to as being "on" or "under" a substrate, each layer It is to be understood that the terms " on "and " under" include both " directly "or" indirectly " do. In addition, the criteria for the top / bottom or bottom / bottom of each layer are described with reference to the drawings.

In the drawings, dimensions are exaggerated, omitted, or schematically illustrated for convenience and clarity of illustration. Also, the size of each component does not entirely reflect the actual size. The same reference numerals denote the same elements throughout the description of the drawings. Hereinafter, a light emitting device package according to an embodiment will be described with reference to the accompanying drawings.

FIG. 1A is a plan view of a light emitting device package 100 according to an embodiment, and FIG. 1B is a sectional view in ab direction of a light emitting device package 100 shown in FIG. 1A.

1A and 1B, a light emitting device package 100 includes a package body 110, a reflective sidewall 101, a first conductive layer 122, a second conductive layer 124, a light emitting element 130, A fixing unit 140, a wavelength converting unit 150, and a lens unit 160. [0035]

The package body 110 may be formed of a resin material such as polyphthalamide (PPA), epoxy molding compound (EMC), or polycarbonate, or silicon (Si).

The top surface shape of the package body 110 may have various shapes such as a triangle, a square, a polygon, and a circle depending on the application and design.

The first conductive layer 122 and the second conductive layer 124 may be disposed on the package body 110 to be electrically separated from each other. For example, a portion of the package body 110 may be disposed between the first conductive layer 122 and the second conductive layer 124.

A portion of the first conductive layer 122 and a portion of the second conductive layer 124 may be exposed from the package body 110. For example, one end of the first conductive layer 122 may be exposed to one side of the package body 110, and one end of the second conductive layer 124 may be exposed to the other side of the package body 110 , But is not limited thereto.

Or in other embodiments the bottom surface of the first conductive layer 122 and the bottom surface of the second conductive layer 124 may be exposed from the package body 110.

The first conductive layer 122 and the second conductive layer 124 may be formed of a conductive material such as a metal such as titanium (Ti), copper (Cu), nickel (Ni), gold (Au) And may be formed of one of tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), or an alloy thereof and may be a single layer or a multilayer structure.

The reflective sidewalls 101 may be disposed on the top surface 102 of the package body 110 and the first and second conductive layers 122 and 124. A cavity 105 may be formed in the reflective sidewall 101 to open the top.

The cavity 105 may be formed in a cup shape, a concave container shape or the like and the reflective side wall 101 may be perpendicular or inclined to the upper surface 102 of the package body 101. The shape of the cavity 105 viewed from above may be various shapes such as a circle, a rectangle, a polygon, an ellipse, and the like.

The reflective sidewalls 101 may be disposed at the edges of each of the top surface 102, the first conductive layer 122, and the second conductive layer 124 of the package body 110. The reflective sidewall 101 may reflect light incident from the light emitting device 130, which will be described later.

The reflective sidewall 101 may be disposed on the package body 110 so as to surround the light emitting element 130 and the fixing portion 140 or around the reflective portion.

The light emitting device 130 is electrically connected to the first conductive layer 122 and the second conductive layer 124. For example, the light emitting device 130 may be disposed on the first conductive layer 122 and the second conductive layer 124.

The light emitting device 130 may be a light emitting diode (LED), for example, a light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode, but the present invention is not limited thereto.

The light emitting device 130 may be electrically connected to the first and second conductive layers 122 and 124 by flip chip bonding and die bonding. However, the present invention is not limited thereto.

The fixing portion 140 may be disposed on the upper surface of the package body 110 so as to be spaced apart from the light emitting device 130 and to surround the periphery of the light emitting device 130. [

For example, the fixing portion 140 may be formed on the upper surface of the first conductive layer 122, the upper surface of the second conductive layer 124, and the upper surface 102 of the package body 110 so as to be spaced from the light emitting element 130. [ Lt; / RTI >

The fixing unit 140 may contact the edge of the outer circumferential surface of the wavelength conversion unit 150 and may fix the edge of the wavelength conversion unit 150.

The fixing unit 140 may be a sidewall or a dam disposed around the wavelength conversion unit 150 to fix the outer circumferential surface of the wavelength conversion unit 150. The shape of the fixing unit 140 may be circular or oval But is not limited thereto. In addition, the cross section of the fixing portion 140 may be formed in a shape having a polygonal shape such as a triangle, a quadrangle, or the like, or a part having a circular shape.

The fixing portion 140 may be made of a reflective material capable of reflecting light emitted from the light emitting device 130. [ For example, the fixing portion 140 may be made of a highly reflective resin material such as polyethylene terephthalate (PET), white silicon, or the like.

The wavelength converting portion 150 is filled in the space between the fixing portion 140 and the light emitting device 130 and may be disposed on the surface of the light emitting device 130.

For example, the wavelength converting unit 150 may be formed by mixing a fluorescent material with a material that can be molded. By filling the molding material mixed with the fluorescent material into the space between the fixing unit 140 and the light emitting device 130, The wavelength converting portion 150 may be formed to have a thin layer on the upper surface and the side surface of the light emitting device 130.

The upper surface of the fixing portion 140 may be positioned higher than the upper surface of the light emitting device 130.

The height H1 of the fixing portion 140 may be higher than the height H2 of the light emitting device 130 (H1 > H2). For example, the difference (H1-H2) between the height H1 of the fixing portion 140 and the height H2 of the light emitting device 130 may be 50um to 200um.

When the difference (H1-H2) of the height H2 is less than 50um, the wavelength converting portion 150 can be flowed out of the fixing portion 140 upon molding, and the difference (H2-H2) The orientation angle may become too narrow.

The thickness t1 of the fixing portion 140 may be 50um to 150um. When the thickness t1 of the fixing portion 140 is less than 50 탆, it is difficult to support the wavelength converting portion 150 when the wavelength converting portion 150 is molded. When the thickness t1 of the fixing portion 140 exceeds 150 탆 The size of the package body 110 can be increased.

The distance D1 between the light emitting element 130 and the fixing portion 140 may be 100um to 150um. The thickness D2 from the upper surface of the light emitting device 130 to the upper surface of the wavelength converting portion 150 may be 100 um to 150 um. When the distance D1 between the light emitting device 130 and the fixing portion 140 is less than 100 um, the molding member for forming the wavelength conversion portion 150 may be difficult to fill.

The height of the upper surface of the wavelength converting portion 150 may be lower or equal to the height of the upper surface of the fixing portion 140.

The height of the fixing portion 140, the height of the light emitting element 130 and the height of the wavelength converting portion 150 may be different from the height of the upper surface 102 of the package body 110 or the height of the first and second conductive layers 122 and 124 And may be a height in the upward direction with respect to the upper surface.

The lens unit 160 is disposed on the fixing unit 140 and the wavelength conversion unit 150 and refracts the light emitted from the light emitting device 130 and passed through the wavelength conversion unit 150.

For example, the lens portion 160 may be disposed on the upper surface of the fixing portion 140, and on the upper surface of the wavelength conversion portion 150. The lower surface of the lens unit 160 may be in contact with the upper surface of the fixing unit 140 and the upper surface of the wavelength conversion unit 150. The lens portion 160 may be spaced apart from the upper surface 102 of the package body 110 and the reflective sidewall 101.

The shape of the lens unit 160 may be a dome or hemispherical shape, but is not limited thereto and may be embodied in various forms capable of refracting light. The lens unit 160 may be made of a translucent resin material or a glass material.

The reflection side wall 101 can adjust the directing angle by reflecting the light refracted or reflected by the lens unit 160 or the package body 110.

The height H3 of the reflective sidewall 101 may be lower than the height H1 of the fixing portion 140 to improve the directivity angle (H3 <H1), but is not limited thereto. Since the reflective sidewall 101 is for directing angle adjustment, the reflective sidewall 101 may be omitted in another embodiment.

In general, the light efficiency of the light emitting device package can be improved as the phosphor contained in the wavelength converting portion is closer to the light emitting device. The embodiment can improve the light efficiency because the wavelength converting portion 150 can be stably formed directly on the surface of the light emitting device 130 by the fixing portion 140.

2A is a plan view of a light emitting device package 200 according to another embodiment, and FIG. 2B is a sectional view in the direction of a cd of the light emitting device package 200 shown in FIG. 2A.

The same reference numerals as in Figs. 1A and 1B denote the same components, and a description of the same components will be simplified or omitted.

2A and 2B, a light emitting device package 200 includes a package body 110, a reflective sidewall 101, a first conductive layer 122, a second conductive layer 124, a light emitting device 130, A fixing unit 140-1, a wavelength converting unit 150, and a lens unit 160-1.

The fixing portion 140-1 may be made of a light-transmitting material, for example, a light-transmitting resin material or a reflecting member capable of transmitting light emitted from the light emitting device 130. [

The height, the thickness, and the distance from the light emitting device 130 to the fixing portion 140-1 may be the same as those described in Figs. 1A and 1B.

The lens portion 160-1 may be disposed on the fixed portion 140, the wavelength conversion portion 150, the upper surface 102 of the package body 110, and the first and second conductive layers 122 and 124 have.

The lens unit 160-1 can refract light that has been irradiated from the light emitting device 130 and has passed through the wavelength converting unit 150 and the fixing unit 140-1.

The lens unit 160 of FIG. 1B is located only on the upper surface of each of the fixing unit 140 and the wavelength converting unit 150, but the lens unit 160-1 is formed so as to surround the fixing unit 140-1. . That is, the fixing portion 140-1 may be positioned inside the lens portion 160-1.

At least a portion 161 of the lower surface of the lens portion 160-1 may be in contact with the upper surface of at least one of the first conductive layer 122 and the second conductive layer 124. [

At least a portion 161 of the lower surface of the lens portion 160-1 may be in contact with at least a portion of the upper surface 102 of the package body 110. [ At least a part of the outer circumferential surface of the lens portion 160-1 may be in contact with the reflective sidewall 101. [

The lower surface of the lens portion 160 shown in FIG. 1B is located on the upper surface of the fixing portion 140-1 and the upper surface of the reflective sidewall 101, but the lens portion 160-1 shown in FIG. The portion 161 may be positioned on the upper surface of the fixing portion 140-1 and the upper surface of the reflective sidewall 101. [

The embodiment can increase the light directing angle by the fixed portion 140-1 of the light transmitting material and the enlarged lens portion 160-1 and improve the light efficiency.

FIG. 3 is a plan view of a light emitting device package 300 according to another embodiment, and FIG. 4 is a sectional view of the light emitting device package 300 in the AB direction.

The same reference numerals as in Figs. 1A and 1B denote the same constituent elements, and a description of the same constituent elements will be simplified or omitted.

3 and 4, the light emitting device package 300 includes a package body 310, first and second conductive layers 322 and 324, and a plurality of light emitting portions 320-1 to 320-n, n> 1), and a reflective sidewall 301. The reflective sidewall 301 may include a reflective sidewall.

The package body 310 is only different in size from the package body 110 described in FIGS. 1A and 1B, and may be the same as the package body 110 except for the size.

The first and second conductive layers 322 and 324 may be disposed on the package body 310 and electrically connected to each of the plurality of light emitting units 320-1 to 320-n, n> 1. .

The first and second conductive layers 322 and 324 may be the same as the first and second conductive layers 122 and 124 described in FIGS.

Each of the plurality of light emitting units 320-1 to 320-n and n> 1 may be disposed on the package body 310 and may be electrically connected to the first and second conductive layers 322 and 324 .

Each of the plurality of light emitting units 320-1 to 320-n may include a light emitting device 130, a fixing unit 140, a wavelength converting unit 150, and a lens unit 160.

The reflective sidewall 301 surrounds each of the plurality of light emitting units 320-1 to 320-n and n> 1, and the height of the reflective sidewall 301, the height of the light emitting device 130, And the height and thickness of the wavelength converting portion 150 may be the same as those described in Figs. 1A and 1B.

The embodiment shown in Figs. 3 and 4 is a light emitting device package having a plurality of light emitting elements, and corresponds to each of the plurality of light emitting elements. The light emitting element package includes the fixing part 140 and the lens part 160 ) May be applied.

FIG. 5 is a plan view of a light emitting device package 400 according to another embodiment, and FIG. 6 is a sectional view in the CD direction of the light emitting device package 400 shown in FIG.

The same reference numerals as those in Figs. 2A, 2B, and 4 denote the same components, and the description of the same components will be simplified or omitted.

5 and 6, the light emitting device package 400 includes a package body 310, first and second conductive layers 322 and 324, and a plurality of light emitting units 420-1 to 420-n, n> 1), and a reflective sidewall 301. The reflective sidewall 301 may include a reflective sidewall.

Each of the plurality of light emitting portions 420-1 to 420-n and n> 1 may be disposed on the package body 310 and may be electrically connected to the first and second conductive layers 322 and 324 .

Each of the plurality of light emitting units 420-1 to 420-n may include a light emitting device 130, a fixing unit 140-1, a wavelength converting unit 150, and a lens unit 160-1.

5 and 6 is a light emitting device package having a plurality of light emitting elements, and corresponds to each of the plurality of light emitting elements, and includes the fixing portion 140-1 and the lens portion 140-1 shown in FIGS. 2A and 2B, (160-1) may be applied.

7 shows a lighting device including a light emitting device according to an embodiment.

7, the lighting apparatus may include a cover 1100, a light source module 1200, a heat discharger 1400, a power supply unit 1600, an inner case 1700, and a socket 1800. In addition, the illumination device according to the embodiment may further include at least one of the member 1300 and the holder 1500.

The light source module 1200 may include any one of the light emitting device packages 100, 200, 300, and 400 according to the embodiment.

The cover 1100 may be in the form of a bulb or a hemisphere, and may be hollow in shape and partially open. The cover 1100 may be optically coupled to the light source module 1200. For example, the cover 1100 may diffuse, scatter, or excite light provided from the light source module 1200. The cover 1100 may be a kind of optical member. The cover 1100 can be coupled to the heat discharging body 1400. The cover 1100 may have an engaging portion that engages with the heat discharging body 1400.

The inner surface of the cover 1100 may be coated with a milky white paint. Milky white paints may contain a diffusing agent to diffuse light. The surface roughness of the inner surface of the cover 1100 may be formed larger than the surface roughness of the outer surface of the cover 1100. [ This is because light from the light source module 1200 is sufficiently scattered and diffused to be emitted to the outside.

The cover 1100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 1100 may be transparent so that the light source module 1200 is visible from the outside, but it is not limited thereto and may be opaque. The cover 1100 may be formed by blow molding.

The light source module 1200 may be disposed on one side of the heat discharger 1400 and the heat generated from the light source module 1200 may be conducted to the heat discharger 1400. The light source module 1200 may include a light source 1210, a connection plate 1230, and a connector 1250.

The member 1300 may be disposed on the upper surface of the heat discharging body 1400 and has a guide groove 1310 into which the plurality of light source portions 1210 and the connector 1250 are inserted. The guide groove 1310 may correspond to or align with the substrate and connector 1250 of the light source 1210.

The surface of the member 1300 may be coated or coated with a light reflecting material.

For example, the surface of the member 1300 may be coated or coated with a white paint. The member 1300 may be reflected by the inner surface of the cover 1100 and may reflect the light returning toward the light source module 1200 toward the cover 1100 again. Therefore, the light efficiency of the illumination device according to the embodiment can be improved.

The member 1300 may be made of an insulating material, for example. The connection plate 1230 of the light source module 1200 may include an electrically conductive material. Therefore, electrical contact can be made between the heat discharging body 1400 and the connecting plate 1230. The member 1300 may be formed of an insulating material so as to prevent an electrical short circuit between the connection plate 1230 and the heat discharger 1400. The heat dissipation member 1400 can dissipate heat by receiving heat from the light source module 1200 and heat from the power supply unit 1600.

The holder 1500 closes the receiving groove 1719 of the insulating portion 1710 of the inner case 1700. Therefore, the power supply unit 1600 housed in the insulating portion 1710 of the inner case 1700 can be hermetically sealed. The holder 1500 may have a guide protrusion 1510 and the guide protrusion 1510 may have a hole through which the protrusion 1610 of the power supply unit 1600 penetrates.

The power supply unit 1600 processes or converts electrical signals provided from the outside and provides the electrical signals to the light source module 1200. The power supply unit 1600 may be housed in the receiving groove 1719 of the inner case 1700 and may be sealed inside the inner case 1700 by the holder 1500. [ The power supply unit 1600 may include a protrusion 1610, a guide portion 1630, a base 1650, and an extension portion 1670.

The guide portion 1630 may have a shape protruding outward from one side of the base 1650. The guide portion 1630 can be inserted into the holder 1500. A plurality of components can be disposed on one side of the base 1650. The plurality of components may include, for example, a DC converter for converting an AC power supplied from an external power source into a DC power source, a driving chip for controlling driving of the light source module 1200, an ESD (ElectroStatic discharge protection device, but are not limited thereto.

The extension 1670 may have a shape protruding outward from the other side of the base 1650. The extension portion 1670 can be inserted into the connection portion 1750 of the inner case 1700 and can receive an external electrical signal. For example, the extension portion 1670 may be equal to or less than the width of the connection portion 1750 of the inner case 1700. Each of the "+ wire" and the "wire" may be electrically connected to the extension portion 1670 and the other end of the "wire" and the "wire" may be electrically connected to the socket 1800 .

The inner case 1700 may include a molding part together with the power supply part 1600 therein. The molding part is a part where the molding liquid is hardened, so that the power supply providing part 1600 can be fixed inside the inner case 1700.

8 shows a display device including the light emitting device package according to the embodiment.

8, the display device 800 includes a bottom cover 810, a reflection plate 820 disposed on the bottom cover 810, light emitting modules 830 and 835 for emitting light, a reflection plate 820 An optical sheet including a light guide plate 840 disposed in front of the light emitting modules 830 and 835 and guiding light emitted from the light emitting modules 830 and 835 toward the front of the display device and prism sheets 850 and 860 disposed in front of the light guide plate 840, An image signal output circuit 872 connected to the display panel 870 and supplying an image signal to the display panel 870; a display panel 870 disposed in front of the display panel 870; Gt; 880 &lt; / RTI &gt; Here, the bottom cover 810, the reflection plate 820, the light emitting modules 830 and 835, the light guide plate 840, and the optical sheet may form a backlight unit.

The light emitting module may include light emitting device packages 835 mounted on the substrate 830. The substrate 830 may be a PCB or the like. The light emitting device package 835 may be any one of the light emitting device packages 100, 200, 300, and 400 according to the embodiment.

The bottom cover 810 can house components within the display device 800. [ Also, the reflection plate 820 may be formed as a separate component as shown in the drawing, or may be provided on the rear surface of the light guide plate 840 or on the front surface of the bottom cover 810 in a state of being coated with a highly reflective material .

Here, the reflection plate 820 can be made of a material having a high reflectance and can be used in an ultra-thin shape, and polyethylene terephthalate (PET) can be used.

The light guide plate 830 may be formed of polymethyl methacrylate (PMMA), polycarbonate (PC), or polyethylene (PE).

The first prism sheet 850 may be formed of a light-transmissive and elastic polymeric material on one side of the support film, and the polymer may have a prism layer in which a plurality of three-dimensional structures are repeatedly formed. Here, as shown in the drawings, the plurality of patterns may be provided with a floor and a valley repeatedly as stripes.

In the second prism sheet 860, the direction of the floor and the valley on one side of the supporting film may be perpendicular to the direction of the floor and the valley on one side of the supporting film in the first prism sheet 850. This is for evenly distributing the light transmitted from the light emitting module and the reflective sheet to the front surface of the display panel 1870.

Although not shown, a diffusion sheet may be disposed between the light guide plate 840 and the first prism sheet 850. The diffusion sheet may be made of polyester and polycarbonate-based materials, and the light incidence angle can be maximized by refracting and scattering light incident from the backlight unit. The diffusion sheet includes a support layer including a light diffusing agent, a first layer formed on the light exit surface (first prism sheet direction) and a light incidence surface (in the direction of the reflection sheet) . &Lt; / RTI &gt;

In an embodiment, the diffusion sheet, the first prism sheet 850, and the second prism sheet 860 make up an optical sheet, which may be made of other combinations, for example a microlens array, A combination of one prism sheet and a microlens array, or the like.

The display panel 870 may include a liquid crystal display (LCD) panel, and may include other types of display devices that require a light source in addition to the liquid crystal display panel 860.

9 shows a head lamp 900 including the light emitting device package according to the embodiment. 8, the head lamp 900 includes a light emitting module 901, a reflector 902, a shade 903, and a lens 904.

The light emitting module 901 may include a plurality of light emitting device packages (not shown) disposed on a substrate (not shown). At this time, the light emitting device package may be any of the embodiments (100, 200, 300, 400).

The reflector 902 reflects the light 911 emitted from the light emitting module 901 in a predetermined direction, for example, toward the front 912.

The shade 903 is disposed between the reflector 902 and the lens 904 and reflects off or reflects a part of the light reflected by the reflector 902 toward the lens 904 to form a light distribution pattern desired by the designer. The one side portion 903-1 and the other side portion 903-2 of the shade 903 may have different heights from each other.

The light emitted from the light emitting module 901 can be reflected by the reflector 902 and the shade 903 and then transmitted through the lens 904 and directed toward the front of the vehicle body. The lens 904 can refract the light reflected by the reflector 902 forward.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments can be combined and modified by other persons having ordinary skill in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

101: reflective sidewall 110: package body
122: first conductive layer 124: second conductive layer
130: light emitting element 140:
150: Wavelength conversion section 160: Lens section.

Claims (5)

A package body;
A light emitting element disposed on the package body;
A fixing unit spaced apart from the light emitting device and disposed on the package body so as to surround the periphery of the light emitting device;
A wavelength converting unit that is filled in a space between the light emitting device and the fixing unit and converts a wavelength of light emitted from the light emitting device;
A lens portion disposed on the upper surface of the fixing portion and on the upper surface of the wavelength conversion portion; And
And a reflective sidewall disposed on the package body to surround the fixed portion,
Wherein the height of the fixing portion is higher than or equal to the height of the wavelength conversion portion. The method according to claim 1,
And the lower surface of the lens portion is in contact with the upper surface of the fixing portion and the upper surface of the wavelength conversion portion. The method according to claim 1,
Wherein the lens portion is spaced apart from the reflective sidewall, and the lower surface of the lens portion is positioned higher than the upper surface of the reflective sidewall. The method according to claim 1,
And at least a part of the lower surface of the lens portion is in contact with at least a part of the upper surface of the package body. The method according to claim 1,
Wherein at least a part of the lower surface of the lens portion is in contact with at least a part of an upper surface of the package body, and at least a part of an outer circumferential surface of the lens portion is in contact with the reflective sidewall.

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